CN107889422A - Heat pipe structure - Google Patents

Abstract

The present invention discloses a heat pipe structure, which includes a first plate, a second plate and a plurality of capillary structures. The second plate is connected to the first plate to form a chamber. The plurality of capillary structures are arranged in the chamber, and the distribution shape of the plurality of capillary structures is similar to the shape of a part of the chamber. The chamber is composed of at least one confluence and at least three extensions, the confluence is connected to the at least three extensions, and the appearance formed by the connection of the first plate and the second plate is different from the appearance of the chamber.

Description

heat pipe structure

technical field

The present invention relates to a heat pipe structure, in particular to a heat pipe structure with a cavity having at least three extensions.

Background technique

Nowadays, electronic equipment continues to develop in the direction of portability, thinness, and high additional functions, and because the overall volume of electronic equipment is getting smaller and smaller, the accommodation space for its internal components is also limited. However, when high-performance electronic equipment operates A large amount of waste heat will be generated. If the heat cannot be taken away from the electronic equipment in real time, the temperature of the electronic equipment will rise, causing damage to internal components and reducing the technical effect and service life of the electronic device. The heat pipe structure is a common heat dissipation device, which can dissipate heat to the outside. Its heat dissipation principle is to use the gas phase change and flow heat transfer of the working fluid inside the plate to diffuse the heat energy to the condensation end to dissipate heat, and use the capillary structure to dissipate heat. The internal working fluid is guided back to the heat source, and this operation is repeated to remove heat.

However, the thickness and configuration of the heat pipe structure are limited by the unevenness of the space used by the internal components of the electronic device. Therefore, how to reduce the thickness of the heat pipe structure and make the configuration of the heat pipe structure adaptable without affecting the heat conduction efficiency of the heat pipe structure The limited space inside the electronic device increases the configuration flexibility of the heat pipe structure, which is one of the important issues in this field.

In view of this, how to provide a heat pipe structure that can reduce the thickness of the heat pipe structure and increase the flexibility of its configuration is one of the current important issues.

Contents of the invention

To achieve the above object, the present invention provides a heat pipe structure including a first plate body, a second plate body and a plurality of capillary structures. The second board is connected with the first board to form a chamber. The plurality of capillary structures are arranged in the chamber, and the shape of the distribution of the plurality of capillary structures is similar to the shape of a part of the chamber. Wherein, the chamber is composed of at least one confluence part and at least three extension parts, the confluence part communicates with the at least three extension parts, and the outer shape and the chamber formed after the first plate body and the second plate body are connected different appearance.

In one embodiment, among the at least three extensions, the length, width or height of at least one extension is different from the length, width or height of the other extensions.

In an embodiment, the thickness or size of the second board is different from that of the first board.

In one embodiment, the first plate body and the second plate body are heated and welded or bonded by a medium to form an edge seal near the side wall of the chamber.

In one embodiment, the heat welding is laser welding, diffusion welding, ultrasonic welding or any combination thereof.

In one embodiment, the dielectric bonding is brazing, gluing, or any combination thereof.

In one embodiment, heat welding or media bonding is a lateral bonding type.

In one embodiment, the first board or the second board is in direct contact with a heat source.

In one embodiment, at least one water injection channel is further included, and the water injection channel communicates with the chamber.

The present invention also provides a heat pipe structure including a first plate body, a second plate body and a plurality of capillary structures. The second board is connected with the first board to form a chamber. The plurality of capillary structures are arranged in the chamber, and the shape of the distribution of the plurality of capillary structures is similar to the shape of a part of the chamber. Wherein, the chamber is composed of at least one confluence part and at least three extension parts, and the confluence part communicates with the at least three extension parts.

In one embodiment, among the at least three extensions, the length, width or height of at least one extension is different from the length, width or height of the other extensions.

In an embodiment, the thickness or size of the second board is different from that of the first board.

In one embodiment, the first plate body and the second plate body are heated and welded or bonded by a medium to form an edge seal near the side wall of the chamber.

In one embodiment, the heat welding is laser welding, diffusion welding, ultrasonic welding or any combination thereof.

In one embodiment, the dielectric bonding is brazing, gluing, or any combination thereof.

In one embodiment, heat welding or media bonding is a lateral bonding type.

In one embodiment, the first board or the second board is in direct contact with an external heat source.

In one embodiment, at least one water injection channel is further included, and the water injection channel communicates with the chamber.

Based on the above, the heat pipe structure of the present invention reduces the overall thickness of the heat pipe structure through the connection of the first plate body and the second plate body, and the overall shape formed by the side walls of the chamber is a non-traditional rectangular parallelepiped. The appearance can be changed according to the configuration design of the chamber, and the chamber can also have at least one confluence part and at least three extension parts, so that the heat pipe structure can go deep between the internal components of the electronic device, and its configuration can be adapted The limited space inside the electronic device increases the configuration flexibility of the heat pipe structure, thereby enabling more flexible use of the internal space of the electronic device.

Description of drawings

FIG. 1A is a three-dimensional schematic diagram of a heat pipe structure according to an embodiment of the present invention.

FIG. 1B is a partial cross-sectional view of the heat pipe structure shown in FIG. 1A along line A-A.

2A to 2E are schematic diagrams of different states of combining the first board and the second board.

FIG. 2F is a schematic diagram of the lateral joint between the first board and the second board shown in FIG. 2E .

FIG. 3A is a three-dimensional schematic diagram of a heat pipe structure according to another embodiment of the present invention.

FIG. 3B is a partial cross-sectional view of the heat pipe structure shown in FIG. 3A along line B-B.

FIG. 4A is a three-dimensional schematic diagram of a heat pipe structure according to another embodiment of the present invention.

FIG. 4B is a partial cross-sectional view of the heat pipe structure shown in FIG. 4A along line C-C.

Wherein, the reference signs are explained as follows:

1, 2, 3: heat pipe structure

11, 11a, 11b, 11c, 11d, 11e, 21, 31: the first plate body

111, 111a, 111b, 111c, 111d, 121c, 121d, 121e, 211, 311, 321: channel

12, 12a, 12b, 12c, 12d, 12e, 22, 32: second board

13, 23, 33: capillary structure

14, 14a, 14b, 14c, 14d, 14e, 24, 34: chamber

141, 241, 341: extension

142, 242, 342: Confluence

15a, 15b, 15c, 15d, 15e, 25, 35: edge banding

16, 26, 36: water injection channel

27, 37: Support structure

A-A, B-B, C-C: line segments

W1, W2: welding head

Detailed ways

A heat pipe structure according to a preferred embodiment of the present invention will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols.

The basic structure and features of an embodiment of the heat pipe structure of the present invention will be introduced below. Please refer to FIG. 1A to FIG. 1B at the same time. FIG. A partial sectional view of the heat pipe structure shown along line A-A.

The present invention provides a heat pipe structure 1 comprising a first plate body 11 , a second plate body 12 and a plurality of capillary structures 13 , the second plate body 12 is connected with the first plate body 11 to form a chamber 14 . A plurality of capillary structures 13 are arranged in the chamber 14, and the shape of the distribution of the plurality of capillary structures 13 is similar to the shape of a part of the chamber 14. 14 have the same shape or slightly larger than the situation. Wherein, the chamber 14 is composed of at least one confluent portion 142 and at least three extension portions 141 , and the confluence portion 142 communicates with at least three extension portions 141 . The outer shape formed after the first plate body 11 and the second plate body 12 is connected is different from the outer shape of the chamber 14, and the first plate body 11 or the second plate body 12 is directly connected to an external heat source (not shown in the drawings). touch.

As shown in FIG. 1B , in this embodiment, the first plate body 11 has a channel 111 , and the channel 111 and the second plate body 12 together form a cavity 14 . The channel 111 can be formed by punching the first plate body 11 with a machine tool, and the channel 111 can form an accommodating space and can form a chamber 14 together with the second plate body 12, so that a plurality of capillary structures 13 is disposed in the chamber 14 .

In this embodiment, the overall shape of the chamber 14 is a non-cuboid, and among the at least three extensions 141, the length, width or height of at least one extension 141 is different from the length, width or height of the other extensions 141. different heights. In addition, the shape of the chamber 14 can also be changed according to the design of the space configuration, so that the thickness or size of the second plate body 12 and the first plate body 11 are different.

In addition, the heat pipe structure 1 also includes at least one water injection channel 16 , which communicates with the chamber 14 for filling the working fluid in the chamber 14 and evacuating the pressure in the chamber 14 . And after filling in the working fluid and vacuumizing, the water injection channel 16 will be closed or filled up.

The different ways of combining the first plate and the second plate will be described in detail below. Please refer to FIGS. 1B and 2A to 2E at the same time. The channel 111 forms the cavity 14 together with the first plate body 11 , the second plate body 12 or another channel (not shown in the drawings). To further illustrate, as shown in Figure 2A to Figure 2D, the first plate body 11a, 11b, 11c, 11d, 11e may have a channel 111a, 111b, 111c, 111d, or as shown in Figure 2E, the first plate body 11e can be a flat plate; and as shown in Figure 2C to Figure 2E, the second plate body 12c, 12d, 12e can have a channel 121c, 121d, 121e, or as shown in Figure 2A and Figure 2B, the second plate body 12a, 12b can also be a flat plate.

In addition, as shown in FIG. 1B , the channel 111 can be formed by punching the first plate body 11 or the second plate body 12 using a machine tool, or as shown in FIG. 2D , the channel 111d and 121d can be formed by Chemical etching is used to form the first plate body 11d or the second plate body 12d. The channel can form an accommodating space and can form a cavity together with another plate or another channel, so that multiple capillary structures are arranged in the cavity.

The following will describe the combination of the first plate and the second plate. Taking FIG. 2A as an example, the first plate 11a and the second plate 12a are heated and welded or medium adjacent to the side wall of the chamber 14a. Joining forms the edge seal 15a, that is, the edge seal 15a is located at the junction of the first plate 11a and the second plate 12a, and is located in the channel of the first plate 11a and/or the second plate 12a 111a adjacent. To further illustrate, the edge sealing part 15a is located at the junction of the first plate body 11a and the second plate body 12a, and the edge sealing parts 15a, 15b, 15e can be located at the chamber 14a, 14b, 14e on the side walls (see Fig. 2A, Fig. 2B and Fig. 2E), or make the edge seals 15c, 15d be located at the vicinity of the side walls of the chambers 14c, 14d (see Fig. 2C and Fig. 2D). Wherein, the distribution shape of the sealing edge 15a may correspond to the overall shape formed by the cavity 14a.

Please also refer to FIG. 2F for a more detailed description. FIG. 2F is a schematic diagram of the lateral joint between the first board and the second board shown in FIG. 2E . The combination of the first plate body 11e and the second plate body 12e can form the edge sealing part 15e by using local unilateral high-temperature heating and welding without solder, wherein the heating and welding is laser welding, diffusion welding, ultrasonic welding or any combination thereof . In addition, the angle of fusion can be frontal or side welding. Among them, the front welding is to use the welding angle perpendicular to the first plate body 11e and the second plate body 12e to carry out edge sealing, and the side welding is to use the welding angle not perpendicular to the first plate body 11e and the second plate body 12e to carry out edge banding. In addition, the medium joint with a larger area at the edge sealing portion 15e can also be used to combine the first plate body 11e and the second plate body 12e, wherein the medium joint is brazing, gluing or any combination thereof. As shown in Figure 2F, in this embodiment, heating and welding or medium bonding can be a lateral bonding type, and the welding head W1 is on the first plate 11e and the second plate 11e in a direction parallel to the first plate 11e. body 12e for edge sealing; or the welding head W2 can utilize a welding angle of 45 degrees with the first plate body 11e or the second plate body 12e for edge sealing.

Please refer to FIG. 3A to FIG. 3B at the same time. FIG. 3A is a schematic perspective view of a heat pipe structure according to another embodiment of the present invention, and FIG. 3B is a partial cross-sectional view of the heat pipe structure shown in FIG. 3A along line B-B.

The present invention provides a heat pipe structure 2 comprising a first plate body 21 , a second plate body 22 and a plurality of capillary structures 23 , and the second plate body 22 is connected with the first plate body 21 to form a cavity 24 . A plurality of capillary structures 23 are arranged in the chamber 24, and the shape of the distribution of the plurality of capillary structures 23 is similar to the shape of the part of the chamber 24. 24 have the same or slightly larger shape. Wherein, the chamber 24 is composed of at least one confluent portion 242 and at least three extension portions 241 , and the confluence portion 242 communicates with at least three extension portions 241 .

In this embodiment, the overall shape formed by the chamber 24 is a non-cuboid, and among the at least three extensions 241, the length, width or height of at least one extension 241 is different from the length, width or height of the other extensions 241. different heights. In addition, the shape of the chamber 24 can also be changed according to the design of the space configuration, so that the thickness or size of the second plate body 22 and the first plate body 21 are different. When the chamber 24 has at least three extensions 241, the distance between each extension 241 of the chamber 24 and the boundary of the first board 21 or the second board 22 can be different according to the space configuration and heat dissipation design. And the extending direction of each extending portion 241 can be the same or not the same, so that the heat pipe structure 2 can go deep between the internal components of the electronic device, so that its configuration can adapt to the limited space inside the electronic device, increasing the configuration flexibility of the heat pipe structure 2 , so that the internal space of the electronic device can be used more flexibly.

In addition, the heat pipe structure 2 further includes at least one support structure 27 disposed at the confluence portion 242 , and the two ends of each support structure 27 respectively abut against the capillary structure 23 or the first plate 21 and the second plate 22 . Wherein, the supporting structure 27 has a regular or irregular shape, such as but not limited to a supporting column or a supporting block, and the supporting structure 27 can be a solid metal block structure or be composed of a capillary structure 23 or include a capillary structure 23 . The support structure 27 can serve as a return path for the working fluid in the chamber 24 of the heat pipe structure 2 , and can also support the first plate body 21 and the second plate body 22 so that they are not deformed or collapsed.

In this embodiment, the heat pipe structure 2 further includes at least one water injection channel 26 . The water injection channel 26 communicates with the chamber 24 for filling the working fluid in the chamber 24 and evacuating the pressure in the chamber 24 . And after filling in the working fluid and vacuumizing, the water injection channel 26 will be closed or filled up.

As shown in FIG. 3B , in this embodiment, the shape of the space surrounded by the first board 21 is similar to the shape of the chamber. Wherein, different combinations of the first plate body 21 and the second plate body 22 can also be shown in FIG. 2A to FIG. 2E , which will not be repeated here. In addition, the first plate body 21 and the second plate body 22 are heated and welded or media bonded to form an edge seal 25 near the side walls of the chamber, that is, the edge seal 25 is located between the first plate body 21 and the second plate body. The junction of the two boards 22 is located near the channel 211 of the first board 21 and/or the second board 22 . To further illustrate, the edge sealing part 25 is located on the junction of the first plate body 21 and the second plate body 22, and the edge sealing part 25 can be located on the side wall surface of the chamber 24 according to the design of the chamber 24 and the manufacturing process. Or make the sealing edge 25 be located in the vicinity of the side wall surface of the chamber 24 . Wherein, the distribution shape of the sealing edge 25 may correspond to the overall shape formed by the cavity 24 .

The combination of the first plate body 21 and the second plate body 22 can form the sealing edge 25 by means of local unilateral high-temperature heating and welding without solder, wherein the heating and welding is laser welding, diffusion welding, ultrasonic welding or any combination thereof . And the welding angle can be front welding or side welding, wherein the front welding is to use the welding angle perpendicular to the first plate body 21 and the second plate body 22 to seal the edge, and the side welding is to use the welding angle not perpendicular to the first plate body 21 and the welding angle of the second plate body 22 for edge sealing. In addition, the media joint with a larger area at the sealing edge 25 can also be used to combine the first board body 21 and the second board body 22 , wherein the media joint is brazing, gluing or any combination thereof. Also, as shown in FIG. 2F , the welding method of heating fusion or dielectric bonding can be a lateral bonding type, which will not be repeated here.

Please refer to FIG. 4A to FIG. 4B at the same time. FIG. 4A is a schematic perspective view of a heat pipe structure according to another embodiment of the present invention, and FIG. 4B is a partial cross-sectional view of the heat pipe structure shown in FIG. 4A along line C-C.

The present invention also provides a heat pipe structure 3 comprising a first plate body 31 , a second plate body 32 and a plurality of capillary structures 33 . The second board 32 is connected with the first board 31 to form a cavity 34 . A plurality of capillary structures 33 are arranged in the chamber 34, and the shape of the distribution of the plurality of capillary structures 33 is similar to the shape of the part of the chamber 34. The so-called "approximate" at least includes the shape of the distribution of the plurality of capillary structures 33 and the shape of the part of the chamber. 34 have the same shape or slightly larger than the situation. Wherein, the chamber 34 is constituted by at least one confluent portion 342 and at least three extension portions 341, the confluence portion 342 communicates with at least three extension portions 341, and the first plate body 31 and the second plate body 32 are connected. The shape is different from that of the chamber 34 .

Wherein, different combinations of the first plate body 31 and the second plate body 32 can also be shown in FIG. 2A to FIG. 2E , which will not be repeated here.

In this embodiment, the overall shape formed by the chamber 34 is a non-cuboid, and among the at least three extensions 341, the length, width or height of at least one extension 341 is different from the length, width or height of the other extensions 341. different heights. In addition, the shape of the cavity 34 can also be changed according to the design of the space configuration, so that the thickness or size of the second plate body 32 and the first plate body 31 are different. When the chamber 34 has at least three extensions 341, the distance between each extension 341 of the chamber 34 and the boundary of the first board 31 or the second board 32 can be different according to the space configuration and heat dissipation design. Moreover, the extending directions of the extending portions 341 may be the same or different. In addition, the heat pipe structure 3 further includes at least one support structure 37 disposed at the confluence portion 342 , and the two ends of each support structure 37 respectively abut against the capillary structure 33 or the first plate 31 and the second plate 32 . Wherein, the supporting structure 37 has a regular or irregular shape, such as but not limited to a supporting column or a supporting block, and the supporting structure 37 can be a solid metal block structure or be composed of a capillary structure 33 or include a capillary structure 33 . The supporting structure 37 can serve as a return path for the working fluid in the cavity 34 of the heat pipe structure 3 , and can also support the first plate body 31 and the second plate body 32 so that they are not deformed or collapsed.

In this embodiment, the heat pipe structure 3 further includes at least one water injection channel 36 . The water injection channel 36 communicates with the chamber 34 for filling the working fluid in the chamber 34 and evacuating the pressure in the chamber 34 . And after filling in the working fluid and vacuuming, the water injection channel 36 will be closed or filled up.

In addition, the first plate body 31 and the second plate body 32 are heated and welded or media bonded to form an edge seal 35 near the side walls of the chamber, that is, the edge seal 35 is located between the first plate body 31 and the second plate body. The junction of the two boards 32 is located near the channels 311 and 321 of the first board 31 and/or the second board 32 . To further illustrate, the edge sealing part 35 is located on the junction of the first plate body 31 and the second plate body 32, and the edge sealing part 35 can be located on the side wall surface of the chamber 34 according to the design of the chamber 34 and the manufacturing process. Or make the sealing edge 35 be located in the vicinity of the side wall surface of the chamber 34 . Wherein, the distribution shape of the sealing edge 35 may correspond to the overall shape formed by the cavity 34 .

The combination of the first plate body 31 and the second plate body 32 can form the edge sealing part 35 by local unilateral high-temperature heating and welding without solder, wherein the heating and welding is laser welding, diffusion welding, ultrasonic welding or any combination thereof . And the welding angle can be front welding or side welding, wherein the front welding is to use the welding angle perpendicular to the first plate body 31 and the second plate body 32 to seal the edge, and the side welding is to use the welding angle not perpendicular to the first plate body 31 and the welding angle of the second plate body 32 for edge sealing. In addition, the media joint with a larger area at the sealing edge 35 can also be used to combine the first board body 31 and the second board body 32 , wherein the media joint is brazing, gluing or any combination thereof. Also, as shown in FIG. 2F , the welding method of heating fusion or dielectric bonding can be a lateral bonding type, which will not be repeated here.

To sum up, the heat pipe structure of the present invention reduces the overall thickness of the heat pipe structure through different connection designs of the first plate body and the second plate body, and the overall shape formed by the side walls of the chamber is unconventional Cuboid, its appearance can be changed according to the configuration design of the chamber, and the chamber can also have at least one confluence and at least three extensions, so that the heat pipe structure can be deep between the internal components of the electronic device, making it The configuration can adapt to the limited space inside the electronic device, increasing the configuration flexibility of the heat pipe structure, thereby enabling more flexible use of the internal space of the electronic device.

In the manufacturing process, the channel of the first plate or the second plate is formed by punching or chemical etching with a machine tool, and heat pipe structures with at least one confluence, at least three extensions and different shapes are manufactured at one time , can reduce the manufacturing process and reduce production costs. In addition, the combination of the first plate and the second plate can use heat fusion or medium joint according to the shape design of the chamber. The heat fusion or medium joint is a side joint design, which can reduce the welding width and increase the heat pipe. The configuration flexibility of the structure enables the heat pipe structure to have both the characteristics of the vapor chamber to provide a heat dissipation area and the two heat dissipation technical effects of the heat pipe to quickly remove heat.

The above description is for illustration only, not for limitation. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the protection scope of the appended claims.

Claims (18)

1. a kind of heat pipe structure, including：

One first plate body；

One second plate body, link to form a chamber with first plate body；And

Multiple capillary structures, set in the chamber, and the shape of the multiple capillary structure distribution and the shape of the partial chamber Shape is approximate；

Wherein, the chamber is made up of an at least fluidic junction and at least three extension, the fluidic junction and described at least three Extension connects, and the external form formed after first plate body and second plate body link is different from the external form of the chamber.

2. heat pipe structure as claimed in claim 1, wherein at least three extension, at least length of the extension The length of degree, width or height and other extensions, width or height are different.

3. heat pipe structure as claimed in claim 1, wherein second plate body are different from the thickness or size of first plate body.

4. heat pipe structure as claimed in claim 1, wherein first plate body and second plate body are in the side wall face of the chamber Adjacent place carries out heat welded or medium engages to be formed at an edge sealing.

5. heat pipe structure as claimed in claim 4, the wherein heat welded are laser welding, Diffusion Welding, ultrasonic welding Or its any combination.

6. the engagement of heat pipe structure as claimed in claim 4, the wherein medium is hard solder, gluing or its any combination.

7. the engagement of heat pipe structure as claimed in claim 4, the wherein heat welded or the medium is lateral engagement pattern.

8. heat pipe structure as claimed in claim 1, wherein first plate body or second plate body directly connect with an external heat source Touch.

9. heat pipe structure as claimed in claim 1, wherein also include an at least water injection path, the water injection path and the chamber.

10. a kind of heat pipe structure, including：

One first plate body；

One second plate body, link to form a chamber with first plate body；And

Multiple capillary structures, set in the chamber, and the shape of the multiple capillary structure distribution and the shape of the partial chamber Shape is approximate；

Wherein, the chamber is made up of an at least fluidic junction and at least three extension, the fluidic junction and described at least three Extension connects.

11. heat pipe structure as claimed in claim 10, wherein at least three extension, at least length of the extension The length of degree, width or height and other extensions, width or height are different.

12. heat pipe structure as claimed in claim 10, wherein second plate body are different from the thickness or size of first plate body.

13. heat pipe structure as claimed in claim 10, wherein first plate body and second plate body are in the side wall face of the chamber Adjacent place carry out heat welded or medium and engage to be formed at an edge sealing.

14. heat pipe structure as claimed in claim 13, the wherein heat welded are laser welding, Diffusion Welding, Supersonic wave soldering Connect or it is combined.

15. the engagement of heat pipe structure as claimed in claim 13, the wherein medium is hard solder, gluing or its any combination.

16. the engagement of heat pipe structure as claimed in claim 13, the wherein heat welded or the medium is lateral engagement pattern.

17. heat pipe structure as claimed in claim 10, wherein first plate body or second plate body and an external heat source are direct Contact.

18. heat pipe structure as claimed in claim 10, wherein also including an at least water injection path, the water injection path connects with the chamber It is logical.