CN107983426A - The digital microcurrent-controlled chip of thermal drivers, production method and method of work - Google Patents

Abstract

The invention relates to the field of microfluidic technology, and proposes a heat-driven digital microfluidic chip, a manufacturing method and a working method. The heat-driven digital microfluidic chip includes: a first substrate, a second substrate, a capillary channel, a plurality of first electric heating components and a plurality of first switching elements. The second substrate is arranged opposite to the first substrate; the capillary channel is arranged on the first substrate and/or the second substrate; a plurality of first electric heating components are arranged on the first substrate and distributed at intervals along the extending direction of the capillary channel; each first switch The element is connected in a current loop where a first electric heating component is located, and receives a control signal to control the closing of the current loop where a plurality of first electric heating components are located. The present invention can realize the directional movement of liquid droplets in the capillary channel under the condition that no hydrophobic layer is arranged on the inner surface of the capillary channel, and can be recycled. At the same time, the present invention drives the droplet to move by changing the surface tension at both ends of the droplet by heating, and the driving force is relatively large.

Description

Heat-driven digital microfluidic chip, manufacturing method and working method

technical field

The invention relates to the field of microfluidic technology, in particular to a heat-driven digital microfluidic chip, a manufacturing method and a working method.

Background technique

Microfluidic chip technology integrates basic operating units such as sample preparation, reaction, separation, and detection into a centimeter-scale chip. This technology greatly reduces the sample cost and improves the detection efficiency. In recent years, it has been highly sought after and widely used in biology, chemistry, medicine and other fields.

At present, the mainstream microfluidic chip drive method is electrode drive, also known as voltage digital microfluidics. Voltage-type digital microfluidics is to place droplets in a capillary channel with a hydrophobic layer. With the help of the electrowetting effect, an external voltage is applied between the droplet and the electrode under the hydrophobic layer to increase the contact between the droplet and the hydrophobic layer where the electrode is located. The wettability between them forms the asymmetric deformation of the droplet and generates an internal pressure difference, thereby realizing the directional movement and mixing of the droplet.

However, in order to obtain sufficient droplet driving force for voltage-based digital microfluidic chips, it is necessary to spin-coat hydrophobic materials or make hydrophobic structures on the surface of capillary channels. When the voltage is not applied to the droplet, it does not wet the hydrophobic layer; when the voltage is applied to the droplet, it wets the hydrophobic layer; thereby obtaining a large deformation and internal pressure difference. Therefore, the chip process is difficult and costly. At the same time, when the chip is cleaned, the hydrophobic layer is easily damaged, which is not conducive to repeated use.

It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present invention, and therefore may include information that does not constitute prior art known to those of ordinary skill in the art.

Contents of the invention

The purpose of the present invention is to provide a heat-driven digital microfluidic chip, a manufacturing method and a working method. One or more problems due to limitations and drawbacks of the related art are overcome at least to some extent.

Other features and advantages of the invention will become apparent from the following detailed description, or in part, be learned by practice of the invention.

According to one aspect of the present invention, a thermally driven digital microfluidic chip is provided, the thermally driven digital microfluidic chip includes: a first substrate, a second substrate, a capillary channel, a plurality of first electric heating components and a plurality of first switch element. The second substrate is arranged opposite to the first substrate; the capillary channel is arranged on the first substrate and/or the second substrate; a plurality of first electric heating components are arranged on the first substrate and distributed at intervals along the extending direction of the capillary channel; each first switch The element is connected in a current loop where a first electric heating component is located, and receives a control signal to control the closing of the current loop where multiple first electric heating components are located.

In an exemplary embodiment of the present invention, it further includes: a plurality of second electric heating components and a plurality of second switching elements. A plurality of second electric heating components are located on the second substrate and distributed at intervals along the extending direction of the capillary channel; each of the second switching elements is connected to a current loop where the second electric heating component is located, and receives control signal, so as to control the closure of the current loop where the multiple second electric heating components are located.

