CN108145265B - Processing method and device for micro grinding head for microarray structure processing - Google Patents
Processing method and device for micro grinding head for microarray structure processing Download PDFInfo
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- CN108145265B CN108145265B CN201810091226.5A CN201810091226A CN108145265B CN 108145265 B CN108145265 B CN 108145265B CN 201810091226 A CN201810091226 A CN 201810091226A CN 108145265 B CN108145265 B CN 108145265B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H9/00—Machining specially adapted for treating particular metal objects or for obtaining special effects or results on metal objects
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- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Abstract
The invention discloses a processing method of a miniature grinding head for microarray structure processing, which comprises the following steps: the cylindrical milling grinding head and the conductive finishing wheel start to rotate; discharging a pulse power supply, and enabling the cylindrical milling grinding head to be in contact with the side surface of the conductive trimming wheel according to a preset trimming track; the conductive finishing wheel is used for finishing the cylindrical milling grinding head into a conical milling grinding head; and processing an array structure on the surface of the workpiece by the conical milling grinding head according to a preset processing track. A processing device for a micro grinding head for processing a microarray structure comprises a processing machine tool with a main shaft, a workbench, a cylindrical milling grinding head arranged on the main shaft, a conductive trimming wheel for trimming the cylindrical milling grinding head into a conical milling grinding head, a driving device for driving the conductive trimming wheel to rotate, and a pulse power supply electrically connected with the cylindrical milling grinding head and the conductive trimming wheel. The micro array processing method of the micro grinding head comprises the following steps: and processing a micro-groove or micro-cone tower array structure on the surface of the workpiece by utilizing the trimmed conical milling grinding head.
Description
Technical Field
The invention relates to the technical field of ultra-precise milling microstructure machining, in particular to a method and a device for machining a micro grinding head for machining a microarray structure.
Background
At present, the microstructure processing technology mainly depends on photoetching processing, electron beam processing, laser processing, micro electric spark processing, micromachining technology (precision cutting, grinding) and the like. However, in mass production, the micro-machining cost of light, electrochemistry, ion beams and the like is high, and the problems of corrosion liquid and the like which are difficult to treat are solved; although the laser processing and the micro electric spark processing have higher efficiency, the processing precision is lower, and the chemical and physical properties of the material surface are easy to change by high-temperature laser ablation; precision cutting processing has higher requirements on the hardness, performance and the like of a cutter, the cutter is worn quickly in the processing process, and a high-hardness and high-strength mold core material is difficult to process into a mirror surface with high shape precision. The surface of the hard and brittle material can be processed into a regular microarray structure by adopting precise micro grinding, and the shape accuracy is good. However, the micro grinding process has low efficiency, which is not favorable for the industrialization development and demand. Therefore, the invention provides a conical milling grinding head for trimming a cylindrical milling grinding head into a specific shape, and a micro-array structure with controllable shape precision can be efficiently processed on the surface of a hard and brittle material by utilizing micro-milling processing. Moreover, the milling and grinding adaptability range is wider, the processing efficiency of the microstructure can be greatly improved, and the batch processing and manufacturing of difficult-to-process materials can be satisfied.
Disclosure of Invention
An object of the present invention is to provide a method for machining a micro grinding head for machining a microarray structure, which aims to solve the problem that a cylindrical milling grinding head cannot meet specific machining requirements in the prior art.
To achieve the purpose, the invention adopts the following technical scheme:
A method for processing a micro grinding head for processing a microarray structure, comprising the steps of:
the cylindrical milling grinding head and the conductive finishing wheel start to rotate;
discharging a pulse power supply, wherein the cylindrical milling grinding head is contacted with the side surface of the conductive trimming wheel according to a preset trimming track;
the conductive finishing wheel finishes the cylindrical milling grinding head into a conical milling grinding head;
And the conical milling grinding head processes an array structure on the surface of the workpiece according to a preset processing track.
Further, the diameter of the cylindrical milling grinding head ranges from 0.1 mm to 5 mm.
Further, the conical milling head is conical.
Further, the abrasive in the cylindrical milling head includes silicon carbide, diamond, and cubic boron nitride.
Further, the granularity range of the cylindrical milling grinding head is 60-1500 meshes.
Further, the conductive trimming wheel is a cylindrical copper electrode trimming wheel, the diameter of the conductive trimming wheel ranges from 30 mm to 500 mm, and the thickness of the conductive trimming wheel ranges from 10 mm to 500 mm.
Further, the rotating speed range of the cylindrical milling grinding head is 1000-5000 rpm, and the rotating speed range of the conductive finishing wheel is 100-1000 rpm; the single feeding depth of the cylindrical milling grinding head ranges from 1 micron to 20 microns, and the feeding speed of the cylindrical milling grinding head ranges from 50 millimeters/minute to 1000 millimeters/minute.
Further, the pulse voltage range during the discharge trimming of the pulse power supply is 0-200V, the pulse width range is 1-200 mu s, and the pulse interval range is 1-200 mu s.
Further, the pulse voltage range during the discharge trimming of the pulse power supply is 0-200V, the pulse width range is 1-200 mu s, and the pulse interval range is 1-200 mu s.
Another object of the present invention is to provide a machining device for a micro grinding head for machining a microarray structure, which aims to solve the problem that a cylindrical milling grinding head cannot meet specific machining requirements in the prior art.
To achieve the purpose, the invention adopts the following technical scheme:
The machining device comprises a machining machine tool with a main shaft, a workbench for placing a workpiece, a cylindrical milling grinding head arranged on the main shaft, a conductive trimming wheel rotationally connected with the workbench and used for trimming the cylindrical milling grinding head into a conical milling grinding head, a driving device used for driving the conductive trimming wheel to rotate, and a pulse power supply electrically connected with the cylindrical milling grinding head and the conductive trimming wheel and used for enabling the conductive trimming wheel to perform electric discharge machining on the side surface of the cylindrical milling grinding head.
Further, the diameter range of the cylindrical milling grinding head is 0.1-5 mm, the composition materials of the cylindrical milling grinding head comprise silicon carbide, diamond and cubic boron nitride, the granularity range of the cylindrical milling grinding head is 60-1500 meshes, the conductive trimming wheel is a cylindrical copper electrode trimming wheel, the diameter range of the conductive trimming wheel is 30-500 mm, and the thickness range of the conductive trimming wheel is 10-500 mm.
Further, a conductive carbon brush is arranged between the cylindrical milling grinding head and the pulse power supply.
The invention has the beneficial effects that: the cylindrical milling grinding head in the rotating state is contacted with the side surface of the conductive trimming wheel in the rotating state, the cylindrical milling grinding head is subjected to contact discharge trimming through the conductive trimming wheel to trim the cylindrical milling grinding head into a conical milling grinding head in a preset shape for processing a workpiece, for example, the conductive trimming wheel is used for carrying out discharge trimming on the cylindrical milling grinding head according to a preset V-shaped trimming track to obtain the conical milling grinding head, so that the conical milling grinding head meets the processing requirement, then the conical milling grinding head is used for processing the workpiece on a workbench, and a required array structure is processed on the workpiece.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a micro grinding head processing device for processing a micro array structure according to the invention;
FIG. 2 is a schematic diagram of an electrical connection between a conductive conditioning disk and a pulsed power supply in accordance with the present invention;
FIG. 3 is a schematic view of the structure of the workpiece (in the case of a micro-trench array structure) according to the present invention;
FIG. 4 is a schematic view of the structure of the workpiece (in the case of the micro cone tower array structure) according to the present invention;
FIG. 5 is a flow chart of a method of processing a micro grinding head for processing a micro array structure according to the invention;
In the figure:
1. a processing machine tool; 2. a main shaft; 3. conical milling grinding head; 4. a driving device; 5. a pulse power supply; 6. a conductive conditioning wheel; 7. a work table; 8. a workpiece; 9. a conductive carbon brush; 10. trimming the track; 11. a micro-trench array structure; 12. and a micro cone tower array structure.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.
It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the invention.
The implementation of the present invention will be described in detail below with reference to specific embodiments.
As shown in fig. 1 to 5, the embodiment of the present invention further provides a processing method of a micro grinding head for processing a micro array structure, wherein the processing device for processing a micro grinding head for processing a micro array structure is used for processing a workpiece 8, and the method comprises the following steps:
the cylindrical milling grinding head and the conductive finishing wheel 6 start to rotate;
Discharging the pulse power supply 5, and enabling the cylindrical milling grinding head to be in contact with the side surface of the conductive trimming wheel 6 according to a preset trimming track 10;
The conductive finishing wheel 6 finishes the cylindrical milling grinding head into a conical milling grinding head 3;
The conical milling grinding head 3 processes an array structure on the surface of the workpiece 8 according to a preset processing track.
