[go: up one dir, main page]

CN107942595B - 阵列基板及其制造方法、液晶显示面板及其制造方法 - Google Patents

阵列基板及其制造方法、液晶显示面板及其制造方法 Download PDF

Info

Publication number
CN107942595B
CN107942595B CN201711391928.7A CN201711391928A CN107942595B CN 107942595 B CN107942595 B CN 107942595B CN 201711391928 A CN201711391928 A CN 201711391928A CN 107942595 B CN107942595 B CN 107942595B
Authority
CN
China
Prior art keywords
layer
shielding
metal
array substrate
black light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201711391928.7A
Other languages
English (en)
Other versions
CN107942595A (zh
Inventor
杨春辉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Original Assignee
HKC Co Ltd
Chongqing HKC Optoelectronics Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HKC Co Ltd, Chongqing HKC Optoelectronics Technology Co Ltd filed Critical HKC Co Ltd
Priority to CN201711391928.7A priority Critical patent/CN107942595B/zh
Publication of CN107942595A publication Critical patent/CN107942595A/zh
Priority to US16/772,819 priority patent/US11294218B2/en
Priority to PCT/CN2018/105062 priority patent/WO2019119889A1/zh
Application granted granted Critical
Publication of CN107942595B publication Critical patent/CN107942595B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • G02F1/136295Materials; Compositions; Manufacture processes
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1335Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/133509Filters, e.g. light shielding masks
    • G02F1/133512Light shielding layers, e.g. black matrix
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136209Light shielding layers, e.g. black matrix, incorporated in the active matrix substrate, e.g. structurally associated with the switching element
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/133345Insulating layers
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1339Gaskets; Spacers; Sealing of cells
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/134309Electrodes characterised by their geometrical arrangement
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333Constructional arrangements; Manufacturing methods
    • G02F1/1343Electrodes
    • G02F1/13439Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136213Storage capacitors associated with the pixel electrode
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136227Through-hole connection of the pixel electrode to the active element through an insulation layer
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136286Wiring, e.g. gate line, drain line
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/1368Active matrix addressed cells in which the switching element is a three-electrode device
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6704Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device
    • H10D30/6723Thin-film transistors [TFT] having supplementary regions or layers in the thin films or in the insulated bulk substrates for controlling properties of the device having light shields
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6729Thin-film transistors [TFT] characterised by the electrodes
    • H10D30/673Thin-film transistors [TFT] characterised by the electrodes characterised by the shapes, relative sizes or dispositions of the gate electrodes
    • H10D30/6732Bottom-gate only TFTs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6741Group IV materials, e.g. germanium or silicon carbide
    • H10D30/6743Silicon
    • H10D30/6746Amorphous silicon
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/01Manufacture or treatment
    • H10D86/021Manufacture or treatment of multiple TFTs
    • H10D86/0231Manufacture or treatment of multiple TFTs using masks, e.g. half-tone masks
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/421Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs having a particular composition, shape or crystalline structure of the active layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441Interconnections, e.g. scanning lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/451Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs characterised by the compositions or shapes of the interlayer dielectrics
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/481Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs integrated with passive devices, e.g. auxiliary capacitors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • GPHYSICS
    • G02OPTICS
    • G02FOPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/136Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
    • G02F1/1362Active matrix addressed cells
    • G02F1/136222Colour filters incorporated in the active matrix substrate

Landscapes

  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Liquid Crystal (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)

Abstract

本发明实施例公开了一种阵列基板,包括:基底;黑色遮光层,设置在所述基底上;第一金属层,对应设置在所述黑色遮光层上,从而所述黑色遮光层位于所述基底和所述第一金属层之间;有源材料层,设置在所述第一金属层上;第二金属层,设置在所述有源材料层上;保护层,设置在所述第二金属层上且其上设置有接触孔;色阻材料层,设置在所述保护层上;以及像素电极层,设置在色阻材料层上且通过所述接触孔连接所述第二金属层。本发明实施例还提供了一种液晶显示面板及其制造方法以及一种阵列基板的制造方法。本发明实施例能够有效地防止数据线侧的漏光现象的发生。

