CN107859882A - Light fixture - Google Patents

Abstract

A lamp includes a semiconductor light-emitting component, a bearing part and a covering part. The carrier carries the semiconductor light-emitting component, the covering part covers the semiconductor light-emitting component and the carrier, and has a first lens covering the semiconductor light-emitting component, wherein the covering part is an integrally formed structure, and the light emitted by the semiconductor light-emitting component passes through the first lens. For the lens, the present invention utilizes integral molding to form a structure in which the covering part wraps the semiconductor light-emitting component and the carrier, so there is no problem of component falling off due to degumming. In addition, the covering part covers the semiconductor light-emitting component and the carrier The structure can also achieve a fairly good waterproof effect.

Description

lamps

technical field

The invention relates to a lamp, in particular to a lamp using a semiconductor light-emitting component.

Background technique

The main body of existing projection lamps is mostly made of glass, and the inner surface of the main body is coated with a reflective aluminum layer to reflect light. Such a structure is not only not environmentally friendly but also has a poor heat dissipation effect, thus affecting the service life of the lamp. In addition, most of the existing projection lamps use glass lenses, and the lenses are bonded to the main body with glue. During use, the components will fall off due to degumming, which will cause safety problems.

Contents of the invention

The object of the present invention is to provide a lamp, which encapsulates the light source and the electronic components related to the light source by integrally forming the covering part. Since such a structure does not use adhesive bonding, there will be no degumming to cause components The problem of falling off, and the overall encapsulation structure can have a waterproof effect on the light source and electronic components. At the same time, lenses and heat dissipation holes are formed on the encapsulation, which can produce the desired light pattern and solve the problem of heat dissipation. In addition, the plastic Another lens is formed on the main body made of aluminum alloy, which can improve the optical effect again, so there is no need to coat the inner surface of the main body with a reflective aluminum layer, so that the product is more in line with the requirements of environmental protection.

An embodiment of the lamp provided by the present invention includes a semiconductor light-emitting component, a bearing part and a covering part. The carrier part carries the semiconductor light-emitting component, and the cladding part covers the semiconductor light-emitting component and the carrier and has a first lens, wherein the cladding part covers the semiconductor light-emitting component and the carrier, and has a first lens covering the semiconductor light-emitting component , wherein the covering part is an integrally formed structure. The present invention uses an integrally formed method to form a structure in which the covering part covers the semiconductor light-emitting component and the supporting part, so there will be no existing lamps that may be degummed due to adhesive bonding. In addition, the structure of the covering member covering the semiconductor light-emitting component and the carrier can also achieve a fairly good waterproof effect, and the light emitted by the semiconductor light-emitting component will pass through the first lens to emit light, which can generate The desired light pattern.

In another embodiment, the covering part has a top, and a recess is formed on the top, and the first lens is disposed in the recess and is located above the semiconductor light emitting component.

In another embodiment, the material of the covering part includes silica gel, and the silica gel structure can achieve the effect of waterproofing. In addition, the thickness of the silica gel structure has an influence on the color temperature of the light, so it can be formed according to the requirements to obtain the desired thickness. Light color temperature.

In another embodiment, the carrier includes a circuit board, that is, the electronic components related to the semiconductor light emitting component can be encapsulated in the encapsulating component together with the semiconductor light emitting component.

In another embodiment, the carrier includes a plurality of terminals extending from the circuit board to the exterior of the enclosure.

In another embodiment, the semiconductor light emitting component includes at least one light emitting diode.

In another embodiment, the covering part has at least one heat dissipation hole, and the heat dissipation hole is formed on the outer peripheral wall of the covering part, and the position of the heat dissipation hole corresponds to the semiconductor light-emitting component, so that the heat generated by the semiconductor light-emitting component can pass through the heat dissipation hole Dissipate to the outside to achieve the effect of heat dissipation.

In another embodiment, the covering part has at least one groove, and the groove is formed on the peripheral wall of the covering part and corresponds to the bearing part.

In another embodiment, the lamp further includes a lampshade, and the lampshade is combined with the covering member, and the light emitted by the semiconductor light-emitting component sequentially passes through the first lens and the lampshade to irradiate to the outside.

In another embodiment, the lampshade is sleeved on the outer peripheral wall of the covering member.

In another embodiment, the covering part further includes a flange formed on the peripheral wall of the covering part. When the lampshade is sleeved on the peripheral wall of the covering part, the bottom edge of the lampshade abuts against the flange.

In another embodiment, the lampshade includes a second lens and a reflective surface, the second lens covers the first lens and the reflective surface surrounds the second lens and the semiconductor light-emitting component, and the light emitted by the semiconductor light-emitting component passes through the first lens and the semiconductor light-emitting component in sequence. The second lens emits light, and part of the light is reflected by the reflective surface to emit light. Because the lampshade has the second lens, the optical effect can be improved again, so there is no need to coat the reflective surface of the lampshade with aluminum film, which can be more in line with the environmental protection standard.

In another embodiment, the reflective surface is a conical surface.

In another embodiment, the material of the shade includes plastic.

The lamp of the present invention uses an integrally formed covering to cover the semiconductor light-emitting component and the carrier, so there is no problem in the prior art that adhesive bonding causes components to fall off due to degumming. In addition, the integrally formed covering The structure covering the semiconductor light-emitting component and the carrier can also achieve a fairly good waterproof effect. In addition, in one embodiment, because the lampshade has a second lens, the optical effect can be improved again, so there is no need to coat the reflective surface of the lampshade The aluminum film makes the lamp of the present invention more environmentally friendly.

The above description is only an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention, it can be implemented according to the contents of the description, and in order to make the above and other purposes, features and advantages of the present invention more obvious and understandable , the following preferred embodiments are specifically cited, and in conjunction with the accompanying drawings, the detailed description is as follows.

Description of drawings

FIG. 1 is an exploded perspective view of an embodiment of the lamp of the present invention.

FIG. 2 is a cross-sectional view of the embodiment of the lamp in FIG. 1 after assembly.

Fig. 3 is a three-dimensional exploded view of another embodiment of the lamp of the present invention.

FIG. 4 is a cross-sectional view of the embodiment of the lamp in FIG. 3 after assembly.

Detailed ways

Please refer to Fig. 1 and Fig. 2, which represent an embodiment of the lamp of the present invention. The lamp 100 of the present invention includes a semiconductor light emitting component 110 , a carrier 120 and a covering 130 . The carrier 120 carries the semiconductor light emitting component 110, the covering part 130 covers the semiconductor light emitting component 110 and the carrier 120 and has a first lens 132 covering the semiconductor light emitting component 110, wherein the covering part 130 is an integrally formed structure, and the semiconductor light emitting The light emitted by the component 110 passes through the first lens 132 . In this embodiment, the covering member 130 has a top 134 , and a recess 136 is formed on the top 134 , and the first lens 132 is disposed in the recess 136 and located above the semiconductor light emitting device 110 .

In this embodiment, the covering member 130 can integrally encapsulate the semiconductor light emitting component 110 and the carrier 120 by embedding and injecting, that is, the semiconductor light emitting component 110 and the carrier 120 are first assembled and then embedded in the mold. , and use special clips to fix both sides of the semiconductor light-emitting component 110, so that the embedded semiconductor light-emitting component 110 and the carrier 120 will not be skewed during the injection of plastic, and then the plastic is injected into the mold and wrapped Covering the semiconductor light-emitting component 110 and the carrier 120 placed in the mold in advance, after the plastic is cooled and shaped, a structure in which the covering member 130 covers the semiconductor light-emitting component 110 and the carrier 120 as a whole is formed. In addition, in this implementation, the plastic of the covering member 130 is, for example, silicone rubber. In this embodiment, the covering member 130 is formed by using low-temperature runner forming technology, for example. Due to the high thermal expansion coefficient of silica gel, it will expand when heated and only slightly shrink when cooled. It is difficult to precisely control the size of the finished product. However, the use of low-temperature runner forming technology can keep the silica gel at a lower temperature and maintain its fluidity. To precisely control the size of the finished product.

In this embodiment, the semiconductor light emitting element 110 includes at least one semiconductor light emitting element, such as a light emitting diode, an organic light emitting diode, a laser diode or other semiconductor light emitting elements. When there are multiple semiconductor light emitting components, they can be arranged into an array of semiconductor light emitting components. The following will take the use of light emitting diodes as an example for description. The carrier 120 includes a circuit board, the circuit board carries the light emitting diodes, and the light emitting diodes are electrically connected to the circuit board, and the circuit board also carries electronic components related to the semiconductor light emitting device 110 . In addition, the carrier 120, for example, further includes a plurality of terminals 122, these terminals 122 are electrically connected to the circuit board and extend from the circuit board to the outside of the cover 130, in this embodiment, the carrier 120 includes two terminals 122, which The two terminals 122 can be connected to an external power source, so that the external power source supplies power to the carrier 120 and the semiconductor light emitting component 110 . In addition, it is worth noting that using silica gel as the material of the covering part 130 will change the color temperature of the emitted light, which is called "color temperature drift". The main reason is that the thickness of the covering part 130 made of silica gel will affect the color temperature of the emitted light. Color temperature changes. Taking a light-emitting diode that uses blue light to excite yellow phosphor to mix white light as an example, when the thickness of the covering member 130 is relatively thin, the color temperature drift of the emitted light will fall within ±500K. The reason is that the covering member 130 covers the semiconductor light-emitting component 110 Finally, the position of the total reflection interface of the blue light emitted by the blue light-emitting diode chip will change, so that the blue light of the light will increase, resulting in the decrease of the blue light of total reflection, thus reducing the generation of yellow light, that is, the blue light of the light will become more and the yellow light will become less. Furthermore, the color temperature is changed, so the color temperature of the emitted light can be controlled by changing the thickness of the covering member 130 .

The covering part 130 has at least one heat dissipation hole 138, which is formed on the outer peripheral wall 135 of the covering part 130, and the position of the heat dissipation hole 138 corresponds to the semiconductor light emitting device 110, so that the heat generated by the semiconductor light emitting device 110 can be dissipated The holes 138 dissipate to the outside to achieve the effect of heat dissipation. In this embodiment, two cooling holes 138 are formed on the outer peripheral wall 135 of the covering member 130 and are located at opposite positions of the outer peripheral wall 135 , but it is not limited thereto, and one or more than two cooling holes can also be provided.

In this embodiment, the covering member 130 further has at least one groove 137, the groove 137 is formed on the outer peripheral wall 135 of the covering member 130 and corresponds to the bearing member 120, the function of the groove 137 is mainly to fix the lamp 100 in the lamp holder.

In this implementation, the lamp 100 may further include a lampshade 140 , which is combined with the covering member 130 , and the light emitted by the semiconductor light-emitting component 110 is irradiated to the outside through the first lens 132 and the lampshade 140 in sequence. The lampshade 140 is sleeved on the outer peripheral wall 135 of the covering member 130, and in this embodiment, the covering member 130 further includes a flange 139, and the flange 139 is also formed on the outer peripheral wall 135 of the covering member 130, when the lampshade 110 sets When disposed on the outer peripheral wall 135 of the covering part 130 , the bottom edge 142 of the lampshade 140 abuts against the flange 139 , thereby positioning the lampshade 140 on the covering part 130 . The lampshade 140 includes a second lens 144 and a reflective surface 146. The second lens 144 covers the first lens 132 and the reflective surface 146 surrounds the second lens 144. The light emitted by the semiconductor light emitting component 110 passes through the first lens 132 and the second lens 144 in sequence. The light is emitted, and part of the light is reflected by the reflective surface 146 to emit light. In this embodiment, the lampshade 140 is in the shape of a truncated cone and can be made of plastic material, and has a first opening 141 and a second opening 143. The first opening 141 and the second opening 143 are formed on opposite two ends of the lampshade 140. The second opening 143 extends toward the interior of the lampshade 140 to form a boss 145. The interior of the boss 145 is hollow and forms a depression 147. The depression 147 is sleeved on the outer peripheral wall 135 of the covering member 130 and coated with glue. wall surface of the recessed portion 147 , so that the lampshade 140 can be fixed on the outer peripheral wall 135 of the covering member 130 . The top of the boss 145 forms the second lens 144 . The reflective surface 146 is the inner peripheral surface of the lampshade 140 and extends from the bottom edge of the boss 145 to the first opening 141, so the reflective surface 146 is a conical surface. In this embodiment, a reticular pattern ( For example, notches) can make the light reflected by the reflective surface 146 more uniform. The light emitted by the semiconductor light emitting element 110 passes through the first lens 132 and the second lens 144 and then emerges, and part of the emitted light is reflected by the reflective surface 146 so that the overall light becomes a desired light pattern.

Please refer to Fig. 3 and Fig. 4, which represent another embodiment of the lamp of the present invention. In the lamp 100' of this embodiment, except for the first lens 132' and the second lens 144', other structures and components are the same as those shown in Figures 1 and 2, so the same components give the same symbol and omit its description. In this embodiment, the curvature of the first lens 132' is larger than that of the first lens 132 of the embodiment shown in Figures 1 and 2, and the curvature of the second lens 144' is also larger than that of the embodiment shown in Figures 1 and 2. The first lens 132 of the present embodiment is larger, so that the lamp of this embodiment can produce different light patterns from the lamps and lanterns of the embodiment shown in Fig. 1 and Fig. In the embodiment shown in 2, the thickness of the first lens 132 is large. As mentioned above, the thickness of the silica gel will affect the color temperature of the emitted light, so the color temperature of the emitted light will also be different.

In the lamp of the present invention, by encapsulating the semiconductor light-emitting component 110 and the carrier 120 integrally with the covering member 130, there is no need to use glue to combine the light source and the main body as in the prior art, which can prevent the problem of degumming and causing the components to fall off. The one-piece encapsulation structure of the invention can also achieve the effect of waterproof and moisture-proof, and further increase the life of the lamp. In addition, because the second lens 144 is formed in the lampshade 140 of the lamp of the present invention, it can produce a secondary optical effect on the outgoing light, so it does not need The reflective surface 146 is coated with an aluminum layer, so the lamp of the present invention is more environmentally friendly than the lamps of the prior art.

The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Anyone familiar with this field Those skilled in the art, without departing from the scope of the technical solution of the present invention, may use the method and technical content disclosed above to make some changes or modify equivalent embodiments with equivalent changes, but if they do not depart from the content of the technical solution of the present invention, Any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention still fall within the scope of the technical solution of the present invention.

Claims (14)

1. A kind of 1. light fixture, it is characterised in that including：

   Semiconductor luminous assembly；

   Bearing part, carry the semiconductor luminous assembly；And

   Coating member, the semiconductor luminous assembly and the bearing part are coated, and with the covering semiconductor luminous assembly The first lens, wherein the structure that the coating member is one of the forming.
2. 2. light fixture as claimed in claim 1, it is characterised in that the coating member has top, and recess is formed at the top, First lens are located in the recess, and positioned at the top of the semiconductor luminous assembly.
3. 3. light fixture as claimed in claim 1, it is characterised in that the material of the coating member includes silica gel.
4. 4. light fixture as claimed in claim 1, it is characterised in that the bearing part includes circuit board.
5. 5. light fixture as claimed in claim 4, it is characterised in that the bearing part further includes more several terminals, and the terminal is certainly The circuit board extends to the outside of the coating member.
6. 6. light fixture as claimed in claim 1, it is characterised in that the semiconductor luminous assembly includes an at least light-emitting diodes Pipe.
7. 7. light fixture as claimed in claim 1, it is characterised in that the coating member has an at least heat emission hole, and described at least one Heat emission hole is formed at the periphery wall of the coating member, and the position correspondence of an at least heat emission hole is in the semiconductor light emitting group Part.
8. 8. light fixture as claimed in claim 1, it is characterised in that the coating member has an at least groove, and described at least one is recessed Groove is formed at the periphery wall of the coating member and corresponds to the bearing part.
9. 9. light fixture as claimed in claim 1, it is characterised in that the light fixture further includes lampshade, is incorporated into the coating member, and Cover first lens of the semiconductor luminous assembly.
10. 10. light fixture as claimed in claim 9, it is characterised in that the coating member has top, is formed at the top recessed Portion, first lens are located in the recess, and are sheathed on institute positioned at the top of the semiconductor luminous assembly, the lampshade State the periphery wall at top.
11. 11. light fixture as claimed in claim 10, it is characterised in that the coating member further includes bead, and the bead is formed at The periphery wall of the coating member, when the lampshade is sheathed on the periphery wall at the top, the bottom of the lampshade Edge is connected to the bead.
12. 12. light fixture as claimed in claim 9, it is characterised in that the lampshade includes the second lens and reflecting surface, and described Two lens cover first lens and the reflecting surface is around second lens and the semiconductor luminous assembly.
13. 13. light fixture as claimed in claim 12, it is characterised in that the reflecting surface is circular conical surface.
14. 14. light fixture as claimed in claim 9, it is characterised in that the material of the lampshade includes plastics.