CN108081158A - Emery wheel and preparation method thereof - Google Patents
Emery wheel and preparation method thereof Download PDFInfo
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- CN108081158A CN108081158A CN201711348401.6A CN201711348401A CN108081158A CN 108081158 A CN108081158 A CN 108081158A CN 201711348401 A CN201711348401 A CN 201711348401A CN 108081158 A CN108081158 A CN 108081158A
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- 229910001651 emery Inorganic materials 0.000 title claims 12
- 238000002360 preparation method Methods 0.000 title abstract description 7
- 238000000227 grinding Methods 0.000 claims abstract description 266
- 239000006061 abrasive grain Substances 0.000 claims abstract description 49
- 239000000843 powder Substances 0.000 claims description 40
- 238000000034 method Methods 0.000 claims description 26
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 12
- 239000000945 filler Substances 0.000 claims description 11
- 238000000110 selective laser sintering Methods 0.000 claims description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052582 BN Inorganic materials 0.000 claims description 6
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 6
- 229910003460 diamond Inorganic materials 0.000 claims description 6
- 239000010432 diamond Substances 0.000 claims description 6
- 239000000428 dust Substances 0.000 claims description 6
- 229910052742 iron Inorganic materials 0.000 claims description 6
- 239000011159 matrix material Substances 0.000 claims description 6
- 239000001301 oxygen Substances 0.000 claims description 6
- 229910052760 oxygen Inorganic materials 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052684 Cerium Inorganic materials 0.000 claims description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 4
- 229910052779 Neodymium Inorganic materials 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 4
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 claims description 4
- 229910017052 cobalt Inorganic materials 0.000 claims description 4
- 239000010941 cobalt Substances 0.000 claims description 4
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 4
- 229910002804 graphite Inorganic materials 0.000 claims description 4
- 239000010439 graphite Substances 0.000 claims description 4
- 229910052746 lanthanum Inorganic materials 0.000 claims description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 claims description 4
- 229910052750 molybdenum Inorganic materials 0.000 claims description 4
- 239000011733 molybdenum Substances 0.000 claims description 4
- QEFYFXOXNSNQGX-UHFFFAOYSA-N neodymium atom Chemical compound [Nd] QEFYFXOXNSNQGX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 4
- 229910000851 Alloy steel Inorganic materials 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 3
- 238000000498 ball milling Methods 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000002245 particle Substances 0.000 claims 4
- 239000004411 aluminium Substances 0.000 claims 2
- 238000002156 mixing Methods 0.000 claims 2
- 238000001816 cooling Methods 0.000 abstract description 35
- 238000005520 cutting process Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 239000000203 mixture Substances 0.000 description 10
- 238000000746 purification Methods 0.000 description 10
- 238000000149 argon plasma sintering Methods 0.000 description 9
- 239000007789 gas Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 238000003892 spreading Methods 0.000 description 5
- 230000007480 spreading Effects 0.000 description 5
- 238000011084 recovery Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 238000007731 hot pressing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
- B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
- B24D3/04—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic
- B24D3/06—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially inorganic metallic or mixture of metals with ceramic materials, e.g. hard metals, "cermets", cements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
- B24D18/009—Tools not otherwise provided for
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Polishing Bodies And Polishing Tools (AREA)
Abstract
本发明涉及砂轮及其制备方法。该砂轮包括磨削主体和基体，其中，所述磨削主体布置在所述基体外表面，所述磨削主体由紧密排列的相同拓扑结构单元构成。该砂轮不仅提高了参与切削磨粒的比例，进而提高了砂轮的磨削效率，降低了磨削力，而且明显提高了砂轮的孔隙率，改善了砂轮的容屑与冷却能力，可以有效防止磨削工件烧伤。
The invention relates to a grinding wheel and a preparation method thereof. The grinding wheel includes a grinding body and a base body, wherein the grinding body is arranged on the outer surface of the base body, and the grinding body is composed of closely arranged identical topological structure units. The grinding wheel not only increases the proportion of abrasive grains involved in cutting, thereby improving the grinding efficiency of the grinding wheel and reducing the grinding force, but also significantly increases the porosity of the grinding wheel, improves the chip holding capacity and cooling capacity of the grinding wheel, and can effectively prevent grinding. Cut workpiece burns.
Description
技术领域technical field
本发明主要涉及磨削加工及增材制造领域，具体地，本发明涉及砂轮及其制备方法，更具体地，本发明涉及金属结合剂砂轮及其制备方法。The present invention mainly relates to the fields of grinding processing and additive manufacturing. Specifically, the present invention relates to a grinding wheel and a preparation method thereof. More specifically, the present invention relates to a metal bond grinding wheel and a preparation method thereof.
背景技术Background technique
传统固结金属结合剂砂轮制造工艺主要是热压成型法。热压法中，首先将金属结合剂与磨粒按照一定比例混合均匀，在自然堆积混料的基础上施加一定的压力与温度，最终成型。这样工艺制造出来的砂轮性能是受混料的成分比例、施加的温度压力、受压时间等相互耦合的、非独立的多个因素共同决定的，而且制造一个性能好的砂轮主要依赖于技术人员的经验，导致同一批砂轮质量一致性差，制造成本高。The traditional manufacturing process of consolidated metal bond grinding wheel is mainly hot pressing forming method. In the hot pressing method, the metal bond and abrasive grains are firstly mixed evenly in a certain proportion, and a certain pressure and temperature are applied on the basis of natural accumulation of the mixture, and finally formed. The performance of the grinding wheel produced by this process is determined by multiple coupled and non-independent factors such as the composition ratio of the mixture, the applied temperature and pressure, and the pressure time, and the manufacture of a grinding wheel with good performance mainly depends on the technical personnel. The experience of the same batch of grinding wheels leads to poor quality consistency and high manufacturing costs.
因此，性能更优的砂轮及其制造方法还需进一步研究。Therefore, the grinding wheel with better performance and its manufacturing method need further research.
发明内容Contents of the invention
本申请是基于发明人对以下事实和问题的发现和认识作出的：This application is based on the inventor's discovery and recognition of the following facts and problems:
砂轮的微观拓扑结构是由气孔、磨粒、结合剂的成分比例与相互接触状态决定的，砂轮的微观拓扑结构直接影响砂轮的磨削性能。然而，传统的热压法制造出来的金属结合剂砂轮的微观拓扑结构是完全不确定的，导致砂轮不仅磨削力大，磨出的工件表面粗糙，精度低，而且砂轮的孔隙率低，容屑与冷却能力弱，容易造成磨削工件烧伤。The micro-topological structure of the grinding wheel is determined by the composition ratio and contact state of pores, abrasive grains, and binders. The micro-topological structure of the grinding wheel directly affects the grinding performance of the grinding wheel. However, the microscopic topological structure of the metal bonded grinding wheel produced by the traditional hot pressing method is completely uncertain, which leads to the grinding force of the grinding wheel, rough surface of the workpiece and low precision, and the porosity of the grinding wheel is low. Chips and cooling capacity are weak, which may easily cause burns to the grinding workpiece.
基于上述问题的发现，发明人通过选择性激光烧结技术将处于松散状态的粉末薄层，通过逐层铺粉、逐层堆积的方式制造具有规则微观拓扑结构的金属结合剂砂轮。发明人惊喜地发现，选择性激光烧结技术制造的金属结合剂砂轮不仅提高了参与切削磨粒的比例，进而提高了砂轮的磨削效率，降低了磨削力，而且明显提高了砂轮的孔隙率，改善了砂轮的容屑与冷却能力，可以有效防止磨削工件烧伤。Based on the discovery of the above problems, the inventors used the selective laser sintering technology to manufacture a metal bond grinding wheel with a regular microscopic topology by spreading the powder layer by layer and stacking the thin layer of powder in a loose state by selective laser sintering technology. The inventors were pleasantly surprised to find that the metal-bonded grinding wheel manufactured by selective laser sintering technology not only increases the proportion of abrasive grains involved in cutting, thereby improving the grinding efficiency of the grinding wheel, reducing the grinding force, but also significantly increasing the porosity of the grinding wheel , improving the chip capacity and cooling capacity of the grinding wheel, which can effectively prevent the grinding workpiece from being burned.
本发明旨在至少在一定程度上解决相关技术中的技术问题之一。The present invention aims to solve one of the technical problems in the related art at least to a certain extent.
在本发明的第一方面，本发明提出了一种砂轮。根据本发明的实施例，所述砂轮包括：磨削主体和基体，所述磨削主体布置在所述基体外表面，所述磨削主体由紧密排列的相同拓扑结构单元构成。根据本发明的实施例，该砂轮不仅提高了参与切削磨粒的比例，进而提高了砂轮的磨削效率，降低了磨削力，而且明显提高了砂轮的孔隙率，改善了砂轮的容屑与冷却能力，可以有效防止磨削工件烧伤。所述砂轮可以达到20％以上的孔隙率，磨削力降低39％以上。In a first aspect of the invention, the invention proposes a grinding wheel. According to an embodiment of the present invention, the grinding wheel includes: a grinding body and a base body, the grinding body is arranged on the outer surface of the base body, and the grinding body is composed of closely arranged identical topology units. According to the embodiment of the present invention, the grinding wheel not only increases the proportion of abrasive grains involved in cutting, further improves the grinding efficiency of the grinding wheel, reduces the grinding force, but also significantly increases the porosity of the grinding wheel, and improves the chip holding capacity of the grinding wheel. The cooling capacity can effectively prevent the grinding workpiece from being burned. The grinding wheel can achieve a porosity of more than 20%, and the grinding force can be reduced by more than 39%.
根据本发明的实施例，上述砂轮还可进一步包括如下附加技术特征之一：According to an embodiment of the present invention, the above-mentioned grinding wheel may further include one of the following additional technical features:
根据本发明的具体实施例，所述拓扑结构单元为边长为0.5～5mm，如为1、2、3或4mm的立方体。所述尺寸范围是根据激光烧结工艺精度与砂轮强度要求来确定的，从而保证砂轮磨削效率高，磨削力小，孔隙率高，容屑与冷却能力强，有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the topological structure unit is a cube with a side length of 0.5-5 mm, such as 1, 2, 3 or 4 mm. The size range is determined according to the precision of the laser sintering process and the strength requirements of the grinding wheel, so as to ensure that the grinding wheel has high grinding efficiency, small grinding force, high porosity, strong chip holding and cooling capabilities, and effectively prevents the grinding workpiece from being burned.
根据本发明的具体实施例，所述立方体为八面体或截角八面体。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the cube is an octahedron or a truncated octahedron. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述立方体的边长为0.5～2.0mm。所述砂轮强度足够，磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the side length of the cube is 0.5-2.0 mm. The grinding wheel has sufficient strength, higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的长度相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the struts of the octahedron are of equal length. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的直径相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the diameters of the struts of the octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱之间的特征夹角相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the characteristic included angles between the pillars of the octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的长度为0.3～3.5mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the length of the octahedral struts is 0.3-3.5 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的直径为0.1～1mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the octahedral pillars have a diameter of 0.1-1 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱之间的特征夹角为60～120度。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the characteristic included angle between the pillars of the octahedron is 60-120 degrees. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的长度相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the lengths of the struts of the truncated octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的直径相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the diameters of the pillars of the truncated octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的长度为0.3～3.5mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the length of the struts of the truncated octahedron is 0.3-3.5 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的直径为0.1～1mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the diameter of the pillars of the truncated octahedron is 0.1-1 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述基体材料为金属材料。According to a specific embodiment of the present invention, the base material is a metal material.
根据本发明的具体实施例，所述基体材料为合金钢或铸铝。According to a specific embodiment of the present invention, the base material is alloy steel or cast aluminum.
在本发明的第二方面，本发明提出了一种制备上述砂轮的方法。根据本发明的实施例，所述方法包括：(1)将磨粒、金属粉末和填充剂进行球磨处理，以便得到混料；(2)将所述混料进行选择性激光烧结处理，以便得到磨削主体；(3)将所述磨削主体与所述砂轮基体进行装配处理，以便得到所述砂轮。根据本发明的实施例，激光烧结工艺制造具有微观拓扑结构的金属结合剂砂轮可以明显提高砂轮的孔隙率，改善砂轮的容屑与冷却能力，防止磨削工件烧伤，规则微观拓扑结构可以提高参与切削磨粒的比例，进而提高砂轮的磨削效率，降低磨削力。根据砂轮运行工况与特殊要求确定相应的微观拓扑结构后，通过该方法可以使制备的砂轮达到20％以上的孔隙率，磨削力降低39％以上。In a second aspect of the invention, the invention proposes a method of preparing the above-mentioned grinding wheel. According to an embodiment of the present invention, the method includes: (1) performing ball milling on abrasive grains, metal powders and fillers to obtain a mixture; (2) performing selective laser sintering on the mixture to obtain Grinding main body; (3) assembling the grinding main body and the grinding wheel base to obtain the grinding wheel. According to the embodiment of the present invention, the laser sintering process can significantly increase the porosity of the grinding wheel, improve the chip holding capacity and cooling capacity of the grinding wheel, and prevent the grinding workpiece from being burned. The ratio of cutting abrasive grains can improve the grinding efficiency of the grinding wheel and reduce the grinding force. After the corresponding microscopic topological structure is determined according to the operating conditions and special requirements of the grinding wheel, the prepared grinding wheel can achieve a porosity of more than 20% and the grinding force can be reduced by more than 39%.
根据本发明的实施例，上述方法还可进一步包括如下附加技术特征之一：According to an embodiment of the present invention, the above method may further include one of the following additional technical features:
根据本发明的实施例，所述方法进一步包括：(4)将所述砂轮进行修整开刃处理。开刃是砂轮制备工艺必须进行的一步。According to an embodiment of the present invention, the method further includes: (4) dressing and sharpening the grinding wheel. Sharpening is a necessary step in the grinding wheel preparation process.
根据本发明的实施例，所述金属粉末选自包括铜、钴、镍、铁、铝、银、钕、铅、镧、铈、钼、硅、铬粉末及以上合金粉末的至少之一。According to an embodiment of the present invention, the metal powder is selected from at least one of copper, cobalt, nickel, iron, aluminum, silver, neodymium, lead, lanthanum, cerium, molybdenum, silicon, chromium powder and the above alloy powders.
根据本发明的实施例，所述填充剂选自包括碳化钨、碳化硅、石墨的至少之一。填充剂在砂轮中起支撑作用，以提高胎体的强度。According to an embodiment of the present invention, the filler is selected from at least one of tungsten carbide, silicon carbide and graphite. The filler acts as a support in the grinding wheel to increase the strength of the carcass.
根据本发明的实施例，所述磨粒为金刚石磨粒。发明人发现，金刚石磨粒硬度大、抗压强度高、耐磨性好，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the abrasive grains are diamond abrasive grains. The inventors found that the diamond abrasive grains have high hardness, high compressive strength and good wear resistance, thereby ensuring high grinding efficiency of the grinding wheel.
根据本发明的实施例，所述磨粒为立方氮化硼磨粒。发明人发现，立方氮化硼磨粒硬度大、耐高温、在高温情况下稳定性好，不与铁发生反应，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the abrasive grains are cubic boron nitride abrasive grains. The inventors found that cubic boron nitride abrasive grains have high hardness, high temperature resistance, good stability under high temperature conditions, and no reaction with iron, thereby ensuring high grinding efficiency of the grinding wheel.
根据本发明的实施例，所述磨粒尺寸为23～200微米。根据使用工况选择所述磨粒尺寸，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the size of the abrasive grains is 23-200 microns. The size of the abrasive grains is selected according to the operating conditions, so as to ensure high grinding efficiency of the grinding wheel.
根据本发明的实施例，所述磨粒浓度为10％～200％，根据使用工况选择所述磨粒浓度，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the concentration of the abrasive grains is 10%-200%, and the concentration of the abrasive grains is selected according to the operating conditions, so as to ensure high grinding efficiency of the grinding wheel.
根据本发明的实施例，所述磨粒包括镀层。磨粒镀层可以提高磨粒与结合剂的粘结强度。According to an embodiment of the present invention, the abrasive grains include a coating. Abrasive grain coating can improve the bonding strength between abrasive grains and bonding agent.
根据本发明的实施例，在步骤(2)中所述选择性激光烧结处理中，激光器的功率为10W～500W，粉层厚度为0.02～0.5mm，线性扫描速度为100mm/s～7000mm/s，工作腔体的氧浓度不大于100ppm，成型气氛在循环净化的条件下的除尘率不小于98％。激光功率、铺粉厚度与扫描速度的设置与粉末特性相关，氧浓度与除尘率是必要条件，以防止氧化，从而保证制备得到的砂轮磨削效率高，磨削力小，孔隙率高，容屑与冷却能力强，有效防止磨削工件烧伤。According to an embodiment of the present invention, in the selective laser sintering process described in step (2), the power of the laser is 10W-500W, the thickness of the powder layer is 0.02-0.5mm, and the linear scanning speed is 100mm/s-7000mm/s , the oxygen concentration of the working cavity is not more than 100ppm, and the dust removal rate of the molding atmosphere is not less than 98% under the condition of circular purification. The settings of laser power, powder coating thickness and scanning speed are related to powder characteristics. Oxygen concentration and dust removal rate are necessary conditions to prevent oxidation, so as to ensure that the prepared grinding wheel has high grinding efficiency, small grinding force, high porosity and capacity. Chips and cooling capacity are strong, which can effectively prevent the grinding workpiece from being burned.
附图说明Description of drawings
图1是根据本发明实施例的砂轮示意图；Fig. 1 is a schematic diagram of a grinding wheel according to an embodiment of the invention;
图2是根据本发明实施例的工艺设备整体结构示意图；2 is a schematic diagram of the overall structure of process equipment according to an embodiment of the present invention;
图3是根据本发明实施例的工艺设备工作腔体示意图；Fig. 3 is a schematic diagram of a working chamber of a process equipment according to an embodiment of the present invention;
图4是根据本发明实施例的拓扑结构单元示意图，Fig. 4 is a schematic diagram of a topology unit according to an embodiment of the present invention,
其中L表示边长；where L is the side length;
图5是根据本发明另一实施例的拓扑结构单元示意图，Fig. 5 is a schematic diagram of a topology unit according to another embodiment of the present invention,
其中L表示边长；where L is the side length;
图6是根据本发明实施例的拓扑结构单元为八面体时的示意图，Fig. 6 is a schematic diagram when the topology unit is an octahedron according to an embodiment of the present invention,
其中，A表示八面体的支柱的长度，D表示八面体的支柱的直径；α表示八面体的支柱之间的特征夹角；以及Wherein, A represents the length of the struts of the octahedron, D represents the diameter of the struts of the octahedron; α represents the characteristic angle between the struts of the octahedron; and
图7是根据本发明实施例的拓扑结构单元为截角八面体时的示意图，Fig. 7 is a schematic diagram when the topology unit is a truncated octahedron according to an embodiment of the present invention,
其中，A表示截角八面体的支柱的长度，D表示截角八面体的支柱的直径。Wherein, A represents the length of the pillar of the truncated octahedron, and D represents the diameter of the pillar of the truncated octahedron.
附图标记：Reference signs:
1：微观拓扑结构砂轮1: Micro topological grinding wheel
11：砂轮基体11: Grinding wheel substrate
12：砂轮磨削主体12: Grinding wheel grinding main body
2：气体净化装置2: Gas purification device
21：气体净化装置主体21: Main body of gas purification device
22：循环管路22: Circulation pipeline
3：微观拓扑结构砂轮制造工艺设备主体3: Micro topological structure grinding wheel manufacturing process equipment main body
301：激光扫描系统301: Laser scanning system
302：工作腔体302: working cavity
303：人机交互界面303: Human-computer interaction interface
304：粉末输送与回收装置304: Powder conveying and recovery device
305：控制系统305: Control system
306：铺粉刮板306: Powder spreading scraper
307：送粉箱307: Powder feeding box
308：振镜系统308: Galvanometer system
309：激光光源309: Laser light source
310：激光器310: laser
311：激光烧结平台311: Laser sintering platform
312：粉末回收箱312: Powder recovery bin
313：成型活塞313: Formed Piston
314：成型基体314: forming matrix
315：送粉活塞315: Powder feeding piston
具体实施方式Detailed ways
下面详细描述本发明的实施例，所述实施例的示例在附图中示出。下面通过参考附图描述的实施例是示例性的，旨在用于解释本发明，而不能理解为对本发明的限制。Embodiments of the invention are described in detail below, examples of which are illustrated in the accompanying drawings. The embodiments described below by referring to the figures are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.
砂轮Grinding wheel
在本发明的第一方面，本发明提出了一种砂轮。根据本发明的实施例，该砂轮包括：磨削主体和基体，所述磨削主体布置在所述基体外表面，所述磨削主体由紧密排列的相同拓扑结构单元构成。根据本发明的实施例，该砂轮不仅提高了参与切削磨粒的比例，进而提高了砂轮的磨削效率，降低了磨削力，而且明显提高了砂轮的孔隙率，改善了砂轮的容屑与冷却能力，可以有效防止磨削工件烧伤。该砂轮可以达到20％以上的孔隙率，磨削力降低39％以上。In a first aspect of the invention, the invention proposes a grinding wheel. According to an embodiment of the present invention, the grinding wheel includes: a grinding body and a base body, the grinding body is arranged on the outer surface of the base body, and the grinding body is composed of closely arranged identical topology units. According to the embodiment of the present invention, the grinding wheel not only increases the proportion of abrasive grains involved in cutting, further improves the grinding efficiency of the grinding wheel, reduces the grinding force, but also significantly increases the porosity of the grinding wheel, and improves the chip holding capacity of the grinding wheel. The cooling capacity can effectively prevent the grinding workpiece from being burned. The grinding wheel can achieve a porosity of more than 20%, and the grinding force can be reduced by more than 39%.
根据本发明的具体实施例，所述拓扑结构单元为边长为0.5～5.0mm，如为1.5mm的立方体。所述尺寸范围是根据激光烧结工艺精度与砂轮强度要求来确定的，从而保证砂轮磨削效率高，磨削力小，孔隙率高，容屑与冷却能力强，有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the topological structure unit is a cube with a side length of 0.5-5.0 mm, such as 1.5 mm. The size range is determined according to the precision of the laser sintering process and the strength requirements of the grinding wheel, so as to ensure that the grinding wheel has high grinding efficiency, small grinding force, high porosity, strong chip holding and cooling capabilities, and effectively prevents the grinding workpiece from being burned.
根据本发明的具体实施例，所述立方体为八面体或截角八面体。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the cube is an octahedron or a truncated octahedron. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述立方体的边长为0.5～2.0mm。所述砂轮强度足够，磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the side length of the cube is 0.5-2.0 mm. The grinding wheel has sufficient strength, higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的长度相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the struts of the octahedron are of equal length. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的直径相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the diameters of the struts of the octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱之间的特征夹角相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the characteristic included angles between the pillars of the octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的长度为0.3～3.5mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the length of the octahedral struts is 0.3-3.5 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱的直径为0.1～1mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the octahedral pillars have a diameter of 0.1-1 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述八面体的支柱之间的特征夹角为60～120度。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the characteristic included angle between the pillars of the octahedron is 60-120 degrees. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的长度相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the lengths of the struts of the truncated octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的直径相等。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the diameters of the pillars of the truncated octahedron are equal. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的长度为0.3～3.5mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the length of the struts of the truncated octahedron is 0.3-3.5 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，所述截角八面体的支柱的直径为0.1～1mm。所述砂轮磨削效率更高，磨削力更小，孔隙率更高，容屑与冷却能力更强，可以进一步有效防止磨削工件烧伤。According to a specific embodiment of the present invention, the diameter of the pillars of the truncated octahedron is 0.1-1 mm. The grinding wheel has higher grinding efficiency, smaller grinding force, higher porosity, stronger chip holding and cooling capacity, and can further effectively prevent burns of grinding workpieces.
根据本发明的具体实施例，该基体材料为金属材料。According to a specific embodiment of the present invention, the base material is a metal material.
根据本发明的具体实施例，该基体材料为合金钢或铸铝。According to a specific embodiment of the present invention, the base material is alloy steel or cast aluminum.
根据本发明的实施例，参考图1，具有微观拓扑结构的金属结合剂砂轮包含选择性激光烧结技术制造的砂轮磨削主体11和机械加工制造的砂轮基体12。根据本发明的实施例的砂轮是通过选择性激光烧结技术制造的砂轮磨削主体与机械加工制造的砂轮基体装配而成的。砂轮磨削主体的外形是一个回转体，总体为圆环状，可以是整体制造也可以分片制造再拼接。砂轮磨削主体均匀分布特定的微观拓扑结构，而且这种结构在空间上具有特定规律。参考图4或图5，拓扑结构单元为立方体，该立方体的边长L为0.5～5.0mm。参考图6，拓扑结构单元为八面体时，A表示八面体的支柱的长度，D表示八面体的支柱的直径，α表示八面体的支柱之间的特征夹角，其中，A取值范围为0.3～3.5mm，D的取值范围为0.1～1mm，α取值范围为60～120度。参考图7，拓扑结构单元为截角八面体时，A表示截角八面体的支柱的长度，D表示截角八面体的支柱的直径，其中，A取值范围为0.3～3.5mm，D的取值范围为0.1～1mm。According to an embodiment of the present invention, referring to FIG. 1 , a metal bonded grinding wheel with a microscopic topology comprises a grinding wheel grinding body 11 manufactured by selective laser sintering technology and a grinding wheel base 12 manufactured by machining. The grinding wheel according to the embodiment of the present invention is assembled by a grinding wheel grinding body manufactured by selective laser sintering technology and a grinding wheel base body manufactured by machining. The shape of the main body of the grinding wheel is a rotating body, which is in the shape of a ring as a whole. It can be manufactured as a whole or in pieces and then spliced. The grinding body of the grinding wheel has a specific micro-topological structure evenly distributed, and this structure has specific rules in space. Referring to FIG. 4 or FIG. 5 , the topology unit is a cube, and the side length L of the cube is 0.5-5.0 mm. Referring to Figure 6, when the topological structure unit is an octahedron, A represents the length of the octahedral pillar, D represents the diameter of the octahedral pillar, and α represents the characteristic angle between the octahedral pillars, wherein the value range of A is 0.3~3.5mm, the value range of D is 0.1~1mm, and the value range of α is 60~120 degrees. Referring to Figure 7, when the topological structure unit is a truncated octahedron, A represents the length of the pillar of the truncated octahedron, and D represents the diameter of the pillar of the truncated octahedron, where the value of A ranges from 0.3 to 3.5mm, and the value of D The value range is 0.1~1mm.
砂轮的制备方法Preparation method of grinding wheel
在本发明的第二方面，本发明提出了一种制备上述砂轮的方法。根据本发明的实施例，该方法包括：(1)将磨粒、金属粉末和填充剂进行球磨处理，以便得到混料；(2)将所述混料进行选择性激光烧结处理，以便得到磨削主体；(3)将所述磨削主体与所述砂轮基体进行装配处理，以便得到所述砂轮。根据本发明的实施例，激光烧结工艺制造具有微观拓扑结构的金属结合剂砂轮可以明显提高砂轮的孔隙率，改善砂轮的容屑与冷却能力，防止磨削工件烧伤，规则微观拓扑结构可以提高参与切削磨粒的比例，进而提高砂轮的磨削效率，降低磨削力。根据砂轮运行工况与特殊要求确定相应的微观拓扑结构后，通过该方法可以使制备的砂轮达到20％以上的孔隙率，磨削力降低39％以上。In a second aspect of the invention, the invention proposes a method of preparing the above-mentioned grinding wheel. According to an embodiment of the present invention, the method includes: (1) ball milling abrasive grains, metal powder and filler to obtain a mixture; (2) performing selective laser sintering on the mixture to obtain a mill (3) assembling the grinding body and the grinding wheel base to obtain the grinding wheel. According to the embodiment of the present invention, the laser sintering process can significantly increase the porosity of the grinding wheel, improve the chip holding capacity and cooling capacity of the grinding wheel, and prevent the grinding workpiece from being burned. The ratio of cutting abrasive grains can improve the grinding efficiency of the grinding wheel and reduce the grinding force. After the corresponding microscopic topological structure is determined according to the operating conditions and special requirements of the grinding wheel, the prepared grinding wheel can achieve a porosity of more than 20% and the grinding force can be reduced by more than 39%.
根据本发明的实施例，该方法进一步包括：(4)将所述砂轮进行修整开刃处理。开刃是砂轮制备工艺必须进行的一步。According to an embodiment of the present invention, the method further includes: (4) performing dressing and sharpening on the grinding wheel. Sharpening is a necessary step in the grinding wheel preparation process.
根据本发明的实施例，该金属粉末选自包括铜、钴、镍、铁、铝、银、钕、铅、镧、铈、钼、硅、铬粉末及以上合金粉末的至少之一。According to an embodiment of the present invention, the metal powder is selected from at least one of copper, cobalt, nickel, iron, aluminum, silver, neodymium, lead, lanthanum, cerium, molybdenum, silicon, chromium powder and the above alloy powder.
根据本发明的实施例，该填充剂选自包括碳化钨、碳化硅、石墨的至少之一。填充剂在砂轮中起支撑作用，以提高胎体的强度。According to an embodiment of the present invention, the filler is selected from at least one of tungsten carbide, silicon carbide and graphite. The filler acts as a support in the grinding wheel to increase the strength of the carcass.
根据本发明的实施例，该磨粒为金刚石磨粒。发明人发现，金刚石磨粒硬度大、抗压强度高、耐磨性好，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the abrasive grains are diamond abrasive grains. The inventors found that the diamond abrasive grains have high hardness, high compressive strength and good wear resistance, thereby ensuring high grinding efficiency of the grinding wheel.
根据本发明的实施例，该磨粒为立方氮化硼磨粒。发明人发现，立方氮化硼磨粒硬度大、耐高温、在高温情况下稳定性好，不与铁发生反应，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the abrasive grains are cubic boron nitride abrasive grains. The inventors found that cubic boron nitride abrasive grains have high hardness, high temperature resistance, good stability under high temperature conditions, and no reaction with iron, thereby ensuring high grinding efficiency of the grinding wheel.
根据本发明的实施例，该磨粒尺寸为23～200微米。根据使用工况选择该磨粒尺寸，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the size of the abrasive grains is 23-200 microns. The size of the abrasive grains is selected according to the operating conditions to ensure high grinding efficiency of the grinding wheel.
根据本发明的实施例，该磨粒浓度为10％～200％，根据使用工况选择该磨粒浓度，从而保证砂轮磨削效率高。According to an embodiment of the present invention, the concentration of abrasive grains is 10%-200%, and the concentration of abrasive grains is selected according to working conditions, so as to ensure high grinding efficiency of the grinding wheel.
根据本发明的实施例，该磨粒包括镀层。磨粒镀层可以提高磨粒与结合剂的粘结强度。According to an embodiment of the invention, the abrasive grains include a coating. Abrasive grain coating can improve the bonding strength between abrasive grains and bonding agent.
根据本发明的实施例，在步骤(2)中所述选择性激光烧结处理中，激光器的功率为10W～500W，粉层厚度为0.02～0.5mm，线性扫描速度为100mm/s～7000mm/s，工作腔体的氧浓度不大于100ppm，成型气氛在循环净化的条件下的除尘率不小于98％。激光功率、铺粉厚度与扫描速度的设置与粉末特性相关，氧浓度与除尘率是必要条件，以防止氧化，从而保证制备得到的砂轮磨削效率高，磨削力小，孔隙率高，容屑与冷却能力强，有效防止磨削工件烧伤。According to an embodiment of the present invention, in the selective laser sintering process described in step (2), the power of the laser is 10W-500W, the thickness of the powder layer is 0.02-0.5mm, and the linear scanning speed is 100mm/s-7000mm/s , the oxygen concentration of the working cavity is not more than 100ppm, and the dust removal rate of the molding atmosphere is not less than 98% under the condition of circular purification. The settings of laser power, powder coating thickness and scanning speed are related to powder characteristics. Oxygen concentration and dust removal rate are necessary conditions to prevent oxidation, so as to ensure that the prepared grinding wheel has high grinding efficiency, small grinding force, high porosity and capacity. Chips and cooling capacity are strong, which can effectively prevent the grinding workpiece from being burned.
参考图2和图3，制造具有微观拓扑结构的金属结合剂砂轮的装置主要由气体净化装置2与制造设备主体3构成，所述气体净化装置主要由气体净化装置主体21与循环管路22构成，所述制造设备主体主要包括激光扫描系统301、工作腔体302、人机交互界面303、粉末输送与回收装置304、控制系统305、铺粉刮板306、送粉箱307、振镜系统308、激光光源309、激光器310、激光烧结平台311、粉末回收箱312、成型活塞313、成型基体314与送粉活塞315。其中，所述铺粉刮板306可以在控制系统305的作用下左右平移运动，所述送粉活塞与所述成型活塞可以在控制系统305作用下上下运动，所述工作腔体302与所述气体净化装置的循环管路22相连。Referring to Fig. 2 and Fig. 3, the device for manufacturing a metal bond grinding wheel with a microscopic topological structure is mainly composed of a gas purification device 2 and a manufacturing equipment main body 3, and the gas purification device is mainly composed of a gas purification device main body 21 and a circulation pipeline 22 , the main body of the manufacturing equipment mainly includes a laser scanning system 301, a working cavity 302, a human-machine interface 303, a powder conveying and recycling device 304, a control system 305, a powder spreading scraper 306, a powder feeding box 307, and a vibrating mirror system 308 , laser light source 309, laser device 310, laser sintering platform 311, powder recovery box 312, forming piston 313, forming matrix 314 and powder feeding piston 315. Wherein, the powder spreading scraper 306 can move left and right under the action of the control system 305, the powder feeding piston and the forming piston can move up and down under the action of the control system 305, the working cavity 302 and the The circulation pipeline 22 of the gas purification device is connected to each other.
具有微观拓扑结构的金属结合剂砂轮的制备方法，包括如下步骤：A method for preparing a metal-bonded grinding wheel with a microscopic topological structure, comprising the steps of:
第一步：在计算机中利用三维建模软件设计砂轮外形轮廓、尺寸与微观拓扑结构尺寸，砂轮整体如图1所示，完成后导出选区激光烧结设备可识别的文件格式；Step 1: Use 3D modeling software to design the profile, size and micro-topological structure size of the grinding wheel in the computer. The overall grinding wheel is shown in Figure 1. After completion, export the file format that can be recognized by the selected laser sintering equipment;
第二步：磨粒、金属粉末、填充剂按照比例称重混合，均匀搅拌为混料；Step 2: Abrasive grains, metal powder, and fillers are weighed and mixed according to the proportion, and evenly stirred to form a mixture;
第三步：将具有微观拓扑结构砂轮三维文件模型导入所述微观拓扑结构金属结合剂砂轮制造工艺设备中，并向所述送粉箱307内添加第二步所述混料，然后通过人机交互界面303设置合适的激光烧结工艺参数；Step 3: Import the three-dimensional file model of the grinding wheel with the microscopic topological structure into the manufacturing process equipment of the metal bond grinding wheel with the microscopic topological structure, and add the mixed material in the second step into the powder feeding box 307, and then pass the man-machine The interactive interface 303 sets appropriate laser sintering process parameters;
第四步：关闭所述工作腔体302隔离门，打开所述气体净化装置2，向工作腔体302循环充入氮气或者氩气；Step 4: Close the isolation door of the working chamber 302, open the gas purification device 2, and fill the working chamber 302 with nitrogen or argon gas;
第五步：启动所述激光光源309；Step 5: Start the laser light source 309;
第六步：在所述控制系统作用305下，所述送粉活塞315上升一段距离，所述铺粉刮板306移动到最右端再移动到最左端，激光经由所述振镜系统308对当前铺粉层选择性烧结，成型活塞313下降一段距离，过程中多余粉料送入粉料回收箱312中；Step 6: Under the action of the control system 305, the powder feeding piston 315 rises for a certain distance, the powder spreading scraper 306 moves to the far right and then to the far left, and the laser beam passes through the galvanometer system 308 to the current The powder layer is selectively sintered, the forming piston 313 is lowered for a certain distance, and the excess powder is sent into the powder recovery box 312 during the process;
第七步：重复步骤六，直至砂轮磨削主体11制备完成；Step 7: Repeat step 6 until the grinding wheel grinding main body 11 is prepared;
第八步：加工所述砂轮基体12，并装配砂轮磨削主体11与砂轮基体12；Step 8: Process the grinding wheel base 12, and assemble the grinding wheel grinding body 11 and the grinding wheel base 12;
第九步：将金属结合剂砂轮修整开刃。Step 9: Trim and sharpen the metal bond grinding wheel.
其中，第二步中所述的混料包含磨粒、金属粉末、填充剂等。磨粒可以选用金刚石磨粒、立方氮化硼磨粒，也可以选用其它磨粒。磨粒可以选用有镀层或没有镀层的，磨粒镀层可以提高磨粒与结合剂的粘结强度。磨粒尺寸在23～200微米之间，磨粒浓度在10％～200％之间。金属粉末可以是青铜、钴、镍、铁、铝等一种或几种粉末，可能还需添加银、钕、铅、镧、铈、钼、硅、铬等元素。填充剂可以是碳化钨、碳化硅、石墨等物质。各类物质比例按需确定。Wherein, the mixture described in the second step includes abrasive grains, metal powder, fillers and the like. The abrasive grains can be diamond abrasive grains, cubic boron nitride abrasive grains, or other abrasive grains. The abrasive grains can be coated or uncoated, and the abrasive grain coating can improve the bonding strength between the abrasive grains and the bonding agent. The abrasive grain size is between 23-200 microns, and the abrasive grain concentration is between 10%-200%. The metal powder can be one or more powders of bronze, cobalt, nickel, iron, aluminum, etc., and elements such as silver, neodymium, lead, lanthanum, cerium, molybdenum, silicon, and chromium may also need to be added. Fillers can be tungsten carbide, silicon carbide, graphite and other substances. The proportions of various substances are determined on demand.
第三步中所述激光烧结参数主要包括设置激光器的功率120W，设置粉层厚度在0.02mm，设置线性扫描速度在800mm/s，线性成型速度为10mm/s～3000mm/s，设置工作腔体的氧浓度小于100ppm，成型气氛在循环净化的条件下，除尘率大于98％。The laser sintering parameters described in the third step mainly include setting the power of the laser to 120W, setting the thickness of the powder layer at 0.02mm, setting the linear scanning speed at 800mm/s, setting the linear forming speed at 10mm/s～3000mm/s, and setting the working cavity The oxygen concentration is less than 100ppm, and the molding atmosphere is under the condition of circulation and purification, and the dust removal rate is greater than 98%.
在本发明的描述中，需要理解的是，术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”“内”、“外”、“顺时针”、“逆时针”、“轴向”、“径向”、“周向”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本发明和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本发明的限制。In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying the referred device or element Must be in a particular orientation, be constructed in a particular orientation, and operate in a particular orientation, and therefore should not be construed as limiting the invention.
此外，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括至少一个该特征。在本发明的描述中，“多个”的含义是至少两个，例如两个，三个等，除非另有明确具体的限定。In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present invention, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.
在本发明中，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”、“固定”等术语应做广义理解，例如，可以是固定连接，也可以是可拆卸连接，或成一体；可以是机械连接，也可以是电连接或彼此可通讯；可以是直接相连，也可以通过中间媒介间接相连，可以是两个元件内部的连通或两个元件的相互作用关系，除非另有明确的限定。对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本发明中的具体含义。In the present invention, unless otherwise clearly specified and limited, terms such as "installation", "connection", "connection" and "fixation" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , or integrated; can be mechanically connected, can also be electrically connected or can communicate with each other; can be directly connected, can also be indirectly connected through an intermediary, can be the internal communication of two components or the interaction relationship between two components, Unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention according to specific situations.
在本发明中，除非另有明确的规定和限定，第一特征在第二特征“上”或“下”可以是第一和第二特征直接接触，或第一和第二特征通过中间媒介间接接触。而且，第一特征在第二特征“之上”、“上方”和“上面”可是第一特征在第二特征正上方或斜上方，或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”可以是第一特征在第二特征正下方或斜下方，或仅仅表示第一特征水平高度小于第二特征。In the present invention, unless otherwise clearly specified and limited, the first feature may be in direct contact with the first feature or the first and second feature may be in direct contact with the second feature through an intermediary. touch. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. "Below", "beneath" and "beneath" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is less horizontally than the second feature.
在本说明书的描述中，参考术语“一个实施例”、“一些实施例”、“示例”、“具体示例”、或“一些示例”等的描述意指结合该实施例或示例描述的具体特征、结构、材料或者特点包含于本发明的至少一个实施例或示例中。在本说明书中，对上述术语的示意性表述不必须针对的是相同的实施例或示例。而且，描述的具体特征、结构、材料或者特点可以在任一个或多个实施例或示例中以合适的方式结合。此外，在不相互矛盾的情况下，本领域的技术人员可以将本说明书中描述的不同实施例或示例以及不同实施例或示例的特征进行结合和组合。In the description of this specification, descriptions referring to the terms "one embodiment", "some embodiments", "example", "specific examples", or "some examples" mean that specific features described in connection with the embodiment or example , structure, material or characteristic is included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the described specific features, structures, materials or characteristics may be combined in any suitable manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine different embodiments or examples and features of different embodiments or examples described in this specification without conflicting with each other.
尽管上面已经示出和描述了本发明的实施例，可以理解的是，上述实施例是示例性的，不能理解为对本发明的限制，本领域的普通技术人员在本发明的范围内可以对上述实施例进行变化、修改、替换和变型。Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and should not be construed as limiting the present invention, those skilled in the art can make the above-mentioned The embodiments are subject to changes, modifications, substitutions and variations.
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| US12064850B2 (en) | 2021-12-30 | 2024-08-20 | Saint-Gobain Abrasives, Inc. | Abrasive articles and methods for forming same |
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