Specifically, the cylindrical milling grinding head and the conductive trimming wheel 6 are adjusted to be in a rotating state, then the cylindrical milling grinding head is subjected to contact and discharge trimming through the conductive trimming wheel 6 to trim the cylindrical milling grinding head into a conical milling grinding head 3 with a preset shape for processing a workpiece 8, for example, the conductive trimming wheel 6 performs discharge trimming on the cylindrical milling grinding head according to a preset V-shaped trimming track 10 to obtain the conical milling grinding head 3, so that the conical milling grinding head 3 meets the processing requirement, then the workpiece 8 on the workbench 7 is processed by utilizing the conical milling grinding head 3, and a required array structure is processed on the workpiece 8. Preferably, the conductive finishing wheel 6 performs discharge finishing on the cylindrical milling grinding head to obtain the conical milling grinding head 3 according to a preset V-shaped finishing track 10, and then the conical milling grinding head 3 is used for processing the micro-groove array structure 11 or the micro-cone tower array structure 12 on the surface of the workpiece 8 according to a preset numerical control track path.
Further, as a specific embodiment of the processing method of the micro grinding head for micro array structure processing provided by the invention, when the pulse power supply 5 discharges and the cylindrical grinding head contacts with the side surface of the conductive grinding wheel 6 according to the preset trimming track 10, the rotating speed range of the cylindrical grinding head is 1000-5000 rpm, and the rotating speed range of the conductive grinding wheel 6 is 100-1000 rpm.
Further, as a specific embodiment of a machining method of a micro grinding head for machining a micro array structure provided by the invention, when the pulse power supply 5 discharges and the cylindrical grinding head contacts with the side surface of the conductive grinding wheel 6 according to a preset trimming track 10, the single feeding depth of the cylindrical grinding head ranges from 1 micron to 20 microns, and the feeding speed of the cylindrical grinding head ranges from 50 mm/min to 1000 mm/min.
Further, as a specific embodiment of the processing method of the micro grinding head for processing the microarray structure, the diameter of the cylindrical milling grinding head ranges from 0.1 millimeter to 5 millimeters.
Further, referring to fig. 1 to 4, as a specific embodiment of a processing method of a micro grinding head for micro array structure processing provided by the present invention, a conductive grinding wheel 6 performs grinding discharge grinding on a cylindrical grinding head according to a preset V-shaped grinding track 10 to obtain a conical grinding head 3, and then uses the conical grinding head 3 to process a micro groove array structure 11 or a micro cone tower array structure 12 on a surface of a workpiece 8 according to a preset numerical control track path.
Further, as a specific embodiment of a method for machining a micro grinding head for machining a micro array structure, the cylindrical milling grinding head is formed by combining materials comprising silicon carbide, diamond and cubic boron nitride, which constitute the cylindrical milling grinding head, with a metal bonding agent.
Further, as a specific embodiment of the processing method of the micro grinding head for processing the microarray structure, the granularity of the cylindrical milling grinding head ranges from 60 meshes to 1500 meshes. Mesh number: for particle size or thickness of the material, definition refers to the number of holes of the screen within 1 inch.
Further, as a specific embodiment of the processing method of the micro grinding head for processing the microarray structure provided by the invention, the conductive trimming wheel 6 is a cylindrical copper electrode trimming wheel, the diameter of the conductive trimming wheel 6 ranges from 30mm to 500 mm, and the thickness of the conductive trimming wheel 6 ranges from 10 mm to 500 mm.
Further, as a specific embodiment of the processing method of the micro grinding head for processing the micro array structure provided by the invention, the pulse voltage range during discharge trimming of the pulse power supply 5 is 0 volt-200 volts, the pulse width range is 1 microsecond-200 microseconds, and the pulse interval range is 1 microsecond-200 microseconds.
As shown in fig. 1 to 4, an embodiment of the present invention proposes a machining apparatus for a micro grinding head for machining a microarray structure, comprising a machining machine tool 1 having a spindle 2, a table 7 for placing a workpiece 8, a cylindrical milling grinding head provided on the spindle 2, a conductive grinding wheel 6 rotatably connected to the table 7 for grinding the cylindrical milling grinding head into a conical milling grinding head 3, a driving device 4 for driving the conductive grinding wheel 6 to rotate, and a pulse power source 5 electrically connected to both the cylindrical milling grinding head and the conductive grinding wheel 6 for discharging the conductive grinding wheel 6 to a side surface of the cylindrical milling grinding head.
