CN108132113B - Using multifunctional layers to achieve electromagnetic shielding for sensors, electronic skin, and robots - Google Patents
Using multifunctional layers to achieve electromagnetic shielding for sensors, electronic skin, and robots Download PDFInfo
- Publication number
- CN108132113B CN108132113B CN201810093956.9A CN201810093956A CN108132113B CN 108132113 B CN108132113 B CN 108132113B CN 201810093956 A CN201810093956 A CN 201810093956A CN 108132113 B CN108132113 B CN 108132113B
- Authority
- CN
- China
- Prior art keywords
- layer
- multifunctional
- multifunctional layer
- sensor
- parallel plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000003990 capacitor Substances 0.000 claims abstract description 94
- 238000005259 measurement Methods 0.000 claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 341
- 230000005284 excitation Effects 0.000 claims description 34
- 230000008859 change Effects 0.000 claims description 32
- 239000002346 layers by function Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 14
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 10
- 239000004020 conductor Substances 0.000 claims description 10
- 239000011810 insulating material Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 229910052709 silver Inorganic materials 0.000 claims description 9
- 239000004332 silver Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 6
- 230000001070 adhesive effect Effects 0.000 claims description 6
- 239000000084 colloidal system Substances 0.000 claims description 6
- 239000011241 protective layer Substances 0.000 claims description 6
- 238000013459 approach Methods 0.000 claims description 5
- 230000008569 process Effects 0.000 claims description 5
- 238000013473 artificial intelligence Methods 0.000 claims description 4
- 238000002788 crimping Methods 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 230000006870 function Effects 0.000 abstract description 23
- 239000011159 matrix material Substances 0.000 abstract description 14
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 230000005684 electric field Effects 0.000 description 23
- 238000009826 distribution Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 14
- 241000282414 Homo sapiens Species 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000011160 research Methods 0.000 description 5
- 239000011664 nicotinic acid Substances 0.000 description 4
- 239000002131 composite material Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 241001122767 Theaceae Species 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000036413 temperature sense Effects 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000742 Cotton Polymers 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 208000027418 Wounds and injury Diseases 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 1
- 230000035622 drinking Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005290 field theory Methods 0.000 description 1
- 229920005570 flexible polymer Polymers 0.000 description 1
- 230000001939 inductive effect Effects 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000003278 mimic effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 230000008447 perception Effects 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 230000037152 sensory function Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
- G01L1/144—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors with associated circuitry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/22—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers
- G01L5/226—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping
- G01L5/228—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes for measuring the force applied to control members, e.g. control members of vehicles, triggers to manipulators, e.g. the force due to gripping using tactile array force sensors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Force Measurement Appropriate To Specific Purposes (AREA)
- Electronic Switches (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Switches That Are Operated By Magnetic Or Electric Fields (AREA)
Abstract
本发明涉及一种应用多功能层实现电磁屏蔽的传感器、电子皮肤和智能机器人。所述传感器包括多个传感器单元，每个传感器单元包括至少2个多功能层，各功能层包含对应的一个区域；每个所述多功能层的内部均设置有两层电极，所述多功能层覆盖在所述两层电极的外部；所述多功能层通过设置在电路中的模拟开关的切换实现多功能层的接地屏蔽或接等电位屏蔽。其有益效果：本发明的多功能层电容能实现接触觉功能；还可作其内部检测单元的电磁屏蔽层，在提高三维力测量抗干扰能力的前提下，还可实现接触觉的全部功能；当形成传感器矩阵时，多功能层可实现分区域屏蔽式扫描，避免了相邻传感器单元的串扰问题。
The present invention relates to a sensor, electronic skin and intelligent robot that use a multifunctional layer to achieve electromagnetic shielding. The sensor includes a plurality of sensor units, each of which includes at least two multifunctional layers, each of which includes a corresponding area; two layers of electrodes are arranged inside each of the multifunctional layers, and the multifunctional layer covers the outside of the two layers of electrodes; the multifunctional layer achieves grounding shielding or equipotential shielding of the multifunctional layer by switching an analog switch arranged in the circuit. Beneficial effects: The multifunctional layer capacitor of the present invention can achieve the function of touch sense; it can also be used as the electromagnetic shielding layer of its internal detection unit, and on the premise of improving the anti-interference ability of three-dimensional force measurement, it can also achieve all the functions of touch sense; when forming a sensor matrix, the multifunctional layer can achieve regional shielding scanning, avoiding the crosstalk problem of adjacent sensor units.
Description
Technical Field
The invention relates to a sensor, electronic skin and a robot for realizing electromagnetic shielding by applying a multifunctional layer, which are applicable to the technical field of artificial intelligence.
Background
In recent years, intelligent robots have been developed to a large-scale practical stage in the industrial field, and interaction of the intelligent robots with the outside world requires intelligent sensors that mimic various sensory functions of human beings, mainly including visual sensors, auditory sensors, tactile sensors, and olfactory sensors. So far, visual sensors and auditory sensors have been developed and widely used in the field of industrial robots. However, as intelligent robots are deeply expanded to various fields of human activities, particularly fields of agricultural robots, home service robots, medical service robots, hotel catering service robots and the like, robots are required to complete more flexible and complex actions, and meanwhile, as robots in the fields need to be in closer contact with human beings, the safety and comfort of the contact between the robots and the human beings must be ensured. Thus, highly sensitive tactile sensors having human-like tactile functionality are becoming increasingly important. Bionic tactile sensors are widely studied in all countries of the world.
The intelligent touch sensor should have the following basic functions:
Touch sense, namely, when a limb of the intelligent robot is about to or just touches an external object, the external object about to or just touches can be roughly classified, and the speed and the distance of the external object about to approach can be judged. For example, the service robot should be able to distinguish that the object to be or just contacted is a human limb or other object, the agricultural picking robot should be able to distinguish that the object to be or just contacted is fruit, cotton or plant branches and leaves, and should judge the approaching speed and distance, so that the intelligent robot can properly control the initial speed of the limb approaching or contacting the external object, so as to avoid injury to the human body to be contacted or damage to the object to be contacted.
The pressure sense and the sliding sense are that after the limbs of the intelligent robot contact an external object, the size and the direction of the three-dimensional pressure applied by the intelligent robot can be sensed, so that the intelligent robot can control the three-dimensional pressure applied by the intelligent robot to the external object within a proper range, for example, when the service robot takes up the teacup, the three-dimensional pressure applied by the service robot to the teacup is controlled, so that the teacup is not crushed and does not slip. In addition, the direction and the sliding speed of the sliding should be perceived when the limbs of the intelligent robot slide on the external object so that the intelligent robot can control the direction and the speed of the sliding, for example, the massage service robot should control the speed and the direction of the sliding of the palm of the hand of the robot on the human body in an appropriate range.
The temperature and humidity sense is that the temperature of the external environment and the external object can be sensed when the limb of the intelligent robot approaches or contacts the external object, so that the intelligent robot can protect the limb of the intelligent robot from being damaged by high temperature or low temperature, and can protect the service object of the intelligent robot from being damaged by high temperature or low temperature, for example, the service robot can judge whether the temperature of tea is suitable for human drinking when the service robot gives old people or patients to drink tea, and can actively evade when the limb of the intelligent robot approaches flame or high temperature object. In addition, the limbs of the intelligent robot can sense the humidity of the external environment and the external object when approaching or contacting the external object, for example, a home service robot can distinguish whether the clothes are dried or not when people are helped to dry the clothes.
