CN107801343B - Board level assembled device - Google Patents
Board level assembled device Download PDFInfo
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- CN107801343B CN107801343B CN201710909048.8A CN201710909048A CN107801343B CN 107801343 B CN107801343 B CN 107801343B CN 201710909048 A CN201710909048 A CN 201710909048A CN 107801343 B CN107801343 B CN 107801343B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/046—Surface mounting
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
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Abstract
本发明实施例涉及电子技术领域，公开了一种板级组装器件。本发明中，板级组装器件包括：电路板、焊接在电路板上的封装器件，设置在封装器件与电路板之间的第一压电薄片以及设置在电路板表面的第二压电薄片，其中，第一压电薄片和第二压电薄片电连接，第二压电薄片用于根据振动时产生的电压驱动第一压电薄片产生用于抵消振动的形变。使得在电路板振动的时候，减少电路板的振动对封装器件的影响，增加板级组装器件在振动环境下的可靠性。
Embodiments of the present invention relate to the technical field of electronics, and disclose a board-level assembly device. In the present invention, the board-level assembly device includes: a circuit board, a package device welded on the circuit board, a first piezoelectric sheet disposed between the package device and the circuit board, and a second piezoelectric sheet disposed on the surface of the circuit board, Wherein, the first piezoelectric sheet and the second piezoelectric sheet are electrically connected, and the second piezoelectric sheet is used for driving the first piezoelectric sheet to generate deformation for canceling the vibration according to the voltage generated during vibration. When the circuit board vibrates, the influence of the vibration of the circuit board on the packaged device is reduced, and the reliability of the board-level assembly device in the vibration environment is increased.
Description
Technical Field
The embodiment of the invention relates to the technical field of electronics, in particular to a board-level assembled device.
Background
Microelectronic packaged devices are typically mounted to an external surface of a circuit board by a surface assembly process, and the connection of the device to the circuit board is typically in the form of a Ball Grid Array (BGA) or pins, with electrical and mechanical connections made by soldering. When board level assembled devices are subjected to strong periodic or random vibration loads during use, damage is likely to occur at the connection locations of the BGA, pins and circuit board, resulting in open circuit failure of the device. On the other hand, strong vibration also affects device operation performance.
To solve the problem caused by the influence of vibration on the device, people currently adopt various ways to reduce the influence of vibration as much as possible, for example: the method comprises the steps of filling glue between a device and a circuit board, connecting the device and the circuit board by using a spring or an elastomer, adding a damping device, adding an energy absorption structure or a vibration isolation gasket at a fixed position of the circuit board and the like.
The inventor finds that at least the following problems exist in the prior art: the underfill is a poor conductor, which is unfavorable for heat dissipation of the active device, and the thermal expansion rate of the underfill is greater than that of the device, thereby possibly causing additional thermal stress in the high-temperature process; in some harsh environments, such as high temperature, long time applications, the problem of glue aging occurs and the vibration protection is lost. The use of springs or elastomer connections between the device and the circuit board increases the device package size, is not conducive to high density packaging applications, and can lose protection over time due to aging of the elastomer. The damping device is added, so that the structure becomes very complicated, the cost is high, and the application in microelectronic devices is not facilitated, and the application range is not wide. The mode of adding the energy absorption structure or the vibration isolation gasket at the fixed position of the circuit board is used, the energy absorption structure is complex, and the requirement of some devices on vibration reduction can not be completely met by the single vibration isolation gasket.
Disclosure of Invention
The invention aims to provide a board-level assembled device, which reduces the influence of the vibration of a circuit board on a packaged device and improves the reliability of the board-level assembled device in a vibration environment when the circuit board vibrates.
To solve the above technical problem, an embodiment of the present invention provides a board level package device, including: the circuit board, the encapsulation device of welding on the circuit board, set up the first piezoelectric thin slice between encapsulation device and circuit board and set up the second piezoelectric thin slice on the circuit board surface, wherein, first piezoelectric thin slice and second piezoelectric thin slice electricity are connected, and the second piezoelectric thin slice is used for producing the deformation that is used for offsetting the vibration according to the voltage drive first piezoelectric thin slice that produces when vibrating.