In the embodiment of the invention, the cylindrical milling head in the rotating state is contacted with the side surface of the conductive trimming wheel 6 in the rotating state, the cylindrical milling head is trimmed to be a conical milling head 3 in a preset shape for processing the workpiece 8 by the conductive trimming wheel 6 through contact and discharge trimming, for example, the conductive trimming wheel 6 performs discharge trimming on the cylindrical milling head according to a preset V-shaped trimming track 10 to obtain the conical milling head 3, so that the conical milling head 3 meets the processing requirement, then the workpiece 8 on the workbench 7 is processed by the conical milling head 3, and the required array structure is processed on the workpiece 8.
Further, as a specific embodiment of the processing device of the micro grinding head for processing the microarray structure, when the pulse power supply 5 discharges and the cylindrical grinding head contacts with the side surface of the conductive grinding wheel 6 according to the preset trimming track 10, the rotation speed of the cylindrical grinding head ranges from 1000 rpm to 5000 rpm, and the rotation speed of the conductive grinding wheel 6 ranges from 100 rpm to 1000 rpm. When the pulse power supply 5 discharges and the cylindrical milling grinding head contacts with the side surface of the conductive trimming wheel 6 according to the preset trimming track 10, the single feeding depth of the cylindrical milling grinding head ranges from 1 micron to 20 microns, and the feeding speed of the cylindrical milling grinding head ranges from 50 millimeters/minute to 1000 millimeters/minute. The diameter of the cylindrical milling grinding head ranges from 0.1 mm to 5 mm. The conductive finishing wheel 6 performs counter discharge finishing on the cylindrical milling grinding head according to a preset V-shaped finishing track 10 to obtain a conical milling grinding head 3, and then the conical milling grinding head 3 is utilized to process a micro-groove array structure 11 or a micro-cone tower array structure 12 on the surface of the workpiece 8 according to a preset numerical control track path. The cylindrical milling head is formed by combining materials comprising silicon carbide, diamond and cubic boron nitride, which form the cylindrical milling head, with a metal bonding agent. The granularity range of the cylindrical milling grinding head is 60-1500 meshes. Mesh number: for particle size or thickness of the material, definition refers to the number of holes of the screen within 1 inch. The conductive dressing wheel 6 is a cylindrical copper electrode dressing wheel, the diameter of the conductive dressing wheel 6 ranges from 30 mm to 500 mm, and the thickness of the conductive dressing wheel 6 ranges from 10 mm to 500 mm.
Further, referring to fig. 2, as a specific embodiment of a processing device for a micro grinding head for micro array processing, a conductive carbon brush 9 is disposed between a cylindrical milling grinding head and a pulse power source 5. Specifically, a wire is arranged between the pulse power supply 5 and the conductive carbon brush 9, and the conductive carbon brush 9 is electrically connected with the cylindrical milling grinding head.
It is to be understood that the above examples of the present invention are provided for clarity of illustration only and are not limiting of the embodiments of the present invention. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the invention are desired to be protected by the following claims.
Claims (7)
1. A method for processing a micro grinding head for processing a micro array structure, which is characterized by comprising the following steps:
the cylindrical milling grinding head and the conductive finishing wheel start to rotate;
discharging a pulse power supply, wherein the cylindrical milling grinding head is contacted with the side surface of the conductive trimming wheel according to a preset V-shaped trimming track;
The conductive trimming wheel trims the cylindrical milling grinding head into a conical milling grinding head, and the cylindrical milling grinding head is subjected to contact counter-discharge trimming through the conductive trimming wheel so as to trim the cylindrical milling grinding head into the conical milling grinding head with a preset shape for processing a workpiece; wherein the conductive trimming wheel is a cylindrical copper electrode trimming wheel; the granularity range of the cylindrical milling grinding head is 60-1500 meshes;
The diameter range of the cylindrical milling grinding head is 0.1-5 mm, and the abrasive in the cylindrical milling grinding head comprises silicon carbide, diamond and cubic boron nitride;
And the conical milling grinding head is used for machining a micro-groove or micro-cone tower array structure on the surface of the workpiece according to a preset machining track.
2. The method of claim 1, wherein the diameter of the conductive finishing wheel is in the range of 30 mm to 500 mm and the thickness of the conductive finishing wheel is in the range of 10 mm to 500 mm.
3. The method for machining a micro grinding head for machining a micro array structure according to claim 1, wherein the rotation speed of the cylindrical milling grinding head ranges from 1000 rpm to 5000 rpm, and the rotation speed of the conductive finishing wheel ranges from 100 rpm to 1000 rpm; the single feeding depth of the cylindrical milling grinding head ranges from 1 micron to 20 microns, and the feeding speed of the cylindrical milling grinding head ranges from 50 millimeters/minute to 1000 millimeters/minute.
4. The method of claim 1, wherein the pulse voltage range during the discharge trimming of the pulse power source is 0 v to 200 v, the pulse width range is 1 μsec to 200 μsec, and the pulse interval range is 1 μsec to 200 μsec.
5. A machining device for performing the machining method of the micro grinding head for machining the microarray structure of any one of claims 1 to 4, characterized by comprising a machining machine tool having a main shaft, a table for placing a workpiece, a cylindrical milling grinding head provided to the main shaft, a conductive grinding wheel rotatably connected to the table for grinding the cylindrical milling grinding head into a conical milling grinding head, a driving device for driving the conductive grinding wheel to rotate, and a pulse power source electrically connected to both the cylindrical milling grinding head and the conductive grinding wheel for discharging the conductive grinding wheel to a side surface of the cylindrical milling grinding head.
6. The machining device for the micro grinding head for machining the micro array structure according to claim 5, wherein the diameter range of the cylindrical milling grinding head is 0.1-5 mm, the constituent materials of the cylindrical milling grinding head comprise silicon carbide, diamond and cubic boron nitride, the granularity range of the cylindrical milling grinding head is 60-1500 meshes, the conductive trimming wheel is a cylindrical copper electrode trimming wheel, the diameter range of the conductive trimming wheel is 30-500 mm, and the thickness range of the conductive trimming wheel is 10-500 mm.
7. A micro grinding head machining device for machining a micro-array structure according to claim 5 or 6, characterized in that a conductive carbon brush is provided between the cylindrical milling grinding head and the pulse power source.
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| CN201810091226.5A CN108145265B (en) | 2018-01-30 | 2018-01-30 | Processing method and device for micro grinding head for microarray structure processing |
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| CN108145265B true CN108145265B (en) | 2024-04-23 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490121A (en) * | 2011-11-24 | 2012-06-13 | 华南理工大学 | Method for finishing V-shaped sharp angle of metal-base diamond grinding wheel by electrical discharge grinding in gas |
| CN103203688A (en) * | 2013-03-12 | 2013-07-17 | 苏州科技学院 | Micro-scale grinding online electrolytic dressing device and method thereof |
| CN103753397A (en) * | 2014-01-09 | 2014-04-30 | 河南理工大学 | Online finishing and morphology detecting device for grinding wheel for performing ultrasonic electrolytic combined grinding on inner circles |
| CN206357063U (en) * | 2016-12-29 | 2017-07-28 | 厦门佳品金刚石工业有限公司 | A kind of manufacturing equipment of polishing pad trimmer |
| CN107598723A (en) * | 2017-09-13 | 2018-01-19 | 华南理工大学 | The micro- sophisticated abrasive particle electrothermal chemical retapering device of emery wheel and its On-Line Control Method |
| CN207997045U (en) * | 2018-01-30 | 2018-10-23 | 深圳大学 | A kind of processing unit (plant) of miniature bistrique for micro array structure processing |
-
2018
- 2018-01-30 CN CN201810091226.5A patent/CN108145265B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102490121A (en) * | 2011-11-24 | 2012-06-13 | 华南理工大学 | Method for finishing V-shaped sharp angle of metal-base diamond grinding wheel by electrical discharge grinding in gas |
| CN103203688A (en) * | 2013-03-12 | 2013-07-17 | 苏州科技学院 | Micro-scale grinding online electrolytic dressing device and method thereof |
| CN103753397A (en) * | 2014-01-09 | 2014-04-30 | 河南理工大学 | Online finishing and morphology detecting device for grinding wheel for performing ultrasonic electrolytic combined grinding on inner circles |
| CN206357063U (en) * | 2016-12-29 | 2017-07-28 | 厦门佳品金刚石工业有限公司 | A kind of manufacturing equipment of polishing pad trimmer |
| CN107598723A (en) * | 2017-09-13 | 2018-01-19 | 华南理工大学 | The micro- sophisticated abrasive particle electrothermal chemical retapering device of emery wheel and its On-Line Control Method |
| CN207997045U (en) * | 2018-01-30 | 2018-10-23 | 深圳大学 | A kind of processing unit (plant) of miniature bistrique for micro array structure processing |
Non-Patent Citations (2)
| Title |
|---|
| 葛成.金属基金刚石砂轮V形尖端的微细修整技术.《科技经济导刊》.2016,(第第18期期),第58-59页. * |
| 金属基金刚石砂轮V形尖端的微细修整技术;葛成;《科技经济导刊》(第第18期期);第58-59页 * |
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