CN107745549B - A kind of method of increasing material manufacturing built-in circuit composite metal plate - Google Patents

Abstract

The invention discloses a kind of methods of increasing material manufacturing built-in circuit composite metal plate, belong to material increasing field；The technical problem to be solved is that providing one kind circuit can be write direct composite metal plate, circuit is prepared simultaneously with composite metal plate, the method that integrated increasing material manufacturing built-in circuit composite metal plate is made；Solve the technical solution of technical problem use are as follows: a kind of method of increasing material manufacturing built-in circuit composite metal plate, by being cut into the circuit paths set in advance in metal foil, metal foil is shaped by ultrasonic consolidation, then it is sequentially filled insulating materials, conductive material, insulating materials in circuit paths, circuit and composite metal plate preparation are integrated；It the composite can be widely applied to material increasing field.

Description

A method for additive manufacturing metal composite board with built-in circuit

technical field

The invention relates to a method for additively manufacturing a metal composite board with a built-in circuit, which belongs to the technical field of additive manufacturing.

Background technique

Ultrasonic metal consolidation forming technology uses high-power ultrasonic energy, uses metal foil as raw material, and uses the heat generated by the vibration and friction of metal layers to cause local severe plastic deformation of the material, thereby achieving physical metallurgical bonding between atoms and realizing simultaneous A special method of solid-state bonding between one or dissimilar metal materials. On the basis of metal ultrasonic consolidation forming technology, combined with CNC milling and other processes, the integration of ultrasonic additive forming and intelligent manufacturing can be realized. This technology has attracted widespread attention due to its advantages in energy saving, environmental protection, high efficiency, and low cost. It has broad application prospects in aerospace, automotive industry, weaponry and other fields. High homogeneous or dissimilar metal laminate materials, the prepared metal laminate materials can be used in armor, aerospace and other fields. In order to better measure the operating status of the equipment and connect with other circuit systems, circuit boards are often implanted inside the composite material. At present, the traditional implantation method is to process grooves inside the prepared composite board, then fill it into the circuit board, and then fill it with resin for encapsulation. The composite metal plate prepared by this method cannot be integrated with the internal circuit board, which reduces the mechanical properties of the composite plate and increases the processing cost.

Contents of the invention

The invention overcomes the disadvantages of the prior art, and provides a method for directly writing the circuit into the metal composite board, preparing the circuit and the metal composite board at the same time, and making an integrated additive manufacturing metal composite board with built-in circuit.

In order to solve the above technical problems, the technical solution adopted in the present invention is: a method for additively manufacturing a metal composite board with a built-in circuit, which is carried out as follows:

(1) Model the metal composite board that needs a built-in circuit, set the circuit path and position in the metal composite board, repair the model with Magic software, and then slice the model with Autofab software;

(2) Cut out the circuit path on the metal foil according to the set circuit path;

(3) The metal foil material is consolidated and formed by an ultrasonic consolidation device, and the excess metal foil is cut off with a cutter after consolidation and formation;

(4) laying a layer of insulating material in the circuit track of the consolidated metal foil;

(5) Spray a layer of conductive material on the consolidated insulating material;

(6) Lay a layer of insulating material on top of the consolidated conductive material;

(7) Repeat steps 2-6 to carry out the compounding of the next layer of metal foil;

(8) The above steps are repeated, and the metal foil materials are accumulated layer by layer to obtain a metal composite board with a built-in circuit.

Preferably, in the step 1, the slice thickness is the thickness of the metal foil, and the forming accuracy is controlled within ±1mm.

Preferably, in the step 2, the thickness of the metal foil is 0.1-0.5mm, the rotation speed of the cutter is 50-200r/s, the moving speed of the cutter is 0.5-1m/s, and the chamfering of the cutter boundary is 0.5-2mm ; After cutting, clean the metal foil with alcohol and blow dry.

Preferably, in the step 3, the ultrasonic consolidation power is 2-4KW. The cutting speed of the cutter is 1-3m/s, and the pressure of the cutter is 1-2 tons.

Preferably, in the step 4, the laying insulating material is ABS or PLA polymer insulating material, the laying speed is 0.5-1 m/s, and the boundary chamfering is 0.5-1 mm.

Preferably, in the step 5, the conductive material sprayed is conductive ink, conductive paint and other conductive materials.

Compared with the prior art, the present invention has the following beneficial effects: through this method, the circuit and the metal composite board can be integrated, which improves the mechanical properties of the metal composite board, can be used in extreme environments, expands the application field, and at the same time reduces The manufacturing cost is reduced, the forming efficiency is improved, and the personalized customization of the circuit board can be realized according to the demand.

Description of drawings

Figure 1 is a schematic diagram of the method for additively manufacturing metal composite boards with built-in circuits.

Figure 2 shows the prepared iron-based composite board with built-in circuit.

Detailed ways

As shown in Figure 1 and Figure 2, a method for additively manufacturing a metal composite board with a built-in circuit according to the present invention is carried out as follows:

(1) Model the metal composite board that needs a built-in circuit, set the circuit path and position in the metal composite board, repair the model with Magic software, and then slice the model with Autofab software, and the thickness of the slice is the thickness of the metal foil , the forming accuracy is controlled at ±1mm;

(2) Cut out the circuit path 7-2 on the metal foil material 7-1 according to the set circuit path, as shown in step a in FIG. 1 . The thickness of the metal foil is 0.1-0.5mm, the rotation speed of the cutter is 50-200r/s, the moving speed of the cutter is 0.5-1m/s, and the chamfering of the edge of the cutter is 0.5-2mm; clean the metal foil with alcohol after cutting and blow dry;

(3) Consolidate the metal foil into shape through an ultrasonic consolidation device, as shown in step b in Figure 1. The power of ultrasonic consolidation is 2-4KW. After consolidation and forming, cut off the excess metal foil with a cutter. The cutting speed of the cutter is 1-3m/s, and the pressure of the cutter is 1-2 tons;

(4) Lay a layer of ABS or PLA polymer insulating material 7-3 in the circuit track 7-2 of the consolidated metal foil, as in step c in FIG. 1 . The laying speed is 0.5-1m/s, and the boundary chamfer is 0.5-1mm;

(5) Spray a layer of conductive ink, conductive paint and other conductive materials 7-4 on the insulating material of the circuit track of the consolidated metal foil, as shown in step d in Figure 1;

(6) Lay a layer of ABS or PLA polymer insulating material on top of the conductive material of the consolidated metal foil;

(7) Repeat steps 2-6 to carry out the compounding of the next layer of metal foil;

(8) Repeat the above steps to accumulate and superimpose layer by layer, so as to obtain a metal composite board with a built-in circuit.

Example 1: A method for additively manufacturing iron-aluminum composite panels with built-in circuits

(1) Model the iron-aluminum composite board that needs a built-in circuit, set the circuit path and position in the iron-aluminum composite board, repair the model with Magic software, and then slice the model with Autofab software, the thickness of the slice is iron foil The thickness of the material, in which the thickness of the iron foil material is the same as that of the aluminum foil material. The forming accuracy is controlled at 1mm;

(2) Cut out the circuit path on the iron foil material according to the set circuit path. The thickness of the iron foil is 0.5mm, the rotation speed of the cutter is 50r/s, the moving speed of the cutter is 0.5m/s, and the chamfering of the edge of the cutter is 0.5mm; after cutting, clean the iron foil with alcohol and dry it;

(3) The iron foil material is consolidated and formed by an ultrasonic consolidation device. The ultrasonic consolidation power is 2KW. After consolidation and forming, cut off the excess iron foil with a cutter, the cutting speed of the cutter is 1m/s, and the pressure of the cutter is 1 ton;

(4) Lay a layer of ABS polymer insulating material in the circuit track of the consolidated iron foil. The laying speed is 0.5m/s, and the boundary chamfer is 0.5mm;

(5) Spray a layer of conductive ink on the insulating material of the circuit track of the consolidated iron foil;

(6) Lay a layer of ABS polymer insulating material on top of the conductive material of the consolidated iron foil;

(7) Repeat steps 2-6 to compound the next layer of aluminum foil;

(8) Repeat the above steps, accumulate and superimpose layer by layer, so as to obtain the iron-aluminum composite board with built-in circuit, as shown in Figure 2.

Example 2:

A method for additively manufacturing titanium-aluminum composite board with built-in circuit

(1) Model the titanium-aluminum composite board that needs a built-in circuit, set the circuit path and position in the titanium-aluminum composite board, repair the model with Magic software, and then slice the model with Autofab software, the thickness of the slice is titanium foil The thickness of the material, in which the thickness of the titanium foil is the same as that of the aluminum foil. The forming accuracy is controlled at 1mm;

(2) Cut out the circuit path on the titanium foil according to the set circuit path. The thickness of the titanium foil is 0.2mm, the rotation speed of the cutter is 80r/s, the moving speed of the cutter is 0.8m/s, and the chamfering of the cutter boundary is 0.8mm; after cutting, clean the iron foil with alcohol and dry it;

(3) Consolidate the titanium foil into shape through an ultrasonic consolidation device. The ultrasonic consolidation power is 3KW. After consolidation and forming, cut off the excess iron foil with a cutter, the cutting speed of the cutter is 2m/s, and the pressure of the cutter is 2 tons;

(4) Lay a layer of ABS polymer insulating material in the circuit track of the consolidated titanium foil. The laying speed is 0.8m/s, and the boundary chamfer is 0.5mm;

(5) Spray a layer of conductive paint on the insulating material of the circuit track of the consolidated titanium foil;

(6) Lay a layer of PLA polymer insulating material on top of the conductive material of the consolidated titanium foil;

(7) Repeat steps 2-6 to compound the next layer of aluminum foil;

(8) Repeat the above steps to accumulate and superimpose layer by layer, so as to obtain the titanium-aluminum composite board with built-in circuit.

Example 3:

A method for additively manufacturing titanium-iron composite board with built-in circuit

(1) Model the titanium-iron composite board that needs a built-in circuit, set the circuit path and position in the titanium-iron composite board, use Magic software to repair the model, and then use Autofab software to slice the model, and the thickness of the slice is titanium foil The thickness of the material, in which the thickness of the titanium foil is the same as that of the iron foil. The forming accuracy is controlled at 0.5mm;

(2) Cut out the circuit path on the titanium foil according to the set circuit path. The thickness of the titanium foil is 0.3mm, the rotation speed of the cutter is 90r/s, the moving speed of the cutter is 0.75m/s, and the chamfering of the cutter boundary is 0.5mm; after cutting, clean the iron foil with alcohol and dry it;

(3) Consolidate the titanium foil into shape through an ultrasonic consolidation device. The ultrasonic consolidation power is 4KW. After consolidation and forming, cut off the excess titanium foil with a cutter. The cutting speed of the cutter is 2.5m/s, and the pressure of the cutter is 1.5 tons;

(4) Lay a layer of ABS polymer insulating material in the circuit track of the consolidated titanium foil. The laying speed is 0.75m/s, and the boundary chamfer is 0.45mm;

(5) Spray a layer of conductive paint on the insulating material of the circuit track of the consolidated titanium foil;

(6) Lay a layer of PLA polymer insulating material on top of the conductive material of the consolidated titanium foil;

(7) Repeat steps 2-6 to carry out the compounding of the next layer of iron foil;

(8) Repeat the above steps, accumulate and superimpose layer by layer, so as to obtain the titanium-iron composite board with built-in circuit.

The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Within the scope of knowledge of those of ordinary skill in the art, various modifications can be made without departing from the gist of the present invention. kind of change.

Claims (6)

1. a kind of method of increasing material manufacturing built-in circuit composite metal plate, which is characterized in that carry out as follows:

(1) composite metal plate for needing built-in circuit is modeled, circuit paths and position in composite metal plate is set, used Magic software repairs model, is then sliced with Autofab software to the model；

(2) circuit paths are cut into according to the circuit paths set out on metal foil；

(3) by ultrasonic consolidation device, metal foil consolidation is cut excess metal foil with cutter after consolidation Fall；

(4) one layer of insulating materials is laid in the circuit paths of the metal foil after consolidation；

(5) layer of conductive material is sprayed on the insulating materials after consolidation；

(6) one layer of insulating materials is being laid with above the conductive material after consolidation；

(7) step 2-step 6 is repeated, the compound of next layer of metal foil is carried out；

(8) it repeats the above steps, metal foil, which is successively accumulated, to add up, and obtains the composite metal plate of built-in circuit.

2. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described In step (1), slice thickness is metal foil thickness, and forming accuracy is controlled in ± 1mm.

3. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described In step (2), for metal foil with a thickness of 0.1-0.5mm, cutter rotation speed is 50-200r/s, and cutter movement speed is 0.5- 1m/s, cutter boundary chamfering are 0.5-2mm；It with alcohol washes metal foil and is dried up after cutting.

4. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described In step (3), ultrasonic consolidation power is 2-4KW, and cutter cutting speed is 1-3m/s, and cutter pressure is 1-2 tons.

5. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described In step (4), laying insulating materials is ABS or PLA insulating polymeric material, and laying speed 0.5-1m/s, boundary chamfering is 0.5-1mm。

6. a kind of method of increasing material manufacturing built-in circuit composite metal plate according to claim 1, it is characterised in that: described In step (5), spraying conductive material is conductive ink or conductive paint conductive material.