CN107851210B - Method for mounting an electronic component in a portable data carrier - Google Patents
Method for mounting an electronic component in a portable data carrier Download PDFInfo
- Publication number
- CN107851210B CN107851210B CN201680040964.6A CN201680040964A CN107851210B CN 107851210 B CN107851210 B CN 107851210B CN 201680040964 A CN201680040964 A CN 201680040964A CN 107851210 B CN107851210 B CN 107851210B
- Authority
- CN
- China
- Prior art keywords
- data carrier
- component
- recess
- electronic component
- stamping die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0718—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being of the biometric kind, e.g. fingerprint sensors
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Automation & Control Theory (AREA)
- Credit Cards Or The Like (AREA)
Abstract
The invention relates to a method for mounting an electronic component 6 in a portable data carrier 2, said component 6 being characterized in that a recess 4 is provided in the surface of the data carrier 2. An adhesive is provided in the recess 4 in order to permanently connect the component 6 to be embedded in the recess 4 with the data carrier 2. Electrically conductive connections are arranged on the contacts of the component 6 and/or on the contacts in the recess 4 of the data carrier 2 in order to electrically conductively connect the contacts of the component 6 with the contacts of the data carrier 2. Finally, the component 6 is inserted and pressed into the recess 4 by means of the hot stamping die 8, so that the component 6 is permanently connected to the data carrier 2. The component 6 is pressed so far into the data carrier 2 that a depression 12 is formed in the data carrier 2 by the data carrier 2 being melted by the hot stamping die 8. The surface of the electronic component 6 and the portion 10 of the recess 12 form a plane.
Description
The invention relates to a method for mounting an electronic component in a portable data carrier, such as a chip card, an identification card, a social security card, a driver's license, a credit card or a medical security card.
The person skilled in the art is often faced with the technical problem of mounting electronic components, such as fingerprint sensors, chemical sensors, keyboards, screens, light-emitting diodes, etc., in a portable data carrier such that the surface of the electronic component and the surface of the portable data carrier form a plane and can thus be reached from the outside.
However, it is not always possible to mount the electronic components during the manufacture of the portable data carrier, but it is often necessary to implement them afterwards, since the electronic components are damaged, for example, during the manufacture of the data carrier due to the pressure and temperature during the film lamination for the manufacture of the data carrier.
If the electronic component is mounted in the portable data carrier in such a way that the surface of the electronic component protrudes beyond the surface of the data carrier, this may lead to damage of the electronic component when the electronic component comes into contact with other objects when the portable data carrier is used. Here, it is sufficient for the electronic component to be damaged continuously when it protrudes only slightly beyond the surface of the data carrier.
In the opposite case, if the electronic component surface is arranged below the data carrier surface, it is determined by the step between the electronic component surface and the portable data carrier surface that the electronic component, for example a fingerprint sensor, may malfunction, since at least a part of the finger is on the step at least in the edge region of the sensor and not on the sensor.
The technical problem underlying the present invention is therefore to provide a solution to the above-mentioned problems.
The object of the invention is achieved by the independent claims. Advantageous embodiments are described in the dependent claims.
In order to solve the technical problem, the invention discloses a method for mounting an electronic component in a portable data carrier, the method being characterized in that,
-providing a recess in a surface of the data carrier,
-providing an adhesive into the recess in order to permanently connect the component to be embedded in the recess with the data carrier,
-arranging electrically conductive connections on contacts of the member and/or contacts in a recess of the data carrier for electrically conductively connecting contacts of the member with contacts of the data carrier,
-embedding and pressing the component into the recess by means of a hot stamping die, so that the component is permanently connected with the data carrier.
Advantageously, the electronic component can be mounted in the data carrier by the method according to the invention in such a way that the surface of the electronic component and the surface of the portable data carrier surrounding the surface of the electronic component form a plane, so that damage to the electronic component, for example by catching on other objects, is avoided. Furthermore, since there are no steps that may at least negatively affect the function as in the prior art, a good and correct function of the electronic component, e.g. a fingerprint sensor, may be ensured.
An advantageous embodiment is to use a hot stamping die having a larger diameter than the component. The electronic component is advantageously pressed into the portable data carrier in such a way that the surface of the electronic component and the surface of the portable data carrier surrounding the surface of the electronic component form a plane within the diameter of the hot stamping die.
A further advantageous embodiment is that the hot stamping die presses the component into the data carrier to such an extent that a depression is produced in the data carrier, wherein the externally accessible surface of the component is located below the surface of the data carrier, wherein the surface of the component and the flat surface surrounding the component in the immediate surroundings of the electronic component form a plane. Advantageously, the electronic component is arranged in the recess in a protected and undamaged manner.
A further advantageous embodiment is the use of a hot stamping die, the edges of which are rounded or beveled. Advantageously, the rounded or beveled edges of the hot stamping die make it possible, if, for example, a fingerprint sensor is used as the electronic component, for the finger to move in a movement starting from the surface of the data carrier past the beveled or rounded sides onto the sensor, so that the sensor can pick up the fingerprint completely and correctly without the finger having to traverse steps or edges which may have a negative effect on the function of the sensor.
A further advantageous embodiment is that the component is mounted after or during the manufacture of the data carrier. This allows greater flexibility in the use of the method, since with the method according to the invention, for example, portable data carriers known in the art can be equipped with electronic components, for example fingerprint sensors, in order to achieve greater security in banking financial transactions.
A further advantageous embodiment is the use of a sensor for capturing a fingerprint as the electronic component. A sensor for collecting a fingerprint is only one possible solution for the electronic component. Alternatively, for example, chemical sensors, keyboards, screens, light-emitting diodes or any other suitable electronic components can also be used.
A further advantageous embodiment is that a recess is milled into the data carrier surface. For milling, mechanical milling methods or lasers can be used. Instead of a milling method, any other suitable method may be used in order to produce the recess.
A further advantageous embodiment is the use of a heat-activated (hitzeaktivevierbarer) adhesive in order to permanently or firmly attach the component to the data carrier. A heat-activated adhesive has the advantage that it can be activated by the heat of a hot stamping die. Alternatively, adhesives that are not activated by heat may be used.
Advantageous embodiments of the invention are described below.
Fig. 1 to 3 show a first embodiment of the invention for mounting electronic components in a portable data carrier with a hot stamping die having beveled edges.
Fig. 4 to 6 show a second embodiment of the invention for mounting an electronic component in a portable data carrier with a hot stamping die having rounded edges.
Fig. 7 to 11 show a third embodiment of how provision is made for mounting electronic components in a laminating method for manufacturing a portable data carrier by preforming certain portions of the recesses.
Fig. 12 to 16 show a fourth embodiment of how provision is made for mounting electronic components in a lamination process for manufacturing a portable data carrier by completely preforming the recesses.
Fig. 17 to 22 show a fifth embodiment, how an electronic component can be mounted in a portable data carrier afterwards, wherein special protection of the design of the enclosing member is taken care of.
Fig. 1 to 3 show a first exemplary embodiment of the invention for mounting an electronic component 6 in a portable data carrier 2 with a hot stamping die 8, a so-called hot stamp or insert die (insert die), which here has beveled edges. For this purpose, with reference to fig. 1, in a first step, recesses 4 are produced, for example milled, at desired locations in the data carrier 2. An adhesive is then arranged in the recess 6 in order to permanently connect the electronic component 6 to be placed with the data carrier 2. Alternatively, the adhesive may also be arranged on the electronic component 6. The adhesive may be a heat activated adhesive or any other suitable adhesive. Furthermore, it is advantageous that electrically conductive connections are arranged on the contacts of the electronic component 6 and on the contacts in the recess 4 in order to establish a good electrically conductive connection between the contacts of the component 6 and the contacts in the recess 4 of the data carrier 2. The component 6 is pressed into the recess 4 of the data carrier 2 with the hot stamping die 8, wherein the component 6 is pressed into the data carrier 2 so deeply that the data carrier 2 melts and a depression 12 having the geometry of the hot stamping die 8 is produced in the data carrier 2. Referring to fig. 2, in this embodiment, the hot stamping die 8 has chamfered edges. It is essential to the invention that the diameter of the hot stamping die 8 is greater than the diameter of the electronic component 6, in order to form a flat surface with at least a part of the depression 12, i.e. with the immediate surroundings 10, of the surface of the electronic component 6. The finished data carrier 2 can be seen in fig. 3, in which the surface of the electronic component 6 and the immediate surroundings 10 in the recess 12 form a flat surface. If for example a fingerprint sensor is used as the electronic component 6, the finger can start on the surface of the data carrier 2 in a continuous movement without having to traverse for example disturbing steps past the slope of the depression 12 and the plane formed by the direct surroundings 10 and the surface of the sensor 6, and the fingerprint can thus be read undisturbed.
Fig. 4 to 6 show a second embodiment of the invention for mounting an electronic component in a portable data carrier with a hot stamping die having rounded edges. All other method steps or technical features correspond to the method steps or features already described in fig. 1 to 3.
Fig. 7 to 11 show a third embodiment of how provision is made for mounting the electronic component 6 in a lamination process for manufacturing the portable data carrier 2 by preforming certain portions of the final recesses 12. The data carrier 2 is produced by a lamination process in which the data carrier 2 is laminated between two laminating plates 14 and 16 by means of pressure and heat, i.e. a plurality of film layers lying one on top of the other are permanently connected to one another by means of pressure and heat, so that the data carrier 2 is produced. The laminate 14 here has a structure 18 in order to partially produce the depressions in the data carrier 2 or to prepare and pre-form the depressions. In fig. 8 a data carrier 2 is shown after lamination with a prepared or pre-formed recess 20. The preformed recess 20 differs essentially from the final recess 12 in that the preformed recess 20 is not arranged as deep in the data carrier 2 as the final recess 12. Subsequently, the recess 4 is produced, for example milled, and the electronic component 6 is pressed into the data carrier 2 by means of a hot stamping die 8. Then, the hot stamping die 8 produces the final shape of the depression 12. Here, a flush fit of the electronic component 6 in the data carrier 2 is achieved. The advantage of first producing the pre-formed depression 20 and finally producing the final shape of the depression 12 is that possible designs on the data carrier can be handled more protectively than if the depression 12 were constructed solely with the hot stamping die 8.
Fig. 12 to 16 show a fourth embodiment of how provision is made for mounting the electronic component 6 in a lamination process for manufacturing the portable data carrier 2 by completely shaping the final recess 12. The fourth embodiment differs from the third embodiment only in that a structural part 22 having the geometry for producing the final shape of the recess 12 in the data carrier 2 is constructed on the laminate 14, as would otherwise be produced by the geometry of the hot stamping die 8.
Fig. 17 to 22 show a fifth embodiment, here showing how the electronic component 6 is installed in the portable data carrier 2 afterwards, wherein special protection of the design is taken care of. Before the film is laminated for the production of the data carrier 2, a separating layer 24 is arranged in the region and at depth of the future recesses 12. The separating layer 24 is, for example, a lacquer layer which is applied, for example, by screen printing. Below the separating layer 24, for example, a design print can be arranged, which can be seen from the outside in the future depressions 12. After lamination of the film layers for producing the data carrier 2, the separation lines 26 are milled in the edge regions of the future recesses 12. At this point, the membrane layer located on the separation layer 24 is no longer held and can be removed simply, for example by a blowing brush, see in particular fig. 19. The resulting surface of the separation layer 24 is flat. In the case of a transparent separating layer 24, the design arranged below the separating layer 24 is visible from the outside. Subsequently, as described above, the recess 4 is provided, for example milled, into the data carrier 2. All other method steps correspond to the steps described above. The electronic component 6 is pressed into the data carrier 2 by means of the hot stamping die 8, so that the surface of the electronic component 6 and the release layer 24 in the immediate surroundings 10 form a flat surface.
List of reference numerals
Portable data carriers, e.g. chip cards, credit cards, driver's licenses, insurance cards, identity cards
4 concave part
6 electronic component
8 hot stamping die
10 flat face in the immediate periphery of an electronic component
12 depression according to the invention in a data carrier, formed by pressing in a hot stamping die
14 laminate with a structural part for producing a portable data carrier
16 laminate without structural parts for producing a portable data carrier
18 on the laminate 14 for partially manufacturing or preparing recesses in the data carrier
20 recess partially preformed by a laminate structure
22 on the laminate 14 in order to completely manufacture the recesses in the data carrier
24 release layer, for example release agent, arranged in the region of the electronic component to be subsequently mounted
26 separation line milled in the edge region of a future recess
Claims (6)
1. A method for mounting an electronic component (6) in a portable data carrier (2),
before laminating the film for producing the data carrier (2), a separating layer (24) is arranged in the region and at the depth of the recess (12),
after the lamination of the film layers for producing the data carrier (2), a separation line (26) is milled in the edge region of the recess (12) to be formed,
Removing the membrane layer located on the separation layer (24),
providing a recess (4) in the surface of the data carrier (2) in a region where a film layer located on the separation layer (24) is removed,
-providing an adhesive into the recess (4) in order to permanently connect a component (6) to be embedded in the recess (4) with the data carrier (2),
arranging electrically conductive connections on contacts of the component (6) and/or contacts in the recess (4) of the data carrier (2) in order to electrically conductively connect contacts of the component (6) with contacts of the data carrier (2),
the component (6) is inserted and pressed into the recess (4) by means of a hot stamping die (8) in such a way that the component (6) is permanently connected to the data carrier (2), wherein the hot stamping die (8) is used, the hot stamping die (8) having a larger diameter than the component (6) and the edges of the hot stamping die (8) being rounded or beveled.
2. A method as claimed in claim 1, characterized in that the hot stamping die (8) presses the component (6) into the data carrier (2) to such an extent that the depression (12) is produced in the data carrier (2),
wherein the externally accessible surface of the component (6) is located below the surface of the data carrier (2),
Wherein the surface of the component (6) forms a plane with a flat surface (10) in the immediate surroundings of the electronic component (6) surrounding the component (6).
3. Method according to one of the preceding claims, characterized in that the component (6) is mounted after the manufacture of the data carrier (2) or during the manufacture of the data carrier (2).
4. Method according to claim 1 or 2, characterized in that a sensor for taking a fingerprint is used as the electronic component (6).
5. A method as claimed in claim 1 or 2, characterized in that the recess (4) is milled into the surface of the data carrier (2).
6. A method as claimed in claim 1 or 2, characterized in that a heat-activated adhesive is used in order to permanently connect the component (6) to the data carrier (2).
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102015009042.9A DE102015009042A1 (en) | 2015-07-13 | 2015-07-13 | Method for installing an electronic component in a portable data carrier |
| DE102015009042.9 | 2015-07-13 | ||
| PCT/EP2016/001203 WO2017008904A1 (en) | 2015-07-13 | 2016-07-12 | Method for installing an electronic component in a portable data carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107851210A CN107851210A (en) | 2018-03-27 |
| CN107851210B true CN107851210B (en) | 2021-09-28 |
Family
ID=56413614
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680040964.6A Active CN107851210B (en) | 2015-07-13 | 2016-07-12 | Method for mounting an electronic component in a portable data carrier |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3323088A1 (en) |
| CN (1) | CN107851210B (en) |
| DE (1) | DE102015009042A1 (en) |
| WO (1) | WO2017008904A1 (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1201542A (en) * | 1995-08-01 | 1998-12-09 | 奥地利塑料卡及证件系统股份有限公司 | Data carrier with component-bearing module and coil, and process for fabricating such data carrier |
| JP2007044893A (en) * | 2005-08-08 | 2007-02-22 | Dainippon Printing Co Ltd | Manufacturing method of ic card and implement for temporary adhesion |
| CN101730624A (en) * | 2007-06-22 | 2010-06-09 | 爱克发-格法特公司 | Smart information carrier and production process therefor |
| CN103218650A (en) * | 2013-02-05 | 2013-07-24 | 珠海市金邦达保密卡有限公司 | Contact type IC card provided with display module and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19621044A1 (en) * | 1996-05-24 | 1997-11-27 | Giesecke & Devrient Gmbh | Method for producing a card-shaped data carrier |
| DE19921231A1 (en) * | 1999-05-07 | 2000-11-09 | Giesecke & Devrient Gmbh | Fingerprint sensor for chip card identification has sensor segments supported by elastically compressible support pad for allowing detection of full fingerprint |
| DE102008053368A1 (en) * | 2008-10-27 | 2010-04-29 | Giesecke & Devrient Gmbh | Method of making a portable data carrier and portable data carrier |
-
2015
- 2015-07-13 DE DE102015009042.9A patent/DE102015009042A1/en active Pending
-
2016
- 2016-07-12 EP EP16739024.4A patent/EP3323088A1/en not_active Ceased
- 2016-07-12 CN CN201680040964.6A patent/CN107851210B/en active Active
- 2016-07-12 WO PCT/EP2016/001203 patent/WO2017008904A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1201542A (en) * | 1995-08-01 | 1998-12-09 | 奥地利塑料卡及证件系统股份有限公司 | Data carrier with component-bearing module and coil, and process for fabricating such data carrier |
| JP2007044893A (en) * | 2005-08-08 | 2007-02-22 | Dainippon Printing Co Ltd | Manufacturing method of ic card and implement for temporary adhesion |
| CN101730624A (en) * | 2007-06-22 | 2010-06-09 | 爱克发-格法特公司 | Smart information carrier and production process therefor |
| CN103218650A (en) * | 2013-02-05 | 2013-07-24 | 珠海市金邦达保密卡有限公司 | Contact type IC card provided with display module and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3323088A1 (en) | 2018-05-23 |
| CN107851210A (en) | 2018-03-27 |
| WO2017008904A1 (en) | 2017-01-19 |
| DE102015009042A1 (en) | 2017-01-19 |
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