In an exemplary embodiment of the present invention, microfluidic channels are provided on the bonding surface of the first substrate and/or the second substrate; when the first substrate is bonded to the second substrate, the The microfluidic channel forms the capillary channel.

In an exemplary embodiment of the present invention, the first switching element is disposed on the first substrate; the second switching element is disposed on the second substrate.

In an exemplary embodiment of the present invention, the first switch element and the second switch element are thin film transistors; the surfaces of the thin film transistors are covered with insulating materials.

In an exemplary embodiment of the present invention, a liquid barrier material is provided on the first electric heating component, the second electric heating component and the insulating material on the surface of the thin film transistor; the liquid barrier material is a thermally conductive material.

According to one aspect of the present invention, a method for manufacturing a thermally driven digital microfluidic chip is provided, the method for manufacturing a thermally driven digital microfluidic chip includes:

setting capillary channels on the correspondingly arranged first substrate and/or the second substrate;

A plurality of first electric heating components are arranged on the first substrate, and the plurality of first electric heating components are distributed at intervals along the extending direction of the capillary channel;

A first switch element is provided in the current loop where each of the first electric heating components is located, so as to control the closing of the current loops where the plurality of first electric heating components are located.

In an exemplary embodiment of the present invention, it also includes:

A plurality of second electric heating components are arranged on the second substrate, and the second electric heating components are distributed at intervals along the extending direction of the capillary channel;

A second switch element is provided in the current loop where each second electric heating component is located, so as to control the closing of the current loop where multiple second electric heating components are located.

In an exemplary embodiment of the present invention, the arranging the capillary channel on the correspondingly arranged first substrate and/or the second substrate includes:

setting microfluidic channels on the bonding surface of the first substrate and/or the second substrate;

The second substrate is bonded to the first substrate, and the microfluidic channel forms the capillary channel.

In an exemplary embodiment of the present invention, the arranging the first switching element in the current loop where each of the first electric heating components is located includes: before the second substrate is bonded to the first substrate,

disposing the first switching element on the first substrate;

The arranging the second switching element in the current loop where each second electric heating component is located includes: before the second substrate is bonded to the first substrate,

disposing the second switching element on the second substrate;

And the surfaces of the first switching element and the second switching element are covered with an insulating layer.

In an exemplary embodiment of the present invention, before the second substrate is bonded to the first substrate, it further includes:

A liquid barrier material is arranged on the first electric heating component, the second electric heating component, and the insulating layer of the first switching element and the second switching element.

According to one aspect of the present invention, a thermally driven digital microfluidic chip control method is provided, comprising:

By changing the temperature on both sides of the droplet in the thermally driven digital microfluidic chip, the directional movement of the droplet in the thermally driven digital microfluidic chip is realized.

In an exemplary embodiment of the present invention, the thermally driven digital microfluidic chip control method is applied to a thermally driven digital microfluidic chip including capillary channels, multiple electric heating components and multiple switching elements; the multiple The electric heating components are distributed at intervals along the extension direction of the capillary channel, and each of the switching elements is connected in a current loop where the electric heating components are located; including:

controlling the switching element to conduct the current loop where the electric heating component is located, so as to realize the heating of the electric heating component;

Different positions of the droplet are heated by the electric heating components at different positions to realize the temperature difference between the two sides of the droplet. It can be seen from the above technical solutions that the advantages and positive effects of the heat-driven digital microfluidic chip, manufacturing method and working method of the present invention are:

A heat-driven digital microfluidic chip, a manufacturing method, and a working method provided by an exemplary embodiment of the present invention, the heat-driven digital microfluidic chip changes the temperature of both sides of the liquid droplet in the capillary channel on the chip, and changes the temperature of the liquid droplet. The size of the surface tension on both sides, so as to realize the directional movement of the droplet in the capillary channel. Compared with related technologies, on the one hand, the heat-driven digital microfluidic chip can realize directional movement of droplets without setting a hydrophobic layer, has a simple structure, low cost and can be recycled. On the other hand, the thermally driven digital microfluidic chip has a relatively large driving force.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description serve to explain the principles of the invention. Apparently, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings according to these drawings without creative efforts.

