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CN108052292A - A kind of high-temperature protection method of solid state disk - Google Patents

A kind of high-temperature protection method of solid state disk Download PDF

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CN108052292A
CN108052292A CN201711420007.9A CN201711420007A CN108052292A CN 108052292 A CN108052292 A CN 108052292A CN 201711420007 A CN201711420007 A CN 201711420007A CN 108052292 A CN108052292 A CN 108052292A
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solid
nand flash
state hard
disk
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杨燕
王海时
李翠
彭映杰
李英祥
王天宝
王滨
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Sichuan Hai Chuang Tian Core Technology Co Ltd
Sichuan Yate Technology Co Ltd
Chengdu University of Information Technology
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Sichuan Hai Chuang Tian Core Technology Co Ltd
Sichuan Yate Technology Co Ltd
Chengdu University of Information Technology
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Priority to US16/216,886 priority patent/US11010063B2/en
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    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0668Interfaces specially adapted for storage systems adopting a particular infrastructure
    • G06F3/0671In-line storage system
    • G06F3/0683Plurality of storage devices
    • G06F3/0688Non-volatile semiconductor memory arrays
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/3003Monitoring arrangements specially adapted to the computing system or computing system component being monitored
    • G06F11/3037Monitoring arrangements specially adapted to the computing system or computing system component being monitored where the computing system component is a memory, e.g. virtual memory, cache
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F11/00Error detection; Error correction; Monitoring
    • G06F11/30Monitoring
    • G06F11/3058Monitoring arrangements for monitoring environmental properties or parameters of the computing system or of the computing system component, e.g. monitoring of power, currents, temperature, humidity, position, vibrations
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0602Interfaces specially adapted for storage systems specifically adapted to achieve a particular effect
    • G06F3/061Improving I/O performance
    • G06F3/0613Improving I/O performance in relation to throughput
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/06Digital input from, or digital output to, record carriers, e.g. RAID, emulated record carriers or networked record carriers
    • G06F3/0601Interfaces specially adapted for storage systems
    • G06F3/0628Interfaces specially adapted for storage systems making use of a particular technique
    • G06F3/0655Vertical data movement, i.e. input-output transfer; data movement between one or more hosts and one or more storage devices
    • G06F3/0658Controller construction arrangements

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  • Mathematical Physics (AREA)
  • Techniques For Improving Reliability Of Storages (AREA)

Abstract

本发明涉及存储技术领域,本发明实施例公开了一种固态硬盘的高温保护方法,所述方法包括:检测固态硬盘的温度,根据反馈的温度信息,合理高效地限制固态硬盘的带宽且保证了固态硬盘的其他性能指标。借此,本发明针对固态硬盘在一些特殊的应用场景如环境温度高达至40℃~100℃,避免了高温条件下固态硬盘进入异常模式,防止过高温度导致固态硬盘烧坏,造成数据丢失,大大增强了固态硬盘的可靠性,解决了固态硬盘在高温下的应用技术难点。

The present invention relates to the field of storage technology. The embodiment of the present invention discloses a high temperature protection method for a solid-state hard disk. The method includes: detecting the temperature of the solid-state hard disk, and reasonably and efficiently limiting the bandwidth of the solid-state hard disk according to the temperature information fed back and ensuring Other performance indicators of solid-state drives. In this way, the present invention aims at some special application scenarios of solid-state hard drives, such as the ambient temperature as high as 40°C to 100°C, avoiding the abnormal mode of solid-state hard drives under high-temperature conditions, and preventing the solid-state hard drives from burning out due to excessive temperatures, resulting in data loss. It greatly enhances the reliability of solid-state hard drives and solves the technical difficulties of solid-state hard drives under high temperature.

Description

一种固态硬盘的高温保护方法A kind of high temperature protection method of solid state hard disk

技术领域technical field

本发明涉及电子存储器技术领域,特别涉及一种固态硬盘的高温保护方法。The invention relates to the technical field of electronic memory, in particular to a high-temperature protection method for a solid-state hard disk.

背景技术Background technique

随着电子信息技术的不断发展,大数据存储的需求不断带动着闪存存储器快速地向更大规模、更高密度、更高可靠性的方向发展。固态硬盘(SSD,Solid State Driver)是一种非易失性的存储设备,拥有长时间保存数据、快速更新数据、存储海量数据等特性,满足各行业中大数据存储需求。固态硬盘采用高密度、大容量的NAND Flash作为存储介质,具有存取速度快、存储容量大等优点,在军事、航天、消费、工控、监控等诸多领域中被广泛应用。固态硬盘主要由主机通讯接口、SSD控制器、NAND Flash存储介质及电源相关电路组成,其中,主机通讯接口、SSD控制器、NAND Flash存储介质直接决定着固态硬盘的性能。主机通讯接口作为主机与固态硬盘的通信接口,完成命令交互、数据传输功能,当下固态硬盘的主流通讯接口有SATA、AHCI、NVME等。SSD控制器主要用于主机通讯接口到NAND Flash存储介质间的数据的中转;NAND Flash存储介质实现对数据的存储,NAND Flash存储介质的性能在固态硬盘中起着至关重要的作用,直接制约着整个固态硬盘的性能。With the continuous development of electronic information technology, the demand for big data storage continues to drive the rapid development of flash memory in the direction of larger scale, higher density and higher reliability. Solid State Drive (SSD, Solid State Driver) is a non-volatile storage device, which has the characteristics of long-term data storage, fast data update, and massive data storage, which can meet the needs of big data storage in various industries. Solid-state hard drives use high-density, large-capacity NAND Flash as storage media, which have the advantages of fast access speed and large storage capacity, and are widely used in military, aerospace, consumer, industrial control, monitoring and many other fields. Solid-state hard drives are mainly composed of host communication interfaces, SSD controllers, NAND Flash storage media, and power-related circuits. Among them, the host communication interfaces, SSD controllers, and NAND Flash storage media directly determine the performance of solid-state hard drives. The host communication interface is used as the communication interface between the host and the solid-state hard drive to complete command interaction and data transmission functions. The current mainstream communication interfaces of solid-state hard drives include SATA, AHCI, and NVME. The SSD controller is mainly used for the transfer of data between the host communication interface and the NAND Flash storage medium; the NAND Flash storage medium realizes the storage of data, and the performance of the NAND Flash storage medium plays a vital role in the solid-state hard disk, directly restricting affects the performance of the entire SSD.

随着固态硬盘应用场景越来越复杂,当其工作环境温度在60~100℃时,考虑到固态硬盘自身功耗,固态硬盘的盘片温度可能会超过固态硬盘控制器或存储介质的最大操作温度,致使固态硬盘不能正常工作,导致用户数据丢失,甚至出现固态硬盘永久损坏。固态硬盘盘片温度过高主要是工作环境温度和盘片业务操作时自身所产生的功耗导致,工作环境温度由用户决定,那么需要一种方法来保证盘片在高温环境中可正常工作,同时尽量兼顾盘片性能,只能通过调整盘片的性能来达到目的。As the application scenarios of solid-state drives become more and more complex, when the working environment temperature is 60-100°C, considering the power consumption of the solid-state drive itself, the disk temperature of the solid-state drive may exceed the maximum operating capacity of the solid-state drive controller or storage medium. temperature, causing the solid-state drive to fail to work normally, resulting in loss of user data, and even permanent damage to the solid-state drive. The high temperature of the solid-state disk is mainly caused by the working environment temperature and the power consumption generated by the disk itself during business operation. The working environment temperature is determined by the user, so a method is needed to ensure that the disk can work normally in a high-temperature environment. At the same time, try to take into account the performance of the disc, which can only be achieved by adjusting the performance of the disc.

固态硬盘盘片性能主要体现在带宽上,固态硬盘盘片带宽主要受控于主机通讯接口、固态硬盘控制器的后端命令并发能力和NAND Flash存储介质的性能,固态硬盘盘片的带宽包括数据传输带宽和命令传输带宽,由于固态硬盘主要是传输数据,因此数据传输带宽主要制约盘片带宽。而针对指定的固态硬盘盘片其固态硬盘控制器的后端命令并发能力基本是固定的。在现有的技术中,主要是降低主机通讯接口的I/O并发度来达到降低盘片温度的目的,但是,当盘片工作的环境温度在80℃之上很难保证盘片可正常工作,且会导致盘片性能波动较大,带宽振幅很大,从而大大降低固态硬盘的性能,严重限制了固态硬盘的广泛应用。The performance of SSD disks is mainly reflected in the bandwidth. The bandwidth of SSD disks is mainly controlled by the host communication interface, the back-end command concurrency capability of the SSD controller, and the performance of NAND Flash storage media. The bandwidth of SSD disks includes data Transmission bandwidth and command transmission bandwidth. Since solid-state drives mainly transmit data, the data transmission bandwidth mainly restricts the disk bandwidth. However, the back-end command concurrency capability of the solid-state hard disk controller for a specified solid-state hard disk disk is basically fixed. In the existing technology, the main purpose is to reduce the I/O concurrency of the host communication interface to reduce the temperature of the disk. However, it is difficult to ensure that the disk can work normally when the ambient temperature of the disk is above 80°C. , and will lead to large fluctuations in disk performance and large bandwidth amplitudes, thereby greatly reducing the performance of solid-state drives and severely limiting the wide application of solid-state drives.

综上所述,在固态硬盘的实际使用中,固态硬盘工作的环境温度在80℃是经常出现的,例如企业长时间使用服务器,或者在天气炎热的环境下使用固态硬盘等情况,为保证盘片在高温的下仍能正常且高效工作,并且满足高可靠性能,非常有必要提出一种固态硬盘,解决高温环境下固态硬盘高性能工作的技术瓶颈。提高固态硬盘的可靠性,实现更为广泛的应用,使制造高可靠性的固态硬盘成为可能。To sum up, in the actual use of solid-state drives, the working environment temperature of solid-state drives often occurs at 80°C. For example, enterprises use servers for a long time, or use solid-state drives in hot weather. Chips can still work normally and efficiently at high temperatures, and meet high reliability performance. It is very necessary to propose a solid-state hard drive to solve the technical bottleneck of high-performance solid-state hard drives in high-temperature environments. Improve the reliability of solid-state hard disks, realize wider applications, and make it possible to manufacture high-reliability solid-state hard disks.

发明内容Contents of the invention

针对上述缺陷,本发明所要解决的技术问题是,提供一种固态硬盘的高温保护方法,目的是在盘片温度较高的情况下,有效地降低盘片温度,从而提高了固态硬盘的可靠性,并尽量兼顾盘片的其他性能,保证固态硬盘高温下安全、可靠、高效工作。In view of the above-mentioned defects, the technical problem to be solved by the present invention is to provide a high-temperature protection method for a solid-state hard disk, the purpose of which is to effectively reduce the temperature of the disk when the temperature of the disk is high, thereby improving the reliability of the solid-state hard disk. , and try to take into account other performance of the disk to ensure the safe, reliable and efficient operation of the solid state drive under high temperature.

为实现上述目的,本发明提供一种固态硬盘的高温保护方法,温度检测电路对固态硬盘盘片的温度进行检测,并根据检测的温度信息对固态硬盘的带宽进行有效地、合理地限制,从而降低固态硬盘的功耗,以此防止固态硬盘由于温度过高而不能正常工作。并且,本发明所提供的一种固态硬盘的高温保护方法,在限制固态硬盘带宽的同时也有效地保证了较好的盘片性能,在现有技术的基础上,极大地增强了固态硬盘的可靠性。所述方法包括如下步骤:In order to achieve the above object, the present invention provides a high temperature protection method for a solid-state hard disk. The temperature detection circuit detects the temperature of the solid-state hard disk, and effectively and reasonably limits the bandwidth of the solid-state hard disk according to the detected temperature information, thereby Reduce the power consumption of the solid-state drive to prevent the solid-state drive from not working properly due to overheating. Moreover, the high-temperature protection method of a solid-state hard disk provided by the present invention effectively ensures better disk performance while limiting the bandwidth of the solid-state hard disk, and greatly enhances the performance of the solid-state hard disk on the basis of the prior art. reliability. The method comprises the steps of:

步骤1:温度检测电路检测固态硬盘的盘片温度;Step 1: The temperature detection circuit detects the disk temperature of the solid-state hard disk;

步骤2:设置定时触发温度检测电路任务;Step 2: Set the timing to trigger the temperature detection circuit task;

步骤3:设置固态硬盘的起始温度阀值;Step 3: Set the initial temperature threshold of the SSD;

步骤4:启动定时触发任务;Step 4: Start the scheduled trigger task;

步骤5:定时获取固态硬盘的实际温度信息;Step 5: Obtain the actual temperature information of the solid state drive regularly;

步骤6:将固态硬盘的实际温度与设定的起始温度阈值进行比较,获取二者的差值;Step 6: Compare the actual temperature of the SSD with the set initial temperature threshold to obtain the difference between the two;

步骤7:依据固态硬盘的实际温度与设定的起始温度阀值间的差值,调整固态硬盘的带宽。Step 7: Adjust the bandwidth of the solid state drive according to the difference between the actual temperature of the solid state drive and the set initial temperature threshold.

所述温度检测电路检测固态硬盘的盘片温度,温度检测电路接收触发信号,并启动固态硬盘温度采集任务。The temperature detection circuit detects the disk temperature of the solid-state hard disk, and the temperature detection circuit receives a trigger signal and starts a temperature collection task of the solid-state hard disk.

所述设置定时触发温度检测电路,包括配置固态硬盘的定时电路的中断周期T1,启动定时器,并以T1为单位周期性地向温度检测电路发送触发信号。当固态硬盘的实际温度达到设置的温度起始阈值时,开始对固态硬盘进行数据传输带宽限制。The setting of the timing trigger temperature detection circuit includes configuring the interrupt period T1 of the timing circuit of the solid-state hard disk, starting the timer, and periodically sending a trigger signal to the temperature detection circuit in units of T1. When the actual temperature of the solid-state hard disk reaches the set temperature start threshold, the data transmission bandwidth limit for the solid-state hard disk starts.

所述定时任务会周期性地发送触发信号给温度检测电路,并获取温度检测电路反馈的固态硬盘的实际温度。The timing task periodically sends a trigger signal to the temperature detection circuit, and obtains the actual temperature of the solid state disk fed back by the temperature detection circuit.

通过调整NAND Flash的数据传输带宽来提升或限制固态硬盘带宽。Increase or limit the bandwidth of SSD by adjusting the data transmission bandwidth of NAND Flash.

所述调整NAND Flash的数据传输带宽,包括对NAND Flash控制器中的命令并发通道数量和NAND Flash接口的数据吞吐率进行调整。The adjustment of the data transmission bandwidth of the NAND Flash includes adjusting the number of concurrent command channels in the NAND Flash controller and the data throughput rate of the NAND Flash interface.

所述调整NAND Flash控制器中的命令并发通道数量,包括:当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,减少NAND Flash控制器中的命令并发通道数量;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,增加NAND Flash控制器中的命令并发通道数量;当固态硬盘的实际温度小于起始温度阀值,恢复默认的NAND Flash控制器中的命令并发通道数量。The adjustment of the number of concurrent channels of commands in the NAND Flash controller includes: when the actual temperature of the solid state disk is greater than the set initial temperature threshold and higher than the disk temperature value of the previous cycle, reducing the number of channels in the NAND Flash controller The number of concurrent command channels; when the actual temperature of the solid state drive is greater than the initial temperature threshold and lower than the disk temperature value of the previous cycle, increase the number of concurrent command channels in the NAND Flash controller; when the actual temperature of the solid state drive is lower than the initial temperature threshold Set the initial temperature threshold and restore the default number of concurrent command channels in the NAND Flash controller.

所述调整NAND Flash接口的数据吞吐率,包括:当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,降低NAND Flash接口的数据吞吐率;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,提升NANDFlash 接口的数据吞吐率;当固态硬盘的实际温度小于起始温度阀值,恢复默认的NANDFlash的数据吞吐率。Said adjustment of the data throughput rate of the NAND Flash interface includes: reducing the data throughput rate of the NAND Flash interface when the actual temperature of the solid-state hard disk is greater than the initial temperature threshold value set and higher than the disk temperature value of the previous cycle; The actual temperature of the solid-state drive is greater than the initial temperature threshold and lower than the disk temperature value of the previous cycle to improve the data throughput rate of the NANDFlash interface; when the actual temperature of the solid-state drive is lower than the initial temperature threshold, restore the default NANDFlash Data throughput.

所述调整NAND Flash接口的数据吞吐率,采用对NAND Flash存储介质的读取或编程命令的操作时间进行调整。The adjustment of the data throughput rate of the NAND Flash interface adopts the operation time of reading or programming commands of the NAND Flash storage medium to adjust.

所述调整NAND Flash存储介质的业务操作时间包括:The business operation time of described adjustment NAND Flash storage medium comprises:

步骤1:周期性地获取固态硬盘的盘片温度,记为盘片第一温度T1;Step 1: Obtain the disk temperature of the solid-state hard disk periodically, which is recorded as the first temperature T1 of the disk;

步骤2:根据盘片所处的工作环境温度设定盘片的温度起始阈值,记为盘片第二温度T2;Step 2: Set the initial temperature threshold of the disk according to the working environment temperature of the disk, which is recorded as the second temperature T2 of the disk;

步骤3:根据固态硬盘主控芯片的工艺温度上限,设定温度裕量,并计算固态硬盘盘片温度的上限,记为盘片第三温度T3;Step 3: Set the temperature margin according to the process temperature upper limit of the main control chip of the solid-state hard disk, and calculate the upper limit of the disk temperature of the solid-state disk, which is recorded as the third temperature T3 of the disk;

步骤4:从NAND Flash存储介质内部获取读取或编程命令的基本操作时间,分别记为 NAND Flash的第一读取时间Cr1和第一编程时间Cw1;Step 4: Obtain the basic operation time of reading or programming commands from the inside of the NAND Flash storage medium, which are respectively recorded as the first reading time Cr1 and the first programming time Cw1 of NAND Flash;

步骤5:当固态硬盘的盘片第一温度T1升至盘片第三温度T3时,设定NAND Flash存储介质的读取或编程命令最大操作时间,分别记为NAND Flash的第二读取时间Crmax2和第二编程时间Cwmax2;Step 5: When the first temperature T1 of the solid-state disk rises to the third temperature T3 of the disk, set the maximum operating time of the read or program command of the NAND Flash storage medium, which is respectively recorded as the second read time of the NAND Flash Crmax2 and the second programming time Cwmax2;

步骤6:根据Cr1和Crmax2,Cw1和Cwmax2得到NAND Flash存储介质读取或编程操作时,对应命令的操作时间差值,分别记为NAND Flash的第三读取时间Cr3和第三编程时间Cw3;Step 6: According to Cr1 and Crmax2, when Cw1 and Cwmax2 obtain the NAND Flash storage medium read or programming operation, the operating time difference of the corresponding command is recorded as the third reading time Cr3 and the third programming time Cw3 of NAND Flash respectively;

步骤7:根据T2和T3得到固态硬盘的实际温度范围差值,记为盘片第一温度差值T4;Step 7: According to T2 and T3, obtain the actual temperature range difference of the solid-state hard disk, and record it as the first temperature difference T4 of the disk;

步骤8:根据T4和Cr3、T4和Cw3,得到平均每一摄氏度的温度变化所引起的NANDFlash存储介质命令操作时间的变化值,分别记为NAND Flash的第四读取周期Cr4和第四编程周期Cw4;Step 8: According to T4 and Cr3, T4 and Cw3, the change value of the NAND Flash storage medium command operation time caused by the average temperature change of each degree Celsius is recorded as the fourth reading cycle Cr4 and the fourth programming cycle of NAND Flash respectively Cw4;

步骤9:若T1大于等于T2,开始调整固态硬盘带宽,得到T1与T2的差值,并获取本次对NAND Flash存储介质的操作类型,结合Cr4和Cw4分别得到NAND Flash存储介质的读取或编程命令的实际操作时间。本次为读取命令时,对NAND Flash存储介质的读取操作时间Cread满足:Step 9: If T1 is greater than or equal to T2, start to adjust the SSD bandwidth, get the difference between T1 and T2, and get the type of operation on the NAND Flash storage medium this time, combine Cr4 and Cw4 to get the reading or Actual operation time of programming commands. When this is a read command, the read operation time Cread of the NAND Flash storage medium satisfies:

Cread=(T1-T2)*Cr4+Cr1Cread=(T1-T2)*Cr4+Cr1

本次编程操作时,对NAND Flash存储介质的实际编程时间Cwrite满足:During this programming operation, the actual programming time Cwrite of the NAND Flash storage medium satisfies:

Cwrite=(T1-T2)*Cw4+Cw1Cwrite=(T1-T2)*Cw4+Cw1

若T1小于T2,停止调整固态硬盘带宽,此时NAND Flash存储介质的读取或编程命令的操作时间采用基本操作时间。对NAND Flash存储介质的读取操作的实际操作时间Cread满足:If T1 is less than T2, stop adjusting the bandwidth of the solid-state hard disk, and at this time, the basic operation time is used for the operation time of reading or programming commands of the NAND Flash storage medium. The actual operation time Cread of the read operation of the NAND Flash storage medium satisfies:

Cread=Cr1Cread=Cr1

对NAND Flash存储介质的编程操作的实际操作时间Cwrite满足:The actual operating time Cwrite of the programming operation of the NAND Flash storage medium satisfies:

Cwrite=Cw1。Cwrite=Cw1.

附图说明Description of drawings

图1示出根据本发明实施例的加入限速方法后的固态硬盘装置。Fig. 1 shows a solid state hard disk device after adding a speed limiting method according to an embodiment of the present invention.

图2示出根据本发明实施例的温度检测电路模块的内部结构框图。Fig. 2 shows a block diagram of the internal structure of a temperature detection circuit module according to an embodiment of the present invention.

图3示出根据本发明实施例的高温限速控制模块框图。Fig. 3 shows a block diagram of a high temperature speed limit control module according to an embodiment of the present invention.

图4示出根据本发明实施例的一种固态硬盘高温保护方法总体流程图。Fig. 4 shows an overall flowchart of a high temperature protection method for a solid state disk according to an embodiment of the present invention.

图5示出根据本发明实施例的固态硬盘在读取或编程操作中调整操作时间流程图。FIG. 5 shows a flow chart of adjusting operation time of a solid state disk during a read or program operation according to an embodiment of the present invention.

具体实施方式Detailed ways

为了使本发明的目的、技术方案及优点更加清楚明白,下面结合附图和具体实施方式对本发明作进一步详细的说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

参见图1,根据本发明实施例提供了一种加入了限速方法后的固态硬盘(SSD,Solid State Driver)装置,包括前端主机通讯接口、固态硬盘控制器及NAND Flash存储介质芯片。固态硬盘的操作业务总的分为编程业务、读取业务和擦除业务。整个固态硬盘电路实现将主机下发的数据存储至NAND Flash存储器颗粒中,也可实现将NAND Flash存储器存储的数据读取至主机。所述前端主机通讯接口与固态硬盘控制器相连,用于主机电脑与盘片之间进行数据传输的接口,包括固态硬盘的数据传送至主机或者将主机的数据传送至固态硬盘控制器;用于将固态硬盘的数据传送至主机或者将主机的数据传送至固态硬盘控制器。所述前端主机通讯接口包括SATA接口或PCIE接口,可以支持目前主流的SATA3.0(Serial ATA,串行ATA) 接口或者PCIE(Peripheral Component Interconnect Express)接口。固态硬盘控制器连接主机通讯接口,用于接收或者上传数据至主机通讯接口,固态硬盘控制器是整个固态硬盘的核心,用于控制整个固态硬盘盘片的数据传输、命令传输及对盘片的读取、编程、擦除业务的操作。固态硬盘控制器连接至NAND Flash存储芯片,用于在对固态硬盘读取操作时,从NAND Flash 存储芯片读取的数据传送至固态硬盘控制器,再通过固态硬盘控制器的操作控制,将读出的数据依次传送至主机通讯接口电路,最终上传至主机。固态硬盘控制器包括温度检测电路模块,其产生温度检测触发信号连接至所述温度读取模块,用于接收温度读取模块中的控制信号,触发温度检测电路模块进行温度检测,并周期性地将温度值信息传送至高温限速控制模块;Referring to Fig. 1, provide a kind of solid state hard disk (SSD, Solid State Driver) device after adding speed limiting method according to the embodiment of the present invention, comprise front-end host computer communication interface, solid state hard disk controller and NAND Flash storage medium chip. The operation business of the solid-state hard disk is generally divided into programming business, reading business and erasing business. The entire solid-state hard disk circuit realizes storing the data issued by the host into the NAND Flash memory particle, and also realizes reading the data stored in the NAND Flash memory to the host. The front-end host communication interface is connected with the solid-state hard disk controller, and is used as an interface for data transmission between the host computer and the disk, including transmitting the data of the solid-state hard disk to the host or sending the data of the host to the solid-state hard disk controller; The data of the solid state disk is transmitted to the host computer or the data of the host computer is transmitted to the solid state disk controller. The front-end host communication interface includes a SATA interface or a PCIE interface, which can support the current mainstream SATA3.0 (Serial ATA, serial ATA) interface or PCIE (Peripheral Component Interconnect Express) interface. The solid-state hard disk controller is connected to the communication interface of the host for receiving or uploading data to the communication interface of the host. Read, program, erase operations. The solid-state hard disk controller is connected to the NAND Flash memory chip, which is used to transmit the data read from the NAND Flash memory chip to the solid-state hard disk controller during the read operation of the solid-state hard disk, and then through the operation control of the solid-state hard disk controller, the read The output data are sent to the communication interface circuit of the host in turn, and finally uploaded to the host. The solid-state disk controller includes a temperature detection circuit module, which generates a temperature detection trigger signal and is connected to the temperature reading module for receiving the control signal in the temperature reading module, triggering the temperature detection circuit module to perform temperature detection, and periodically Send the temperature value information to the high temperature speed limit control module;

温度读取模块,其产生温度读取控制信号连接至所述温度检测电路模块及定时触发电路,用于实时读取固态硬盘盘片的温度大小;A temperature reading module, which generates a temperature reading control signal and is connected to the temperature detection circuit module and a timing trigger circuit, for real-time reading of the temperature of the solid-state hard disk;

定时触发电路,其产生周期性地定时触发信号连接至高温限速控制模块及温度读取模块,用于作为温度检测的触发机制,按周期传送定时触发信号给温度读取控制电路;A timing trigger circuit, which generates a periodic timing trigger signal and is connected to the high temperature speed limit control module and the temperature reading module, is used as a trigger mechanism for temperature detection, and periodically transmits the timing trigger signal to the temperature reading control circuit;

高温限速控制模块,其产生控制定时触发的信号连接至所述定时触发电路,产生限速控制命令连接至所述NAND Flash控制器,将接收的温度信息值传送至所述高温限速值生成器模块,用于当固态硬盘盘片的温度大于所设置的温度大小,对固态硬盘进行高温限速控制。A high temperature speed limit control module, which generates a signal for controlling the timing trigger and is connected to the timing trigger circuit, generates a speed limit control command and connects to the NAND Flash controller, and transmits the received temperature information value to the high temperature speed limit value generation The controller module is used to control the high-temperature speed limit of the solid-state hard disk when the temperature of the solid-state hard disk is higher than the set temperature.

NAND Flash控制器,其接收高温限速控制模块传送的限速控制命令,产生调整通道及 NAND Flash存储芯片数据带宽的控制信号和数据带宽大小至NAND Flash存储芯片接口电路,用于控制整个固态硬盘盘片的编程或读取或擦除操作,以及控制数据和命令的传递,并接收高温限速模块传递的高温限速逻辑控制信号及NAND Flash存储芯片限速带宽值;NAND Flash controller, which receives the speed limit control command sent by the high temperature speed limit control module, generates the control signal and data bandwidth to adjust the channel and the data bandwidth of the NAND Flash memory chip to the interface circuit of the NAND Flash memory chip, and is used to control the entire solid-state hard drive Program, read or erase the disk, and control the transmission of data and commands, and receive the high temperature speed limit logic control signal transmitted by the high temperature speed limit module and the speed limit bandwidth value of the NAND Flash memory chip;

NAND Flash存储芯片接口电路,接收NAND Flash控制器传送的控制信号及数据,产生访问NAND Flash存储器芯片的编程或擦除或读取操作时序传送至NAND Flash存储芯片; NAND Flash存储芯片接口电路可支持异步、ONFI协议接口和Toggle协议接口。本领域技术人员可知,ONFI(Open NAND Flash Interface)协议和Toggle同步协议为NAND Flash存储器颗粒厂商共同标记的国际协议标准,不同厂商采用不同协议。The NAND Flash memory chip interface circuit receives the control signals and data transmitted by the NAND Flash controller, generates access to the programming or erasing or reading operation timing of the NAND Flash memory chip and transmits it to the NAND Flash memory chip; the NAND Flash memory chip interface circuit can support Asynchronous, ONFI protocol interface and Toggle protocol interface. Those skilled in the art know that the ONFI (Open NAND Flash Interface) protocol and the Toggle synchronization protocol are international protocol standards jointly marked by NAND Flash memory particle manufacturers, and different manufacturers adopt different protocols.

高温限速值生成器模块,其产生NAND Flash读取或编程命令的潜伏期值大小传送至高温限速控制模块,用于接收高温限速控制模块所得到的不同温度信息值,并产生NANDFlash 读取或编程命令的潜伏期值大小。本发明实施例中所述温度检测电路模块、温度读取模块、定时触发电路模块、高温限速控制模块、高温限速值模块、NAND Flash控制器(NANDFlash Controller,NFC)和NAND Flash存储器接口电路全部由数字集成电路制成,为实际存在的芯片电路模块。High temperature speed limit value generator module, which generates the latency value of NAND Flash reading or programming command and sends it to the high temperature speed limit control module to receive different temperature information values obtained by the high temperature speed limit control module and generate NAND Flash read Or the latency value of the programming command. The temperature detection circuit module, temperature reading module, timing trigger circuit module, high temperature speed limit control module, high temperature speed limit value module, NAND Flash controller (NANDFlash Controller, NFC) and NAND Flash memory interface circuit described in the embodiment of the present invention All are made of digital integrated circuits, which are actual chip circuit modules.

固态硬盘后端包括NAND Flash控制器中的NAND Flash存储芯片接口电路及多通道的 NAND Flash存储芯片。本发明实施例中固态硬盘后端由多通道组成,这样可以实现数据的大容量存储及数据的高效存储。每通道一般由大于两个NAND Flash存储芯片构成,本实施例中所述NAND Flash存储介质芯片采用8个NAND Flash存储介质芯片级连,构成一个NAND Flash存储通道,一共4个NAND Flash存储通道。其中NAND Flash存储介质芯片包括SLC NAND Flash存储芯片、MLC NAND Flash存储芯片、TLC NAND Flash存储芯片、3D NANDFlash存储芯片。SLC NAND Flash(Single Level Cell,单层单元闪存)存储芯片即每个阵列器件存储1比特数据,MLC NAND Flash(Multi-Level Cell)存储芯片每个阵列器件存储2比特数据,TLC NAND Flash(Triple-Level Cell)存储芯片每个阵列器件存储3比特数据。3D NAND Flash存储芯片其阵列结构采用当今前言技术三维存储器,大大提高了存储容量。在对固态硬盘编程操作时,固态硬盘控制器接收由主机通讯接口传输的数据及命令,并按照操作命令产生对应的操作时序电路,将数据按照编程操作时序传送至NAND Flash存储芯片指定地址,完成对固态硬盘的编程操作。主机通讯接口采用SATA(Serial AdvancedTechnology Attachment,串行ATA接口规范)接口协议,实现与SATA主机进行命令交互及数据传输。固态硬盘的核心组件为固态硬盘控制器和NAND Flash存储介质芯片,固态硬盘控制器用于控制从主机传送至前端接口电路的数据传送至固态硬盘控制器,并控制实现从主机传送进的数据编程至NAND Flash存储器芯片,或者控制实现对NAND Flash存储器芯片的擦除操作,或者实现从NAND Flash存储器芯片中读取数据至前端接口电路。NAND Flash存储芯片用于作为数据存储。本发明实施例的固态硬盘装置对固态硬盘控制器进行改进,加入高温保护电路控制模块,实现对固态硬盘的高温保护,在较小影响固态硬盘性能的前提下极大程度地提高了固态硬盘地稳定性。图1示出根据本发明实施例的加入限速方法后的固态硬盘电路装置,其中,固态硬盘控制器包括温度检测电路模块、温度读取模块、定时触发电路模块、高温限速控制模块、高温限速值模块、NAND Flash控制器(NAND FlashController,NFC)和NAND Flash存储器接口电路。温度检测电路模块与温度读取模块、定时触发电路模块、高温限速控制模块、高温限速值模块依次相连;高温限速控制模块与NANDFlash控制器、NAND Flash 存储芯片接口电路依次相连。其中,温度检测电路模块用于接收温度读取模块中的控制信号,触发温度检测电路模块进行温度检测,并周期性地将温度值传送至高温限速控制模块。温度检测电路模块实际是一个模数转换器,模拟信号来源是温度检测电路。温度检测电路作为物理信号转换为电信号的实现模块,模块中核心器件为PT100温度传感器件,它通过介质将温度信号传送到相应的检测电路并转换为电信号。温度读取模块用于实时读取固态硬盘盘片的温度大小。定时器触发电路作为温度检测的触发机制,按周期传送触发信号给温度读取模块,触发周期可由用户自定义,主要通过增加一个主机通信命令来完成触发周期的更新。触发周期由CPU下发给定时器电路,定时器电路实现计数,当计数至设置的触发周期,即产生触发信号传送至温度读取模块。高温限速控制模块用于当固态硬盘盘片的温度大于所设置的温度大小,对固态硬盘进行高温限速控制。其中,高温限速的方法即调整NAND Flash的数据传输带宽,包括对NAND Flash控制器中的命令并发通道数量和/或NAND Flash接口的数据吞吐率进行调整。高温限速值生成器模块用于接收高温限速控制模块所得到的不同信息值,包括盘片第一温度T1、盘片第二温度T2、盘片第三温度T3、NAND Flash的第一读取时间Cr1 和第一编程时间Cw1、NAND Flash的第二读取时间Crmax2和第二编程时间Cwmax2。高温限速值生成器模块接收高温限速控制模块所计算出的高温控制参数后,计算产生对NAND Flash存储介质的实际编程时间Cwrite和/或对NANDFlash存储介质的读取操作时间Cread 时间值大小,最终将计算出的对NAND Flash存储介质的实际编程时间Cwrite和/或读取操作时间Cread时间的值大小传送至高温限速控制模块,高温限速控制模块控制将其值大小传送至NAND Flash控制器。由NAND Flash控制器根据该值大小调控NAND Flash存储芯片接口电路,最终调控访问NAND Flash存储芯片的数据带宽,从而达到温度过高进行限速的方案,温度降低恢复数据带宽。从而,在不影响固态硬盘的其他工作性能指标情况下高效地解决了固态硬盘在高温环境下的工作问题,大大提高了固态硬盘的可靠性。The back end of the solid-state hard disk includes a NAND Flash memory chip interface circuit in the NAND Flash controller and a multi-channel NAND Flash memory chip. In the embodiment of the present invention, the back end of the solid-state hard disk is composed of multiple channels, so that large-capacity data storage and efficient data storage can be realized. Each channel is generally composed of more than two NAND Flash storage chips. The NAND Flash storage medium chip described in this embodiment is cascaded with 8 NAND Flash storage medium chips to form a NAND Flash storage channel, a total of 4 NAND Flash storage channels. Among them, NAND Flash storage medium chips include SLC NAND Flash storage chips, MLC NAND Flash storage chips, TLC NAND Flash storage chips, and 3D NAND Flash storage chips. SLC NAND Flash (Single Level Cell, single-level unit flash memory) memory chip stores 1 bit of data per array device, MLC NAND Flash (Multi-Level Cell) memory chip stores 2 bits of data per array device, TLC NAND Flash (Triple-Level Cell) -Level Cell) memory chip stores 3 bits of data per array device. The array structure of the 3D NAND Flash memory chip adopts the three-dimensional memory of today's advanced technology, which greatly improves the storage capacity. When programming the solid-state hard disk, the solid-state hard disk controller receives the data and commands transmitted by the host communication interface, and generates the corresponding operation sequence circuit according to the operation command, and transmits the data to the specified address of the NAND Flash memory chip according to the programming operation sequence, and completes Programming operations on solid-state drives. The host communication interface adopts the SATA (Serial Advanced Technology Attachment, Serial ATA interface specification) interface protocol to realize command interaction and data transmission with the SATA host. The core components of the solid-state hard disk are the solid-state hard disk controller and the NAND Flash storage medium chip. The solid-state hard disk controller is used to control the data transmitted from the host to the front-end interface circuit to the solid-state hard disk controller, and to control the programming of the data transmitted from the host to the The NAND Flash memory chip, or controls the erasing operation of the NAND Flash memory chip, or realizes reading data from the NAND Flash memory chip to the front-end interface circuit. NAND Flash memory chips are used for data storage. The solid-state hard disk device of the embodiment of the present invention improves the solid-state hard disk controller, adds a high-temperature protection circuit control module, realizes high-temperature protection for the solid-state hard disk, and greatly improves the performance of the solid-state hard disk under the premise of less affecting the performance of the solid-state hard disk. stability. Fig. 1 shows the solid-state hard disk circuit device after adding the speed limiting method according to an embodiment of the present invention, wherein, the solid-state hard disk controller includes a temperature detection circuit module, a temperature reading module, a timing trigger circuit module, a high-temperature speed-limiting control module, a high-temperature A speed limit module, a NAND Flash controller (NAND FlashController, NFC) and a NAND Flash memory interface circuit. The temperature detection circuit module is connected to the temperature reading module, the timing trigger circuit module, the high temperature speed limit control module, and the high temperature speed limit value module in sequence; the high temperature speed limit control module is connected to the NAND Flash controller and the NAND Flash memory chip interface circuit in sequence. Wherein, the temperature detection circuit module is used to receive the control signal from the temperature reading module, trigger the temperature detection circuit module to perform temperature detection, and periodically transmit the temperature value to the high temperature speed limit control module. The temperature detection circuit module is actually an analog-to-digital converter, and the source of the analog signal is the temperature detection circuit. The temperature detection circuit is used as a module to convert physical signals into electrical signals. The core device in the module is PT100 temperature sensor, which transmits temperature signals to corresponding detection circuits through media and converts them into electrical signals. The temperature reading module is used to read the temperature of the solid state disk in real time. As a trigger mechanism for temperature detection, the timer trigger circuit transmits trigger signals to the temperature reading module periodically. The trigger cycle can be customized by the user, and the update of the trigger cycle is mainly completed by adding a host communication command. The trigger cycle is sent to the timer circuit by the CPU, and the timer circuit realizes counting. When the count reaches the set trigger cycle, a trigger signal is generated and sent to the temperature reading module. The high temperature speed limit control module is used to control the high temperature speed limit of the solid state disk when the temperature of the solid state disk is higher than the set temperature. Among them, the method of high temperature speed limit is to adjust the data transmission bandwidth of NAND Flash, including adjusting the number of concurrent command channels in the NAND Flash controller and/or the data throughput rate of the NAND Flash interface. The high temperature speed limit value generator module is used to receive different information values obtained by the high temperature speed limit control module, including the first disk temperature T1, the second disk temperature T2, the third disk temperature T3, and the first reading of NAND Flash. Take the time Cr1 and the first programming time Cw1, the second reading time Crmax2 and the second programming time Cwmax2 of NAND Flash. After the high temperature speed limit value generator module receives the high temperature control parameters calculated by the high temperature speed limit control module, it calculates and generates the actual programming time Cwrite of the NAND Flash storage medium and/or the read operation time Cread time value of the NAND Flash storage medium , and finally transmit the value of the calculated actual programming time Cwrite and/or read operation time Cread time to the NAND Flash storage medium to the high temperature speed limit control module, and the high temperature speed limit control module controls to transmit its value to the NAND Flash controller. The NAND Flash controller regulates the interface circuit of the NAND Flash memory chip according to the value, and finally regulates the data bandwidth of accessing the NAND Flash memory chip, so as to achieve the solution of limiting the speed when the temperature is too high, and recovering the data bandwidth when the temperature decreases. Therefore, the working problem of the solid-state hard disk in a high-temperature environment is efficiently solved without affecting other working performance indicators of the solid-state hard disk, and the reliability of the solid-state hard disk is greatly improved.

其次,本发明实施例的固态硬盘具备4个通道,每个通道可以挂载8颗NAND Flash存储介质芯片,多通道的固态硬盘可以实现数据的大容量存储及较高带宽,多通道固态硬盘共同操作引起固态硬盘盘片温度上升的问题也是本发明引起高温的原因,在满足多通道进行大数据传输以及多通道数据传输引起盘片温度升高的矛盾问题也是本发明方案所解决的问题之一。高温限速的方法即调整NAND Flash的数据传输带宽,也包括对NAND Flash控制器中的命令并发通道数量的调整,高温限速控制模块接收到温度读取模块的信息值大小时,比较读取的盘片温度值与起始温度阈值差值大小,当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,减少NAND Flash控制器中的命令并发通道数量;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,增加NAND Flash 控制器中的命令并发通道数量;当固态硬盘的实际温度小于起始温度阀值,恢复默认的NAND Flash控制器中的命令并发通道数量。Secondly, the solid-state hard drive of the embodiment of the present invention has 4 channels, and each channel can mount 8 NAND Flash storage medium chips, and the multi-channel solid-state hard drive can realize large-capacity storage of data and higher bandwidth. The temperature rise of the solid-state hard disk caused by the operation is also the cause of the high temperature in the present invention, and the contradictory problem of satisfying multi-channel large data transmission and multi-channel data transmission caused by the temperature rise of the disk is also one of the problems solved by the present invention. . The method of high temperature speed limit is to adjust the data transmission bandwidth of NAND Flash, and also includes the adjustment of the number of concurrent command channels in the NAND Flash controller. When the high temperature speed limit control module receives the information value of the temperature reading module, it compares and reads The difference between the disk temperature value and the initial temperature threshold value. When the actual temperature of the solid state disk is greater than the set initial temperature threshold value and higher than the disk temperature value of the previous cycle, reduce the command concurrency in the NAND Flash controller. Number of channels; when the actual temperature of the solid state drive is greater than the initial temperature threshold and lower than the disk temperature value of the previous cycle, increase the number of concurrent command channels in the NAND Flash controller; when the actual temperature of the solid state drive is lower than the initial temperature Threshold, restore the default number of concurrent command channels in the NAND Flash controller.

固态硬盘的不断发展,集成度越来越高,其不在只是适用于常规室温环境下,应用场景越来越复杂,在一些特殊的应用场景下,如环境温度超过常规温度如60~100摄氏度时,再对固态硬盘的编程操作或者读取操作或者擦除操作时,其自身工作功耗很高,可能会造成固态硬盘本身的温度超过其芯片的工艺温度,致使固态硬盘盘片异常工作,导致用户数据丢失的情况,严重时还会导致固态硬盘烧坏。图1示出根据本发明实施例前端接口电路采用SATA 协议,为了不减缓固态硬盘的访问速率及不降低其他性能指标,本发明仍然采用前端接口同时下发32个IO口命令,即前端IO口的并发度仍然是32,与之前已有专利CN201210475065 对高温保护提出的减小指令队列深度(即降低前端IO口并发度)相比,已有专利的方案虽然在一定程度上起到保护固态硬盘的作用,但是却造成固态硬盘的的整体性能大幅降低。本发明提出的一种固态硬盘的高温保护方法很好地解决了了现有技术的瓶颈,客服了高温环境下对固态硬盘的保护,同时很好地保证了固态硬盘的良好性能,增强了固态硬盘的可靠性。With the continuous development of solid-state drives, the integration level is getting higher and higher. It is not only suitable for normal room temperature environments, but the application scenarios are becoming more and more complex. In some special application scenarios, if the ambient temperature exceeds the conventional temperature, such as 60-100 degrees Celsius , when programming, reading or erasing the solid-state hard disk, its own power consumption is very high, which may cause the temperature of the solid-state hard disk itself to exceed the process temperature of its chip, resulting in abnormal operation of the solid-state hard disk, resulting in In the case of user data loss, the solid-state drive will be burned out in severe cases. Fig. 1 shows that according to the embodiment of the present invention, the front-end interface circuit adopts the SATA protocol. In order not to slow down the access rate of the solid-state hard disk and not reduce other performance indicators, the present invention still uses the front-end interface to issue 32 IO port commands at the same time, that is, the front-end IO port The concurrency degree is still 32. Compared with the previous patent CN201210475065, which proposed to reduce the depth of the instruction queue for high temperature protection (that is, reduce the concurrency degree of the front-end IO port), although the existing patented scheme can protect the solid-state disk to a certain extent However, the overall performance of the solid state drive is greatly reduced. A high-temperature protection method for a solid-state hard disk proposed by the present invention solves the bottleneck of the prior art well, serves to protect the solid-state hard disk in a high-temperature environment, and at the same time ensures the good performance of the solid-state hard disk, and enhances the performance of the solid-state hard disk. HDD reliability.

图2示出根据本发明实施例的温度检测实现的内部结构框图,包括温度传感器、温度转换电路、温度数据寄存器、检测触发模块。温度转换电路、温度数据寄存器、检测触发模块由数字电路制成。其中,温度传感器、温度转换电路、温度数据寄存器依次相连,检测触发模块连接至温度转换电路。温度传感器用于将温度信号传输到温度转换电路中,温度传感器使用特殊材质构成,对于其应用场景、使用寿命、精准度都有较好的效果。温度转换电路根据温度传感器对应的阻抗变化引起电压分布,主要利用温度传感器的温阻效应进行,从而得到温度物理信号向电压信号的转换。由于温度传感器(PT100)的特殊性需要有温度补偿电路,主要作用是对其进行校准,用于使用得到的温度值更为精确。当温度信号转换为电压信号后就直接可通过模数转换得到数字信号值,其转换基准按下式进行:Fig. 2 shows a block diagram of the internal structure of temperature detection according to an embodiment of the present invention, including a temperature sensor, a temperature conversion circuit, a temperature data register, and a detection trigger module. The temperature conversion circuit, temperature data register and detection trigger module are made of digital circuits. Wherein, the temperature sensor, the temperature conversion circuit, and the temperature data register are connected in sequence, and the detection trigger module is connected to the temperature conversion circuit. The temperature sensor is used to transmit the temperature signal to the temperature conversion circuit. The temperature sensor is made of special material, which has a good effect on its application scene, service life and accuracy. The temperature conversion circuit causes the voltage distribution according to the impedance change corresponding to the temperature sensor, mainly using the temperature resistance effect of the temperature sensor, so as to obtain the conversion of the temperature physical signal to the voltage signal. Due to the particularity of the temperature sensor (PT100), a temperature compensation circuit is required, the main function is to calibrate it, and the temperature value obtained for use is more accurate. When the temperature signal is converted into a voltage signal, the digital signal value can be directly obtained through analog-to-digital conversion, and the conversion standard is as follows:

温度值=Vout/Cbase Temperature value = V out /C base

在上式中,温度值为最终准确值,Vout为温度转换电路得到的电信号值,Cbase为温度基准值,即每摄氏度的变化引起的电压值的变化的线性关系。在实际的应用中,传感器件的温阻效率不可能是线性关系,但是经过补偿后,可近似看作为线性关系,由此可计算得到固态硬盘的工作温度。而工作温度是暂存于温度数据寄存器中的,是由固态硬盘的主控写入到该寄存器中的,最终在获取该值的时候需要以特定时序去访问该数据寄存器的基地址,以此获取到固态硬盘的工作温度。温度检测触发模块是被动式触发,需要指定的触发信号,所以,固态硬盘的温度获取是被动式,只有提供了触发信号给温度检测触发模块之后,温度检测与转换相关电路才能真正的工作,否则温度寄存器保存的是上一次检测的结果。In the above formula, the temperature value is the final accurate value, Vout is the electrical signal value obtained by the temperature conversion circuit, and Cbase is the temperature reference value, that is, the linear relationship of the change of the voltage value caused by the change of each degree Celsius. In practical applications, the temperature resistance efficiency of the sensing device cannot be a linear relationship, but after compensation, it can be approximately regarded as a linear relationship, from which the operating temperature of the solid-state hard disk can be calculated. The working temperature is temporarily stored in the temperature data register, which is written into the register by the master control of the solid-state hard disk. Finally, when obtaining the value, it is necessary to access the base address of the data register in a specific timing, so as to Obtain the operating temperature of the solid state drive. The temperature detection trigger module is a passive trigger and requires a specified trigger signal. Therefore, the temperature acquisition of the solid state disk is passive. Only after the trigger signal is provided to the temperature detection trigger module, the temperature detection and conversion related circuits can really work. Otherwise, the temperature register What is saved is the result of the last detection.

温度传感器用于检测固态硬盘盘片温度,它获取到的是物理信号,获取结果直接传送给温度转换电路。温度转换电路主要作用是将物理信号转换为电信号,因为电信号为实际可采样信号,然后将电信号数据送往处理器。经过处理器计算后的数据为实际的固态硬盘盘片温度值,处理器最终将最新的温度值存放于固态地址的温度寄存器中,用户可直接通过该地址获取到固态硬盘当前的盘片温度值。检测触发模块是专门设计的采样固态硬盘温度的电路,用户可通过简单的电平触发施加给该模块,该模块会自动触发温度转换电路工作并将新的数据送往处理器。The temperature sensor is used to detect the temperature of the solid-state disk. It obtains physical signals, and the obtained results are directly sent to the temperature conversion circuit. The main function of the temperature conversion circuit is to convert the physical signal into an electrical signal, because the electrical signal is an actual sampleable signal, and then send the electrical signal data to the processor. The data calculated by the processor is the actual disk temperature value of the solid-state hard disk, and the processor finally stores the latest temperature value in the temperature register of the solid-state address, and the user can directly obtain the current disk temperature value of the solid-state hard disk through this address . The detection trigger module is a specially designed circuit for sampling the temperature of the solid-state hard disk. The user can apply it to the module through a simple level trigger, and the module will automatically trigger the temperature conversion circuit to work and send new data to the processor.

图3示出根据本发明实施例的高温限速控制装置图,包括:温度采集信号、温度采集寄存器、高温限速控制模块、NAND Flash通道,所述温度采集寄存器、高温限速控制模块、NAND Flash通道全部采用数字集成电路制成,是实在的制造出来的芯片集成电路。其中:Figure 3 shows a diagram of a high temperature speed limit control device according to an embodiment of the present invention, including: a temperature acquisition signal, a temperature acquisition register, a high temperature speed limit control module, a NAND Flash channel, the temperature acquisition register, a high temperature speed limit control module, a NAND Flash channels are all made of digital integrated circuits, which are actually manufactured chip integrated circuits. in:

所述温度采集信号连接至所述高温限速控制模块,用于触发固态硬盘的温度采集电路工作;The temperature acquisition signal is connected to the high temperature speed limit control module for triggering the operation of the temperature acquisition circuit of the solid-state hard disk;

所述温度采集寄存器连接至所述高温限速控制模块,用于存放盘片温度值;The temperature acquisition register is connected to the high temperature speed limit control module, and is used to store the disk temperature value;

所述高温限速控制模块连接至所述NAND Flash通道,用于依据盘片温度值信息完成高温限制控制;The high temperature speed limit control module is connected to the NAND Flash channel, and is used to complete the high temperature limit control according to the disk temperature value information;

所述NAND Flash通道连接至所述高温限速控制模块,用于作为NAND Flash命令或数据的传输通道。The NAND Flash channel is connected to the high temperature speed limit control module, and is used as a transmission channel for NAND Flash commands or data.

所述高温限速控制模块包括:温度采集信号产生模块、温度值有效性检测模块、温度采集次数统计模块、温度分析模块、温度与阀值比较模块、高温限速启动判定模块、NFC命令操作时间获取模块、NFC命令操作时间有效性分析模块和NFC命令操作时间配置模块,其中:The high temperature speed limit control module includes: temperature acquisition signal generation module, temperature value validity detection module, temperature collection times statistics module, temperature analysis module, temperature and threshold comparison module, high temperature speed limit start determination module, NFC command operation time Obtain module, NFC command operation time validity analysis module and NFC command operation time configuration module, wherein:

所述温度采集信号产生模块连接至所述温度有效值检测模块,用于周期性地发出温度检测信号,并接收温度值信息,并传递到温度有效值检测模块;此处,NFC(NAND FlashController,NAND Flash控制器)为本领域技术人员所知专业词汇。The temperature acquisition signal generation module is connected to the temperature effective value detection module, for periodically sending temperature detection signals, and receiving temperature value information, and delivered to the temperature effective value detection module; here, NFC (NAND FlashController, NAND Flash controller) is a term known to those skilled in the art.

所述温度有效值检测模块连接至所述温度采集次数统计模块,用于对温度值信息进行检测,若检测当前温度信息无效则直接丢弃;否则,将有效的温度信息传递到温度采集次数统计模块;The temperature effective value detection module is connected to the temperature collection times statistics module for detecting the temperature value information, if the detected current temperature information is invalid, it will be directly discarded; otherwise, the effective temperature information will be passed to the temperature collection times statistics module ;

所述温度采集次数统计模块连接至所述温度分析模块,用于获取多次温度信息值,并统计温度值的时间戳信息;The temperature acquisition times statistics module is connected to the temperature analysis module, and is used to obtain multiple temperature information values, and count the time stamp information of the temperature values;

所述温度分析模块连接至所述温度与阀值比较模块,用于依据时间戳信息对所有的温度信息进行分析,得到一个最大的温度值;The temperature analysis module is connected to the temperature and threshold comparison module, and is used to analyze all temperature information according to the time stamp information to obtain a maximum temperature value;

所述温度与阀值比较模块连接至所述高温限速启动判定模块模块,用于比较温度值与设定阀值,这个比较操作还包括与上一周期温度信息值比较;The temperature-threshold comparison module is connected to the high-temperature speed-limited start determination module for comparing the temperature value with the set threshold value, and this comparison operation also includes comparison with the temperature information value of the previous cycle;

所述高温限速启动判定模块连接至所述NFC命令操作时间获取模块,用于判定高温限速是否要开始启动,并产生一个启动信号;The high temperature limit speed start determination module is connected to the NFC command operation time acquisition module, which is used to determine whether the high temperature limit speed starts to start, and generates a start signal;

所述NFC命令操作时间获取模块连接至所述NFC命令操作时间有效性分析模块,用于依据当前获取到的温度转换为NFC命令的实际操作时间;The NFC command operation time acquisition module is connected to the NFC command operation time validity analysis module, and is used to convert the actual operation time of the NFC command according to the temperature obtained currently;

所述NFC命令操作时间有效性分析模块连接至NFC命令操作时间配置模块,用于对NFC 命令的实际操作时间的有效性进行分析,主要识别当前NFC命令的实际操作时间是否超限;The NFC command operating time validity analysis module is connected to the NFC command operating time configuration module for analyzing the validity of the actual operating time of the NFC command, mainly identifying whether the actual operating time of the current NFC command exceeds the limit;

所述NFC命令操作时间配置模块连接至NAND Flash通道,用于存储当前NFC命令的实际操作时间,并一直有效,直到获取到新的NFC命令的操作时间。The NFC command operation time configuration module is connected to the NAND Flash channel for storing the actual operation time of the current NFC command, and is always valid until the operation time of a new NFC command is obtained.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,可对盘片的温度进行实时采集操作。A high-temperature speed-limiting control device for a solid-state hard disk controller is characterized in that the temperature of the disk can be collected in real time.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,基于盘片温度获取到NFC 读命令的实际操作时间。A high-temperature speed-limiting control device for a solid-state hard disk controller is characterized in that the actual operation time of an NFC read command is obtained based on the temperature of the disk.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,基于盘片温度获取到NFC 写命令的实际操作时间。A high-temperature speed-limiting control device for a solid-state hard disk controller is characterized in that the actual operation time of the NFC write command is obtained based on the temperature of the disk.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,所述对盘片温度信息有效性进行智能检测。A high-temperature speed-limiting control device for a solid-state hard disk controller, characterized in that the validity of disk temperature information is intelligently detected.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,所述对NFC命令操作时间进行存储。A high-temperature speed-limiting control device for a solid-state hard disk controller, characterized in that the operation time of the NFC command is stored.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,所述NFC命令操作时间会被新的操作时间所替换。A high-temperature speed-limiting control device for a solid-state hard disk controller is characterized in that the operation time of the NFC command will be replaced by a new operation time.

一种用于固态硬盘控制器的高温限速控制装置,其特征在于,所述NFC命令包括:对 NAND Flash存储器读取操作命令、编程操作命令、擦除操作命令、读状态命令、模式切换命令、读ID命令。A high-temperature speed-limiting control device for a solid-state hard disk controller, wherein the NFC command includes: a read operation command, a programming operation command, an erasing operation command, a read status command, and a mode switching command to a NAND Flash memory , Read ID command.

图4所示出根据本发明实施例的一种固态硬盘高温保护方法总体流程图,包括以下步骤:Fig. 4 shows the overall flowchart of a high temperature protection method for a solid state disk according to an embodiment of the present invention, including the following steps:

步骤1:温度检测电路检测固态硬盘的盘片温度;Step 1: The temperature detection circuit detects the disk temperature of the solid-state hard disk;

步骤2:设置定时触发温度检测电路;Step 2: Set the timing trigger temperature detection circuit;

步骤3:设置固态硬盘的起始温度阀值;Step 3: Set the initial temperature threshold of the SSD;

步骤4:启动定时触发任务;Step 4: Start the scheduled trigger task;

步骤5:定时获取固态硬盘的实际温度信息;Step 5: Obtain the actual temperature information of the solid state drive regularly;

步骤6:将固态硬盘的实际温度与设定的起始温度阈值进行比较,获取二者的差值;Step 6: Compare the actual temperature of the SSD with the set initial temperature threshold to obtain the difference between the two;

步骤7:依据固态硬盘的实际温度与设定的起始温度阀值间的差值,调整固态硬盘的带宽。Step 7: Adjust the bandwidth of the solid state drive according to the difference between the actual temperature of the solid state drive and the set initial temperature threshold.

所述依据固态硬盘的实际温度与设定的起始温度阀值间的差值,调整固态硬盘的带宽。通过检测到温度与设定的起始温度差值,调整固态硬盘的带宽来调整固态硬盘的操作时间周期,从而达到降低温度的作用。固态硬盘的带宽包括数据传输带宽及命令传输带宽,由于对固态硬盘的操作主要是数据的存储,而命令相对数据很小,因此影响固态硬盘带宽主要由数据传输带宽决定。The bandwidth of the solid state disk is adjusted according to the difference between the actual temperature of the solid state disk and the set initial temperature threshold. By detecting the difference between the temperature and the set initial temperature, the bandwidth of the solid-state hard disk is adjusted to adjust the operating time period of the solid-state hard disk, thereby reducing the temperature. The bandwidth of solid-state drives includes data transmission bandwidth and command transmission bandwidth. Since the operation of solid-state drives is mainly data storage, and commands are relatively small compared to data, the impact on the bandwidth of solid-state drives is mainly determined by the data transmission bandwidth.

所述设置定时触发温度检测电路,包括配置固态硬盘的定时电路的中断周期T1,启动定时器,并以T1为单位周期性地向温度检测电路发送定时触发信号。温度检测电路模块,其产生温度检测触发信号连接至所述温度读取模块,用于接收温度读取模块中的控制信号,触发温度检测电路模块进行温度检测,并周期性地将温度值信息传送至高温限速控制模块。The setting of the timing trigger temperature detection circuit includes configuring the interrupt period T1 of the timing circuit of the solid-state hard disk, starting the timer, and periodically sending a timing trigger signal to the temperature detection circuit in units of T1. A temperature detection circuit module, which generates a temperature detection trigger signal and is connected to the temperature reading module for receiving the control signal in the temperature reading module, triggering the temperature detection circuit module to perform temperature detection, and periodically transmitting temperature value information To the high temperature speed limit control module.

所述设置定时触发温度检测电路,包括配置固态硬盘的定时电路的中断周期T1,启动定时器,并以T1为单位周期性地向温度检测电路发送触发信号。当固态硬盘的实际温度达到设置的温度起始阈值时,开始对固态硬盘进行带宽限制。固态硬盘所设置的温度起始阈值由用户设置,通常实施例为70摄氏度。当温度检测电路检测盘片达到设置温度起始阈值则开始对固态硬盘带宽进行限制。The setting of the timing trigger temperature detection circuit includes configuring the interrupt period T1 of the timing circuit of the solid-state hard disk, starting the timer, and periodically sending a trigger signal to the temperature detection circuit in units of T1. When the actual temperature of the solid state disk reaches the set temperature start threshold, the bandwidth limit of the solid state disk starts. The initial temperature threshold set by the solid state disk is set by the user, and is usually 70 degrees Celsius in an embodiment. When the temperature detection circuit detects that the disk reaches the set temperature initial threshold, it starts to limit the bandwidth of the solid state disk.

所述定时任务会周期性地发送触发信号给温度检测电路,并获取温度检测电路反馈的固态硬盘的实际温度。将固态硬盘的实际温度与设定的起始温度阈值进行比较,获取二者的差值。如实施例中获取的温度检测电路反馈的固态硬盘实际温度为T1,设定的起始温度阈值为 T2,则求出T1-T2的大小。通过调整NAND Flash的数据传输带宽来提升或限制固态硬盘带宽。The timing task periodically sends a trigger signal to the temperature detection circuit, and obtains the actual temperature of the solid state disk fed back by the temperature detection circuit. Compare the actual temperature of the solid state disk with the set initial temperature threshold to obtain the difference between the two. For example, the actual temperature of the solid-state hard disk fed back by the temperature detection circuit obtained in the embodiment is T1, and the set initial temperature threshold is T2, then the value of T1-T2 is calculated. Increase or limit the bandwidth of SSD by adjusting the data transmission bandwidth of NAND Flash.

所述调整NAND Flash的数据传输带宽,包括对NAND Flash控制器中的命令并发通道数量和/或NAND Flash接口的数据吞吐率进行调整。The adjustment of the data transmission bandwidth of the NAND Flash includes adjusting the number of concurrent command channels in the NAND Flash controller and/or the data throughput rate of the NAND Flash interface.

所述调整NAND Flash控制器中的命令并发通道数量,包括:当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,减少NAND Flash控制器中的命令并发通道数量;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,增加NAND Flash控制器中的命令并发通道数量;当固态硬盘的实际温度小于起始温度阀值,恢复默认的NAND Flash控制器中的命令并发通道数量。The adjustment of the number of concurrent channels of commands in the NAND Flash controller includes: when the actual temperature of the solid state disk is greater than the set initial temperature threshold and higher than the disk temperature value of the previous cycle, reducing the number of channels in the NAND Flash controller The number of concurrent command channels; when the actual temperature of the solid state drive is greater than the initial temperature threshold and lower than the disk temperature value of the previous cycle, increase the number of concurrent command channels in the NAND Flash controller; when the actual temperature of the solid state drive is lower than the initial temperature threshold Set the initial temperature threshold and restore the default number of concurrent command channels in the NAND Flash controller.

所述调整NAND Flash接口的数据吞吐率,包括:当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,降低NAND Flash接口的数据吞吐率;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,提升NANDFlash 接口的数据吞吐率;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低时,提升NAND Flash接口的数据吞吐率以保证固态硬盘整体操作性能提升,即当温度降低下去时候,不能一直限制固态硬盘带宽,故采用提升NAND Flash接口的数据吞吐率来提升固态硬盘带宽,从而大大提升固态硬盘性能。当固态硬盘的实际温度小于起始温度阀值,恢复默认的NAND Flash的数据吞吐率。Said adjustment of the data throughput rate of the NAND Flash interface includes: reducing the data throughput rate of the NAND Flash interface when the actual temperature of the solid-state hard disk is greater than the initial temperature threshold value set and higher than the disk temperature value of the previous cycle; The actual temperature of the solid state disk is greater than the initial temperature threshold and lower than the disk temperature value of the previous cycle, which improves the data throughput rate of the NAND Flash interface; when the actual temperature of the solid state disk is greater than the initial temperature threshold and lower than the previous cycle When the temperature of the disk is low, increase the data throughput rate of the NAND Flash interface to ensure that the overall operating performance of the SSD is improved. That is, when the temperature drops, the bandwidth of the SSD cannot be limited all the time, so the data throughput rate of the NAND Flash interface is increased. Increase the bandwidth of solid-state drives, thereby greatly improving the performance of solid-state drives. When the actual temperature of the SSD is lower than the initial temperature threshold, the default data throughput rate of NAND Flash will be restored.

所述调整NAND Flash接口的数据吞吐率,采用对NAND Flash存储介质的读取或编程命令的操作时间进行调整。所述对NAND Flash存储介质的读取或编程命令的操作时间即对 NAND Flash存储芯片操作的潜伏期。The adjustment of the data throughput rate of the NAND Flash interface adopts the operation time of reading or programming commands of the NAND Flash storage medium to adjust. The operation time of the read or programming command to the NAND Flash storage medium is the latency period for the operation of the NAND Flash storage chip.

所述调整NAND Flash存储介质的读取或编程业务操作时间包括:The reading or programming business operation time of described adjustment NAND Flash storage medium comprises:

步骤1:周期性地获取固态硬盘的盘片温度,记为盘片第一温度T1;Step 1: Obtain the disk temperature of the solid-state hard disk periodically, which is recorded as the first temperature T1 of the disk;

步骤2:根据盘片所处的工作环境温度设定盘片的温度起始阈值,记为盘片第二温度T2;Step 2: Set the initial temperature threshold of the disk according to the working environment temperature of the disk, which is recorded as the second temperature T2 of the disk;

步骤3:根据固态硬盘主控芯片的工艺温度上限,设定温度裕量,并计算固态硬盘盘片温度的上限,记为盘片第三温度T3;所述固态硬盘主控芯片的工艺温度由生产工艺线所决定,一般是125摄氏度。例如实施例中工艺温度是125摄氏度,温度裕量为25摄氏度,则计算固态硬盘的盘片温度的上限为工艺温度上限-设定温度裕量=125-25=100摄氏度。固态硬盘的盘片温度的上限即在调整过程中不能超过的最大盘片温度,即若此时高温环境温度是71摄氏度,设置的温度起始阈值也为70摄氏度,则此刻开始调整固态硬盘带宽,且要让固态硬盘盘片温度不能超过盘片温度的上限100摄氏度。Step 3: according to the process temperature upper limit of the solid-state hard disk main control chip, set the temperature margin, and calculate the upper limit of the solid-state hard disk disk temperature, which is recorded as the third temperature T3 of the disk; the process temperature of the solid-state hard disk main control chip is determined by It is determined by the production process line, generally at 125 degrees Celsius. For example, in the embodiment, the process temperature is 125 degrees Celsius, and the temperature margin is 25 degrees Celsius, then the upper limit of the disk temperature of the solid-state hard disk is calculated as the upper limit of the process temperature-set temperature margin=125-25=100 degrees Celsius. The upper limit of the disk temperature of the solid-state hard disk is the maximum disk temperature that cannot be exceeded during the adjustment process, that is, if the high-temperature ambient temperature is 71 degrees Celsius at this time, and the initial threshold of the set temperature is also 70 degrees Celsius, then start to adjust the bandwidth of the solid-state disk at this moment , and the temperature of the solid-state hard disk should not exceed the upper limit of the disk temperature by 100 degrees Celsius.

步骤4:从NAND Flash存储介质内部获取读取或编程命令的基本操作时间,分别记为 NAND Flash的第一读取时间Cr1和第一编程时间Cw1;从NAND Flash存储介质内部获取读取或编程命令的基本操作时间可以直接通过NAND Flash存储芯片操作手册,按照芯片操作手册发送对应命令来获取NAND Flash的第一读取时间Cr1和第一编程时间Cw1。Step 4: Obtain the basic operation time of reading or programming commands from the inside of the NAND Flash storage medium, which are respectively recorded as the first reading time Cr1 and the first programming time Cw1 of NAND Flash; obtain the reading or programming from the inside of the NAND Flash storage medium The basic operation time of the command can be directly through the operation manual of the NAND Flash memory chip, and send the corresponding command according to the chip operation manual to obtain the first reading time Cr1 and the first programming time Cw1 of the NAND Flash.

步骤5:当固态硬盘的盘片第一温度T1升至盘片第三温度T3时,设定NAND Flash存储介质的读取或编程命令最大操作时间,分别记为NAND Flash的第二读取时间Crmax2和第二编程时间Cwmax2;Step 5: When the first temperature T1 of the solid-state disk rises to the third temperature T3 of the disk, set the maximum operating time of the read or program command of the NAND Flash storage medium, which is respectively recorded as the second read time of the NAND Flash Crmax2 and the second programming time Cwmax2;

步骤6:根据Cr1和Crmax2,Cw1和Cwmax2得到NAND Flash存储介质读取或编程操作时,对应命令的操作时间差值,分别记为NAND Flash的第三读取时间Cr3和第三编程时间Cw3;即Cr3为Cr1与Crmax2值的差值,Cw3为Cw1与Cwmax2值的差值。Step 6: According to Cr1 and Crmax2, when Cw1 and Cwmax2 obtain the NAND Flash storage medium read or programming operation, the operating time difference of the corresponding command is recorded as the third reading time Cr3 and the third programming time Cw3 of NAND Flash respectively; That is, Cr3 is the difference between Cr1 and Crmax2, and Cw3 is the difference between Cw1 and Cwmax2.

步骤7:根据T2和T3得到固态硬盘的实际温度范围差值,记为盘片第一温度差值T4;即T4为T2-T3的大小。Step 7: Obtain the actual temperature range difference of the solid state disk according to T2 and T3, and record it as the first disc temperature difference T4; that is, T4 is the size of T2-T3.

步骤8:根据T4和Cr3、T4和Cw3,得到平均每一摄氏度的温度变化所引起的NANDFlash存储介质命令操作时间的变化值,分别记为NAND Flash的第四读取周期Cr4和第四编程周期Cw4;Step 8: According to T4 and Cr3, T4 and Cw3, the change value of the NAND Flash storage medium command operation time caused by the average temperature change of each degree Celsius is recorded as the fourth reading cycle Cr4 and the fourth programming cycle of NAND Flash respectively Cw4;

步骤9:若T1大于等于T2,开始调整固态硬盘带宽,得到T1与T2的差值(T1-T2),并获取本次对NAND Flash存储介质的操作业务类型,操作业务类型包括编程操作业务和读取操作业务。结合Cr4和Cw4分别得到NAND Flash存储介质的读取或编程命令的实际操作时间。本次为读取命令时,对NAND Flash存储介质的实际操作时间Cread满足:Step 9: If T1 is greater than or equal to T2, start to adjust the bandwidth of the solid-state hard disk, get the difference between T1 and T2 (T1-T2), and obtain the type of operation business on the NAND Flash storage medium this time. The type of operation business includes programming operation business and Read operation business. Combine Cr4 and Cw4 to obtain the actual operation time of the read or program command of the NAND Flash storage medium respectively. When this is a read command, the actual operation time Cread of the NAND Flash storage medium satisfies:

Cread=(T1-T2)*Cr4+Cr1Cread=(T1-T2)*Cr4+Cr1

本次编程操作时,对NAND Flash存储介质的实际操作时间Cwrite满足:During this programming operation, the actual operation time Cwrite of the NAND Flash storage medium satisfies:

Cwrite=(T1-T2)*Cw4+Cw1Cwrite=(T1-T2)*Cw4+Cw1

若T1小于T2,停止调整固态硬盘带宽,此时NAND Flash存储介质的读取或编程命令的操作时间采用基本操作时间。对NAND Flash存储介质的读取操作的实际操作时间Cread满足:If T1 is less than T2, stop adjusting the bandwidth of the solid-state hard disk, and at this time, the basic operation time is used for the operation time of reading or programming commands of the NAND Flash storage medium. The actual operation time Cread of the read operation of the NAND Flash storage medium satisfies:

Cread=Cr1Cread=Cr1

对NAND Flash存储介质的编程操作的实际操作时间Cwrite满足:The actual operating time Cwrite of the programming operation of the NAND Flash storage medium satisfies:

Cwrite=Cw1Cwrite=Cw1

图5示出根据本发明实施例的固态硬盘在读取或编程操作中调整操作时间流程图,其步骤包括:Fig. 5 shows a flow chart of adjusting the operating time of a solid-state hard disk in a read or programming operation according to an embodiment of the present invention, the steps of which include:

步骤1:周期性地获取固态硬盘的盘片温度,记为盘片第一温度T1;Step 1: Obtain the disk temperature of the solid-state hard disk periodically, which is recorded as the first temperature T1 of the disk;

步骤2:根据盘片所处的工作环境温度设定盘片的温度起始阈值,记为盘片第二温度T2;Step 2: Set the initial temperature threshold of the disk according to the working environment temperature of the disk, which is recorded as the second temperature T2 of the disk;

步骤3:根据固态硬盘主控芯片的工艺温度上限,设定温度裕量,并计算固态硬盘盘片温度的上限,记为盘片第三温度T3;Step 3: Set the temperature margin according to the process temperature upper limit of the main control chip of the solid-state hard disk, and calculate the upper limit of the disk temperature of the solid-state disk, which is recorded as the third temperature T3 of the disk;

步骤4:从NAND Flash存储介质内部获取读取或编程命令的基本操作时间,分别记为 NAND Flash的第一读取时间Cr1和第一编程时间Cw1;Step 4: Obtain the basic operation time of reading or programming commands from the inside of the NAND Flash storage medium, which are respectively recorded as the first reading time Cr1 and the first programming time Cw1 of NAND Flash;

步骤5:当固态硬盘的盘片第一温度T1升至盘片第三温度T3时,设定NAND Flash存储介质的读取或编程命令最大操作时间,分别记为NAND Flash的第二读取时间Crmax2和第二编程时间Cwmax2;Step 5: When the first temperature T1 of the solid-state disk rises to the third temperature T3 of the disk, set the maximum operating time of the read or program command of the NAND Flash storage medium, which is respectively recorded as the second read time of the NAND Flash Crmax2 and the second programming time Cwmax2;

步骤6:根据Cr1和Crmax2,Cw1和Cwmax2得到NAND Flash存储介质读取或编程操作时,对应命令的操作时间差值,分别记为NAND Flash的第三读取时间Cr3和第三编程时间Cw3;Step 6: According to Cr1 and Crmax2, when Cw1 and Cwmax2 obtain the NAND Flash storage medium read or programming operation, the operating time difference of the corresponding command is recorded as the third reading time Cr3 and the third programming time Cw3 of NAND Flash respectively;

步骤7:根据T2和T3得到固态硬盘的实际温度范围差值,记为盘片第一温度差值T4;Step 7: According to T2 and T3, obtain the actual temperature range difference of the solid-state hard disk, and record it as the first temperature difference T4 of the disk;

步骤8:根据T4和Cr3、T4和Cw3,得到平均每一摄氏度的温度变化所引起的NANDFlash存储介质命令操作时间的变化值,分别记为NAND Flash的第四读取周期Cr4和第四编程周期Cw4;Step 8: According to T4 and Cr3, T4 and Cw3, the change value of the NAND Flash storage medium command operation time caused by the average temperature change of each degree Celsius is recorded as the fourth reading cycle Cr4 and the fourth programming cycle of NAND Flash respectively Cw4;

步骤9:若T1大于等于T2,开始调整固态硬盘带宽,得到T1与T2的差值,并获取本次对NAND Flash存储介质的操作类型,结合Cr4和Cw4分别得到NAND Flash存储介质的读取或编程命令的实际操作时间;本次为读取命令时,对NAND Flash存储介质的读取操作时间Cread满足:Step 9: If T1 is greater than or equal to T2, start to adjust the SSD bandwidth, get the difference between T1 and T2, and get the type of operation on the NAND Flash storage medium this time, combine Cr4 and Cw4 to get the reading or The actual operation time of the programming command; when it is a read command this time, the read operation time Cread of the NAND Flash storage medium satisfies:

Cread=(T1-T2)*Cr4+Cr1Cread=(T1-T2)*Cr4+Cr1

本次编程操作时,对NAND Flash存储介质的实际编程时间Cwrite满足:During this programming operation, the actual programming time Cwrite of the NAND Flash storage medium satisfies:

Cwrite=(T1-T2)*Cw4+Cw1Cwrite=(T1-T2)*Cw4+Cw1

若T1小于T2,停止调整固态硬盘带宽,此时NAND Flash存储介质的读取或编程命令的操作时间采用基本操作时间,对NAND Flash存储介质的读取操作的实际操作时间Cread满足:If T1 is less than T2, stop adjusting the bandwidth of the solid-state hard disk. At this time, the operation time of the read or program command of the NAND Flash storage medium adopts the basic operation time, and the actual operation time Cread of the read operation of the NAND Flash storage medium satisfies:

Cread=Cr1Cread=Cr1

对NAND Flash存储介质的编程操作的实际操作时间Cwrite满足:The actual operating time Cwrite of the programming operation of the NAND Flash storage medium satisfies:

Cwrite=Cw1。Cwrite=Cw1.

Claims (10)

1.一种固态硬盘的高温保护方法,其特征在于,包括以下步骤:1. a high-temperature protection method of solid-state hard disk, is characterized in that, comprises the following steps: 步骤1:温度检测电路检测固态硬盘的盘片温度;Step 1: The temperature detection circuit detects the disk temperature of the solid-state hard disk; 步骤2:设置定时触发温度检测电路;Step 2: Set the timing trigger temperature detection circuit; 步骤3:设置固态硬盘的起始温度阀值;Step 3: Set the initial temperature threshold of the SSD; 步骤4:启动定时触发任务;Step 4: Start the scheduled trigger task; 步骤5:定时获取固态硬盘的实际温度信息;Step 5: Obtain the actual temperature information of the solid state drive regularly; 步骤6:将固态硬盘的实际温度与设定的起始温度阈值进行比较,获取二者的差值;Step 6: Compare the actual temperature of the SSD with the set initial temperature threshold to obtain the difference between the two; 步骤7:依据固态硬盘的实际温度与设定的起始温度阀值间的差值,调整固态硬盘的带宽。Step 7: Adjust the bandwidth of the solid state drive according to the difference between the actual temperature of the solid state drive and the set initial temperature threshold. 2.如权利要求1所述的一种固态硬盘的高温保护方法,其特征在于,所述设置定时触发温度检测电路,包括配置固态硬盘的定时电路的中断周期T1,启动定时器,并以T1为单位周期性地向温度检测电路发送触发信号。2. the high-temperature protection method of a kind of solid-state hard disk as claimed in claim 1, is characterized in that, described setting timing triggers temperature detection circuit, comprises the interruption period T1 of the timing circuit of configuration solid-state hard disk, starts the timer, and with T1 Send a trigger signal to the temperature detection circuit periodically as a unit. 3.如权利要求1所述的一种固态硬盘的高温保护方法,其特征在于,当固态硬盘的实际温度达到设置的温度起始阈值时,开始对固态硬盘进行数据传输带宽限制。3. The high-temperature protection method of a solid-state hard disk as claimed in claim 1, wherein, when the actual temperature of the solid-state hard disk reaches a set temperature initial threshold, the data transmission bandwidth limit of the solid-state hard disk is started. 4.如权利要求1所述的一种固态硬盘的高温保护方法,其特征在于,所述定时任务会周期性地发送触发信号给温度检测电路,并获取温度检测电路反馈的固态硬盘的实际温度。4. the high temperature protection method of a kind of solid-state hard disk as claimed in claim 1, is characterized in that, described timing task can periodically send trigger signal to temperature detection circuit, and obtains the actual temperature of the solid-state hard disk of temperature detection circuit feedback . 5.如权利要求1所述的一种固态硬盘的高温保护方法,其特征在于,通过调整NANDFlash的数据传输带宽来提升或限制固态硬盘带宽。5. The high temperature protection method of a kind of solid-state hard disk as claimed in claim 1, is characterized in that, promote or limit solid-state hard disk bandwidth by adjusting the data transmission bandwidth of NAND Flash. 6.如权利要求6所述的一种固态硬盘的高温保护方法,其特征在于,所述调整NANDFlash的数据传输带宽,包括对NAND Flash控制器中的命令并发通道数量和/或NAND Flash接口的数据吞吐率进行调整。6. the high-temperature protection method of a kind of solid-state hard disk as claimed in claim 6, is characterized in that, the data transmission bandwidth of described adjustment NANDFlash, comprises to the concurrent channel quantity of order in the NAND Flash controller and/or the NAND Flash interface The data throughput rate is adjusted. 7.如权利要求6所述的一种固态硬盘的高温保护方法,其特征在于,所述调整NANDFlash控制器中的命令并发通道数量,包括:当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,减少NAND Flash控制器中的命令并发通道数量;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,增加NANDFlash控制器中的命令并发通道数量;当固态硬盘的实际温度小于起始温度阀值,恢复默认的NAND Flash控制器中的命令并发通道数量。7. the high-temperature protection method of a kind of solid-state hard disk as claimed in claim 6, is characterized in that, described adjusting the command concurrent channel quantity in the NANDFlash controller comprises: when the actual temperature of solid-state hard disk is greater than the initial temperature valve of setting value and higher than the disk temperature value of the previous cycle, reduce the number of concurrent command channels in the NAND Flash controller; when the actual temperature of the solid state drive is greater than the initial temperature threshold and lower than the disk temperature value of the previous cycle , to increase the number of concurrent command channels in the NAND Flash controller; when the actual temperature of the SSD is lower than the initial temperature threshold, restore the default number of concurrent command channels in the NAND Flash controller. 8.如权利要求6所述的一种固态硬盘的高温保护方法,其特征在于,所述调整NANDFlash接口的数据吞吐率,包括:当固态硬盘的实际温度大于设置的起始温度阀值且比上一个周期的盘片温度值要高,降低NAND Flash接口的数据吞吐率;当固态硬盘的实际温度大于起始温度阀值且比上一个周期的盘片温度值要低,提升NAND Flash接口的数据吞吐率;当固态硬盘的实际温度小于起始温度阀值,恢复默认的NAND Flash的数据吞吐率。8. The high-temperature protection method of a kind of solid-state hard disk as claimed in claim 6, is characterized in that, said adjusting the data throughput rate of NANDFlash interface comprises: when the actual temperature of solid-state hard disk is greater than the initial temperature threshold value of setting and is higher than The disk temperature value in the previous cycle is higher, which reduces the data throughput rate of the NAND Flash interface; when the actual temperature of the SSD is greater than the initial temperature threshold and lower than the disk temperature value in the previous cycle, increase the NAND Flash interface. Data throughput rate; when the actual temperature of the SSD is lower than the initial temperature threshold, the default data throughput rate of NAND Flash will be restored. 9.如权利要求8所述的一种固态硬盘的高温保护方法,其特征在于,所述调整NANDFlash接口的数据吞吐率,采用对NAND Flash存储介质的读取或编程命令的操作时间进行调整。9. the high-temperature protection method of a kind of solid-state hard disk as claimed in claim 8, is characterized in that, the data throughput rate of described adjustment NAND Flash interface, adopts the operation time of reading or programming order to NAND Flash storage medium to adjust. 10.如权利要求9所述的一种固态硬盘的高温保护方法,其特征在于,所述调整NANDFlash存储介质的业务操作时间包括:10. the high-temperature protection method of a kind of solid-state hard disk as claimed in claim 9, is characterized in that, the service operating time of described adjustment NAND Flash storage medium comprises: 步骤1:周期性地获取固态硬盘的盘片温度,记为盘片第一温度T1;Step 1: Obtain the disk temperature of the solid-state hard disk periodically, which is recorded as the first temperature T1 of the disk; 步骤2:根据盘片所处的工作环境温度设定盘片的温度起始阈值,记为盘片第二温度T2;Step 2: Set the initial temperature threshold of the disk according to the working environment temperature of the disk, which is recorded as the second temperature T2 of the disk; 步骤3:根据固态硬盘主控芯片的工艺温度上限,设定温度裕量,并计算固态硬盘盘片温度的上限,记为盘片第三温度T3;Step 3: Set the temperature margin according to the process temperature upper limit of the main control chip of the solid-state hard disk, and calculate the upper limit of the disk temperature of the solid-state disk, which is recorded as the third temperature T3 of the disk; 步骤4:从NAND Flash存储介质内部获取读取或编程命令的基本操作时间,分别记为NAND Flash的第一读取时间Cr1和第一编程时间Cw1;Step 4: Obtain the basic operation time of reading or programming commands from the inside of the NAND Flash storage medium, which are respectively recorded as the first reading time Cr1 and the first programming time Cw1 of NAND Flash; 步骤5:当固态硬盘的盘片第一温度T1升至盘片第三温度T3时,设定NAND Flash存储介质的读取或编程命令最大操作时间,分别记为NAND Flash的第二读取时间Crmax2和第二编程时间Cwmax2;Step 5: When the first temperature T1 of the solid-state disk rises to the third temperature T3 of the disk, set the maximum operating time of the read or program command of the NAND Flash storage medium, which is respectively recorded as the second read time of the NAND Flash Crmax2 and the second programming time Cwmax2; 步骤6:根据Cr1和Crmax2,Cw1和Cwmax2得到NAND Flash存储介质读取或编程操作时,对应命令的操作时间差值,分别记为NAND Flash的第三读取时间Cr3和第三编程时间Cw3;Step 6: According to Cr1 and Crmax2, when Cw1 and Cwmax2 obtain the NAND Flash storage medium read or programming operation, the operating time difference of the corresponding command is recorded as the third reading time Cr3 and the third programming time Cw3 of NAND Flash respectively; 步骤7:根据T2和T3得到固态硬盘的实际温度范围差值,记为盘片第一温度差值T4;Step 7: According to T2 and T3, obtain the actual temperature range difference of the solid-state hard disk, and record it as the first temperature difference T4 of the disk; 步骤8:根据T4和Cr3、T4和Cw3,得到平均每一摄氏度的温度变化所引起的NAND Flash存储介质命令操作时间的变化值,分别记为NAND Flash的第四读取周期Cr4和第四编程周期Cw4;Step 8: According to T4 and Cr3, T4 and Cw3, the change value of the command operation time of the NAND Flash storage medium caused by the temperature change of each degree Celsius is obtained, which is respectively recorded as the fourth reading cycle Cr4 and the fourth programming of NAND Flash cycle Cw4; 步骤9:若T1大于等于T2,开始调整固态硬盘带宽,得到T1与T2的差值,并获取本次对NAND Flash存储介质的操作类型,结合Cr4和Cw4分别得到NAND Flash存储介质的读取或编程命令的实际操作时间;本次为读取命令时,对NAND Flash存储介质的读取操作时间Cread满足:Step 9: If T1 is greater than or equal to T2, start to adjust the SSD bandwidth, get the difference between T1 and T2, and get the type of operation on the NAND Flash storage medium this time, combine Cr4 and Cw4 to get the reading or The actual operation time of the programming command; when it is a read command this time, the read operation time Cread of the NAND Flash storage medium satisfies: Cread=(T1-T2)*Cr4+Cr1;Cread=(T1-T2)*Cr4+Cr1; 本次编程操作时,对NAND Flash存储介质的实际编程时间Cwrite满足:During this programming operation, the actual programming time Cwrite of the NAND Flash storage medium satisfies: Cwrite=(T1-T2)*Cw4+Cw1;Cwrite=(T1-T2)*Cw4+Cw1; 若T1小于T2,停止调整固态硬盘带宽,此时NAND Flash存储介质的读取或编程命令的操作时间采用基本操作时间,对NAND Flash存储介质的读取操作的实际操作时间Cread满足:If T1 is less than T2, stop adjusting the bandwidth of the solid-state hard disk. At this time, the operation time of the read or program command of the NAND Flash storage medium adopts the basic operation time, and the actual operation time Cread of the read operation of the NAND Flash storage medium satisfies: Cread=Cr1;Cread=Cr1; 对NAND Flash存储介质的编程操作的实际操作时间Cwrite满足:The actual operating time Cwrite of the programming operation of the NAND Flash storage medium satisfies: Cwrite=Cw1。Cwrite=Cw1.
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