Description

阵列基板及其制造方法、液晶显示面板及其制造方法
技术领域
本发明涉及显示技术领域,尤其涉及一种阵列基板及其制造方法和一种液晶显示面板及其制造方法。
背景技术
传统的COT(color on TFT,TFT上滤色器)型LCD器件的实际生产制程中,特别是完成所有制程的阵列基板的与完成所有制程的对向基板对组在一起并切割成小片时,极易导致对向基板上的BM(Black Matrix,黑矩阵)与数据线两者之间相对位置的移动,当这种移动超出一定范围,例如BM的移动超过了SM(shielding metal,屏蔽金属)后就容易产生SM与数据线之间的漏光,会降低产品的良率。增大对向基板上的BM宽度固然能够起到作用,但是会降低产品的穿透率。
发明内容
因此,本发明实施例提供了一种阵列基板及其制造方法和一种液晶显示面板及其制造方法,能够有效地防止数据线侧的漏光现象的发生。
本发明提供了一种阵列基板,包括:基底;黑色遮光层,设置在所述基底上;第一金属层,对应设置在所述黑色遮光层上,从而所述黑色遮光层位于所述基底和所述第一金属层之间;有源材料层,设置在所述第一金属层上;第二金属层,设置在所述有源材料层上;保护层,设置在所述第二金属层上且其上设置有接触孔;色阻材料层,设置在所述保护层上;以及像素电极层,设置在色阻材料层上且通过所述接触孔连接所述第二金属层。
在本发明的一个实施例中,所述第一金属层包括:主动开关元件的栅极和用于与所述像素电极层形成存储电容的屏蔽金属。
在本发明的一个实施例中,所述有源材料层包括:所述主动开关元件的栅极绝缘层、半导体层和欧姆接触层,所述栅极绝缘层、所述半导体层和所述欧姆接触层依序层叠设置。
在本发明的一个实施例中,所述第二金属层包括:所述主动开关元件的源极、所述主动开关元件的与所述像素电极层连接的漏极以及与所述源极连接的数据线。
在本发明的一个实施例中,所述色阻材料层包括:红色色阻块、绿色色阻块和蓝色色阻块;所述像素电极层包括:与所述红色色阻块、所述绿色色阻块和所述蓝色色阻块一一对应且由透明导电材料制成的多个像素电极。
在本发明的一个实施例中,所述屏蔽金属环绕所述像素电极并与所述像素电极平行于所述数据线的两边缘部分重叠,且所述屏蔽金属与所述数据线在垂直于所述数据线的方向上存在间隙。
在本发明的一个实施例中,所述黑色遮光层的材料为含碳黑的黑色光阻。
本发明还提供了一种液晶显示面板,包括:如前述实施例所述的阵列基板;对向基板,与所述阵列基板相对设置;液晶层,设置在所述阵列基板和所述对向基板之间;框胶,设置在所述阵列基板和所述对向基板之间并环绕所述液晶层;其中,所述对向基板包括:第二基底;黑色矩阵层,设置在所述第二基底面向所述阵列基板的一侧;以及公共电极层,设置在所述黑色矩阵层面向所述阵列基板的一侧。
在本发明的一个实施例中,所述黑色遮光层的材料和所述黑色矩阵层的材料相同。
本发明还提供了一种阵列基板的制造方法,包括步骤:在基底上形成黑色遮光层和第一金属层,从而所述黑色遮光层位于所述基底与所述第一金属层之间;在所述第一金属层上形成有源材料层;在所述有源材料层上形成第二金属层;在所述第二金属层上形成保护层并在所述保护层中形成接触孔;在所述保护层上形成色阻材料层;在所述色阻材料层上形成像素电极层、并使所述像素电极层通过所述接触孔连接所述第二金属层。
在本发明的一个实施例中,形成所述黑色遮光层和形成所述第一金属层为共用同一道光罩制程。
在本发明的一个实施例中,在基底上形成黑色遮光层和第一金属层,从而所述黑色遮光层位于所述基底与所述第一金属层之间包括:在所述基底上形成黑色遮光材料层;在所述黑色遮光材料层上形成金属材料层;在所述金属材料层上形成光阻材料层;利用光罩对所述光阻材料层进行曝光显影以得到图案化光阻材料层;以所述图案化光阻材料层为掩膜对所述金属材料层和所述黑色遮光材料层依序进行湿蚀刻和干蚀刻;以及在所述干蚀刻后去除残余的光阻材料层,以得到所述黑色遮光层和第一金属层。
在本发明的一个实施例中,在基底上形成黑色遮光层和第一金属层,从而所述黑色遮光层位于所述基底与所述第一金属层之间包括:在所述黑色遮光层上形成主动开关元件的栅极和用于与所述像素电极层形成存储电容的屏蔽金属;其中所述栅极和所述屏蔽金属为所述第一金属层的构成部分。
在本发明的一个实施例中,所述在所述第一金属层上形成有源材料层包括:依次在所述第一金属层上形成所述主动开关元件的栅极绝缘层、半导体层和欧姆接触层。
在本发明的一个实施例中,在所述有源材料层上形成第二金属层包括:在所述有源材料层上形成所述主动开关元件的源极、所述主动开关元件的与所述像素电极层连接的漏极以及与所述源极连接的数据线;其中所述源极、所述漏极和所述数据线为所述第二金属层的构成部分。
