CN107833849A - Lead frame and the method for connection sheet integration production in chip diode - Google Patents
Lead frame and the method for connection sheet integration production in chip diode Download PDFInfo
- Publication number
- CN107833849A CN107833849A CN201710977609.8A CN201710977609A CN107833849A CN 107833849 A CN107833849 A CN 107833849A CN 201710977609 A CN201710977609 A CN 201710977609A CN 107833849 A CN107833849 A CN 107833849A
- Authority
- CN
- China
- Prior art keywords
- connection sheet
- lead frame
- pin
- connecting portion
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
- H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
- H01L2224/40—Structure, shape, material or disposition of the strap connectors after the connecting process of an individual strap connector
- H01L2224/401—Disposition
- H01L2224/40151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/40221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/40245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8534—Bonding interfaces of the connector
- H01L2224/85345—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention discloses lead frame in a kind of chip diode and the method for connection sheet integration production,Wherein,The lead frame includes multipair pin set,Pin set described in each pair includes the first pin units and second pin unit being oppositely arranged,All pin sets are divided into several columns,In each row the connection sheet is provided with per between adjacent two couple pin set,Complete the punching press to the connection sheet simultaneously in the punching course that the lead frame is carried out to copper strips,The present invention integrates lead frame and matched connection sheet,So as to which in production, connection sheet carries out punching press with lead frame on same copper strips,Utilize the dead meal part in lead frame punching course,Complete the punching press to connection sheet,So as to greatly improve copper raw material utilization rate,Avoid the waste of raw material,The destruction to environment caused by decreasing copper strips production while directly lifting economic benefit.
Description
Technical field
The present invention relates to microelectronic component technical field, and in particular to lead frame and company in a kind of chip diode
The method of contact pin integration production.
Background technology
Lead frame is applied to chip diode encapsulation field, and it act as concentrating on single chip diode only
Together consequently facilitating follow-up each manufacturing procedure.
Existing SMA chip diodes structure is usually to be placed in using independent connection sheet on lead frame again by welding phase
Even, or using the pattern that two panels lead frame is stacked to welding, both the above product pattern it is required to enter using two copper strips
The punching press of row early stage, the production space shared by equipment is big, not only causes copper strips to waste, and production efficiency is relatively low.
The content of the invention
The present invention provides lead frame and the method for connection sheet integration production in a kind of chip diode.
To reach above-mentioned purpose, the technical solution adopted by the present invention is：Lead frame and company in a kind of chip diode
The method of contact pin integration production, wherein, the lead frame includes multipair pin set, and pin set described in each pair includes relative set
The first pin units and second pin unit put, it is characterised in that：All pin sets are divided into several columns, in each row
The connection sheet is provided with per between adjacent two couple pin set, in the punching course of the lead frame is carried out to copper strips
The punching press to the connection sheet is completed simultaneously.
Further, the lead frame is made up of longitudinally disposed multiple row frame set, and frame set includes described in each column
Along the first vertical frame and the second vertical frame of longitudinally opposed setting, the pin set is longitudinally spaced to be laid in first vertical frame and institute
State between the second vertical frame.
Further, the punching course comprises the following steps：
（1）Charging：Copper strips is fed；
（2）Punching press：Punching press is carried out to the copper strips, forms the lead frame and the connection sheet, the connection sheet with it is described
First vertical frame or second vertical frame in lead frame are connected；
（3）Punching：The connection sheet is cut, the connection sheet is separated with the lead frame, the connection got off will be cut
Piece is collected；
（4）Cut：The lead frame is cut to size up to specification.
Further, 672 pairs of pin sets are equipped with each lead frame after cutting.
Further, a connection sheet, the connection sheet and institute are equipped between every two adjacent pin sets
State the first pin units and the second pin unit is parallel.
Further, the first connecting portion and use that the connection sheet includes matching with the second pin unit
With the second connecting portion being connected with diode chip for backlight unit, bending part is provided between the first connecting portion and the second connecting portion,
The second connecting portion is higher than the first connecting portion, and the second connecting portion is provided with boss.
Further, the boss is circular or square protruding.
Further, first pin units include the first pin area for being connected with first vertical frame and with it is described
The supporting part that the free end of first pin area is integrally connected.
Further, the first Baltimore groove, first Baltimore groove are provided between first pin area and the supporting part
In be provided with least one through hole.
Further, the second pin unit include the second pin area that is connected with second vertical frame and with it is described
The 3rd connected connecting portion of the free end in second pin area, is provided with second between the second pin area and the 3rd connecting portion
Baltimore groove.
After above technical scheme, the present invention has the following advantages that compared with prior art：The present invention is by lead frame
Integrated with matched connection sheet, so that connection sheet is carried out with lead frame on same copper strips in production
Punching press, using the dead meal part in lead frame punching course, the punching press to connection sheet is completed, so as to greatly improve copper original
Expect utilization rate, avoid the waste of raw material, decreased while directly lifting economic benefit caused by copper strips produces
Destruction to environment.
Brief description of the drawings
Accompanying drawing 1 is that connection sheet is connected to the structural representation on lead frame in punching course of the present invention；
Accompanying drawing 2 is a kind of partial enlarged drawing of accompanying drawing 1；
Accompanying drawing 3 is another partial enlarged drawing of accompanying drawing 1；
Accompanying drawing 4 is the structural representation of lead frame in the present invention；
Accompanying drawing 5 is a kind of partial enlarged drawing of accompanying drawing 3；
Accompanying drawing 6 is another partial enlarged drawing of accompanying drawing 3；
Accompanying drawing 7 is the structural representation being installed on independent connection sheet on lead frame；
Accompanying drawing 8 is the sectional view in A-A directions in accompanying drawing 7.
Wherein, 1, lead frame；11st, the first vertical frame；12nd, the second vertical frame；13rd, the first pin units；131st, supporting part；
132nd, the first Baltimore groove；133rd, through hole；134th, the first pin area；14th, second pin unit；141st, the 3rd connecting portion；142nd,
Two Baltimore grooves；143rd, second pin area；15th, punching；2nd, connection sheet；21st, first connecting portion；22nd, second connecting portion；23rd, boss；
24th, bending part；3rd, diode chip for backlight unit.
Embodiment
Below in conjunction with the accompanying drawings and embodiment the invention will be further described.
As shown in Figures 1 to 8, by lead frame 1 and the side of the integration production of connection sheet 2 in a kind of chip diode
Method, wherein, lead frame 1 includes multipair pin set, and each pair pin set includes the first pin units 13 and second being oppositely arranged
Pin units 14, all pin sets are divided into several columns, in each row per two pairs of adjacent pin sets between be provided with connection sheet 2,
The punching press to connection sheet 2 can be completed simultaneously in the punching course for carrying out lead frame 1 to copper strips.
In the present embodiment, lead frame 1 is made up of longitudinally disposed multiple row frame set, and each column frame set is included along longitudinal direction
The first vertical frame 11 and the second vertical frame 12 being oppositely arranged, pin set is longitudinally spaced to be laid in the first vertical frame 11 and the second vertical frame 12
Between.It is provided with open-work between adjacent frame set, the shape of open-work is including but not limited to square, strip, circle and waist type.
It is the specific steps of punching course in the present embodiment below：
（1）Charging：Copper strips is fed；
（2）Punching press：Punching press is carried out to copper strips, forms lead frame 1 and connection sheet 2, connection sheet 2 and first in lead frame 1
The vertical frame 12 of vertical frame 11 or second is connected, and between the first pin units 13 and second pin unit 14 in each pair pin set, connects
Punching 15 is formed between the pin units 13 of piece 2 and first and second pin unit 14；
（3）Punching：Connection sheet 2 is cut, connection sheet 2 is separated with lead frame 1, the connection sheet 2 got off will be cut and received
Collection；And per between adjacent two pins group it is punching 15；
（4）Cut：Lead frame 1 is cut to size up to specification.
Above-mentioned steps（2）In, a connection sheet 2 is provided between every adjacent two pins group, connection sheet 2 and first is perpendicular
The one of frame 11 is connected, the two pins group parallel and adjacent with the first pin units 13 and second pin unit 14 of connection sheet 2
It is symmetrical relative to the connection sheet 2 being disposed there between, referring to accompanying drawing 1 to accompanying drawing 3.
It is of course also possible to which part connection sheet 2 is connected with the first vertical frame 11, remaining connection sheet 2 is connected with the second vertical frame 12.
In other examples, two and more than two connection sheets can also be set between every adjacent two pins group
2, the connection sheet 2 of part is connected with the one of the first vertical frame 11, and remaining connection sheet 2 is connected with the one of the second vertical frame 12, all
The arrangement mode of connection sheet 2 between two adjacent pin sets is mutually coordinated with the space of punching 15.
Preferably, by above-mentioned steps（4）Each lead frame 1 after cutting is made up of 28 row frame sets, each pair frame set
24 pairs of pin sets are provided with along longitudinal direction, are provided with 672 pairs of pin sets on lead frame 1 altogether, the unit intensity of pin set is high, referring specifically to
Accompanying drawing 4 is to accompanying drawing 6.
Lead frame 1 in the present embodiment, its second pin unit 14 include the second pin being connected with the second vertical frame 12
Area 143 and the 3rd connecting portion 141 being connected with the free end in second pin area 143, the connecting portion of second pin area 143 and the 3rd
The second Baltimore groove 142 is provided between 141.
The first connecting portion 21 and use that connection sheet 2 in the present embodiment includes matching with second pin unit 14
With the second connecting portion 22 being connected with diode chip for backlight unit 3, bending part 24 is provided between first connecting portion 21 and second connecting portion 22,
Second connecting portion 22 is higher than first connecting portion 21, controls angle of inclination and the height of bending part 24 so as to control second connecting portion 22
With the difference in height of first connecting portion 21, make the thickness of the difference in height matched diodes chip 3, second connecting portion 22 is provided with boss
23。
Boss 23 is preferably circular or square protruding.In other examples, projection can also use other shapes, often
Raised quantity in individual connection sheet 2 can also be multiple, and shape can be with identical or different used by different projections.
In the present embodiment, the first pin units 13 include the first pin area 134 for being connected with the first vertical frame 11 and with the
The connected supporting part 131 in the free end of one pin area 134, supporting part 131 is supporting diode chip for backlight unit 3.First pin area 134
The first Baltimore groove 132 is provided between supporting part 131, at least one through hole 133 is provided with the first Baltimore groove 132.
Each connection sheet 2 after cutting is installed in a pair of pins group can be by the first pin units 13 and second pin list
Member 14 is connected.
Connection sheet 2 is installed on structural representation on lead frame 1 as shown in Figure 7 and Figure 8, the first of connection sheet 2 connects
Socket part 21 is connected with the 3rd connecting portion 141 of second pin unit 14 by tin cream, and diode chip for backlight unit 3 is placed in the first pin units
On 13 supporting part 131, diode chip for backlight unit 3 is connected with supporting part 131 also by tin cream, by setting suitable second connection
Difference in height between portion 22 and first connecting portion 21, second connecting portion 22 is just overlapped on diode chip for backlight unit 3, pass through
Second connecting portion 22 is connected by tin cream with diode chip for backlight unit 3.
In the present embodiment by set in second connecting portion 22 boss 23 contribute in stove welding process connection sheet 2 with
The connection of diode chip for backlight unit 3, effectively prevents the off normal of connection sheet 2 and connection sheet 2 is deflected away from the weld zone of diode chip for backlight unit 3 causes product
Electrical property failure, so as to greatly improve yield.
Through hole 133 is set in the first Baltimore groove 132 it is possible to prevente effectively from encapsulating the problem of stomata is produced in injection moulding process,
Improve product reliability.
Lead frame 1 and matched connection sheet 2 are integrated on a copper strips by the present invention to be produced, and utilizes lead
Dead meal part in the punching course of framework 1, the punching press to connection sheet 2 is completed, connection sheet 2 is with lead frame 1 in same copper strips
Upper carry out punching press, improves copper raw material utilization rate, avoids the waste of raw material, also subtracts while directly lifting economic benefit
The destruction to environment caused by copper strips production is lacked.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that Spirit Essence is made, it should all be included within the scope of the present invention.
Claims (10)
1. lead frame and the method for connection sheet integration production in a kind of chip diode, wherein, the lead frame bag
Multipair pin set is included, pin set described in each pair includes the first pin units and second pin unit being oppositely arranged, and its feature exists
In：All pin sets are divided into several columns, and the connection is provided with per between adjacent two couple pin set in each row
Piece, complete the punching press to the connection sheet simultaneously in the punching course that the lead frame is carried out to copper strips.
2. lead frame and the method for connection sheet integration production in chip diode according to claim 1, it is special
Sign is：The lead frame is made up of longitudinally disposed multiple row frame set, and frame set described in each column is included along longitudinally opposed
The first vertical frame and the second vertical frame set, the pin set is longitudinally spaced to be laid in first vertical frame and second vertical frame
Between.
3. lead frame and the method for connection sheet integration production in chip diode according to claim 2, it is special
Sign is：The punching course comprises the following steps：
（1）Charging：Copper strips is fed；
（2）Punching press：Punching press is carried out to the copper strips, forms the lead frame and the connection sheet, the connection sheet with it is described
First vertical frame or second vertical frame in lead frame are connected；
（3）Punching：The connection sheet is cut, the connection sheet is separated with the lead frame, the connection got off will be cut
Piece is collected；
（4）Cut：The lead frame is cut to size up to specification.
4. lead frame and the method for connection sheet integration production in chip diode according to claim 3, it is special
Sign is：672 pairs of pin sets are equipped with each lead frame after cutting.
5. lead frame and the method for connection sheet integration production in chip diode according to claim 3, it is special
Sign is：The step（2）In, it is equipped with a connection sheet, the connection sheet between every two adjacent pin sets
It is parallel with first pin units and the second pin unit.
6. lead frame and the method for connection sheet integration production in chip diode according to claim 3, it is special
Sign is：The connection sheet include to the first connecting portion that matches with the second pin unit and to diode
The connected second connecting portion of chip, bending part is provided between the first connecting portion and the second connecting portion, described second connects
Socket part is higher than the first connecting portion, and the second connecting portion is provided with boss.
7. lead frame and the method for connection sheet integration production in chip diode according to claim 6, it is special
Sign is：The boss is circular or square protruding.
8. lead frame and the method for connection sheet integration production in chip diode according to claim 3, it is special
Sign is：First pin units include the first pin area for being connected with first vertical frame and with first pin area
The supporting part that is integrally connected of free end.
9. lead frame and the method for connection sheet integration production in chip diode according to claim 8, it is special
Sign is：The first Baltimore groove is provided between first pin area and the supporting part, is provided with least in first Baltimore groove
One through hole.
10. lead frame and the method for connection sheet integration production in chip diode according to claim 3, it is special
Sign is：The second pin unit include the second pin area that is connected with second vertical frame and with the second pin area
Connected the 3rd connecting portion in free end, the second Baltimore groove is provided between the second pin area and the 3rd connecting portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710977609.8A CN107833849A (en) | 2017-10-17 | 2017-10-17 | Lead frame and the method for connection sheet integration production in chip diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710977609.8A CN107833849A (en) | 2017-10-17 | 2017-10-17 | Lead frame and the method for connection sheet integration production in chip diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107833849A true CN107833849A (en) | 2018-03-23 |
Family
ID=61648529
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710977609.8A Withdrawn CN107833849A (en) | 2017-10-17 | 2017-10-17 | Lead frame and the method for connection sheet integration production in chip diode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107833849A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN113967692A (en) * | 2021-10-22 | 2022-01-25 | 吴江翔实模具有限公司 | Stamping manufacturing process of SMA-400 lead frame |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041448A (en) * | 1996-07-25 | 1998-02-13 | Toppan Printing Co Ltd | Lead frame |
| CN103187317B (en) * | 2011-12-31 | 2015-08-05 | 百容电子股份有限公司 | The assemble method of semiconductor element |
| CN205028896U (en) * | 2015-10-08 | 2016-02-10 | 亚昕科技股份有限公司 | Lead frame tape structure |
-
2017
- 2017-10-17 CN CN201710977609.8A patent/CN107833849A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1041448A (en) * | 1996-07-25 | 1998-02-13 | Toppan Printing Co Ltd | Lead frame |
| CN103187317B (en) * | 2011-12-31 | 2015-08-05 | 百容电子股份有限公司 | The assemble method of semiconductor element |
| CN205028896U (en) * | 2015-10-08 | 2016-02-10 | 亚昕科技股份有限公司 | Lead frame tape structure |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108637084A (en) * | 2018-05-09 | 2018-10-12 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN108637084B (en) * | 2018-05-09 | 2019-06-04 | 四川金湾电子有限责任公司 | A kind of processing technology of semiconductor lead frame |
| CN113967692A (en) * | 2021-10-22 | 2022-01-25 | 吴江翔实模具有限公司 | Stamping manufacturing process of SMA-400 lead frame |
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Application publication date: 20180323 |
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