Fig. 1 is a structural schematic diagram of an embodiment of a thermally driven digital microfluidic chip of the present invention;

Fig. 2 is a cross-sectional view along the capillary channel in an embodiment of the thermally driven digital microfluidic chip of the present invention;

Fig. 3 is a cross-sectional view along the capillary channel in another embodiment of the thermally driven digital microfluidic chip of the present invention;

Fig. 4 is a flow chart of an embodiment of the method for manufacturing a thermally driven digital microfluidic chip of the present invention.

Detailed ways

Example embodiments will now be described more fully with reference to the accompanying drawings. Exemplary embodiments may, however, be embodied in many forms and should not be construed as limited to the examples set forth herein; rather, these examples are provided so that this disclosure will be thorough and complete and will fully convey the concept of the exemplary embodiments communicated to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so that it is upside down, then elements described as being "upper" will become elements that are "lower". Other relative terms, such as "high", "low", "top", "bottom", "left", "right", etc. also have similar meanings. When a structure is "on" another structure, it may mean that a structure is integrally formed on another structure, or that a structure is "directly" placed on another structure, or that a structure is "indirectly" placed on another structure through another structure. other structures.

The terms "a", "an" and "the" are used to indicate the presence of one or more elements/components/etc; Additional elements/components/etc. may be present in addition to the listed elements/components/etc.

This exemplary embodiment provides a thermally driven digital microfluidic chip, as shown in FIG. 1 , which is a schematic structural diagram of an implementation manner of the thermally driven digital microfluidic chip of the present invention. The heat-driven digital microfluidic chip includes: a first substrate 1 , a second substrate 2 , a capillary channel 3 , a plurality of first electrothermal components 4 and a plurality of first switching elements 5 . The second substrate 2 is arranged opposite to the first substrate 1; the capillary channel 3 is arranged on the first substrate and/or the second substrate; a plurality of first electric heating components 4 are arranged on the first substrate 1 and distributed at intervals along the extending direction of the capillary channel; Each first switching element 5 is connected in the current loop where one first electrothermal component 4 is located, and receives a control signal to control the closing of the current loop where multiple first electrothermal components are located. It should be noted that the first switching element 5 may be a field effect transistor, which includes a drain, a source and a gate. When the gate voltage reaches the conduction voltage, the conduction between the source and the drain is conducted; when the gate voltage is lower than the conduction voltage, the source and the drain are blocked. The drain and source of the first switching element 5 can be connected to the current loop where the first electrothermal component 4 is located, and the gate receives the control signal. The control signal can make the source and drain of the first switching element 5 conduct, so as to connect the current loop where the first electrothermal component 4 is located.

The thermally driven digital microfluidic chip, manufacturing method and working method provided in this exemplary embodiment. The heat-driven digital microfluidic chip changes the surface tension on both sides of the droplet by changing the temperature on both sides of the droplet in the capillary channel on the chip, causing the surface tension on both sides of the droplet to be unbalanced. Oriented movement within. Compared with related technologies, on the one hand, the heat-driven digital microfluidic chip can realize directional movement of droplets without setting a hydrophobic layer, has a simple structure, low cost and can be recycled. On the other hand, the thermally driven digital microfluidic chip has a relatively large driving force.

It should be noted that the principle that heating the surface of the droplet can reduce its surface tension is: when the surface temperature of the droplet increases, the kinetic energy of the molecules on the surface of the droplet increases, and the attraction force between molecules becomes smaller; at the same time, due to the increase in temperature, , the concentration of molecules on the surface of the droplet decreases; thus, the surface tension of the droplet decreases as the surface temperature of the droplet increases. As can be seen from the above, in this exemplary embodiment, in the technical solution of reducing the surface tension of the droplet by heating the surface, the droplet can either wet the capillary channel or not wet the capillary channel, and the capillary channel can be set The hydrophobic layer may not be provided with a hydrophobic layer. When there is no hydrophobic layer on the inner surface of the capillary channel, the droplet can wet or not wet the capillary channel, and the surface tension of the droplet can be reduced by heating the surface of the droplet. When there is a hydrophobic layer on the inner surface of the capillary channel, the droplet can also wet or not wet the capillary channel, and the surface tension of the droplet can still be reduced by heating the surface of the droplet. In this exemplary embodiment, the hydrophobic layer can increase the smoothness of liquid droplet movement. This exemplary embodiment is described by taking no hydrophobic layer on the inner surface of the capillary channel as an example.

In this exemplary embodiment, a liquid inlet 6 may be reserved on the surface of the first substrate 1 or the second substrate 2 , and the liquid inlet 6 communicates with the capillary channel 3 for inputting liquid droplets into the capillary channel. The first electric heating component 4 can be selected as an electric resistance wire, and the electric resistance wire generates heat in a conduction state to heat the liquid droplet. The first switching element 5 can be selected as a thin film transistor, and the gate of the thin film transistor can be connected to an integrated circuit, and the integrated circuit can simultaneously send a control signal to one or more thin film transistors to control the opening of one or more thin film transistors to meet the liquid Drop the needs of different mobile states. The capillary channel 3 can be designed in different shapes and sizes according to specific requirements. Those skilled in the art should understand that there may be more options for the first electric heating assembly 4 and the first switch element 5, all of which belong to the protection scope of the present invention.

In this exemplary embodiment, one way of forming the capillary channel may be: setting a microfluidic channel on the bonding surface of the first substrate 1 and/or the second substrate 2; When the second substrate 2 is bonded, the microfluidic channel forms the capillary channel 3 . This method is simple in process and low in implementation cost; at the same time, this method can also facilitate the arrangement of the first switching element and the first electric heating component. It should be noted that there are still more ways to choose from for the formation of the capillary channel, for example: integral molding technology, etc., and these changes should be understood to belong to the protection scope of the present invention.

In this exemplary embodiment, there are three feasible technical solutions for setting the capillary channel, including: the capillary channel 3 is set on the first substrate 1; the capillary channel 3 is set on the second substrate 2; the capillary channel 3 is set on the second substrate A substrate 1 and a second substrate 2 .

This exemplary embodiment is first described by taking the capillary channel 3 disposed on the second substrate as an example, as shown in FIG. 2 , which is a cross-sectional view along the capillary channel in an embodiment of the thermally driven digital microfluidic chip of the present invention. The first switch element 5 is arranged on the first substrate, and the surface of the first switch element 5 is covered with an insulating material 8; the surface insulation material of the first electric heating component 4 and the first switch element 5 is provided with a liquid barrier material 9; the liquid-insulating material 9 is a heat-conducting material.

It should be noted that the first switching element 5 can be arranged on the same layer as the first electrothermal component 4 to improve the overall compactness of the chip. The insulating material 8 can be selected as polyvinyl chloride resin. The liquid barrier material 9 can be selected as indium tin oxide. Indium tin oxide has good thermal conductivity, and can quickly transfer the heat of the first electric heating component to the liquid droplets.

In this exemplary embodiment, first, the liquid droplet 7 is wetted on the inner surface of the capillary channel 3 for illustration. When the liquid droplet 7 is wetted on the inner surface of the capillary channel 3, the droplet 7 is formed Concave liquid surface. The surface tension of the concave liquid surfaces on both sides is respectively facing the direction of one side. That is, the surface tension of the left liquid surface faces to the left; the surface tension of the right liquid surface faces to the right. When the first electric heating assembly 4 located on the left side of the droplet heats the droplet, the temperature of the concave liquid surface on the left side of the droplet is higher than the temperature of the concave liquid surface on the right side, and the surface tension on the left side of the droplet is smaller than that on the right side. Surface tension, the droplet moves to the right under the action of surface tension on the right.

It should be noted that when the droplet does not wet the capillary channel, the droplet forms a convex liquid surface on both sides of the capillary channel, and the surface tension of the convex liquid surface faces the inner side of the droplet, that is, the left liquid surface The surface tension faces to the right; the surface tension of the right liquid surface faces to the left. When the first electric heating component located on the left side of the droplet heats the droplet, the temperature of the convex liquid surface on the left side of the droplet is higher than the temperature of the convex liquid surface on the right side, and the surface tension on the left side of the droplet is smaller than that on the right side Tension, the droplet moves to the left under the action of surface tension on the right. In the above exemplary embodiment, the capillary channel 3 is disposed on the second substrate 2 , and the first heating component 4 is disposed on the first substrate 1 . There will be certain errors when the first substrate 1 and the second substrate 2 are bonded, so that the first heating components 4 cannot be strictly distributed along the extending direction of the capillary channel 3 . This exemplary embodiment also proposes a capillary channel setting method: the capillary channel 3 is set on the first substrate 1 .

It should be noted that, in this exemplary embodiment, a microfluidic channel can be formed on the first substrate 1 , and a first electrothermal component 4 , a first switching element 5 , an insulating material, and a liquid barrier material are arranged in the microfluidic channel. When the second substrate 2 is bonded to the first substrate 1 , the microfluidic channel forms a capillary channel 3 . At this time, the electric heating components 4 are strictly distributed along the extending direction of the capillary channel 3 .

In the above exemplary embodiment, the liquid droplets 7 are only heated by the first electric heating components 4 distributed on the first substrate 1, and the heating speed is relatively slow. As shown in FIG. 3 , it is a cross-sectional view along the capillary channel in an embodiment of the thermally driven digital microfluidic chip of the present invention. In this exemplary embodiment, it may further include: a plurality of second electric heating components 10 and a plurality of second switching elements 11 . A plurality of second electric heating components 11 may be located on the second substrate 2 and distributed at intervals along the extending direction of the capillary channel 3; each of the second switching elements 11 is connected to a current where the second electric heating component 10 is In the loop, and receive a control signal to control the closing of the current loop where the plurality of second electric heating components 10 are located.

It should be noted that, the second electric heating component 10 may also be selected as an electric resistance wire, and the electric resistance wire generates heat in a conduction state to heat the liquid droplet. The second switch element 11 can be selected as a thin film transistor, and is arranged on the second substrate 2 and arranged on the same layer as the second electric heating component, so as to improve the overall compactness of the chip. The first switching element 5 and the second switching element 11 may be connected to the same integrated circuit. The integrated circuit can send control signals to the first switch element 5 and the second switch element 11 at the same time, so as to turn on the circuits where the first electrothermal component 4 and the second electrothermal component 10 are located. The first electric heating component 4 and the second electric heating component 10 are controlled to generate heat at the same time, so as to realize rapid heating of the liquid droplets. The surface of the second switching element 11 may also be covered with an insulating material; the insulating material on the surface of the second electric heating component 10 and the second switching element 11 may also be provided with a liquid barrier material; the liquid barrier material is a heat conducting material. Wherein, the insulating material can be selected as polyvinyl chloride resin. The liquid barrier material can be selected as indium tin oxide. Indium tin oxide has good thermal conductivity, and can quickly transfer the heat of the first electric heating component to the liquid droplets.

It should be noted that the second substrate 2 may not be provided with a microfluidic channel or may be provided with a microfluidic channel. When no microfluidic channel is provided on the second substrate 2, the second electrothermal assembly 10 can be directly arranged on the second substrate, and when the second substrate is bonded to the first substrate, the microfluidic channel on the first substrate forms a capillary channel; When the second substrate is provided with a microfluidic channel, the second electric heating assembly is arranged on the microfluidic channel, and when the first substrate and the second substrate are bonded, the microfluidic channel on the first substrate is opposite to the microfluidic channel on the second substrate , combined to form capillary channels.

This exemplary embodiment also provides a method for manufacturing a thermally driven digital microfluidic chip, as shown in FIG. 4 , which is a flow chart of an embodiment of the method for manufacturing a thermally driven digital microfluidic chip of the present invention. The manufacturing method of the heat-driven digital microfluidic chip includes:

Step S1: setting capillary channels on the corresponding first substrate and/or the second substrate;

Step S2: setting a plurality of first electric heating components on the first substrate, and the plurality of first electric heating components are distributed at intervals along the extending direction of the capillary channel;

Step S3: setting a first switching element in the current loop where each of the first electrothermal components is located, so as to control the closing of the current loops where multiple first electrothermal components are located.

In this exemplary embodiment, also include:

A plurality of second electric heating components are arranged on the second substrate, and the second electric heating components are distributed at intervals along the extending direction of the capillary channel;

A second switch element is provided in the current loop where each second electric heating component is located, so as to control the closing of the current loop where multiple second electric heating components are located.

In this exemplary embodiment, setting the capillary channel on the correspondingly set first substrate and/or the second substrate includes:

setting microfluidic channels on the bonding surface of the first substrate and/or the second substrate;

The second substrate is bonded to the first substrate, and the microfluidic channel forms the capillary channel.

In this exemplary embodiment, setting the first switching element in the current loop where each of the first electric heating components is located includes: before the second substrate is bonded to the first substrate,

disposing the first switching element on the first substrate;

The arranging the second switching element in the current loop where each second electric heating component is located includes: before the second substrate is bonded to the first substrate,

disposing the second switching element on the second substrate;

And the surfaces of the first switching element and the second switching element are covered with an insulating layer.

In this exemplary embodiment, before the second substrate is bonded to the first substrate, further comprising:

A liquid barrier material is arranged on the first electric heating component, the second electric heating component and the insulating layer of the first switching element and the second switching element.

It should be noted that the manufacturing method of the thermally driven digital microfluidic chip provided in this exemplary embodiment has the same structure as the thermally driven digital microfluidic chip provided in this exemplary embodiment, and its working principle and technical characteristics are analyzed in A detailed description has been made in the thermally driven digital microfluidic chip, and will not be repeated here.

This exemplary embodiment also provides a thermally driven digital microfluidic chip control method, including:

By changing the temperature on both sides of the droplet in the thermally driven digital microfluidic chip, the directional movement of the droplet in the thermally driven digital microfluidic chip is realized.

It should be noted that the thermally driven digital microfluidic chip control method can be applied to a thermally driven digital microfluidic chip including a capillary channel, a plurality of electric heating components and a plurality of switching elements; The extension direction of the capillary channel is distributed at intervals, and each of the switching elements is connected in a current loop where the electric heating component is located; the control method includes: controlling the switching element to conduct the current loop where the electric heating component is located, realizing the The electric heating component generates heat; different positions of the liquid droplet are heated by the electric heating component at different positions, so as to realize the temperature difference between the two sides of the liquid droplet.

Other embodiments of the invention will be readily apparent to those skilled in the art from consideration of the specification and practice. This application is intended to cover any modification, use or adaptation of the present invention, which follow the general principles of the present invention and include common knowledge or conventional technical means in the technical field. The specification and examples are to be considered exemplary only, with the true scope and spirit of the invention indicated by the appended claims.

The features, structures or characteristics described above may be combined in any suitable manner in one or more embodiments and, where possible, the features discussed in the various embodiments are interchangeable. In the foregoing description, numerous specific details were provided in order to give a thorough understanding of embodiments of the invention. However, one skilled in the art will appreciate that the technical solutions of the present invention may be practiced without one or more of the specific details, or that other methods, components, materials, etc. may be employed. In other instances, well-known structures, materials, or operations are not shown or described in detail to avoid obscuring aspects of the invention.

Claims (10)

1. A kind of 1. digital microcurrent-controlled chip of thermal drivers, it is characterised in that including：

   First substrate；

   Second substrate, is oppositely arranged with the first substrate；

   Capillary channel, is arranged at the first substrate and/or the second substrate；

   Multiple first electric-heating assemblies, are arranged at the first substrate, and are spaced apart along the capillary channel extending direction；

   Multiple first switching elements, each first switching element are connected to the electric current where first electric-heating assembly In circuit, and control signal is received, to control the closure of multiple first electric-heating assemblies place current loops.
2. 2. the digital microcurrent-controlled chip of thermal drivers according to claim 1, it is characterised in that further include：

   Multiple second electric-heating assemblies, are spaced apart positioned at the second substrate, and along the capillary channel extending direction；

   Multiple second switch elements, each second switch element are connected to the electric current where second electric-heating assembly In circuit, and control signal is received, to control the closure of multiple second electric-heating assemblies place current loops.
3. 3. the digital microcurrent-controlled chip of thermal drivers according to claim 2, it is characterised in that the first switching element and/ Or the second switch element is thin film transistor (TFT)；The film crystal pipe surface is covered with insulating materials.
4. 4. the digital microcurrent-controlled chip of thermal drivers according to claim 1 or 2, it is characterised in that the first substrate and/or Microchannel is provided with the second substrate bonding face；

   When the first substrate is bonded with the second substrate, the microchannel forms the capillary channel.
5. 5. the digital microcurrent-controlled chip of thermal drivers according to claim 3, it is characterised in that first electric-heating assembly, It is provided with two electric-heating assemblies and the thin film transistor (TFT) surface insulation material every liquid material；

   It is described every liquid material be Heat Conduction Material.
6. A kind of 6. digital microcurrent-controlled chip manufacture method of thermal drivers, it is characterised in that including：

   Capillary channel is set on the first substrate and/or the second substrate being correspondingly arranged；

   Multiple first electric-heating assemblies are set on the first substrate, and multiple first electric-heating assemblies prolong along the capillary channel Direction is stretched to be spaced apart；

   First switching element is set in current loop where each first electric-heating assembly, to control multiple first electricity The closure of current loop where hot component.
7. 7. the digital microcurrent-controlled chip manufacture method of a kind of thermal drivers according to claim 6, it is characterised in that further include：

   Multiple second electric-heating assemblies are set on the second substrate, and second electric-heating assembly is along the capillary channel extension side To being spaced apart；

   Second switch element is set in current loop where each second electric-heating assembly, to control multiple second electricity The closure of current loop where hot component.
8. 8. the digital microcurrent-controlled chip manufacture method of a kind of thermal drivers according to claim 6 or 7, it is characterised in that described Capillary channel is set to include on the first substrate and/or the second substrate being correspondingly arranged：

   Microchannel is set on the first substrate and/or the second substrate bonding face；

   The second substrate is bonded with the first substrate, the microchannel forms the capillary channel.
9. A kind of 9. digital microcurrent-controlled chip controls method of thermal drivers, it is characterised in that including：

   By varying the temperature of drop both sides in the digital microcurrent-controlled chip of the thermal drivers, realize the drop in the thermal drivers Displacement in digital microcurrent-controlled chip.
10. 10. a kind of digital microcurrent-controlled chip controls method of thermal drivers according to claim 9, leads to applied to one including capillary The digital microcurrent-controlled chip of thermal drivers in road, multiple electric-heating assemblies and multiple switch element；The multiple electric-heating assembly is described in Capillary channel extending direction is spaced apart, and each switch element is connected to the current loop where an electric-heating assembly In；It is characterized in that, the method specifically includes：

    The direction for needing to flow according to drop, according to where electric-heating assembly described in the preset rules control switching elements conductive Current loop, makes the electric-heating assembly of diverse location generate heat；

    The diverse location of the drop is heated by the electric-heating assembly of diverse location, realizes the drop both sides Temperature difference, to control displacement of the drop in the digital microcurrent-controlled chip of the thermal drivers.