CN107846781A - A kind of preparation method of ultra-thin circuit board easy to break - Google Patents
A kind of preparation method of ultra-thin circuit board easy to break Download PDFInfo
- Publication number
- CN107846781A CN107846781A CN201711182804.8A CN201711182804A CN107846781A CN 107846781 A CN107846781 A CN 107846781A CN 201711182804 A CN201711182804 A CN 201711182804A CN 107846781 A CN107846781 A CN 107846781A
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- China
- Prior art keywords
- circuit board
- board substrate
- wad cutter
- faces
- ultra
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Links
- 241001391944 Commicarpus scandens Species 0.000 title claims abstract description 33
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- 238000003475 lamination Methods 0.000 claims abstract description 15
- 239000000758 substrate Substances 0.000 claims description 92
- 238000003825 pressing Methods 0.000 claims description 20
- 238000005530 etching Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 238000004080 punching Methods 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a kind of preparation method of ultra-thin circuit board easy to break, the preparation method includes step S1, sawing sheet baking sheet；Step S2, one time prepared by line layer；It is prepared by step S3, wad cutter figure；Step S4, circuit layer lamination；Step S5, secondary line layer make.The present invention prepares circuit by circuit board double and improves the toughness of ultra-thin circuit board easy to break, and reduces caused aid cost in manufacturing process, reduces production cost and improves the quality yield of ultra-thin circuit board easy to break.
Description
Technical field
The present invention relates to circuit board technology field, in particular to a kind of preparation method of ultra-thin circuit board easy to break.
Background technology
The making of ultra-thin circuit board easy to break is mainly added using tool holder and increasing auxiliary side two ways in the prior art
Work manufactures.Using frock clamp, cost of manufacture and manufacture difficulty are added, and needs the quantity according to fixture true in manufacturing process
Determine batch output, be unfavorable for the making of the ultra-thin circuit board easy to break of high-volume., then will be in plate by the way of auxiliary side is increased
Technique edges windowing is handled, and windowing is formed on the inside of the outward flange of sheet material, by the protection copper of the graph area of plate and the guarantor in edges of boards area
Shield copper separates, and edges of boards locality protection copper is larger, causes the waste of plate, cost.Ultra-thin circuit easy to break is in conventional machining work
The flow such as mistake high-pressure washing all easily causes folded plate and scrapped in sequence, causes yields low.
The content of the invention
It is an object of the invention to provide a kind of preparation method of ultra-thin circuit board easy to break, circuit is prepared by circuit board double
The toughness of ultra-thin circuit board easy to break is improved, and reduces caused aid cost in manufacturing process, reduces production cost simultaneously
Improve the quality yield of ultra-thin circuit board easy to break.
The present invention can be achieved through the following technical solutions：
The invention discloses a kind of preparation method of ultra-thin circuit board easy to break, the preparation method step are as follows：
Step S1, sawing sheet baking sheet：According to the big cabinet plate of product specification and toast, produce circuit board substrate；The circuit board substrate
The internal stress of substrate can be eliminated after overbaking, internal stress effect can be avoided to cause substrate to occur in subsequently lamination process
Cross large-scale harmomegathus；
Step S2, one time line layer makes：The circuit board substrate is divided into circuit board substrate A faces and circuit board substrate B faces, described
The surface circuit etching layer in circuit board substrate A faces, the surface in the circuit board substrate B faces prepare resist layer；One side makees line first
Road floor avoid etching after circuit board substrate it is too thin, cover amount of copper it is too small cause circuit board substrate easily produce bending and fracture wind
Danger；The contraposition target position figure that does according further to circuit board substrate A faces aligns etched circuit board substrate B faces figure, improves electricity
Road plate substrate A faces and circuit board substrate B face the Aligning degree of bit pattern；
It is prepared by step S3, wad cutter figure：The circuit board substrate A faces make pressing wad cutter figure and contraposition wad cutter figure；It is described
Pressing wad cutter figure made by circuit board substrate A faces avoids occurring circuit in bonding processes for the wad cutter of circuit surface pressing alignment
The situation of face skew, it is aligned additionally by contraposition wad cutter lifting circuit board substrate A faces and circuit board substrate B in face of bit pattern
Degree；
Step S4, circuit layer lamination：Circuit board substrate A upper threads road surface is pressed together, after pressing, step is gone out with wad cutter machine
Rapid line layer of S3 makes done contraposition wad cutter and pressing wad cutter；Wad cutter and pressure are aligned so as to be formed by the punching press of wad cutter machine
Wad cutter is closed, can ensure to align wad cutter using impact style punching and pressing wad cutter shape is complete, and not interfere with what is etched
Circuit；
Step S5, secondary line layer make：The contraposition wad cutter gone out according to step S4 laminations, the harmomegathus of measuring circuit plate substrate,
Circuit board substrate B faces line pattern is produced according to the contraposition wad cutter.Aligned by aligning wad cutter, ensure circuit board substrate A
Face line pattern and the alignment of circuit board substrate B upper threads road pattern height, figure is inclined when avoiding circuit board substrate B face circuit etchings
Move.
Further, the number of contraposition wad cutter figure prepared by the step S3 is at least 4.Align the quantity root of target position
Set according to the number of plies of line layer, ensure each sandwich circuit layer energy accurate contraposition.
Yet further, before the step S4 goes out the contraposition wad cutter and pressing wad cutter with wad cutter machine, in the circuit
Hardboard on plate substrate underlay.Because circuit board substrate is too thin, easily cause electricity if hardboard is not padded directly with wad cutter machine punching
Road plate substrate cracking, pressure when hardboard can effectively buffer wad cutter machine punching on pad, protection circuit plate substrate.
Yet further, the hardboard thickness is more than 1.0mm.The hardboard thickness, which is less than 1.0mm, can not then play effectively
Cushioning effect.
A kind of preparation method of ultra-thin circuit board easy to break of the present invention, has following beneficial effect：
Firstth, the toughness of ultra-thin circuit board easy to break is improved.The present invention is by respectively to circuit board substrate A faces and circuit board substrate B
Face carries out internal layer circuit making, and the resist layer in circuit board substrate B faces is synchronously done in the circuit surface in etched circuit board substrate A faces,
The line in circuit board substrate B faces is produced after being laminated by a circuit further according to the contraposition wad cutter that circuit board substrate A faces are reserved
Lu Tu, so as to improve the toughness of ultra-thin circuit board easy to break.
Secondth, caused aid cost in manufacturing process is reduced.The traditional diamond-making technique of ultra-thin circuit board easy to break
It is to need frock clamp to fix, adds cost of manufacture and manufacture difficulty, and will be according to the amount of fixture come really in fabrication
Determine the condition of production, be unfavorable for the making of the ultra-thin circuit board easy to break of high-volume, the interior layer line in the first processing circuit board substrate A faces of the present invention
Road, after the internal layer circuit in stacked wiring board substrate A faces, the toughness of ultra-thin circuit board easy to break is improved so as to realize that to improve purse easy to break
Circuit board processability, and by setting contraposition wad cutter to align the internal layer in processing circuit board substrate B faces in circuit board substrate A faces
Circuit, internal layer circuit processing contraposition accuracy is improved, is processed again without auxiliary mould instrument protection circuit plate, so as to reduce system
Caused aid cost during work.
3rd, reduce production cost and improve the quality yield of ultra-thin circuit board easy to break.Traditional diamond-making technique increases circuit
The auxiliary side of plate substrate, on the inside of circuit board substrate outward flange formed windowing, by the protection copper of the graph area of circuit board substrate with
The protection copper in edges of boards area separates, and edges of boards locality protection copper is big, causes waste of material, and production cost improves.The present invention is by twice
Internal layer circuit makes, and improves the toughness of ultra-thin circuit board easy to break, improves ultra-thin circuit board processability easy to break, without setting
Aid in side, being not easy situations such as disconnected plate, folded plate occur in process, reducing the loss of material, improve the quality yield of product,
So as to reduce production cost.
Embodiment
In order that those skilled in the art will better understand the technical solution of the present invention, with reference to embodiment to this hair
Bright product is described in further detail.
Embodiment 1
A kind of making of ultra-thin circuit board easy to break, its making step are as follows：
Step S1, sawing sheet baking sheet：Toasted 40 minutes with 120 DEG C according to the big cabinet plate of product specification, produce circuit board substrate；
Step S2, one time line layer makes：The circuit board substrate is divided into circuit board substrate A faces and circuit board substrate B faces, described
The surface circuit etching layer in circuit board substrate A faces, the surface in the circuit board substrate B faces prepare resist layer；
It is prepared by step S3, wad cutter figure：The circuit board substrate A faces make pressing wad cutter figure and contraposition wad cutter figure, according to
The number of plies of lamination needed for circuit board substrate A faces is 4 layers, and 8 contraposition wad cutter figures are made in circuit board substrate A faces；
Step S4, circuit layer lamination：Circuit board substrate A upper threads road surface is pressed together, after pressing under circuit board substrate
Thickness is 2mm hardboard on pad, and contraposition wad cutter and pressing wad cutter are gone out with wad cutter machine；
Step S5, secondary line layer make：The contraposition wad cutter gone out according to step S4 laminations, the harmomegathus of measuring circuit plate substrate,
Circuit board substrate B faces line pattern is produced according to the contraposition wad cutter.
Subsequent step is conventional processing steps, produces ultra-thin circuit board easy to break.
Embodiment 2
A kind of making of ultra-thin circuit board easy to break, its making step are as follows：
Step S1, sawing sheet baking sheet：Toasted 60 minutes with 110 DEG C according to the big cabinet plate of product specification, produce circuit board substrate；
Step S2, one time line layer makes：The circuit board substrate is divided into circuit board substrate A faces and circuit board substrate B faces, described
The surface circuit etching layer in circuit board substrate A faces, the surface in the circuit board substrate B faces prepare resist layer；
It is prepared by step S3, wad cutter figure：The circuit board substrate A faces make pressing wad cutter figure and contraposition wad cutter figure, according to
The number of plies of lamination needed for circuit board substrate A faces is 6 layers, and 12 contraposition wad cutter figures are made in circuit board substrate A faces；
Step S4, circuit layer lamination：Circuit board substrate A upper threads road surface is pressed together, after pressing under circuit board substrate
Thickness is 1mm hardboard on pad, and contraposition wad cutter and pressing wad cutter are gone out with wad cutter machine；
Step S5, secondary line layer make：The contraposition wad cutter gone out according to step S4 laminations, the harmomegathus of measuring circuit plate substrate,
Circuit board substrate B faces line pattern is produced according to the contraposition wad cutter.
Subsequent step is conventional processing steps, produces ultra-thin circuit board easy to break.
Embodiment 3
A kind of making of ultra-thin circuit board easy to break, its making step are as follows：
Step S1, sawing sheet baking sheet：Toasted 40 minutes with 130 DEG C according to the big cabinet plate of product specification, produce circuit board substrate；
Step S2, one time line layer makes：The circuit board substrate is divided into circuit board substrate A faces and circuit board substrate B faces, described
The surface circuit etching layer in circuit board substrate A faces, the surface in the circuit board substrate B faces prepare resist layer；
It is prepared by step S3, wad cutter figure：The circuit board substrate A faces make pressing wad cutter figure and contraposition wad cutter figure, according to
The number of plies of lamination needed for circuit board substrate A faces is 2 layers, and 4 contraposition wad cutter figures are made in circuit board substrate A faces；
Step S4, circuit layer lamination：Circuit board substrate A upper threads road surface is pressed together, after pressing under circuit board substrate
Thickness is 3mm hardboard on pad, and contraposition wad cutter and pressing wad cutter are gone out with wad cutter machine；
Step S5, secondary line layer make：The contraposition wad cutter gone out according to step S4 laminations, the harmomegathus of measuring circuit plate substrate,
Circuit board substrate B faces line pattern is produced according to the contraposition wad cutter.
Subsequent step is conventional processing steps, produces ultra-thin circuit board easy to break.
The foregoing is only a preferred embodiment of the present invention, not makees any formal limitation to the present invention；It is all
The those of ordinary skill of the industry can by specification and described above and swimmingly implement the present invention；But all to be familiar with sheet special
The technical staff of industry without departing from the scope of the present invention, makes a little using disclosed above technology contents
Perhaps the equivalent variations of variation, modification and evolution, it is the equivalent embodiment of the present invention；Meanwhile all substantive skills according to the present invention
Variation, modification and evolution of any equivalent variations that art is made to above example etc., still fall within technical scheme
Protection domain within.
Claims (4)
- A kind of 1. preparation method of ultra-thin circuit board easy to break, it is characterised in that：The preparation method step is as follows：Step S1, sawing sheet baking sheet：According to the big cabinet plate of product specification and toast, produce circuit board substrate；Step S2, one time line layer makes：The circuit board substrate is divided into circuit board substrate A faces and circuit board substrate B faces, described The surface circuit etching layer in circuit board substrate A faces, the surface in the circuit board substrate B faces prepare resist layer；It is prepared by step S3, wad cutter figure：The circuit board substrate A faces make pressing wad cutter figure and contraposition wad cutter figure；Step S4, circuit layer lamination：Circuit board substrate A upper threads road surface is pressed together, after pressing, step is gone out with wad cutter machine Line layer of S3 makes done contraposition wad cutter and pressing wad cutter；Step S5, secondary line layer make：The contraposition wad cutter gone out according to step S4 laminations, the harmomegathus of measuring circuit plate substrate, Circuit board substrate B faces line pattern is produced according to the contraposition wad cutter.
- A kind of 2. preparation method of ultra-thin circuit board easy to break according to claim 1, it is characterised in that：The step S3 systems The number of standby contraposition wad cutter figure is at least 4.
- A kind of 3. preparation method of ultra-thin circuit board easy to break according to claim 1, it is characterised in that：The step S4 is used Before wad cutter machine goes out the contraposition wad cutter and pressing wad cutter, the hardboard on the circuit board substrate underlay.
- A kind of 4. preparation method of ultra-thin circuit board easy to break according to claim 3, it is characterised in that：The hardboard thickness More than 1.0mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182804.8A CN107846781B (en) | 2017-11-23 | 2017-11-23 | Manufacturing method of ultrathin easy-to-break circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711182804.8A CN107846781B (en) | 2017-11-23 | 2017-11-23 | Manufacturing method of ultrathin easy-to-break circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107846781A true CN107846781A (en) | 2018-03-27 |
| CN107846781B CN107846781B (en) | 2020-09-25 |
Family
ID=61679967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711182804.8A Active CN107846781B (en) | 2017-11-23 | 2017-11-23 | Manufacturing method of ultrathin easy-to-break circuit board |
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| Country | Link |
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| CN (1) | CN107846781B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080088883A (en) * | 2007-03-30 | 2008-10-06 | 주식회사 뉴프렉스 | Formation method of embedded capacitor of flexible printed circuit board |
| CN102170745A (en) * | 2010-02-26 | 2011-08-31 | 日本特殊陶业株式会社 | Multilayered wiring board and method of manufacturing the same |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | The method of embedding capacitors in PCB multilayer board |
| CN103140050A (en) * | 2011-12-05 | 2013-06-05 | 深南电路有限公司 | Machining method of burying capacitance circuit board |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
-
2017
- 2017-11-23 CN CN201711182804.8A patent/CN107846781B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080088883A (en) * | 2007-03-30 | 2008-10-06 | 주식회사 뉴프렉스 | Formation method of embedded capacitor of flexible printed circuit board |
| CN102170745A (en) * | 2010-02-26 | 2011-08-31 | 日本特殊陶业株式会社 | Multilayered wiring board and method of manufacturing the same |
| CN103140050A (en) * | 2011-12-05 | 2013-06-05 | 深南电路有限公司 | Machining method of burying capacitance circuit board |
| CN102497749A (en) * | 2011-12-16 | 2012-06-13 | 东莞生益电子有限公司 | The method of embedding capacitors in PCB multilayer board |
| CN104349613A (en) * | 2013-08-08 | 2015-02-11 | 北大方正集团有限公司 | PCB (Printed Circuit Board) and manufacturing method thereof |
| CN104270889A (en) * | 2014-09-28 | 2015-01-07 | 广州兴森快捷电路科技有限公司 | Local high-precision printed circuit board and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107846781B (en) | 2020-09-25 |
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