In addition to the above basic functions, since all limbs of the bionic robot need to cover a large area of bionic skin having a large number of touch sensors, the intelligent touch sensors are also required to meet the requirements of miniaturization, low power consumption, and convenience in forming a sensor matrix.
The existing intelligent touch sensor technology research is divided according to the sensing principle and mainly divided into a resistive type, a capacitive type, a photoelectric type, a piezoelectric type, an inductive type, a micro-electromechanical type and a composite type (two or more than two principles are combined). At present, most of the research groups are in a laboratory research stage, but are not mature to a practical stage, and along with the deep research, more and more research groups focus on resistive, capacitive and resistive-capacitive composite type, and the characteristics of simple manufacturing process, low cost, convenience in mass production and the like are close to mature.
Pure resistive touch sensors are implemented using flexible piezoresistive materials (e.g., conductive rubber) that change their resistivity when subjected to pressure, thereby reflecting the magnitude of the pressure. The touch sensing device has the advantages of realizing the perception of pressure sense, namely three-dimensional force, along with simple manufacturing process, low cost, strong anti-interference capability and convenience for mass production, but has the defects that the touch sensing requirement can not be almost realized, the contacted object can not be classified and identified, the approaching speed and distance can not be judged when the external object is contacted, the sensitivity is low, and the consistency of the product is difficult to control. Has certain market potential in some application fields with low requirements on touch sense and sensitivity.
The capacitive or resistive-capacitive composite touch sensor is the most promising at present, and compared with other forms of touch sensors, the capacitive touch sensor has unique advantages for realizing touch feeling, the capacitive touch sensor utilizes an electric field theory, electric field lines of the capacitive touch sensor can pass through and approach or contact external objects, and the characteristics of different objects with different dielectric constants are utilized for classifying and identifying the external objects, so that the capacitive touch sensor can particularly accurately distinguish whether the external objects are human bodies or other objects. The capacitive touch sensor for realizing the pressure sense and the sliding sense has the advantages of high sensitivity, good consistency, easy manufacture, low cost, easy matrix realization and the like. However, the existing capacitive touch sensor technology has the following defects:
Firstly, all requirements of the touch sensor, including classification recognition of external objects and discrimination of the proximity degree of the external objects, pressure sense and slip sense, namely the measurement of the magnitude and direction of three-dimensional force, and temperature sense and humidity sense, cannot be completely met.
Secondly, the anti-interference capability is poor, the influence of environmental temperature, humidity and electromagnetic interference is easy to be caused, the influence of the environmental temperature and the humidity is usually eliminated by adopting a differential method when the three-dimensional force is measured, and the electromagnetic shielding method is adopted to improve the anti-electromagnetic interference capability. Once electromagnetic shielding measures are adopted, the capability of resisting electromagnetic interference is effectively improved, but the capability of classifying and identifying an external object and judging the approaching speed and distance is lost, namely, the touch sense function cannot be realized.
Third, when forming a sensor matrix, electric field crosstalk of adjacent sensor cells cannot be avoided.
In recent years, researchers at home and abroad have published numerous papers and patent documents, which can be largely classified into the following 2 major categories:
Sensors having only a pressure and/or slip sensing function, i.e. being able to measure only three-dimensional forces, are divided into two sub-classes, shielded and unshielded measures, for example:
The patent application number CN201410245030 discloses a full flexible capacitive touch sensor, which takes an upper polar plate of a parallel plate capacitor as a shielding layer to be directly grounded, and although the anti-interference capability is improved, the function of classifying, identifying and approaching an external object is lost because electric field lines inside the shielding layer cannot pass through the shielding layer, and touch connection cannot be realized.
Publication US2008/0174321A1 discloses a capacitive sensor that can measure object proximity and slip at the same time, which can operate in two modes. The capacitive electrode adopts an upper layer and a lower layer, the upper layer is formed by two electrodes, the function of identifying and identifying the external object classification by touch can be realized, but the measurement of the proximity degree of the touch to the external object cannot be realized, the upper layer electrode and the lower layer electrode can form a parallel plate capacitor, the normal force measurement of pressure sense can be realized, but the measurement of tangential force cannot be realized, and the patent cannot realize any anti-interference measures such as shielding or difference. Nor does any measure of anti-crosstalk be achieved when forming the matrix.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a sensor for realizing electromagnetic shielding by applying a multifunctional layer.
The sensor for realizing electromagnetic shielding by using the multifunctional layers is characterized by comprising a plurality of sensor units, wherein each sensor unit comprises at least 2 multifunctional layers, each functional layer comprises a corresponding area, an internal electrode is arranged in each multifunctional layer, the multifunctional layers are covered outside the internal electrodes, and the multifunctional layers are respectively grounded and connected with the internal electrodes of the multifunctional layers through an analog switch so as to realize grounding shielding or equipotential shielding.
The invention provides a sensor for realizing electromagnetic shielding by using a multifunctional layer, which also comprises the following auxiliary technical schemes:
wherein each sensor unit comprises 4 multifunctional layers.
The first multifunctional layer and the third multifunctional layer are arranged at equal height and opposite to each other, the second multifunctional layer and the fourth multifunctional layer are arranged at equal height and opposite to each other, the center distance between the first multifunctional layer and the third multifunctional layer is d1, the center distance between the second multifunctional layer and the fourth multifunctional layer is d2, the ratio of d1 to d2 is 1.2-5, the heights of the first multifunctional layer and the third multifunctional layer are h1, the heights of the second multifunctional layer and the fourth multifunctional layer are h2, and the difference value between the h1 and the h2 is 1-3mm.
The multifunctional layer is connected to the processor through an analog switch, and the processor is connected to an external circuit;
The multifunctional layer can shield the sensor in regions through time-sharing switching of the analog switch and control of the bus;
wherein each measurement period T is made up of two sub-periods T1 and T2:
When T1, the first multifunctional layer is connected with a multifunctional layer excitation signal, the third multifunctional layer is connected with an analog-to-digital conversion circuit, the second multifunctional layer and the fourth multifunctional layer are simultaneously grounded, or the second multifunctional layer and the fourth multifunctional layer are simultaneously connected with excitation signals of parallel plate capacitance common electrodes in the second multifunctional layer and the fourth multifunctional layer, an analog switch for controlling the parallel plate capacitance in the first multifunctional layer and the third multifunctional layer is disconnected, and the analog switch for controlling the parallel plate capacitance in the second multifunctional layer and the fourth multifunctional layer is connected with excitation signals of the parallel plate capacitance common electrodes in the second multifunctional layer and the fourth multifunctional layer, so that the capacitor C1 formed by the first multifunctional layer and the third multifunctional layer is not subjected to external crosstalk of the second multifunctional layer and the fourth multifunctional layer when touch connection is realized, and meanwhile, the parallel plate capacitance in the second multifunctional layer and the fourth multifunctional layer is still in a working state under a shielding state, so that the change of three-dimensional capacity can be measured;
In the T2 process, the second multifunctional layer is connected with an excitation signal of the multifunctional layer, the fourth multifunctional layer is connected with an analog-to-digital conversion circuit, the first multifunctional layer and the third multifunctional layer are simultaneously grounded, or the first multifunctional layer and the third multifunctional layer are simultaneously connected with an excitation signal of a common electrode of internal parallel plate capacitors, an analog switch for controlling the internal parallel plate capacitors of the second multifunctional layer and the fourth multifunctional layer is disconnected, and the analog switch for controlling the internal parallel plate capacitors of the first multifunctional layer and the third multifunctional layer is connected with an excitation signal of a common electrode of the internal parallel plate capacitors, so that the capacitor C2 formed by the second multifunctional layer and the fourth multifunctional layer is not subjected to external crosstalk of the first multifunctional layer and the third multifunctional layer, is not subjected to crosstalk of the internal parallel plate capacitors of the second multifunctional layer and the fourth multifunctional layer when the touch is realized, and meanwhile, the first multifunctional layer and the third multifunctional layer are in a shielding state, and the internal parallel plate capacitors can still be in a working state so as to measure the change of three-dimensional force;
In the next period T3, the 4 multifunctional layers of the sensor unit in the shielding state are simultaneously grounded or connected with the excitation signals of the common electrodes of the internal parallel plate capacitors, and the common electrodes of the internal parallel plate capacitors of the 4 multifunctional layers are connected with the excitation signals of the corresponding common electrodes, so that the sensor unit in the shielding state can measure the change of the three-dimensional force, wherein t3=t.
Wherein the measurement period T is 1-20ms, and t1=t2=0.5t.
The multifunctional printed circuit board comprises a plurality of multifunctional layers, wherein each multifunctional layer comprises an upper portion and a bottom portion, the upper portions are made of flexible conductive materials, a protective layer made of flexible insulating materials is arranged outside the flexible conductive materials, the bottoms comprise a plurality of layers of PCB boards or FPC boards, a flexible insulating layer is arranged below the PCB boards or the FPC boards, a grounding shielding layer controlled by an analog switch is arranged below the flexible insulating layer, an insulating protective layer is arranged below the grounding shielding layer controlled by the analog switch, annular electrodes corresponding to each multifunctional layer are arranged on a first layer of PCB board or an FPC board, round electrodes are arranged on a second layer of PCB board or an FPC board, through holes are formed in the round electrodes, the annular electrodes and the round electrodes are connected to form independent conductive areas, the upper portions and the bottoms are electrically connected, the upper cross-shaped common electrodes are electrically connected to the first layer of PCB board or the FPC board through central conductive columns arranged inside the multifunctional layers, and the lower independent electrodes are directly arranged on the first layer of PCB board or the FPC board.
The flexible conductive material is an organic conductive silver adhesive material, and a conductive silver adhesive bonding layer is arranged between the organic conductive silver adhesive material and the multifunctional layer.
The upper part and the bottom of the multifunctional layer are bonded or crimped through conductive adhesive to form electric connection, and the conductive column is electrically connected to the first layer of PCB or FPC board through welding, crimping or conductive adhesive.
The invention also provides an electronic skin which is characterized by comprising the sensor for realizing electromagnetic shielding by using the multifunctional layer.
The invention also provides a robot which is characterized by comprising the electronic skin.
The invention also provides an artificial intelligent artificial limb which is characterized by comprising the electronic skin.
The implementation of the invention comprises the following technical effects:
The sensor for realizing electromagnetic shielding by using the multifunctional layer can completely realize all functional requirements of a touch sensor by means of the multifunctional layer, wherein the multifunctional layer can be used for forming electrodes of capacitors and completely realizing touch sense functional requirements, the multifunctional layer can be used as an electromagnetic shielding layer of an internal detection unit of the sensor, so that all functions of touch contact can be realized on the premise of effectively improving the anti-interference capability of three-dimensional force measurement, and the multifunctional layer can be used for realizing regional shielding scanning when a sensor matrix is formed, so that the crosstalk problem of adjacent sensor units is effectively avoided.
Drawings
Fig. 1 is an external configuration diagram of a sensor unit according to the present invention.
Fig. 2 is a layout of the multifunctional layer according to one embodiment of the present invention.
Fig. 3 is a layout of a multi-functional layer according to another embodiment of the present invention.
Fig. 4 is a layout of a multi-functional layer according to still another embodiment of the present invention.
Fig. 5 is a layered view of a sensor unit of the present invention.
Fig. 6 is an exploded view of a string sensor unit in one embodiment of the present invention.
Fig. 7 is a graph showing the electric field lines of the multifunctional layer of the present invention.
Fig. 8 is a diagram showing the distribution of electric field lines when an external object of the present invention does not enter the electric field line distribution areas of the capacitors C1 and C2.
Fig. 9 is a diagram showing the distribution of electric field lines when an external object enters the electric field line distribution region of the capacitor C1 but does not enter the electric field line distribution region of the capacitor C2.
Fig. 10 is a diagram showing the distribution of electric field lines when an external object of the present invention enters the electric field line distribution areas of the capacitors C1 and C2.
Fig. 11 is a graph showing the electric field lines when an external object of the present invention contacts the capacitor C1 but does not contact the capacitor C2.
Fig. 12 is a graph showing the electric field lines when the external object of the present invention is simultaneously contacted with the capacitors C1 and C2.
Fig. 13 is a matrix scan of a conventional sensor.
Fig. 14 is a scan of a split area shielded matrix of the present invention.
Fig. 15 is a cross-sectional view of a multi-functional area in one embodiment of the invention.
FIG. 16 is a block diagram of a parallel plate capacitor in one embodiment of the invention.
FIG. 17 is a schematic diagram of a parallel plate capacitor in an embodiment of the invention when not under force.
FIG. 18 is a schematic diagram of a parallel plate capacitance subjected to a normal force in one embodiment of the invention.
FIG. 19 is a schematic diagram of a parallel plate capacitor subjected to shear forces in accordance with one embodiment of the present invention.
FIG. 20 is a schematic diagram of a parallel plate capacitor subjected to a slip force in accordance with one embodiment of the present invention.
Fig. 21 is a circuit control diagram in an embodiment of the invention.
Fig. 22 is an equivalent circuit diagram of a sensor unit in one embodiment of the invention.
Fig. 23 is a cross-sectional view of a multi-functional layer in another embodiment of the present invention.
Fig. 24 is a partial exploded view of fig. 23.
FIG. 25 is a schematic diagram of a varistor according to another embodiment of the present invention when the varistor expands due to heat.
FIG. 26 is a schematic diagram of a varistor according to another embodiment of the present invention when the varistor contracts under cooling.
Fig. 27 is an equivalent circuit diagram of a sensor unit in another embodiment of the invention.
Detailed Description
The invention will now be described in detail with reference to the following examples and the accompanying drawings, it being pointed out that the examples described are intended only to facilitate an understanding of the invention and are not intended to be limiting in any way.
As shown in fig. 1, the sensor for realizing electromagnetic shielding by using the multifunctional layers provided by the embodiment comprises a plurality of sensor units, wherein each sensor unit comprises at least 2 multifunctional layers, each multifunctional layer comprises a corresponding area, preferably each sensor unit comprises 4 multifunctional layers, each multifunctional layer comprises a corresponding area, the 4 multifunctional layers are arranged in pairs and are arranged at any angle by taking the intersection point of two pairs of central connecting lines as the center, wherein the 4 multifunctional layers are orthogonally arranged as shown in fig. 2, namely, are arranged at an angle of 90 degrees, the 4 multifunctional layers are horizontally arranged as shown in fig. 3, namely, are arranged at an angle of 0 degrees, and the 4 multifunctional layers are arranged at an angle of 45 degrees as shown in fig. 4.
As shown in fig. 5 and 6, each multifunctional layer includes an upper portion 11 and a bottom portion corresponding to the multifunctional layer, the upper portion 11 is made of flexible conductive material, a protective layer 12 made of flexible insulating material is arranged outside the flexible conductive material, the bottom portion includes a multi-layer PCB board or FPC board, a flexible insulating layer 17 is arranged under the PCB board or FPC board, a grounding shielding layer 18 controlled by an analog switch is arranged under the flexible insulating layer 17, an insulating protective layer 19 is arranged under the grounding shielding layer 18 controlled by the analog switch, a ring electrode 141 corresponding to each multifunctional layer is arranged on the first layer PCB board or FPC board 14, a circular electrode 151 is arranged on the second layer PCB board or FPC board 15, a via hole 152 is arranged on the circular electrode 151, the via hole 152 is used for connecting the ring electrode 141 and the circular electrode 151, so as to form an independent conductive area, and the upper portion 11 made of flexible conductive material and the second layer PCB board or FPC board 15 form a complete multifunctional layer, and the thickness of the single layer PCB board or FPC board is only 0.025mm, so that the required full-function shielding layer can be satisfied. The electronic devices of the touch sensor unit are arranged on the lower surface 162 of the third layer PCB board or FPC board 16, the upper surface 161 and the lower surface 162 of the third layer PCB board or FPC board 16 are used for electronic circuit wiring, as shown in fig. 6, flexible insulating materials 13 are filled in the corresponding area of each multifunctional layer, the flexible insulating materials 13 insulate the upper layer electrode, the lower layer electrode and the multifunctional layer from each other, the upper layer cross-shaped common electrode 6 is electrically connected to the first layer PCB board or FPC board through a central conductive post 20 arranged in the multifunctional layer, the lower layer independent electrode 7 is directly arranged on the first layer PCB board or FPC board 141, and the distance between the upper layer cross-shaped common electrode and the lower layer independent electrode is 0.5-3mm.
Preferably, the volume of the sensor unit is 1mm 3-100mm3.
Preferably, the ground shielding layer 18 controlled by the analog switch is made of an organosilicon conductive silver paste material, and the insulating protection layer 19 is made of a PDMS material.
Preferably, the flexible conductive material is an organic conductive silver colloid material, and the organic conductive silver colloid material and the multifunctional layer are bonded through conductive silver colloid.
Preferably, the upper portion 11 and the bottom of the multifunctional layer are electrically connected by bonding or pressure bonding with conductive paste, and the conductive post 20 is electrically connected to the first layer PCB board or FPC board 141 by welding, pressure bonding or conductive paste.
For convenience of explanation, the present embodiment is exemplified by a horizontal arrangement. As shown in fig. 7, among the 4 multi-functional layers in the present embodiment, the first multi-functional layer 1 and the third multi-functional layer 3 form a capacitor C1, the second multi-functional layer 2 and the fourth multi-functional layer 4 form a capacitor C2, the long dashed line in the figure indicates the electric field distribution of the capacitor C1, the short dashed line indicates the electric field distribution of the capacitor C2, the first multi-functional layer 1 and the third multi-functional layer 3 are higher than the second multi-functional layer 2 and the fourth multi-functional layer 4, and the center distance between the first multi-functional layer 1 and the third multi-functional layer 3 is greater than that between the second multi-functional layer 2 and the fourth multi-functional layer 4. The arrangement is such that the electric field line distribution area of the capacitor C1 is higher than the electric field line distribution area of the capacitor C2. As shown in fig. 8, when the external object 5 does not enter the electric field line distribution areas of the capacitor C1 and the capacitor C2, the medium in the electric field line distribution areas of the capacitor C1 and the capacitor C2 is air, the capacitance values of the capacitor C1 and the capacitor C2 change in equal proportion with the change of the ambient temperature and the humidity, and the influence of the change of the ambient temperature and the humidity can be eliminated by using a digital differential algorithm. As shown in fig. 9, when the external object 5 enters the electric field line distribution area of the capacitor C1 but does not enter the electric field line distribution area of the capacitor C2, the capacitance of the capacitor C1 will change due to the different dielectric constants of the objects made of different materials, the change amount of the capacitance of the capacitor C1 is approximately proportional to the dielectric constant of the external object, and the capacitance of the capacitor C2 is unchanged, as shown in fig. 10, when the external object 5 enters the electric field line distribution areas of the capacitor C1 and the capacitor C2 simultaneously, the change amounts of the capacitance of the capacitor C1 and the capacitor C2 are proportional to the dielectric constants of the object, and the proximity distance and the proximity speed can be calculated according to the relationship between the change amounts of the capacitor C1 and the capacitor C2, thereby realizing the classification recognition and the proximity degree discrimination function of the external object 5.
In this embodiment, the bottoms of the multifunctional layers disposed inside each sensor unit are all disposed on the same plane, so the capacitance provided in this embodiment can be considered as a plane-like capacitance.
As shown in fig. 11, when the external object 5 has just contacted the first and third multifunctional layers 1 and 3, which are relatively higher in the sensor unit, but has not contacted the second and fourth multifunctional layers 2 and 4, which are relatively lower, the detection units inside the first and third multifunctional layers 1 and 3 are forced, and the detection units inside the second and fourth multifunctional layers 2 and 4 have not been forced, and thus have not been changed. When the external object 5 further applies pressure to the sensor unit, as shown in fig. 12, the detection units inside the second multifunctional layer 2 and the fourth multifunctional layer 4 are also subjected to pressure to change. Accordingly, the time when the external object is in contact with the sensor surface can be further accurately determined, and the speed at which the external object is in contact with the sensor surface can be accurately calculated.
According to the sensor for realizing the electromagnetic shielding function by using the multifunctional layer, when a plurality of sensor units form a sensor matrix (used for intelligent bionic skin), the scanning function of the split-area shielding type sensor matrix can be realized through synchronous control of the analog switch and the bus, so that mutual crosstalk of adjacent sensor units is avoided during matrix scanning.
The prior art capacitive matrix scanning is shown in fig. 13, in which the row scan lines are connected to the excitation signal through multiple switches, and the column scan lines are connected to the capacitive input measurement channels through multiple switches. When a row and a column, such as a second row and a second column, are selected, the excitation signals on the selected row are simultaneously applied to the capacitive excitation poles of all columns, and only the capacitive input stage of the selected column is connected to the capacitance measuring channel, but the excitation poles of the capacitances on adjacent columns which are not selected on the selected row can generate crosstalk to the selected capacitances. In addition, the stimulus signal on the connection lines on the selected row can also cause crosstalk to the selected capacitance.
In this embodiment, as shown in fig. 14, the split-area shielding scanning mode is that the SPI bus selects the sensor unit in the measurement state by the address bit, and the sensor unit not designated by the address bit is marked as the X ground shield, so that crosstalk is not caused to the selected sensor unit. The selected sensor unit, 4 of which multiple functional layers form 2 capacitors for realizing the tactile function, has excitation signals coming from the inside of the sensor unit. When the sensor unit is used as a grounding shielding unit inch, 4 multifunctional layers of the sensor unit are grounded at the same time, and the size of the shielding area, namely the number of units shielded by grounding, can be selected according to actual needs. When the sensor unit is used as a grounding shielding unit, the multifunctional layers of the sensor unit temporarily lose the function of touch sense, but the unit for three-dimensional force measurement inside each multifunctional layer is still in a normal working state so as to ensure that the sensor unit still has the functions of pressure sense and slip sense. Since the 4 multifunctional layers of the unselected sensor units are all grounded, no crosstalk is caused to the adjacent selected unit.
Example 1
In this embodiment, the detection unit for detecting three-dimensional force inside the multifunctional layer is a parallel plate capacitor.
The parallel plate capacitance structures within the 4 multifunctional layers on each sensor unit are identical, and for simplicity of illustration we will only take the internal structure of the first multifunctional layer 1 as an example.
As shown in fig. 15, 16, 21 and 22, the upper cross-shaped common electrode 6 of the first multifunctional layer 1 forms 4 parallel plate capacitances C3, C4, C5 and C6 with the 4 rectangular independent electrodes 7 disposed corresponding to the lower layer respectively, the upper cross-shaped common electrode 6 of the second multifunctional layer 2 forms 4 parallel plate capacitances C7, C8, C9 and C10 with the 4 rectangular independent electrodes 7 disposed corresponding to the lower layer respectively, the upper cross-shaped common electrode 6 of the third multifunctional layer 3 forms 4 parallel plate capacitances C11, C12, C13 and C14 with the 4 rectangular independent electrodes 7 disposed corresponding to the lower layer respectively, and the upper cross-shaped common electrode 6 of the fourth multifunctional layer 4 forms 4 parallel plate capacitances C15, C16, C17 and C18 with the 4 rectangular independent electrodes 7 of the lower layer respectively, wherein the common electrode 6 is connected with an excitation signal, and the rectangular electrodes 7 are connected with 4 capacitance analog-to-digital conversion channels respectively.
For convenience of explanation, the parallel plate capacitors C4 and C5 formed by the upper cross-shaped common electrode 6 and the lower rectangular electrode 7 will be described as examples.
As shown in fig. 17, when no external force is applied, the interval between the plates of the parallel plate capacitor C4 is a1, the facing area between the plates is s1, the interval between the plates of the parallel plate capacitor C5 is a2, and the facing area between the plates is s2, where a1=a2, s1=s2, and thus the capacitance values of the parallel plate capacitor C4 and the parallel plate capacitor C5 are also equal. When subjected to the normal pressure of the external object 5, as shown in fig. 18, the gap a1 between the plates of the parallel plate capacitor C4 and the gap a2 between the plates of the parallel plate capacitor C5 both change, thereby changing the capacitance values of both the parallel plate capacitor C4 and the parallel plate capacitor C5. From this the magnitude and direction of the normal force received can be determined. When subjected to tangential force of the external object 5, as shown in fig. 19, the facing area s1 between the two plates of the parallel plate capacitor C4 and the facing area s2 between the two plates of the parallel plate capacitor C5 both change, thereby changing the capacitance values of both the parallel plate capacitor C4 and the parallel plate capacitor C5. The tangential force can be measured according to the magnitude of the tangential force, and the tangential force direction can be judged according to the difference of the capacitance values of the parallel plate capacitor C4 and the parallel plate capacitor C5. Specifically, when subjected to tangential force in the direction indicated by the arrow in fig. 19, the absolute value of the capacitance value variation value of the parallel plate capacitance C4 is larger than the absolute value of the capacitance value variation value of the parallel plate capacitance C5. When subjected to tangential force in the direction opposite to that shown by the arrow in fig. 19, the absolute value of the capacitance value variation value of the parallel plate capacitance C4 is smaller than that of the parallel plate capacitance C5. It can be seen that the direction of tangential force to which the sensor is subjected can be determined according to the difference in capacitance value of the parallel plate capacitance C4 and the parallel plate capacitance C5 in the present embodiment. When a sliding force is applied, as shown in fig. 20, the normal force and tangential force applied to the parallel plate capacitor C4 and the parallel plate capacitor C5 vibrate, causing a change in the gap a1 between the plates of the parallel plate capacitor C4 and the gap a2 between the plates of the parallel plate capacitor C5, and a change in the facing area s1 between the plates of the parallel plate capacitor C4 and the facing area s2 between the plates of the parallel plate capacitor C5, resulting in fluctuation in capacitance of the parallel plate capacitor C4 and the parallel plate capacitor C5. From this the speed and direction of the sliding can be determined.
In the embodiment, the multifunctional layer covers the outer parts of the upper cross-shaped common electrode and the lower independent electrode, wherein the multifunctional layer can be hemispherical, ellipsoidal or the like;
The multifunctional layer is used for realizing electromagnetic shielding function on the parallel plate capacitor in the multifunctional layer, and two modes of realizing electromagnetic shielding are grounding shielding and equipotential shielding;
The analog switch of the multifunctional layer is switched to be connected with an excitation signal corresponding to the common electrode of the parallel plate capacitor, so that the multifunctional layer and the common electrode of the parallel plate capacitor form equipotential, and the equipotential shielding of external electromagnetic signals is realized.
Specifically, the multifunctional layer in this embodiment is connected to a processor through an analog switch, and the processor is connected to an external circuit through a bus;
the multifunctional layer realizes the function of the split-area shielding sensor through time-sharing switching of the analog switch and control of the bus, and when the split-area scanning is carried out:
as shown in fig. 21, the sensor unit in the scanning state is to perform a T-cycle operation in which one measurement cycle T is composed of two sub-cycles T1 and T2:
In the T1, the analog switch K1 of the first multifunctional layer 1 is connected with the excitation signal S1 of the multifunctional layer, the analog switch K3 of the third multifunctional layer 3 is connected with the analog-to-digital conversion circuit M1, the analog switch K2 of the second multifunctional layer 2 and the analog switch K4 of the fourth multifunctional layer 4 are simultaneously grounded, or the analog switch K2 of the second multifunctional layer 2 is connected with the excitation signal S2-1 of the internal parallel plate capacitance common electrode 6 thereof, the analog switch K4 of the fourth multifunctional layer 4 is connected with the excitation signal S4-1 of the internal parallel plate capacitance common electrode 6 thereof, the analog switch K1-1 of the internal parallel plate capacitance of the first multifunctional layer 1 is disconnected with the analog switch K3-1 of the internal parallel plate capacitance of the third multifunctional layer 3, so that the capacitance C1 is not subjected to external crosstalk of the second multifunctional layer 2 and the fourth multifunctional layer 4 when the touch is realized, and is not subjected to crosstalk of the internal parallel plate capacitance of the first multifunctional layer 1 and the third multifunctional layer 3;
In the T2, the analog switch K2 of the second multifunctional layer 2 is connected with the excitation signal S2 of the multifunctional layer, the analog switch K4 of the fourth multifunctional layer 4 is connected with the analog-to-digital conversion circuit M2, the analog switch K1 of the first multifunctional layer 1 and the analog switch K3 of the third multifunctional layer 3 are simultaneously grounded, or the analog switch K1 of the first multifunctional layer 1 is connected with the excitation signal S1-1 of the parallel plate capacitance common electrode 6 thereof, the analog switch K3 of the third multifunctional layer 3 is connected with the excitation signal S3-1 of the parallel plate capacitance common electrode 6 thereof, the analog switch K2-1 of the second multifunctional layer internal parallel plate capacitor is disconnected with the analog switch K4-1 of the fourth multifunctional layer internal parallel plate capacitor, so that the capacitance C2 is not influenced by external crosstalk of the first multifunctional layer 1 and the third multifunctional layer 3 when the touch is realized, and is not influenced by the internal capacitance of the second multifunctional layer 2 and the fourth multifunctional layer 4;
the sensor unit in the shielded state is subjected to the following T3 cycle operation, wherein t3=t:
In the T3 process, the analog switches K1, K2, K3 and K4 of the 4 multifunctional layers of the sensor unit in the shielding state are simultaneously grounded, or the analog switches K1, K2, K3 and K4 of the 4 multifunctional layers are simultaneously connected with the excitation signals S1-1, S2-1, S3-1 and S4-1 of the common electrodes 6 of the parallel plate capacitors, and the analog switches K1-1, K2-1, K3-1 and K4-1 of the common electrodes of the 4 multifunctional layers are simultaneously connected with the excitation signals S1-1, S2-1, S3-1 and S4-1 of the corresponding common electrodes 6 of the parallel plate capacitors, so that the sensor unit in the shielding state can measure three-dimensional force change.
As shown in fig. 22, the capacitance measurement of the present embodiment uses an ad1 company 7150 chip, the processor uses a 32-bit processor with an ARM-m0 core, and the external communication uses an SPI bus.
Preferably, the measurement period T is 1-20ms, and t1=t2=0.5t.
Preferably, the combination of the multifunctional layer and the parallel plate capacitance can realize a temperature sensing function. In fact, the temperature can be measured directly with parallel plate capacitances for measuring three-dimensional forces, and ambient temperature changes can cause the medium between the parallel plate capacitances to expand or contract, thereby changing the spacing of the parallel plate capacitances, resulting in a change in capacitance. However, the conventional touch sensor has no multifunctional layer, and cannot distinguish whether the capacitance change is caused by the pressure of an external object or the temperature change, so that the temperature sense of the touch sensor cannot be realized by directly using the parallel plate capacitance. In this embodiment, whether an external object touches the touch sensor or not can be accurately determined by using the multifunctional layer, and under the condition that no external object touches the touch sensor, the only factor causing the change of the capacitance of the internal parallel plates can only be the temperature due to the electromagnetic shielding effect of the multifunctional layer, as shown in fig. 8 and 25, when the ambient temperature increases, the flexible insulating material between the parallel plate capacitances will expand, causing the distance between the parallel plate capacitances to become larger, so that the capacitance value of the 4 parallel plate capacitances becomes smaller in the same ratio, whereas, as shown in fig. 26, when the ambient temperature decreases, the flexible insulating material between the parallel plate capacitances will shrink, causing the distance between the parallel plate capacitances to become smaller, so that the capacitance value of the 4 parallel plate capacitances becomes larger in the same ratio, and thus the change of the temperature can be calculated according to the change of the capacitance.
When the external object 5 contacts the sensor, as shown in fig. 11, the first multi-functional layer 1 and the third multi-functional layer 3 which are higher are subjected to pressure first due to the height difference between the two pairs of multi-functional layers, while the second multi-functional layer 2 and the fourth multi-functional layer 4 which are lower are not subjected to pressure yet, as shown in fig. 25, if the temperature of the external object 5 is higher than the ambient temperature, the flexible insulating material between the inner parallel plate capacitor plates of the second multi-functional layer 2 and the fourth multi-functional layer 4 which are not subjected to pressure will expand due to the heat sensing effect, thereby causing the capacitance ratio thereof to decrease, whereas, as shown in fig. 26, if the temperature of the external object 5 is lower than the ambient temperature, the flexible insulating material between the inner parallel plate capacitor plates of the second multi-functional layer and the fourth multi-functional layer which are not subjected to pressure will contract due to the heat sensing effect, thereby causing the capacitance ratio thereof to increase. So that the temperature of the contact to the external object can be estimated from the change in capacitance of the parallel plate capacitances in the second multifunctional layer 2 and the fourth multifunctional layer.
Preferably, the parallel plate capacitance is measured in the range of 0.001pf to 100pf.
Preferably, the center distance between the first multifunctional layer 1 and the third multifunctional layer 3 is d1, the center distance between the second multifunctional layer 2 and the fourth multifunctional layer 4 is d2, the ratio of d1 to d2 is 1.2-5, the heights of the first multifunctional layer 1 and the third multifunctional layer 3 are h1, the heights of the second multifunctional layer 2 and the fourth multifunctional layer 4 are h2, and the difference value between h1 and h2 is 1-3mm.
Example 2
In this embodiment, the detection unit for detecting three-dimensional force inside the multifunctional layer is a varistor.
As shown in fig. 23 to 26, the structure and function of the multifunctional layer are the same as those of the multifunctional layer in example 1. The principle that the multifunctional layer is used for measuring three-dimensional force is changed into a piezoresistor by a parallel plate capacitor, the internal electrode structure of the multifunctional layer is unchanged, but 4 rectangular flexible piezoresistors 21 are added between the upper cross-shaped public electrode 6 and the lower rectangular independent electrode 7, the upper cross-shaped public electrode 6 and the lower rectangular independent electrode serve as two poles of the piezoresistor 21, when normal force is applied, the 4 piezoresistors 21 are subjected to the same deformation pressure, when tangential force and sliding force are applied, the 4 piezoresistors 21 are subjected to different deformation pressures, and the change of the three-dimensional force can be measured according to the change of four resistors.
In this embodiment, the multifunctional layer covers the upper cross-shaped common electrode, the piezoresistor and the lower independent electrode, wherein the multifunctional layer may be hemispherical or ellipsoidal.
Preferably, the combination of the multifunctional layer and the piezoresistor 21 can also realize a temperature sensing function. When the temperature changes, the four piezoresistors inside the multifunctional layer for measuring the three-dimensional force are also affected by the temperature change to cause the change of resistance, so that the temperature sensing function can be realized, and the measurement principle is similar to that of the parallel plate capacitance, so that the description is omitted here. Specifically, the piezoresistor 21 is made of conductive rubber piezoresistive material, which is a polymer material made by uniformly distributing carbon or other highly conductive particles into an insulating flexible polymer matrix material by a specific process, and the conductivity of the piezoresistive material depends on the density of the internal conductive particles. When the piezoresistive material is deformed by pressure, the density of conductive particles in the piezoresistive material is changed, so that the resistance at two ends of the sensor is changed, and the change of the three-dimensional force in the multifunctional layer can be measured according to the change of the resistance.
As shown in fig. 27, the multifunctional layer is connected to a processor through an analog switch, the processor is connected to an external circuit through a bus, the functions of the multifunctional layer controlled by the analog switch and the piezoresistor inside the multifunctional layer are periodically switched in a time-sharing manner, wherein one measurement period T is composed of two subcycles T1 and T2:
During the period T1, the analog switch K1 of the first multifunctional layer 1 connects the first multifunctional layer 1 with the multifunctional layer excitation signal S1, the analog switch K3 of the third multifunctional layer 3 connects the third multifunctional layer 3 with the capacitance analog-to-digital conversion circuit m1, so that the first multifunctional layer 1 and the third multifunctional layer 3 form a capacitance C1, the analog switch K2 of the second multifunctional layer 2 and the analog switch K4 of the fourth multifunctional layer 4 are grounded at the same time, the analog switch K1-1 controlling the piezoresistor 21 in the first multifunctional layer 1 and the analog switch K3-1 controlling the piezoresistor 21 in the third multifunctional layer 3 are simultaneously opened, so that the capacitance C1 is not influenced by external crosstalk of the second multifunctional layer 2 and the fourth multifunctional layer 4 when the touch connection is realized, and is not influenced by crosstalk of the first multifunctional layer 4 and the third multifunctional layer 3, and simultaneously, the analog switch K2-1 controlling the second multifunctional layer 2 and the analog switch K4 controlling the fourth multifunctional layer 4 are connected with the piezoresistor 21 in the same time, so that the three-dimensional measuring voltage-dependent resistor is still in a three-dimensional state.
During the period T2, the analog switch K2 of the second multifunctional layer 2 connects the second multifunctional layer 2 with the multifunctional layer excitation signal S2, the analog switch K4 of the fourth multifunctional layer 4 connects the fourth multifunctional layer 4 with the capacitance analog-to-digital conversion circuit m2, so that the second multifunctional layer 2 and the fourth multifunctional layer 4 form a capacitance C2, the analog switch K1 of the first multifunctional layer 1 and the analog switch K3 of the third multifunctional layer 3 are grounded at the same time, the analog switch K2-1 of the piezoresistor 21 in the second multifunctional layer 2 and the analog switch K4-1 of the piezoresistor 21 in the fourth multifunctional layer 4 are simultaneously opened, so that the capacitance C2 is not influenced by external crosstalk of the first multifunctional layer 1 and the third multifunctional layer 3 when the touch connection is realized, and is not influenced by crosstalk of the second multifunctional layer 2 and the fourth multifunctional layer 4, and at the same time, the analog switch K1-1 of the piezoresistor 21 in the first multifunctional layer 1 and the analog switch K3 in the third multifunctional layer 3 are controlled, so that the voltage-dependent resistor 21 in the third multifunctional layer 3 and the third multifunctional layer 4 are still in a three-dimensional state, and the three-dimensional state can be kept.
The time of the measurement period T should be controlled between 1 and 20ms, t1=t2=1/2T.
When the split area matrix scanning is performed, the sensor unit selected to be in the measurement state performs the above-described T period, and the sensor unit selected to be the shielding area performs a special period T3.
The analog switches K1, K2, K3 and K4 of 4 multifunctional layers of the sensor unit in a shielding state are grounded, and meanwhile, the analog switches K1-1, K2-1, K3-1 and K4-1 of the piezoresistors 21 in the 4 multifunctional layers are connected with the cross-shaped common electrode 6 of the piezoresistor 21 in the sensor unit in the shielding state, so that the sensor unit in the shielding state can measure the change of three-dimensional force.
As shown in fig. 27, the capacitance measurement of the present embodiment uses an ad1 company 7150 chip, the processor uses a 32-bit processor with an ARM-m0 core, and the external communication uses an SPI bus.
Preferably, the measurement period T is 1-20ms, and t1=t2=0.5t.
Another aspect of the application also relates to an electronic skin comprising an electromagnetic shielding function by applying the above-mentioned multifunctional layer, since the improvement relates only to the sensor on the artificial skin, while other components can be implemented by the more mature technology in the prior art. Therefore, the present application will not be described with respect to other components of the electronic skin.
Yet another aspect of the application relates to a robot comprising an electronic skin as described above, since the improvement relates only to sensors on the electronic skin, while other components may employ more sophisticated techniques in the art. Therefore, the present application will not be described further with respect to other components of the intelligent robot.
Still another aspect of the present application is directed to an artificial intelligence prosthesis comprising the electronic skin described above, as the improvement relates only to contact sensors on the artificial skin, and other components can employ well-established techniques in the art. Therefore, the present application will not be described with respect to other components of an artificial intelligence prosthesis.
Finally, it should be noted that the above embodiments are only for illustrating the technical solution of the present invention, and not for limiting the scope of the present invention, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (11)
1. A sensor for realizing electromagnetic shielding by using multifunctional layers is characterized by comprising a plurality of sensor units, wherein each sensor unit comprises at least 2 multifunctional layers, an analog switch of each multifunctional layer is respectively connected with an excitation signal of the corresponding multifunctional layer and an analog-to-digital conversion circuit, at least one capacitor for detecting the approach of an external object is formed between the multifunctional layers, each multifunctional layer comprises a corresponding area, an internal electrode is arranged in each multifunctional layer, the internal electrode forms a detection unit for detecting external force, the multifunctional layers are covered on the outer parts of the internal electrodes, when the external force is detected, the multifunctional layers are respectively grounded or connected to the internal electrodes of the multifunctional layers through the analog switch to realize grounding shielding or equipotential shielding, and the internal electrodes of the multifunctional layers are still in a working state under a shielding state to measure the change of the force.
2. A sensor for electromagnetic shielding using a multi-functional layer as defined in claim 1, wherein each sensor unit comprises 4 multi-functional layers.
3. The sensor for realizing electromagnetic shielding by using the multifunctional layers according to claim 2, wherein the first multifunctional layer and the third multifunctional layer are equal in height and are oppositely arranged, the second multifunctional layer and the fourth multifunctional layer are equal in height and are oppositely arranged, the center distance between the first multifunctional layer and the third multifunctional layer is d1, the center distance between the second multifunctional layer and the fourth multifunctional layer is d2, the ratio of d1 to d2 is 1.2-5, the heights of the first multifunctional layer and the third multifunctional layer are h1, the heights of the second multifunctional layer and the fourth multifunctional layer are h2, and the difference value between the h1 and the h2 is 1-3mm.
4. A sensor for realizing electromagnetic shielding by using a multifunctional layer according to claim 2 or 3, wherein the multifunctional layer is connected to a processor through an analog switch, and the processor is connected to an external circuit;
The multifunctional layer shields the sensor in regions through time-sharing switching of the analog switch and control of the bus;
wherein each measurement period T is made up of two sub-periods T1 and T2:
In the T1 process, the first multifunctional layer is connected with a multifunctional layer excitation signal, the third multifunctional layer is connected with an analog-to-digital conversion circuit, and the second multifunctional layer and the fourth multifunctional layer are simultaneously grounded, or the second multifunctional layer and the fourth multifunctional layer are simultaneously connected with excitation signals of common electrodes of internal parallel plate capacitors, an analog switch for controlling the internal parallel plate capacitors of the first multifunctional layer and the third multifunctional layer is disconnected, and an analog switch for controlling the internal parallel plate capacitors of the second multifunctional layer and the fourth multifunctional layer is connected with excitation signals of common electrodes of the internal parallel plate capacitors;
in the T2 process, the second multifunctional layer is connected with a multifunctional layer excitation signal, the fourth multifunctional layer is connected with an analog-to-digital conversion circuit, the first multifunctional layer and the third multifunctional layer are simultaneously grounded, or the first multifunctional layer and the third multifunctional layer are simultaneously connected with excitation signals of common electrodes of internal parallel plate capacitors, an analog switch for controlling the internal parallel plate capacitors of the second multifunctional layer and the fourth multifunctional layer is disconnected, and an analog switch for controlling the internal parallel plate capacitors of the first multifunctional layer and the third multifunctional layer is simultaneously connected with excitation signals of common electrodes of the internal parallel plate capacitors;
In the next period T3, the 4 multifunctional layers of the sensor unit in the shielding state are simultaneously grounded, or simultaneously connected with the excitation signals of the common electrodes of the internal parallel plate capacitors, and the common electrodes of the internal parallel plate capacitors of the 4 multifunctional layers are connected with the excitation signals of the corresponding common electrodes, wherein t3=t.