在本发明的一个实施例中,所述在所述保护层上形成色阻材料层包括:在所述保护层上按照预设顺序形成红色色阻块、绿色色阻块和蓝色色阻块。
在本发明的一个实施例中,在所述色阻层上形成像素电极层包括:在所述色阻层上形成与所述红色色阻块、所述绿色色阻块和所述蓝色色阻块一一对应且由透明导电材料制成的多个像素电极。
在本发明的一个实施例中,所述黑色遮光层的材料为含碳黑的黑色光阻。
本发明还提供了一种液晶显示面板的制造方法,包括步骤:采用如前述实施例的方法制造阵列基板;在第二基底上依次形成黑色矩阵层和公共电极层;以及在所述公共电极层和所述阵列基板之间设置并注入液晶分子形成液晶层。
在本发明的一个实施例中,所述黑色遮光层的材料和所述黑色矩阵层的材料相同。
本发明可以具有如下优点或有益效果:通过本发明实施例制造在阵列基板上的黑色遮光层,在尽量简化制造复杂度以及保证产品穿透率的基础上,可以很好地起到防止由于设计在对向基板上的黑色矩阵层与数据线两者之间相对位置的移动使得对向基板上的黑色矩阵层无法遮挡在数据线与遮蔽金属之间的光线从而产生的漏光现象。
附图说明
为了更清楚地说明本发明实施例的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为本发明实施例提供的一种阵列基板的结构示意图;
图2A为沿着图1中的剖面线A的阵列基板的结构示意图;
图2B为沿着图1中的剖面线B的阵列基板的结构示意图;
图3A为沿着图1中的剖面线A的液晶显示面板的结构示意图;
图3B为沿着图1中的剖面线B的液晶显示面板的结构示意图;
图4A至图4H为本发明实施例提供的一种第一金属层和黑色遮光层的制作过程示意图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本发明护的范围。
如图1所示,本发明的一个实施例提供的一种阵列基板10,包括数据线DL、扫描线GL、主动开关元件T、像素电极PE和屏蔽金属SM。数据线DL和扫描线GL例如交叉设置以形成多个区域,在每一个所述区域上设置有一个像素电极PE。主动开关元件T包括源极S、漏极D和栅极G,源极S与数据线DL电气连接,像素电极PE通过接触孔CH与漏极D电气连接,栅极G与扫描线GL电气连接。屏蔽金属SM例如环绕像素电极PE设置,并与像素电极PE平行于数据线DL的两边缘部分(如图1中的左右边缘)重叠以与像素电极PE形成存储电容,且屏蔽金属SM与数据线DL在垂直于数据线DL的方向上(例如图1中的水平方向)存在间隙。更具体地,源极S、漏极D和数据线DL例如位于同一层结构中,遮蔽金属层SM、栅极G和扫描线GL例如也位于同一层结构中;数据线DL和扫描线GL例如由不透光导电金属材料制成,所述不透光导电金属材料例如为金属铬或其他不透光导电金属材料,其可以作为遮光结构配合黑色遮光材料使用达到更佳的遮光效果,使得光在通过所述不透光导电金属材料时被全部遮挡。像素电极PE例如为采用透明导电金属材料制成,所述透明导电金属材料例如为ITO(Indium TinOxide,铟锡氧化物)薄膜材质制成,ITO薄膜具有高的导电率、高的可见光透过率、高的机械硬度和良好的化学稳定性。像素电极PE例如为多个。
如图2A所示为沿着图1中的剖面线A的阵列基板10的结构示意图,可以看出,阵列基板10还包括:基底GS1、黑色遮光块BM1组成的黑色遮光层、有源材料层AS、保护层PV和包括多种颜色的色阻块CR的色阻材料层。黑色遮光块BM1设置在基底GS1上方,屏蔽金属SM位于黑色遮光块BM1上方的层结构中,从而黑色遮光块BM1位于基底GS1和屏蔽金属SM之间,有源材料层AS位于屏蔽金属SM和数据线DL之间的层结构中,保护层PV位于数据线DL和所述色阻材料层之间的层结构中,像素电极PE位于所述色阻材料层上方的层结构中。基底GS1例如为透光玻璃材料制成。屏蔽金属SM的下方例如对应设置有黑色遮光块BM1,黑色遮光块BM1例如由黑色不透光绝缘材料制成,所述黑色不透光绝缘材料例如为含碳黑的黑色光阻,栅极G的下方也对应设置有黑色遮光块BM1(见图2B),扫描线GL的下方也对应设置有黑色遮光块BM1(图中未示出),配合设置在与阵列基板10对应设置的对向基板上的黑色矩阵材料以实现更好的遮光效果,防止因在液晶显示面板的制造过程中由于对向基板与阵列基板10之间未能很好的对齐导致的对向基板上的黑色矩阵材料未能完全覆盖到数据线和屏蔽金属之间的部分从而导致的漏光现象的发生。更具体地,所述包括多种颜色的色阻块CR的色阻材料层例如包括红色色阻块CR、绿色色阻块CR和蓝色色阻块CR,红色色阻块CR、绿色色阻块CR和蓝色色阻块CR与所述多个像素电极PE一一对应设置,例如一个像素电极PE对应一个红色色阻块CR或一个像素电极PE对应一个绿色色阻块CR或一个像素电极PE对应一个蓝色色阻块CR;图2A示出的有源材料层AS在经过屏蔽金属SM的上方时例如只包括主动开关元件T的栅极绝缘层GI
如图2B所示为沿着图1中的剖面线B的阵列基板的结构示意图,可见,图2A示出的有源材料层AS在经过主动开关元件T的栅极G上方时不仅包括主动开关元件T的栅极绝缘层GI,还包括主动开关元件T的半导体层SC和欧姆接触层C,栅极绝缘层GI、半导体层SC和欧姆接触层C依序层叠设置,保护层PV的中间设置有接触孔CH,像素电极PE通过接触孔CH与漏极D电气连接。更具体地,图2B示出的源极S和漏极D例如和图2A中示出的数据线DL位于同一层结构中,遮蔽金属层SM、栅极G和扫描线GL(图2A和图2B中未示出)例如也位于同一层结构中;半导体层SC例如采用a-Si(非晶硅)材料制成,栅极绝缘层GI和保护层PV例如采用氮化硅材料制成。
如图3A和图3B所示,本发明的一个实施例提供的一种液晶显示面板20,如图3A所示为沿着图1中剖面线A的液晶显示面板20的结构示意图,如图3B所示为沿着图1中剖面线B的液晶显示面板20的结构示意图。可见,液晶显示面板20包括:如前述任一实施例所述的阵列基板10、与阵列基板10相对设置的对向基板以及设置在所述对向基板和阵列基板10之间的:框胶SD、感光间隔物PS以及被框胶SD包围的由多个液晶分子形成的液晶层LC,所述对向基板包括基底GS2、设置在基底GS2面向阵列基板10的一侧的黑色矩阵块BM2以及设置在黑色矩阵块BM2面向阵列基板10的一侧的公共电极层CE。阵列基板10的具体功能和结构细节请参考前述实施例的描述,在此不再赘述。更具体地,黑色矩阵块BM2在阵列基板10上的投影覆盖阵列基板10上的像素电极PE之外的所有区域和阵列基板10上的黑色遮光层212。更具体地,黑色矩阵块BM2例如和黑色遮光块BM1一样是由黑色不透光绝缘材料制成,所述黑色不透光绝缘材料例如为含碳黑的黑色光阻。如图3A所示,黑色矩阵块BM2在阵列基板10的基底GS1上的投影例如完全覆盖屏蔽金属SM、黑色遮光块BM1、数据线DL以及覆盖像素电极PE的部分区域;如图3B所示,黑色矩阵块BM2在阵列基板10的基底GS1上的投影例如还完全覆盖主动开关元件T的各个组成部分:栅极G、半导体层SC、欧姆接触层C、源极S和漏极D;框胶SD例如是环绕液晶层LC设置,如此可以使液晶层LC的液晶分子封闭在一定区域内;感光间隔物PS例如均匀分散设置在液晶层LC的所述液晶分子之间,从而可以支撑上下两个基板,使之保持一定的间距;公共电极层CE可以与设置在阵列基板10上的像素电极PE配合在施加合适的电压时共同形成需要的电场来驱动布置在两者之间的液晶层LC中的液晶分子转向,从而实现所需图像的显示;公共电极层CE例如采用透明导电金属材料制成,例如由ITO薄膜材质制成。
综上所述,本发明前述实施例在保证产品穿透率的基础上,通过在屏蔽金属SM的下方、栅极G的下方以及扫描线GL的下方设置黑色遮光块BM1可以解决当阵列基板10和所述对向基板对组制成液晶显示面板20的时候极易产生的因无法对齐而导致的错位现象,例如导致如图3A所示的黑色矩阵块BM2的左边界或者右边界错位至屏蔽金属SM的上方甚至错位至屏蔽金属SM和数据线DL之间的间隙上方从而导致数据线DL两侧的漏光现象的发生,或者导致图3B所示的黑色矩阵块BM2的错位导致的栅极G和扫描线GL(图3B中未示出)左右两侧的漏光现象。
本发明的另一实施例提供了如前述实施例所述的阵列基板10的一种制造方法,如图2A和2B所示,包括步骤:利用同一道光罩在基底GS1上形成黑色遮光块BM1、主动开关元件T的栅极G、屏蔽金属SM和与栅极G连接的扫描线GL。更具体地,利用同一道光罩在基底GS1上形成黑色遮光块BM1、主动开关元件T的栅极G、屏蔽金属SM和扫描线GL包括步骤:如图4A所示先在基底GS1上形成黑色遮光材料层BM,如图4B所示其次在黑色遮光材料层BM上例如通过PVD(物理汽相沉积,包括蒸镀和溅镀等)方法形成金属材料层M1,从而黑色遮光材料层BM位于基底GS1和金属材料层M1之间,如图4C所示然后在金属材料层M1上形成光阻材料层PR,如图4D所示之后利用光罩PM和光照L对光阻材料层PR进行曝光显影以得到如图4E所示的图案化光阻材料层PR1,如图4F和图4G所示再以图案化光阻材料层PR1为掩膜对金属材料层M1和黑色遮光材料层BM依序进行湿蚀刻和干蚀刻,以及如图4H所示在所述干蚀刻后去除残余的光阻材料层PR1以得到黑色遮光块BM1、主动开关元件T的栅极G、屏蔽金属SM和与栅极G连接的扫描线GL(图中未示出)。
进一步地,如图2A和2B所示,所述的阵列基板10的制造方法,例如还包括步骤:在主动开关元件T的栅极G、屏蔽金属SM和与栅极G连接的扫描线GL所在的层结构上形成有源材料层AS。更具体地,形成有源材料层AS为:先在主动开关元件T的栅极G、屏蔽金属SM和与栅极G连接的扫描线GL所在的层结构上例如通过PECVD(等离子增强化学汽相淀积)方法形成栅极绝缘层GI;再在位于主动开关元件T的栅极G的上方的栅极绝缘层GI上方通过PECVD方法形成半导体层SC和欧姆接触层C。
进一步地,如图2A和2B所示,所述的阵列基板10的制造方法,例如还包括步骤:在有源材料层AS上方的层结构中例如利用PVD方法形成主动开关元件T的源极S、主动开关元件T的漏极D以及与源极S连接的数据线DL。
进一步地,如图2A和2B所示,所述的阵列基板10的制造方法,例如还包括步骤:在主动开关元件T的源极S、主动开关元件T的漏极D以及与源极S连接的数据线DL上方的层结构中例如通过PECVD方法形成保护层PV并在保护层PV中形成接触孔CH。
进一步地,如图2A和2B所示,所述的阵列基板10的制造方法,例如还包括步骤:在保护层PV上方的层结构中按照预设顺序形成包括多种颜色的色阻块CR的色阻材料层。更具体地,色阻块CR例如为红色色阻块CR、绿色色阻块CR和蓝色色阻块CR中的任意一种,所述预设顺序例如为先形成所有的红色色阻块CR,再形成所有的绿色色阻块CR,最后形成所有的蓝色色阻块CR)或者其他的顺序。
进一步地,如图2A和2B所示,所述的阵列基板10的制造方法,例如还包括步骤:在所述色阻材料层上方的层结构中例如通过PVD方法形成与色阻块CR一一对应设置的多个像素电极PE,并使像素电极PE通过接触孔CH连接主动开关元件T的漏极D。
更具体地,在基底GS1上形成屏蔽金属SM例如为:形成环绕像素电极PE并与像素电极PE平行于数据线DL的两边缘部分重叠从而形成存储电容(如图1中左右两边缘)且与数据线DL在垂直于数据线DL的方向上(如图1中的水平方向上)存在间隙的屏蔽金属SM。
本发明的再一实施例提供了如前述任一实施例所述的液晶显示面板20的一种制造方法,如图3A和3B所示,包括步骤:采用如前述任一实施例所述的阵列基板10的制造方法制造的阵列基板10,阵列基板10的制造方法的具体步骤请参考前述实施例的描述,在此不再赘述;在基底GS2上依次形成黑色矩阵块BM2和公共电极层CE;在公共电极层CE和阵列基板10之间形成感光间隔物PS和框胶SD并注入液晶层LC,最终形成液晶显示面板20。
综上所述,本发明前述实施例通过利用同一道光罩在基底GS1上形成黑色遮光块BM1、主动开关元件T的栅极G、屏蔽金属SM和扫描线GL的方法,在保证不增加光罩简化制作复杂度的前提下,实现了黑色遮光块BM1的制作,并免去了黑色遮光块BM1和位于其上方的层结构中的主动开关元件T的栅极G、屏蔽金属SM和扫描线GL之间的对齐过程;同时,在保证产品穿透率的基础上,最终通过在屏蔽金属SM的下方、栅极G的下方以及扫描线GL的下方设置黑色遮光块BM1可以解决当阵列基板10和所述对向基板对组制成液晶显示面板20的时候极易产生的因无法对齐而导致的错位现象,例如导致如图3A所示的黑色矩阵块BM2的左边界或者右边界错位至屏蔽金属SM的上方甚至错位至屏蔽金属SM和数据线DL之间的间隙上方从而导致数据线DL两侧的漏光现象的发生,或者导致图3B所示的黑色矩阵块BM2的错位导致的栅极G和扫描线GL(图3B中未示出)左右两侧的漏光现象。
在本申请所提供的几个实施例中,应所述理解到,所揭露的系统,装置和方法,可以通过其它的方式实现。例如,以上所描述的装置实施例仅仅是示意性的,例如,所述单元的划分,仅仅为一种逻辑功能划分,实际实现时可以有另外的划分方式,例如多路单元或组件可以结合或者可以集成到另一个系统,或一些特征可以忽略,或不执行。另一点,所显示或讨论的相互之间的耦合或直接耦合或通信连接可以是通过一些接口,装置或单元的间接耦合或通信连接,可以是电性,机械或其它的形式。
所述作为分离部件说明的单元可以是或者也可以不是物理上分开的,作为单元显示的部件可以是或者也可以不是物理单元,即可以位于一个地方,或者也可以分布到多路网络单元上。可以根据实际的需要选择其中的部分或者全部单元来实现本实施例方案的目的。
另外,在本发明各个实施例中的各功能单元可以集成在一个处理单元中,也可以是各个单元单独物理存在,也可以两个或两个以上单元集成在一个单元中。上述集成的单元既可以采用硬件的形式实现,也可以采用硬件加软件功能单元的形式实现。
最后应说明的是:以上实施例仅用以说明本发明的技术方案,而非对其限制;尽管参照前述实施例对本发明进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本发明各实施例技术方案的精神和范围。

Claims (18)

1.一种阵列基板的制造方法,其特征在于,包括步骤:
在基底上形成黑色遮光材料层;
在所述黑色遮光材料层上形成金属材料层;
在所述金属材料层上形成光阻材料层;
利用光罩对所述光阻材料层进行曝光显影以得到图案化光阻材料层;
以所述图案化光阻材料层为掩膜对所述金属材料层和所述黑色遮光材料层依序进行湿蚀刻和干蚀刻;以及
在所述干蚀刻后去除残余的光阻材料层,以得到黑色遮光层和第一金属层,并在所述黑色遮光层中形成多个黑色遮光块;
在所述第一金属层上形成有源材料层;
在所述有源材料层上形成第二金属层;
在所述第二金属层上形成保护层并在所述保护层中形成接触孔;
在所述保护层上形成色阻材料层;
在所述色阻材料层上形成像素电极层、并使所述像素电极层通过所述接触孔连接所述第二金属层;
其中,所述黑色遮光层包括多个黑色遮光块,并且所述多个黑色遮光块之间存在间隙,所述第二金属层包括数据线,并且所述数据线设置在所述间隙下;
其中,所述数据线由金属铬制成;
其中,形成所述黑色遮光层和形成所述第一金属层为共用同一道光罩制程。
2.如权利要求1所述的阵列基板的制造方法,其特征在于,在基底上形成黑色遮光层和第一金属层,从而所述黑色遮光层位于所述基底与所述第一金属层之间包括:在所述黑色遮光层上形成主动开关元件的栅极和用于与所述像素电极层形成存储电容的屏蔽金属;其中所述栅极和所述屏蔽金属为所述第一金属层的构成部分。
3.如权利要求2所述的阵列基板的制造方法,其特征在于,所述在所述第一金属层上形成有源材料层包括:依次在所述第一金属层上形成所述主动开关元件的栅极绝缘层、半导体层和欧姆接触层。
4.如权利要求3所述的阵列基板的制造方法,其特征在于,在所述有源材料层上形成第二金属层包括:在所述有源材料层上形成所述主动开关元件的源极、所述主动开关元件的与所述像素电极层连接的漏极以及与所述源极连接的数据线;其中所述源极、所述漏极和所述数据线为所述第二金属层的构成部分。
5.如权利要求4所述的阵列基板的制造方法,其特征在于,所述在所述保护层上形成色阻材料层包括:在所述保护层上按照预设顺序形成红色色阻块、绿色色阻块和蓝色色阻块。
6.如权利要求5所述的阵列基板的制造方法,其特征在于,在色阻层上形成像素电极层包括:在所述色阻层上形成与所述红色色阻块、所述绿色色阻块和所述蓝色色阻块一一对应且由透明导电材料制成的多个像素电极。
7.如权利要求1所述的阵列基板的制造方法,其特征在于,所述黑色遮光层的材料为含碳黑的黑色光阻。
8.一种液晶显示面板的制造方法,其特征在于,包括步骤:
采用如权利要求1-7任意一项所述的方法制造阵列基板;
在第二基底上依次形成黑色矩阵层和公共电极层;以及
在所述公共电极层和所述阵列基板之间设置并注入液晶分子形成液晶层。
9.如权利要求8所述的液晶显示面板的制造方法,其特征在于,所述黑色遮光层的材料和所述黑色矩阵层的材料相同。
10.一种阵列基板,其特征在于,通过如权利要求1-7任意一项所述的阵列基板的制造方法制成;
所述阵列基板包括:
基底;
黑色遮光层,设置在所述基底上;
第一金属层,对应设置在所述黑色遮光层上,从而所述黑色遮光层位于所述基底和所述第一金属层之间;
有源材料层,设置在所述第一金属层上;
第二金属层,设置在所述有源材料层上;
保护层,设置在所述第二金属层上且其上设置有接触孔;
色阻材料层,设置在所述保护层上;以及
像素电极层,设置在色阻材料层上且通过所述接触孔连接所述第二金属层;
其中,所述黑色遮光层包括多个黑色遮光块,并且所述多个黑色遮光块之间存在间隙,所述第二金属层包括数据线,并且所述数据线设置在所述间隙下;
其中,所述数据线由金属铬制成。
11.如权利要求10所述的阵列基板,其特征在于,所述第一金属层包括:主动开关元件的栅极和用于与所述像素电极层形成存储电容的屏蔽金属;其中,所述第一金属层还包括:扫描线,所述扫描线与所述栅极电气连接,且所述扫描线由不透光导电金属材料制成。
12.如权利要求11所述的阵列基板,其特征在于,所述有源材料层包括:所述主动开关元件的栅极绝缘层、半导体层和欧姆接触层,所述栅极绝缘层、所述半导体层和所述欧姆接触层依序层叠设置。
13.如权利要求12所述的阵列基板,其特征在于,所述第二金属层还包括:所述主动开关元件的源极、所述主动开关元件的与所述像素电极层连接的漏极以及与所述源极,其中所述源极与所述数据线连接。
14.如权利要求13所述的阵列基板,其特征在于,所述色阻材料层包括:红色色阻块、绿色色阻块和蓝色色阻块;所述像素电极层包括:与所述红色色阻块、所述绿色色阻块和所述蓝色色阻块一一对应且由透明导电材料制成的多个像素电极。
15.如权利要求14所述的阵列基板,其特征在于,所述屏蔽金属环绕所述像素电极并与所述像素电极平行于所述数据线的两边缘部分重叠,且所述屏蔽金属与所述数据线在垂直于所述数据线的方向上存在间隙。
16.如权利要求10所述的阵列基板,其特征在于,所述黑色遮光层的材料为含碳黑的黑色光阻。
17.一种液晶显示面板,其特征在于,包括:
如权利要求10-16任意一项所述的阵列基板;
对向基板,与所述阵列基板相对设置;
液晶层,设置在所述阵列基板和所述对向基板之间;
框胶,设置在所述阵列基板和所述对向基板之间并环绕所述液晶层;
其中,所述对向基板包括:
第二基底;
黑色矩阵层,设置在所述第二基底面向所述阵列基板的一侧;以及
公共电极层,设置在所述黑色矩阵层面向所述阵列基板的一侧;
其中,所述液晶显示面板还包括:感光间隔物,均匀分散设置在所述液晶层的液晶分子之间。
18.如权利要求17所述的液晶显示面板,其特征在于,所述黑色遮光层的材料和所述黑色矩阵层的材料相同。
CN201711391928.7A 2017-12-21 2017-12-21 阵列基板及其制造方法、液晶显示面板及其制造方法 Active CN107942595B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201711391928.7A CN107942595B (zh) 2017-12-21 2017-12-21 阵列基板及其制造方法、液晶显示面板及其制造方法
US16/772,819 US11294218B2 (en) 2017-12-21 2018-09-11 Array substrate and its maufacturing method, liquid crystal display panel and its manufacturing method
PCT/CN2018/105062 WO2019119889A1 (zh) 2017-12-21 2018-09-11 阵列基板及其制造方法、液晶显示面板及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711391928.7A CN107942595B (zh) 2017-12-21 2017-12-21 阵列基板及其制造方法、液晶显示面板及其制造方法

Publications (2)

Publication Number Publication Date
CN107942595A CN107942595A (zh) 2018-04-20
CN107942595B true CN107942595B (zh) 2024-03-29

Family

ID=61940950

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711391928.7A Active CN107942595B (zh) 2017-12-21 2017-12-21 阵列基板及其制造方法、液晶显示面板及其制造方法

Country Status (3)

Country Link
US (1) US11294218B2 (zh)
CN (1) CN107942595B (zh)
WO (1) WO2019119889A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107942595B (zh) * 2017-12-21 2024-03-29 惠科股份有限公司 阵列基板及其制造方法、液晶显示面板及其制造方法
CN108803161B (zh) * 2018-06-29 2021-07-09 上海天马微电子有限公司 显示面板、显示面板的制造方法以及显示装置
CN109935173B (zh) * 2019-03-29 2021-10-26 上海天马微电子有限公司 一种显示模组及显示装置
CN110136571A (zh) * 2019-04-29 2019-08-16 深圳市华星光电半导体显示技术有限公司 一种阵列基板及其显示面板
CN110308598B (zh) * 2019-06-12 2022-01-07 惠科股份有限公司 阵列基板、阵列基板的制作方法和显示面板
CN110290243B (zh) * 2019-06-24 2022-07-08 Oppo广东移动通信有限公司 显示装置、电子设备及图像获取方法
CN111427210B (zh) * 2020-04-10 2022-11-25 深圳市华星光电半导体显示技术有限公司 显示面板
CN111443532A (zh) * 2020-04-21 2020-07-24 Tcl华星光电技术有限公司 液晶显示面板及显示装置

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050097114A (ko) * 2004-03-30 2005-10-07 엘지.필립스 엘시디 주식회사 액정패널구조
CN100412629C (zh) * 2005-03-15 2008-08-20 Nec液晶技术株式会社 液晶显示设备及其制造方法
CN100416390C (zh) * 2004-03-30 2008-09-03 乐金显示有限公司 液晶显示器件
CN100517033C (zh) * 2005-12-07 2009-07-22 群康科技(深圳)有限公司 液晶显示面板
CN201289561Y (zh) * 2008-11-17 2009-08-12 上海广电光电子有限公司 液晶显示装置
CN102236228A (zh) * 2010-05-04 2011-11-09 乐金显示有限公司 液晶显示装置及其制造方法
CN105093752A (zh) * 2015-08-18 2015-11-25 深圳市华星光电技术有限公司 液晶面板
CN207742427U (zh) * 2017-12-21 2018-08-17 惠科股份有限公司 阵列基板和液晶显示面板

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0792574B2 (ja) * 1988-12-21 1995-10-09 インターナショナル・ビジネス・マシーンズ・コーポレーション 液晶表示装置およびその製造方法
JP2002296609A (ja) * 2001-03-29 2002-10-09 Nec Corp 液晶表示装置及びその製造方法
KR101335276B1 (ko) * 2006-09-20 2013-11-29 삼성디스플레이 주식회사 어레이 기판, 이를 갖는 표시패널 및 그 제조 방법
KR100941836B1 (ko) * 2008-05-19 2010-02-11 삼성모바일디스플레이주식회사 유기 전계 발광표시장치
KR20130115621A (ko) * 2012-04-12 2013-10-22 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
JP2014106322A (ja) * 2012-11-27 2014-06-09 Kyocera Corp 液晶表示装置
US10199507B2 (en) * 2012-12-03 2019-02-05 Lg Display Co., Ltd. Thin film transistor, display device and method of manufacturing the same
CN105093735B (zh) * 2015-07-10 2018-04-20 深圳市华星光电技术有限公司 一种阵列基板及其制作方法
CN105842904B (zh) 2016-05-25 2024-02-06 京东方科技集团股份有限公司 阵列基板、显示装置及制备方法
CN106098703B (zh) * 2016-07-01 2020-03-10 武汉华星光电技术有限公司 显示面板及其制造方法、显示器
CN107132710B (zh) 2017-05-17 2021-01-26 京东方科技集团股份有限公司 一种阵列基板及其制备方法、显示面板
CN107065358A (zh) * 2017-05-27 2017-08-18 深圳市华星光电技术有限公司 Tft基板和液晶显示面板
CN107403758B (zh) * 2017-08-09 2022-09-23 京东方科技集团股份有限公司 阵列基板及其制备方法、显示装置
CN108039339A (zh) * 2017-12-21 2018-05-15 惠科股份有限公司 阵列基板的制作方法、阵列基板和液晶显示面板
CN107942595B (zh) * 2017-12-21 2024-03-29 惠科股份有限公司 阵列基板及其制造方法、液晶显示面板及其制造方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20050097114A (ko) * 2004-03-30 2005-10-07 엘지.필립스 엘시디 주식회사 액정패널구조
CN100416390C (zh) * 2004-03-30 2008-09-03 乐金显示有限公司 液晶显示器件
CN100412629C (zh) * 2005-03-15 2008-08-20 Nec液晶技术株式会社 液晶显示设备及其制造方法
CN100517033C (zh) * 2005-12-07 2009-07-22 群康科技(深圳)有限公司 液晶显示面板
CN201289561Y (zh) * 2008-11-17 2009-08-12 上海广电光电子有限公司 液晶显示装置
CN102236228A (zh) * 2010-05-04 2011-11-09 乐金显示有限公司 液晶显示装置及其制造方法
CN105093752A (zh) * 2015-08-18 2015-11-25 深圳市华星光电技术有限公司 液晶面板
CN207742427U (zh) * 2017-12-21 2018-08-17 惠科股份有限公司 阵列基板和液晶显示面板

Also Published As

Publication number Publication date
CN107942595A (zh) 2018-04-20
US11294218B2 (en) 2022-04-05
WO2019119889A1 (zh) 2019-06-27
US20210165268A1 (en) 2021-06-03

Similar Documents

Publication Publication Date Title
CN107942595B (zh) 阵列基板及其制造方法、液晶显示面板及其制造方法
KR101335276B1 (ko) 어레이 기판, 이를 갖는 표시패널 및 그 제조 방법
JP4925030B2 (ja) 液晶表示装置及びその製造方法
JP5299873B2 (ja) 液晶表示パネル
US8450744B2 (en) High light transmittance in-plane switching liquid crystal display device and method for manufacturing the same
US9052550B2 (en) Thin film transistor liquid crystal display
TWI457643B (zh) 平面切換式液晶顯示裝置
JP6132503B2 (ja) 液晶表示装置
KR101243824B1 (ko) 액정표시장치 및 그 제조방법
TW200424626A (en) Method of manufacturing liquid crystal display device
US20070146620A1 (en) Liquid crystal display element
US11372291B2 (en) Manufacturing method of array substrate, array substrate and liquid crystal display panel
CN104793390A (zh) 显示面板、薄膜晶体管基板、彩色滤光片基板及制作方法
WO2012114687A1 (ja) 電子機器及びその製造方法
KR101631620B1 (ko) 프린지 필드형 액정표시장치 및 그 제조방법
CN113467145A (zh) 阵列基板及制作方法、显示面板
US20100001936A1 (en) Liquid crystal display and method for manufacturing the same
CN104020621B (zh) 一种阵列基板及其制备方法、显示装置
KR20130030975A (ko) 액정표시장치
CN203930286U (zh) 母板堆叠结构
KR20130033676A (ko) 프린지 필드 스위칭 모드 액정표시장치
KR101969429B1 (ko) 에프에프에스 방식 액정표시장치용 어레이기판 및 그 제조방법
KR100640048B1 (ko) 액정표시장치 및 그의 제조방법
CN106940507A (zh) 阵列基板及其制备方法、显示面板
KR102245004B1 (ko) 액정표시장치용 어레이 기판의 제조 방법

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant