CN108040421A - Flexible circuit board, manufacturing method thereof and electronic equipment - Google Patents

Abstract

The present application provides a flexible circuit board and a manufacturing method thereof, and an electronic device. The flexible circuit board includes a substrate layer, a gold finger structure, and a reinforcement structure. The substrate layer is made of a flexible material; the gold finger structure includes a copper layer and a conductive layer. The copper layer is arranged on the substrate layer, and the conductive layer is arranged in at least a part of the copper layer. The conductive layer is used to electrically connect the copper layer with other components; the reinforcement structure is arranged on the substrate layer and at opposite ends of the conductive layer to strengthen the strength of the copper layer in the area where the conductive layer is located. The reinforcement structure of the present application effectively protects the gold finger structure of the flexible circuit board and avoids the brittle fracture of the gold finger structure.

Description

A kind of flexible circuit board and its manufacturing method, electronic equipment

technical field

The present application relates to the technical field of flexible circuit boards, in particular to a flexible circuit board, a manufacturing method thereof, and electronic equipment.

Background technique

Because flexible circuit boards are soft, more and more light and thin electronic devices are beginning to use flexible circuit boards to replace some traditional hard circuit boards. The device is electrically connected. However, due to the brittle nature of copper, this leads to the risk of brittle fracture of the gold finger structure during the insertion and removal process, which in turn affects the normal use of electronic devices.

Contents of the invention

The application provides a flexible circuit board, the flexible circuit board includes a base material layer, a gold finger structure and a reinforcement structure, the material of the base material layer is a flexible material; the gold finger structure includes a copper layer and a conductive layer, and the copper layer is arranged on the base On the material layer, the conductive layer is arranged on at least part of the copper layer, and the conductive layer is used to electrically connect the copper layer to other components; the reinforcement structure is arranged on the base material layer and at opposite ends of the conductive layer to strengthen the electrical conductivity The strength of the copper layer in the area where the layer is located.

The present application also provides a method for manufacturing a flexible circuit board, the method comprising: preparing a base material layer; making a gold finger structure, first forming a copper layer on the base material layer, and then setting a conductive layer on at least a part of the copper layer, The conductive layer is used to electrically connect the copper layer with other electronic components; reinforcing structures are arranged on the substrate layer and opposite ends of the conductive layer to strengthen the strength of the copper layer in the area where the conductive layer is located.

The present application also provides an electronic device, including the above-mentioned flexible circuit board.

The flexible circuit board provided by the present application can effectively prevent the golden finger structure from being brittle and break, and improve the service life of the flexible circuit board.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained based on these drawings without creative effort.

Fig. 1 is a schematic cross-sectional structure diagram of an embodiment of the flexible circuit board of the present application;

Fig. 2 is a top view of an embodiment of the flexible circuit board of the present application;

Fig. 3 is a schematic cross-sectional structure diagram of another embodiment of the flexible circuit board of the present application;

Fig. 4 is a schematic flow diagram of an embodiment of a method for manufacturing a flexible circuit board of the present application;

Fig. 5 is a structural diagram of an embodiment of the electronic device of the present application.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application. In addition, it should be noted that, for the convenience of description, only some structures related to the present application are shown in the drawings but not all structures. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of this application.

The electronic devices provided in the embodiments of the present application include electronic devices such as smart phones, tablet computers, smart wearable devices, digital audio and video players, e-readers, handheld game consoles, and vehicle-mounted electronic devices.

The terms "first" and "second" in this application are only used for descriptive purposes, and should not be understood as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include at least one of these features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. All directional indications (such as up, down, left, right, front, back...) in the embodiments of the present application are only used to explain the relative positional relationship between the various components in a certain posture (as shown in the drawings) , sports conditions, etc., if the specific posture changes, the directional indication also changes accordingly. Furthermore, the terms "include" and "have", as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device comprising a series of steps or components is not limited to the listed steps or components, but optionally also includes unlisted steps or components, or optionally also includes Other steps or components inherent to the process, method, product or apparatus are included.

Reference herein to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitly by those skilled in the art that the embodiments described herein can be combined with other embodiments.

At present, electronic equipment is becoming thinner and lighter, and the positions of electronic components are becoming more and more concentrated. In order to electrically connect electronic components in different positions, electronic equipment has begun to use flexible circuit boards to solve this problem. However, the disadvantage of the golden finger structure of the flexible circuit board is that it is easy to break, which leads to failure of the flexible circuit board. In order to solve this technical problem, the present application proposes the following technical solutions.

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a schematic cross-sectional structure diagram of an embodiment of the flexible circuit board 10 of the present application, and FIG. 2 is a top view of an embodiment of the flexible circuit board 10 of the present application.

The flexible circuit board 10 may include, but is not limited to, a substrate layer 12 , a gold finger structure 14 and a reinforcement structure 16 . The gold finger structure 14 is disposed on the substrate layer 12. The gold finger structure 14 is used to electrically connect the flexible circuit board 10 with other components, and the components may include electronic components or electronic parts such as circuit boards. The reinforcement structure 16 is arranged on the base material layer 12 and at opposite ends of the gold finger structure 14. The reinforcement structure 16 is used to strengthen the strength of the gold finger structure 14 area, so as to prevent the gold finger structure 14 from being brittle during the insertion and extraction process, thereby affecting the Normal use of the flexible circuit board 10 .

The flexible circuit board 10 can be a single-layer circuit board, the flexible circuit board 10 can also be a double-layer circuit board, and the flexible circuit board 10 can also be a multi-layer circuit board with at least two layers, such as 3, 4 or 5, etc. . In this embodiment, the flexible circuit board 10 is described as an example of a double-layer circuit board. Correspondingly, the gold finger structures 14 are arranged on opposite sides of the base material layer 12, and the reinforcing structure 16 is also arranged on the base material layer 12. opposite two sides, and at opposite ends of the golden finger structure 14 .

The substrate layer 12 is made of a flexible material, and the substrate layer 12 is used to bear other material layers of the flexible circuit board 10 , such as a copper layer 142 , an adhesive layer or a cover film layer and the like. The substrate layer 12 made of flexible material can make the flexible circuit board 10 meet the purpose of flexible folding. The material of the substrate layer 12 may be polyimide, which has excellent thermal stability, chemical corrosion resistance and mechanical properties. Specifically, the flexural strength of graphite or glass fiber reinforced polyimide can reach 345Mpa, and the flexural modulus can reach 20GPa, which has relatively high tensile strength. The material of the base material layer 12 can also be polyester (polyester). Polyester has excellent mechanical properties, high rigidity, hardness and toughness, puncture resistance, friction resistance, high temperature and low temperature resistance, chemical resistance, oil resistance, air tightness and heat preservation. It has good fragrance and is one of the commonly used barrier composite film substrates.

The gold finger structure 14 may include, but is not limited to, a copper layer 142 and a conductive layer 144 . The copper layer 142 is disposed on the substrate layer 12 . The copper layer 142 is used to form the circuit structure of the flexible circuit board 10 . The conductive layer 144 is disposed on at least a partial area of the copper layer 142 away from the substrate layer 12 , and at least a partial area of the copper layer 142 is exposed, for conducting the circuit of the flexible circuit board 10 with the outside. However, the copper of the bare structure is easily oxidized by air outside, resulting in poor contact of the flexible circuit board 10, so a conductive layer 144 is provided on the copper of the bare structure, and the conductive layer 144 is used to electrically connect the copper layer 142 with other electronic components. , and has its own antioxidant capacity. The material of the conductive layer 144 can be gold, the material of the conductive layer 144 can also be silver, and the material of the conductive layer 144 can also be made of other materials with excellent electrical conductivity and strong oxidation resistance. Within the scope that those skilled in the art can understand, at least some areas of the copper layer 142 may not be provided with the conductive layer 144, but simply conduct electricity through the exposed copper structure, in order to avoid poor contact caused by copper oxidation. occurs, the exposed copper can be periodically deoxidized and cleaned.

The flexible circuit board 10 is installed in the electronic device, and is electrically connected with electronic components or circuit boards at different positions in the electronic device by means of plugging and unplugging the golden finger structure 14 . Because the gold finger structure 14 is formed by adding a conductive layer 144 to at least a partial area of the copper layer 142 on the base layer 12, the copper has low strength and is brittle, so it is easy to break during the insertion and extraction process of the gold finger structure 14. Specifically, since the end of the gold finger structure 14 has no reinforcement support, it is most likely to be broken, which makes the flexible circuit board 10 invalid. Reinforcement structures 16 are provided at opposite ends of the gold finger structure 14 to enhance the local strength of the gold finger structure 14, thereby solving the problem that the gold finger structure 14 is easily broken during the insertion and removal process.

The manufacturing process of the flexible circuit board 10: prepare the substrate layer → copper foil cutting → CNC drilling → copper plating → front side treatment → dry film pressing → exposure → development → etching → film stripping → grinding process → intermediate inspection → cover film stamping → Printing holes for solder mask→hot pressing cover film→printing solder mask ink→gold-plating solder pads→printing text→attaching reinforcement board→punching product shape→comprehensive quality inspection. Each step is described as follows:

Prepare the substrate layer 12: the substrate layer is used to carry other materials;

Copper foil cutting: Use a cutting machine to cut the rolled copper foil into semi-finished copper foil of the required size, and attach the semi-finished copper foil to the substrate layer;

CNC drilling through holes: use CNC machines to open holes on the copper foil;

Copper plating: electroplating the through holes on the copper foil, so that the inner layer of the through holes is electroplated with copper to realize the electrified connection of the inner and outer circuits of the copper foil;

Front treatment: use chemical methods to remove oxides and pollutants on the surface of copper foil, so that the surface of copper foil can meet the roughness required for subsequent dry film application;

Press dry film and exposure: Laminate photosensitive dry film on copper foil, then irradiate with ultraviolet light to form lines on dry film;

Development: wash away the dry film that has not been irradiated by ultraviolet light, and retain the dry film that has been polymerized by ultraviolet light to basically shape the circuit;

Etching and stripping: At a temperature of 40-55 degrees Celsius, the etching liquid is evenly sprayed through the nozzle to corrode the surface of the copper foil to remove the unprotected copper foil, thereby forming a line on the substrate layer and peeling off the dry film;

Grinding process: grinding the above-mentioned copper foil that has been etched;

Intermediate inspection: check whether the line is good;

Cover film stamping: paste the cover film on the surface of the copper foil, and then punch out the shape of the circuit board;

Solder resist printing holes: processing of positioning holes for ink printing;

Hot pressing cover film: heat and press the cover film and copper foil;

Solder resist ink printing: Cover the board with a layer of photosensitive solder resist ink, which can protect the board surface in the subsequent process, prevent the oxidation of lines and copper surfaces, and have the functions of solder resistance and solder limit;

Gold finger plating: use the electroplating reaction principle to plate nickel and gold on at least part of the copper layer;

Printed text: Print text symbols or numbers on the surface of the finished circuit board to indicate the position of the various parts assembled, such as: R stands for resistors, C stands for capacitors;

Paste the reinforcement board: attach the reinforcement board to the semi-finished flexible circuit board on the special fixture;

Punched product shape: remove excess material to obtain a flexible circuit board;

Comprehensive quality inspection: inspect the flexible circuit board as a whole, including electrical and appearance.

The material of the reinforcing structure 16 can be copper, and it is completed when the copper layer 142 circuit is made in the steps of pressing dry film, exposure, development, etching and stripping in the process of making the flexible circuit board 10, so that it can be completed without additional processes. , the reinforced structure 16 is produced, which greatly improves the production efficiency. In addition, the copper reinforced structure 16 can increase the strength of the gold finger structure 14 area, and the thickness can be controlled to be very thin, which will not affect the gold finger. For normal plugging and unplugging of the structure 14, the thickness can be controlled above 0.03mm, such as 0.03mm, 0.05mm, 0.10mm, 0.12mm, 0.14mm, 0.20mm, 0.30mm or 0.50mm and so on. Of course, the copper reinforcing structure 16 can also be fabricated as a single step, which is not limited in this application. The gold finger structure 14 area of the flexible circuit board 10 is not protected by a covering film, so it is easy to be brittle in the process of plugging and unplugging. The reinforcement structure 16 mainly solves the problem of low mechanical strength of the gold finger structure 14 area of the flexible circuit board 10, improving The strength of the insertion part prevents the golden finger structure 14 from being brittle.

In order to enhance the toughness of the gold finger structure 14 region of the flexible circuit board 10, a cover film 18 can be arranged on the reinforcing structure 16 away from the base material layer 12 side, and the cover film 18 can be carried out in the step of stamping the cover film 18, greatly improving In order to improve production efficiency, of course, the cover film 18 structure can also be fabricated as a single step, which is not limited in this application.

Please refer to FIG. 3 . FIG. 3 is a schematic cross-sectional structure diagram of another embodiment of the flexible circuit board 10 of the present application.

The reinforcing structure 16 can also be a reinforcing plate of the flexible circuit board 10, and the step of pasting the reinforcing plate in the process of manufacturing the flexible circuit board 10 is completed, so that the reinforcing structure 16 can be produced without additional processes, greatly improving the performance of the flexible circuit board 10. The production efficiency is improved. Of course, the reinforcement structure 16 can also be manufactured as a single step, which is not limited in this application. The reinforcement structure 16 serves as a reinforcement to improve the strength of the gold finger structure 14 area, thereby preventing brittle fracture at this position. In addition, the increased strength of the gold finger structure 14 area also facilitates the insertion and removal of the gold finger structure 14 . The reinforcing structure 16 and the covering film 18 of the flexible circuit board 10 are connected by a thermosetting adhesive. The thermosetting adhesive is solid at normal temperature and has no viscosity, but when the temperature rises to a certain level, it will transform into a highly viscous semi-cured state, at this time, the cover film 18 and the reinforcing structure 16 are adhered. The reinforcement structure 16 is equipped with a layer of thermosetting adhesive. Align the side of the reinforcement structure 16 coated with the thermosetting adhesive with the flexible circuit board 10 bonding position, and then iron the reinforcement structure 16 with an electric soldering iron for about 1 to 2 seconds to perform single-point positioning. , and finally carry out hot pressing, that is, high temperature and high pressure, so that the entire surface of the thermosetting adhesive can be completely flowed and bonded. In order to prevent the reinforcement structure 16 from being separated from the flexible circuit board 10, the two can be baked in a baking oven to further cure the glue.

The reinforcing plate of the reinforcing structure 16 may be made of insulating materials such as polyimide or glass fiber. The polyimide reinforced structure 16 has high temperature resistance, and the general thickness is 25 μm, 50 μm, 75 μm, 100 μm, 125 μm, 150 μm, 175 μm, 200 μm, 225 μm, 250 μm, 275 μm, 300 μm, 350 μm, 475 μm, etc. The glass fiber reinforced structure 16 has a thickness of 100 μm, 150 μm, 200 μm, 250 μm, 300 μm, 350 μm, 400 μm, 450 μm, 500 μm, 600 μm, 700 μm, 800 μm, 900 μm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm , 1.6mm, 1.7m, 1.8mm, 1.9mm, 2.0mm, 2.2mm, 2.4mm, 2.5mm, 2.5mm, 3mm, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 15mm,

20mm, 25mm, 30mm, 35mm, 40mm, 45mm, 50mm, 55mm,

60mm, 65mm, 70mm, 75mm, 80mm, 85mm, 90mm, 100mm, etc., glass fiber reinforced structure 16 is divided into high temperature resistant glass fiber reinforced structure 16, flame retardant glass fiber reinforced structure 16, ablation resistant glass fiber reinforced structure 16, high High-strength glass fiber reinforced structure 16 , high toughened glass fiber reinforced structure 16 and antistatic glass fiber reinforced structure 16 .

The reinforcing plate of the reinforcing structure 16 can be made of metal materials such as aluminum foil or stainless steel. The aluminum foil reinforced structure 16 has better heat dissipation and can be used in places with higher heat dissipation requirements, such as desk lamps and the like. The stainless steel reinforcing structure 16 is not easily deformed and has high strength, which can effectively protect the flexible circuit board 10 . The stainless steel reinforced structure 16 can be made by stamping with a die, and has stable dimensions and high production efficiency. Further, the stainless steel reinforced structure 16 can be made by chemical etching, which avoids the occurrence of burrs on the stainless steel reinforced structure 16. The chemical etching of the stainless steel reinforced structure 16 is to coat a protective layer on the surface of the stainless steel, and let the strong acid solution corrode the unprotected places to obtain our The required stainless steel reinforcement structure 16, because the whole process is a chemical reaction without physical process, effectively avoids the occurrence of burrs on the stainless steel reinforcement structure 16.

When the reinforcement plate of the reinforcement structure 16 is made of metal material, the reinforcement structure 16 must be grounded to prevent the static electricity concentration of the reinforcement structure 16 from affecting the flexible circuit board 10 or other electronic components in the electronic device. In this embodiment, the reinforced structure 16 is electrically connected to the exposed copper by opening the exposed copper on the flexible circuit board 10 , so as to realize the grounding of the reinforced structure 16 and prevent the concentration of static electricity on the reinforced structure 16 .

There are many ways to electrically connect the reinforcing structure 16 to the exposed copper. For example, 1: the reinforcing structure 16 is electrically connected to the exposed copper through conductive glue to achieve the purpose of grounding the reinforcing structure 16; 2: the reinforcing structure 16 is provided with a cutting Corner, connect the cut corner and the exposed copper through solder paste, so that the reinforcing structure 16 is electrically connected to the exposed copper; 3: The rigid reinforcement board is provided with a through hole corresponding to the exposed copper, and the through hole can be circular or square, The silver paste is poured into the through hole, and after the silver paste is cooled, the reinforcing structure 16 can be electrically connected to the exposed copper, so that the reinforcing structure 16 is electrically connected to the exposed copper, and so on. Other ways to electrically connect the reinforcing structure 16 to the exposed copper will not be repeated here.

The reinforcing structure 16 can also be an ink layer, and the material of the ink layer can be solder resist ink, then the reinforcing structure 16 is manufactured in the solder resist ink printing step in the process of manufacturing the flexible circuit board 10 . The material of the ink layer can also be text ink, and the reinforcement structure 16 is completed in the printing text step in the process of making the flexible circuit board 10, so that the reinforcement structure 16 can be produced without additional processes, which greatly improves production efficiency. Of course, the reinforcement structure 16 made of ink material can also be manufactured as a single step, which is not limited in this application. Wherein, the thickness of the ink layer may be 10um to 100um, for example: 10um, 20um, 30um, 40um, 50um, 60um, 70um, 80um, 90um and 100um.

Please refer to FIG. 4 . FIG. 4 is a schematic flowchart of an embodiment of a manufacturing method of the flexible circuit board 10 of the present application.

M401, prepare the substrate layer 12.

The substrate layer 12 is made of flexible material, and the substrate layer 12 is used to bear other material layers of the flexible circuit board 10 , such as copper layer 142 , glue layer or cover film layer and so on. The substrate layer 12 made of flexible material can make the flexible circuit board 10 meet the purpose of flexible folding. The material of the substrate layer 12 may be polyimide, which has excellent thermal stability, chemical corrosion resistance and mechanical properties. Specifically, the flexural strength of graphite or glass fiber reinforced polyimide can reach 345Mpa, and the flexural modulus can reach 20GPa, which has relatively high tensile strength. The material of the base material layer 12 can also be polyester (polyester), which has excellent mechanical properties, high rigidity, hardness and toughness, puncture resistance, friction resistance, high temperature and low temperature resistance, chemical resistance, oil resistance, air tightness and heat preservation. It has good fragrance and is one of the commonly used barrier composite film substrates.

M402, to make the gold finger structure 14, first make the copper layer 142 on the base material layer 12, and then set the conductive layer 144 on at least part of the copper layer 142, the conductive layer 144 is used to electrically connect the copper layer 142 to other components .

Copper foil cutting: Use a cutting machine to cut the coiled copper foil into semi-finished copper foil of the required size; CNC drilling through holes: use a CNC machine to open holes on the copper foil; Copper plating: Electroplating the through holes on the copper foil , so that the inner layer of the through hole is electroplated with copper to realize the electrical connection of the inner and outer layers of the copper foil; front side treatment: use chemical methods to remove oxides and pollutants on the surface of the copper foil, so that the surface of the copper foil can meet the needs of the subsequent dry film Roughness of dry film; pressing dry film and exposure: lamination of photosensitive dry film on copper foil, and then irradiating with ultraviolet light to form lines on the dry film; development: washing away the dry film not irradiated by ultraviolet light, retaining the dry film exposed to ultraviolet light Light irradiates the dry film that undergoes polymerization to basically shape the circuit; etching and stripping: at a temperature of 40-55 degrees Celsius, the etching liquid is evenly sprayed on the surface of the copper foil through the nozzle to corrode the unprotected copper foil, thereby Form the circuit on the copper foil and peel off the dry film; grinding process: grind the copper foil that has been etched above; intermediate inspection: check whether the circuit is good; cover film stamping: paste the cover film on the surface of the copper foil, and then punch out The shape of the circuit board; Solder resist printing holes: processing of positioning holes for ink printing; Hot pressing cover film: Heat and press the cover film and copper foil; Solder resist ink printing: Cover a layer of photosensitive type on the board surface Solder resist ink, which can protect the board surface in the subsequent process, prevent the oxidation of lines and copper surfaces, and have the functions of solder resistance and solder limit; gold finger 14 gold plating: use the principle of electroplating reaction to plate nickel and gold 144 on at least part of the area on the copper layer 142; printed text: print text symbols or numbers on the surface of the finished circuit board to indicate the position of the various parts assembled, such as: R stands for resistors, C stands for capacitors; Attach the reinforcement board to the semi-finished product of the flexible circuit board 10 on the tool; punch the product shape: remove the excess material to obtain the flexible circuit board 10; comprehensive quality inspection: inspect the flexible circuit board 10 as a whole, including electrical and appearance.

M403 , on the substrate layer 12 and at opposite ends of the conductive layer 144 , a strengthening structure 16 is provided to strengthen the strength of the copper layer 142 in the region where the conductive layer 144 is located.

Please refer to FIG. 1 at the same time. Optionally, the material of the reinforcing structure 16 can be copper, which is completed when the copper layer 142 circuit is made in the steps of pressing dry film, exposure, development, etching and stripping in the process of making the flexible circuit board 10. In this way, the reinforcement structure 16 can be produced without additional processes, which greatly improves the production efficiency. In addition, the thickness of the copper reinforcement structure 16 can be controlled under the premise of increasing the strength of the gold finger structure 14 region. Very thin, so that it will not affect the normal plug-in and use of the golden finger structure 14, the thickness can be controlled above 0.03mm, such as 0.03mm, 0.05mm, 0.10mm, 0.12mm, 0.14mm, 0.20mm, 0.30mm or 0.50mm and many more. Of course, the copper reinforcing structure 16 can also be fabricated as a single step, which is not limited in this application.

Among them, in order to enhance the toughness of the gold finger structure 14 region of the flexible circuit board 10, a cover film 18 can be provided on the side of the reinforcing structure 16 away from the base material layer 12, and the cover film 18 can be carried out in the step of stamping the cover film 18, greatly The production efficiency is greatly improved. Of course, the covering film 18 structure can also be manufactured as a single step, which is not limited in this application.

Please also refer to FIG. 3 . Optionally, the reinforcing structure 16 is a reinforcing plate of the flexible circuit board 10 , and the step of pasting the reinforcing plate in the process of manufacturing the flexible circuit board 10 is completed to improve the manufacturing efficiency of the flexible circuit board 10 .

Further, the reinforcement structure 16 is connected to the flexible circuit board 10 through thermosetting glue.

Optionally, the material of the reinforcing structure 16 includes polyimide or glass fiber.

Optionally, the material of the reinforcing structure 16 includes stainless steel.

Further, the reinforcing structure 16 is made by stamping or chemical etching.

Furthermore, the flexible circuit board 10 is provided with exposed copper, and the reinforcing structure 16 is electrically connected to the exposed copper, so as to realize the grounding of the reinforcing structure 16 and prevent static electricity concentration on the reinforcing structure 16 .

Further, the rigid reinforcement structure 16 is electrically connected to the exposed copper through conductive glue; or

The reinforcement structure 16 is provided with cut corners, and the cut corners are used for soldering solder paste, so that the reinforcement structure 16 is electrically connected to the exposed copper; or the reinforcement structure 16 is provided with through holes corresponding to the exposed copper, and the through holes are used for filling silver paste. In order to electrically connect the reinforcing structure 16 to the exposed copper.

Please refer to FIG. 5 . FIG. 5 is a structural diagram of an embodiment of the electronic device of the present application.

The electronic equipment includes a front shell assembly 20, a rear shell assembly 30 and the flexible circuit board 10 of any of the above-mentioned embodiments, the front shell assembly 20 and the rear shell assembly 30 are connected to each other to form a closed space, and the flexible circuit board 10 assembly is accommodated in the closed space Electrically connect the circuit board or electronic components in the electronic equipment, so that the electronic equipment can realize different functions.

The above is only the implementation of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process conversion made by using the specification and drawings of the application, or directly or indirectly used in other related technologies fields, are all included in the scope of patent protection of this application in the same way.

Claims (10)

1. A kind of 1. flexible PCB, it is characterised in that including：

   Substrate layer, the material of the substrate layer is flexible material；

   Golden finger structure, including layers of copper and conductive layer, the layers of copper are arranged on the substrate layer, and the conductive layer is arranged on institute At least part region of layers of copper is stated, the conductive layer is used to the layers of copper and other components being electrically connected；

   Reinforcement structure, is arranged on the substrate layer and in the opposite end of the conductive layer, where strengthening the conductive layer The intensity of the layers of copper in region.
2. 2. flexible PCB according to claim 1, it is characterised in that

   The flexible PCB is double-layer circuit board, and accordingly, the reinforcement structure is arranged at the opposite sides of the substrate layer.
3. 3. flexible PCB according to claim 2, it is characterised in that

   The material of the substrate layer is polyimides or terylene, and the material of the reinforcement structure is copper, and the reinforcement structure is remote Cover layer is set from the substrate layer side, the cover layer is used for the toughness for strengthening the reinforcement structure.
4. 4. flexible PCB according to claim 2, it is characterised in that

   The material of the reinforcement structure includes stainless steel.
5. 5. flexible PCB according to claim 4, it is characterised in that

   The reinforcement structure is made of mould punching or chemical etching.
6. 6. flexible PCB according to claim 5, it is characterised in that

   The flexible PCB offers dew copper, and the reinforcement structure is electrically connected with the dew copper, to realize that the reinforcement is tied The ground connection of structure.
7. 7. flexible PCB according to claim 6, it is characterised in that

   The reinforcement structure is set to be electrically connected with the dew copper by conducting resinl；Or

   The reinforcement structure is provided with corner cut, and the corner cut is used to weld tin cream, so that the reinforcement structure and the dew copper electricity Property connection；Or

   The reinforcement structure is provided with through hole corresponding with the dew copper, and the through hole is used to fill silver paste, so that described strengthen knot Structure is electrically connected with the dew copper.
8. A kind of 8. production method of flexible PCB, it is characterised in that

   Prepare substrate layer；

   Golden finger structure is made, layers of copper is first made on the substrate layer, is then set at least part region of the layers of copper Conductive layer, the conductive layer are used to the layers of copper and other electronic components being electrically connected；

   Reinforcement structure is set on the substrate layer and in the opposite end of the conductive layer, to strengthen the conductive layer location The intensity of the layers of copper in domain.
9. 9. according to the method described in claim 8, it is characterized in that,

   The material of the reinforcement structure is copper, and the layers of copper and the reinforcement structure make in same step, to reduce State the cost of manufacture of flexible PCB.
10. 10. a kind of electronic equipment, it is characterised in that including：

    Claim 1 to 7 any one of them flexible PCB.