CN108124075B - Image sensor - Google Patents
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- CN108124075B CN108124075B CN201711135554.2A CN201711135554A CN108124075B CN 108124075 B CN108124075 B CN 108124075B CN 201711135554 A CN201711135554 A CN 201711135554A CN 108124075 B CN108124075 B CN 108124075B
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- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 101150073480 CIS1 gene Proteins 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
- H04N1/028—Details of scanning heads ; Means for illuminating the original for picture information pick-up
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/024—Details of scanning heads ; Means for illuminating the original
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Facsimile Heads (AREA)
- Facsimile Scanning Arrangements (AREA)
- Studio Devices (AREA)
Abstract
The invention discloses an image sensor. Wherein, this image sensor includes: the photosensitive chip set comprises a plurality of photosensitive chips which are sequentially connected along a preset direction, and each photosensitive chip is used for converting light sensed by the photosensitive chip set into an electric signal; the printed circuit board group comprises a plurality of printed circuit boards which are sequentially connected along a preset direction, each printed circuit board is connected with at least one photosensitive chip, and each printed circuit board is used for receiving electric signals converted by the corresponding connected photosensitive chip; an interface module for performing communication between the image sensor and an external device; the driving circuit is arranged between the photosensitive chip set and the interface module and is used for driving electric signals transmitted between the image sensor and external equipment. The invention solves the technical problem of signal attenuation and distortion caused by lengthening the circuit board and splicing the circuit board in the large CIS in the prior art.
Description
Technical Field
The invention relates to the field of sensors, in particular to an image sensor.
Background
The contact image sensor (CIS for short) is an image sensor which adopts a plurality of circuit boards to splice together and realizes large-format image scanning, and the contact image sensor (CIS for short) is used for scanning manuscript images and is mainly applied to fax machines, scanners, multifunctional integrated machines, automatic teller machines, sorter machines, paper marking machines and other devices, the scanning width of the contact image sensor used by the devices is 183-216 mm at most, and the scanning width can reach A3 length at most. With the development of technology, the contact image sensor is gradually applied to the fields of online detection, machine vision and the like, and is used for scanning textiles, large maps and the like, and for some special purposes, the scanning width of the image sensor may be required to reach more than one meter. However, the current circuit board manufacturers on the market cannot produce longer wiring circuit boards, which restricts the scanning width of the contact image sensor. In the prior art, two methods are generally adopted to realize large-format scanning:
(1) The first method is shown in fig. 1, and a plurality of contact image sensors with shorter scanning widths are adopted for staggered splicing, which is common to an electronic whiteboard, for example, the contact image sensors CIS 1-CIS 4 with 4 A4 scanning widths are adopted for staggered splicing to realize large-format scanning.
(2) The second method is shown in fig. 2, in which a plurality of shorter wiring circuit boards (also called printed circuit boards, abbreviated as PCBs) are spliced on a base station on which the PCBs are mounted to splice a longer circuit board, so as to realize large-scale scanning.
The first method adopts a plurality of contact image sensors for splicing, the cost is greatly increased, the CIS1 and the CIS3 are required to be on one horizontal scanning line due to the staggered mode for splicing, the CIS2 and the CIS4 are also required to be on one horizontal scanning line, and the two scanning lines are required to be parallel, so that the high requirements on the manufacturing process are met. Moreover, CIS stitching brings great trouble to later image stitching, and high requirements are put on an image processing algorithm. The second method adopts a plurality of printed circuit boards for splicing, and due to the splicing gaps among the PCBs, the phenomenon of leakage points can occur during scanning, and the scanning precision is affected. In the two methods, each spliced CIS needs an independent control signal, and the spliced CIS needs to be simultaneously communicated with external equipment, so that the interfaces are complex and the number of signals is large.
In addition, at present, there is a method of splicing the photosensitive chips and the wiring circuit boards separately, that is, splicing the photosensitive chips and the wiring circuit boards, and by adopting the splicing mode, the cost is reduced, the precision is ensured, and the requirement of large-format scanning can be met. However, the problems of signal attenuation, distortion and the like caused by lengthening the circuit board and splicing the circuit board prevent the development of a large CIS.
In view of the above problems, no effective solution has been proposed at present.
Disclosure of Invention
The embodiment of the invention provides an image sensor, which at least solves the technical problem of signal attenuation and distortion caused by lengthening a circuit board and splicing the circuit board in a large CIS in the prior art.
An embodiment of the present invention provides an image sensor including: the photosensitive chip set comprises a plurality of photosensitive chips which are sequentially connected along a preset direction, and each photosensitive chip is used for converting light sensed by the photosensitive chip set into an electric signal; the printed circuit board group comprises a plurality of printed circuit boards which are sequentially connected along a preset direction, each printed circuit board is connected with at least one photosensitive chip, and each printed circuit board is used for receiving electric signals converted by the corresponding connected photosensitive chip; an interface module for performing communication between the image sensor and an external device; the driving circuit is arranged between the photosensitive chip set and the interface module and is used for driving electric signals transmitted between the image sensor and external equipment.
Further, the image sensor further includes: the first group of buses comprises a plurality of buses, the buses of the first group of buses are connected with the printed circuit boards in one-to-one correspondence and are connected with the interface module, each bus in the first group of buses is used for transmitting electric signals of the corresponding connected printed circuit boards, wherein the driving circuit comprises a plurality of output driving circuits, the output driving circuits are connected with the printed circuit boards in one-to-one correspondence, and each output driving circuit is used for driving the electric signals of the corresponding connected printed circuit boards.
Further, a first group of buses are arranged on each printed circuit board, the first groups of buses of two adjacent printed circuit boards are connected through a plurality of communication connecting wires, and the plurality of communication connecting wires are in one-to-one correspondence with the plurality of buses of the first group of buses.
Further, the plurality of communication connection lines on the two adjacent printed circuit boards are integrated in at least one metal strip, and the at least one metal strip is bridged above the two corresponding printed circuit boards.
Further, each printed circuit board includes: the multi-path selection switch circuit comprises a plurality of input ends and an output end, the plurality of input ends of the multi-path selection switch circuit are connected with a plurality of electric signals converted by at least one photosensitive chip connected with the corresponding printed circuit board in a one-to-one correspondence manner, the output end of the multi-path selection switch circuit is used as the output end of the corresponding printed circuit board, and the multi-path selection switch circuit is used for sequentially outputting the plurality of electric signals converted by the at least one photosensitive chip connected with the corresponding printed circuit board.
Further, the image sensor further includes: the second group of buses comprises a plurality of buses, the buses of the second group of buses are connected with the plurality of printed circuit boards in one-to-one correspondence and are connected with the interface module, each bus in the second group of buses is used for transmitting one of electric signals sent by external equipment, wherein the driving circuit comprises a plurality of input driving circuits, the plurality of input driving circuits are connected with the buses of the second group of buses in one-to-one correspondence, and each input driving circuit is used for driving the electric signals transmitted on the corresponding connected buses.
Further, a group of second buses are arranged on each printed circuit board, the second buses of two adjacent printed circuit boards are connected through a plurality of communication connecting wires, and the plurality of communication connecting wires are in one-to-one correspondence with the plurality of buses of the second buses.
Further, the plurality of communication connection lines on the two adjacent printed circuit boards are integrated in at least one metal strip, and the at least one metal strip is bridged above the two corresponding printed circuit boards.
Further, the interface module comprises a plurality of interfaces, the interfaces are in one-to-one correspondence with the printed circuit boards, each interface is arranged on the corresponding printed circuit board, and each interface is connected with all buses included in the image sensor.
Further, the image sensor further includes: the base station, the printed circuit board group sets up on the base station, and drive circuit sets up in the base station.
In the embodiment of the invention, the photosensitive chip group comprises a plurality of photosensitive chips which are sequentially connected along a preset direction, and each photosensitive chip is used for converting light sensed by the photosensitive chip group into an electric signal; the printed circuit board group comprises a plurality of printed circuit boards which are sequentially connected along a preset direction, each printed circuit board is connected with at least one photosensitive chip, and each printed circuit board is used for receiving electric signals converted by the corresponding connected photosensitive chip; an interface module for performing communication between the image sensor and an external device; the driving circuit is arranged between the photosensitive chip set and the interface module and is used for driving an electric signal transmitted between the image sensor and external equipment, so that the technical problems of signal attenuation and signal distortion caused by lengthening a circuit board and splicing the circuit board in the prior art are solved, and the technical effects of reinforcing the signal and preventing signal distortion are further realized.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this specification, illustrate embodiments of the application and together with the description serve to explain the application and do not constitute a limitation on the application. In the drawings:
FIG. 1 is a schematic diagram of an alternative image sensor of the prior art;
FIG. 2 is a schematic diagram of an alternative image sensor of the prior art;
FIG. 3 is a schematic diagram of an alternative image sensor according to an embodiment of the invention;
FIG. 4 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 5 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 6 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 7 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 8 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 9 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 10 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 11 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 12 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 13 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 14 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
FIG. 15 is a schematic view of another alternative image sensor according to an embodiment of the invention;
FIG. 16 is a schematic diagram of another alternative image sensor according to an embodiment of the invention;
fig. 17 is a schematic diagram of another alternative image sensor according to an embodiment of the invention.
Detailed Description
In order that those skilled in the art will better understand the present invention, a technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present invention, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present invention without making any inventive effort, shall fall within the scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and the claims of the present invention and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the invention described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion.
The application provides an image sensor.
Example 1
Fig. 3 is a schematic view of an alternative image sensor according to an embodiment of the present invention, as shown in fig. 3, the image sensor includes a photosensitive chipset 10, a printed circuit board group 20, an interface module 30 and a driving circuit 40, wherein the photosensitive chipset 10 includes a plurality of photosensitive chips sequentially connected along a preset direction, each photosensitive chip is used for converting light sensed by itself into an electrical signal, and in the case of the image sensor being a contact image sensor CIS, each photosensitive chip is used for sensing light reflected by an original document and converting light sensed by itself reflected by the original document into an electrical signal. The printed circuit board set 20 includes a plurality of printed circuit boards sequentially connected along a predetermined direction, each printed circuit board is connected to at least one photosensitive chip, and each printed circuit board is configured to receive an electrical signal converted by the corresponding connected photosensitive chip. The interface module 30 is used to perform communication between the image sensor and an external device. The driving circuit 40 is disposed between the photosensitive chipset 10 and the interface module 30, and is used for driving the electrical signal transmitted between the image sensor and the external device to improve the driving capability of the electrical signal, for example, driving the electrical signal may refer to amplifying the voltage of the electrical signal to make the electrical signal higher than a threshold of a high level or lower than a threshold of a low level, and so on. Because the image sensor provided by the embodiment of the invention adopts the spliced circuit board and the spliced photosensitive chip, the transmission distance of the electric signal is far, the distortion of the electric signal can be possibly generated, the electric signal is driven by the driving circuit, the driving capability of the electric signal can be improved, and in particular, the input signal and the output signal can be respectively driven by the corresponding driving circuits.
As an alternative embodiment, as shown in fig. 4, the photosensitive chip set includes a plurality of photosensitive chips 3, and the plurality of photosensitive chips 3 are sequentially connected and arranged on the circuit board 4a along a straight line, it should be noted that the circuit board 4a is a circuit board that is not wired, and is only used as a supporting portion of the plurality of photosensitive chips 3, preferably, the circuit board 4a is one, so as to prevent a gap from being generated when the plurality of circuit boards are spliced, and influence the scanning accuracy. The printed circuit board assembly includes a plurality of printed circuit boards 4b, each printed circuit board 4b is connected with at least one photosensitive chip 3 through at least one metal wire, each printed circuit board 4b is used for receiving the electric signal converted by the corresponding connected photosensitive chip 3, the plurality of printed circuit boards 4b are connected through at least one metal strip 8, it should be noted that the printed circuit boards 4b are wiring circuit boards printed with circuits, the plurality of printed circuit boards 4b are sequentially connected along the direction parallel to the connection direction of the plurality of photosensitive chips 3, and the base station 6 is used for carrying the circuit boards 4a and the plurality of printed circuit boards 4b. Fig. 5 is a right side view of the alternative embodiment shown in fig. 4, each photo-sensing chip 3 being connected to one printed circuit board 4b by a metal wire 7. Fig. 6 is a bottom view of the alternative embodiment shown in fig. 4, the interface module comprising a plurality of interfaces 9, one interface 9 being provided on each printed circuit board 4b, each interface 9 being capable of being connected to an external device through one of a plurality of through holes provided in the bottom of the base station 6.
As an alternative embodiment, the image sensor may further include a first set of buses, where the first set of buses includes a plurality of buses, as shown in fig. 7, respectively connected to the plurality of printed circuit boards 4b in a one-to-one correspondence, and each printed circuit board 4b is connected to only one bus, and each bus is used to transmit an electrical signal of the corresponding connected printed circuit board. And each bus of the first group of buses is also connected with the interface module, and the electric signals of the printed circuit board transmitted on each bus can be sent to external equipment connected with the interface module through the interface module. It should be noted that, the driving circuit includes a plurality of output driving circuits, the plurality of output driving circuits are connected with the plurality of printed circuit boards in a one-to-one correspondence manner, each output driving circuit is configured to drive and transmit an electrical signal output by the corresponding connected printed circuit board onto a corresponding bus, as shown in fig. 7, an output signal (A, B, C … …) of each printed circuit board is driven by the corresponding connected output driving circuit, and each output driving circuit outputs the electrical signal after driving onto the bus corresponding to the printed circuit board.
Further, each printed circuit board may further include a multiplexing switch circuit, and since each printed circuit board may be connected to a plurality of photosensitive chips and each printed circuit board outputs only one electrical signal, the multiplexing switch circuit of each printed circuit board is required to gate the electrical signal currently output among the plurality of photosensitive chips, specifically, the multiplexing switch circuit includes a plurality of input terminals and one output terminal, the plurality of input terminals of the multiplexing switch circuit are connected in one-to-one correspondence with the plurality of electrical signals converted by the at least one photosensitive chip connected to the corresponding printed circuit board, the output terminal of the multiplexing switch circuit is used as the output terminal of the corresponding printed circuit board, and the multiplexing switch circuit is used to sequentially output the plurality of electrical signals converted by the at least one photosensitive chip connected to the corresponding printed circuit board.
The first group of buses may be integrated in each printed circuit board, specifically, each printed circuit board is provided with a group of first group buses, each bus in the first group of buses may be printed on each printed circuit board, the first group of buses of two adjacent printed circuit boards are connected through a plurality of communication connection lines, the plurality of communication connection lines are in one-to-one correspondence with the plurality of buses of the first group of buses, that is, each communication connection line is connected with the corresponding buses on two adjacent printed circuit boards, for example, as shown in fig. 4, the plurality of communication connection lines are integrated in at least one metal strip 8, and each metal strip 8 is bridged above two adjacent printed circuit boards 4b to be connected.
As an alternative embodiment, the image sensor may further comprise a second set of buses, where the second set of buses includes a plurality of buses, and the plurality of buses of the second set of buses are connected to the interface module, for transmitting an electrical signal sent by the external device, as shown in fig. 7. Further, the driving circuit includes a plurality of input driving circuits, the plurality of input driving circuits are connected to the plurality of buses of the second set of buses in one-to-one correspondence, and each input driving circuit is used for driving the electric signals transmitted on the buses connected correspondingly. That is, each input driving circuit drives a corresponding electrical signal input from the external device and outputs the electrical signal to a corresponding bus on the second group of buses; or each input driving circuit inputs a signal of one bus of the second group of buses to a corresponding printed circuit board after being driven, in which case the second group of buses may be connected in one-to-one correspondence with the plurality of printed circuit boards.
The second group of buses can be integrated in each printed circuit board, specifically, each printed circuit board is provided with a group of second group buses, the second group buses of two adjacent printed circuit boards are connected through a plurality of communication connecting wires, and the plurality of communication connecting wires correspond to the plurality of buses of the second group buses one by one. Further, as shown in fig. 4, a plurality of communication connection lines on two adjacent printed circuit boards are integrated in at least one metal strip 8, and each metal strip 8 is bridged over two adjacent printed circuit boards 4b to be connected.
Note that, in the embodiment of the image sensor shown in fig. 4 to 6, all the driving circuits may be provided in the base 6.
Example 2
An image sensor is shown in fig. 8, and includes a light source 1, a lens 2, a photosensitive chip 3, a printed circuit board 4b, a frame 5, a base 6, a wire 7, and an interface module 9. After being reflected by the manuscript, the light emitted by the light source 1 is converged on the photosensitive chip 3 by the lens 2 for photoelectric conversion, and the electric signal converted by the photosensitive chip 3 passes through the metal wire 7 and is transmitted outwards through the interface 9 on the printed circuit board 4 b. The base 6 is used for mounting the printed circuit board 4b, and the frame 5 is used for mounting the light source 1 and the lens 2.
As shown in fig. 4 in a plan view, fig. 5 in a right side view, and fig. 6 in a bottom view, the base 6 is provided with a plurality of printed circuit boards 4b and a single wiring-free circuit board 4a, and the plurality of photosensitive chips 3 are mounted on the wiring-free circuit board 4 a. Two adjacent printed circuit boards 4b are cascaded by a metal strip 8.
Each printed circuit board 4b is identical and operates on the principle shown in fig. 7, 9, 10 and 11.
As shown in fig. 9, after input signals 4b1, 4b2 from a peripheral device (external device) pass through the input drive circuit 4b3, drive signals 4b1', 4b2' are generated, and the drive signals 4b1', 4b2' are input to a sensor (photo chip).
As shown in fig. 10, the photoelectric signal 4b5 output from the sensor is output to the interface after passing through the output driving circuit 4b 6. As shown in fig. 11, before the output signals after passing through the output driving circuit 4b6 are output to the interface, each output signal is connected to the multiplexing switch 4b7 and then transmitted to the bus. Alternatively, the corresponding output signal 4b5 on each printed circuit board 4b may be one or more.
The plurality of printed circuit boards 4b are connected into a whole through the connecting wire 8, so that ultra-wide scanning is realized. Since the signals of each of the printed circuit boards 4b are communicated with each other as shown in fig. 7, the signals of the entire large-sized image sensor can be communicated with the outside through the interface 9 of any one of the printed circuit boards 4b, or can be simultaneously communicated with the peripheral device connection through the interfaces 9 of a plurality of the printed circuit boards 4 b.
The circuit board 4a is used to mount the photosensitive chip 3, and since there is no circuit in the circuit board 4a, the circuit board is not limited by the device, and can be made to have any length. The printed circuit board 4b is internally provided with a circuit, is connected with the photosensitive chip 3 through a metal wire 7, provides various working signals for the photosensitive chip 3 and outputs analog signals, and the working signals are communicated with external equipment through an interface 9.
The photosensitive chips 3 in this embodiment are arranged on one circuit board 4a, and no splice joint exists between any two adjacent photosensitive chips 3, so that scanning accuracy is ensured while large-format scanning is realized. The printed circuit boards 4b are not limited to the two printed circuit boards 4b being spliced according to the requirement of the scanning length, but may be a plurality of printed circuit boards 4b being spliced, and each printed circuit board 4b has an input driving circuit and an output driving circuit.
Example 3
An image sensor is shown in fig. 12, and includes a light source 1, a lens 2, a photosensitive chip 3, a printed circuit board 4b, a frame 5, a base 6, a wire 7, and an interface module 9. After being reflected by the manuscript, the light emitted by the light source 1 is converged on the photosensitive chip 3 by the lens 2 for photoelectric conversion, and the electric signal converted by the photosensitive chip 3 passes through the metal wire 7 and is transmitted outwards through the interface 9 on the printed circuit board 4 b. The base 6 is used for mounting the printed circuit board 4b, and the frame 5 is used for mounting the light source 1 and the lens 2.
As shown in fig. 13 in a plan view, fig. 14 in a right side view, and fig. 6 in a bottom view, the base 6 is provided with a plurality of printed circuit boards 4b bonded together, and a plurality of photosensitive chips 3 are bonded to the base 6. Two adjacent printed circuit boards 4b are cascaded by a metal strip 8.
Each printed circuit board 4b is identical and operates on the principle shown in fig. 7, 9, 10 and 11.
As shown in fig. 9, after input signals 4b1, 4b2 from a peripheral device (external device) pass through the input drive circuit 4b3, drive signals 4b1', 4b2' are generated, and the drive signals 4b1', 4b2' are input to a sensor (photo chip).
As shown in fig. 10, the photoelectric signal 4b5 output from the sensor is output to the interface after passing through the output driving circuit 4b 6. As shown in fig. 11, before the output signals after passing through the output driving circuit 4b6 are output to the interface, each output signal is connected to the multiplexing switch 4b7 and then transmitted to the bus. Alternatively, the corresponding output signal 4b5 on each printed circuit board 4b may be one or more.
The plurality of printed circuit boards 4b are connected into a whole through the connecting wire 8, so that ultra-wide scanning is realized. Since the signals of each of the printed circuit boards 4b are communicated with each other as shown in fig. 7, the signals of the entire large-sized image sensor can be communicated with the outside through the interface 9 of any one of the printed circuit boards 4b, or can be simultaneously communicated with the peripheral device connection through the interfaces 9 of a plurality of the printed circuit boards 4 b.
The circuit board 4a is used to mount the photosensitive chip 3, and since there is no circuit in the circuit board 4a, the circuit board is not limited by the device, and can be made to have any length. The printed circuit board 4b is internally provided with a circuit, is connected with the photosensitive chip 3 through a metal wire 7, provides various working signals for the photosensitive chip 3 and outputs analog signals, and the working signals are communicated with external equipment through an interface 9.
The photosensitive chips 3 in this embodiment are arranged on one circuit board 4a, and no splice joint exists between any two adjacent photosensitive chips 3, so that scanning accuracy is ensured while large-format scanning is realized. The printed circuit boards 4b are not limited to the two printed circuit boards 4b being spliced according to the requirement of the scanning length, but may be a plurality of printed circuit boards 4b being spliced, and each printed circuit board 4b has an input driving circuit and an output driving circuit.
Example 4
An image sensor is shown in fig. 15, and includes a light source 1, a lens 2, a photosensitive chip 3, a printed circuit board 4b, a frame 5, a wire 7, and an interface module 9. After being reflected by the manuscript, the light emitted by the light source 1 is converged on the photosensitive chip 3 by the lens 2 for photoelectric conversion, and the electric signal converted by the photosensitive chip 3 passes through the metal wire 7 and is transmitted outwards through the interface 9 on the printed circuit board 4 b. The frame 5 is used for mounting the light source 1 and the lens 2.
The image sensor of this embodiment further includes a base, a top view of which is shown in fig. 16, a right side view is shown in fig. 17, and a bottom view is shown in fig. 6. As shown in fig. 15 and 17, the base 6 is L-shaped in cross section, the base 6 is used for mounting the printed circuit boards 4b, a plurality of printed circuit boards 4b are mounted and spliced on the base 6, and a plurality of photosensitive chips 3 are spliced on the base 6. As shown in fig. 16, two adjacent printed circuit boards 4b are cascaded by a metal bar 8.
Each printed circuit board 4b is identical and operates on the principle shown in fig. 7, 9, 10 and 11.
As shown in fig. 9, after input signals 4b1, 4b2 from a peripheral device (external device) pass through the input drive circuit 4b3, drive signals 4b1', 4b2' are generated, and the drive signals 4b1', 4b2' are input to a sensor (photo chip).
As shown in fig. 10, the photoelectric signal 4b5 output from the sensor is output to the interface after passing through the output driving circuit 4b 6. As shown in fig. 11, before the output signals after passing through the output driving circuit 4b6 are output to the interface, each output signal is connected to the multiplexing switch 4b7 and then transmitted to the bus. Alternatively, the corresponding output signal 4b5 on each printed circuit board 4b may be one or more.
The plurality of printed circuit boards 4b are connected into a whole through the connecting wire 8, so that ultra-wide scanning is realized. Since the signals of each of the printed circuit boards 4b are communicated with each other as shown in fig. 7, the signals of the entire large-sized image sensor can be communicated with the outside through the interface 9 of any one of the printed circuit boards 4b, or can be simultaneously communicated with the peripheral device connection through the interfaces 9 of a plurality of the printed circuit boards 4 b.
The circuit board 4a is used to mount the photosensitive chip 3, and since there is no circuit in the circuit board 4a, the circuit board is not limited by the device, and can be made to have any length. The printed circuit board 4b is internally provided with a circuit, is connected with the photosensitive chip 3 through a metal wire 7, provides various working signals for the photosensitive chip 3 and outputs analog signals, and the working signals are communicated with external equipment through an interface 9.
The photosensitive chips 3 in this embodiment are arranged on one circuit board 4a, and no splice joint exists between any two adjacent photosensitive chips 3, so that scanning accuracy is ensured while large-format scanning is realized. The printed circuit boards 4b are not limited to the two printed circuit boards 4b being spliced according to the requirement of the scanning length, but may be a plurality of printed circuit boards 4b being spliced, and each printed circuit board 4b has an input driving circuit and an output driving circuit.
The order of the embodiments of the application described above does not represent a benefit or disadvantage of the embodiments.
In the foregoing embodiments of the present application, the descriptions of the embodiments are emphasized, and for a portion of this disclosure that is not described in detail in this embodiment, reference is made to the related descriptions of other embodiments. In the several embodiments provided in the present application, it should be understood that the disclosed technology may be implemented in other manners.
The foregoing is merely a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application, which are intended to be comprehended within the scope of the present application.
Claims (4)
1. An image sensor, comprising:
The photosensitive chip set comprises a plurality of photosensitive chips which are sequentially connected along a preset direction, and each photosensitive chip is used for converting light sensed by the photosensitive chip set into an electric signal;
The printed circuit board group comprises a plurality of printed circuit boards which are sequentially connected along the preset direction, each printed circuit board is connected with at least one photosensitive chip, and each printed circuit board is used for receiving the electric signals converted by the corresponding connected photosensitive chips;
An interface module for performing communication between the image sensor and an external device;
The drive circuit, set up in between the sensitization chipset with interface module is used for driving the image sensor with the electrical signal of transmission between the external equipment, wherein, to the image sensor with the electrical signal of transmission between the external equipment drives, include: amplifying the voltage of an electrical signal so that the voltage of the electrical signal is higher than a threshold of a high level, the electrical signal being input by the external device; the driving circuit comprises a plurality of output driving circuits, the plurality of output driving circuits are connected with the plurality of printed circuit boards in a one-to-one correspondence manner, and each output driving circuit is used for driving the electric signals of the corresponding connected printed circuit boards;
The image sensor further includes: the first group of buses comprises a plurality of buses, the buses of the first group of buses are connected with the printed circuit boards in a one-to-one correspondence manner and are connected with the interface module, and each bus of the first group of buses is used for transmitting electric signals of the corresponding connected printed circuit boards; each printed circuit board is provided with a group of first buses, the first buses of two adjacent printed circuit boards are connected through a plurality of communication connecting wires, and the communication connecting wires are in one-to-one correspondence with the buses of the first buses; the communication connecting wires on two adjacent printed circuit boards are integrated in at least one metal strip, and the at least one metal strip is bridged above the two corresponding printed circuit boards;
The image sensor further includes: the second group of buses comprises a plurality of buses, a plurality of buses of the second group of buses are connected with a plurality of printed circuit boards in one-to-one correspondence, and are connected with the interface module, and each bus of the second group of buses is used for transmitting one of electric signals sent by the external equipment; the driving circuit comprises a plurality of input driving circuits, the input driving circuits are connected with the buses of the second group of buses in one-to-one correspondence, and each input driving circuit is used for driving the electric signals transmitted on the buses which are correspondingly connected; and each printed circuit board is provided with a group of second buses, two adjacent printed circuit boards are connected through a plurality of communication connecting wires, and the communication connecting wires are in one-to-one correspondence with the buses of the second buses.
2. The image sensor of claim 1, wherein each of the printed circuit boards comprises:
The multi-path selection switch circuit comprises a plurality of input ends and an output end, wherein the plurality of input ends of the multi-path selection switch circuit are connected with a plurality of electric signals converted by at least one photosensitive chip connected with a corresponding printed circuit board in a one-to-one correspondence manner, the output end of the multi-path selection switch circuit is used as the output end of the corresponding printed circuit board, and the multi-path selection switch circuit is used for sequentially outputting the plurality of electric signals converted by at least one photosensitive chip connected with the corresponding printed circuit board.
3. The image sensor according to any one of claims 1 to 2, wherein,
The interface module comprises a plurality of interfaces, the interfaces are in one-to-one correspondence with the printed circuit boards, each interface is arranged on the corresponding printed circuit board, and each interface is connected with all buses included by the image sensor.
4. The image sensor of claim 1, further comprising:
the base station, the printed circuit board group sets up on the base station, drive circuit sets up in the base station.
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| CN201711135554.2A CN108124075B (en) | 2017-11-15 | 2017-11-15 | Image sensor |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179313A (en) * | 2011-12-22 | 2013-06-26 | 佳能元件股份有限公司 | Image sensor unit, image reading apparatus, and image forming apparatus |
| CN106331421A (en) * | 2016-08-22 | 2017-01-11 | 威海华菱光电股份有限公司 | Image sensor and image scanning equipment |
| CN106412372A (en) * | 2016-09-21 | 2017-02-15 | 威海华菱光电股份有限公司 | Image sensor |
| CN207820025U (en) * | 2017-11-15 | 2018-09-04 | 威海华菱光电股份有限公司 | Imaging sensor |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM268676U (en) * | 2004-12-28 | 2005-06-21 | Lite On Semiconductor Corp | Fingerprint scan device and electric equipment with fingerprint scan function |
| CN1885897A (en) * | 2005-06-20 | 2006-12-27 | 亚泰影像科技股份有限公司 | Contact image sensor and its photosensitive substrate |
| US8058602B2 (en) * | 2009-02-25 | 2011-11-15 | Cmos Sensor, Inc. | Long-length industry camera image sensor for flat surface inspection application |
| JP5724823B2 (en) * | 2011-10-25 | 2015-05-27 | 三菱電機株式会社 | Image reading device |
| JP5587392B2 (en) * | 2011-12-22 | 2014-09-10 | キヤノン・コンポーネンツ株式会社 | Image sensor unit, image reading apparatus, and image forming apparatus |
| CN102724376A (en) * | 2012-06-26 | 2012-10-10 | 威海华菱光电股份有限公司 | Contact-type multi-resolution image sensor and control method thereof |
| JP2015005827A (en) * | 2013-06-19 | 2015-01-08 | キヤノン・コンポーネンツ株式会社 | Image sensor unit, image reading apparatus, and image formation apparatus |
| CN103561190B (en) * | 2013-11-05 | 2017-02-08 | 威海华菱光电股份有限公司 | Image reading device and system |
| JP5986140B2 (en) * | 2014-05-16 | 2016-09-06 | キヤノン・コンポーネンツ株式会社 | Circuit board, image sensor unit, image reading apparatus, and image forming apparatus |
| CN106657710B (en) * | 2016-12-05 | 2023-10-10 | 威海华菱光电股份有限公司 | Frame assembly and contact type image sensor with same |
-
2017
- 2017-11-15 CN CN201711135554.2A patent/CN108124075B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179313A (en) * | 2011-12-22 | 2013-06-26 | 佳能元件股份有限公司 | Image sensor unit, image reading apparatus, and image forming apparatus |
| CN106331421A (en) * | 2016-08-22 | 2017-01-11 | 威海华菱光电股份有限公司 | Image sensor and image scanning equipment |
| CN106412372A (en) * | 2016-09-21 | 2017-02-15 | 威海华菱光电股份有限公司 | Image sensor |
| CN207820025U (en) * | 2017-11-15 | 2018-09-04 | 威海华菱光电股份有限公司 | Imaging sensor |
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|---|---|
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