CN108088577A - A kind of packaging structure of temperature sensor - Google Patents
A kind of packaging structure of temperature sensor Download PDFInfo
- Publication number
- CN108088577A CN108088577A CN201711238313.0A CN201711238313A CN108088577A CN 108088577 A CN108088577 A CN 108088577A CN 201711238313 A CN201711238313 A CN 201711238313A CN 108088577 A CN108088577 A CN 108088577A
- Authority
- CN
- China
- Prior art keywords
- temperature
- housing
- packaging structure
- temperature sensor
- seal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
The invention discloses a kind of packaging structure of temperature sensor, include the housing that one end is closed（4）, the housing（4）The other end is connected seal socket（8）, it is characterised in that：It further includes and is encapsulated in housing（4）Temperature-sensitive element that is interior and being placed in blind end（2）, the temperature-sensitive element（2）Surrounding filling heat-conducting medium forms sensor temperature probe（11）, the temperature-sensitive element（2）Pass through excessive conducting wire and seal socket（8）Connection, with sensor temperature probe（11）The closed chamber filling epoxy resin of connection（5）Form the thermal conduction path that excessive conducting wire passes through, the seal socket（8）With the housing（4）The rubber gasket being sealed is provided between other end mounting surface（7）, in this way, by epoxy resin encapsulated and by rubber gasket to seal socket（8）The dual-seal being sealed ensure that high leakproofness, the environment of resistance to high vibration, antijamming capability strong demand.
Description
Technical field
The present invention relates to a kind of packaging structure of temperature sensor more particularly to a kind of scene temperature being suitable in adverse circumstances
Spend the packaging structure of temperature sensor of measurement.
Background technology
Temperature sensor forms temperature-sensitive element and cable packages in enclosure interior.Temperature sensor
(temperature transducer) refers to that the temperature being measured can be experienced and is converted into the sensor of usable output signal.Temperature
Degree sensor is the core of temperature measuring instrument, various in style.It can be divided into contact and contactless two by measurement method
Major class is divided into two class of thermal resistance and thermocouple according to sensor material and electron component characteristic.The prior art is usually in MEMS
（Microelectro Mechanical Systems MEMS）MEMS temperature sensor, film sealing cap are carried on substrate
It is covered on MEMS substrate, the cavity for accommodating MEMS temperature sensor, film sealing cap is formed between film sealing cap and MEMS substrate
Edge and MEMS substrate between by seal bonding material seal, between film sealing cap and MEMS temperature sensor pass through heat pass
Pathway connects.As the use environment of temperature sensor tends to be severe, the particularly use under extreme climate environment, tradition
Temperature sensor only by probe, fluid sealant embedding, because its leakproofness is not high, structural strength is low, in long-term moist, high vibration
Under conditions of intensity and electromagnetic environment are severe, it is easy to the drift of thermistor resistance value, structural damage and other issues occur, and draw
Line measurement does not consider electromagnetic interference, and rear end measurement can be interfered.
The content of the invention
The purpose of the present invention is be directed to the temperature sensor of existing encapsulation technology cannot meet high sealing, high vibration intensity and
Use problem under conditions of electromagnetic environment is severe provides a kind of with high leakproofness, the environment of resistance to high vibration, strong antijamming capability
Packaging structure of temperature sensor.
In order to achieve the above object, the present invention provides a kind of packaging structure of temperature sensor, includes the housing of one end closing,
The housing other end is connected seal socket, it is characterised in that：It further includes and is encapsulated in housing and is placed in the temperature-sensitive of blind end
Element fills heat-conducting medium around the temperature-sensitive element and forms sensor temperature probe, and the temperature-sensitive element passes through excessive
Conducting wire is connected with seal socket, and the closed chamber filling epoxy resin connected with sensor temperature probe forms what excessive conducting wire passed through
Thermal conduction path.
Further, to be provided with the rubber being sealed between the seal socket and the housing other end mounting surface close
Seal washer.
Further, the excessive conducting wire is connected by the heat-shrink tube that pyrocondensation fastens with socket corresponding interface.
Further, the seal socket is spirally connected with shielded plug one end, and the shielded plug other end is tightly connected
Shield tail attachment.
Further, the shell one end is closed by end cap seal.
Further, the heat-conducting medium is reinforced silicones heat-conducting cream.
Further, the housing outer surface is made the external thread section for being easily installed connection and is made tight convenient for spiral
Solid six aspect.
Further, insulated paint is uniformly coated on the inside of the tube wall of the sensor temperature probe part of housing, and carries out room temperature
Cure.
Further, rubber gasket is made of FM-2D fluoroether rubbers.
The present invention has the advantages that compared with the prior art.
With high leakproofness, the environment of resistance to high vibration, strong antijamming capability.A kind of temperature sensor encapsulation knot of the present invention
Structure by epoxy resin encapsulated and the dual-seal being sealed by rubber gasket to seal socket, ensure that highly dense
The requirement of envelope property；Scene temperature directly being digitally transmitted with " one-wire bus " substantially increases the anti-interference of system.It is double-deck
Sealing technology has that good insulated enclosure and resistance to mechanical collision, warping resistance ability, reliability are high, with high leakproofness, resistance to
High vibration environment, strong antijamming capability.
Housing inside and outside wall can be avoided to aoxidize and damage.Excessive conducting wire and socket corresponding interface in temperature-sensitive element of the present invention
Connection, junction carries out pyrocondensation fastening with heat-shrink tube, can reduce the stress damage of tie point under vibration, case material
Using the good austenitic stainless steel of comprehensive performance, end cap and housing melting welding, can by carrying out 14Mpa oil pressure leak checks
Housing inside and outside wall is avoided to aoxidize and damage.
A kind of packaging structure of temperature sensor of the present invention, supports " one-wire bus " interface (1-Wire), measures temperature range
For -55 °C ~+125 °C, in the range of -10 ~+85 °C, precision is ± 0.5 °C.Particularly suitable for high sealing, high vibration intensity and electricity
It is used under conditions of magnetic environment is severe.
Description of the drawings
Fig. 1 is a kind of schematic cross-sectional view of packaging structure of temperature sensor of the present invention.
In figure：1 end cap, 2 temperature-sensitive elements, 3 reinforced silicones heat-conducting creams, 4 housings, 5 epoxy resin, 6 heat-shrink tubes, 7 rubbers
Glue seal washer, 8 seal sockets, 9 shielded plugs, 10 shielding tail attachmentes, 11 sensor temperature probes, 12 external thread sections, 13 6
Aspect.
Specific embodiment
To further illustrate the present invention the principle of patent and structure, the embodiment of the present invention is carried out in conjunction with attached drawing detailed
Explanation.
As shown in Figure 1, a kind of packaging structure of temperature sensor of the present invention, includes the housing 4 that one end is closed, the shell
4 other end of body is connected seal socket 8, it is characterised in that：It further includes and is encapsulated in housing 4 and is placed in the temperature-sensitive element 2 of blind end,
2 surrounding of the temperature-sensitive element filling heat-conducting medium forms sensor temperature probe 11, and the temperature-sensitive element 2 is by excessively leading
Line is connected with seal socket 8, and the closed chamber filling epoxy resin 5 connected with sensor temperature probe 11 forms excessive conducting wire and passes through
Thermal conduction path.
Further, it is provided with the rubber being sealed between the seal socket 8 and 4 other end mounting surface of housing
Seal washer 7.
Further, the excessive conducting wire is connected by the heat-shrink tube that pyrocondensation fastens with 8 corresponding interface of socket.
Further, the seal socket 8 is spirally connected with 9 one end of shielded plug, and 9 other end of shielded plug sealing connects
Connect shielding tail attachment 10.
Further, described 4 one end of housing is sealed by end cap 1 and closed, and end cap 1 is connected with 4 melting welding of housing, passes through progress
14Mpa oil pressure leak checks.
Further, the heat-conducting medium is reinforced silicones heat-conducting cream 3.
Further, 4 outer surface of housing is made the external thread section 12 for being easily installed connection and is made convenient for spiral
Six aspects 13 of fastening, the material of the housing 4 use the good austenitic stainless steel of comprehensive performance.
Further, insulated paint is uniformly coated on the inside of the tube wall of 11 part of sensor temperature probe of housing 4, and is carried out normal
Temperature cures.
Further, rubber gasket 7 is made of FM-2D fluoroether rubbers.
Claims (9)
1. a kind of packaging structure of temperature sensor includes the housing of one end closing（4）, the housing（4）The other end is connected close
Seal socket（8）, it is characterised in that：It further includes and is encapsulated in housing（4）Temperature-sensitive element that is interior and being placed in blind end（2）, the heat
Quick element（2）Surrounding filling heat-conducting medium forms sensor temperature probe（11）, the temperature-sensitive element（2）Pass through excessive conducting wire
With seal socket（8）Connection, with sensor temperature probe（11）The closed chamber filling epoxy resin of connection（5）Form excessive conducting wire
The thermal conduction path passed through.
2. a kind of packaging structure of temperature sensor according to claim 1, it is characterised in that：The seal socket（8）
With the housing（4）The rubber gasket being sealed is provided between other end mounting surface（7）.
3. a kind of packaging structure of temperature sensor according to claim 2, it is characterised in that：The excessive conducting wire passes through
The heat-shrink tube and socket of pyrocondensation fastening（8）Corresponding interface connects.
4. a kind of packaging structure of temperature sensor according to claim 3, it is characterised in that：The seal socket（8）
With shielded plug（9）One end is spirally connected, the shielded plug（9）The other end is tightly connected shielding tail attachment（10）.
5. according to any a kind of packaging structure of temperature sensor in claim 1,2,3 or 4, it is characterised in that：Described
Housing（4）One end passes through end cap（1）Sealing closing.
6. a kind of packaging structure of temperature sensor according to claim 5, it is characterised in that：The heat-conducting medium is
Reinforced silicones heat-conducting cream（3）.
7. a kind of packaging structure of temperature sensor according to claim 6, it is characterised in that：The housing（4）Appearance
Make the external thread section for being easily installed connection in face（12）And make convenient for screw-tightened six aspect（13）.
8. a kind of packaging structure of temperature sensor according to claim 7, it is characterised in that：In the housing（4）'s
Sensor temperature probe（11）Uniformly coating insulated paint, and carry out normal temperature cure on the inside of partial tube wall.
9. according to any a kind of packaging structure of temperature sensor in claim 2,3 or 4, it is characterised in that：The rubber
Glue seal washer（7）It is made of FM-2D fluoroether rubbers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711238313.0A CN108088577A (en) | 2017-11-30 | 2017-11-30 | A kind of packaging structure of temperature sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711238313.0A CN108088577A (en) | 2017-11-30 | 2017-11-30 | A kind of packaging structure of temperature sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108088577A true CN108088577A (en) | 2018-05-29 |
Family
ID=62173457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711238313.0A Pending CN108088577A (en) | 2017-11-30 | 2017-11-30 | A kind of packaging structure of temperature sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108088577A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110017910A (en) * | 2019-04-28 | 2019-07-16 | 上海岗崎控制仪表有限公司 | A kind of multi-shell curing entity temperature sensor |
| CN113566992A (en) * | 2021-09-02 | 2021-10-29 | 西安技达工业设备有限公司 | Intermediate frequency furnace water temperature detects encapsulation temperature measurement subassembly |
| CN114364949A (en) * | 2020-06-17 | 2022-04-15 | Tdk电子股份有限公司 | Sensor with housing and silicone filler |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2039838U (en) * | 1988-12-03 | 1989-06-21 | 航天工业部一院七○四所 | Platinum thermal resistance temp. sensor |
| EP1037028A1 (en) * | 1999-03-09 | 2000-09-20 | Mannesmann VDO Aktiengesellschaft | Sensor for combined measurement of temperature and level |
| CN201011501Y (en) * | 2007-01-04 | 2008-01-23 | 曲阜天博汽车零部件制造有限公司 | Combined water temperature sensor for internal combustion engine |
| CN201464063U (en) * | 2009-05-14 | 2010-05-12 | 上海海华传感器有限公司 | Temperature sensor plug for automobile engine |
| CN102680127A (en) * | 2012-06-04 | 2012-09-19 | 句容市博远电子有限公司 | Negative temperature coefficient (NTC) temperature sensor |
| CN202547820U (en) * | 2012-03-02 | 2012-11-21 | 恒新基电子（青岛）有限公司 | Screw type temperature sensor |
| CN202720070U (en) * | 2012-07-27 | 2013-02-06 | 肇庆爱晟电子科技有限公司 | High-stability and rapid NTC temperature sensor |
-
2017
- 2017-11-30 CN CN201711238313.0A patent/CN108088577A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2039838U (en) * | 1988-12-03 | 1989-06-21 | 航天工业部一院七○四所 | Platinum thermal resistance temp. sensor |
| EP1037028A1 (en) * | 1999-03-09 | 2000-09-20 | Mannesmann VDO Aktiengesellschaft | Sensor for combined measurement of temperature and level |
| CN201011501Y (en) * | 2007-01-04 | 2008-01-23 | 曲阜天博汽车零部件制造有限公司 | Combined water temperature sensor for internal combustion engine |
| CN201464063U (en) * | 2009-05-14 | 2010-05-12 | 上海海华传感器有限公司 | Temperature sensor plug for automobile engine |
| CN202547820U (en) * | 2012-03-02 | 2012-11-21 | 恒新基电子（青岛）有限公司 | Screw type temperature sensor |
| CN102680127A (en) * | 2012-06-04 | 2012-09-19 | 句容市博远电子有限公司 | Negative temperature coefficient (NTC) temperature sensor |
| CN202720070U (en) * | 2012-07-27 | 2013-02-06 | 肇庆爱晟电子科技有限公司 | High-stability and rapid NTC temperature sensor |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110017910A (en) * | 2019-04-28 | 2019-07-16 | 上海岗崎控制仪表有限公司 | A kind of multi-shell curing entity temperature sensor |
| CN110017910B (en) * | 2019-04-28 | 2024-05-10 | 上海岗崎控制仪表有限公司 | Layered curing entity temperature sensor |
| CN114364949A (en) * | 2020-06-17 | 2022-04-15 | Tdk电子股份有限公司 | Sensor with housing and silicone filler |
| US12123746B2 (en) | 2020-06-17 | 2024-10-22 | Tdk Electronics Ag | Sensor with housing and silicone resin filler |
| CN113566992A (en) * | 2021-09-02 | 2021-10-29 | 西安技达工业设备有限公司 | Intermediate frequency furnace water temperature detects encapsulation temperature measurement subassembly |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180529 |