5. A sensor for electromagnetic shielding with a multifunctional layer according to claim 4, wherein the measuring period T is 1-20ms and T1=T2=0.5T.
6.A sensor for realizing electromagnetic shielding by using multifunctional layers according to any one of claims 1-3 is characterized in that each multifunctional layer comprises an upper part and a bottom part, wherein the upper part and the bottom part correspond to the multifunctional layers, the upper part is made of flexible conductive materials, a protective layer made of flexible insulating materials is arranged outside the flexible conductive materials, the bottom part comprises a multi-layer PCB (printed Circuit Board) or FPC (flexible printed Circuit Board), a flexible insulating layer is arranged below the PCB or FPC, a grounding shielding layer controlled by an analog switch is arranged below the flexible insulating layer, an insulating protective layer is arranged below the grounding shielding layer controlled by the analog switch, a circular electrode corresponding to each multifunctional layer is arranged on a first layer PCB or FPC board, a circular electrode is arranged on a second layer PCB or FPC board, through holes are formed in the circular electrode and are connected with the circular electrode to form independent conductive areas, an upper common electrode is electrically connected to the first layer or FPC board through a central conductive post arranged inside the multifunctional layer, and a lower common electrode is arranged on the first layer or FPC board directly on the first layer or the PCB.
7. The sensor for achieving electromagnetic shielding through the multifunctional layer according to claim 6, wherein the flexible conducting material is an organic conducting silver colloid material, and a conducting silver colloid bonding layer is arranged between the organic conducting silver colloid material and the multifunctional layer.
8. The sensor for realizing electromagnetic shielding by using the multifunctional layer as set forth in claim 6, wherein the upper part and the bottom of the multifunctional layer are electrically connected by bonding or crimping with conductive adhesive, and the conductive post is electrically connected to the first layer of PCB or FPC board by welding, crimping or conductive adhesive.
9. An electronic skin comprising a sensor according to any one of claims 1-8, which is electromagnetically shielded by the application of a multifunctional layer.
10. A robot comprising the electronic skin of claim 9.
11. An artificial intelligence prosthesis comprising an electronic skin according to claim 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810093956.9A CN108132113B (en) | 2018-01-31 | 2018-01-31 | Using multifunctional layers to achieve electromagnetic shielding for sensors, electronic skin, and robots |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810093956.9A CN108132113B (en) | 2018-01-31 | 2018-01-31 | Using multifunctional layers to achieve electromagnetic shielding for sensors, electronic skin, and robots |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108132113A CN108132113A (en) | 2018-06-08 |
| CN108132113B true CN108132113B (en) | 2025-02-11 |
Family
ID=62430268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810093956.9A Active CN108132113B (en) | 2018-01-31 | 2018-01-31 | Using multifunctional layers to achieve electromagnetic shielding for sensors, electronic skin, and robots |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108132113B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111912462B (en) * | 2020-08-12 | 2021-12-24 | 东南大学 | A multifunctional flexible tactile sensor with sliding sense, pressure sense and temperature sense |
| CN113125055B (en) * | 2021-03-03 | 2022-11-08 | 上海大学 | Piezoresistive and capacitive fused three-dimensional flexible touch sensor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201993730U (en) * | 2011-02-11 | 2011-09-28 | 德理投资股份有限公司 | Touch panel with interference shielding |
| CN106959175A (en) * | 2017-03-21 | 2017-07-18 | 合肥工业大学 | A kind of Grazing condition condenser type based on pyramid structure slides touch sensor |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU2086996C1 (en) * | 1994-04-11 | 1997-08-10 | Дмитрий Иванович Нефедьев | Device for testing high-voltage measuring voltage transformers |
| JP5308465B2 (en) * | 2011-01-28 | 2013-10-09 | タツタ電線株式会社 | Shield printed wiring board |
| CN204286649U (en) * | 2014-11-19 | 2015-04-22 | 衢州学院 | A kind of bionic three-dimensional capacitance type touch sensor of tentacle structure |
-
2018
- 2018-01-31 CN CN201810093956.9A patent/CN108132113B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201993730U (en) * | 2011-02-11 | 2011-09-28 | 德理投资股份有限公司 | Touch panel with interference shielding |
| CN106959175A (en) * | 2017-03-21 | 2017-07-18 | 合肥工业大学 | A kind of Grazing condition condenser type based on pyramid structure slides touch sensor |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108132113A (en) | 2018-06-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108362427B (en) | Touch sensor with multifunctional layer, electronic skin and intelligent robot | |
| CN108446042B (en) | Capacitive touch sensor, electronic skin and intelligent robot | |
| JP7054561B2 (en) | Sensors, electronic skin and robots that have the function of shielding by time and shielding by area. | |
| CN108362428A (en) | A kind of capacitance-resistance combined type touch sensor, electronic skin and intelligent robot | |
| CN106959175B (en) | A fully flexible capacitive sliding tactile sensor based on pyramid structure | |
| CN207923324U (en) | With timesharing, the sensor of subregion function of shielding, electronic skin and robot | |
| US20140013865A1 (en) | Apparatus for Sensing | |
| KR20170103758A (en) | Flexible transparent sensor with ionically-conductive material | |
| CN104236764B (en) | A kind of capacitive touch sliding feeling sensor device | |
| CN107290082A (en) | A kind of capacitance type touch sensor | |
| CN111735561A (en) | A flexible proximity and tactile dual-mode sensor for robotics | |
| CN106775055A (en) | Flexible touch screen and flexible touch display screen | |
| CN207741882U (en) | A kind of contact sensor, electronic skin and intelligent robot with Multifunctional layered | |
| CN106383607A (en) | Touch Display System with Pressure Sensing | |
| CN108132113B (en) | Using multifunctional layers to achieve electromagnetic shielding for sensors, electronic skin, and robots | |
| CN209820667U (en) | Capacitive touch sensor, electronic skin and intelligent robot | |
| CN113386158B (en) | A fully printed biomimetic super-sensing flexible robotic skin | |
| CN218875482U (en) | A touch sensor, mechanical clamping jaw, intelligent robot for mechanical clamping jaw | |
| CN103063340A (en) | Two-dimensional matrix sensor of thin-film-shaped soft sensing materials | |
| CN104267858B (en) | Sensing chip, manufacturing method thereof and electronic device provided with sensing chip | |
| CN103063331A (en) | Simple-structure two-dimensional matrix sensor using soft induction materials | |
| CN207741883U (en) | A kind of capacitance-resistance combined type touch sensor, electronic skin and intelligent robot | |
| CN207764769U (en) | A kind of capacitive touch sensors, electronic skin and intelligent robot | |
| CN111896163A (en) | Resistance-type touch sensor, electronic skin and intelligent robot | |
| CN210036760U (en) | Dual Mode Sensing Units and Dual Mode Sensors |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |