CN107757127A - Nozzle structure, the preparation method of nozzle structure and micro electronmechanical ink jet-print head - Google Patents
Nozzle structure, the preparation method of nozzle structure and micro electronmechanical ink jet-print head Download PDFInfo
- Publication number
- CN107757127A CN107757127A CN201711041824.3A CN201711041824A CN107757127A CN 107757127 A CN107757127 A CN 107757127A CN 201711041824 A CN201711041824 A CN 201711041824A CN 107757127 A CN107757127 A CN 107757127A
- Authority
- CN
- China
- Prior art keywords
- nozzle structure
- wall
- protective layer
- substrate
- spray orifice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00349—Creating layers of material on a substrate
- B81C1/00373—Selective deposition, e.g. printing or microcontact printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14483—Separated pressure chamber
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2202/00—Embodiments of or processes related to ink-jet or thermal heads
- B41J2202/01—Embodiments of or processes related to ink-jet heads
- B41J2202/22—Manufacturing print heads
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0176—Chemical vapour Deposition
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention relates to a kind of nozzle structure, the preparation method of nozzle structure and micro electronmechanical ink jet-print head, the nozzle structure in wall by forming pressure cavities, spray orifice is formed on the outer surface of wall, wall includes intermediate and the deielectric-coating being attached on intermediate again, so as to improve the flatness on pressure cavities surface, and then the probability of the contaminants such as injection hole surface ink or particulate is reduced, in addition, the wall steadiness that it is formed is strong, can improve the reliability of micro electronmechanical ink jet-print head；The preparation method of the nozzle structure on the intermediate formed by covering the first protective layer; so that obtained nozzle structure pattern is good, uniformity is high; improve the flatness on pressure cavities surface; reduce the probability of the contaminants such as injection hole surface ink or particulate; it has higher steadiness; the reliability of micro electronmechanical ink jet-print head can be improved, and this method is compatible with MEMS technology, available for mass production.
Description
Technical field
The present invention relates to a kind of nozzle structure, the preparation method of nozzle structure and micro electronmechanical ink jet-print head, belong to microcomputer
Electric manufacturing field.
Background technology
The nozzle structure of the existing ink jet-print head based on the manufacture of micro electronmechanical (MEMS) technology is more in the following ways：
The first：Pressure chamber profile is formed using such as inorganic sacrificial such as copper, nickel layer material, then deposits one layer of photosensitive thickness on its surface
Film forms cavity wall and ejection layer, and using nozzle pattern is lithographically formed, thick-film material generally selects SU8 photoresists or photosensitive
Property polyimides (Polyimide)；Sacrificial layer material, which is removed, finally by release forms ink cavity and jet orifice structure；Second
Kind using organic sacrificial layer material formed pressure chamber profile, then again its surface deposit one layer of certain thickness deielectric-coating, one
As from PECVD depositions silica, cavity perimeter walls and ejection layer are formed with silica, pass through the method for chemical wet etching
Prepare spray orifice pattern；Dry release is carried out to organic sacrificial layer material finally by spray orifice, it is empty to prepare final ink
Chamber.
Although above two mode is the usual way commonly used in the prior art for being used to manufacture ink jet-print head,
There are the following problems for it：
The first scheme has the disadvantage that：In the prior art, limited by surface processing technique, generally use electricity
Plating mode prepares the inorganic sacrificial layer such as copper, nickel, but the sacrificial layer thickness uniformity prepared is poor, and surface roughness is big；And
It can be influenceed afterwards in light-sensitive materials such as the SU8 of its surface deposition by front layer sacrifice layer pattern, it is poor to be lithographically derived spray orifice pattern
And uniformity is also poor, it is difficult to meets the demands such as micro electronmechanical ink jet-print head high density spray orifice morphological consistency height.
Second scheme has the disadvantage that：Because deielectric-coating silicon oxide thickness is restricted by micro-electromechanical processing technology, typically
Less than 10um, the pressure chamber side wall thickness of formation is relatively thin, can not be filled up completely between pressure cavity structure, forms groove, so
The blocking of the aggregation of the pollutants such as ink or particulate, even ink channel can be easily caused.Relatively thin pressure chamber side wall also can
Easily sustained damage during the scouring of spray orifice.
The content of the invention
It is an object of the invention to provide a kind of nozzle structure, and it can reduce the pollution such as injection hole surface ink or particulate
The probability of thing aggregation, improve the reliability of micro electronmechanical ink jet-print head.
To reach above-mentioned purpose, the present invention provides following technical scheme：A kind of nozzle structure, including substrate, formation are in institute
State the wall in substrate, it is empty formed with pressure in the wall formed with the ink entrance for penetrating the substrate in the substrate
Chamber, the wall at least on a side external surface formed with spray orifice；The side of the pressure cavities connects with ink entrance, another
Side connects with the spray orifice, and the wall includes intermediate and the deielectric-coating being attached on the intermediate.
Further, the wall has the madial wall for forming the pressure cavities, and the madial wall is by the deielectric-coating
Formed.
Further, the wall has the hole wall for forming the spray orifice, and the hole wall is formed by deielectric-coating.
Further, the intermediate has upper surface, and the deielectric-coating extends to the upper surface of the intermediate.
Further, the intermediate is formed by photosensitive polyimide, and the deielectric-coating is formed by silica.
Present invention also offers a kind of preparation method of nozzle structure, comprise the following steps：
S1：Substrate is provided, at least two juts, two adjacent protruding parts are formed by expendable material on the substrate
Between formed with gap；
S2：The first protective layer is deposited on the jut and substrate；
S3：Intermediate is formed between the two neighboring jut, the intermediate fills gap and is covered in projection
The top in portion, first protective layer isolate the intermediate with jut；Shower nozzle window is formed in the top surface of the intermediate
Mouthful, the area of the shower nozzle window is less than the area of the top surface of the jut；
S4：First protective layer is etched in the position of the shower nozzle window to form spray orifice, the spray orifice runs through first
Protective layer；
S5：The ink entrance through the substrate is formed on the substrate, and discharges the sacrifice layer to form pressure sky
Chamber, the ink entrance, pressure cavities, spray orifice connection.
Further, also there are following steps between the step S3 and S4：Deposit forms second on the wall
Protective layer, second protective layer cover intermediate；
In the step S4, the spray orifice runs through the first protective layer and the second protective layer.
Further, to form deielectric-coating, the deielectric-coating coats institute for first protective layer, the linking of the second protective layer
State intermediate.
Further, the wall is photosensitive polyimide, and first protective layer and the second protective layer are oxidation
Silicon layer.
Present invention also offers a kind of micro electronmechanical ink jet-print head, including above-mentioned nozzle structure, or including by above-mentioned
Nozzle structure obtained by the preparation method of nozzle structure.
The beneficial effects of the present invention are：The nozzle structure of the present invention in wall by forming pressure cavities, in wall
Outer surface on form spray orifice, and wall includes intermediate and the deielectric-coating being attached on intermediate, so as to improve pressure sky
The flatness on chamber surface, and then the probability of the contaminants such as injection hole surface ink or particulate is reduced, in addition, what it was formed
Wall steadiness is strong, can improve the reliability of micro electronmechanical ink jet-print head；The preparation method of the nozzle structure of the present invention first passes through
Sacrifice layer is formed in substrate, the first protective layer is then formed on sacrifice layer, refills to form intermediate and then etch to be formed
Spray orifice, finally form ink entrance in substrate and releasing sacrificial layer is to form pressure cavities, in being formed by such a method
Covered with the first protective layer on mesosome, so that obtained nozzle structure pattern is good, uniformity is high, pressure sky is improved
The flatness on chamber surface, the probability of the contaminants such as injection hole surface ink or particulate is reduced, it has higher consolidate
Property, the reliability of micro electronmechanical ink jet-print head can be improved, and this method is compatible with MEMS technology, available for mass production.By
Above-mentioned nozzle structure is used in the micro electronmechanical ink jet-print head of the present invention, compared with prior art, its reliability is higher.
Described above is only the general introduction of technical solution of the present invention, in order to better understand the technological means of the present invention,
And can be practiced according to the content of specification, below with presently preferred embodiments of the present invention and coordinate accompanying drawing describe in detail as after.
Brief description of the drawings
Fig. 1 is the flow chart of the preparation method of the nozzle structure shown in one embodiment of the invention；
Fig. 2 is the schematic diagram that sacrifice layer is prepared in substrate；
Fig. 3 is the schematic diagram that the first protective layer is prepared on the basis of Fig. 2；
Fig. 4 is the schematic diagram that intermediate is prepared on the basis of Fig. 3；
Fig. 5 is the schematic diagram that the second protective layer is prepared on the basis of Fig. 4；
Fig. 6 is the schematic diagram that spray orifice is prepared on the basis of Fig. 5；
Fig. 7 is that the schematic diagram that nozzle structure is formed after ink entrance and pressure chamber is prepared on the basis of Fig. 2.
Embodiment
With reference to the accompanying drawings and examples, the embodiment of the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
Fig. 1 to Fig. 7 is referred to, the preparation method of the nozzle structure shown in a preferred embodiment of the present invention includes following step
Suddenly：
The first step：Incorporated by reference to Fig. 2, there is provided substrate 1, the substrate 1 have the front 11 and the back side 12 being disposed opposite to each other,
Sacrifice layer 2 is formed by expendable material on the front 11 of the substrate 1, the sacrifice layer 2 includes being formed in the front of the substrate 1
Multiple juts 21 on 11, there is top surface formed with gap 22, each jut 21 between two adjacent protruding parts 21
211 and side 212；In this step, the gap 22 is formed by the method for chemical wet etching in the top of substrate 1, the gap 22
The graphics shape formed is the contour structures of the pressure cavities subsequently formed；The material of the sacrifice layer 2 is non-photosensitive
Organic material, i.e. non-photosensitive polyimides；
Second step：Fig. 3 is referred to, the first protective layer 3, first protection are deposited on the jut 21 and substrate 1
Layer 3 at least covers side 212 and the substrate 1 of jut 21, and in the present embodiment, first protective layer 3 also covers jut
21 top surface 211；In this step, the material of first protective layer 3 is silicon oxide layer, and it uses 350 degrees Celsius of PECVD to sink
Product method is realized；
3rd step：Fig. 4 is referred to, is deposited on the sacrifice layer 2 and forms intermediate 4, the intermediate 4 fills gap
(non-label) is simultaneously covered in the top of sacrifice layer 2, in this step, because in second step, the first protective layer 3 covers sacrifice layer 2
Side 212, top surface 211 and covering substrate 1, so, the intermediate that is formed 4 is actual for the first protective layer 3 of covering；Institute
The top surface 211 for stating intermediate 4 is lithographically formed shower nozzle window 41, and the area of the shower nozzle window 41 is less than the jut 21
The area of top surface 211；In this step, the intermediate 4 is photosensitive polyimide, in this step, passes through polyimides
Mobility each gap 22 of its sacrifice layer 2 is filled；
4th step：Fig. 5 is referred to, the second protective layer 5 of deposit formation, second protective layer 5 on the intermediate 4
Filling shower nozzle window (non-label) simultaneously covers the top surface (non-label) of intermediate 4, and second protective layer 5 is protected with described first
Sheath 3 is connected to form deielectric-coating 10, and the junction of the first protective layer 5 and the second protective layer 3 is shower nozzle window, i.e. is being formed sediment
When product forms the second protective layer 5, second protective layer 5 covers shower nozzle window；In fact, the deielectric-coating 10 wraps completely
Intermediate 4 is covered, first protective layer 3, the second protective layer 5 and intermediate 4 are collectively forming wall 9, and the wall 9 is in sandwich knot
Structure；In this step, the material of second protective layer 5 is silicon oxide layer, and it uses 350 degrees Celsius of PECVD deposition process real
It is existing；
5th step：Fig. 6 is referred to, the first protective layer 3 described in the position chemical wet etching in the shower nozzle window (non-label)
With the second protective layer 5 to form spray orifice 6, the spray orifice 6 runs through to be collectively forming by the second protective layer 5 and first protective layer 3
Deielectric-coating 10, i.e., the spray orifice 6 is simultaneously through the second protective layer 5 and first protective layer 3；In other embodiments, may be used
To omit the 4th step, i.e., the second protective layer is not formed, if such a situation, in this step, forming spray orifice 6 only needs to etch
First protective layer 3.
6th step：Fig. 7 is referred to, the ink entrance 8 through the substrate 1 is formed in the substrate 1, and described in release
To form pressure cavities 7, the ink entrance 8, pressure cavities 7, spray orifice 6 connect sacrifice layer (not shown)., should in this step
Sacrifice layer is gone divided by formed by the method for dry release by pressure cavities 7.
In the present embodiment, the quantity of the pressure cavities 7 formed is multiple, and the pressure cavities 7 are in one with spray orifice 6
One connection is set；The quantity of the ink entrance 8 formed is multiple, and the ink entrance 8 connects with pressure cavities 7 in one-to-one
Set.The axis line overlap of the axis of the pressure cavities 7, the axis of ink entrance 8 and spray orifice 6 corresponding to mutually.At it
In his embodiment, spray orifice 6, pressure cavities 7, the quantity mode of ink entrance 8 and matching process can be in the following way：Extremely
Few two spray orifices 6 can correspond to a pressure cavities 7 simultaneously and be connected with the pressure cavities 7, and at least two pressure cavities 7 can be same
When a corresponding ink entrance 8；Or the quantity of the pressure cavities 7, ink entrance 8 is one.Certainly, the axis of pressure cavities 7
The axis of line, the axis of ink entrance 8 and spray orifice 6 can not also be overlapping.But in order to improve the stability of work, spray orifice
6th, pressure cavities 7, the optimal placement scheme of ink entrance 8 are the present embodiment.
Fig. 7 is referred to, a kind of micro electronmechanical ink jet-print head shown in a preferred embodiment of the present invention includes nozzle structure,
The nozzle structure can be by obtained by above-mentioned preparation method.The nozzle structure is included with the He of front 11 being disposed opposite to each other
The substrate 1 at the back side 12, the wall 9 formed on the front 11 of the substrate 1.Formed with the insertion substrate in the substrate 1
1 ink entrance 8, in the present embodiment, the quantity of the ink entrance 8 is multiple, and the base is run through in the side of each ink entrance 8
The front 11 at bottom 1, opposite side run through the back side 12 of the substrate 1.Formed with pressure cavities 7, the wall 9 in the wall 9
At least on a side external surface formed with spray orifice 6, in the present embodiment, quantity, the quantity of pressure cavities 7 of the spray orifice 6 are equal
To be multiple, in addition, multiple spray orifices 6 are arranged on same side external surface.The side of the pressure cavities 7 connects with ink entrance 8
Logical, opposite side connects with the spray orifice 6, and in the present embodiment, the pressure cavities 7 connect setting, institute with spray orifice 6 in one-to-one
State ink entrance 8 and connect setting in one-to-one with pressure cavities 7, the axis of each mutually corresponding pressure cavities 7, enter
The axis of black mouth 8 and the axis line overlap of spray orifice 6.In other embodiments, spray orifice 6, pressure cavities 7, ink entrance 8
Quantity mode and matching process can be in the following way：At least two spray orifices 6 can correspond to simultaneously a pressure cavities 7 and with
The pressure cavities 7 connect, and at least two pressure cavities 7 can correspond to an ink entrance simultaneously；Or pressure cavities 7, the ink feed
The quantity of mouth 8 is one.Certainly, the axis of the axis of pressure cavities 7, the axis of ink entrance 8 and spray orifice 6 can also
It is not overlapping.But in order to improve the stability of work, spray orifice 6, pressure cavities 7, the optimal placement scheme of ink entrance 8 are this reality
Apply example.
The wall 9 includes intermediate 4 and the deielectric-coating 10 being attached on the intermediate 4, and the intermediate 4 is by feeling
Photosensitiveness polyimides is formed, and the deielectric-coating 10 is formed by silica.The wall 9, which has, forms the pressure cavities 7
Madial wall 91 and form the hole wall 92 of the spray orifice 6, the madial wall 91, hole wall 92 are formed by the deielectric-coating 10.It is described
Intermediate 4 has upper surface 42, and the deielectric-coating 10 extends to the upper surface 42 of the intermediate 4.Really, implement at other
In mode, deielectric-coating 10 can be not extend to the upper surface 42 of intermediate 4, or the hole wall 92 of the spray orifice 6 can be directly in
Mesosome 4 is formed.But if madial wall 91, hole wall 92 form deielectric-coating 10 by the deielectric-coating 10, and deielectric-coating 10 extends again
To the upper surface 42 of the intermediate 4, then the contaminants such as the surface ink of spray orifice 6 or particulate can be farthest reduced
Probability.
In summary, above-mentioned nozzle structure in wall 9 by forming pressure cavities 7, the shape on the outer surface of wall 9
Into spray orifice 6, and wall 9 includes intermediate 4 and the deielectric-coating 10 being attached on intermediate 4, so as to improve the table of pressure cavities 7
The flatness in face, and then the probability of the contaminants such as the surface ink of spray orifice 6 or particulate is reduced, in addition, the wall of its formation
9 steadiness are strong, can improve the reliability of micro electronmechanical ink jet-print head；The preparation method of the nozzle structure of the present invention first passes through
Sacrifice layer 2 is formed in substrate 1, the first protective layer 3 is then formed on sacrifice layer 2, refills to form intermediate 4 and then etch
Spray orifice 6 is formed, finally ink entrance 8 is formed on the base 1 and releasing sacrificial layer 2 is to form pressure cavities 7, pass through such a method
Covered with the first protective layer 3 on the intermediate 4 formed, so that obtained nozzle structure pattern is good, uniformity is high,
The flatness on the surface of pressure cavities 7 is improved, the probability of the contaminants such as the surface ink of spray orifice 6 or particulate can be reduced, it has
There is higher steadiness, the reliability of micro electronmechanical ink jet-print head can be improved, and this method is compatible with MEMS technology, can be used for
Mass production.Because the micro electronmechanical ink jet-print head of the present invention uses above-mentioned nozzle structure, compared with prior art, it can
It is higher by property.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously
Can not therefore it be construed as limiting the scope of the patent.It should be pointed out that come for one of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
- A kind of 1. nozzle structure, it is characterised in that：Including substrate, the wall of formation on the substrate, formed in the substrate There is an ink entrance for penetrating the substrate, formed with pressure cavities, the shape at least on a side external surface of the wall in the wall Into there is spray orifice；The side of the pressure cavities connects with ink entrance, and opposite side connects with the spray orifice, and the wall includes centre Body and the deielectric-coating being attached on the intermediate.
- 2. nozzle structure as claimed in claim 1, it is characterised in that the wall has the inner side for forming the pressure cavities Wall, the madial wall are formed by the deielectric-coating.
- 3. nozzle structure as claimed in claim 2, it is characterised in that the wall has the hole wall for forming the spray orifice, institute Hole wall is stated to be formed by deielectric-coating.
- 4. nozzle structure as claimed in claim 3, it is characterised in that the intermediate has upper surface, and the deielectric-coating prolongs Extend the upper surface of the intermediate.
- 5. such as the nozzle structure any one of Claims 1-4 item, it is characterised in that the intermediate is gathered by photonasty Acid imide is formed, and the deielectric-coating is formed by silica.
- A kind of 6. preparation method of nozzle structure, it is characterised in that：Comprise the following steps：S1：Substrate is provided, at least two juts are formed by expendable material on the substrate, shape between two adjacent protruding parts Into there is gap；S2：The first protective layer is deposited on the jut and substrate；S3：Intermediate is formed between the two neighboring jut, the intermediate fills gap and is covered in jut Top, first protective layer isolate the intermediate with jut；Shower nozzle window, institute are formed in the top surface of the intermediate State area of the area less than the top surface of the jut of shower nozzle window；S4：First protective layer is etched in the position of the shower nozzle window to form spray orifice, the spray orifice is through the first protection Layer；S5：The ink entrance through the substrate is formed on the substrate, and discharges the sacrifice layer to form pressure cavities, institute State ink entrance, pressure cavities, spray orifice connection.
- 7. the preparation method of nozzle structure as claimed in claim 6, it is characterised in that also have between the step S3 and S4 Have the following steps：Deposit forms the second protective layer on the wall, and second protective layer covers intermediate；In the step S4, the spray orifice runs through the first protective layer and the second protective layer.
- 8. the preparation method of nozzle structure as claimed in claim 7, it is characterised in that first protective layer, the second protection To form deielectric-coating, the deielectric-coating coats the intermediate for layer linking.
- 9. the preparation method of nozzle structure as claimed in claim 7 or 8, it is characterised in that the wall is photonasty polyamides Imines, first protective layer and the second protective layer are silicon oxide layer.
- 10. a kind of micro electronmechanical ink jet-print head, it is characterised in that including the shower nozzle knot as any one of weighing and require 1 to 5 Structure, or the nozzle structure obtained by including the preparation method by any one of claim 6 to 9 nozzle structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711041824.3A CN107757127B (en) | 2017-10-30 | 2017-10-30 | Nozzle structure, preparation method of nozzle structure and micro-electromechanical ink-jet printing head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711041824.3A CN107757127B (en) | 2017-10-30 | 2017-10-30 | Nozzle structure, preparation method of nozzle structure and micro-electromechanical ink-jet printing head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107757127A true CN107757127A (en) | 2018-03-06 |
| CN107757127B CN107757127B (en) | 2023-05-26 |
Family
ID=61271096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711041824.3A Active CN107757127B (en) | 2017-10-30 | 2017-10-30 | Nozzle structure, preparation method of nozzle structure and micro-electromechanical ink-jet printing head |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107757127B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1600549A (en) * | 2003-09-27 | 2005-03-30 | 三星电子株式会社 | Method of manufacturing monolithic inkjet printhead |
| TWI268221B (en) * | 2006-03-10 | 2006-12-11 | Benq Corp | Fluid injection device and method of fabricating the same |
| TWI271320B (en) * | 2006-03-10 | 2007-01-21 | Benq Corp | Monolithic fluid injection device and method of manufacturing the same |
| CN101062498A (en) * | 2006-04-28 | 2007-10-31 | 明基电通股份有限公司 | Monolithic fluid injection device and manufacturing method thereof |
| CN101062494A (en) * | 2006-04-28 | 2007-10-31 | 明基电通股份有限公司 | Fluid ejection device and method of manufacturing the same |
| CN101557938A (en) * | 2006-12-12 | 2009-10-14 | 伊斯曼柯达公司 | Liquid ejector having improved chamber walls |
| CN101557939A (en) * | 2006-12-12 | 2009-10-14 | 伊斯曼柯达公司 | Liquid drop ejector having improved liquid chamber |
| CN207758356U (en) * | 2017-10-30 | 2018-08-24 | 苏州工业园区纳米产业技术研究院有限公司 | Nozzle structure and micro electronmechanical inkjet print head |
-
2017
- 2017-10-30 CN CN201711041824.3A patent/CN107757127B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1600549A (en) * | 2003-09-27 | 2005-03-30 | 三星电子株式会社 | Method of manufacturing monolithic inkjet printhead |
| TWI268221B (en) * | 2006-03-10 | 2006-12-11 | Benq Corp | Fluid injection device and method of fabricating the same |
| TWI271320B (en) * | 2006-03-10 | 2007-01-21 | Benq Corp | Monolithic fluid injection device and method of manufacturing the same |
| CN101062498A (en) * | 2006-04-28 | 2007-10-31 | 明基电通股份有限公司 | Monolithic fluid injection device and manufacturing method thereof |
| CN101062494A (en) * | 2006-04-28 | 2007-10-31 | 明基电通股份有限公司 | Fluid ejection device and method of manufacturing the same |
| CN101557938A (en) * | 2006-12-12 | 2009-10-14 | 伊斯曼柯达公司 | Liquid ejector having improved chamber walls |
| CN101557939A (en) * | 2006-12-12 | 2009-10-14 | 伊斯曼柯达公司 | Liquid drop ejector having improved liquid chamber |
| CN207758356U (en) * | 2017-10-30 | 2018-08-24 | 苏州工业园区纳米产业技术研究院有限公司 | Nozzle structure and micro electronmechanical inkjet print head |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107757127B (en) | 2023-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6461888B1 (en) | Lateral polysilicon beam process | |
| US10245834B2 (en) | Manufacturing method for a fluid-ejection device, and fluid-ejection device | |
| JP5090603B2 (en) | Micromechanical structural element and corresponding manufacturing method | |
| JP5644340B2 (en) | Capacitor structure and manufacturing method thereof | |
| US8344466B2 (en) | Process for manufacturing MEMS devices having buried cavities and MEMS device obtained thereby | |
| US8998388B2 (en) | Method for manufacturing a fluid ejection device and fluid ejection device | |
| CN106250807B (en) | Fingerprint acquisition apparatus with the isomery coated structure including mould | |
| CN107443901B (en) | The manufacturing method of liquid discharging head and liquid discharging head | |
| US20150028438A1 (en) | Mems device and process for producing same | |
| JP5676941B2 (en) | Wiring board manufacturing method and wiring board | |
| CN103607687A (en) | MEMS microphone defect monitoring structure and manufacturing method thereof | |
| CN107757127A (en) | Nozzle structure, the preparation method of nozzle structure and micro electronmechanical ink jet-print head | |
| CN109151689A (en) | microphone and its manufacturing method | |
| US7294552B2 (en) | Electrical contact for a MEMS device and method of making | |
| JP6041033B2 (en) | Manufacturing method of semiconductor substrate | |
| CN207758356U (en) | Nozzle structure and micro electronmechanical inkjet print head | |
| TW200906634A (en) | Highly integrated wafer bonded MEMS devices with release-free membrane manufacture for high density print heads | |
| JP6128972B2 (en) | Manufacturing method of substrate for liquid discharge head | |
| CN106379858A (en) | Manufacturing method of micro-electromechanical device, micro-electromechanical device and micro-electromechanical device base structure | |
| CN105417488B (en) | Pressure sensor and its manufacture method | |
| US9349644B2 (en) | Semiconductor device producing method | |
| CN106553453A (en) | Hot bubble type ink jet printhead and preparation method thereof | |
| CN105439075B (en) | A kind of MEMS device and preparation method thereof, electronic device | |
| CN102950897B (en) | Liquid nozzle and manufacturing method thereof | |
| JP2017109304A (en) | Micro electromechanical device and manufacturing method of the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |