CN107887374A - A kind of three-dimensional LED encapsulation modules and preparation method with loop filament - Google Patents

Abstract

The invention relates to a three-dimensional LED encapsulation module with an annular filament and a manufacturing method thereof. Specifically, a metal strip is punched into a plurality of units and connected together with two or more than two LED multiple annular filament support prototypes. , there is a metal connecting body between the inner ring and the ring of each unit for supporting or/and circuit connection, injection molding after electroplating, so that each ring is reinforced with plastic, and at the same time, the disconnected part of the ring circuit is connected with a plastic insulator Together, LED chips are packaged on each ring, and the LED chips are connected to the metal ring circuit by bonding wires, and the inner rings of the units are connected in series, or in parallel, or in series and parallel combinations, and then multiple units are connected in the The same LED filament packaging module is split into a single unit, and then a plurality of rings in the unit are pulled apart along the axial direction to make a three-dimensional LED packaging module with a ring-shaped filament. The filament packaging module of the present invention Good heat conduction and heat dissipation, uniform and beautiful multi-faceted light.

Description

A three-dimensional LED packaging module with annular filament and its manufacturing method

technical field

The invention and the LED application field specifically relate to a three-dimensional LED packaging module with a ring-shaped filament and a manufacturing method thereof.

Background technique

Traditional LED filament light bulbs are assembled by welding one by one straight rod-type filament strips. The welding efficiency is low, and the straight rods lack the beauty of curves. There have been companies that used spiral-structured metal packages and then pulled them into three-dimensional shapes. The welding wire of the package will break when it is pulled apart, but it has not been successful. How to directly make the LED filament into an integrated three-dimensional module to improve assembly efficiency, and there are many curved lines with good shape has become a constant in the industry. Problems to overcome.

In order to overcome the above problems, a three-dimensional LED packaging module with annular filament and its manufacturing method of the present invention adopt multi-ring interconnected annular filament metal brackets, and adopt injection molding reinforcement in the area where the chip is packaged, so that the module is packaged in the package. When it is pulled apart into a three-dimensional shape after completion, the position of the chip will not be deformed, ensuring that the package bonding wire will not be stretched and broken, and the integrated three-dimensional curve is beautiful in appearance, forming any series and parallel packages in any number of ways inside, and the external power supply There are few electrode connection points, the assembly in the bulb is simple, and the efficiency is high.

Contents of the invention

The invention relates to a three-dimensional LED encapsulation module with an annular filament and a manufacturing method thereof. Specifically, a metal strip is punched into a plurality of units and connected together with two or more than two LED multi-annular filament support prototypes. , there is a metal connector between the inner ring and the ring of each unit for supporting or/and circuit connection, injection molding after electroplating, so that each ring is reinforced with plastic, and at the same time, the disconnected part of the ring circuit is connected with a plastic insulator Together, LED chips are packaged on each ring, and the LED chips are connected to the metal ring circuit by bonding wires, and the inner rings of the units are connected in series, or in parallel, or in series and parallel combinations, and then multiple units are connected in the The same LED filament packaging module is split into individual units, and then a plurality of rings in the unit are pulled apart along the axial direction to make a three-dimensional LED packaging module with a ring-shaped filament. The filament packaging module of the present invention Good heat conduction and heat dissipation, uniform and beautiful multi-faceted light.

According to the present invention, there is provided a method for manufacturing a three-dimensional LED packaging module with annular filaments, comprising: punching a metal strip into an annular bracket containing at least one unit, including two or more rings of different sizes , each ring has a disconnected opening, and there is a metal connecting body between the inner ring and the ring of each unit for supporting or/and circuit connection, and the metal connecting body can be provided with a disconnecting opening according to the needs of the circuit design; or Die the metal strip into an annular bracket containing at least one unit. The middle of each unit bracket is a metal sheet, and the outer ring is one or more rings of different sizes. The middle metal sheet and each ring of the outer ring are There are disconnected openings. There is a metal connector between the metal sheet and the ring in each unit and the ring and the ring for support or/and circuit connection. The metal connector can be provided with a disconnected opening according to the needs of the circuit design. , injection molding after electroplating, or electroplating after injection molding, the injection-molded plastic insulator reinforces each ring, or/and metal sheet into a more rigid and non-deformable structure, and at the same time disconnects each ring, or/and metal sheet The place is firmly fixed and insulated and integrated, cut into a single piece of LED ring bracket containing at least one unit with a mold, and encapsulates LED chips on each ring, or/and metal sheet, or on each ring, or/and metal Both the chip and the metal connector are packaged with LED chips, and the LED chips are connected to the metal circuit by bonding wires, and each ring of the unit, or/and the metal sheet form an integrated connection in series, parallel, or a series-parallel combination. Apply encapsulation glue on the front, or front and side, or front, side and back of the metal bracket around the chip, bake and cure, then disassemble the LED filament packaging module with multiple units connected together into individual units, and then put A plurality of rings, or \ and metal sheets in the unit are pulled apart along the axial direction to form a three-dimensional LED packaging module with a ring-shaped filament.

According to the present invention, there is also provided a method for manufacturing a three-dimensional LED encapsulation module with a ring-shaped filament, which includes: punching the metal strip into a ring-shaped bracket containing at least one unit, including two or more different sizes. Ring, each ring has a disconnected opening, and there is a metal connector between the inner ring and the ring of each unit for support or/and circuit connection. The metal connector can be provided with a disconnection according to the needs of the circuit design; Or the metal strip is punched into an annular bracket containing at least one unit with a die. The middle of each unit bracket is a metal sheet, and the outer ring is one or more rings of different sizes. The middle metal sheet and each ring of the outer ring There are disconnected openings on each unit. There is a metal connector between the metal sheet and the ring in each unit and the ring and the ring for support or/and circuit connection. The metal connector can be set to be disconnected according to the needs of the circuit design. After electroplating or before electroplating, a rigid insulator is pasted on each ring, or/and metal sheet to reinforce each ring, or/and metal sheet into a more rigid and non-deformable structure, while making each The disconnected part of the ring, or/and the metal sheet is firmly fixed and insulated and integrated, cut into a single piece of LED ring bracket containing at least one unit with a mold, and the LED chip is packaged on each ring, or/and metal sheet, or LED chips are packaged on each ring, or/and metal sheet and on the metal connector, and the LED chip is connected to the metal ring circuit by welding wires, and a series connection is formed between each ring, or/and metal sheet in the unit, or Integral connection of parallel or series-parallel hybrid combination, applying encapsulation glue on the front, or front and side, or front, side and back of the metal bracket around the chip, after baking and curing, and then connecting multiple LED units together The filament encapsulation module is divided into individual units, and then multiple rings or \ and metal sheets in the unit are pulled apart along the axial direction to make a three-dimensional LED encapsulation module with a ring-shaped filament.

According to the present invention, there is also provided a three-dimensional LED packaging module with an annular filament, comprising an annular support; a rigid insulator; an LED chip; a metal bonding wire; packaging glue; wherein the annular support contains two or more Rings of different sizes, each ring has a disconnected opening, and there is a metal connector between the inner ring and the ring of each unit for support or/and circuit connection. The metal connector can be set according to the needs of the circuit design Or the middle is a metal sheet, and the outer ring is one or more rings of different sizes. Each ring of the middle metal sheet and the outer ring has a broken opening. The metal sheet in each unit is connected to the Rings, and metal connectors for support or/and circuit connection between the rings, the metal connectors can be provided with openings according to the needs of circuit design; the rigid insulator is in each ring, or/ The rigid insulation reinforcement body formed by injection molding on the metal sheet, or the rigid insulation reinforcement body formed by pasting a rigid insulator on each ring, or/and metal sheet, makes each ring, or/and metal sheet reinforcement become more Rigid and non-deformable structure, at the same time, each ring, or/and metal sheet is firmly fixed and insulated and integrated; the LED chip is packaged on each ring, or/and metal sheet, or packaged On each ring, or/and metal sheet and metal connector, the LED chip is connected to the metal circuit of the ring support through the metal bonding wire, forming a series connection, or a parallel connection, or a series-parallel connection Combined circuit connection; the packaging glue is set on the front, or front and side, or front, side and back of the metal bracket around the chip, and multiple rings, or \ and metal sheets are pulled apart along the axial direction to form a A three-dimensional LED encapsulation module with a ring-shaped filament.

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with a ring-shaped filament is characterized in that there are at least two or more electrode connection points for an external power supply on the LED ring support .

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with a ring-shaped filament is characterized in that the insulator is opaque or transparent.

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with a ring-shaped filament is characterized in that the packaging glue contains fluorescent powder packaging glue.

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with annular filament is characterized in that the LED annular support is on each ring, or/and metal sheet, or on Each ring, or/and the metal sheet and the metal connecting body are provided with edges of a battlement-like structure to form a ring-shaped LED bracket with a battlement-like structure.

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with ring-shaped filament is characterized in that the LED ring-shaped support with long battlement-like structure is to package LED chips on the long battlements.

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with a ring-shaped filament is characterized in that the shape of the long battlements is approximately square, or polygonal, or approximately arc-shaped.

According to a preferred embodiment of the present invention, the above-mentioned three-dimensional LED packaging module with a ring-shaped filament is characterized in that the long battlement is narrowed at the root of the battlement, forming a nearly bottleneck-shaped battlement root, After packaging, the light emitted by the chip on the long battlement is guided from the edge of more directions to the back with the help of glue.

According to a preferred embodiment of the present invention, the three-dimensional LED packaging module with a ring-shaped filament is characterized in that the three-dimensional LED packaging module with a ring-shaped filament is used to make LED bulbs, or candle bulbs, Or opposite sex bulbs.

The details of one or more embodiments of the invention are set forth in the following description of the accompanying drawings and the detailed description.

Description of drawings

The features, objects and advantages of the present invention will become more apparent by reading this specification in conjunction with the following drawings, a brief description of which follows.

Figure 1 is a schematic plan view of a ring-shaped stent prototype connected with multiple units punched out of metal strips

Fig. 2 is a schematic plan view of a prototype of a single-unit annular stent.

Fig. 3 is a schematic plan view of the ring stent after injection molding of the ring stent prototype of a single unit and strengthening.

Fig. 4 is a schematic cross-sectional view of "Fig. 3".

Fig. 5 is a schematic perspective view of "Fig. 3".

Fig. 6 is a schematic plan view of a ring-shaped support with pre-severed connection points removed for support of a single unit.

FIG. 7 is a schematic plan view after bonding wires on the ring support.

Fig. 8 is a schematic cross-sectional view of "Fig. 7".

FIG. 9 is a schematic plan view of a circular filament LED packaging module dripped with packaging glue.

Fig. 10 is a schematic cross-sectional view of "Fig. 9".

FIG. 11 is a perspective schematic diagram of a three-dimensional LED packaging module with a ring-shaped filament.

Detailed ways

The present invention will be described in detail below by taking preferred embodiments as examples.

However, those skilled in the art should understand that the following descriptions are only examples and descriptions of some preferred implementations, and do not have any limitations on the claims of the present invention.

Use a 0.4mm thick metal strip, and use a die to punch out the unnecessary part of the metal on the Hongrui bracket punching machine, and process it into three rings (1.1) and (1.2) with long battlements (1.5) of different sizes. ), (1.3), and at the same time according to the needs of the design circuit, punch out the disconnected opening (1.4) on the ring (1.1), (1.2), (1.3), and the ring (1.1) and the ring (1.2) There are two metal connectors (1.6a) for support and circuit connection between them, and there are two metal connectors for support and circuit connection between the ring (1.2) and the ring (1.3) (1.6b), the electrode connection points (1.8) of two external power sources on the inner circle of the ring (1.3), all punch out the plastic mosaic hole (1.10) that injection molding is used on each ring, also have The pre-break connection point (1.9) used as a connection support, the pre-break connection point (1.9) connects multiple units together, and then connects them together on the frame (1.7) to make a prototype of the LED ring bracket (as shown in Figure 1) .

Explanation: Figure 2 shows the prototype of the LED ring bracket of a single unit. The processes of die bonding, wire bonding, and packaging glue in the subsequent production process are all made on the continuous ring bracket with multiple units connected together, but for the sake of illustration To be clearer, it is expressed in the diagram of a single unit ring bracket, which is hereby explained.

Then carry out electroplating silver surface treatment at the positions where welding wires and LED chips are required to emit light and reflect light in the subsequent order, and then use injection molds on the rings (1.1), (1.2), (1.3) of the ring bracket (1) on the Nissei injection molding machine ), the structural sides of the long battlements (1.5) are exposed on each ring, and the injection-molded plastic insulator (2) is embedded in the inlay hole (1.10) on each ring, so that each ring is covered with a plastic insulator (2) Reinforcement becomes a more rigid and non-deformable structure, and at the same time, the disconnection of each ring is firmly fixed and insulated into one (as shown in Figure 3, Figure 4, and Figure 5), and then on Hongrui's cutting foot punch Use a mold to punch out the pre-broken connection point (1.9) used as a connection support to make an LED ring bracket (as shown in Figure 6).

On the Youguang DB382 crystal bonder, the LED chips (3) are respectively bonded on the Great Battlements (1.5) of the three rings (1.1), (1.2), (1.3), baked and solidified, and then soldered by ASM-AB350 The wire machine uses a metal bonding wire (4) to connect the chip and the chip and between the chip and the metal circuit to form a circuit of 54 series and 2 parallels (as shown in Figures 7 and 8). Use a glue dispenser to apply glue (5) on the front of the ring bracket that is close to which side of the long battlement (1.5) has the inherent LED chip (3) on each ring, and hang it on the side of the long battlement (1.5) at the same time, bake After curing, apply the packaging glue (5) containing fluorescent powder on the back of the ring bracket on the side of each ring near the battlement (1.5) with a dispenser, and hang it on the side of the battlement (1.5) at the same time, Bake and solidify, and use a mold to cut off the frame (1.7) to make a single unit LED packaging module with a ring-shaped filament (as shown in Figures 9 and 10).

The single-unit LED package module with ring-shaped filament is pulled apart along the axial direction to produce a three-dimensional LED package module with ring-shaped filament (as shown in FIG. 11 ).

The present invention has been described in detail above with reference to the accompanying drawings for a specific embodiment of a three-dimensional LED packaging module with a ring-shaped filament and its manufacturing method. However, those skilled in the art should understand that the above descriptions are only examples and descriptions of some specific implementations, and do not limit the scope of the present invention, especially the scope of the claims.

Claims (11)

1. a kind of preparation method of the three-dimensional LED encapsulation modules with loop filament, including：

Metal tape is punched into ring support at least containing a unit with mould, containing two or more different big Small ring, there is the disconnection mouth of disconnection on each ring, support or/and circuit connection function are acted as per having between unit inner ring and ring Metal connector, metal connector need settable disconnection mouth according to circuit design；

Or metal tape is punched into ring support at least containing a unit with mould, it is metal among each unit rack Piece, outer ring are one or more multiple different size of rings, have disconnection on each ring of intermediate metal film and outer ring Mouth is disconnected, is connected per there is the metal for acting as support or/and circuit connection function between unit inner metal sheets and ring, and ring and ring Body, metal connector according to circuit design need it is settable disconnect mouth, be molded after plating or electroplated after injection, injection Plastic insulation, which reinforces each ring or/and sheet metal, becomes more rigid and on-deformable structure, at the same make each ring, Or/and the gap of sheet metal is fixedly secured and insulated and is connected, the monolithic at least containing a unit is cut into mould LED ring supports, the packaging LED chips or be in each ring or/and sheet metal and gold on each ring or/and sheet metal All packaging LED chips, LED chips are connected on metallic circuit by bonding wire on category connector, each ring of unit or/and metal The integrally connected of series connection or the combination of in parallel or serial-parallel mirror is formed between piece, applies metal branch of the encapsulation glue in chip circumference Frame front or front and side or front, the side and back side, after baking-curing, then link together multiple units LED filament encapsulation module split into individual unit, then multiple rings in unit or and sheet metal axially Pull open, be fabricated to a kind of three-dimensional LED encapsulation modules with loop filament.

2. a kind of preparation method of the three-dimensional LED encapsulation modules with loop filament, including：

Metal tape is punched into ring support at least containing a unit with mould, containing two or more different big Small ring, there is the disconnection mouth of disconnection on each ring, support or/and circuit connection function are acted as per having between unit inner ring and ring Metal connector, metal connector need settable disconnection mouth according to circuit design；

Or metal tape is punched into ring support at least containing a unit with mould, it is metal among each unit rack Piece, outer ring are one or more multiple different size of rings, have disconnection on each ring of intermediate metal film and outer ring Mouth is disconnected, is connected per there is the metal for acting as support or/and circuit connection function between unit inner metal sheets and ring, and ring and ring Body, metal connector according to circuit design need it is settable disconnect mouth, after plating or before being plating, in each ring or/and Sheet metal pastes rigid insulator, and each ring or/and sheet metal are reinforced and become more rigid and on-deformable structure, Make the gap of each ring or/and sheet metal be fixedly secured and insulate simultaneously to be connected, cut into mould and at least contain one The single chip LED ring support of individual unit, on each ring or/and sheet metal packaging LED chips or be each ring or/ With all packaging LED chips, LED chip are connected on metal loop circuit by bonding wire on sheet metal and on metal connector, unit Interior each integrally connected that series connection or the combination of in parallel or serial-parallel mirror are formed between ring or/and sheet metal, applies encapsulation glue At the metallic support front of chip circumference or front and side or front, the side and back side, after baking-curing, then The LED filament encapsulation module that multiple units link together splits into individual unit, then multiple rings in unit or and Sheet metal axially pulls open, and is fabricated to a kind of three-dimensional LED encapsulation modules with loop filament.

3. a kind of three-dimensional LED encapsulation modules with loop filament, including

Ring support；

Rigid insulator；

LED chip；

Metal wire；

Encapsulate glue；Wherein

Described ring support is the disconnection mouth for having on each ring containing two or more different size of rings disconnection, The metal connector for acting as support or/and circuit connection function per having between unit inner ring and ring, metal connector is according to circuit Design needs settable disconnection mouth；Or centre is sheet metal, outer ring is one or more multiple different size of rings, in Between have the disconnection mouth of disconnection on sheet metal and each ring of outer ring, per having between unit inner metal sheets and ring, and ring and ring The metal connector of support or/and circuit connection function is acted as, metal connector needs settable disconnection mouth according to circuit design；

Described rigid insulator be molded on each ring or/and sheet metal formation rigid insulation reinforcing body or That the rigid insulation reinforcing body that rigid insulator is formed is pasted on each ring or/and sheet metal, by each ring or/and Sheet metal, which is reinforced, becomes more rigid and on-deformable structure, while makes the gap of each ring or/and sheet metal firmly solid Determine and insulate to be connected；

Described LED chip be encapsulated on each ring or/and sheet metal or be packaged in each ring or/and sheet metal and On metal connector, LED chip is solder-connected to by described metal wire on the metallic circuit of described ring support, shape Into series connection or the circuit connection of in parallel or serial-parallel mirror combination；

Described encapsulation glue be arranged on chip circumference metallic support front or front and side or front, side and The back side, multiple ring ,Huo Zhe and sheet metal are axially pulled open, and form a kind of three-dimensional LED Encapsulation Moulds with loop filament Group.

A kind of 4. three-dimensional LED encapsulation modules with loop filament according to claim 1 or 2 or 3, it is characterised in that There are the electrode connection points of at least two or more than two external power supplys on described LED ring supports.

A kind of 5. three-dimensional LED encapsulation modules with loop filament according to claim 1 or 2 or 3, it is characterised in that Described insulator is lighttight or is printing opacity.

A kind of 6. three-dimensional LED encapsulation modules with loop filament according to claim 1 or 2 or 3, it is characterised in that Described encapsulation glue is containing fluorescent powder packaging glue.

A kind of 7. three-dimensional LED encapsulation modules with loop filament according to claim 1 or 2 or 3, it is characterised in that Described LED ring supports are on each ring or/and sheet metal or are in each ring or/and sheet metal and metal company It is arranged to the side of long battlement shape structure on junctor, forms the LED ring supports of long battlement shape structure.

A kind of 8. three-dimensional LED encapsulation modules with loop filament according to claim 7, it is characterised in that described length The LED ring supports of battlement shape structure, it is that LED chip is encapsulated on long battlement.

A kind of 9. three-dimensional LED encapsulation modules with loop filament according to claim 7, it is characterised in that described length The shape of battlement is squarish or polygon or generally radiused.

10. a kind of three-dimensional LED encapsulation modules with loop filament according to claim 7, it is characterised in that described Long battlement, zoomed in the root of pile, form the pile root of approximate bottleneck shape, the light for sending the chip after encapsulation on long battlement, From the edge in more directions under glue help leaded light to the back side.

11. a kind of three-dimensional LED encapsulation modules with loop filament according to any one of the claims 1-10, it is special Sign is that the three-dimensional LED encapsulation modules with loop filament are used to make LED ball bubble or candle bulb or different in nature lamp Bubble.