CN108024471A - Circuit module structure - Google Patents
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- CN108024471A CN108024471A CN201610971082.3A CN201610971082A CN108024471A CN 108024471 A CN108024471 A CN 108024471A CN 201610971082 A CN201610971082 A CN 201610971082A CN 108024471 A CN108024471 A CN 108024471A
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- 239000004020 conductor Substances 0.000 claims abstract description 173
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 210000001503 joint Anatomy 0.000 abstract 1
- 238000012423 maintenance Methods 0.000 abstract 1
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- 230000004308 accommodation Effects 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/023—Stackable modules
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/026—Multiple connections subassemblies
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Abstract
Description
技术领域technical field
本发明涉及一种电路模块,具体而言指一种能以多样态进行立体堆栈的电路模块构造。The invention relates to a circuit module, in particular to a circuit module structure capable of three-dimensional stacking in multiple forms.
背景技术Background technique
现有的电路模块欲进行链接时,主要在各电路模块的端面设置磁铁,以通过磁铁相吸而连结成串,如美国专利US2013/0343025A1。然而,不仅由于磁铁的吸力有限,从而有容易脱离的问题,更由于此种电路模块无法进行上下堆栈及侧向连接,导致变化性较少。When the existing circuit modules are to be connected, magnets are mainly provided on the end faces of the circuit modules so as to be connected in series by magnets attracting each other, such as US2013/0343025A1. However, not only is there a problem of easy detachment due to the limited attractive force of the magnet, but also because this kind of circuit module cannot be stacked up and down and connected sideways, resulting in less variability.
因此,本案发明人为克服以上问题,已发明出一种电路模块系统,如中国专利CN204927641U(美国相应公开号US2016/0192492A1),主要以一电路板及一连接座构成一电路模块,该连接座具有一座体及一导体,该导体嵌接于该座体上,再将该座体结合于该电路板上,使该导体与该电路板电性导通,并在该座体上设置凹槽,以通过该凹槽与另一电路模块上的榫进行插接,以使两个电路模块上的导体能电性导通。Therefore, in order to overcome the above problems, the inventor of this case has invented a circuit module system, such as the Chinese patent CN204927641U (the US corresponding publication number US2016/0192492A1), which mainly constitutes a circuit module with a circuit board and a connecting seat. a seat and a conductor, the conductor is embedded in the seat, and then the seat is combined with the circuit board, the conductor is electrically connected to the circuit board, and a groove is provided on the seat, It can be inserted into the tenon on another circuit module through the groove, so that the conductors on the two circuit modules can be electrically connected.
然而,由于此种电路模块的导体嵌设于座体上,而座体由两片外壳并接而成,因此整体所需要的元件较多,从而有制造成本较高的问题,况且由于元件多便会导致组装上的步骤增加,组装麻烦。另外,由于导体必须先嵌设在座体上,再将座体与电路板结合,在使用及组合过程中,座体会相对于电路板运动,使得导体与电路板的电路间的接触容易受座体与电路板间的相互运动所影响,使得导电不佳,或者有易磨损的问题。However, since the conductors of this type of circuit module are embedded on the base body, and the base body is formed by connecting two shells in parallel, there are many components required as a whole, which leads to the problem of high manufacturing cost. It will lead to an increase in the steps of assembling, and the assembling is troublesome. In addition, since the conductor must first be embedded on the base, and then the base is combined with the circuit board, the base will move relative to the circuit board during use and assembly, so that the contact between the conductor and the circuit of the circuit board is easily affected by the base. Affected by the mutual movement with the circuit board, the conductivity is not good, or there is a problem of easy wear.
发明内容Contents of the invention
为了解决上述问题,本发明提供了一种电路模块构造,包含有至少一个第一电路模块,第一电路模块具有一第一电路板、一第一桥接座及一第二桥接座,其中:该第一电路板具有一第一基板、一第一母导体及一第一公导体,该第一基板具有一第一凸接部及一第二凸接部,该第一母导体设于该第一凸接部上,该第一公导体设于该第二凸接部上;该第一桥接座为一体制成,该第一桥接座底侧具有一第一容置槽,该第一容置槽具有两个侧壁,该两个侧壁开设有相对的两个第一嵌接槽,该第一桥接座外侧具有一第一外侧槽;该第二桥接座为一体制成,该第二桥接座底侧具有一第二容置槽,该第二容置槽具有两个侧壁,该两个侧壁开设有相对的两个第二嵌接槽,该第二桥接座外侧具有一第二外侧柱;该第一电路板的第一凸接部嵌接于该第一桥接座的两个第一嵌接槽中,该第一母导体位于该第一容置槽内,该第一电路板的第二凸接部嵌接于该第二桥接座的两个第二嵌接槽中,该第一公导体位于该第二容置槽内。In order to solve the above problems, the present invention provides a circuit module structure, including at least one first circuit module, the first circuit module has a first circuit board, a first bridging seat and a second bridging seat, wherein: the The first circuit board has a first substrate, a first female conductor and a first male conductor, the first substrate has a first protruding part and a second protruding part, the first female conductor is arranged on the first The first male conductor is arranged on the second convex portion; the first bridging seat is integrally made, and the bottom side of the first bridging seat has a first receiving groove, and the first accommodating The placement groove has two side walls, and the two side walls are provided with two first embedding grooves opposite to each other, and the outside of the first bridging seat has a first outer groove; the second bridging seat is integrally made, and the first bridging seat The bottom side of the second bridging seat has a second accommodating groove, the second accommodating groove has two side walls, and the two side walls are provided with two second embedding grooves opposite to each other, and the outer side of the second bridging seat has a The second outer column; the first protruding part of the first circuit board is embedded in the two first embedding grooves of the first bridging seat, the first female conductor is located in the first receiving groove, and the first female conductor is located in the first receiving groove. The second protruding part of a circuit board is embedded in the two second embedding grooves of the second bridging seat, and the first male conductor is located in the second accommodating groove.
上述的电路模块构造,其中,该第一基板为布设有预定电路的印刷电路板;该第一凸接部位于该第一基板的一端,该第二凸接部位于该第一基板的另一端,该第一母导体及该第一公导体与该第一基板的电路电性导通。The circuit module structure above, wherein, the first substrate is a printed circuit board on which a predetermined circuit is laid; the first protruding part is located at one end of the first substrate, and the second protruding part is located at the other end of the first substrate , the first female conductor and the first male conductor are electrically connected to the circuit of the first substrate.
上述的电路模块构造,其中,该第一电路板的第一基板具有至少一第一定位孔及至少一第二定位孔;该第一桥接座的第一容置槽底壁一侧具有至少一第一定位柱,该第一定位柱插置于该第一基板的第一定位孔中,该第二桥接座的第二容置槽底壁一侧具有至少一第二定位柱,该第二定位柱插置于该第一基板的第二定位孔中。The above-mentioned circuit module structure, wherein, the first substrate of the first circuit board has at least one first positioning hole and at least one second positioning hole; A first positioning post, the first positioning post is inserted into the first positioning hole of the first substrate, at least one second positioning post is provided on one side of the bottom wall of the second accommodating groove of the second bridging base, the second The positioning post is inserted into the second positioning hole of the first substrate.
上述的电路模块构造,其中,该第一桥接座的底面具有两个第一底侧槽,该第一桥接座的顶面具有两个第一顶侧柱,且各第一顶侧柱的位置对应于各第一底侧槽位置;该第二桥接座的底面具有两个第二底侧槽,该第二桥接座的顶面具有两个第二顶侧柱,且各第二顶侧柱的位置对应于各第二底侧槽位置,两个第一电路模块迭接时,利用上面的第一电路模块的底侧槽与下面的第一电路模块的顶侧柱相结合。The above-mentioned circuit module structure, wherein, the bottom surface of the first bridging seat has two first bottom side grooves, the top surface of the first bridging seat has two first top side columns, and the position of each first top side column Corresponding to the position of each first bottom side groove; the bottom surface of the second bridging seat has two second bottom side grooves, the top surface of the second bridging seat has two second top side columns, and each second top side column The positions correspond to the positions of the second bottom side slots. When two first circuit modules are stacked, the bottom side slots of the upper first circuit module are combined with the top side columns of the lower first circuit module.
上述的电路模块构造,还包含有一第一盖体,该第一盖体具有一贯穿顶底面的第一贯孔,该第一盖体的底面具有四个嵌接槽,该多个嵌接槽供第一电路模块的第一顶侧柱及第二顶侧柱插接。The above-mentioned circuit module structure also includes a first cover body, the first cover body has a first through hole penetrating through the top and bottom surfaces, the bottom surface of the first cover body has four embedding grooves, and the plurality of embedding grooves It is used for inserting the first top side column and the second top side column of the first circuit module.
上述的电路模块构造,还包含有一第二盖体,该第二盖体具有一贯穿顶底面的第二贯孔,该第二盖体的顶面具有四个嵌接凸部,该多个嵌接凸部插接于第一电路模块的第一底侧槽与该第二底侧槽内。The above-mentioned circuit module structure further includes a second cover body, the second cover body has a second through hole penetrating through the top and bottom surfaces, the top surface of the second cover body has four embedding protrusions, and the plurality of embedding protrusions The connecting protrusion is plugged into the first bottom groove and the second bottom groove of the first circuit module.
上述的电路模块构造,其中,该第一桥接座的前侧具有一第一前侧槽及一第一前侧柱,该第一前侧槽在下,该第一前侧柱在上,该第一桥接座的后侧具有一第一后侧槽及一第一后侧柱,该第一后侧槽在上,该第一后侧柱在下,该第一后侧槽的位置对应于该第一前侧柱的位置,该第一后侧柱的位置对应于该第一前侧槽的位置;该第二桥接座的前侧具有一第二前侧槽及一第二前侧柱,该第二前侧槽在上,该第二前侧柱在下,该第二桥接座的后侧具有一第二后侧槽及一第二后侧柱,该第二后侧槽在下,该第二后侧柱在上,该第二后侧槽的位置对应于该第二前侧柱的位置,该第二后侧柱的位置对应于该第二前侧槽的位置,两个第一电路模块并接时,通过槽与柱的组装,可以将其中一个第一电路模块前侧或后侧与另一第一电路模块前侧或后侧组装。The above-mentioned circuit module structure, wherein, the front side of the first bridging seat has a first front groove and a first front side column, the first front groove is on the bottom, the first front side column is on the top, and the first front side column is on the top. The rear side of a bridging seat has a first rear side groove and a first rear side column, the first rear side groove is on the top, the first rear side column is on the bottom, and the position of the first rear side groove corresponds to the first rear side column The position of a front side post, the position of the first rear side post corresponds to the position of the first front side slot; the front side of the second bridging seat has a second front side slot and a second front side post, the The second front side groove is on the top, the second front side column is on the bottom, the rear side of the second bridging seat has a second rear side groove and a second rear side column, the second rear side groove is on the bottom, the second The rear side column is on top, the position of the second rear side slot corresponds to the position of the second front side column, the position of the second rear side column corresponds to the position of the second front side slot, and the two first circuit modules During parallel connection, the front side or rear side of one of the first circuit modules can be assembled with the front side or rear side of the other first circuit module through the assembly of the groove and the column.
上述的电路模块构造,还包含有一第二电路模块及一电性导接模块;该第二电路模块的构造与第一电路模块相同;第一电路模块的第一顶侧柱与该第二电路模块的第二底侧槽插接,第一电路模块的第二顶侧柱与该第二电路模块的第一底侧槽插接,该第二电路模块与第一电路模块呈上下堆栈链接;该电性导接模块具有一第一电性导板、一第一导接座、一第二电性导板、一第二导接座及一连接导线;该第一电性导板具有一第一电性基板及一第一导接体,该第一导接体设置于该第一电性基板上并与该第一电性基板电性导通,该第一导接座的构造与第一电路模块的第一桥接座构造相同,该第一电性导板与该第一导接座的第一嵌接槽嵌接;该第二电性导板具有一第二电性基板及一第二导接体,该第二导接体设置于该第二电性基板上并与该第二电性基板电性导通;该第二导接座的构造与第一电路模块的第二桥接座构造相同,该第二电性导板与该第二导接座的第二嵌接槽嵌接;该第二导接座的第二顶侧柱插接于该第一导接座的第一底侧槽中,该第一导接座与该第二导接座呈上下连结;该连接导线一端电性连结于该第一电性导板上,另一端电性连结于该第二电性导板上,由该连接导线将该第一导接体与该第二导接体进行电性连结导通;该第二导接座的第二外侧柱插接于第一电路模块的第一外侧槽中,该第二电路模块的第二外侧柱插接于该第一导接座的第一外侧槽中,该电性导接模块的第二导接体与第一电路模块的第一母导体插接,该电性导接模块的第一导接体与该第二电路模块的第一公导体插接。The above-mentioned circuit module structure also includes a second circuit module and an electrical connection module; the structure of the second circuit module is the same as that of the first circuit module; the first top side column of the first circuit module is connected to the second circuit module The second bottom side slot of the module is plugged in, the second top side column of the first circuit module is plugged into the first bottom side slot of the second circuit module, and the second circuit module and the first circuit module are stacked up and down; The electrical conduction module has a first electrical guide plate, a first conduction base, a second electrical guide plate, a second conduction base and a connecting wire; the first electrical guide plate has a first electrical guide A conductive substrate and a first conductor, the first conductor is disposed on the first electrical substrate and is electrically connected to the first electrical substrate, the structure of the first conductor seat is consistent with the first circuit The structure of the first bridging seat of the module is the same, the first electrical guide plate is embedded in the first embedding groove of the first conductive seat; the second electrical guide plate has a second electrical substrate and a second conductive body, the second conductor is disposed on the second electrical substrate and is electrically connected to the second electrical substrate; the structure of the second conductor seat is the same as that of the second bridge seat of the first circuit module , the second electrical guide plate is engaged with the second embedding groove of the second lead base; the second top side column of the second lead base is inserted into the first bottom side groove of the first lead base Among them, the first conductive seat and the second conductive seat are connected up and down; one end of the connecting wire is electrically connected to the first electrical guide plate, and the other end is electrically connected to the second electrical guide plate, by The connecting wire conducts electrical connection and conduction between the first conductor body and the second conductor body; the second outer column of the second conductor base is plugged into the first outer groove of the first circuit module, the The second outer column of the second circuit module is plugged into the first outer groove of the first conductive socket, the second conductor of the electrical conductive module is plugged into the first female conductor of the first circuit module, The first conductor of the electrical connection module is inserted into the first male conductor of the second circuit module.
上述的电路模块构造,其中,该第一电性导板布设有预定电路,该第一电性导板一端具有一第一凸接块,该第一凸接块嵌接于该第一导接座的第一嵌接槽内,该第一导接体设置于该第一凸接块上并与该第一电性导板的电路导通;该第二电性导板布设有预定电路,该第二电性导板一端具有一第二凸接块,该第二凸接块嵌接于该第二导接座的第二嵌接槽内,该第二导接体设置于该第二凸接块上并与该第二电性导板的电路导通。The above-mentioned circuit module structure, wherein, the first electrical guide plate is provided with a predetermined circuit, and one end of the first electrical guide plate has a first protruding block, and the first protruding block is embedded in the first lead base In the first embedding groove, the first conductor is arranged on the first protruding block and conducts with the circuit of the first electrical guide plate; the second electrical guide plate is provided with a predetermined circuit, and the second electrical guide plate One end of the guide plate has a second protruding block, the second protruding block is embedded in the second embedding groove of the second guide seat, the second conductor is arranged on the second protruding block and The circuit with the second electrical conductive plate is conducted.
上述的电路模块构造,其中,该第一电性导板具有至少一第一定位孔;该第一导接座具有至少一第一定位柱,该第一定位柱插置于该第一定位孔中;该第二导板具有至少一第二定位孔;该第二导接座具有至少一第二定位柱,该第二定位柱插置于该第二定位孔中。The above-mentioned circuit module structure, wherein, the first electrical guide plate has at least one first positioning hole; the first conductive base has at least one first positioning post, and the first positioning post is inserted into the first positioning hole ; The second guide plate has at least one second positioning hole; The second guide base has at least one second positioning post, and the second positioning post is inserted into the second positioning hole.
上述的电路模块构造,其中,还包含有一电性导接模块,该电性导接模块具有一第一电性导板、一第一导接座、一第二电性导板、一第二导接座及一连接导线;该第一电性导板具有一第一电性基板及一第一导接体,该第一导接体设置于该第一电性基板上并与该第一电性基板电性导通,该第一导接座的构造与第一电路模块的第一桥接座构造相同,该第一电性导板与该第一导接座的第一嵌接槽嵌接;该第二电性导板具有一第二电性基板及一第二导接体,该第二导接体设置于该第二电性基板上并与该第二电性基板电性导通;该第二导接座的构造与第一电路模块的第二桥接座构造相同,该第二电性导板与该第二导接座的第二嵌接槽嵌接;利用该第一导接座结合该第二桥接座,该第一导接体插接在第一公导体,第二导接座结合第一桥接座,第二导接体插接在第一母导体。The above-mentioned circuit module structure, wherein, also includes an electrical conduction module, the electrical conduction module has a first electrical guide plate, a first conduction base, a second electrical guide plate, a second conduction seat and a connecting wire; the first electrical guide plate has a first electrical substrate and a first conductor, the first conductor is arranged on the first electrical substrate and connected to the first electrical substrate Electrical conduction, the structure of the first conductive seat is the same as that of the first bridging seat of the first circuit module, the first electrical guide plate is embedded in the first embedding groove of the first conductive seat; the second The second electrical guide plate has a second electrical substrate and a second conductor, the second conductor is disposed on the second electrical substrate and is electrically connected to the second electrical substrate; the second electrical conductor The structure of the lead base is the same as that of the second bridging base of the first circuit module, the second electrical guide plate is embedded in the second embedding groove of the second lead base; the first lead base is used to combine the first Two bridge sockets, the first conductor is plugged into the first male conductor, the second conductor is connected to the first bridge socket, and the second conductor is plugged into the first female conductor.
上述的电路模块构造,其中,还包含:第一电路模块的数目为两个,每一第一电路模块具有一第一电路板、一第一桥接座及一第二桥接座,其中:该第一电路板具有一第一基板、一第一母导体及一第一公导体,该第一基板具有一第一凸接部及一第二凸接部,该第一母导体系设于该第一凸接部上,该第一公导体设于该第二凸接部上;该第一桥接座为一体制成,该第一桥接座底侧具有一第一容置槽,该第一容置槽具有两个侧壁,该两个侧壁开设有相对的两个第一嵌接槽,该第一桥接座外侧具有一第一外侧槽;该第二桥接座为一体制成,该第二桥接座底侧具有一第二容置槽,该第二容置槽具有两个侧壁,该两个侧壁开设有相对的两个第二嵌接槽,该第二桥接座外侧具有一第二外侧柱;该第一电路板的第一凸接部嵌接于该第一桥接座的两个第一嵌接槽中,该第一母导体位于该第一容置槽内,该第一电路板的第二凸接部嵌接于该第二桥接座的两个第二嵌接槽中,该第一公导体位于该第二容置槽内;一电性导接模块,该电性导接模块具有一第一电性导板、一第一导接座、一第二电性导板、一第二导接座及一连接导线;该第一电性导板具有一第一电性基板及一第一导接体,该第一导接体设置于该第一电性基板上并与该第一电性基板电性导通,该第一导接座的构造与第一电路模块的第一桥接座构造相同,该第一电性导板与该第一导接座的第一嵌接槽嵌接;该第二电性导板具有一第二电性基板及一第二导接体,该第二导接体设置于该第二电性基板上并与该第二电性基板电性导通;该第二导接座的构造与第一电路模块的第二桥接座构造相同,该第二电性导板与该第二导接座的第二嵌接槽嵌接;利用该第一导接座结合该第二桥接座,该第一导接体插接在第一公导体,第二导接座结合第一桥接座,第二导接体插接在第一母导体。The above-mentioned circuit module structure further includes: the number of the first circuit modules is two, and each first circuit module has a first circuit board, a first bridging seat and a second bridging seat, wherein: the first A circuit board has a first substrate, a first female conductor and a first male conductor, the first substrate has a first protruding part and a second protruding part, the first female conductor is arranged on the first The first male conductor is arranged on the second convex portion; the first bridging seat is integrally made, and the bottom side of the first bridging seat has a first receiving groove, and the first accommodating The placement groove has two side walls, and the two side walls are provided with two first embedding grooves opposite to each other, and the outside of the first bridging seat has a first outer groove; the second bridging seat is integrally made, and the first bridging seat The bottom side of the second bridging seat has a second accommodating groove, the second accommodating groove has two side walls, and the two side walls are provided with two second embedding grooves opposite to each other, and the outer side of the second bridging seat has a The second outer column; the first protruding part of the first circuit board is embedded in the two first embedding grooves of the first bridging seat, the first female conductor is located in the first receiving groove, and the first female conductor is located in the first receiving groove. The second protruding part of a circuit board is embedded in the two second embedding grooves of the second bridging base, the first male conductor is located in the second receiving groove; an electrical conducting module, the electrical The conductive connection module has a first electrical guide plate, a first conductive base, a second electrical guide plate, a second conductive base and a connecting wire; the first electrical guide plate has a first electrical substrate and a first conductor, the first conductor is disposed on the first electrical substrate and is electrically connected to the first electrical substrate, the structure of the first conductor seat is the same as that of the first circuit module The first bridging base has the same structure, the first electrical guide plate is embedded in the first embedding groove of the first conductive base; the second electrical guide plate has a second electrical substrate and a second conductor, The second conductor is disposed on the second electrical substrate and is electrically connected to the second electrical substrate; the structure of the second conductor seat is the same as that of the second bridge seat of the first circuit module, and the structure of the second conductor seat is the same as that of the second bridge seat of the first circuit module. The second electrical guide plate is embedded in the second embedding groove of the second conductive seat; the first conductive seat is combined with the second bridging seat, the first conductor is plugged into the first male conductor, and the second conductive seat The second conductor base is combined with the first bridging base, and the second conductor is plugged into the first female conductor.
上述的电路模块构造,其中,两个第一电路模块串接时,利用其中一个第一电路模块的第一外侧槽插接在另一第一电路模块的第二外侧柱,利用其中一个第一电路模块的公导体插接在另一个第一电路模块的母导体。The above-mentioned circuit module structure, wherein, when two first circuit modules are connected in series, the first outer slot of one of the first circuit modules is inserted into the second outer column of the other first circuit module, and one of the first The male conductor of the circuit module is inserted into the female conductor of another first circuit module.
本发明中的第一母导体与该第一公导体与第一桥接座及第二桥接座分别设置于该第一基板上,因此在将该第一桥接座及第二桥接座与该第一电路板结合时,就算有些许的相互运动或位置上的偏差亦不会影响到该第一母导体、第一公导体与该第一电路板间的组装及电性连结,从而能确保本发明的导电稳定性。本发明中的第一桥接座与第二桥接座为一体制成,且将第一母导体与第一公导体直接设置于该第一基板上,不仅可减少所需的元件,以达到降低制造成本的目的,而且本案组装容易及快速,方便操作使用。In the present invention, the first female conductor, the first male conductor, the first bridging seat and the second bridging seat are respectively arranged on the first substrate, so when the first bridging seat and the second bridging seat are connected to the first When the circuit boards are combined, even if there is a slight mutual movement or positional deviation, it will not affect the assembly and electrical connection between the first female conductor, the first male conductor and the first circuit board, thereby ensuring the stability of the present invention. conductivity stability. In the present invention, the first bridging seat and the second bridging seat are integrally made, and the first female conductor and the first male conductor are directly arranged on the first substrate, which not only reduces the required components, but also reduces the manufacturing cost. The purpose of cost, and the assembly of this case is easy and fast, and it is convenient to operate and use.
附图说明Description of drawings
图1为本发明第一较佳实施例的立体分解图;Fig. 1 is the three-dimensional exploded view of the first preferred embodiment of the present invention;
图2为图1所示实施例另一视角的立体分解图;Fig. 2 is a three-dimensional exploded view of another viewing angle of the embodiment shown in Fig. 1;
图3为图1所示实施例的立体组合图;Fig. 3 is the three-dimensional assembly diagram of the embodiment shown in Fig. 1;
图4为图1所示实施例另一视角的立体组合图;Fig. 4 is a three-dimensional combined view of another viewing angle of the embodiment shown in Fig. 1;
图5为图1所示实施例的串接的使用状态剖视图;Fig. 5 is a cross-sectional view of the use state of the serial connection of the embodiment shown in Fig. 1;
图6为图1所示实施例的立体堆栈、并接及串接组合示意图;Fig. 6 is a schematic diagram of three-dimensional stacking, parallel connection and series connection of the embodiment shown in Fig. 1;
图7为本发明电性导接模块的立体部份分解图;FIG. 7 is a perspective partial exploded view of the electrical connection module of the present invention;
图8A为本发明另一较佳实施例的立体图;Figure 8A is a perspective view of another preferred embodiment of the present invention;
图8B为图8A的部分分解图;Figure 8B is a partially exploded view of Figure 8A;
图9A为本发明第三较佳实施例的立体图;Fig. 9A is a perspective view of a third preferred embodiment of the present invention;
图9B为图9A的部分分解图;Figure 9B is a partially exploded view of Figure 9A;
图10为本发明另一较佳实施例的立体分解图;Fig. 10 is a three-dimensional exploded view of another preferred embodiment of the present invention;
图11为图10所示实施例的立体组合图;Fig. 11 is a three-dimensional combined view of the embodiment shown in Fig. 10;
图12为图10所示实施例的平面分解图;Fig. 12 is a plane exploded view of the embodiment shown in Fig. 10;
图13为图10所示实施例的平面组合图。Fig. 13 is a combined plan view of the embodiment shown in Fig. 10 .
附图标记说明:100、200、300、400-电路模块构造;10-第一电路模块;11-第一电路板;14-紧缩槽;12-第一桥接座;15-电子元件;111-第一基板;112-第一母导体;113-第一公导体;114-第一凸接部;115-第二凸接部;116-第一定位孔;117-第二定位孔;121-第一容置槽;122-第一嵌接槽;123-第一定位柱;124-第一外侧槽;125-第一底侧槽;126-第一顶侧柱;127-第一前侧槽;128-第一前侧柱;129-第一后侧槽;120-第一后侧柱;13-第二桥接座;131-第二容置槽;132-第二嵌接槽;133-第二定位柱;134-第二外侧柱;135-第二底侧槽;136-第二顶侧柱;137-第二前侧槽;138-第二前侧柱;139-第二后侧槽;130-第二后侧柱;20-第二电路模块;30-电性导接模块;213-第一公导体;225-第一底侧槽;234-第二外侧柱;235-第二底侧槽;31-第一电性导板;311-第一电性基板;32-第一导接座;33-第二电性导板;331-第二电性基板;34-第二导接座;332-第二导接体;312-第一导接体;35-连接导线;321-第一容置槽;322-第一嵌接槽;313-第一凸接块;333-第二凸接块;40-第一盖体;41-第一贯孔;42-嵌接孔;50-第二盖体;51-第二贯孔;52-嵌接凸部。Explanation of reference numerals: 100, 200, 300, 400 - circuit module structure; 10 - first circuit module; 11 - first circuit board; 14 - compression slot; 12 - first bridging seat; 15 - electronic component; 111 - 112-the first female conductor; 113-the first male conductor; 114-the first protrusion; 115-the second protrusion; 116-the first positioning hole; 117-the second positioning hole; 121- 122-the first embedding groove; 123-the first positioning column; 124-the first outer groove; 125-the first bottom side groove; 126-the first top side column; 127-the first front side Slot; 128-the first front side column; 129-the first rear side groove; 120-the first rear side column; 13-the second bridging seat; 131-the second accommodation groove; 132-the second embedding groove; 133 134-second lateral post; 135-second bottom side slot; 136-second top side post; 137-second front side slot; 138-second front side post; 139-second rear Side groove; 130-second rear side column; 20-second circuit module; 30-electrical conductor module; 213-first male conductor; 225-first bottom side groove; 234-second outer column; 235- 31-the first electrical guide plate; 311-the first electrical substrate; 32-the first conductive seat; 33-the second electrical guide plate; 331-the second electrical substrate; 34-the second Conductor seat; 332-second conductor body; 312-first conductor body; 35-connecting wire; 321-first accommodation groove; 322-first embedding groove; 313-first convex block; 333 - the second convex block; 40 - the first cover; 41 - the first through hole; 42 - the embedding hole; 50 - the second cover; 51 - the second through hole; 52 - the embedding protrusion.
具体实施方式Detailed ways
为使审查员能对本发明的特征与其特点有更进一步的了解与认同,兹列举以下较佳的实施例并配合图式说明如下:In order to enable the examiner to have a further understanding and recognition of the features and characteristics of the present invention, the following preferred embodiments are listed below and described as follows with accompanying drawings:
如图1~图4所示为本发明一较佳实施例所提供的电路模块构造100,其包含有至少一个第一电路模块10,其中:As shown in Figures 1 to 4, a circuit module structure 100 provided by a preferred embodiment of the present invention includes at least one first circuit module 10, wherein:
第一电路模块10具有一第一电路板11、一第一桥接座12及一第二桥接座13。The first circuit module 10 has a first circuit board 11 , a first bridge seat 12 and a second bridge seat 13 .
该第一电路板11具有一第一基板111、一第一母导体112及一第一公导体113,该第一基板111为布设有预定电路(图未示)的印刷电路板,在其上面设有若干的电子元件15,该第一基板111一端具有一第一凸接部114,该第一基板111另一端具有一第二凸接部115,该第一基板111的顶面具有两个第一定位孔116及两个第二定位孔117,该第一母导体112设置于该第一基板111的第一凸接部114上并与该第一基板111上的电路导通,该第一公导体113设置于该第一基板111的第二凸接部115上并与该第一基板111上的电路导通。The first circuit board 11 has a first substrate 111, a first female conductor 112 and a first male conductor 113. The first substrate 111 is a printed circuit board with a predetermined circuit (not shown), on which There are several electronic components 15, one end of the first substrate 111 has a first protrusion 114, the other end of the first substrate 111 has a second protrusion 115, and the top surface of the first substrate 111 has two The first positioning hole 116 and the two second positioning holes 117, the first bus conductor 112 is disposed on the first protruding portion 114 of the first substrate 111 and conducts with the circuit on the first substrate 111, the first bus conductor 112 A male conductor 113 is disposed on the second protruding portion 115 of the first substrate 111 and conducts with the circuit on the first substrate 111 .
该第一桥接座12由绝缘材质一体制成,本实施例采用塑料材料,该第一桥接座12的底侧凹陷有一第一容置槽121,该第一容置槽121的两个侧壁一侧具有相对的两个第一嵌接槽122,该第一容置槽121的底壁上具有两个第一定位柱123,该第一桥接座12的外侧面凹陷有一第一外侧槽124,该第一桥接座12的底面具有两个第一底侧槽125,该第一桥接座12的顶面具有两个第一顶侧柱126,且各第一顶侧柱126的位置对应于各第一底侧槽125位置,该第一桥接座12的前侧具有一第一前侧槽127及一第一前侧柱128,该第一前侧槽127在下,该第一前侧柱128在上,该第一桥接座12的后侧具有一第一后侧槽129及一第一后侧柱120,该第一后侧槽129在上,该第一后侧柱120在下,使该第一后侧槽129的位置对应于该第一前侧柱128的位置,该第一后侧柱120的位置对应于该第一前侧槽127的位置。该第一电路板10的第一凸接部114与第一母导体112位于该第一桥接座12的第一容置槽121内,由该第一凸接部114的两侧嵌入于该第一嵌接槽122内,以将该第一桥接座12与该第一电路板11链接,并由该第一桥接座12的第一定位柱123插入于该第一电路板11的第一定位孔116中,以使该第一桥接座12能与该第一电路板11进行准确的定位连结。The first bridging seat 12 is integrally made of insulating material. In this embodiment, plastic material is used. The bottom side of the first bridging seat 12 is recessed with a first accommodating groove 121. The two side walls of the first accommodating groove 121 One side has two opposite first embedding grooves 122, the bottom wall of the first accommodating groove 121 has two first positioning posts 123, and the outer surface of the first bridging base 12 is recessed with a first outer groove 124 , the bottom surface of the first bridge seat 12 has two first bottom side grooves 125, the top surface of the first bridge seat 12 has two first top side columns 126, and the position of each first top side column 126 corresponds to The position of each first bottom side groove 125, the front side of the first bridging seat 12 has a first front side groove 127 and a first front side column 128, the first front side groove 127 is below, and the first front side column 128 on top, the rear side of the first bridging seat 12 has a first rear side groove 129 and a first rear side column 120, the first rear side groove 129 is on the top, and the first rear side column 120 is on the bottom, so that The position of the first rear side slot 129 corresponds to the position of the first front side post 128 , and the position of the first rear side post 120 corresponds to the position of the first front side slot 127 . The first protruding portion 114 and the first female conductor 112 of the first circuit board 10 are located in the first accommodating groove 121 of the first bridging seat 12 , and are embedded in the first protruding portion 114 from both sides. An embedding groove 122 is used to link the first bridging seat 12 with the first circuit board 11, and the first positioning post 123 of the first bridging seat 12 is inserted into the first positioning position of the first circuit board 11. hole 116, so that the first bridging seat 12 can be accurately positioned and connected to the first circuit board 11.
该第二桥接座13由绝缘材质一体制成,本实施例采用塑料材料,该第二桥接座13的底侧凹陷有一第二容置槽131,该第二容置槽131的两个侧壁上具有相对的两个第二嵌接槽132,该第二容置槽131的底壁一侧具有两个第二定位柱133,该第二桥接座13的外侧面凸出有一第二外侧柱134,该第二桥接座13的底面具有两个第二底侧槽135,该第二桥接座13的顶面具有两个第二顶侧柱136,且各第二顶侧柱136的位置对应于各第二底侧槽135位置,该第二桥接座13的前侧具有一第二前侧槽137及一第二前侧柱138,该第二前侧槽137在上,该第二前侧柱138在下,该第二桥接座13的后侧具有一第二后侧槽139及一第二后侧柱130,该第二后侧槽139在下,该第二后侧柱130在上,该第二后侧槽139的位置对应于该第二前侧柱138的位置,该第二后侧柱130的位置对应于该第二前侧槽137的位置。该第一电路板10的第二凸接部115与第一公导体113位于该第二桥接座13的第二容置槽131内,由该第二凸接部115的两侧嵌入于该第二嵌接槽132内,以将该第二桥接座13与该第一电路板11链接,并由该第二桥接座13的第二定位柱133插入于该第一电路板11的第二定位孔117中,以使该第二桥接座13能与该第一电路板11进行准确的定位连结。The second bridging seat 13 is integrally made of insulating material. In this embodiment, plastic material is used. The bottom side of the second bridging seat 13 is recessed with a second accommodating groove 131. The two side walls of the second accommodating groove 131 There are two opposite second embedding grooves 132 on the top, two second positioning posts 133 on one side of the bottom wall of the second accommodating groove 131, and a second outer post protruding from the outer surface of the second bridging seat 13 134, the bottom surface of the second bridge seat 13 has two second bottom side grooves 135, the top surface of the second bridge seat 13 has two second top side columns 136, and the positions of the second top side columns 136 correspond to At the position of each second bottom side groove 135, the front side of the second bridging seat 13 has a second front side groove 137 and a second front side column 138, the second front side groove 137 is on the top, and the second front side The side column 138 is at the bottom, the rear side of the second bridging seat 13 has a second rear side groove 139 and a second rear side column 130, the second rear side groove 139 is at the bottom, and the second rear side column 130 is at the top, The position of the second rear side slot 139 corresponds to the position of the second front side post 138 , and the position of the second rear side post 130 corresponds to the position of the second front side slot 137 . The second protruding portion 115 and the first male conductor 113 of the first circuit board 10 are located in the second accommodating groove 131 of the second bridging seat 13 , and are embedded in the first male conductor 113 by both sides of the second protruding portion 115 . Two embedding grooves 132 are used to link the second bridging seat 13 with the first circuit board 11, and the second positioning post 133 of the second bridging seat 13 is inserted into the second positioning of the first circuit board 11. hole 117, so that the second bridging base 13 can be accurately positioned and connected to the first circuit board 11.
上述即为本发明第一较佳实施例所提供的一种电路模块构造100的各部构件及其组成方式介绍,接着再将其特点说明如下:The above is the introduction of each component and its composition method of a circuit module structure 100 provided by the first preferred embodiment of the present invention, and then its characteristics are described as follows:
藉此,本发明可由该第一桥接座或第二桥接座与另一组的电路模块进行轻易地连接,以通过本发明中的第一母导体或第一公导体与另一组的电路模块进行电性导接,以达到多样态的立体组装功效。Thereby, the present invention can easily connect the first bridging base or the second bridging base with another set of circuit modules, so as to connect the other set of circuit modules through the first female conductor or the first male conductor in the present invention Conduct electrical connection to achieve multi-dimensional three-dimensional assembly effect.
如图5所示为两个第一电路模块10的串接组装样态立体剖面图。首先将其中一个第一电路模块10的第二外侧柱134插接另一个第一电路模块10的第一外侧槽124内,使两个第一电路模块10能轻易地进行连结,并同时由其一第一电路模块10的第一公导体113插接于另一第一电路模块10的第一母导体112中,使两个第一电路模块10间能够电性导通。FIG. 5 is a three-dimensional cross-sectional view of two first circuit modules 10 assembled in series. First, insert the second outer column 134 of one of the first circuit modules 10 into the first outer groove 124 of the other first circuit module 10, so that the two first circuit modules 10 can be easily connected, and simultaneously The first male conductor 113 of one first circuit module 10 is plugged into the first female conductor 112 of another first circuit module 10 , so that the two first circuit modules 10 can be electrically connected.
当然,除上述图5中将两个第一电路模块10串接链接外,还可取更多组相同构造的第一电路模块10进行横向、前后及上下堆栈的立体链接(如图6所示),以达到多样态的立体堆栈功效。图6所显示的上下结合及横向结合,通过各对应的柱及槽加以结合完成,非常方便,以下再进一步说明。Of course, in addition to connecting the two first circuit modules 10 in series in FIG. 5 above, more groups of first circuit modules 10 with the same structure can also be used for horizontal, front-to-back, and up-and-down three-dimensional links (as shown in FIG. 6 ). , in order to achieve multi-dimensional three-dimensional stacking effect. The upper and lower joints and horizontal joints shown in Figure 6 are completed through the joints of the corresponding columns and grooves, which is very convenient and will be further described below.
上述实施例中,该第一桥接座12的第一顶侧柱126、第一前侧柱128及第一后侧柱120与该第二桥接座13的第二顶侧柱136、第二前侧柱138及第二后侧柱130皆在其柱身上开设有一紧缩槽14,当柱身受外力所压迫时,可由该紧缩槽14提供柱身向内位移闭合的裕度,以利能顺畅地插入于对应位置的槽内。In the above embodiment, the first top side column 126, the first front side column 128 and the first rear side column 120 of the first bridging seat 12 are connected with the second top side column 136, the second front side column 136 of the second bridging seat 13. The side column 138 and the second rear side column 130 are all provided with a tightening groove 14 on the column body. When the column body is pressed by an external force, the tightening groove 14 can provide a margin for the inward displacement and closing of the column body, so as to be able to move smoothly. Insert it into the corresponding slot.
如图7所示,本发明一实施例还包含有一电性导接模块30,其中;As shown in FIG. 7, an embodiment of the present invention also includes an electrical connection module 30, wherein;
如图8A、图8B所示,该第二电路模块20的构造与组装方式皆与该第一电路模块10相同,以下不多作赘述。将该第一电路模块10的第一顶侧柱126与该第二电路模块20的第二底侧槽235插接,该第一电路模块10的第二顶侧柱136与该第二电路模块20的第一底侧槽225插接,使该第二电路模块20与该第一电路模块20能够呈上下堆栈链接。As shown in FIG. 8A and FIG. 8B , the structure and assembly method of the second circuit module 20 are the same as those of the first circuit module 10 , and will not be described in detail below. The first top side column 126 of the first circuit module 10 is inserted into the second bottom side groove 235 of the second circuit module 20, and the second top side column 136 of the first circuit module 10 is connected to the second circuit module. The first bottom side groove 225 of 20 is plugged in, so that the second circuit module 20 and the first circuit module 20 can be stacked up and down.
该电性导接模块30具有一第一电性导板31、一第一导接座32、一第二电性导板33、一第二导接座34及一连接导线35。The electrical connection module 30 has a first electrical conductive plate 31 , a first conductive seat 32 , a second electrical conductive plate 33 , a second conductive seat 34 and a connecting wire 35 .
该第一电性导板31与第一电路板11的结构特征相同,其具有一第一电性基板311及一第一导接体312,该第一电性基板311为布设有预定电路的印刷电路板,该第一电性基板311一端具有一第一凸接块313,该第一电性基板311上具有两个第一定位孔(图中未示),该第一导接体312设置于该第一凸接块上并与该第一电性基板311的电路导通,于本实施例中该第一导接体312为母导体。The first electrical guide plate 31 has the same structural features as the first circuit board 11. It has a first electrical substrate 311 and a first conductor 312. The first electrical substrate 311 is a printed circuit board with a predetermined circuit. Circuit board, one end of the first electrical substrate 311 has a first protruding block 313, the first electrical substrate 311 has two first positioning holes (not shown in the figure), the first conductor 312 is set The circuit on the first bump block and the first electrical substrate 311 is conducted. In this embodiment, the first conductor 312 is a parent conductor.
该第一导接座32的构造与第一电路模块10的第一桥接座12构造相同,同样具有一第一容置槽、第一嵌接槽、两个第一定位柱、一第一外侧槽、两个第一底侧槽、两个第一顶侧柱、一第一前侧槽、一第一前侧柱、一第一后侧槽及一第一后侧柱,其具体结构不多赘述。该第一电性导板31的第一凸接块313与第一导接体位于该第一导接座32的第一容置槽321内,由该第一凸接块的两侧嵌入于该第一嵌接槽322内,将该第一导接座32与该第一电性导板31连结,并由该第一导接座32的第一定位柱插入于该第一电性导板31的第一定位孔中,以使该第一导接座32能与该第一电性导板31进行准确的定位连结。The structure of the first connecting seat 32 is the same as that of the first bridging seat 12 of the first circuit module 10, and also has a first accommodating groove, a first embedding groove, two first positioning posts, and a first outer side. Groove, two first bottom side grooves, two first top side columns, a first front side groove, a first front side column, a first rear side groove and a first rear side column, its specific structure is different More details. The first protruding block 313 and the first conductor of the first electrical guide plate 31 are located in the first accommodating groove 321 of the first conductive seat 32, and are embedded in the first protruding block from both sides. In the first embedding groove 322, the first conductive base 32 is connected with the first electrical guide plate 31, and the first positioning column of the first conductive base 32 is inserted into the first electrical guide plate 31. in the first positioning hole, so that the first conductive base 32 can be accurately positioned and connected to the first electrical guide plate 31 .
该第二电性导板33与第一电路板11的结构特征相同,其具有一第二电性基板331及一第二导接体332,该第二电性基板331为布设有预定电路的印刷电路板,该第二电性基板331一端具有一第二凸接块333,该第二电性基板331上具有两个第二定位孔(图中未示),该第二导接体332设置于该第二凸接块上并与该第二电性基板331的电路导通,于本实施例中该第一导接体312为公导体。The second electrical guide plate 33 has the same structural features as the first circuit board 11. It has a second electrical substrate 331 and a second conductor 332. The second electrical substrate 331 is a printed circuit board on which a predetermined circuit is laid. Circuit board, one end of the second electrical substrate 331 has a second protruding block 333, the second electrical substrate 331 has two second positioning holes (not shown in the figure), the second conductor 332 is set The circuit on the second bump block and the second electrical substrate 331 is connected. In this embodiment, the first conductor 312 is a male conductor.
该第二导接座34的构造与第一电路模块10的第二桥接座13构造相同,同样具有一第二容置槽、第二嵌接槽、两个第二定位柱、一第二外侧柱、两个第二底侧槽、两个第二顶侧柱、一第二前侧槽、一第二前侧柱、一第二后侧槽及一第二后侧柱,其具体结构不多赘述。该第二电性导板34的第二凸接块与第二导接体位于该第二导接座34的第二容置槽内,由该第二凸接块的两侧嵌入于该第二嵌接槽内,以将该第二导接座34与该第二电性导板34连结,并由该第二导接座34的第二定位柱插入于该第二电性导板33的第二定位孔中,以使该第二导接座34能与该第二电性导板33进行准确的定位连结。The structure of the second connecting seat 34 is the same as that of the second bridging seat 13 of the first circuit module 10, and also has a second accommodating groove, a second embedding groove, two second positioning columns, and a second outer side. column, two second bottom side grooves, two second top side columns, a second front side groove, a second front side column, a second rear side groove and a second rear side column, its specific structure is not More details. The second protruding block and the second conductor of the second electrical guide plate 34 are located in the second accommodating groove of the second conductive seat 34, and are embedded in the second protruding block from both sides. Embedded in the groove, so that the second guide seat 34 is connected with the second electrical guide plate 34, and the second positioning column of the second guide seat 34 is inserted into the second position of the second electrical guide plate 33. In the positioning hole, the second conductive base 34 can be accurately positioned and connected to the second electrical guide plate 33 .
为了简要起见,前述的电性导接模块30仅提供组合图,除了连接导线35外,其各部结构可参第一电路模块10。For the sake of brevity, the aforesaid electrical connection module 30 only provides an assembly diagram, except for the connecting wire 35 , the structures of its parts can refer to the first circuit module 10 .
如图8A所示为本发明另一实施例的外观示意图。图8B为图8A的部分分解图。本实施例包含有上、下迭接的一第一电路模块10,第二电路模块20及一电性导接模块30。第二电路模块20结构特征与第一电路模块10一样,为了区别,将之称为“第二”。FIG. 8A is a schematic view of the appearance of another embodiment of the present invention. FIG. 8B is a partially exploded view of FIG. 8A. This embodiment includes a first circuit module 10 , a second circuit module 20 and an electrical connection module 30 connected up and down. The structural features of the second circuit module 20 are the same as those of the first circuit module 10 , and are referred to as "second" for the sake of distinction.
实施例中,将下面的第一电路模块10的顶侧柱126、136与上面的第二电路模块20的底侧槽225、235分别插接,使得上下的第一电路模块10及第二电路模块20能够迭接。In the embodiment, the top side columns 126, 136 of the lower first circuit module 10 are respectively inserted into the bottom side grooves 225, 235 of the upper second circuit module 20, so that the upper and lower first circuit modules 10 and the second circuit The modules 20 are stackable.
该第二导接座34的第二顶侧柱136插接于该第一导接座32的第一底侧槽125中,以将该第一导接座32与该第二导接座34呈上下连结。The second top side column 136 of the second guide seat 34 is inserted into the first bottom side groove 125 of the first guide seat 32 to connect the first guide seat 32 with the second guide seat 34 Link up and down.
该连接导线35,一端电性连结于该第一电性导板31的电路上,另一端电性连结于该第二电性导板33的电路上,以通过该连接导线35将该第一电性导板31上的第一导接体312与该第二电性导板33上的第二导接体332进行电性连结导通。One end of the connecting wire 35 is electrically connected to the circuit of the first electrical lead plate 31, and the other end is electrically connected to the circuit of the second electrical lead plate 33, so that the first electrical lead 35 can be connected through the connecting wire 35. The first conductor 312 on the guide plate 31 is electrically connected to the second conductor 332 on the second electrical guide plate 33 .
接着,便可将该电性导接模块30的第二外侧柱134插接于该第一电路模块10的第一外侧槽124中,及将该第二电路模块20的第二外侧柱234插接于该电性导接模块30的第一外侧槽124中,使该第一电路模块10与该第二导接座34连结,该第二电路模块20则与该第一导接座32连结。同时,由该电性导接模块30的第二导接体332与该第一电路模块10的第一母导体112插接,并由该电性导接模块30的第一导接体312与该第二电路模块20的第一公导体213插接,使能通过电性导接模块30将该第一电路模块10与该第二电路模块20导通Then, the second outer column 134 of the electrical connection module 30 can be inserted into the first outer groove 124 of the first circuit module 10, and the second outer column 234 of the second circuit module 20 can be inserted into connected to the first outer groove 124 of the electrical lead module 30, so that the first circuit module 10 is connected with the second lead base 34, and the second circuit module 20 is connected with the first lead base 32 . At the same time, the second conductor 332 of the electrical connection module 30 is inserted into the first female conductor 112 of the first circuit module 10 , and the first conductor 312 of the electrical connection module 30 is connected to the The first male conductor 213 of the second circuit module 20 is plugged in, so that the first circuit module 10 and the second circuit module 20 can be connected through the electrical connection module 30
图9A为本发明另一实施例电路模块构造400的立体图,图9B为图9A的部分分解图。本实施例包含两个并接的第一电路模块10及一电性导接模块30。其中,电性导接模块30的第一导接座32及第二导接座34并接时,利用前后的槽及柱加以结合,当两个第一电路模块10并接时,通过前后的槽127、129、137、139与柱128、120、138、130的结合,可以将其中一个第一电路模块10前侧或后侧与另一第一电路模块10前侧或后侧结合(如图9A、图9B)。FIG. 9A is a perspective view of a circuit module structure 400 according to another embodiment of the present invention, and FIG. 9B is a partially exploded view of FIG. 9A . This embodiment includes two parallel connected first circuit modules 10 and an electrical connection module 30 . Wherein, when the first conductive seat 32 and the second conductive seat 34 of the electrical conductive module 30 are connected in parallel, the front and rear grooves and columns are used to combine them. When the two first circuit modules 10 are connected in parallel, the The combination of grooves 127, 129, 137, 139 and posts 128, 120, 138, 130 can combine the front side or rear side of one of the first circuit modules 10 with the front side or rear side of the other first circuit module 10 (such as Figure 9A, Figure 9B).
