CN107735715B - Pattern drawing device and pattern drawing method - Google Patents

Abstract

A pattern drawing device (EX) draws a predetermined pattern on a substrate (P) by performing main scanning of a Spot (SP) focused on the substrate (P) along a drawing line (S L) and by performing sub-scanning of the substrate (P), collects a1 st light beam (L Ba) reflected by a Polygon Mirror (PM) and projects the same as a spot (SPa) onto a1 st drawing line (S L a), and collects a2 nd light beam (L Bb) reflected by the Polygon Mirror (PM) and projects the same as a spot (SPb) onto a2 nd drawing line (S L b), wherein the two drawing lines (S L a, S L b) are positioned at the same position on the substrate (P) in the sub-scanning direction and are shifted in the main scanning direction.

Description

Pattern drawing device and pattern drawing method

technical field

The present invention relates to a pattern drawing device and a pattern drawing method for drawing a pattern by scanning a spot of a light beam irradiated on an object to be irradiated.

Background technique

As disclosed in Japanese Patent Application Laid-Open No. 2004-117865, there is known a technique in which, in a laser scanning device (color laser printer) that draws an image on a photoreceptor by scanning a laser beam, a single polygon mirror is used to scan a plurality of Each of the laser beams traces the image along multiple scan lines.

Japanese Patent Laid-Open No. 2004-117865 discloses a tandem-type laser scanning device in which scanning lines are arranged in parallel and spaced apart in the moving direction of the object to be irradiated, that is, in the sub-scanning direction. Generated by multiple laser beams deflected to scan using each of the different reflective surfaces of a polygon mirror. For the laser scanning device disclosed in Japanese Patent Application Laid-Open No. 2004-117865, the maximum size in the scanning line direction (main scanning direction) of an image that can be drawn on the irradiated body (photosensitive drum, etc.) is determined by the size of one scanning line. Length decides. Therefore, in order to increase the size of the image that can be drawn in the main scanning direction, it is necessary to enlarge the scanning optical system (lens, mirror, etc.) after the polygon mirror so that the scanning line becomes longer. On the other hand, in an exposure apparatus that draws and exposes a high-definition pattern for electronic circuits with a minimum line width of about several μm to 20 μm by scanning a light spot, it is necessary to make the size (diameter) of the light spot the smallest line It is about a fraction of the width (1/2 to 1/4) of the width, and it is necessary to control the intensity adjustment of the light spot corresponding to the data of the drawing pattern with high precision and high speed in synchronization with the projection position of the light spot on the scanning line. Change. However, if one scan line generated by deflected scanning of the beam passing through the polygon mirror is lengthened, it becomes difficult to stably maintain the scan line required for drawing a high-definition pattern along with the enlargement of the scanning optical system after the polygon mirror, etc. configuration accuracy or optical performance.

SUMMARY OF THE INVENTION

A first aspect of the present invention is a pattern drawing device that condenses a light beam from a light source device on an object to be irradiated in a spot shape, and performs main scanning along a predetermined scanning line on the condensed light spot, and A predetermined pattern is drawn on the irradiated object by sub-scanning the irradiated object, and the irradiated object is provided with a rotating polygon mirror that rotates around a rotation axis for the main scanning, and a first light guide optical system that extends from a first direction toward The rotating polygon mirror projects the first light beam from the light source device; the second light guide optical system projects the second light beam from the light source device toward the rotating polygon mirror from a second direction different from the first direction; the first projection an optical system for condensing the first light beam reflected by the rotating polygon mirror and projecting it on a first scanning line as a first spot; and a second projection optical system for condensing the second light beam reflected by the rotating polygon mirror The light beam is condensed and projected on the second scanning line as a second light spot; so that the first scanning line and the second scanning line are located on the irradiated object at the same position in the sub-scanning direction and on the main scanning line. The said 1st projection optical system and the said 2nd projection optical system are arrange|positioned so that a scanning direction may be shifted|deviated.

A second aspect of the present invention is a pattern drawing apparatus that sub-scans the irradiated body, which is a flexible long sheet substrate, in the longitudinal direction, and controls light whose intensity is modulated based on drawing data. The dots are mainly scanned along a scanning line extending in the width direction perpendicular to the longitudinal direction of the irradiated object, whereby a pattern corresponding to the drawing data is drawn on the irradiated object, and includes: a rotating polygon mirror , which rotates around the rotation axis for the above-mentioned main scanning; the first light-guiding optical system projects the first light beam from the first direction toward the above-mentioned rotating polygon mirror; the second light-guiding optical system projects from the second direction different from the above-mentioned first direction projecting a second light beam toward the rotating polygon mirror; a first projection optical system for condensing the first light beam reflected by the rotating polygon mirror and projecting it on a first scanning line as a first spot; and a second projection optics a system for condensing the second light beam reflected by the rotating polygon mirror and projecting it on a second scanning line as a second light spot; the scanning lengths of the first scanning line and the second scanning line are set as In the same manner, the first projection optical system and the second projection optical system are arranged in such a manner that the first scanning line and the second scanning line are separately set in the main scanning direction at an interval equal to or less than the scanning length.

A third aspect of the present invention is a pattern drawing method in which a light beam from a light source device is condensed on an object to be irradiated in a spot shape, and the condensed light spot is subjected to main scanning along a predetermined scanning line, and Sub-scanning the irradiated object to draw a predetermined pattern on the irradiated object includes the steps of: projecting a first light beam from the light source device toward a rotating polygon mirror from a first direction; The second light beam is projected toward the rotating polygon mirror from a second direction different from the first direction; by the rotation of the rotating polygon mirror, the first light beams and performing deflection scanning on the second light beam; condensing the first light beam reflected by the rotating polygon mirror and projecting it on a first scanning line as a first spot; and causing the second light beam reflected by the rotating polygon mirror Condensing light and projecting it on a second scanning line as a second light spot; the first scanning line and the second scanning line are located on the irradiated object at the same position in the sub-scanning direction, and in the main scanning direction Stagger on.

A fourth aspect of the present invention is a pattern drawing method in which light whose intensity is modulated based on drawing data is sub-scanned in the longitudinal direction of an object to be irradiated, which is a flexible long sheet substrate. The dots are mainly scanned along a scanning line extending in a width direction perpendicular to the longitudinal direction of the irradiated object, whereby a pattern corresponding to the drawing data is drawn on the irradiated object, which includes the steps of: A first light beam is projected toward the rotating polygon mirror from a first direction; a second light beam is projected toward the rotating polygon mirror from a second direction different from the first direction; The above-mentioned first light beam and the above-mentioned second light beam reflected by different reflecting surfaces of the mirror are subjected to deflection scanning; the above-mentioned first light beam reflected by the above-mentioned rotating polygon mirror is condensed and projected on the first scanning line as a first light spot; and condensing the second light beam reflected by the rotating polygon mirror and projecting it on a second scanning line as a second light spot; setting the respective scanning lengths of the first scanning line and the second scanning line to be the same, And the said 1st scanning line and the said 2nd scanning line are set apart from the space|interval of the said scanning length or less in the said main scanning direction.

A fifth aspect of the present invention is a pattern drawing device that condenses a light beam from a light source device on the irradiated object in a point-like manner while conveying the irradiated object in the sub-scanning direction, and condenses the irradiated object. The light spot performs main scanning along a scanning line orthogonal to the sub-scanning direction, whereby a predetermined pattern is drawn on the irradiated object, and includes: a rotating polygon mirror that rotates around a predetermined rotation axis; a first light guide optical system , projecting the first light beam from the light source device from the first direction toward the rotating polygon mirror; the second light guide optical system projects the second light beam from the light source device toward the rotating polygon mirror from a second direction different from the first direction. 2 light beams; a first projection optical system for condensing the above-mentioned first light beam reflected by the above-mentioned rotating polygon mirror and projecting it on a first scanning line as a first light spot; and a second projection optical system for making the above-mentioned rotating polygon mirror The mirror-reflected second light beam is condensed and projected on a second scanning line as a second light spot; and a drawing unit is provided for the irradiated object along the main scanning direction and the sub-scanning direction The above-mentioned rotating polygon mirror, the above-mentioned first light guide optical system, the above-mentioned second light guide optical system, and the above-mentioned first light guide optical system are integrally held in such a manner that the first scanning line and the second scanning line are staggered in parallel in at least one of the directions. The projection optical system and the second projection optical system are rotatable; the rotation center axis of the drawing unit is set to pass through the midpoint of the first scanning line and the second scanning line perpendicular to the irradiated object between the midpoints.

A sixth aspect of the present invention is a pattern drawing method for condensing a light beam from a light source device on the irradiated object in a spot shape while conveying the irradiated object in the sub-scanning direction, and condensing the condensed object. The light spot performs a main scan along a scanning line extending in a direction orthogonal to the sub-scanning direction, whereby a predetermined pattern is drawn on the irradiated object, which includes a step of: transmitting the first light beam from the light source device from the first Projecting the second light beam from the light source device toward the rotating polygon mirror in one direction; projecting the second light beam from the light source device toward the rotating polygon mirror from a second direction different from the first direction; The above-mentioned first light beam and the above-mentioned second light beam reflected by different reflecting surfaces of the mirror are subjected to deflection scanning; the above-mentioned first light beam reflected by the above-mentioned rotating polygon mirror is condensed and projected on the first scanning line as a first light spot; Condensing the second light beam reflected by the rotating polygon mirror and projecting it on a second scanning line as a second spot; For the rotation, the rotation center axis is perpendicular to the object to be irradiated, and is set between the midpoint of the first scanning line and the midpoint of the second scanning line.

A seventh aspect of the present invention is a pattern drawing device that performs a main scan on an object to be irradiated with a light beam from a light source device, and the object to be irradiated and the light beam to face the light beam in a direction intersecting with the main scan. A sub-scan, whereby a pattern is drawn on the object to be irradiated, comprising: a light deflecting member for changing the angle of the reflection surface for the main scan; and a first projection optical system for projecting a first light beam as an upper edge of the object to be irradiated The light beam scanned in the main scanning direction, the first light beam is a light beam projected from the first direction to the light deflection member and reflected by the reflection surface of the light deflection member; and a second projection optical system for projecting the second light beam as the The light beam scanned in the main scanning direction on the irradiated body, the second light beam is a light beam projected from a second direction different from the first direction to the light deflection member and reflected by the reflection surface of the light deflection member; The first projection optical system and the above-mentioned first projection optical system are arranged such that the first scanning line formed by the main scanning of the first light beam and the second scanning line formed by the main scanning of the second light beam are shifted in the main scanning direction. The second projection optical system.

Description of drawings

FIG. 1 is a diagram showing a schematic configuration of a device manufacturing system including an exposure apparatus for exposing a substrate according to the first embodiment.

2 is a diagram showing the arrangement relationship of the plurality of drawing units shown in FIG. 1 and the arrangement relationship of the drawing lines of each drawing unit provided on the irradiated surface of the substrate.

3 is a diagram showing the arrangement relationship of the drawing lines of each drawing unit when the ends of the drawing lines adjacent to each other in the main scanning direction are made to coincide with each other.

4 is a diagram showing the arrangement relationship of the drawing lines of each drawing unit when the ends of the drawing lines adjacent to each other in the scanning direction are overlapped with each other by a fixed length.

Fig. 5 is a configuration diagram of the drawing unit shown in Fig. 1 viewed from the -Yt (-Y) direction side.

FIG. 6 is a configuration diagram of the drawing unit shown in FIG. 5 viewed from the +Zt direction side.

FIG. 7 is a diagram showing an optical path of a light flux incident on a mirror through the optical element and the collimator lens shown in FIG. 5 , viewed from the +Zt direction side.

FIG. 8 is a diagram showing an optical path of a light beam incident from a mirror to a mirror of the drawing unit as viewed from the +Xt direction side.

FIG. 9 is a diagram showing an arrangement relationship between a reflection mirror and a condenser lens as a reflection member in the drawing unit shown in FIG. 5 when viewed in the XtZt plane.

FIG. 10 is a diagram showing the arrangement relationship of the reflecting mirror and the condenser lens as the reflecting member shown in FIG. 9 when viewed in the XtYt plane.

11A is a view of the state in which the reflection direction of a light beam incident in parallel on a mirror serving as a reflection member changes when the entire drawing unit shown in FIG. 5 is rotated by a predetermined angle around the central axis of rotation when viewed from the +Zt direction side FIG. 11B is a diagram showing the positional change of the light beam in the reflecting mirror as the reflecting member when the entire drawing unit shown in FIG. 5 is rotated by a predetermined angle from the side of the advancing direction of the light beam.

FIG. 12 is a view of a beam scanning system using a polygon mirror in Modification 1 of the first embodiment when viewed from the +Zt direction side.

FIG. 13 is a view when the beam scanning system of FIG. 12 is viewed from the +Xt direction side.

FIG. 14 is a view of the optical path of a light beam incident on and reflected by a polygon mirror in Modification 2 of the first embodiment when viewed from the +Zt direction side.

FIG. 15 is a view when the beam scanning system of FIG. 14 is viewed from the +Xt direction side.

16A is a view of the beam scanning system using a polygon mirror in Modification 4 of the first embodiment when viewed from the +Zt direction side, and FIG. 16B is a view of the beam scanning system of FIG. 16A viewed from the -Xt direction side.

FIG. 17 is a diagram showing the configuration of a part of the drawing unit in the second embodiment.

FIG. 18 is a configuration diagram of the drawing unit Ub of the third embodiment viewed from the -Yt (-Y) direction side.

FIG. 19 is a view showing the configuration from the polygon mirror toward the +Zt side in the drawing unit shown in FIG. 18 when viewed from the +Xt direction side.

FIG. 20 is a view showing the configuration from the polygon mirror toward the −Zt direction side in the drawing unit shown in FIG. 18 when viewed from the +Zt direction side.

21 is a diagram showing a situation in which the exposure area formed on the substrate as the electronic component forming area is divided into six along the Y (Yt) direction, and the pattern is drawn for each of the plurality of strip-shaped divided areas by six drawing lines an example of .

FIG. 22 is a diagram showing an example of the arrangement angle of the mirrors provided after the fθ lens according to the third embodiment.

23 is a diagram showing a configuration of an example of a light beam distribution system for distributing two light beams provided by the light source device 14 shown in FIG. 1 to each of the four drawing units in FIG. 2 .

FIG. 24 is a diagram for explaining the deflection state of the light beam between the polygon mirror and the subsequent reflecting mirrors of the drawing unit according to the fourth embodiment.

FIG. 25 is a graph showing characteristics based on an example of the incident angle dependence of the reflectance in the polygon mirror or the reflecting mirror of FIG. 24 .

FIG. 26 is a diagram showing the configuration of a control system of an acousto-optic modulation element (AOM) for adjusting the variation of the beam intensity due to the incident angle dependence of the reflectance of the mirror.

FIG. 27 is a timing chart showing an example of waveforms or timings of signals of each part in the control system of FIG. 26 .

Detailed ways

Hereinafter, the pattern drawing apparatus and pattern drawing method of the aspect of this invention are demonstrated in detail with reference to the accompanying drawings, with reference to a preferred embodiment. In addition, the aspect of this invention is not limited to these embodiment, The aspect which added various changes or improvement is included. That is, the constituent elements described below include constituent elements that can be easily assumed by the manufacturer, and substantially the same constituent elements, and the constituent elements described below can be appropriately combined. In addition, various omissions, substitutions, or changes of constituent elements can be made without departing from the scope of the present invention.

[1st Embodiment]

FIG. 1 : is a figure which shows the schematic structure of the element manufacturing system 10 containing the exposure apparatus EX which performs exposure processing with respect to the board|substrate (object) P of 1st Embodiment. In addition, in the following description, the XYZ orthogonal coordinate system with the gravitational direction as the Z direction is set, and unless otherwise specified, the X direction, the Y direction, and the Z direction will be described based on the arrows shown in the figure.

The component manufacturing system 10 is a manufacturing system constructed with a manufacturing line that manufactures, for example, a flexible display as an electronic component, a film-like touch panel, a film-like color filter for a liquid crystal display panel, or Flexible wiring sheets for soldering electronic parts, etc. Hereinafter, electronic components will be described on the premise of a flexible display. Examples of flexible displays include organic EL (Electroluminescence) displays, liquid crystal displays, and the like. The component manufacturing system 10 has a so-called roll-to-roll structure, that is, a flexible sheet-like (film-like) substrate (sheet substrate) P is wound into a roll shape (not shown in the figure). The supply roll shown sends out the board|substrate P, and after carrying out various processes to the board|substrate P sent out continuously, the board|substrate P after various processes is wound up by the collection|recovery roll which is not shown in figure. The board|substrate P has the strip|belt shape which the moving direction of the board|substrate P becomes a long-side direction (long strip), and a width direction becomes a short-side direction (short strip). The board|substrate P conveyed from the said supply roll is sequentially subjected to various processes by processing apparatus PR1, exposure apparatus (pattern drawing apparatus, beam scanning apparatus) EX, processing apparatus PR2, etc., and is wound up by the said recovery roll.

In addition, the X direction is a direction (conveyance direction) from the processing apparatus PR1 to the processing apparatus PR2 via the exposure apparatus EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is the width direction of the substrate P. As shown in FIG. The Z direction is a direction (upward direction) orthogonal to the X direction and the Y direction, and is parallel to the direction in which the gravitational force acts.

As the substrate P, for example, a resin film, or a foil made of a metal or alloy such as stainless steel, or the like can be used. As the material of the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, ethylene vinyl alcohol copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, At least one or more of polycarbonate resin, polystyrene resin and vinyl acetate resin. In addition, the thickness and rigidity (Young's modulus) of the substrate P may be within a range that does not cause the substrate P to be folded or irreversible when passing through the conveyance path of the exposure apparatus EX. range of folds. As the base material of the substrate P, films such as PET (Polyethylene terephthalate) or PEN (Polyethylenenaphthalate) having a thickness of about 25 μm to 200 μm are preferable sheets. Typical for substrates.

Since the board|substrate P may receive heat in each process performed by the processing apparatus PR1, the exposure apparatus EX, and the processing apparatus PR2, it is preferable to select the board|substrate P of the material with a remarkably small thermal expansion coefficient. For example, the thermal expansion coefficient can be suppressed by mixing an inorganic filler into the resin film. The inorganic filler may also be, for example, titanium oxide, zinc oxide, aluminum oxide, or silicon oxide. Moreover, the board|substrate P may be a single-layer body of an ultra-thin glass having a thickness of about 100 μm produced by a float method or the like, or may be a laminated body obtained by bonding the above-mentioned resin film, foil, etc. to the ultra-thin glass. .

Furthermore, the flexibility of the substrate P refers to the property of being able to bend the substrate P without being broken or broken even when a force of its own weight (its own weight) is applied to the substrate P. FIG. Moreover, the property which bends by the force of a self-weight degree is also included in flexibility. In addition, the degree of flexibility varies depending on the material, size, and thickness of the substrate P, the layer structure formed on the substrate P, and the environment such as temperature and humidity. In short, when the substrate P is correctly wound around the various conveyance rollers, rotary drums, and other conveyance direction changing members provided in the conveyance path in the component manufacturing system 10 of the first embodiment, it is possible to smoothly It can be said to be in the range of flexibility when the substrate P is conveyed without being bent to cause folds or damage (cracks or scratches).

The processing apparatus PR1 performs pre-processing on the board|substrate P exposed by the exposure apparatus EX. The processing apparatus PR1 conveys the substrate P processed in the previous step to the exposure apparatus EX. By this pre-processing, the board|substrate P conveyed to the exposure apparatus EX becomes the board|substrate (photosensitive board|substrate) P on which the photosensitive functional layer (photosensitive layer, photosensitive layer) was formed in the surface.

This photosensitive functional layer is apply|coated on the board|substrate P as a solution, and it becomes a layer (film) by drying. A typical photosensitive functional layer is a photoresist, but as a material that does not require development treatment, there are photosensitive silane coupling agents (SAM) that modify the lyophilic and lyophobic properties of the part irradiated with ultraviolet rays, or a photosensitive silane coupling agent (SAM) that is exposed to ultraviolet rays. The photosensitive reducing agent etc. of the plating reducing group are exposed on the part after irradiation. In the case of using a photosensitive silane coupling agent as the photosensitive functional layer, the pattern part after exposure to ultraviolet rays on the substrate P is modified from lyophobicity to lyophilicity. Therefore, it is possible to form a thin-film transistor ( TFT) and other electrodes, semiconductors, and pattern layers for insulating or connecting wiring. When a photosensitive reducing agent is used as a photosensitive functional layer, a plating reducing group is exposed on the pattern part after exposure to ultraviolet rays on the board|substrate P. Therefore, immediately after exposure, the substrate P is immersed in a plating solution containing palladium ions or the like for a fixed period of time, thereby forming (precipitating) a patterned layer of palladium. Such a plating process is an additive process, and in the case where an etching process as a subtractive process is premised, the substrate P conveyed to the exposure apparatus EX may be a substrate in which a base material is provided. It is PET or PEN, a metallic thin film such as aluminum (A1) or copper (Cu) is completely or selectively vapor-deposited on the surface thereof, and a photoresist layer is further laminated (laminated) on the metallic thin film.

In this 1st Embodiment, the exposure apparatus EX is the exposure apparatus of the direct drawing system which does not use a photomask, ie, the exposure apparatus of the so-called raster scan system. The exposure apparatus EX irradiates the irradiated surface (photosensitive surface) of the board|substrate P supplied from the processing apparatus PR1 with the light pattern corresponding to predetermined patterns, such as a circuit for a display, a wiring, etc.. Although it will be described in detail below, the exposure apparatus EX conveys the substrate P in the +X direction (sub-scanning direction), while following a predetermined scanning direction (Y direction) on the substrate P (irradiated surface of the substrate P). ) one-dimensionally scans (main scan) the light spot SP of the exposure light beam LB, and modulates (on/off) the intensity of the light spot SP at high speed according to pattern data (drawing data). Thereby, the light pattern corresponding to predetermined patterns, such as the circuit for a display, wiring, etc., is exposed and drawn on the irradiated surface of the board|substrate P. That is, by using the sub-scanning of the substrate P and the main scanning of the light spot SP, the light spot SP is relatively two-dimensionally scanned on the irradiated surface of the substrate P, and a predetermined pattern is drawn on the substrate P by exposure exposure. Moreover, since the exposure apparatus EX repeatedly subjects the substrate P to pattern exposure for electronic components, and the substrate P is conveyed along the conveyance direction (+X direction), a plurality of them are provided at predetermined intervals along the longitudinal direction of the substrate P. The exposure area W of the pattern is exposed by the exposure apparatus EX (refer to FIG. 2 ). Since the electronic element is formed in this exposure area W, the exposure area W is also an electronic element formation area. In addition, since an electronic element is comprised by overlapping a some pattern layer (patterned layer), the pattern corresponding to each layer is exposed by the exposure apparatus EX.

The processing apparatus PR2 performs post-step processing (for example, plating processing, development, etching processing, etc.) on the substrate P subjected to the exposure processing by the exposure apparatus EX. By this post-processing, the pattern layer of an element is formed on the board|substrate P.

As described above, since an electronic component is formed by stacking a plurality of pattern layers, one pattern layer is generated through at least each process of the component manufacturing system 10 . Therefore, in order to generate an electronic component, each process of the component manufacturing system 10 shown in FIG. 1 must be passed through at least twice. Therefore, a pattern layer can be laminated|stacked by attaching the collection|recovery roll on which the board|substrate P was wound up as a supply roll to another component manufacturing system 10. The above-described operations are repeated to form electronic components. Therefore, the processed substrate P is in a state in which a plurality of electronic components are connected along the longitudinal direction of the substrate P with a predetermined interval therebetween. That is, the board|substrate P becomes a board|substrate for multiple chamfering.

The collection roll which collect|recovered the board|substrate P formed in the state connected with electronic components can also be attached to the dicing apparatus which is not shown in figure. The dicing device to which the collection roll is attached divides (singed) the processed substrate P for each electronic component, thereby forming a plurality of individual electronic components. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (longitudinal direction), and 10 m or more in the longitudinal direction (longitudinal direction). In addition, the size of the board|substrate P is not limited to the said size.

Next, the exposure apparatus EX will be described in detail. The exposure apparatus EX is stored in a temperature-controlled chamber ECV. This temperature-controlled chamber ECV is set to take into consideration the hygroscopicity of the substrate P or the contamination of the substrate P caused by the transfer, by keeping the inside at a predetermined temperature and a predetermined humidity to suppress the temperature-induced change in the shape of the substrate P transferred inside. Humidity such as static electricity. The temperature control room ECV is arranged on the installation surface E of the manufacturing plant by passive or active vibration isolation units SU1 and SU2. The vibration isolation units SU1 and SU2 reduce vibration from the installation surface E. The installation surface E may be a surface specially laid on the installation base (pedestal) on the workshop floor, or may be the ground. The exposure apparatus EX is provided with at least the board|substrate conveyance mechanism 12, the light source apparatus 14, the exposure head 16, the control apparatus 18, and alignment microscopes AMa (AMa1-AMa4), AMb (AMb1-AMb4).

The substrate conveyance mechanism 12 conveys the substrate P conveyed from the processing apparatus PR1 to the processing apparatus PR2 at a predetermined speed. The conveyance path of the board|substrate P conveyed in the exposure apparatus EX is prescribed|regulated by this board|substrate conveyance mechanism 12. As shown in FIG. The substrate conveyance mechanism 12 includes an edge position controller EPC, a drive roller R1, a tension adjustment roller RT1, a rotary drum (cylindrical drum table) DR1, and tension adjustment in this order from the upstream side (-X direction side) in the conveyance direction of the substrate P. Roller RT2, rotating drum (cylindrical drum table) DR2, tensioning roller RT3, and driving roller R2.

The edge position controller EPC adjusts the position in the width direction (Y direction, that is, the short direction of the substrate P) of the substrate P conveyed from the processing apparatus PR1. That is, the edge position controller EPC makes the position of the width direction end portion (edge) of the substrate P conveyed with a predetermined tension applied in a range of about ±tens of μm to several tens of μm with respect to the target position (allowable). range), the substrate P is moved in the width direction, and the width direction position of the substrate P is adjusted. The edge position controller EPC includes a roller that hangs the substrate P with a predetermined tension applied thereto, and an edge sensor (edge detection) (not shown) that detects the position of an end (edge) in the width direction of the substrate P. department). The edge position controller EPC moves the roller of the edge position controller EPC in the Y direction based on the detection signal detected by the edge sensor to adjust the widthwise position of the substrate P. The drive roller (roller) R1 rotates while holding the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P toward the rotating drum DR1. The edge position controller EPC adjusts the width direction position of the board|substrate P so that the longitudinal direction of the board|substrate P conveyed to the rotary drum DR1 may become orthogonal to the central axis AXo1 of the rotary drum DR1. After the board|substrate P conveyed from the drive roller R1 is hung on the dancer roller RT1, it guide|induces to the rotating drum DR1.

The rotating drum (first rotating drum) DR1 has a central axis (first central axis) AXo1 extending in the Y direction and extending in a direction intersecting the direction of gravitational force, and a cylindrical drum having a fixed radius from the central axis AXo1. peripheral surface. The rotating drum DR1 makes a part of the substrate P follow (imitation) its outer peripheral surface (circumferential surface), bends and supports it in the shape of a cylindrical surface along the longitudinal direction, and rotates around the central axis AXo1 to move the substrate P to + Transfer in the X direction. The rotating drum DR1 supports the substrate P from the surface (back surface) side opposite to the surface on which the photosensitive surface is formed on the opposite side (+Z direction side) to the gravitational action direction side. The rotary drum DR1 supports the area (portion) on the board|substrate P by which the light beam spot from each drawing unit U1, U2, U5, U6 of the exposure head 16 mentioned later is projected by the peripheral surface. A shaft Sft1 supported by an annular bearing so that the rotary drum DR1 rotates around the central axis AXo1 is provided on both sides in the Y direction of the rotary drum DR1. The axis Sft1 rotates around the central axis AXo1 by applying torque from a rotational drive source (for example, a motor, a reduction mechanism, or the like), which is not shown, controlled by the control device 18 . Note that, for convenience, a plane including the central axis AXo1 and parallel to the YZ plane is referred to as a central plane Poc1.

After the board|substrate P carried out from the rotating drum DR1 is hung on the dancer roll RT2, it is guided to the rotating drum DR2 provided in the downstream side (+X direction side) rather than the rotating drum DR1. The rotating drum (second rotating drum) DR2 has the same configuration as that of the rotating drum DR1. That is, the rotating drum DR2 has a central axis (second central axis) AXo2 extending in the Y direction and extending in a direction intersecting the gravitational action direction, and a cylindrical outer peripheral surface having a fixed radius from the central axis AXo2. The rotating drum DR2 makes a part of the substrate P follow the outer peripheral surface (circumferential surface) of the substrate P to be bent and supported in a cylindrical shape in the longitudinal direction, and rotates around the central axis AXo2 to convey the substrate P in the +X direction . The rotating drum DR2 supports the board|substrate P from the back surface side on the opposite side (+Z direction side) of a gravitational action direction side. The rotary drum DR2 supports the area (portion) on the board|substrate P by which the light beam for drawing from each of the drawing units U3 and U4 of the exposure head 16 mentioned later is projected by its peripheral surface. The shaft Sft2 is also provided in the rotating drum DR2. The axis Sft2 rotates around the central axis AXo2 by applying torque from a rotational drive source (for example, a motor, a reduction mechanism, or the like), which is not shown, controlled by the control device 18 . The central axis AXo1 of the rotary drum DR1 and the central axis AXo2 of the rotary drum DR2 are in a parallel state. Note that, for convenience, a plane including the central axis AXo2 and parallel to the YZ plane is referred to as a central plane Poc2.

The board|substrate P carried out from the rotating drum DR2 is guided to the drive roller R2 after being hung on the dancer roller RT2. The drive roll (roll) R2 rotates while holding the front and back of the board|substrate P similarly to the drive roll R1, and conveys the board|substrate P to the processing apparatus PR2. The tensioning roller RT1 - the tensioning roller RT3 are elastically pressed in -Z direction, and apply predetermined tension to the board|substrate P wound and supported by rotating drum DR1, DR2 along the longitudinal direction. Thereby, the tension|tensile_strength in the longitudinal direction which is given to the board|substrate P hung on rotating drum DR1, DR2 is stabilized in a predetermined range. Moreover, the control apparatus 18 rotates the drive rollers R1 and R2 by controlling the rotation drive source (for example, a motor, a reduction mechanism, etc.) which is not shown in figure.

The light source device 14 has a light source (pulse light source), and emits a pulsed light beam (pulse light, laser light) LB to each of the drawing unit U1 - the drawing unit U6 . The light beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the emission frequency of the light beam LB is set to Fs. The light source device 14 emits light at the emission frequency Fs and emits the light beam LB under the control of the control device 18 .

The exposure head 16 includes a plurality of drawing units U ( U1 to U6 ) into which the light beams LB from the light source device 14 respectively enter. The exposure head 16 draws a pattern with respect to a part of the board|substrate P supported by the peripheral surface of rotary drum DR1, DR2 by several drawing units U (U1-U6). The exposure head 16 is a so-called multi-beam type exposure head by having a plurality of drawing units U ( U1 to U6 ) having the same configuration. The drawing units U1, U5, U2, and U6 are provided above the rotating drum DR1, and the drawing units U3 and U4 are provided above the rotating drum DR2. The drawing units U1 and U5 are arranged on the upstream side (-X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc1, and are arranged at a predetermined interval along the Y direction. The drawing units U2 and U6 are arranged on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc1 , and are arranged at a predetermined interval along the Y direction. Moreover, the drawing unit U3 is arrange|positioned on the upstream side (-X direction side) of the conveyance direction of the board|substrate P with respect to center surface Poc2. The drawing unit U4 is arranged on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc2. The drawing units U1 and U5 and the drawing units U2 and U6 are arranged symmetrically with respect to the center plane Poc1 , and the drawing units U3 and U4 are arranged symmetrically with respect to the center plane Poc2 .

Each of the drawing units U ( U1 to U6 ) causes the two light beams LB from the light source device 14 to converge on the irradiated surface of the substrate P, respectively, and project them on the irradiated surface (photosensitive surface) of the substrate P, along the predetermined two beams. The drawing lines (scanning lines) SLa and SLb scan the two light spots SP converged on the irradiated surface of the substrate P one-dimensionally. Although the configuration of the drawing unit U will be described in detail below, in the first embodiment, one drawing unit U is provided with one rotating polygon mirror (beam deflector, light deflecting member) and two fθ lenses. In the system (scanning optical system), one drawing unit U ( U1 - U6 ) forms scanning lines generated by light spots SP at two different places on the substrate P, respectively. Therefore, the two light beams LB are sent to each of the drawing units U from the light source device 14 . In addition, the light beam LB from the light source device 14 is branched into a plurality of light beams LB by a light beam distribution system through which the two light beams LB are incident on each of the drawing units U ( U1 to U6 ) as two light beams LB. The reflector and beam splitter shown in the figure are constituted.

Each drawing unit U ( U1 - U6 ) irradiates the substrate P with the two light beams LB in the XZ plane so that the two light beams LB advance toward the central axis AXo1 of the rotary drum DR1 or the central axis AXo2 of the rotary drum DR2 . As a result, the optical paths (central axes of the light beams) of the two light beams LB traveling from the respective drawing units U ( U1 to U6 ) toward the two drawing lines SLa and SLb on the substrate P are identical to the irradiated beams on the substrate P in the XZ plane. The normals of the faces are parallel. In the first embodiment, the optical path (beam center axis) of the light beam LB traveling from the drawing units U1 and U5 toward the rotating drum DR1 is set so that the angle with respect to the center plane Poc1 becomes -θ1. The optical path (light beam center axis) of the light beam LB traveling from the drawing units U2 and U6 toward the rotating drum DR2 is set so that the angle with respect to the center plane Poc1 becomes +θ1. Moreover, the optical path (light beam center axis) of the light beam LB advancing toward the rotating drum DR2 from the drawing unit U3 is set so that the angle with respect to the center plane Poc2 may be -θ1. The optical path (light beam center axis) of the light beam LB traveling from the drawing unit U4 toward the rotating drum DR2 is set so that the angle with respect to the center plane Poc2 becomes +θ1. Further, each drawing unit U ( U1 to U6 ) irradiates the substrate P so that the light beam LB irradiated on the two drawing lines SLa and SLb is perpendicular to the irradiated surface of the substrate P in a plane parallel to the YZ plane Beam LB. That is, in the main scanning direction of the light spot SP on the irradiated surface, the light beam LB projected on the substrate P is scanned in a telecentric state.

As shown in FIG. 2 , the plurality of rendering units U ( U1 to U6 ) are arranged in a predetermined arrangement relationship. The two drawing lines SLa and SLb of each drawing unit U ( U1 to U6 ) extend along the main scanning direction, that is, the Y direction, and are at the same position in the sub-scanning direction (X direction) on the irradiated surface of the substrate P, and are located at the same position in the sub-scanning direction (X direction). The main scanning direction (Y direction) is staggered and arranged. That is, the drawing lines SLa and SLb of the drawing units U ( U1 to U6 ) are arranged in a parallel state only in the main scanning direction (Y direction) separated from each other. In addition, the scanning lengths (lengths) of the drawing lines SLa and SLb are set to the same length, and the drawing lines SLa and SLb are set to be separated from each other at intervals equal to or less than the scanning length in the main scanning direction.

The plurality of drawing units U ( U1 to U6 ) are arranged so that the drawing lines SLa and SLb of the plurality of drawing units U ( U1 to U6 ) are in the Y direction (the width direction of the substrate P, the main scanning direction) as shown in FIG. 2 . connected without being separated from each other. Each of the drawing units U ( U1 to U6 ) can be rotated slightly around the rotation center axis AXr, for example, within a range of ±1.5 degrees, with a resolution of μrad, to scan the drawing lines (scanning lines) SLa, The slope of SLb can be adjusted. The rotation center axis AXr is perpendicular to the substrate P and passes through the center point (midpoint) of a line segment connecting the midpoint of the drawing line (first scanning line) SLa and the midpoint of the drawing line (second scanning line) SLb axis. An extension line of this axis intersects the central axis AXo1 of the rotary drum DR1 or the central axis AXo2 of the rotary drum DR2 in FIG. 1 . In addition, in the first embodiment, the drawing line SLa and the drawing line SLb of each drawing unit U ( U1 to U6 ) are at the same position in the sub-scanning direction and are separated from each other in the main-scanning direction. Therefore, the center of rotation is The axis AXr is arranged on a straight line passing through the drawing lines SLa and SLb, and is arranged at the center point of the gap between the drawing line SLa and the drawing line SLb.

If the drawing units U ( U1 to U6 ) are slightly rotated (rotated) around the rotation center axis AXr, the drawing lines SLa and SLb of the light spot SP of the scanning beam LB will also be rotated around the rotation center axis AXr accordingly. move (rotate). Accordingly, if the drawing units U ( U1 to U6 ) are rotated by a fixed angle, the drawing lines SLa and SLb are accordingly centered on the rotation center axis AXr and inclined by a fixed angle with respect to the Y direction (Y axis). Each of the above-described drawing units U ( U1 to U6 ) is rotated around the central axis of rotation AXr by a highly responsive drive mechanism including an actuator, not shown, under the control of the control device 18 .

In addition, the two drawing lines SLa and SLb of the drawing unit U1 may be represented by SL1a and SL1b, and similarly, the two drawing lines SLa and SLb of the drawing units U2 to U6 may be represented by SL2a, SL2b to SL6a, and SL6b. In addition, the drawing lines SLa and SLb may be collectively referred to only as the drawing line SL.

As shown in FIG. 2, the scanning area is shared by each drawing unit U ( U1 - U6 ) so that the whole width direction of the exposure area W may be completely covered by the plurality of drawing units U ( U1 - U6 ). Thereby, each drawing unit U ( U1 - U6 ) can draw a pattern in the some area|region divided|segmented along the width direction of the board|substrate P. For example, if the scanning length (length) of the drawing line SL is about 20 mm to 40 mm, by arranging a total of six drawing units U in the Y direction, the width in the Y direction that can be drawn is enlarged to about 240 mm to 480 mm. The lengths (scanning lengths) of the respective drawing lines SL ( SL1 a , SL1 b to SL6 a , SL6 b ) are basically the same. That is, the scanning distance of the light spot SP of the light beam LB scanned along each of the plurality of drawing lines SL ( SL1 a , SL1 b to SL6 a , SL6 b ) is basically the same. In addition, when the width of the exposure region W is to be increased, it can be dealt with by extending the length of the drawing lines SL (SLa, SLb) itself, or by increasing the number of drawing units U arranged in the Y direction.

The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, and SL6b are located on the irradiated surface of the substrate P supported by the rotating drum DR1. The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, and SL6b are arranged in two rows along the circumferential direction of the rotating drum DR1 with the center plane Poc1 therebetween. The drawing lines SL1a, SL1b, SL5a, and SL5b are located on the irradiated surface of the substrate P on the upstream side (-X direction side) of the substrate P in the conveyance direction with respect to the center plane Poc1. The drawing lines SL2a, SL2b, SL6a, and SL6b are located on the irradiated surface of the substrate P on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc1.

The drawing lines SL3a, SL3b, SL4a, and SL4b are located on the irradiated surface of the substrate P supported by the rotating drum DR2. The drawing lines SL3a, SL3b, SL4a, and SL4b are arranged along the circumferential direction of the rotating drum DR2 in two rows with the center plane Poc2 therebetween. The drawing lines SL3a and SL3b are located on the irradiated surface of the substrate P on the upstream side (-X direction side) of the substrate P in the conveyance direction with respect to the center plane Poc2. The drawing lines SL4a and SL4b are located on the irradiated surface of the substrate P on the downstream side (+X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc2. The drawing lines SL1a, SL1b to SL6a, SL6b are substantially parallel to the width direction of the substrate P, that is, the central axes AXo1, AXo2 of the rotating drums DR1, DR2.

The odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b are arranged on a straight line along the width direction (scanning direction) of the substrate P in the Y direction (the width direction of the substrate P) at predetermined intervals. The even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b are also arranged on a straight line at a predetermined interval along the width direction of the substrate P in the Y direction. At this time, the drawing line SL1b is arranged between the drawing line SL2a and the drawing line SL2b in the Y direction. The drawing line SL3a is arranged between the drawing line SL2b and the drawing line SL4a in the Y direction. The drawing line SL3b is arranged between the drawing line SL4a and the drawing line SL4b in the Y direction. The drawing line SL5a is arranged between the drawing line SL4b and the drawing line SL6a in the Y direction. The drawing line SL5b is arranged between the drawing line SL6a and the drawing line SL6b in the Y direction. That is, the drawing lines SL are arranged in the Y direction in the order of SL1a, SL2a, SL1b, SL2b, SL3a, SL4a, SL3b, SL4b, SL5a, SL6a, SL5b, SL6b in this order from the -Y direction side The drawn patterns are in contact with the ends in the Y direction.

The scanning direction of the light spot SP of the light beam LB scanned along each of the odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b is a one-dimensional direction, and is the same direction (+Y direction). The scanning direction of the light spot SP of the light beam LB scanned along each of the even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b is a one-dimensional direction, and is the same direction (-Y direction). The scanning direction (+Y direction) of the light spot SP of the light beam LB scanned along the above-mentioned odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, SL5b, and the even-numbered drawing lines SL2a, SL2b, SL4a, The scanning directions (-Y direction) of the light spots SP of the light beams LB scanned by SL4b, SL6a, and SL6b are directions opposite to each other. Thereby, the pattern drawn at the drawing start positions of the drawing lines SL1b, SL3a, SL3b, SL5a, and SL5b (the positions of the drawing start points) and the drawing start positions of the drawing lines SL2a, SL2b, SL4a, SL4b, and SL6a are in contact with each other. In addition, the pattern drawn at the drawing end positions of the drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b (the positions of the drawing end points) and the drawing end positions of the drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b connected. In addition, in the initial state, the odd-numbered drawing lines SL1a, SL1b, SL5a, and SL5b located on the straight line and the even-numbered drawing lines SL2a, SL2b, SL6a, and SL6b located on the straight line are along the conveyance direction of the substrate P (rotational direction). The circumferential direction of the drum DR1) is arranged to be spaced apart by a fixed length (interval length). Similarly, in the initial state, the odd-numbered drawing lines SL3a, SL3b located on the straight line and the even-numbered drawing lines SL4a, SL4b located on the straight line are spaced apart along the conveyance direction of the substrate P (circumferential direction of the rotating drum DR2). Open fixed length (interval length) configuration.

In addition, the width (X-direction dimension) of the drawing line SL is a thickness corresponding to the dimension (diameter) φ of the light spot SP. For example, when the effective size φ of the light spot SP is 3 μm, the width of the drawing line SL is also 3 μm. The light spot SP may be projected along the drawing line SL so as to overlap with a predetermined length (for example, half of the effective size φ of the light spot SP). In addition, the ends of the drawing lines SL adjacent to each other in the scanning direction (for example, the drawing end point of the drawing line SL1a and the drawing end point of the drawing line SL2a) may have a predetermined length (for example, the size φ of the light spot SP) half) overlap in the Y direction.

3 is a diagram showing the arrangement relationship of the drawing lines SLa and SLb of each drawing unit U when the ends of the drawing lines SL adjacent to each other in the main scanning direction are aligned (adjacent to each other). As shown in FIG. 3 , the scan lengths of the drawing lines SLa and SLb of the drawing unit U, and the Y-direction separation distance (gap) between the drawing line SLa and the drawing line SLb of the drawing unit U are all set to Lo. Therefore, the drawing lines SLa and SLb of the drawing units U1 , U3 , and U5 facing each other and the drawing units can be arranged so that the ends of the drawing lines SL adjacent to each other in the main scanning direction are adjacent to each other in the main scanning direction. Drawing lines SLa and SLb of U2, U4, and U6. In addition, the rotation center axis AXr of the drawing unit U is set to pass through the center point of the separation distance Lo between the drawing lines SLa and SLb.

4 is a diagram showing an arrangement relationship of the drawing lines SLa and SLb of each drawing unit U when the ends of the drawing lines SL adjacent in the scanning direction are overlapped with each other by α/2 (fixed length). As shown in FIG. 4 , the scan lengths of the drawing lines SLa and SLb are represented by Lo, and the Y-direction separation distance (gap) between the drawing line SLa and the drawing line SLb of the drawing unit U is represented by Lo−α. Therefore, the drawing lines SLa, SLb and The drawing lines SLa and SLb of the drawing units U2, U4, and U6 are drawn. In addition, the rotation center axis AXr of the drawing unit U is set to pass through the center point of the separation distance Lo-α between the drawing lines SLa and SLb.

The control apparatus 18 shown in FIG. 1 controls each part of the exposure apparatus EX. The control device 18 includes a computer, a recording medium on which a program is recorded, and the like, and the computer functions as the control device 18 of the first embodiment by executing the program. The alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) shown in FIG. 1 are used to detect the alignment marks MK (MK1 to MK4) formed on the substrate P shown in FIG. 2 . A plurality of alignment microscopes AMa (AMa1 to AMa4) are provided along the Y direction. Similarly, a plurality of alignment microscopes AMb ( AMb1 to AMb4 ) are also provided along the Y direction. The alignment marks MK ( MK1 to MK4 ) are reference marks for aligning the pattern drawn on the exposure region W on the irradiated surface of the substrate P and the substrate P so as to face each other. The alignment microscope AMa ( AMa1 to AMa4 ) is used to detect alignment marks MK ( MK1 to MK4 ) on the substrate P supported by the peripheral surface of the rotating drum DR1 . The alignment microscopes AMa ( AMa1 to AMa4 ) are installed closer to the positions (drawing lines SL1a, SL1b, SL5a, SL5b) of the spots SP of the light beams LB irradiated from the drawing units U1, U5 to the irradiated surface of the substrate P (drawing lines SL1a, SL1b, SL5a, SL5b). The upstream side (-X direction side) of the conveyance direction of the board|substrate P. Moreover, the alignment microscope AMb (AMb1-AMb4) detects the alignment mark MK (MK1-MK4) on the board|substrate P supported by the peripheral surface of the rotating drum DR2. The alignment microscope AMb ( AMb1 to AMb4 ) is installed upstream in the conveyance direction of the substrate P from the position (drawing lines SL3 a, SL3 b ) of the spot SP of the light beam LB irradiated from the drawing unit U3 to the irradiated surface of the substrate P side (-X direction side).

The alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) include a light source that projects illumination light for alignment on the substrate P, not shown, and an imaging element (Charge Coupled Device, CCD) that captures the reflected light. charge-coupled element), CMOS (Complementary Metal Oxide Semiconductor, complementary metal oxide semiconductor), etc.). The imaging signals captured by the alignment microscopes AMa ( AMa1 to AMa4 ) and AMb ( AMb1 to AMb4 ) are sent to the control device 18 . The microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) were aligned, and the alignment marks MK (MK1 to MK4) existing in the observation area (not shown) were imaged. The observation areas of the alignment microscopes AMa ( AMa1 to AMa4 ) and AMb ( AMb1 to AMb4 ) are provided along the Y direction, and are arranged according to the Y direction positions of the alignment marks MK ( MK1 to MK4 ). Therefore, the alignment microscopes AMa1 and AMb1 can image the alignment marks MK1, and similarly, the alignment microscopes AMa2 to AMa4 and AMb2 to AMb4 can image the alignment marks MK2 to MK4. The size of the observation area on the irradiated surface of the substrate P is set according to the size of the alignment marks MK ( MK1 to MK4 ) or the alignment accuracy (position measurement accuracy), and is about 100 μm to 500 μm square. The control device 18 detects the position of the alignment mark MK based on the imaging signals from the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). In addition, the illumination light for alignment is light of the wavelength band which has little sensitivity with respect to the photosensitive functional layer of the board|substrate P, for example, the light with a wavelength of about 500 nm - 800 nm. In addition, since the imaging elements of the alignment microscopes AMa and AMb need to photograph the alignment marks MK while the substrate P is moving, the shutter time is set to a high-speed shutter time corresponding to the conveyance speed of the substrate P (charge storage time, etc. for photographing). time).

Next, the configuration of the drawing unit U will be described. Since each drawing unit U has the same structure, in this 1st Embodiment, the drawing unit U2 is demonstrated as an example. Hereinafter, in the description of the drawing unit U, the orthogonal coordinate system XtYtZt is set in order to specify the arrangement of each member or light beam in the drawing unit U. The Yt axis of the orthogonal coordinate system XtYtZt is set parallel to the Y axis of the orthogonal coordinate system XYZ, and the orthogonal coordinate system XtYtZt is set to be inclined at a fixed angle around the Y axis with respect to the orthogonal coordinate system XYZ.

FIG. 5 is a configuration diagram of the drawing unit U2 viewed from the -Yt (-Y) direction side, and FIG. 6 is a configuration diagram of the drawing unit U2 viewed from the +Zt direction side. Of the two light beams LB incident on the drawing unit U2, one light beam LB is represented by LBa, and the other light beam LB is represented by LBb. In addition, the light spot SP of the light beam (first light beam) LBa may be represented by SPa, and the light spot SP of the light beam (second light beam) LBb may be represented by SPb. The light spot (1st light spot) SPa scans on the drawing line SL2a (SLa), and the light spot (2nd light spot) SPb scans on the drawing line SL2b (SLb).

In addition, in FIG. 6, for easy understanding, the light spots SPa and SPb are represented by thicker dots than the drawing lines SL2a and SL2b. 5 and 6 , the direction parallel to the rotation center axis AXr is the Zt direction, and the substrate P is placed on a plane orthogonal to the Zt direction from the processing apparatus PR1 to the processing apparatus PR2 via the exposure apparatus EX The direction of Xt is the Xt direction, and the direction perpendicular to the Xt direction on the plane orthogonal to the Zt direction is the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt in FIGS. 5 and 6 are rotated around the Y-axis and the three-dimensional coordinates of X, Y, and Z in FIG. 1 are rotated so that the Z-axis direction is parallel to the rotation center axis AXr. the three-dimensional coordinates.

The drawing unit U2 includes a mirror M1, a condenser lens CD, a triangular mirror M2, mirrors M3a, M3b, offset optical members (offset optical plates) SRa, SRb, beam shaping optical systems BFa, BFb, a mirror M4, Optical system of cylindrical lens CY1, mirror M5, polygon mirror PM, mirrors M6a, M6b, fθ lenses FTa, FTb, mirrors M7a, M7b, and cylindrical lenses CY2a, CY2b. These optical systems (reflecting mirror M1, condenser lens CD, etc.) are integrally formed in a highly rigid housing as one drawing unit U2. That is, the drawing unit U2 integrally holds these optical systems. For an optical system in which both light beams LBa and LBb are incident, only reference symbols are added, and for an optical system in which two light beams LBa and LBb are respectively incident and the two light beams LBa and LBb are arranged in pairs, the reference symbols are used in the optical system. Then add a and b. In short, for an optical system in which only the light beam LBa is incident, a is appended after the reference sign, and for an optical system in which only the light beam LBb is incident, b is appended after the reference sign.

As shown in FIG. 5 , the two light beams LBa, LBb from the light source device 14 are reflected by the mirror M8 after passing through the two optical elements AOMa, AOMb and the two collimating lenses CLa, CLb to be parallel to the Zt axis. The state is injected into the rendering unit U2. The two light beams LBa and LBb incident on the drawing unit U2 are incident on the mirror M1 along the rotation center axis AXr of the drawing unit U2 in the XtZt plane. 7 is a diagram showing the optical paths of light beams LBa and LBb incident on the mirror M8 through the optical elements AOMa and AOMb and the collimating lenses CLa and CLb as viewed from the +Zt direction side, and FIG. 8 is a view from the +Xt direction side from the reflection The mirror M8 is a diagram showing the optical paths of the light beams LBa and LBb incident on the mirror M1 of the unit U2. In addition, in FIG. 7 and FIG. 8 , it is also represented by the three-dimensional coordinate system of Xt, Yt, and Zt.

The optical elements AOMa and AOMb are permeable to the light beams LBa and LBb, and are acousto-optic modulation elements (AOM: Acousto-Optic Modulator). The optical elements AOMa and AOMb use ultrasonic waves (high-frequency signals) to diffract the incident light beams LBa and LBb at a diffraction angle corresponding to the frequency of the high-frequency wave, thereby changing the optical path of the light beams LBa and LBb, that is, the advancing direction. The optical elements AOMa and AOMb are turned on/off according to the drive signal (high-frequency signal) from the control device 18, and are turned on/off to generate diffracted light (primary diffraction) that diffracts the incident light beams LBa, LBb. beam).

When the drive signal (high frequency signal) from the control device 18 is turned off, the optical element AOMa passes the incident light beam LBa without diffracting it. Therefore, when the drive signal is turned off, the light beam Lba passing through the optical element AOMa is incident on an absorber (not shown) and not incident on the collimator lens CLa and the mirror M8. This means that the intensity of the light spot SPa projected on the irradiated surface of the substrate P is adjusted to a low level (zero). On the other hand, when the optical element AOMa is turned on by the drive signal (high-frequency signal) from the control device 18, a first-order diffracted light beam is generated by diffracting the incident light beam LBa. Therefore, when the drive signal is turned on, the first-order diffracted light beam deflected by the optical element AOMa (for convenience of description, the light beam LBa from the optical element AOMa) passes through the collimator lens CLa, and is incident on the Mirror M8. This means that the intensity of the light spot SPa projected on the irradiated surface of the substrate P is adjusted to a high level.

Similarly, when the drive signal (high-frequency signal) from the control device 18 is turned off, the optical element AOMb passes the incident light beam LBb without diffracting it. Therefore, the light beam LBb passing through the optical element AOMb, It is incident on an absorber (not shown) and is not incident on the collimator lens CLb and the mirror M8. This means that the intensity of the light spot SPb projected on the irradiated surface of the substrate P is adjusted to a low level (zero). On the other hand, when the optical element AOMb is turned on according to the drive signal (high frequency signal) from the control device 18, the incident light beam LBb is diffracted, so the light beam LBb deflected by the optical element AOMb (one time Diffracted beam), after passing through the collimating lens CLb, is incident on the mirror M8. This means that the intensity of the light spot SPb projected on the irradiated surface of the substrate P is adjusted to a high level. The control device 18 turns on/off the drive signal applied to the optical element AOMa at high speed according to the pattern data (bit map) of the pattern drawn by the drawing line SL2a, and based on the pattern data of the pattern drawn by the drawing line SL2b, The driving signal applied to the optical element AOMb is turned on/off at high speed. That is, the intensities of the light spots SPa and SPb are adjusted to a high level and a low level according to the pattern data. In addition, the light beams LBa and LBb incident on the optical elements AOMa and AOMb are condensed so as to have a beam waist in the optical elements AOMa and AOMb. Therefore, they are deflected and output by the optical elements AOMa and AOMb. The light beams LBa and LBb (first-order diffracted light beams) become diverging lights, and the collimating lenses CLa and CLb make the diverging lights into parallel light beams having a predetermined beam diameter.

The reflection mirror M8 reflects the incident light beams LBa and LBb in the −Zt direction, and guides them to the reflection mirror (reflection member) M1 of the drawing unit U2 . The light beams LBa and LBb reflected by the mirror M8 are incident on the mirror M1 of the drawing unit U2 in a symmetrical manner with respect to the rotation center axis AXr. At this time, the light beams LBa and LBb may or may not cross on the mirror M1. FIGS. 6 and 8 show an example in which the light beams LBa and LBb intersect at the position of the rotation center axis AXr on the mirror M1. That is, the light beams LBa and LBb are incident on the mirror M1 at a fixed angle with respect to the rotation center axis AXr. In the first embodiment, the light beams LBa and LBb are incident on the mirror M1 symmetrically with respect to the rotation center axis AXr along the Yt (Y) direction. In addition, it may be designed so that the light beams LBa and LBb are incident on the mirror M1 in parallel in a symmetrical manner with respect to the rotation center axis AXr.

Returning to the description of FIGS. 5 and 6 , the mirror M1 reflects the incident light beams LBa and LBb in the +Xt direction. The light beams LBa and LBb (respectively parallel light beams) reflected by the mirror M1 are gradually separated from each other by a fixed opening angle in the XtYt plane as shown in FIG. 6 . The condenser lens CD is a lens for condensing the respective central axes of the light beams LBa and LBb from the mirror M1 to be parallel to each other in the XtYt plane, and for condensing the light beams LBa and LBb at a predetermined focal position. The function of the condenser lens CD will be described below, and the front focal position of the condenser lens CD is set so as to be on or near the reflective surface of the mirror M1. The triangular mirror M2 reflects the light beam LBa passing through the condenser lens CD by 90 degrees to the -Yt (-Y) direction side and guides it to the mirror M3a, and directs the light beam LBb passing through the condenser lens CD to +Yt (+ The Y) direction side is reflected by 90 degrees and guided to the mirror M3b.

The mirror M3a reflects the incident light beam LBa by 90 degrees toward the +Xt direction side. The light beam LBa reflected by the reflection mirror M3a passes through the offset optical member (first offset optical member formed of a parallel flat plate) SRa and the beam shaping optical system BFa, and enters the reflection mirror M4. The mirror M3b reflects the incident light beam LBb toward the +Xt direction side by 90 degrees. The light beam LBb reflected by the reflection mirror M3b passes through the offset optical member (second offset optical member formed of a parallel flat plate) SRb and the beam shaping optical system BFb, and enters the reflection mirror M4. The triangular mirror M2 and the mirrors M3a and M3b widen the distance between the respective central axes of the light beams LBa and LBb in the Yt direction after passing through the condenser lens CD. The shift optical members SRa and SRb adjust the center positions of the light beams LBa and LBb in a plane (YtZt plane) orthogonal to the advancing direction of the light beams LBa and LBb. The offset optical members SRa and SRb have two quartz parallel plates parallel to the YtZt plane, one parallel plate can be inclined around the Yt axis, and the other parallel plate can be inclined around the Zt axis. The two parallel plates are inclined around the Yt axis and the Zt axis, respectively, thereby slightly shifting the positions of the centers of the light beams LBa and LBb two-dimensionally in the YtZt plane orthogonal to the advancing directions of the light beams LBa and LBb. The above-mentioned two parallel plates are driven by an actuator (driving part) not shown under the control of the control device 18 . The beam shaping optical systems BFa and BFb are optical systems for shaping the light beams LBa and LBb, for example, shaping the diameters of the light beams LBa and LBb condensed by the condenser lens CD to a predetermined size.

As shown in FIG. 5 , the mirror M4 reflects the light beams LBa and LBb from the beam shaping optical systems BFa and BFb in the −Zt direction. The light beams LBa and LBb reflected by the reflecting mirror M4 pass through the first cylindrical lens CY1 and are incident on the reflecting mirror M5. The reflecting mirror M5 reflects the light beams LBa and LBb from the reflecting mirror M4 in the −Xt direction and makes the light beams LBa and LBb incident on the respective reflecting surfaces RP of the polygon mirror PM. The light beam LBa is incident on the first reflecting surface RP of the polygon mirror PM from the first direction, and the light beam LBb is incident on the other second reflecting surface RP of the polygon mirror PM from a second direction different from the first direction.

The polygon mirror PM reflects the incident light beams LBa and LBb to the fθ lenses FTa and FTb. The polygon mirror PM reflects the incident light beams LBa and LBb so as to deflect the light beams LBa and LBb to scan the light spots SPa and SPb of the light beams LBa and LBb on the irradiated surface of the substrate P. Thereby, by the rotation of the polygon mirror PM, the light beams LBa and LBb are deflected one-dimensionally scanned in a plane parallel to the XtYt plane. Specifically, the polygon mirror PM is a rotating polygon mirror having a rotation axis AXp extending in the Zt axis direction and a plurality of reflection surfaces RP arranged around the rotation axis AXp so as to surround the rotation axis AXp. In the first embodiment, the polygon mirror PM is a rotating polygon mirror having eight reflective surfaces RP parallel to the Zt axis and having a regular octagonal shape. By rotating the polygon mirror PM in a predetermined rotation direction about the rotation axis AXp, the reflection angles of the pulsed light beams LBa and LBb irradiated on the reflection surface RP can be continuously changed. As a result, the reflection directions of the light beams LBa and LBb can be deflected by the first reflecting surface RP and the second reflecting surface RP, respectively, so that the light beams LBa and LBb irradiated on the irradiated surface of the substrate P are irradiated on the surface SPa and SPb of the light beams LBa and LBb along the Scan in the main scanning direction.

One reflection surface RP of the polygon mirror PM can scan the light spots SPa and SPb along the drawing lines SL2a and SL2b by deflecting both the light beams LBa and LBb. Therefore, when the polygon mirror PM rotates once, the number of scans of the light spots SPa and SPb along the drawing lines SL2a and SL2b on the irradiated surface of the substrate P is 8 times at the maximum as the number of the reflecting surfaces RP. The polygon mirror PM is rotated at a constant speed by a polygon mirror drive unit including a motor or the like. The rotation of the polygon mirror PM is controlled by the control device 18 by the polygon mirror drive unit.

In addition, when the lengths of the drawing lines SL2a and SL2b are, for example, 30 mm, the light spots SPa and SPb of 3 μm are pulsed so as to overlap each other by 1.5 μm, and the light spots SPa and SPb are irradiated along the drawing lines SL2a and SL2b. When reaching the irradiated surface of the substrate P, the number of light spots SP (pulse emission number) irradiated by one scan was 20000 (30 mm/1.5 μm). In addition, if the scanning time of the light spots SPa and SPb along the drawing lines SL2a and SL2b is 200 μsec, it is necessary to irradiate the pulsed light spots SP 20000 times during this period. Therefore, the light emission frequency Fs of the light source device 14 Fs≧20000 times/200μsec=100MHz.

