CN108012066A - A kind of high pixel modular structure and production technology - Google Patents

Abstract

A high-pixel module structure, including circuit boards, photosensitive chips, capacitive elements, gold wires, optical filters, lenses and mirror holders, the lens and mirror holders are integrally formed; the circuit board is injected and filled to form a sealing module, sealed The module is a rectangular structure. The sealing module fills and seals the non-photosensitive area of the photosensitive chip, the capacitive element and the gold wire; the bottom of the mirror base is glued to the upper surface of the sealing module, and the thickness of the glue is 0.1mm. A through hole is formed in the middle of the sealing module, the photosensitive area of the photosensitive chip is located in the through hole of the sealing module, and the axis of the mirror base coincides with the axis of the through hole. An annular support platform is arranged on the inner surface of the through hole, and the optical filter is installed on the annular support platform. The lens barrel and lens base are designed in one piece, which avoids threaded focusing and prevents the dust on the threads from falling onto the filter to form dirt and affect the image quality.

Description

A high pixel module structure and production process

technical field

The invention relates to the field of camera manufacturing, in particular to a high-pixel module structure and a production process.

Background technique

Defects in traditional fixed-focus modules: First, mobile phone imaging modules are composed of components such as lenses, mirror mounts, chips, filters, capacitors, connectors, and boards.

Second, the characteristics of high-pixel lenses, short focus (the module can be made shorter), large aperture (more light input, better image quality), and a large number of lenses (clearer image quality), which will lead to high lens production costs and good quality. low rate.

Third, the characteristics of high-pixel chips require larger image size, smaller structural size, and thinner thickness, so the pixel size must be small. If the pixel size is small, the dust control requirements will be stricter, otherwise it will be easy to image , so the manufacturing difficulty of the chip increases.

Fourth, the characteristics of high-pixel boards, flatness control, because the board needs to be routed inside, there are many or few lines, thick and thin, but the flatness must be absolutely guaranteed, so the difficulty of process production will increase.

Fifth, the characteristics of high-pixel modules. The camera module lens is an optical product, which has strict requirements on material, design, process, environment, and optical path. It needs to be cleaned by special processes during production, such as pure water cleaning and chemical cleaning. , Ion wind blowing, etc. Chips need special storage, moisture-proof and dust-proof. The board needs to be cleaned to remove rosin and solder paste, and it must also be protected from moisture and oxidation. These are properly arranged, and then the chip is placed on the board through the process (capacitors, connectors and other components have been placed on the board through SMT in the board factory), and then the chip's pad and the chip are connected with gold wires. The pads of the board are bridged together for conduction. Then the lens is locked into the lens holder through the locking machine, and the optical filter has been attached to the lens holder (6)) and assembled on the board through the machine, which forms a circuit-connected, optical Imaging module camera.

Due to these characteristics of high pixels, the production cost of lenses, chips, and boards is high, the production cost of modules is high, the yield rate is very difficult to control, and the efficiency is low. Because the chip needs to be assembled in a closed space, it needs to be fixed with glue when assembling the lens, and then the focusing test is carried out. During the focusing stage, the screw teeth rotate. Friction will be generated, which will generate tiny particles such as debris and dust. These tiny particles will be imaged when they fall on the chip. As mentioned above, because the pixel size of the chip is small, it is particularly sensitive to tiny dust and is easy to image, which seriously affects the module. imaging effect. In addition, for the debris and dust that will be imaged after being made into a module, it needs to be cleaned up through rework and maintenance. From the comprehensive point of view of time cost, labor cost, and heavy industry scrap cost, the cost is too high. Another difficult thing to control is focusing. It is mentioned above that the lens and the lens mount are adjusted to focus by moving up and down the thread, which means that the relationship between the lens and the lens mount is fixed, and the inclination cannot be adjusted for the optical axis of the chip. In addition, the board is not flat, and the chip will be tilted after assembly. When assembling the lens, the device can only go straight up and down, front and back, left and right, and cannot rotate 360°, so the effect of module assembly will be dead, and the problem will come. As mentioned above, the lens has a large aperture, which requires very high assembly precision. If the existing design method and industry are still used, the center and four corners of the module analysis will inevitably appear uneven, which will seriously affect the yield rate, and The camera module with screw teeth needs to spend a lot of technical manpower and time to focus up and down and test repeatedly when adjusting the focus after assembly.

Molding design was originally used mostly on structural materials, but now electronic materials are also designed as molding products, so the requirements for molding have increased by at least 3 times, because some electrical requirements of electronic materials must be considered, especially It is a chip, because the molding environment is completed under vacuum rapid high-pressure filling, so the pressure resistance of the chip, the impact of rapid impact on the gold wire, the thickness of the gold wire is 0.08um, and the high temperature requirements for sensitive electronic materials, etc. It is necessary to design new materials and industries. Molding's fast high-pressure filling temperature is about 230°.

Contents of the invention

Aiming at the deficiencies of the prior art, the present invention proposes a high-pixel module structure and production process, wherein the specific technical scheme of a high-pixel module structure is as follows: a high-pixel module structure, which is characterized in that it includes a circuit board (1), photosensitive chip (2), capacitive element (3), gold wire, optical filter (4), lens (5) and mirror holder (6), described lens (5) is installed in described mirror holder ( 6) on;

A sealing module (7) is formed by injection molding on the circuit board (1), and the sealing module (7) seals the non-photosensitive area of the photosensitive chip (2), the capacitive element (3) and the gold line for filling and sealing;

The bottom of the mirror holder (6) is glued to the upper end surface of the sealing module (7);

A through hole (9) is formed in the middle of the sealing module (7), and the photosensitive area of the photosensitive chip (2) is located in the through hole (9) of the sealing module (7);

An annular support platform (8) is arranged on the inner surface of the through hole (9), and the optical filter (4) is installed on the annular support platform (8).

In order to better realize the present invention, it may further be that: the sealing module (7) has a rectangular structure.

Further, the lens (5) and the mirror holder (6) are integrally formed.

Further: the axis of the mirror base (6) coincides with the axis of the through hole (9).

Further: the thickness of the glue is 0.1mm.

The specific technology of a high-pixel module production process is: a high-pixel module production process, which is characterized in that it includes the following steps:

Step 1: After filling and sealing the non-photosensitive area of the photosensitive chip, the capacitive element and the gold wire through a molding injection molding process, a sealed module with through holes is formed;

Step 2: Install the filter in the through hole of the sealing module;

Step 3: Place the lens holder on the sealing module, face the lens side to the analysis standard image, and adjust the focus at the same time, adjust the resolution of the lens center and the four corners of the lens to the set value, and the adjustment method can be rotated 360 degrees;

Step 4: Reserve a gluing distance of 0.1 mm, and after the focusing is completed, the lens base and the gluing are formed on the sealing module.

Further, the adhesive is AA adhesive.

The beneficial effects of the present invention are as follows: firstly, the lens barrel and the lens base are designed in one piece, without screw thread for focusing, and it also prevents the dust at the screw thread from falling onto the filter to form dirt and affect the image quality.

Second, all the components outside the non-inductive area of the chip are sealed through the Molding injection molding process (boards, chips, capacitors, and gold wires are filled by injection molding), so that debris and dust between capacitor components will not fall into the chip On the one hand, reduce the source of dust and improve the yield.

Thirdly, the length and width of the module are made smaller, and the size of the supporting surface of the mirror base is reduced by using the molding process. The lens does not need to be in direct contact with the board, and can be directly assembled on the molding. That is to use the height after MOlding to replace the height of part of the mirror base.

Fourth, auto-focus automatic assembly (AA) (360°rotatable) assembles the lens on the top of the molded side while focusing, which can take into account the analytical uniformity of the center and four corners of the lens. For the sensitivity of the lens with a large aperture, It can be controlled very precisely. After the image is formed, a layer of AA glue is applied to form a high-end camera module that can not only avoid threaded focusing, but also reduce the size of the module and reduce dust. The biggest feature of using AA glue is that it has very good stability, and the deformation from liquid to solid is only about 0.1%. The above advantages make the application range of the present invention wider and facilitate the popularization and utilization of the present invention.

Description of drawings

Fig. 1 is a structural schematic diagram of the present invention.

Detailed ways

The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

As shown in Figure 1: a high-pixel module structure, including a circuit board 1, a photosensitive chip 2, a capacitive element 3, a gold wire, a filter 4, a lens 5 and a mirror holder 6, and the lens 5 and the mirror holder 6 are integrated In addition, the lens 5 and the mirror base 6 can be set to be detachable, and the lens 5 and the mirror base 6 form a zoom module;

The sealing module 7 is formed on the circuit board 1 by injection molding, and the sealing module 7 has a rectangular structure. The sealing module 7 fills and seals the non-photosensitive area of the photosensitive chip 2, the capacitive element 3 and the gold wire;

The bottom of the mirror base 6 is glued to the upper surface of the sealing module 7 with a thickness of 0.1 mm. The glue is AA glue, and the AA is the abbreviation of active alignment.

A through hole 9 is formed in the middle of the sealing module 7 , the photosensitive area of the photosensitive chip 2 is located in the through hole 9 of the sealing module 7 , and the axis of the mirror base 6 coincides with the axis of the through hole 9 .

An annular support platform 8 is provided on the inner surface of the through hole 9 , and the optical filter 4 is mounted on the annular support platform 8 .

A high-pixel module structure, characterized in that: comprising the following steps:

Step 1: After filling and sealing the non-photosensitive area of the photosensitive chip, capacitor elements and gold wires through the Molding injection molding process, a sealed module with through holes is formed;

Step 2: Install the filter in the through hole of the sealing module;

Step 3: Place the lens holder on the sealing module, face the lens side to the analysis standard image, and adjust the focus at the same time, adjust the resolution of the lens center and the four corners of the lens to the set value, and the adjustment method can be rotated 360 degrees;

Step 4: Reserve a gluing distance of 0.1mm. After the focus adjustment is completed, the lens base and the glue are glued to the sealing module to form.

Claims (6)

1. A high-pixel module structure, characterized in that it includes a circuit board (1), a photosensitive chip (2), a capacitive element (3), a gold wire, an optical filter (4), a lens (5) and a mirror holder (6), the lens (5) is mounted on the mirror holder (6); A sealing module (7) is formed by injection molding on the circuit board (1), and the sealing module (7) seals the non-photosensitive area of the photosensitive chip (2), the capacitive element (3) and the gold line for filling and sealing; The bottom of the mirror holder (6) is glued to the upper end surface of the sealing module (7); A through hole (9) is formed in the middle of the sealing module (7), and the photosensitive area of the photosensitive chip (2) is located in the through hole (9) of the sealing module (7); An annular support platform (8) is arranged on the inner surface of the through hole (9), and the optical filter (4) is installed on the annular support platform (8). 2. A high pixel module structure according to claim 1, characterized in that: the sealing module (7) is a rectangular structure. 3. A high pixel module structure according to claim 1, characterized in that: the lens (5) and the mirror holder (6) are integrally formed. 4. A high pixel module structure according to claim 1, characterized in that: the axis of the mirror holder (6) coincides with the axis of the through hole (9). 5. A high pixel module process, characterized in that: comprising the steps of: Step 1: After filling and sealing the non-photosensitive area of the photosensitive chip, the capacitive element and the gold wire through a molding injection molding process, a sealed module with through holes is formed; Step 2: Install the filter in the through hole of the sealing module; Step 3: Place the lens holder on the sealing module, face the lens side to the analysis standard image, and adjust the focus at the same time, adjust the resolution of the lens center and the four corners of the lens to the set value, and the adjustment method can be rotated 360 degrees; Step 4: Reserve a gluing distance of 0.1 mm, and after the focusing is completed, the lens base and the gluing are formed on the sealing module. 6. A high pixel module process according to claim 5, characterized in that it comprises the following steps: the glue is AA glue.