CN107743345A - Electronic equipment - Google Patents

Abstract

The present disclosure relates to an electronic device, which includes a front case assembly and a back plate, the front case assembly includes a first mating surface, the back plate includes a second mating surface, the second mating surface and the An oblique fit is formed between the first mating surfaces. In the present disclosure, the first mating surface of the front shell assembly can form an oblique fit with the second mating surface of the back plate, so that a larger tolerance limit can be allowed during assembly between the front shell assembly and the back plate, so that Assembly can still be carried out within a certain range where the actual fitting tolerance exceeds the maximum allowable tolerance, which is beneficial to improving the yield rate of electronic equipment.

Description

Electronic equipment

technical field

The present disclosure relates to the technical field of terminals, and in particular, to an electronic device.

Background technique

At present, the appearance parts of electronic equipment usually include a backplane and a front shell assembly, through which the front shell assembly and the backplane can cooperate to form an accommodation space, and the accommodation space can place electric boards, main boards and other flexible circuit boards, etc. These electric boards, The main board and the flexible circuit board are connected to each other to maintain the normal operation of the electronic equipment.

Contents of the invention

The present disclosure provides an electronic device to solve the deficiencies in the related art.

According to an embodiment of the present disclosure, an electronic device is provided, including a front case assembly and a back plate, the front case assembly includes a first mating surface, the back plate includes a second mating surface, and the second mating surface and the An oblique fit is formed between the first mating surfaces.

Optionally, the first mating surface is located on at least one side of the front case assembly and is inclined toward the outside of the electronic device.

Optionally, the first mating surface includes a first slope and a second slope located at a set of opposite sides of the front case assembly, the first slope and the second slope both face the electronic device of the exterior.

Optionally, the first mating surface includes a third slope and a fourth slope located at a set of opposite sides of the front shell assembly, and the third slope and the fourth slope are parallel to each other.

Optionally, the first mating surface includes a fifth inclined surface and a vertical surface at a group of opposite sides of the front case assembly, the fifth inclined surface faces the outside of the electronic device, the vertical surface The surface is arranged along the thickness direction of the electronic device.

Optionally, the angle formed between the first mating surface and the thickness direction of the electronic device is no greater than thirty degrees.

Optionally, the angle formed between the second mating surface and the thickness direction of the electronic device is no smaller than the angle formed between the first mating surface and the thickness direction of the electronic device.

Optionally, in the assembly direction of the first mating surface and the second mating surface, the specifications of the first mating surface match the specifications of the second mating surface.

Optionally, after the first mating surface and the second mating surface are mated in place, the exterior surface of the front shell assembly is mated with the exterior surface of the back panel.

Optionally, glue is applied between the first mating surface and the second mating surface.

It can be seen from the above-mentioned embodiments that the first mating surface of the front shell assembly of the present disclosure can form an oblique fit with the second mating surface of the back plate, so that a larger gap can be allowed during assembly between the front shell assembly and the back plate. Tolerance limits, so that assembly can still be carried out within a certain range where the actual fit tolerance exceeds the maximum allowable tolerance, which is conducive to improving the yield rate of electronic equipment.

It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure.

Description of drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the disclosure and together with the description serve to explain the principles of the disclosure.

Fig. 1 is an exploded schematic view of an electronic device according to an exemplary embodiment.

Fig. 2 is a schematic cross-sectional view of an electronic device according to an exemplary embodiment.

Fig. 3 is a schematic structural diagram of an electronic device according to an exemplary embodiment.

Fig. 4 is a schematic cross-sectional view of another electronic device according to an exemplary embodiment.

Fig. 5 is a schematic cross-sectional view of another electronic device according to an exemplary embodiment.

Fig. 6 is a schematic cross-sectional view of another electronic device according to an exemplary embodiment.

Fig. 7 is an assembly schematic diagram of an electronic device according to an exemplary embodiment.

detailed description

Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term "and/or" as used herein refers to and includes any and all possible combinations of one or more of the associated listed items.

It should be understood that although the terms first, second, third, etc. may be used in this application to describe various information, the information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another. For example, without departing from the scope of the present application, first information may also be called second information, and similarly, second information may also be called first information. Depending on the context, the word "if" as used herein may be interpreted as "at" or "when" or "in response to a determination."

Fig. 1 is an exploded schematic view of an electronic device according to an exemplary embodiment. As shown in FIG. 1 , the electronic device 100 includes a front case assembly 1 and a back plate 2 assembled with each other. The cooperation between the back plate 2 and the front case assembly 1 forms an internal space for accommodating electronic components of the electronic device 100 . Wherein, as shown in FIG. 2 , the front shell assembly 1 may include a first mating surface 11, the back plate 2 may include a second mating surface 21, and an oblique fit may be formed between the second mating surface 21 and the first mating surface 11, thereby When the front case assembly 1 and the back plate 2 are assembled, a larger tolerance limit can be allowed, so that the assembly can still be carried out within a certain range where the actual fitting tolerance exceeds the maximum allowable tolerance, which is beneficial to improving the yield rate of electronic equipment.

In this embodiment, the oblique fit formed between the first mating surface 11 and the second mating surface 12 can be located on any side of the electronic device 100, for example, as indicated by arrows A and B shown in FIG. There are ramp mates at the sides shown. Correspondingly, the first mating surface 11 on the front shell assembly 1 can also be located at any side of the front shell assembly 1, for example, as shown in FIG. 4, the first mating surface 11 is located at the first side 12, or The first mating surface 11 may also be located at the second side 13 opposite to the first side 12 on the front shell assembly 1 , which is not limited in the present disclosure.

In an embodiment, still taking the embodiment shown in FIG. 4 as an example, the first mating surface 11 may include a first inclined surface 111 and a second inclined surface 112 located at a set of opposite sides of the front shell assembly 1 . For example, the first slope 111 may be located at the first side 12 shown in FIG. 2 , and the second slope 112 may be located at the second side 13 opposite to the first side. Correspondingly, the second matching surface 21 may include a first inclined matching surface 211 matching with the first inclined surface 111 and a second inclined matching surface 212 matching with the second inclined surface 112 . Wherein, both the first slope 111 and the second slope 112 may be oriented to the outside of the electronic device, so that when the electronic device 100 is assembled, a set of side edges set opposite to each other can allow the actual fit tolerance to exceed a certain range of the maximum allowable tolerance, Improve assembly yield. Wherein, the two sets of oppositely disposed sides on the front shell assembly 1 are all disposed on inclined planes, which is not limited in the present disclosure.

In another embodiment, as shown in FIG. 5 , the first mating surface 11 may include a third inclined surface 113 and a fourth inclined surface 114 located at a set of opposite sides of the front shell assembly 1 . For example, the third slope 113 may be located at the first side 12 of the electronic device, and the fourth slope 114 may be located at the second side 13 of the electronic device. Correspondingly, the second matching surface 21 may include a third inclined surface 213 matching with the third inclined surface 113 and a fourth inclined surface 214 matching with the fourth inclined surface 114 . Wherein, the third slope 113 and the fourth slope 114 can be parallel to each other, that is, one of the slopes can be set toward the outside of the electronic device 100, and the other can be set toward the inside of the electronic device 100, so that the backplane 2 can be inclined downwards. Assembled to the front shell assembly 1 in a manner, and the third inclined surface 113 and the fourth inclined surface 114 can provide guidance to improve assembly efficiency.

In yet another embodiment, as shown in FIG. 6 , the first mating surface 11 may include a fifth inclined surface 115 and a vertical surface 116 located at a set of opposite sides of the front shell assembly 1 . For example, the fifth inclined surface 115 may be located at the first side 12 of the electronic device, and the vertical surface 116 may be located at the second side 13 of the electronic device. Correspondingly, the second mating surface 21 may include a fifth inclined mating surface 215 mating with the fifth inclined surface 115 and a vertical mating surface 216 mating with the vertical surface 116 . Wherein, either one of the fifth slope 115 and the vertical surface 116 can be set toward the outside of the electronic device 100, and the other can be set along the thickness direction of the electronic device 100. For example, the fifth slope 115 shown in FIG. The vertical surface 116 is disposed on the outside of the electronic device 100 along the thickness direction of the electronic device.

It should be noted that, in the above embodiment, only the first side 12 and the second side 13 oppositely disposed on the front shell assembly 1 are used as an example for illustration. In fact, the two sets of opposite sides of the front shell assembly 1 can form a bevel fit with the back plate 2; or, the adjacent sides of the front shell assembly 1 can form a bevel fit with the back plate 2. No more details here.

In each of the above-mentioned embodiments, the angle formed by the first mating surface 11 and the thickness direction of the electronic device 100 does not exceed 30 degrees, so as to avoid an increase in the area of the front case assembly 11 due to a large angle, which is conducive to maintaining the electronic device. 100 is a reasonable size. Further, the angle formed by the second mating surface 21 and the thickness direction of the electronic device 100 is not smaller than the angle formed by the first mating surface 11 and the thickness direction of the electronic device 100, so as to ensure that the second mating surface 21 can be smoothly assembled to the first mating surface 21. In the trumpet-shaped space formed by the mating surface 11, the rate of good products is improved.

In this embodiment, as shown in FIG. 7, on the assembly direction C of the first mating surface 11 and the second mating surface 21 (see the assembly state diagram from the upper side view to the lower side view in FIG. 7), the first mating The specifications of the surface 11 are compatible with the specifications of the second mating surface 12, for example, it can be the length of the inclined plane of the first mating surface 11 and the length of the inclined plane of the second mating surface 12, etc., or it can be the length of the inclined plane of the first mating surface 11 and the electronics. The angle formed by the thickness direction of the device 100 is adapted to the angle formed by the second mating surface 12 and the thickness direction of the electronic device 100, so that the back plate 2 can be smoothly assembled to the front shell assembly 1.

Wherein, when the first mating surface 11 and the second mating surface 21 are fitted in place, the appearance surface of the front shell assembly 1 and the appearance surface of the back plate 2 are matched to ensure a smooth joint between the front shell assembly 1 and the back plate 2. transition. For example, as shown in the lower side view of FIG. 7 , the arc transition between the appearance surface of the front case assembly 1 and the appearance surface of the back plate 2 improves the aesthetic appearance of the electronic device 100 . Further, after the cooperation between the first mating surface 11 and the second mating surface 21 is completed, it can be specified by dispensing glue to avoid slippage of the backboard 2 . Wherein, the electronic device 100 may include a mobile phone, a tablet computer, or an electronic reader, etc., which is not limited in the present disclosure.

Other embodiments of the disclosure will be readily apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any modification, use or adaptation of the present disclosure, and these modifications, uses or adaptations follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field not disclosed in the present disclosure . The specification and examples are to be considered exemplary only, with a true scope and spirit of the disclosure being indicated by the following claims.

It should be understood that the present disclosure is not limited to the precise constructions which have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. a kind of electronic equipment, it is characterised in that including front shell assemblies and backboard, the front shell assemblies include the first mating surface, The backboard includes the second mating surface, and inclined-plane is formed between second mating surface and first mating surface and is coordinated.

2. electronic equipment according to claim 1, it is characterised in that first mating surface is located at the front shell assemblies An at least side edge and towards the outside of the electronic equipment in inclined-plane set.

3. electronic equipment according to claim 1, it is characterised in that first mating surface includes being located at the fore shell group The first inclined-plane and the second inclined-plane at one group of relative side of part, first inclined-plane and second inclined-plane are towards the electricity The outside of sub- equipment.

4. electronic equipment according to claim 1, it is characterised in that first mating surface includes being located at the fore shell group The 3rd inclined-plane and the 4th inclined-plane at one group of relative side of part are mutually flat between the 3rd inclined-plane and the 4th inclined-plane OK.

5. electronic equipment according to claim 1, it is characterised in that first mating surface includes being located at the fore shell group The 5th inclined-plane and vertical plane at one group of relative side of part, the 5th inclined-plane is towards the outside, described of the electronic equipment Thickness direction of the vertical plane along the electronic equipment is set.

6. electronic equipment according to claim 1, it is characterised in that first mating surface and the thickness of the electronic equipment Spend direction angle and be not more than 30 degree.

7. electronic equipment according to claim 1, it is characterised in that second mating surface and the thickness of the electronic equipment Direction angle is spent not less than first mating surface and the thickness direction angle of the electronic equipment.

8. electronic equipment according to claim 1, it is characterised in that in first mating surface and second mating surface Assembly direction on, the specification of first mating surface is adapted to the specification of second mating surface.

9. electronic equipment according to claim 1, it is characterised in that in first mating surface and second mating surface After coordinating in place, the appearance of the front shell assemblies is engaged with the appearance of the backboard.

10. electronic equipment according to claim 1, it is characterised in that first mating surface and second mating surface Between dispensing fix.