利用第一导接座32、第一外侧槽124结合第二桥接座13的第二外侧柱134,第一导接体312插接第一公导体113,第二导接座34的第二外侧柱134结合第一桥接座12的第一外侧槽124,第二导接体332插接在第一母导体112,可以组装并电性地连结两个并接的第一电路模块10。The first conductor 312 is plugged into the first male conductor 113 by using the first conductor seat 32 and the first outer groove 124 combined with the second outer column 134 of the second bridging seat 13 , and the second outer side of the second conductor seat 34 The column 134 is combined with the first outer groove 124 of the first bridging base 12 , and the second conductor 332 is plugged into the first female conductor 112 to assemble and electrically connect two parallel first circuit modules 10 .
由以上说明可知,利用该电性导接模块30可以链接任意的两个第一电路模块10,因此,本电性导接模块30也适用在图6中的任两个第一电路模块10间的链接。From the above description, it can be known that any two first circuit modules 10 can be connected by using the electrical connection module 30, therefore, the electrical connection module 30 is also suitable for use between any two first circuit modules 10 in FIG. 6 the link to.
通过本实施例,可让本发明的组装方式更加地多样化,以增加使用者更多不同样态的组装需求。Through this embodiment, the assembling methods of the present invention can be made more diversified, so as to increase the user's assembling requirements in more different forms.
另外,虽然于本实施例中,该电性导接模块的第一导接体为母导体而该第二导接体为公导体;但是,实际上该第一导接体亦可为公导体,该第二导接体为母导体,其不仅可达到相同的功效,更能让第一电路模块与该第二电路模块的组装态样更具变化性。In addition, although in this embodiment, the first conductor of the electrical connection module is a female conductor and the second conductor is a male conductor; however, in fact, the first conductor can also be a male conductor , the second conductor is a female conductor, which can not only achieve the same effect, but also allow the assembly of the first circuit module and the second circuit module to be more variable.
其次,虽然上述实施例中,将该第一导接座位于上方,将该第二导接座位于下方的方式进行上下的堆栈链接;但是,实际上亦可将该第二导接座位于上方,将该第一导接座位于下方的方式进行上下的堆栈链接,其不仅可达到相同的功效,更能让第一电路模块与该第二电路模块的组装态样更具变化性。Secondly, although in the above-mentioned embodiment, the first connection seat is located at the top and the second connection seat is located at the bottom, the stacking link is performed up and down; however, in fact, the second connection seat can also be located at the top The method of stacking and linking the first contact seat at the bottom can not only achieve the same effect, but also make the assembly configuration of the first circuit module and the second circuit module more variable.
如图10~图13所示为本发明一较佳实施例所提供的一种电路模块构造300,其除了包含有与第一实施例相同的第一电路模块10外,还包含有一第一盖体40及一第二盖体50,其中;As shown in Figures 10 to 13, a circuit module structure 300 provided by a preferred embodiment of the present invention, besides including the same first circuit module 10 as the first embodiment, also includes a first cover Body 40 and a second cover 50, wherein;
如图10、图11所示,该第一盖体40呈方形,由塑料材料一体制成。该第一盖体40具有一贯穿顶底面的第一贯孔41,实施例中,该第一贯孔41为矩形孔,该第一盖体40的底面邻近四个周角落处具有四个嵌接槽42。As shown in FIG. 10 and FIG. 11 , the first cover 40 is square and integrally made of plastic material. The first cover 40 has a first through hole 41 that runs through the top and bottom surfaces. In the embodiment, the first through hole 41 is a rectangular hole. Connect groove 42.
该第二盖体50呈方形,由塑料材料一体制成。该第二盖体50具有一贯穿顶底面的第二贯孔51,实施例中,该第二贯孔51为矩形孔,该第二盖体40的顶面邻近四个周角落处具有四个嵌接凸部53。The second cover 50 is square and integrally made of plastic material. The second cover 50 has a second through hole 51 that runs through the top and bottom surfaces. In the embodiment, the second through hole 51 is a rectangular hole, and the top surface of the second cover 40 has four Embedding convex portion 53 .
该第一盖体40由该四个嵌接槽42供该第一电路模块10的第一顶侧柱126及第二顶侧柱136进行嵌入连接(如图12、图13所示),以将该第一盖体40盖设于该第一电路模块10的上方。该第二盖体50将该四个嵌接凸部52嵌入连接于该第一电路模块10的第一底侧槽125与该第二底侧槽135内(如图12~图13所示),以将该第二盖体50盖设于该第一电路模块10的下方。The first cover 40 uses the four embedding grooves 42 for the first top side column 126 and the second top side column 136 of the first circuit module 10 to be embedded and connected (as shown in FIGS. 12 and 13 ), so as to The first cover 40 is disposed above the first circuit module 10 . The second cover 50 embeds the four embedding protrusions 52 into the first bottom groove 125 and the second bottom groove 135 of the first circuit module 10 (as shown in FIGS. 12-13 ). , so as to cover the second cover 50 under the first circuit module 10 .
藉此,本实施例不仅可通过该第一盖体40与该第二盖体50作为该第一电路模块10的外壳,从而达到防撞功效。亦可能通过该第一盖体40上的第一贯孔41与该第二盖体50上的第二贯孔42,作为与外部元件进行链接的接口,如可作为与乐高积木间进行插接的接口,以扩大本发明所能运用的领域范围。In this way, in this embodiment, the first cover 40 and the second cover 50 can be used as the shell of the first circuit module 10 , so as to achieve anti-collision effect. It is also possible to pass through the first through hole 41 on the first cover 40 and the second through hole 42 on the second cover 50 as an interface for linking with external components, such as plugging in with Lego blocks. interface to expand the field of application of the present invention.
上述实施例中,该第二盖体的嵌接凸部上开设有一紧缩槽14,使当该嵌接凸部受外力所压迫时,可由该紧缩槽提供该嵌接凸部向内位移闭合的裕度,以利能顺畅地插入于对应位置的槽内。In the above embodiment, a constriction groove 14 is provided on the embedding protrusion of the second cover, so that when the embedding protrusion is pressed by an external force, the constriction groove can provide the inward displacement and closing of the embedding protrusion. margin so that it can be smoothly inserted into the slot at the corresponding position.
以上仅为本发明所提供的较佳实施例而已,并非用以限制本发明的实施范围,凡本技术领域内的相关技艺者根据本发明所为的均等变化,皆应属本发明所涵盖的保护范围。The above are only preferred embodiments provided by the present invention, and are not intended to limit the scope of implementation of the present invention. All equivalent changes made by those skilled in the art according to the present invention shall be covered by the present invention. protected range.
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| CN201435474Y (en) * | 2009-04-22 | 2010-03-31 | 莫列斯公司 | Module connector |
| US20130050958A1 (en) * | 2011-08-26 | 2013-02-28 | Littlebits Electronics Inc. | Modular electronic building systems with magnetic interconnections and methods of using the same |
| CN202612061U (en) * | 2012-02-20 | 2012-12-19 | 王永南 | Miniature air pump |
| CN202564636U (en) * | 2012-04-11 | 2012-11-28 | 瀚荃股份有限公司 | Inter-Board Connector Set |
| CN204927641U (en) * | 2015-07-17 | 2015-12-30 | 胡巍瀚 | Circuit module system |
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Application publication date: 20180511 |