CN108019902B - Method and device for cooling circuit board of air conditioner - Google Patents
Method and device for cooling circuit board of air conditioner Download PDFInfo
- Publication number
- CN108019902B CN108019902B CN201610932868.4A CN201610932868A CN108019902B CN 108019902 B CN108019902 B CN 108019902B CN 201610932868 A CN201610932868 A CN 201610932868A CN 108019902 B CN108019902 B CN 108019902B
- Authority
- CN
- China
- Prior art keywords
- flow
- circuit board
- flow valve
- current
- flow rate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本发明公开了一种空调电路板冷却方法及装置,属于空调领域。该方法包括:获取电路板的工作电流;当工作电流大于预设电流时,开启流量阀。该装置包括电流计和控制器;电流计用于测量电路板的工作电流;当电流计测量的工作电流大于预设电流时,控制器用于开启流量阀。根据本发明实施例的冷却方法,获取电路板的工作电流,当电路板的工作电流大于预设电流时,开启流量阀;根据本发明实施例的冷却装置,电流计,用于测量电路板的工作电流;当电流计测量的工作电流大于预设电流时,控制器用于开启流量阀,由于电路板的工作电流是整个电路板的电流,根据电路板的不同位置的工作电流控制电路板温度的结果一致。
The invention discloses a cooling method and device for an air conditioner circuit board, belonging to the field of air conditioners. The method includes: obtaining the working current of the circuit board; when the working current is greater than the preset current, opening the flow valve. The device includes an ammeter and a controller; the ammeter is used to measure the working current of the circuit board; when the working current measured by the ammeter is greater than the preset current, the controller is used to open the flow valve. According to the cooling method of the embodiment of the present invention, the working current of the circuit board is obtained, and when the working current of the circuit board is greater than the preset current, the flow valve is opened; the cooling device according to the embodiment of the present invention, the ammeter, is used to measure the Working current; when the working current measured by the ammeter is greater than the preset current, the controller is used to open the flow valve. Since the working current of the circuit board is the current of the entire circuit board, the temperature of the circuit board is controlled according to the working current at different positions of the circuit board. The results were consistent.
Description
技术领域technical field
本发明涉及空调技术领域,特别涉及一种空调电路板冷却方法及装置。The present invention relates to the technical field of air conditioners, and in particular, to a method and device for cooling a circuit board of an air conditioner.
背景技术Background technique
制冷系统的控制器的寿命与其工作温度密切相关,控制器工作过程产生的热量若不能及时散发会影响其工作稳定性和可靠性。The life of the controller of the refrigeration system is closely related to its working temperature. If the heat generated in the working process of the controller cannot be dissipated in time, it will affect its working stability and reliability.
现有技术公开了一空调器,包括压缩机、冷凝器、节流元件和蒸发器,并依次串联形成回路;在压缩机的回气管和蒸发器的出气管上并联一电控散热组件,该电控散热组件包括电控板和用于对电控板进行散热的散热管,以及用于调节所述散热管的流量的控制阀组件;控制阀组件可以根据电控板的温度实时地调节散热管内的冷媒流量,散热管内的冷媒与电控板换热以降低电控板的温度,从而保证电控板温度的稳定性。电控板温度是通过温度传感器测量的,温度传感器只能放置于电控板的某一固定位置,而电控板不同的位置温度可能不一样,会出现同一工作状况,温度传感器放于电控板不同的位置时控制电控板温度的结果不一致。The prior art discloses an air conditioner, which includes a compressor, a condenser, a throttling element and an evaporator, which are connected in series to form a loop; an electronically controlled heat dissipation component is connected in parallel on the air return pipe of the compressor and the air outlet pipe of the evaporator. The electronically controlled heat dissipation assembly includes an electronic control board, a heat dissipation pipe for cooling the electronic control board, and a control valve assembly for adjusting the flow rate of the heat dissipation pipe; the control valve assembly can adjust the heat dissipation in real time according to the temperature of the electronic control board The refrigerant flow in the tube and the refrigerant in the heat pipe exchange heat with the electric control board to reduce the temperature of the electric control board, thereby ensuring the stability of the temperature of the electric control board. The temperature of the electric control board is measured by the temperature sensor. The temperature sensor can only be placed in a certain fixed position of the electric control board. The temperature of different positions of the electric control board may be different, and the same working condition will occur. The temperature sensor is placed in the electric control board. The results of controlling the temperature of the electronic control board are inconsistent when the board is in different positions.
发明内容SUMMARY OF THE INVENTION
本发明实施例提供了一种空调电路板冷却方法及装置,旨在解决同一工作状况下,温度传感器放于电控板不同的位置时控制电控板温度的结果不一致的问题。Embodiments of the present invention provide a method and device for cooling an air conditioner circuit board, aiming to solve the problem of inconsistent results of controlling the temperature of the electric control board when temperature sensors are placed in different positions of the electric control board under the same working condition.
一方面,本发明实施例提供了一种空调电路板冷却方法,冷却方法包括:In one aspect, an embodiment of the present invention provides a method for cooling an air conditioner circuit board, the cooling method comprising:
获取电路板的工作电流;Get the working current of the circuit board;
当工作电流大于预设电流时,开启流量阀。When the working current is greater than the preset current, open the flow valve.
另一方面,本发明实施例提供了一种空调电路板冷却装置,冷却装置包括电流计、流量阀和控制器;On the other hand, an embodiment of the present invention provides an air conditioner circuit board cooling device, the cooling device includes a current meter, a flow valve and a controller;
电流计用于测量电路板的工作电流;The ammeter is used to measure the working current of the circuit board;
当电流计测量的工作电流大于预设电流时,控制器用于开启流量阀。When the working current measured by the ammeter is greater than the preset current, the controller is used to open the flow valve.
本发明实施例公开的技术方案中,由于电路板的工作电流是整个电路板的电流,根据电路板的不同位置的工作电流控制电路板温度的结果一致。In the technical solutions disclosed in the embodiments of the present invention, since the operating current of the circuit board is the current of the entire circuit board, the results of controlling the temperature of the circuit board according to the operating currents at different positions of the circuit board are consistent.
附图说明Description of drawings
此处的附图被并入说明书中并构成本说明书的一部分,示出了符合本发明的实施例,并与说明书一起用于解释本发明的原理。The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention.
图1是根据一示例性实施例示出的一种空调电路板冷却方法的流程示意图;FIG. 1 is a schematic flowchart of a method for cooling an air conditioner circuit board according to an exemplary embodiment;
图2是根据一示例性实施例示出的一种空调电路板冷却方法的流程示意图;FIG. 2 is a schematic flowchart of a method for cooling a circuit board of an air conditioner according to an exemplary embodiment;
图3是根据一示例性实施例示出的一种空调电路板冷却装置的结构图。FIG. 3 is a structural diagram of an air conditioner circuit board cooling device according to an exemplary embodiment.
附图标记说明:1、电流计;2、回气管;3、冷却回路;4、流量阀;5、电路板;6、膨胀阀;7、控制器。Explanation of reference numerals: 1, galvanometer; 2, air return pipe; 3, cooling circuit; 4, flow valve; 5, circuit board; 6, expansion valve; 7, controller.
具体实施方式Detailed ways
以下描述和附图充分地示出本发明的具体实施方案,以使本领域的技术人员能够实践它们。实施例仅代表可能的变化。除非明确要求,否则单独的部件和功能是可选的,并且操作的顺序可以变化。一些实施方案的部分和特征可以被包括在或替换其他实施方案的部分和特征。本发明的实施方案的范围包括权利要求书的整个范围,以及权利要求书的所有可获得的等同物。在本文中,各实施方案可以被单独地或总地用术语“发明”来表示,这仅仅是为了方便,并且如果事实上公开了超过一个的发明,不是要自动地限制该应用的范围为任何单个发明或发明构思。本文中,诸如第一和第二等之类的关系术语仅仅用于将一个实体或者操作与另一个实体或操作区分开来,而不要求或者暗示这些实体或操作之间存在任何实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素。本文中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。对于实施例公开的方法、产品等而言,由于其与实施例公开的方法部分相对应,所以描述的比较简单,相关之处参见方法部分说明即可。The following description and drawings sufficiently illustrate specific embodiments of the invention to enable those skilled in the art to practice them. The examples represent only possible variations. Unless expressly required, individual components and functions are optional and the order of operations may vary. Portions and features of some embodiments may be included in or substituted for those of other embodiments. The scope of embodiments of the invention includes the full scope of the claims, along with all available equivalents of the claims. Various embodiments may be referred to herein by the term "invention," individually or collectively, for convenience only, and are not intended to automatically limit the scope of this application to any if more than one invention is in fact disclosed. A single invention or inventive concept. Herein, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation and do not require or imply any actual relationship between these entities or operations or order. Moreover, the terms "comprising", "comprising" or any other variation thereof are intended to encompass a non-exclusive inclusion such that a process, method or apparatus comprising a list of elements includes not only those elements, but also others not expressly listed elements. The various embodiments herein are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and it is sufficient to refer to each other for the same and similar parts between the various embodiments. For the methods, products, etc. disclosed in the embodiments, since they correspond to the method parts disclosed in the embodiments, the description is relatively simple, and the relevant parts can be referred to the description of the method part.
如图1所示,本发明实施例提供了一种冷却方法,包括:As shown in FIG. 1, an embodiment of the present invention provides a cooling method, including:
S101、获取电路板的工作电流;S101. Obtain the working current of the circuit board;
S102、当工作电流大于预设电流时,开启流量阀。S102, when the working current is greater than the preset current, open the flow valve.
电路板的电流可以通过电流计来测量,也可以用其它测量电流的仪器来测量;电路板选定以后电路板的电阻确定,电路板的散热量随着电路板的电流增大而增大。The current of the circuit board can be measured by a galvanometer, or it can be measured with other current measuring instruments; after the circuit board is selected, the resistance of the circuit board is determined, and the heat dissipation of the circuit board increases with the increase of the current of the circuit board.
预设电流可以是电路板的最高安全电流,也可以是根据电路板的最高安全电流而设定的电流,只要保证电路板在预设电流下正常工作即可,当电路板的工作环境散热能力高时,预设电流可以设置的高,为了提高电路板的散热能力也可以在电路板的周围设置冷却风扇;电路板的预设电流可以开始设置好,也可以后期根据电路板1的散热能力调整,只要保证电路板在预设电流下长期正常工作产生的热量能散掉,电路板的温度不会逐渐升高即可。The preset current can be the highest safe current of the circuit board, or it can be the current set according to the highest safe current of the circuit board, as long as the circuit board can work normally under the preset current. When it is high, the preset current can be set high. In order to improve the heat dissipation capacity of the circuit board, a cooling fan can also be set around the circuit board; the preset current of the circuit board can be set at the beginning, or later according to the heat dissipation capacity of the circuit board 1 Adjustment, as long as the heat generated by the long-term normal operation of the circuit board under the preset current can be dissipated, and the temperature of the circuit board will not gradually increase.
当电路板的工作电流小于等于预设电流时,电路板产生的发热量可以散掉,电路板的温度不会逐渐升高。When the operating current of the circuit board is less than or equal to the preset current, the heat generated by the circuit board can be dissipated, and the temperature of the circuit board will not gradually increase.
当电路板的工作电流大于预设电流时,电路板散发的热量小于电路板产生的热量,电路板的温度逐渐升高,如果电路板的工作电流长期大于预设电流,最终导致电路板或电路板上的电子元件无法正常工作、损坏或者使用寿命缩短等问题。When the working current of the circuit board is greater than the preset current, the heat emitted by the circuit board is less than the heat generated by the circuit board, and the temperature of the circuit board gradually increases. If the working current of the circuit board is greater than the preset current for a long time, the circuit board or circuit The electronic components on the board are not working properly, are damaged, or have a shortened lifespan.
开启流量阀可以是使流量阀的流量从无到有的调节,也可以是使流量阀的流量从小到大的调节。Opening the flow valve can be to adjust the flow of the flow valve from scratch, or it can be to adjust the flow of the flow valve from small to large.
根据本发明实施例的冷却方法,获取电路板的工作电流,当电路板的工作电流大于预设电流时,开启流量阀,由于电路板的工作电流是整个电路板的电流,根据电路板的不同位置的工作电流控制电路板温度的结果一致。According to the cooling method of the embodiment of the present invention, the working current of the circuit board is obtained, and when the working current of the circuit board is greater than the preset current, the flow valve is opened. The results are consistent with the position of the operating current to control the board temperature.
进一步可选的,步骤S102中开启流量阀包括:Further optionally, opening the flow valve in step S102 includes:
S1021、开启流量阀的流量值到第一流量;S1021, open the flow value of the flow valve to the first flow;
S1022、获取电路板单位时间从预设电流到工作电流的发热量;S1022, obtaining the heat generation of the circuit board per unit time from the preset current to the working current;
S1023、获取单位时间开启流量阀的流量值到第一流量冷媒流经电路板的散热量;S1023, obtaining the flow value of the flow valve opened per unit time to the heat dissipation of the first flow refrigerant flowing through the circuit board;
当发热量大于散热量时,调节流量阀的流量值到第二流量,第二流量大于第一流量;When the calorific value is greater than the heat dissipation, adjust the flow value of the flow valve to the second flow, and the second flow is greater than the first flow;
当发热量小于散热量时,调节流量阀的流量值到第三流量,第三流量小于第一流量;When the calorific value is less than the heat dissipation, adjust the flow value of the flow valve to a third flow, and the third flow is smaller than the first flow;
当发热量等于散热量时,保持流量阀流量不变。When the heat generation is equal to the heat dissipation, keep the flow rate of the flow valve unchanged.
第一流量可以是流量阀的最小调节流量,也可以是流量阀的最大调节流量,还可以是流量阀可调节流量的任一流量。The first flow rate may be the minimum regulated flow rate of the flow valve, or the maximum regulated flow rate of the flow valve, or any flow rate of the adjustable flow rate of the flow valve.
第一流量确定后,散热量确定,发热量确定。After the first flow rate is determined, the heat dissipation amount is determined, and the calorific value is determined.
如图2所示,当发热量大于散热量时,将流量阀的流量调大,即调节流量阀到第二流量,当发热量大于流量阀为第二流量的散热量时,再次调大流量阀的流量,不断调大流量阀的流量,直到流量阀的流量为第n流量时,其中第n流量为大于等于两次调节的流量,发热量小于等于流量阀为第n流量的散热量,可以不再调节流量阀的流量,保持流量阀的流量不变工作。As shown in Figure 2, when the calorific value is greater than the heat dissipation, increase the flow rate of the flow valve, that is, adjust the flow valve to the second flow rate. The flow rate of the valve, continuously adjust the flow rate of the flow valve until the flow rate of the flow valve is the nth flow, where the nth flow is greater than or equal to the flow of two adjustments, and the calorific value is less than or equal to the heat dissipation of the flow valve for the nth flow, The flow of the flow valve can no longer be adjusted, and the flow of the flow valve can be kept unchanged.
可以在开始给流量阀设一个较小的流量,逐渐调大流量,防止出现流量阀调的流量太大,发热量远远小于散热量,电路板温度快速降低而产生凝水现象。You can set a small flow rate for the flow valve at the beginning, and gradually increase the flow rate to prevent the flow rate adjusted by the flow valve from being too large, the calorific value is far less than the heat dissipation, and the temperature of the circuit board is rapidly reduced to cause condensation.
如图2所示,当发热量小于散热量时,将流量阀的流量调小,即调节流量阀到第三流量,当发热量小于流量阀为第三流量的散热量时,再次调小流量阀的流量,不断调小流量阀的流量,直到流量阀的流量为第m流量时,其中第m流量为大于等于两次调节的流量,发热量大于等于流量阀为第m流量的散热量,可以不再调节流量阀的流量,保持流量阀的流量不变工作。As shown in Figure 2, when the calorific value is less than the heat dissipation, reduce the flow of the flow valve, that is, adjust the flow valve to the third flow; when the calorific value is less than the heat dissipation of the third flow, adjust the flow again The flow rate of the valve, continuously adjust the flow rate of the flow valve until the flow rate of the flow valve is the mth flow rate, where the mth flow rate is greater than or equal to the flow rate adjusted twice, and the calorific value is greater than or equal to the heat dissipation of the flow valve for the mth flow rate, The flow of the flow valve can no longer be adjusted, and the flow of the flow valve can be kept unchanged.
可以在开始给流量阀设一个较大的流量,逐渐调小流量,防止出现流量阀调的流量太大,发热量远远小于散热量,电路板温度快速降低而产生凝水现象。You can set a larger flow rate for the flow valve at the beginning, and gradually adjust the flow rate to prevent the flow rate adjusted by the flow valve from being too large, the calorific value is far less than the heat dissipation, and the temperature of the circuit board is rapidly reduced to cause condensation.
当发热量大于流量阀为第m流量的散热量,还可以再逐渐调大流量阀的流量,按着开始为较小流量的方法,逐渐调大流量阀的流量;当发热量小于流量阀为第n流量的散热量,还可以逐渐调小流量阀的流量,按着开始为较大流量的方法,逐渐调小流量阀的流量;直至找到一个散热量与发热量相当的流量阀的流量。When the calorific value is greater than the heat dissipation of the mth flow rate of the flow valve, the flow rate of the flow valve can be gradually increased, and the flow rate of the flow valve can be gradually increased according to the method of starting with a smaller flow rate; when the calorific value is less than the flow rate of the flow valve, the For the heat dissipation of the nth flow rate, the flow rate of the flow valve can also be gradually reduced, and the flow rate of the flow valve can be gradually reduced according to the method of starting with a larger flow rate;
其中步骤S1022获取发热量和步骤S1023获取散热量的顺序可以为先进行步骤S1022获取发热量再进行步骤S1023获取散热量,或者先进行步骤S1023获取散热量再进行步骤S1022获取发热量,还可以同时进行步骤S1022获取发热量和步骤S1023获取散热量。The sequence of obtaining the calorific value in step S1022 and obtaining the radiating amount in step S1023 may be to first perform step S1022 to obtain the calorific value and then proceed to step S1023 to obtain the radiating amount, or first perform step S1023 to obtain the radiating amount and then proceed to step S1022 to obtain the calorific value, or at the same time Go to step S1022 to obtain the heat generation amount and step S1023 to obtain the heat dissipation amount.
进一步可选的,步骤S1022中获取发热量包括:Further optionally, obtaining the calorific value in step S1022 includes:
根据如下公式获取发热量:The calorific value is obtained according to the following formula:
Q发=I当前 2R-I预设 2RQ hair = I current 2 R - I preset 2 R
其中,Q发为发热量,I当前为电路板的工作电流,I预设为电路板的预设电流,R为电路板的电阻。Wherein, Q is the calorific value, I is the current working current of the circuit board, I preset is the preset current of the circuit board, and R is the resistance of the circuit board.
当工作电流小于预设电流时,Q发为负值,表示此时电路板的产生的发热量,可以被周围环境散掉,电路板的温度不会逐渐升高;当工作电流等于预设电流时,Q发为零,表示此时电路板的产生的发热量,正好可以被周围环境散掉,电路板的温度不会逐渐升高。When the working current is less than the preset current, Q is a negative value, indicating that the heat generated by the circuit board can be dissipated by the surrounding environment, and the temperature of the circuit board will not gradually increase; when the working current is equal to the preset current When Q is zero, it means that the heat generated by the circuit board at this time can just be dissipated by the surrounding environment, and the temperature of the circuit board will not gradually increase.
进一步可选的,步骤S1023中获取散热量包括:Further optionally, obtaining the heat dissipation amount in step S1023 includes:
S10231、获取开启流量阀的流量值到第一流量冷媒调节电路板温度的调节量;S10231. Obtain the adjustment amount from the flow value of the open flow valve to the temperature of the first flow refrigerant adjustment circuit board;
S10232、获取单位时间流过流量阀的冷媒体积;S10232. Obtain the volume of refrigerant flowing through the flow valve per unit time;
S10233、根据如下公式计算单位时间的散热量:S10233. Calculate the heat dissipation per unit time according to the following formula:
Q散=ΔTCPV Qscatter = ΔTCPV
其中,Q散为散热量,ΔT为温度的调节量,C为冷媒的比热容,P为冷媒的密度,V为冷媒体积。Among them, Q is the amount of heat dissipation , ΔT is the adjustment amount of temperature, C is the specific heat capacity of the refrigerant, P is the density of the refrigerant, and V is the volume of the refrigerant.
其中步骤S10231获取温度的调节量与步骤S10232获取冷媒体积的顺序可以为先进行步骤S10231获取温度的调节量再进行步骤S10232获取冷媒体积,也可以先进行步骤S10232获取冷媒体积再进行步骤S10231获取温度的调节量,还可以同时进行步骤S10231获取温度的调节量和步骤S10232获取冷媒体积。The order of obtaining the temperature adjustment amount in step S10231 and obtaining the cooling medium volume in step S10232 may be to first perform step S10231 to obtain the temperature adjustment amount and then perform step S10232 to obtain the cooling medium volume, or perform step S10232 to obtain the cooling medium volume first and then perform step S10231 to obtain the temperature. It is also possible to perform step S10231 to obtain the temperature adjustment amount and step S10232 to obtain the refrigerant volume at the same time.
可选的,步骤S10231获取温度的调节量包括:Optionally, in step S10231, obtaining the adjustment amount of the temperature includes:
获取冷媒流经冷却回路前的温度T1;Obtain the temperature T1 before the refrigerant flows through the cooling circuit;
获取冷媒流经冷却回路后的温度T2;Obtain the temperature T2 after the refrigerant flows through the cooling circuit;
确定T2减T1的差值为调节量。Determine the difference between T2 minus T1 as the adjustment amount.
其中获取温度T1和获取温度T2的顺序可以为先获取温度T1再获取温度T2,也可以先获取温度T2再获取温度T1,还可以同时获取温度T1和温度T2.The order of obtaining the temperature T1 and obtaining the temperature T2 may be to obtain the temperature T1 first and then obtain the temperature T2, or obtain the temperature T2 first and then obtain the temperature T1, or obtain the temperature T1 and the temperature T2 at the same time.
开启流量阀的流量值到第一流量冷媒调节电路板温度的调节量也可以是空调提前设定好的量,即在空调中存有流量阀对应流量的温度的调节量,到时直接调用即可。The adjustment amount from the flow value of opening the flow valve to the temperature of the first flow refrigerant adjustment circuit board can also be the amount set in advance by the air conditioner, that is, the adjustment amount of the temperature corresponding to the flow rate of the flow valve is stored in the air conditioner, and it can be directly called at that time. Can.
冷媒的体积和冷媒的流量有关,当流量阀的流量确定以后,流过流量阀冷媒的体积也就可以确定。可以根据流量阀的开度大小计算单位时间流过流量阀的体积。The volume of the refrigerant is related to the flow rate of the refrigerant. When the flow rate of the flow valve is determined, the volume of the refrigerant flowing through the flow valve can also be determined. The volume flowing through the flow valve per unit time can be calculated according to the opening of the flow valve.
可选的,上述本发明实施例的冷却方法,获取电路板的工作电流可以为间隔获取或者也可以为实时获取。当电路板上的电子元件有敏感元件时,可以采用实时获取,以便实时调控,当电路板上的电子元件为耐热性好的元件时,可以间隔获取工作电流,来间隔控制,具体间隔时间可以根据电路板的耐热性来确定,也可以利用实验手段来确定间隔控制的时间,只要保证电路板可以长期正常工作即可。Optionally, in the cooling method according to the above embodiment of the present invention, obtaining the operating current of the circuit board may be obtained at intervals or may also be obtained in real time. When the electronic components on the circuit board have sensitive components, real-time acquisition can be used for real-time control. When the electronic components on the circuit board are components with good heat resistance, the working current can be obtained at intervals to control the interval. The specific interval time It can be determined according to the heat resistance of the circuit board, or the interval control time can be determined by experimental means, as long as the circuit board can work normally for a long time.
如图3所示,本发明实施例提供了一种冷却装置,包括:电流计1、流量阀4和控制器7;As shown in FIG. 3 , an embodiment of the present invention provides a cooling device, including: a current meter 1 , a
电流计1用于测量电路板5的工作电流;The ammeter 1 is used to measure the working current of the circuit board 5;
当电流计1测量的工作电流大于预设电流时,控制器7用于开启流量阀4。When the working current measured by the ammeter 1 is greater than the preset current, the controller 7 is used to open the
根据本发明实施例的冷却装置,电流计1用于测量电路板的工作电流;当电流计测量的工作电流大于预设电流时,控制器7用于开启流量阀4,由于电路板的工作电流是整个电路板的电流,根据电路板5的不同位置的工作电流控制电路板5温度的结果一致。According to the cooling device of the embodiment of the present invention, the ammeter 1 is used to measure the working current of the circuit board; when the working current measured by the ammeter is greater than the preset current, the controller 7 is used to open the
可选的,本发明实施例的冷却装置,控制器7还可以用于:Optionally, in the cooling device according to the embodiment of the present invention, the controller 7 can also be used for:
开启流量阀4的流量值到第一流量;Open the flow value of the
获取电路板5单位时间从预设电流到工作电流的发热量;Obtain the calorific value of the circuit board 5 unit time from the preset current to the working current;
获取单位时间开启流量阀4的流量值到第一流量冷媒流经电路板5的散热量;Obtain the flow value of opening the
当发热量大于散热量时,调节流量阀4的流量值到第二流量,第二流量大于第一流量;When the calorific value is greater than the heat dissipation, adjust the flow value of the
当发热量小于散热量时,用于调节流量阀4的流量值到第三流量,第三流量小于第一流量;When the calorific value is less than the heat dissipation, it is used to adjust the flow value of the
当发热量等于散热量时,用于保持流量阀4流量不变。When the heat generation is equal to the heat dissipation, it is used to keep the flow rate of the
第一流量可以是流量阀4的最小调节流量,也可以是流量阀4的最大调节流量,还可以是流量阀4可调节流量的任一流量。The first flow rate may be the minimum regulated flow rate of the
第一流量确定后,散热量确定,发热量确定。After the first flow rate is determined, the heat dissipation amount is determined, and the calorific value is determined.
如图2所示,当发热量大于散热量时,将流量阀4的流量调大,即调节流量阀4到第二流量,当发热量大于流量阀4为第二流量的散热量时,再次调大流量阀4的流量,不断调大流量阀4的流量,直到流量阀4的流量为第n流量时,其中第n流量为大于等于两次调节的流量,发热量小于等于流量阀4为第n流量的散热量,可以不再调节流量阀4的流量,保持流量阀4的流量不变工作。As shown in Figure 2, when the calorific value is greater than the heat dissipation, the flow rate of the
可以在开始给流量阀4设一个较小的流量,逐渐调大流量,防止出现流量阀4调的流量太大,发热量远远小于散热量,电路板5温度快速降低而产生凝水现象。You can set a small flow rate for the
如图2所示,当发热量小于散热量时,将流量阀4的流量调小,即调节流量阀4到第三流量,当发热量小于流量阀为第三流量的散热量时,再次调小流量阀4的流量,不断调小流量阀4的流量,直到流量阀4的流量为第m流量时,其中第m流量为大于等于两次调节的流量,发热量大于等于流量阀4为第m流量的散热量,可以不再调节流量阀4的流量,保持流量阀4的流量不变工作。As shown in Figure 2, when the calorific value is less than the heat dissipation, the flow rate of the
可以在开始给流量阀4设一个较大的流量,逐渐调小流量,防止出现流量阀4调的流量太大,发热量远远小于散热量,电路板5温度快速降低而产生凝水现象。You can set a larger flow rate for the
当发热量大于流量阀4为第m流量的散热量,还可以再逐渐调大流量阀4的流量,按着开始为较小流量的方法,逐渐调大流量阀4的流量;当发热量小于流量阀4为第n流量的散热量,还可以逐渐调小流量阀4的流量,按着开始为较大流量的方法,逐渐调小流量阀4的流量;直至找到一个散热量与发热量相当的流量阀4的流量。When the calorific value is greater than the heat dissipation of the
进一步可选的,本发明实施例的冷却装置,控制器还用于:Further optionally, in the cooling device according to the embodiment of the present invention, the controller is also used for:
根据如下公式计算电路板单位时间从预设电流到工作电流的发热量;Calculate the calorific value of the circuit board from the preset current to the working current per unit time according to the following formula;
Q发=I当前 2R-I预设 2RQ hair = I current 2 R - I preset 2 R
其中,Q发为发热量,I当前为电路板的工作电流,I预设为电路板的预设电流,R为电路板的电阻。Wherein, Q is the calorific value, I is the current working current of the circuit board, I preset is the preset current of the circuit board, and R is the resistance of the circuit board.
当工作电流小于预设电流时,Q发为负值,表示此时电路板5的产生的发热量,可以被周围环境散掉,电路板5的温度不会逐渐升高;当工作电流等于预设电流时,Q发为零,表示此时电路板5的产生的发热量,正好可以被周围环境散掉,电路板5的温度不会逐渐升高。When the working current is less than the preset current, Q is a negative value, indicating that the heat generated by the circuit board 5 can be dissipated by the surrounding environment, and the temperature of the circuit board 5 will not gradually increase; when the working current is equal to the preset When the current is set, Q is zero, which means that the heat generated by the circuit board 5 can just be dissipated by the surrounding environment, and the temperature of the circuit board 5 will not gradually increase.
进一步可选的,本发明实施例的冷却装置,控制器还用于:Further optionally, in the cooling device according to the embodiment of the present invention, the controller is also used for:
获取开启流量阀4的流量值到第一流量冷媒调节电路板温度的调节量;Obtain the adjustment amount from the flow value of the
获取单位时间流过流量阀的冷媒体积;Obtain the volume of refrigerant flowing through the flow valve per unit time;
根据如下公式计算单位时间开启流量阀4的流量值到第一流量冷媒流经电路板的的散热量:Calculate the heat dissipation from the flow value of the
Q散=ΔTCPV Qscatter = ΔTCPV
其中,Q散为散热量,ΔT为温度的调节量,C为冷媒的比热容,P为冷媒的密度,V为冷媒体积。Among them, Q is the amount of heat dissipation , ΔT is the adjustment amount of temperature, C is the specific heat capacity of the refrigerant, P is the density of the refrigerant, and V is the volume of the refrigerant.
可选的,本发明实施例的冷却装置可以包括温度传感器,温度传感器用于:Optionally, the cooling device in the embodiment of the present invention may include a temperature sensor, and the temperature sensor is used for:
获取冷媒流经冷却回路前的温度T1;Obtain the temperature T1 before the refrigerant flows through the cooling circuit;
获取冷媒流经冷却回路后的温度T2;Obtain the temperature T2 after the refrigerant flows through the cooling circuit;
确定T2减和T1的差值为开启流量阀4的流量值到第一流量冷媒调节电路板温度的调节量。It is determined that the difference between T2 minus T1 is the adjustment amount from the flow value of opening the
获取开启流量阀4的流量值到第一流量冷媒调节电路板5温度的调节量也可以是空调提前设定好的量,即在空调中存有流量阀对应流量的温度的调节量,到时直接调用即可。The adjustment amount obtained from the flow value of the
冷媒的体积和冷媒的流量有关,当流量阀4的流量确定以后,流过流量阀冷媒的体积也就可以确定。可以根据流量阀4的开度大小计算单位时间流过流量阀4的体积。The volume of the refrigerant is related to the flow rate of the refrigerant. After the flow rate of the
如图3所示,可选的,本发明实施例的冷却装置还可以包括:回气管2、和连接在回气管2上的冷却回路3;流量阀4连接在冷却回路3上,冷却回路3通过电路板5表面。As shown in FIG. 3 , optionally, the cooling device in the embodiment of the present invention may further include: a return pipe 2 and a
当打开启流量阀4,冷媒流经电路板5的表面,与电路板5进行热交换,将电路板5散发的热量带走。When the
可选的,本发明实施例的冷却装置还可以包括:膨胀阀6,膨胀阀6连接在回气管上,回气管与冷却回路并联,控制器7还用于开启膨胀阀6。膨胀阀6与流量阀4配合使用,用于控制流经回气管2与冷却回路3冷媒的流量,膨胀阀6和流量阀4都是用于调节管路上冷媒的流量,本领域技术人员可以用其它可以调节流量的阀体来替换,只要可以调节冷媒的流量即可。Optionally, the cooling device in the embodiment of the present invention may further include: an expansion valve 6 , the expansion valve 6 is connected to the air return pipe, and the air return pipe is connected in parallel with the cooling circuit, and the controller 7 is further configured to open the expansion valve 6 . The expansion valve 6 is used in conjunction with the
可选的,本发明实施例的冷却装置的流量阀的最大流量可以与回气管的流量相同,以便控制回气管的冷媒全部流经冷却回路3;膨胀阀的最大流量可以与回气管的流量相同,以便控制回气管的冷媒流量最大或没有。Optionally, the maximum flow rate of the flow valve of the cooling device in the embodiment of the present invention may be the same as the flow rate of the return pipe, so as to control all the refrigerant in the return pipe to flow through the
可选的,本发明的实施例的冷却装置的流量阀4可以为手动调节流量,或者流量阀4也可以为自动调节流量。Optionally, the
根据电路板5的发热量与冷却回路3中冷媒的散热量可以手动调节流量阀4的流量,直到电路板5的发热量小于等于冷却回路3中冷媒的散热量。The flow rate of the
控制器7可以根据电路板5的发热量与冷却回路3中冷媒的散热量可以自动调节流量阀4的流量,直到电路板5的发热量小于等于冷却回路3中冷媒的散热量。The controller 7 can automatically adjust the flow rate of the
应当理解的是,本发明并不局限于上面已经描述并在附图中示出的流程及结构,并且可以在不脱离其范围进行各种修改和改变。本发明的范围仅由所附的权利要求来限制。It should be understood that the present invention is not limited to the processes and structures that have been described above and shown in the accompanying drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present invention is limited only by the appended claims.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610932868.4A CN108019902B (en) | 2016-10-31 | 2016-10-31 | Method and device for cooling circuit board of air conditioner |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201610932868.4A CN108019902B (en) | 2016-10-31 | 2016-10-31 | Method and device for cooling circuit board of air conditioner |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108019902A CN108019902A (en) | 2018-05-11 |
CN108019902B true CN108019902B (en) | 2020-08-25 |
Family
ID=62069780
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201610932868.4A Active CN108019902B (en) | 2016-10-31 | 2016-10-31 | Method and device for cooling circuit board of air conditioner |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108019902B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN115247877A (en) * | 2022-06-24 | 2022-10-28 | 青岛海尔空调器有限总公司 | Method and device for controlling air conditioner, air conditioner and storage medium |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
BR112013001929A2 (en) * | 2011-06-29 | 2016-05-24 | Panasonic Corp | cooling device and air conditioner including the same |
JP5794197B2 (en) * | 2012-05-10 | 2015-10-14 | トヨタ自動車株式会社 | Fuel cell system and control method thereof |
CN103052305A (en) * | 2013-01-08 | 2013-04-17 | 南车株洲电力机车研究所有限公司 | Method, device and system for cooling power electronic heating element |
CN204006418U (en) * | 2014-06-06 | 2014-12-10 | 美的集团武汉制冷设备有限公司 | Electric-controlled box heat abstractor and the air-conditioning of refrigeration plant |
-
2016
- 2016-10-31 CN CN201610932868.4A patent/CN108019902B/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN108019902A (en) | 2018-05-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN105378575B (en) | Device and method for the aperture for controlling the valve in HVAC system | |
RU2573378C2 (en) | Device and method of valve opening control for hvac system | |
US9989943B2 (en) | HVAC systems and controls | |
US10533763B2 (en) | Controller of air-conditioning system and method for controlling air-conditioning system | |
US10161774B2 (en) | Systems and computer program products for measuring airflow rates in heating, ventilating, and air conditioning (HVAC) ducts and HVAC systems including the same | |
US9417149B2 (en) | System for calibration of a compressor unit in a heating, ventilation, and air conditioning system | |
JP2009031866A (en) | Flow control valve and flow control method | |
CN105423497A (en) | Control method and device of electronic expansion valve | |
WO2017011493A1 (en) | Systems for calibrating airflow rates in heating, ventilating, and air conditioning (hvac) ducts and hvac systems including the same | |
CN106338132B (en) | Air conditioner circuit board cooling method and device | |
CN108291734B (en) | Method and system for operating a heat exchanger | |
JP2023546685A (en) | Refrigerant leak sensor measurement adjustment system and method | |
CN110822615A (en) | Method and device for controlling expansion valve in multi-connected air conditioning system and storage medium | |
WO2019057039A1 (en) | Real-time humidity calculation method for air-conditioned room, and air-conditioner | |
CN107975920B (en) | Expansion valve control method and multi-line system | |
CN111207482A (en) | Air conditioner electronic expansion valve clamping adjustment control method and air conditioner | |
JP2006512553A (en) | Air conditioner for managing refrigerant charge | |
CN108019902B (en) | Method and device for cooling circuit board of air conditioner | |
CN108800417B (en) | Defrosting control method and system for outdoor unit of air conditioner | |
JP2010243002A (en) | Air conditioning system | |
JP2016056973A (en) | Air conditioning control device, air conditioning control method and air conditioning control program | |
KR20180072361A (en) | Apparatus for a performance test of air conditioner and method for testing thereof | |
CN105698452B (en) | The control method for exiting defrosting mode for heat pump and the heat pump using its method | |
US10684025B2 (en) | Method of controlling a fluid circulation system | |
JP4897850B2 (en) | Cooling tower performance evaluation system for air conditioning |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20201104 Address after: 266101 Haier Industrial Park, Haier Road, Laoshan District, Shandong, Qingdao, China Patentee after: QINGDAO HAIER AIR CONDITIONER GENERAL Corp.,Ltd. Patentee after: Haier Smart Home Co., Ltd. Address before: 266101 Haier Industrial Park, Haier Road, Laoshan District, Shandong, Qingdao, China Patentee before: QINGDAO HAIER AIR CONDITIONER GENERAL Corp.,Ltd. |