Compared with the prior art, the first piezoelectric sheet is arranged between the circuit board and the packaging device and connected with the second piezoelectric sheet arranged on the surface of the circuit board, the first piezoelectric sheet and the second piezoelectric sheet deform when the circuit board vibrates, the first piezoelectric sheet and the second piezoelectric sheet generate voltage according to positive piezoelectric effect, the second piezoelectric sheet drives the first piezoelectric sheet to generate deformation for offsetting vibration according to the voltage generated during vibration, the packaging device above the first piezoelectric sheet is used for supporting, deformation generated around welding spots and pins of the packaging device due to vibration is reduced, the influence of the vibration of the circuit board on the packaging device is reduced, and the reliability of the board-level assembly device in a vibration environment is improved.
In addition, the first end of the first piezoelectric sheet is electrically connected with the first end of the second piezoelectric sheet, wherein the first end of the first piezoelectric sheet and the second end of the second piezoelectric sheet have the same electric polarity; or the first end of the first piezoelectric sheet is electrically connected with the first end of the second piezoelectric sheet through a reversing device, wherein the electric polarities of the first end of the first piezoelectric sheet and the second end of the second piezoelectric sheet are opposite; the second end of the first piezoelectric sheet and the second end of the second piezoelectric sheet are respectively grounded.
And determining the connection mode of the first piezoelectric sheet and the second piezoelectric sheet according to the polarity condition of the first end of the first piezoelectric sheet and the first end of the second piezoelectric sheet. When the polarities are opposite, the second piezoelectric sheet is not connected through the reversing device, and when the polarities are the same, the second piezoelectric sheet is connected through the reversing device, so that the voltage applied to the first piezoelectric sheet by the second piezoelectric sheet is opposite to the voltage generated on the first piezoelectric sheet in direction, reverse deformation for offsetting vibration can be generated on the first piezoelectric sheet, and the flexibility for setting a board-level assembly device is improved through multiple implementation modes.
In addition, the first piezoelectric sheet and the second piezoelectric sheet are positioned on the same side of the circuit board; alternatively, the first piezoelectric sheet and the second piezoelectric sheet are located on different sides of the circuit board.
The position of placing of second piezoelectric thin slice is not restricted for can select more reasonable overall arrangement mode as required when fixed encapsulation device, first piezoelectric thin slice and second piezoelectric thin slice and place, make the mode of placing piezoelectric thin slice more various.
In addition, the polarization directions of the first piezoelectric sheet and the second piezoelectric sheet are the same, or the polarization directions of the first piezoelectric sheet and the second piezoelectric sheet are perpendicular.
In addition, an amplifying device is connected between the first piezoelectric sheet and the second piezoelectric sheet. The voltage signal is amplified through the amplifying device so as to enhance the influence of the voltage signal generated by the second piezoelectric sheet on the first piezoelectric sheet, so that the first piezoelectric sheet generates deformation enough to offset vibration, and the influence of the vibration on the device is better reduced.
In addition, the first piezoelectric sheet and the second piezoelectric sheet are respectively made of ceramics or organic materials with piezoelectric effect.
In addition, the surfaces of the first piezoelectric sheet and the second piezoelectric sheet are plated with metal films. The conductive properties of the first piezoelectric sheet and the second piezoelectric sheet are increased by plating a metal film on the surface of the piezoelectric sheet.
In addition, the first piezoelectric sheet is composed of a plurality of tiled third piezoelectric sheets, wherein the plurality of third piezoelectric sheets are respectively electrically connected with the second piezoelectric sheets. The sum of the areas of the upper surfaces of the plurality of tiled third piezoelectric sheets is smaller than the area of the upper surface of the complete first piezoelectric sheet, so that the material can be saved, and the cost of a board-level assembled device is reduced.
In addition, the second piezoelectric sheets are electrically connected to the plurality of first piezoelectric sheets, respectively. The second piezoelectric sheet can be used for offsetting vibration for the first piezoelectric sheets, resource waste caused by the fact that the second piezoelectric sheet is arranged for each first piezoelectric sheet is avoided, cost is saved, and design complexity is reduced.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the figures in which like reference numerals refer to similar elements and which are not to scale unless otherwise specified.
Fig. 1 is a schematic structural view of a board-level assembled device according to a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a board-level assembled device according to a second embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a board-level assembled device according to a third embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a board-level assembled device according to a fourth embodiment of the present invention;
fig. 5 is a schematic structural diagram of a board-level assembled device according to a fifth embodiment of the present invention;
fig. 6 is a schematic structural diagram of a board-level assembled device according to a sixth embodiment of the present invention;
fig. 7 is a schematic structural diagram of a board-level assembled device according to a seventh embodiment of the present invention;
fig. 8 is a schematic structural view of a board-level assembled device according to an eighth embodiment of the present invention;
fig. 9 is a schematic structural view of a board-level assembled device according to a ninth embodiment of the present invention;
fig. 10 is a schematic structural view of a board-level assembled device according to a tenth embodiment of the present invention;
fig. 11 is a schematic structural view of a board-level assembled device according to an eleventh embodiment of the present invention;
fig. 12 is a schematic structural view of a board-level assembled device according to a twelfth embodiment of the present invention;
fig. 13 is a schematic structural view of a board-level assembled device according to a thirteenth embodiment of the present invention;
fig. 14 is a schematic structural view of a board-level assembled device according to a fourteenth embodiment of the present invention;
fig. 15 is a schematic structural diagram of a board-level assembled device according to a fifteenth embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more apparent, embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it will be appreciated by those of ordinary skill in the art that numerous technical details are set forth in order to provide a better understanding of the present application in various embodiments of the present invention. However, the technical solution claimed in the present application can be implemented without these technical details and various changes and modifications based on the following embodiments.
A first embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 1, a board-level assembled device 10 of the present embodiment includes: the piezoelectric element comprises a circuit board 11, a packaged device 12 welded on the circuit board 11, a first piezoelectric sheet 13 arranged between the packaged device 12 and the circuit board 11, and a second piezoelectric sheet 14 arranged on the upper surface of the circuit board, wherein the first piezoelectric sheet 13 and the second piezoelectric sheet are electrically connected.
In application, the board-level assembly device 10 further includes a fixing bolt 15 for fixing the circuit board 11.
It should be noted that the first piezoelectric sheet 13 and the second piezoelectric sheet 14 in this embodiment are made of ceramics or organic materials having piezoelectric effect, that is, when the circuit board 11 vibrates, a force is applied to the first piezoelectric sheet 13 and the second piezoelectric sheet 14. The first piezoelectric sheet 13 and the second piezoelectric sheet 14 are deformed under the action of external force, a polarization phenomenon is generated inside the first piezoelectric sheet 13 and the second piezoelectric sheet 14, and charges with opposite positive and negative polarities appear on two opposite surfaces of the first piezoelectric sheet 13 and the second piezoelectric sheet 14, so that a potential difference is generated between the upper surface and the lower surface of the first piezoelectric sheet 13 and the second piezoelectric sheet 14. When the circuit board stops vibrating and the acting force applied to the surfaces of the first piezoelectric sheet 13 and the second piezoelectric sheet 14 is cancelled, the potential difference between the surfaces of the first piezoelectric sheet 13 and the second piezoelectric sheet 14 disappears. On the other hand, when an electric field is applied in the polarization direction of the first piezoelectric sheet 13 and the second piezoelectric sheet 14, the piezoelectric sheets are deformed by the electric field.
It is obvious from the above that, when the surfaces of the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are plated with metal films, the two piezoelectric sheets have a conductive function. When the circuit board 11 vibrates, by electrically connecting the first piezoelectric sheet 13 with the second piezoelectric sheet 14, a voltage generated when the second piezoelectric sheet 14 vibrates can be applied to the first piezoelectric sheet 13 under the packaged device 12, thereby driving the first piezoelectric sheet 13 to generate a deformation for canceling the vibration. The influence of the vibration of the circuit board 11 on the packaged device 12 is counteracted through the reverse deformation of the first piezoelectric sheet, and the reliability of the board-level assembled device 10 in a vibration environment is improved.
In addition, it should be noted that the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on the same side of the circuit board 11 in the present embodiment, and the polarization directions of the two piezoelectric sheets are the same. The end of the first piezoelectric sheet 13 grounded is the second end of the first piezoelectric sheet 13, the end of the second piezoelectric sheet 14 grounded is the second end of the second piezoelectric sheet 14, wherein the first end of the first piezoelectric sheet is opposite in electric polarity to the first end of the second piezoelectric sheet and is electrically connected to the first end of the first piezoelectric sheet 13, the first end of the first piezoelectric sheet 13 is the lower surface of the first piezoelectric sheet 13, and the first end of the second piezoelectric sheet 14 is the upper surface of the second piezoelectric sheet 14.
It should be noted that the circuit board 1 in the present embodiment may be a Printed Circuit Board (PCB) or other circuit boards such as an impedance board.
It should be noted that in this embodiment, the piezoelectric constants of the first piezoelectric sheet and the second piezoelectric sheet are different, the piezoelectric constant of the second piezoelectric sheet 14 is 2-3 times that of the first piezoelectric sheet 13, and the higher sensitivity of the second piezoelectric sheet 14 is more beneficial to the implementation of this embodiment.
A second embodiment of the present invention relates to a board-level assembled device, as shown in fig. 2, the second embodiment is mainly different from the first embodiment in that the first end of the first piezoelectric sheet 13 is changed to be the upper surface of the first piezoelectric sheet 13, the first end of the second piezoelectric sheet 14 is still the upper surface of the second piezoelectric sheet 14, and additionally, a reversing device 16 is added, and the first end of the second piezoelectric sheet 14 is connected with the first end of the first piezoelectric sheet 13 through the reversing device 16.
It should be noted that, since the second end of the first piezoelectric sheet 13 and the second end of the second piezoelectric sheet 14 are respectively located on the same side of the two piezoelectric sheets, the ground terminals have the same charges, and the first end of the first piezoelectric sheet 13 and the first end of the second piezoelectric sheet 14 connected thereto have the same charges, so that after the voltage generated by the second piezoelectric sheet 14 is applied to the first piezoelectric sheet 13, the first piezoelectric sheet 13 can generate a deformation that counteracts the vibration in the opposite direction, and therefore, an inverting device 16 needs to be connected between the two piezoelectric sheets.
In addition, the inverter 16 in the present embodiment includes a parallel voltage negative feedback circuit or a chip having an inverting function, which is not limited herein, and the circuit of parallel voltage negative feedback or the chip having an inverting function herein may be integrated on a circuit board.
A third embodiment of the present invention relates to a board-level assembled device, as shown in fig. 3, the third embodiment is mainly different from the first embodiment in that a first piezoelectric sheet 13 and a second piezoelectric sheet 14 are respectively located on opposite sides of a circuit board 11, and a first end of the first piezoelectric sheet 13 is a lower surface of the first piezoelectric sheet 13, a first end of the second piezoelectric sheet 14 is a lower surface of the second piezoelectric sheet 14, and the first end of the second piezoelectric sheet 14 is electrically connected with the first end of the first piezoelectric sheet 13 through a conductive through hole 17 on the circuit board.
It should be noted that, when the circuit board 11 vibrates, the first end of the first piezoelectric sheet 13 and the first end of the second piezoelectric sheet 14 have opposite charges, i.e. opposite electric polarities, and the first piezoelectric sheet 13 and the second piezoelectric sheet 14 have the same polarization direction, so the first end of the second piezoelectric sheet 14 is not connected to the first end of the first piezoelectric sheet 13 by an inverting device, so that the voltage generated on the second piezoelectric sheet 14 is applied to the first piezoelectric sheet, and the first piezoelectric sheet 13 generates an opposite deformation that cancels the vibration.
A fourth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 4, the fourth embodiment is mainly different from the third embodiment in that the first end of the first piezoelectric sheet 13 is the lower surface of the first piezoelectric sheet 13, the first end of the second piezoelectric sheet 14 is the upper surface of the second piezoelectric sheet 14, and a reversing device 16 is added in the connection between the first end of the first piezoelectric sheet 13 and the first end of the second piezoelectric sheet 14.
It should be noted that the first end of the first piezoelectric sheet 13 and the first end of the second piezoelectric sheet 14 are electrode ends in contact with the circuit board 11, respectively, and have the same charge and the same electrical polarity on the surface, so if a voltage generated on the second piezoelectric sheet 14 is applied to the first piezoelectric sheet to generate a reverse deformation, the first end of the second piezoelectric sheet 14 needs to be processed by the reversing device 16 to perform a voltage reversing process and then applied to the first end of the first piezoelectric sheet 13.
A fifth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 5, the fifth embodiment is mainly different from the first embodiment in that the polarization directions of the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are perpendicular to each other, and the left end of the second piezoelectric sheet 14 is a first end of the second piezoelectric sheet 14 and is connected to the first end of the first piezoelectric sheet 13. The left end electrode of the second piezoelectric sheet and the lower end electrode of the first piezoelectric sheet are opposite in polarity in this embodiment.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the first piezoelectric sheet 13 depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 5 shows that the left end electrode of the second piezoelectric sheet 14 is connected to the lower end electrode of the first piezoelectric sheet 13. Alternatively, the left end electrode of the second piezoelectric sheet 14 is connected to the upper end electrode of the first piezoelectric sheet 13 by reversing means. In this case, the left end of the second piezoelectric sheet 14 is the first end of the second piezoelectric sheet 14, and the upper end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since both cases pertain to the case where the left end electrode of the second piezoelectric sheet 14 and the lower end electrode of the first piezoelectric sheet 13 are opposite in electrical polarity, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board 11, there are different connection modes according to the polarities of the first ends of the two piezoelectric sheets, which are not described herein again, and the principle is similar to that of the present embodiment.
A sixth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 6, the sixth embodiment is different from the fifth embodiment mainly in that a first end, i.e., a left end electrode, of a second piezoelectric sheet 14 is connected to a first end, i.e., a lower end electrode, of a first piezoelectric sheet through an inverting device 16, and in this embodiment, the left end electrode of the second piezoelectric sheet and the upper end electrode of the first piezoelectric sheet have the same polarity.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the first piezoelectric sheet 13 depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 6 shows that the left end electrode of the second piezoelectric sheet 14 is connected with the lower end electrode of the first piezoelectric sheet 13 through the reversing device 16. Alternatively, the left end of the second piezoelectric sheet 14 is directly connected to the upper end electrode of the first piezoelectric sheet 13. In this case, the left end of the second piezoelectric sheet is the first end of the second piezoelectric sheet 14, and the upper end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since both cases pertain to the case where the left end electrode of the second piezoelectric sheet 14 and the lower end electrode of the first piezoelectric sheet 13 are the same in electrical polarity, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there may be different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described herein again, which is similar to the present embodiment.
A seventh embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 7, the seventh embodiment is mainly different from the fifth embodiment in that the right end electrode of the second piezoelectric sheet 14 is such that the first end of the second piezoelectric sheet 14 is connected to the lower end electrode of the first piezoelectric sheet 13, that is, the first end of the first piezoelectric sheet 13, and in this embodiment, the right end electrode of the second piezoelectric sheet 14 is opposite in polarity to the lower end electrode of the first piezoelectric sheet 13.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the second piezoelectric sheet depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 7 shows that the right end electrode of the second piezoelectric sheet 14 is connected to the lower end electrode of the first piezoelectric sheet 13. Alternatively, the right end electrode of the second piezoelectric sheet 14 is directly connected to the upper end electrode of the first piezoelectric sheet 13 by reversing means, in which case the right end of the second piezoelectric sheet 14 is the first end of the second piezoelectric sheet 14, and the upper end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since both cases pertain to the case where the right-end electrode of the second piezoelectric sheet 14 and the lower-end electrode of the first piezoelectric sheet 13 are opposite in electrical polarity, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there may be different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described herein again, which is similar to the present embodiment.
An eighth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 8, the eighth embodiment is mainly different from the seventh embodiment in that a right end electrode of a second piezoelectric sheet 14, i.e., a first end of the second piezoelectric sheet 14, is connected to a lower end electrode of a first piezoelectric sheet, i.e., a first end of the first piezoelectric sheet 13, by an inverting means 16, and in this embodiment, the right end electrode of the second piezoelectric sheet 14 is the same polarity as the lower end electrode of the first piezoelectric sheet 13.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the second piezoelectric sheet depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 8 shows that the right end electrode of the second piezoelectric sheet 14 is connected to the lower end electrode of the first piezoelectric sheet 13 through the reversing device 16. Alternatively, the right end electrode of the second piezoelectric sheet 14 is directly connected to the upper end electrode of the first piezoelectric sheet 13, in which case the right end of the second piezoelectric sheet is the first end of the second piezoelectric sheet 14, and the upper end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since the right end electrode of the second piezoelectric sheet 14 and the lower end electrode of the first piezoelectric sheet 13 have the same electrical polarity in both cases, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there are different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described here again and is similar to that of the present embodiment.
A ninth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 9, the ninth embodiment is mainly different from the first embodiment in that the polarization directions of the first piezoelectric sheet and the second piezoelectric sheet are perpendicular, the first end of the second piezoelectric sheet 14, which is the upper end electrode of the second piezoelectric sheet 14, is connected to the first end of the first piezoelectric sheet 13, which is the left end electrode of the first piezoelectric sheet 13, and the upper end electrode of the second piezoelectric sheet 14 in this embodiment is opposite in polarity to the left end electrode of the first piezoelectric sheet 13.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the second piezoelectric sheet depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 9 shows that the upper end electrode of the second piezoelectric sheet 14 is connected to the left end electrode of the first piezoelectric sheet 13. Alternatively, the upper end electrode of the second piezoelectric sheet 14 is connected to the right end electrode of the first piezoelectric sheet 13 by a reversing device, in which case the upper end of the second piezoelectric sheet is the first end of the second piezoelectric sheet 14, and the right end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since the two cases belong to the case where the upper end electrode of the second piezoelectric sheet 14 and the left end electrode of the first piezoelectric sheet 13 have the same electrical polarity, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there may be different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described herein again, which is similar to the present embodiment.
A tenth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 10, the tenth embodiment is mainly different from the ninth embodiment in that the upper end electrode of the second piezoelectric sheet 14, i.e., the first end of the second piezoelectric sheet 14, is connected to the left end electrode of the first piezoelectric sheet, i.e., the first end of the first piezoelectric sheet 13, by the reversing device 16, and in this embodiment, the upper end electrode of the second piezoelectric sheet 14 and the left end electrode of the first piezoelectric sheet 13 have the same polarity.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the second piezoelectric sheet depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 10 shows that the upper end electrode of the second piezoelectric sheet 14 is connected to the left end electrode of the first piezoelectric sheet 13 via the reversing device 16. Alternatively, the upper end electrode of the second piezoelectric sheet 14 is directly connected to the right end electrode of the first piezoelectric sheet 13, in which case the left end of the second piezoelectric sheet is the first end of the second piezoelectric sheet 14, and the right end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since the polarity of the upper end electrode of the second piezoelectric sheet 14 and the polarity of the left end electrode of the first piezoelectric sheet 13 are the same in both cases, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there may be different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described herein again, which is similar to the present embodiment.
An eleventh embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 11, the eleventh embodiment is mainly different from the first embodiment in that the electric polarities of the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are perpendicular to each other. The lower end electrode of the second piezoelectric sheet 14, i.e., the first end of the second piezoelectric sheet 14, is connected to the left end electrode of the first piezoelectric sheet, i.e., the first end of the first piezoelectric sheet 13, and in this embodiment, the lower end electrode of the second piezoelectric sheet 14 is opposite in polarity to the left end electrode of the first piezoelectric sheet 13.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the second piezoelectric sheet depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 11 shows that the lower end electrode of the second piezoelectric sheet 14 is connected to the left end electrode of the first piezoelectric sheet 13. Alternatively, the lower end electrode of the second piezoelectric sheet 14 is directly connected to the right end electrode of the first piezoelectric sheet 13 through a reversing device, in which case the left end of the second piezoelectric sheet is the first end of the second piezoelectric sheet 14, and the right end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since the two cases are the case where the lower end electrode of the second piezoelectric sheet 14 and the left end electrode of the first piezoelectric sheet 13 are opposite in electric polarity, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there may be different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described herein again, which is similar to the present embodiment.
A twelfth embodiment of the present invention relates to a board-level assembled device, as shown in fig. 12, and the main difference of the twelfth embodiment from the eleventh embodiment is that the lower end electrode of the second piezoelectric sheet 14, i.e., the first end of the second piezoelectric sheet 14, is connected to the left end electrode of the first piezoelectric sheet, i.e., the first end of the first piezoelectric sheet 13, by the reversing device 16, and in this embodiment, the lower end electrode of the second piezoelectric sheet 14 has the same polarity as the left end electrode of the first piezoelectric sheet 13.
The specific connection between the first end of the second piezoelectric sheet 14 and the first end of the second piezoelectric sheet depends on the electrode at the first end of the second piezoelectric sheet 14 and the electrode at the first end of the first piezoelectric sheet 13. Fig. 12 shows that the lower end electrode of the second piezoelectric sheet 14 is connected to the left end electrode of the first piezoelectric sheet 13 via the reversing device 16. Alternatively, the lower end electrode of the second piezoelectric sheet 14 is directly connected to the right end electrode of the first piezoelectric sheet 13, in which case the left end of the second piezoelectric sheet is the first end of the second piezoelectric sheet 14, and the right end electrode of the first piezoelectric sheet 13 is the first end of the first piezoelectric sheet 13. Since the lower end electrode of the second piezoelectric sheet 14 and the left end electrode of the first piezoelectric sheet 13 have the same electrical polarity in both cases, the second case will not be described again. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there are different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described here again and is similar to that of the present embodiment.
A thirteenth embodiment of the present invention relates to a board-level assembled device, and as shown in fig. 13, the thirteenth embodiment is different from the first embodiment mainly in that piezoelectric constants of the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are close to or the same in this embodiment, and an amplifying device 18 is added between the first piezoelectric sheet 13 and the second piezoelectric sheet 14 in order to apply a voltage generated by vibration to the second piezoelectric sheet 14 to the first piezoelectric sheet 13 to generate a deformation enhancing effect and to better resist the influence of vibration on the packaged device on the first piezoelectric sheet 13.
A fourteenth embodiment of the present invention relates to a board-level assembled device, and the main difference of the fourteenth embodiment with respect to the first embodiment is that the first piezoelectric sheet in the present embodiment is composed of a plurality of tiled third piezoelectric sheets 131, wherein the plurality of third piezoelectric sheets 131 are electrically connected to the second piezoelectric sheets 14, respectively.
In this embodiment, the sum of the areas of the upper surfaces of the plurality of tiled third piezoelectric sheets 131 is smaller than the area of the upper surface of the complete first piezoelectric sheet in the first embodiment, so that material can be saved.
A fifteenth embodiment of the present invention relates to a piezoelectric sheet connection method, and the present embodiment is mainly different from the first embodiment in that the second piezoelectric sheets 14 are connected to the plurality of first piezoelectric sheets 13, respectively.
In the embodiment, the situation that when the circuit board needs to be provided with the first piezoelectric sheets below a plurality of devices respectively, the circuit board is correspondingly provided with the second piezoelectric sheets correspondingly connected with the first piezoelectric sheets below the devices is avoided. Therefore, the occupied area of the second piezoelectric sheets on the circuit board is saved by respectively connecting the second piezoelectric sheets with the plurality of first piezoelectric sheets, and meanwhile, the material of the first piezoelectric sheets is saved. In addition, when the first piezoelectric sheet 13 and the second piezoelectric sheet 14 are located on different sides of the circuit board, there may be different connection modes according to the polarities of the first ends of the two piezoelectric sheets, and the principle is not described herein again, which is similar to the present embodiment.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples for carrying out the invention, and that various changes in form and details may be made therein without departing from the spirit and scope of the invention in practice.
Claims (9)
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| CN201710909048.8A CN107801343B (en) | 2017-09-29 | 2017-09-29 | Board level assembled device |
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| CN201710909048.8A CN107801343B (en) | 2017-09-29 | 2017-09-29 | Board level assembled device |
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| CN107801343B true CN107801343B (en) | 2020-03-27 |
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| WO2014105898A1 (en) * | 2012-12-26 | 2014-07-03 | Applied Cavitation, Inc. | Piezoelectric devices |
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