CN108070895A - A kind of metallic cover type composite granule electroplanting device - Google Patents
A kind of metallic cover type composite granule electroplanting device Download PDFInfo
- Publication number
- CN108070895A CN108070895A CN201711362736.3A CN201711362736A CN108070895A CN 108070895 A CN108070895 A CN 108070895A CN 201711362736 A CN201711362736 A CN 201711362736A CN 108070895 A CN108070895 A CN 108070895A
- Authority
- CN
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- Prior art keywords
- electroplating bath
- metallic cover
- composite granule
- inner cavity
- type composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 23
- 239000008187 granular material Substances 0.000 title claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 38
- 238000007747 plating Methods 0.000 claims abstract description 35
- 238000009713 electroplating Methods 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000011229 interlayer Substances 0.000 claims abstract description 5
- 230000001376 precipitating effect Effects 0.000 claims abstract description 4
- 239000000919 ceramic Substances 0.000 claims description 9
- 239000012528 membrane Substances 0.000 claims description 8
- 239000012530 fluid Substances 0.000 claims description 5
- 150000001768 cations Chemical class 0.000 claims description 3
- 150000002500 ions Chemical class 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 11
- 238000000576 coating method Methods 0.000 abstract description 9
- 239000011248 coating agent Substances 0.000 abstract description 8
- 125000002091 cationic group Chemical group 0.000 abstract description 5
- 238000005253 cladding Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- 238000004062 sedimentation Methods 0.000 abstract description 4
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 abstract description 3
- 239000011258 core-shell material Substances 0.000 abstract description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 9
- 239000010949 copper Substances 0.000 description 7
- 239000003984 copper intrauterine device Substances 0.000 description 7
- HHLFWLYXYJOTON-UHFFFAOYSA-N glyoxylic acid Chemical compound OC(=O)C=O HHLFWLYXYJOTON-UHFFFAOYSA-N 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910002804 graphite Inorganic materials 0.000 description 3
- 239000010439 graphite Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000011257 shell material Substances 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000000498 ball milling Methods 0.000 description 2
- 238000000975 co-precipitation Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 239000013527 degreasing agent Substances 0.000 description 2
- 238000001802 infusion Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000003980 solgel method Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000013589 supplement Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- -1 as shown in figure 3 Substances 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 239000003575 carbonaceous material Substances 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 230000007123 defense Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000002242 deionisation method Methods 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 239000003995 emulsifying agent Substances 0.000 description 1
- 239000006052 feed supplement Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011946 reduction process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 239000001488 sodium phosphate Substances 0.000 description 1
- 235000011008 sodium phosphates Nutrition 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- RYFMWSXOAZQYPI-UHFFFAOYSA-K trisodium phosphate Chemical class [Na+].[Na+].[Na+].[O-]P([O-])([O-])=O RYFMWSXOAZQYPI-UHFFFAOYSA-K 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/20—Electroplating using ultrasonics, vibrations
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a kind of metallic cover type composite granule electroplanting devices of core-shell material production equipment technology, it is intended to solve that existing process sedimentation rate is low, and coating is coarse, it is not fine and close, and the technical issues of powder reuniting；Including power supply and it is sequentially connected end to end in turn logical electroplating bath, circulating pump, reservoir, external conductive casing is equipped with outside the electroplating bath, is internally provided with permeable interlayer so as to form inner cavity and exocoel inside electroplating bath, the cathode connecting pin of the power supply be electrically connected with external conductive casing, anode connection terminal stretches into the inner cavity so that during plating external conductive casing as cathode using reducing metal is cationic, inner cavity metal powder is cationic with precipitating metal as anode；The hud typed composite material being well combined can be formed, the present invention has the advantages that sedimentation rate is fast, coating is smooth, fine and close conveniently inexpensively in one layer of metal phase of conductive powder body outer cladding using the present apparatus.
Description
Technical field
The present invention relates to core-shell material production equipment technologies, and in particular to a kind of metallic cover type composite granule plating
Device.
Background technology
Metallic cover type composite granule is a kind of compound powdered metallurgical material of new multiphase, its kind is numerous, performance
Uniqueness has been widely used in the fields such as national defense industry, machine-building, chemical industry chemistry.According to the difference of nucleocapsid, metallic cover
Type composite granule can substantially be divided into three types, metal-carbon material, one ceramics of metal, metal-metal material.
The preparation method of metallic cover type composite granule usually has following several:Ball-milling method, infusion process, sol-gel method,
Coprecipitation, chemical plating and galvanoplastic etc..Ball-milling method method is simple, and the content of metal is easy to control in powder, but more difficult shape
Into the composite granule of cladded type, especially superfines, it is difficult to be uniformly mixed；Although sol-gel method is can be uniformly dispersed, but from
Composite granule obtained is the oxide of metal, it is necessary to reduce at a higher temperature in solution, and this technique is not only cumbersome but also holds
Easily particle is made to grow up in reduction process, it is difficult to prepare tiny powder；Infusion process and coprecipitation can only generally obtain gold
Belong to the relatively low powder of content；Chemical plating and plating application are relatively broad, and the uniformity of metallic cover is more preferable in the powder prepared,
But chemical plating pre-processing technique is complicated, and plating solution is unstable, and plating solution composition is complicated and manufacturing cost is high.It electroplates compared with chemical plating,
With deposition velocity faster, bath stability it is good, it is of low cost, to it is more environment-friendly, powder surface metallic cover rate is high excellent
Point.
But for existing electroplanting device when preparing metallic cover type composite granule, generally existing sedimentation rate is low, and coating is coarse,
It is not fine and close, the problems such as powder reuniting.
The content of the invention
In view of this, it is existing to solve it is an object of the invention to provide a kind of metallic cover type composite granule electroplanting device
Have that equipment sedimentation rate is low, and coating is coarse, it is not fine and close, the technical issues of powder reuniting.
The technical solution adopted in the present invention is：
A kind of metallic cover type composite granule electroplanting device is designed, including power supply and is sequentially connected end to end in turn logical electroplating bath, Xun Huan
Pump, reservoir, be equipped with external conductive casing outside the electroplating bath, be internally provided with permeable interlayer so that formed inside electroplating bath inner cavity and
Exocoel, the cathode connecting pin of the power supply is electrically connected with the external conductive casing, anode connection terminal stretches into the inner cavity so that plating
When external conductive casing it is cationic with precipitating metal as anode as the metal powder of cathode using reducing metal cation, inner cavity.
Preferably, the top of the electroplating bath is in cylindrical type and equipped with leakage fluid dram, lower part in pyramid type and equipped with inlet.
Preferably, two pairs of ultrasonic vibrators are arranged on the external conductive casing.
Preferably, the permeable interlayer is permeable ceramic membrane.
Preferably, the connecting pipe between the electroplating bath and circulating pump is equipped with flowmeter.
Preferably, the material-feeding port communicated with the inner cavity is equipped at the top of the electroplating bath at any time to inner cavity benefit
Fill coated metal powder.
Compared with prior art, the method have the benefit that：
It 1st, can be conveniently inexpensively in electrically conductive powder using the present apparatus（Graphite powder, coke blacking, metal powder）One layer of outer cladding
Metal phase（Copper, nickel, silver）, form the hud typed composite material being well combined.
2nd, the present apparatus is equipped with ultrasonic vibrator on cathode external conductive casing, makes to be adhered to cathode（External conductive casing）The conduction on surface
Powder granule comes back to plating solution, prevents coated metal in the over-deposit on conductive powder body surface, makes plated layer compact, uniformly.
3rd, the present apparatus substitutes anode stub with Powder coatings material, is conducive to supplement cationic in plating solution, especially in electricity
It during plating, when metal powder deficiency in inner cavity, electroplated without interruption, extract anode stub out to be replaced, it is only necessary to inwardly
Coating dusty material is filled into chamber, and due to the barrier of permeable ceramic membrane, coating Powder Recovery is convenient, Bu Huijin
Enter reservoir.
Description of the drawings
Fig. 1 is the structural diagram of the present invention；
Fig. 2 is electroplating tank structure schematic diagram；
Fig. 3 is plating flow diagram；
1 is electroplating bath, and 2 be circulating pump, and 3 be flowmeter, and 4 be reservoir, and 5 be power supply, and 6 be ultrasonic vibrator, and 7 be powder copper, 11
It is external conductive casing for leakage fluid dram, 12,13 be permeable ceramic membrane, and 14 be inlet, and 15 be exocoel, and 16 be inner cavity, and 17 be feed supplement
Mouthful.
Specific embodiment
Illustrate the specific embodiment of the present invention with reference to the accompanying drawings and examples, but following embodiment is used only in detail
It describes the bright present invention in detail, does not limit the scope of the invention in any way.Involved parts in following embodiment, structure,
The devices such as mechanism are then conventional commercial product unless otherwise instructed.
Embodiment：As Figure 1-Figure 2, a kind of metallic cover type composite granule electroplanting device, including circulating pump 2, liquid storage
Slot 4, electroplating bath 1 and flowmeter 3,1 outside of electroplating bath are equipped with external conductive casing 12（It is stainless steel in the present embodiment）, it is internal
Equipped with permeable ceramic membrane 13 so that 1 inside of electroplating bath forms inner cavity 16 and exocoel 15, permeable 13 shape of ceramic membrane and conduction
Shell 12 is consistent；1 top of electroplating bath in cylindrical type and equipped with leakage fluid dram 11, lower part in pyramid type and equipped with inlet 14 for
The entrance of plating solution and discharge, leakage fluid dram 11 are connected with 4 top of reservoir, inlet 14, flowmeter 3, circulating pump 2 and reservoir
4 bottoms are connected successively by pipeline；The top of electroplating bath 1 is additionally provided with to fill into the material-feeding port 17 of powder copper 7 to inner cavity 16.
The device further includes power supply 5（It is DC power supply in the present embodiment）, cathode connecting pin and the external conductive casing 12 of power supply 5
Electrical connection, anode connection terminal stretches into inner cavity 16 so that plating solution, external conductive casing 12 and power supply 5 form primary Ioops, and when plating is conductive outer
Shell 12 is cationic with precipitating metal as anode as the powder copper 7 of cathode using reducing metal cation, inner cavity 16.
Two pairs of ultrasonic vibrators 6 are arranged on external conductive casing 12.
The operate with method of above-mentioned metallic cover type composite granule electroplanting device is as follows：
It is illustrated below exemplified by preparing Cu-cladding Al Rod powder, as shown in figure 3, concrete operation step is as follows：
Treatment before plating：
Oil removing：The degreaser of sodium hydroxide of the preparation containing 150g/L, 30g/L sodium carbonate, 35g/L sodium phosphates and water, then will
100g graphite powders are added in degreaser stirs 30min at a temperature of 60 DEG C, then filters out graphite powder, uses deionization
Water washing is clean, is dried for standby.
Oil removing can reduce surface tension when powder is contacted with plating solution.
Prepare plating solution：Each substance is configured to plating solution according to following content：Copper sulphate 1.1mol/L, sulfuric acid 6mmol/L, ice vinegar
Sour 20mmol/L, emulsifier op-10 0.8g/L, glyoxalic acid 20g/L.
Plating：
Plating solution is added in reservoir 4, adds in the graphite powder after treatment before plating, useful load starts external circulating pump in 50g/L
2, adjusting flowmeter 3 makes plating solution enter exocoel 15 by flowmeter 3, inlet 14 from reservoir 4 by pipeline, using drain
Mouth 11 flow back into reservoir 4 and circulates.
DC power supply 5 is opened, current density is adjusted to 20AHdm-2, 2h is electroplated, the Cu in plating solution2+In cathode（It is conductive outer
Shell 12）Surface is precipitated and is coated on graphite powder surface, and the powder copper 7 in inner cavity is oxidized to Cu2+And it adds in plating solution；Together
When starter cathode external conductive casing 12 on ultrasonic vibrator 6, make to be adhered to cathode（External conductive casing 12）The graphite powder particle weight on surface
Plating solution newly is returned to, prevents copper in the over-deposit on graphite particle surface, makes copper coating fine and close, uniformly.
Plating posttreatment：
After plating, the powder for having coated metal is taken out, is washed with deionized totally, is added to benzotriazole solution
Middle passivation 30min, afterwards filters the powder after passivation, and washes clean is dried at a temperature of 60 DEG C.
The present apparatus substitutes anode stub with powder copper 7, is conducive to Cu in plating solution2+Supplement, especially in electroplating process, when
Cu in plating solution2+It during wretched insufficiency, electroplated without interruption, extract anode stub out to be replaced, it is only necessary to is inside by material-feeding port 17
Powder copper 7 is filled into chamber 16, and due to the barrier of permeable ceramic membrane 13, the recycling of powder copper 7 is convenient, will not enter storage
Liquid bath 4.
During production copper-plated using present apparatus progress graphite powder, due to the barrier of permeable ceramic membrane 13, powder can be made
Copper 7 and Cu-cladding Al Rod powder are respectively at the two spaces mutually completely cut off, and when filtering will not influence each other, so that copper-clad obtained
Graphite composite powder impurity is less.
Glyoxalic acid is added in plating solution, passes through the reduction of glyoxalic acid so that powder can be quickly in powder in plating
Body surface face forms metal crystal nuclei, is conducive to fast growth of the metallic crystal in powder surface, densification, can make electrodeposition rate
Soon, coating is smooth, fine and close.
Finally illustrate, the above embodiments are merely illustrative of the technical solutions of the present invention and it is unrestricted, this field is common
Other modifications or equivalent substitution that technical staff makes technical scheme, without departing from technical solution of the present invention
Spirit and scope, should be covered by the scope of the claims of the present invention.
Claims (6)
1. a kind of metallic cover type composite granule electroplanting device, including power supply and be sequentially connected end to end in turn logical electroplating bath, circulating pump,
Reservoir, it is characterised in that：External conductive casing is equipped with outside the electroplating bath, is internally provided with permeable interlayer so that electroplating bath inside shape
Into inner cavity and exocoel, the cathode connecting pin of the power supply is electrically connected with the external conductive casing, anode connection terminal stretches into the inner cavity
So that external conductive casing is positive with precipitating metal as anode as the metal powder of cathode using reducing metal cation, inner cavity during plating
Ion.
2. metallic cover type composite granule electroplanting device according to claim 1, it is characterised in that：The electroplating bath top
In cylindrical type and equipped with leakage fluid dram, lower part in pyramid type and equipped with inlet.
3. metallic cover type composite granule electroplanting device according to claim 1, it is characterised in that：On the external conductive casing
It is arranged with two pairs of ultrasonic vibrators.
4. metallic cover type composite granule electroplanting device according to claim 1, it is characterised in that：The permeable interlayer is
Permeable ceramic membrane.
5. metallic cover type composite granule electroplanting device according to claim 1, it is characterised in that：It the electroplating bath and follows
Connecting pipe between ring pump is equipped with flowmeter.
6. metallic cover type composite granule electroplanting device according to claim 1, it is characterised in that：At the top of the electroplating bath
Equipped with the material-feeding port communicated with the inner cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711362736.3A CN108070895B (en) | 2017-12-18 | 2017-12-18 | Metal cladding type composite powder electroplating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711362736.3A CN108070895B (en) | 2017-12-18 | 2017-12-18 | Metal cladding type composite powder electroplating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108070895A true CN108070895A (en) | 2018-05-25 |
| CN108070895B CN108070895B (en) | 2024-02-02 |
Family
ID=62158499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711362736.3A Active CN108070895B (en) | 2017-12-18 | 2017-12-18 | Metal cladding type composite powder electroplating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108070895B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866593A (en) * | 2018-08-21 | 2018-11-23 | 陈欣洁 | A kind of composite granule electroplanting device |
| CN109023489A (en) * | 2018-08-28 | 2018-12-18 | 杨胜 | A kind of metallic cover type composite granule preparation facilities |
| CN112195495A (en) * | 2020-10-10 | 2021-01-08 | 曲靖师范学院 | Electrochemical deposition plating bath based on MEMS micro-device manufacturing |
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| US20080299756A1 (en) * | 2007-05-30 | 2008-12-04 | Utac Thai Limited | Method and apparatus for plating a semiconductor package |
| CN101665965A (en) * | 2009-10-13 | 2010-03-10 | 广州杰赛科技股份有限公司 | Electroplating device of copper plating of graphite powder and technique |
| CN103266342A (en) * | 2013-05-28 | 2013-08-28 | 南京工程学院 | Device and method for preparing nano-composite coatings based on centrifugal force |
| CN108326292A (en) * | 2017-12-18 | 2018-07-27 | 中国平煤神马集团开封炭素有限公司 | A kind of metallic cover type composite granule electroplating technology |
| CN207685395U (en) * | 2017-12-18 | 2018-08-03 | 中国平煤神马集团开封炭素有限公司 | A kind of metallic cover type composite granule electroplanting device |
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2017
- 2017-12-18 CN CN201711362736.3A patent/CN108070895B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080299756A1 (en) * | 2007-05-30 | 2008-12-04 | Utac Thai Limited | Method and apparatus for plating a semiconductor package |
| CN101665965A (en) * | 2009-10-13 | 2010-03-10 | 广州杰赛科技股份有限公司 | Electroplating device of copper plating of graphite powder and technique |
| CN103266342A (en) * | 2013-05-28 | 2013-08-28 | 南京工程学院 | Device and method for preparing nano-composite coatings based on centrifugal force |
| CN108326292A (en) * | 2017-12-18 | 2018-07-27 | 中国平煤神马集团开封炭素有限公司 | A kind of metallic cover type composite granule electroplating technology |
| CN207685395U (en) * | 2017-12-18 | 2018-08-03 | 中国平煤神马集团开封炭素有限公司 | A kind of metallic cover type composite granule electroplanting device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108866593A (en) * | 2018-08-21 | 2018-11-23 | 陈欣洁 | A kind of composite granule electroplanting device |
| CN109023489A (en) * | 2018-08-28 | 2018-12-18 | 杨胜 | A kind of metallic cover type composite granule preparation facilities |
| CN112195495A (en) * | 2020-10-10 | 2021-01-08 | 曲靖师范学院 | Electrochemical deposition plating bath based on MEMS micro-device manufacturing |
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| Publication number | Publication date |
|---|---|
| CN108070895B (en) | 2024-02-02 |
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