CN108022864B - Wet process equipment - Google Patents
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- CN108022864B CN108022864B CN201610966533.4A CN201610966533A CN108022864B CN 108022864 B CN108022864 B CN 108022864B CN 201610966533 A CN201610966533 A CN 201610966533A CN 108022864 B CN108022864 B CN 108022864B
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- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims description 27
- 238000012545 processing Methods 0.000 claims description 9
- 239000000126 substance Substances 0.000 claims description 2
- 238000009825 accumulation Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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Abstract
本发明提供一种湿式制程装置。本发明藉由在一主液体移除单元旁设置一副液体移除单元,并在所述副液体移除单元与所述主液体移除单元之间形成一第二风口,产生一伯努利现象,进而藉由所述第二风口带走靠近一容器侧壁的液体,避免液体的累积。
The present invention provides a wet process device. The present invention provides a secondary liquid removal unit next to a primary liquid removal unit and forms a second air port between the secondary liquid removal unit and the primary liquid removal unit to generate a Bernoulli phenomenon, thereby removing liquid near a container side wall through the second air port to avoid liquid accumulation.
Description
技术领域technical field
本发明涉及一种制程装置,尤其是适用于面板产业和半导体产业之湿式制程装置。The present invention relates to a process device, especially a wet process device suitable for panel industry and semiconductor industry.
背景技术Background technique
在面板产业以及半导体产业中,湿式制程发展的已经相当成熟。然而,受限于现有的机构设计,在实际操作中仍存在许多问题。举例来说,湿式制程需要持续施加不同的液体至一基板,举例而言,在一容器中可能采用A蚀刻液体对所述基板进行蚀刻,在相邻的另一容器中可能采用纯水对所述基板进行清洗。一般而言,是让所述基板在多个储存有不同液体的容器中依序传递与移动,然而,为了确保液体不会从一容器带至另一容器而产生彼此污染的状况,必须利用液体移除装置(俗称风刀)在基板离开每一个容器时,能够不带走所述容器中的液体至另一容器中,以避免造成污染以及产品的瑕疵。In the panel industry and the semiconductor industry, the development of wet process has been quite mature. However, limited by the existing mechanism design, there are still many problems in practical operation. For example, a wet process requires the continuous application of different liquids to a substrate. For example, etching liquid A may be used in one container to etch the substrate, and pure water may be used in another adjacent container to etch the substrate. The substrate is cleaned. Generally speaking, the substrates are sequentially transferred and moved in a plurality of containers that store different liquids. However, in order to ensure that the liquids are not brought from one container to another and contaminate each other, the liquid must be used. When the substrate leaves each container, the removing device (commonly known as air knife) can not take away the liquid in the container to another container, so as to avoid pollution and product defects.
参考图1-2,图1绘示现有技术的湿式制程装置10之示意图。图2绘示现有技术的湿式制程装置10之剖面侧视图。所述湿式制程装置10包括一第一容器11以及一主液体移除单元15。所述第一容器11包括一第一侧壁19的一开口12,用于让一基板14沿着所述第一容器11的第一轴13从所述开口12离开或进入所述第一容器10。所述主液体移除单元15设置在所述第一容器11内部靠近所述第一侧壁19与所述开口12之区域,并且所述主液体移除单元15包括一第一风口16。所述第一风口16的方向21是朝左下方(以所述第一轴13为准,约为225度,一般而言,所述方向21会介于180-270度),以便将在所述基板14上的液体18吹除。然而,所述侧壁19设有所述开口12使得所述侧壁19较为脆弱,无法用于固定所述主液体移除单元15。因此只能够将所述主液体移除单元15通过其他的内壁进行固定作业,进而使所述主液体移除单元15无法固定在所述侧壁11上。因此,通常会在所述主液体移除单元15的上方加装一导板17,所述导板17能够避免所述液体18在所述主液体移除单元15与所述侧壁11之间的空隙滴落至所述基板14。虽然可以避免所述导板17上方的所述液体18滴落至所述基板14上,但是随着时间经过,多少仍然会在所述导板17以及所述侧壁11的间隙中累积液体18,进而滴落在所述基板14上的技术问题。Referring to FIGS. 1-2 , FIG. 1 is a schematic diagram of a conventional
综上所述,基于所述侧壁11的结构问题,无法将所述主液体移除单元15固定在所述侧壁11上。即使能够将所述主液体移除单元15固定在所述侧壁11上,仍有可能在所述主液体移除单元15与所述侧壁之间累积所述液体18,进而滴落在所述基板14上的技术问题。To sum up, due to the structural problems of the
因此,有必要提供一种湿式制程装置,以解决上述之问题。Therefore, it is necessary to provide a wet processing apparatus to solve the above problems.
发明内容SUMMARY OF THE INVENTION
有鉴于此,本发明目的在于提供一种湿式制程装置,通过在一主液体移除单元旁设置一副液体移除单元,并在所述副液体移除单元与所述主液体移除单元之间形成一第二风口,产生一伯努利现象,进而藉由所述第二风口带走靠近一容器侧壁的液体,避免液体的累积。In view of this, an object of the present invention is to provide a wet process device, by arranging a secondary liquid removal unit beside a main liquid removal unit, and between the secondary liquid removal unit and the main liquid removal unit A second tuyere is formed between the two to generate a Bernoulli phenomenon, and then the liquid close to the side wall of a container is taken away by the second tuyere to avoid the accumulation of liquid.
为达成上述目的,本发明提供一种湿式制程装置,其包括一第一容器、一主液体移除单元、一气体提供单元以及一副液体移除单元。In order to achieve the above object, the present invention provides a wet process apparatus, which includes a first container, a main liquid removal unit, a gas supply unit, and a secondary liquid removal unit.
所述第一容器,包括一第一侧壁的一开口,用于让一基板沿着所述第一容器的第一轴从所述开口离开或进入所述第一容器。所述主液体移除单元设置在所述第一容器内部靠近所述第一侧壁与所述开口之区域,并且所述主液体移除单元包括第一风口。所述气体提供单元提供一气体至所述主液体移除单元,以由所述第一风口流向所述基板。所述副液体移除单元邻接于所述主液体移除单元,所述副液体移除单元与所述主液体移除单元之间形成一第二风口。所述副液体移除单元包括连接至所述第一侧壁的一导板。The first container includes an opening in a first side wall for allowing a substrate to exit or enter the first container along a first axis of the first container from the opening. The main liquid removing unit is disposed in an area inside the first container close to the first side wall and the opening, and the main liquid removing unit includes a first tuyere. The gas supply unit supplies a gas to the main liquid removal unit to flow to the substrate from the first tuyere. The auxiliary liquid removing unit is adjacent to the main liquid removing unit, and a second tuyere is formed between the auxiliary liquid removing unit and the main liquid removing unit. The secondary liquid removal unit includes a guide plate connected to the first side wall.
所述主液体移除单元、所述第一侧壁、所述导板以及所述副液体移除单元之间的物质依序经过所述导板、所述副液体移除单元往所述第二风口移动。Substances between the main liquid removal unit, the first side wall, the guide plate and the auxiliary liquid removal unit pass through the guide plate and the auxiliary liquid removal unit in sequence to the second tuyere move.
在一优选实施例中,所述第二风口的位置较所述第一风口远离所述开口。In a preferred embodiment, the position of the second tuyere is farther from the opening than the first tuyere.
在一优选实施例中,所述气体在所述第二风口产生的第一气体压力小于所述主液体移除单元、所述第一侧壁、所述导板以及所述副液体移除单元之间的第二气体压力。In a preferred embodiment, the first gas pressure generated by the gas at the second tuyere is lower than the pressure between the main liquid removal unit, the first side wall, the guide plate and the auxiliary liquid removal unit. the second gas pressure in between.
在一优选实施例中,所述气体是洁净干燥气体。In a preferred embodiment, the gas is a clean dry gas.
在一优选实施例中,所述主液体移除单元以及所述副液体移除单元设置于所述基板的上方。In a preferred embodiment, the main liquid removal unit and the auxiliary liquid removal unit are disposed above the substrate.
在一优选实施例中,所述第一风口的方向与所述第一轴的第一夹角介于180-270度。In a preferred embodiment, the first included angle between the direction of the first tuyere and the first axis is between 180-270 degrees.
在一优选实施例中,所述第二风口的方向与所述第一轴的第二夹角介于180-270度。In a preferred embodiment, the second included angle between the direction of the second tuyere and the first axis is between 180-270 degrees.
在一优选实施例中,所述第二夹角小于所述第一夹角。In a preferred embodiment, the second included angle is smaller than the first included angle.
相较于先前技术,本发明通过在一主液体移除单元旁设置一副液体移除单元,并在所述副液体移除单元与所述主液体移除单元之间形成一第二风口,产生一伯努利现象,进而藉由所述第二风口带走靠近一容器侧壁的液体,避免液体的累积。Compared with the prior art, the present invention provides a secondary liquid removing unit beside a main liquid removing unit, and forms a second tuyere between the secondary liquid removing unit and the main liquid removing unit, A Bernoulli phenomenon is generated, and the liquid close to the side wall of a container is taken away by the second tuyere to avoid the accumulation of liquid.
附图说明Description of drawings
图1,绘示现有技术的湿式制程装置之示意图;FIG. 1 is a schematic diagram of a wet process apparatus in the prior art;
图2,绘示现有技术的湿式制程装置之剖面侧视图;FIG. 2 is a cross-sectional side view of a prior art wet processing apparatus;
图3,绘示本发明的湿式制程装置之示意图;FIG. 3 is a schematic diagram of the wet process apparatus of the present invention;
图4,绘示本发明的湿式制程装置之剖面侧视图;以及FIG. 4 is a cross-sectional side view of the wet processing apparatus of the present invention; and
图5,绘示本发明的第一夹角以及第二夹角的示意图。FIG. 5 is a schematic diagram showing the first included angle and the second included angle of the present invention.
具体实施方式Detailed ways
以下参照附图详细说明的实施例将会使得本发明的优点和特征以及实现这些优点和特征的方法更加明确。但是,本发明不局限于以下所公开的实施例,本发明能够以互不相同的各种方式实施,以下所公开的实施例仅用于使本发明的公开内容更加完整,有助于本发明所属技术领域的普通技术人员能够完整地理解本发明之范畴,本发明是根据申请专利范围而定义。在说明书全文中,相同的附图标记表示相同的装置组件。The embodiments described in detail below with reference to the accompanying drawings will make the advantages and features of the present invention and the methods for achieving them more apparent. However, the present invention is not limited to the embodiments disclosed below, and the present invention can be implemented in various ways different from each other. The embodiments disclosed below are only used to make the disclosure of the present invention more complete and contribute to the present invention Those of ordinary skill in the art can fully understand the scope of the present invention, and the present invention is defined according to the scope of the patent application. Throughout the specification, the same reference numerals refer to the same device components.
参考图3-5。图3绘示本发明的湿式制程装置100之示意图。图4绘示本发明的湿式制程装置100之剖面侧视图。图5绘示本发明的第一夹角161以及第二夹角181的示意图。Refer to Figures 3-5. FIG. 3 is a schematic diagram of the
所述湿式制程装置100包括一第一容器110、一主液体移除单元150、一气体提供单元210以及一副液体移除单元170。The
所述第一容器110包括一第一侧壁112的一开口120用于让一基板140沿着所述第一容器110的第一轴130从所述开口120离开或进入所述第一容器110。所述主液体移除单元150设置第一容器110内部靠近所述第一侧壁112与所述开口120之区域,并且所述主液体移除单元150包括第一风口160。所述第一风口160的方向与所述第一轴130的第一夹角161介于180-270度。所述气体提供单元210提供一气体至所述主液体移除单元150,以由所述第一风口160流向所述基板140。优选地,所述气体是干燥洁净气体(clean dry air,CDA)。所述副液体移除单元170邻接于所述主液体移除单元150,并且远离所述开口120,所述副液体移除单元170与所述主液体移除单元150之间形成一第二风口180。所述副液体移除单元170连接至所述第一侧壁112的一导板190。所述第二风口180的位置较所述第一风口160远离所述开口120。所述第二风口180的方向与所述第一轴130的第二夹角181介于180-270度。The
本发明中藉由利用伯努利定律(Bernoulli's principle),所述气体提供单元210提供气体,将气体从所述第一风口160上的液体200往左吹,会在所述第二风口180处产生一个高速的流场。所述气体在所述第二风口180产生的第一气体压力P1小于所述主液体移除单元150、所述第一侧壁112、所述导板190以及所述副液体移除单元170之间的第二气体压力P2。详细地,根据伯努利定律,在一个水平流体(此处的高低差可忽略不计)中,流速高的地方其压力就会小,因此所述第二风口180处的所述第一气体压力P1会小于所述气体压力P2,因此,所述主液体移除单元150、所述第一侧壁112、所述导板190以及所述副液体移除单元170之间的空气就会带着周围的液体200被拉往所述第二风口180,进而移除靠近所述第一侧壁112的液体。In the present invention, by using Bernoulli's principle, the
优选地,所述第二夹角181小于所述第一夹角161。因此所述第二风口180能够进一步辅助所述第一风口160将所述液体200自所述基板140上移除。进一步,所述主液体移除单元150以及所述副液体移除单元170设置于所述基板140移动方向的上方。然而,在其他优选实施例中,所述主液体移除单元150以及所述副液体移除单元170设置于所述基板140移动方向的下方,以便因应去除在所述基板140下方的液体。在本优选实施例中,所述主液体移除单元150以及所述副液体移除单元170均设置在所述基板140的上方,而所述开口120是在右侧,所述第一夹角161以及所述第二夹角181的角度才会如此设计;举例而言,当所述主液体移除单元150以及所述副液体移除单元170均设置在所述基板140的下方,而所述开口120仍是在右侧,所述第一夹角161以及所述第二夹角181的角度就会是介于90-180度。Preferably, the second included
相较于现有技术,本发明不需提供气体至所述副液体移除单元170,亦即只需要使用相同的空气量,然而,却能够通过产生伯努利现象进而额外在所述第二风口180处产生拉力,进而能够将靠近所述第一侧壁112的所述液体200通过所述第二风口180被抽走,进而避免其掉落至所述基板140靠近所述第一侧壁112处。Compared with the prior art, the present invention does not need to provide gas to the secondary
虽然本发明已用优选实施例揭露如上,然其并非用以限定本发明,本发明所属技术领域中具有通常知识者,在不脱离本发明之精神和范围内,当可作各种之更动与润饰,因此本发明之保护范围当视后附之申请专利范围所界定者为准。Although the present invention has been disclosed above with preferred embodiments, it is not intended to limit the present invention. Those skilled in the art to which the present invention pertains can make various modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the appended patent application.
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CN101034223A (en) * | 2007-05-14 | 2007-09-12 | 友达光电股份有限公司 | Substrate cleaning device, substrate technical equipment and cleaning method of substrate cleaning device |
CN105489475A (en) * | 2015-12-09 | 2016-04-13 | 武汉华星光电技术有限公司 | Wet processing device and TFT (thin film transistor) substrate drying method |
CN206293414U (en) * | 2016-10-28 | 2017-06-30 | 盟立自动化股份有限公司 | Wet process equipment |
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