The first cylindrical lens CY1 converges the incident light beams LBa and LBb on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM superior. Even if the reflection surface RP is inclined with respect to the Zt axis, which is the normal line of the XtYt plane, the influence can be suppressed even if the first cylindrical lens CY1 whose generatrix is parallel to the Yt direction, and the later-described first cylindrical lens CY1 The second cylindrical lenses CY2a and CY2b have the reflection surface RP inclined with respect to the Zt direction. For example, the irradiation positions of the light spots SPa and SPb (drawing lines SL2a and SL2b) of the light beams LBa and LBb irradiated on the irradiated surface of the substrate P can be suppressed due to the extremely small inclination of each reflecting surface RP of the polygon mirror PM. The error is offset in the Xt direction.

Specifically, the polygon mirror PM reflects the incident light beam LBa toward the -Yt (-Y) direction side, and guides it to the reflecting mirror M6a. Moreover, the polygon mirror PM reflects the incident light beam LBb toward the +Yt (+Y) direction side, and guides it to the reflecting mirror M6b. The mirror M6a reflects the incident light beam LBa toward the −Xt direction side, and guides it to the fθ lens FTa having the optical axis AXfa extending in the Xt axis direction. The mirror M6b reflects the incident light beam LBb toward the −Xt direction side, and guides it to the fθ lens FTb having an optical axis AXfb (parallel to the optical axis AXfa) extending in the Xt axis direction.

The fθ(f-θ) lenses FTa and FTb are the scanning lenses of the telecentric system, and in the XtYt plane, the light beams LBa and LBb from the polygon mirror PM reflected by the mirrors M6a and M6b are aligned with the optical axes AXfa and AXfb. Projected to mirrors M7a, M7b in parallel. The mirror M7a reflects the incident light beam LBa toward the irradiated surface of the substrate P in the -Zt direction, and the mirror M7b reflects the incident light beam LBb in the -Zt direction toward the irradiated surface of the substrate P. The light beam Lba reflected by the mirror M7a passes through the second cylindrical lens CY2a and is projected onto the irradiated surface of the substrate P, and the light beam LBb reflected by the reflecting mirror M7b passes through the second cylindrical lens CY2b and is projected to the irradiated surface of the substrate P. noodle. Through the fθ lens FTa and the second cylindrical lens CY2a whose generatrix is parallel to the Yt direction, the light beam LBa projected on the substrate P converges on the irradiated surface of the substrate P into a minute light with an effective diameter of about several μm (for example, 3 μm). Click Spa. Similarly, through the fθ lens FTb and the second cylindrical lens CY2b whose generatrix is parallel to the Yt direction, the light beam LBb projected on the substrate P converges on the irradiated surface of the substrate P to a small effective diameter of about several μm (for example, 3 μm). the light spot SPb. The light spots SPa and SPb projected on the irradiated surface of the substrate P are simultaneously one-dimensionally scanned along drawing lines SL2a and SL2b extending in the main scanning direction (Yt direction, Y direction) by rotating one polygon mirror PM.

The incident angle θ (angle with respect to the optical axis) of the light beams incident on the fθ lenses FTa and FTb changes according to the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FTa projects the spot SPa of the light beam LBa to an image height position on the irradiated surface of the substrate P proportional to the incident angle of the light beam LBa. Similarly, the fθ lens FTb projects the spot SPb of the light beam LBb to the image height position on the irradiated surface of the substrate P proportional to the incident angle of the light beam LBb. If the focal length is f and the image height position is y, the fθ lenses FTa and FTb have a relationship of y=f×θ (distortion). Therefore, by the fθ lenses FTa and FTb, the light spots SPa and SPb of the light beams LBa and LBb can be accurately scanned at constant velocity along the Yt direction (Y direction). When the incident angle θ of the light beams LBa and LBb incident on the fθ lenses FTa and FTb is 0 degrees, the light beams LBa and LBb incident on the fθ lenses FTa and FTb travel along the optical axes AXfa and AXfb.

The above condenser lens CD, triangular mirror M2, mirror M3a, offset optical member SRa, beam shaping optical system BFa, mirror M4, first cylindrical lens CY1, and mirror M5 are multi-faceted from the first direction. The mirror PM functions as the first light guide optical system 20 for guiding the light beam LBa. In addition, the condenser lens CD, the triangular mirror M2, the reflection mirror M3b, the offset optical member SRb, the beam shaping optical system BFb, the reflection mirror M4, the first cylindrical lens CY1, and the reflection mirror M5 are different from the first direction. The second light guide optical system 22 that guides the light beam LBb toward the polygon mirror PM in the second direction functions as a second light guide optical system 22 . In addition, although the condenser lens CD, the triangular mirror M2, the mirror M4, the first cylindrical lens CY1, and the mirror M5 are used as the common components of the first light guide optical system 20 and the second light guide optical system 22, At least a part of these members may be provided individually for the first light guide optical system 20 and the second light guide optical system 22 . In addition, the mirror M6a, the fθ lens FTa, the mirror M7a, and the second cylindrical lens CY2a function as the first projection optical system 24 for condensing the light beam LBa reflected by the polygon mirror PM And it is projected on the drawing line SL2a (SLa) as a light spot SPa. Similarly, the mirror M6b, the fθ lens FTb, the mirror M7b, and the second cylindrical lens CY2b function as the second projection optical system 26 for condensing the light beam LBb reflected by the polygon mirror PM The light is projected onto the drawing line SL2b (SLb) as a light spot SPb. The first projection optical system 24 and the second projection optical system 26 are arranged so that the drawing lines SLa and SLb are at the same position in the sub-scanning direction and are separated from each other in the main-scanning direction. Moreover, the 1st projection optical system 24 and the 2nd projection optical system 26 are arrange|positioned so that the drawing lines SLa and SLb may be spaced apart in the main scanning direction by the interval equal to or less than the scanning length.

In the case of the first embodiment, even when the light beams LBa and LBb are incident on the mirror M1 at the position where the rotation center axis AXr passes, the light beams LBa and LBb are not parallel to the rotation center axis AXr. The incident light is incident on the mirror M1, but as shown in FIG. 8, it is incident on the mirror M1 (or its vicinity) at a constant inclination with respect to the rotation center axis AXr. Therefore, when the entire drawing unit U2 rotates around the rotation center axis AXr, the incident angles of the light beams LBa and LBb with respect to the mirror M1 are relatively changed. Thereby, the reflection directions of the light beams LBa and LBb reflected by the mirror M1 in the drawing unit U2 are two-dimensionally changed according to the rotation of the drawing unit U2 around the rotation center axis AXr.

FIGS. 9 and 10 are exaggeratedly showing the reflection of the light beam LBa in the drawing unit U2 in the initial position state in which the drawing unit U2 is not rotated about the rotation center axis AXr, and the state in which the drawing unit U2 is rotated by Δθz from the initial position. A graph of the change in direction (change in the path the beam travels). 9 is a diagram showing the arrangement relationship between the mirror (reflection member) M1 and the condenser lens CD in the XtZt plane, and FIG. 10 is a diagram showing the arrangement relationship between the mirror M1 and the condenser lens CD in the XtYt plane. In addition, the principle that the reflection direction of the light beam LBb in the drawing unit U2 changes when the drawing unit U2 rotates around the rotation center axis AXr is the same as that of the light beam LBa, so only the light beam LBa will be described. Here, the optical axis AXc of the condenser lens CD is set to intersect the rotation center axis AXr on the reflection surface of the mirror M1 (set at 45° with respect to the XtYt plane), and the reflection surface of the mirror M1 is set to intersect with the rotation center axis AXr. at the position of the front focal distance fa of the condenser lens CD. Furthermore, the light beams LBa and LBb converge on the surface Pcd (back focal plane) at the position of the rear focal distance fb of the condenser lens CD so as to reach the beam waist (minimum diameter) and then diverge. In FIGS. 9 and 10 , the light beam LBa-1 shown by the solid line represents the light beam LBa when the drawing unit U2 as a whole is not rotated at the initial position, that is, when the drawing line SL2a is parallel to the Yt(Y) direction. The light beam LBa- 2 indicated by the two-dotted chain line represents the light beam LBa in a state in which the entire drawing unit U2 is rotated by Δθz around the rotational center axis AXr.

When the drawing unit U2 rotates around the rotation center axis AXr, the relative incidence angle of the light beam LBa (LBb) with respect to the reflection surface of the mirror M1 changes. As shown in FIG. 10 , if the light beam LBa projected on the reflection surface of the mirror M8 before the mirror M1 is LBa( M8 ), it can be seen from the beam alignment state of FIG. 8 that in the initial position state, the XtYt plane Each position of the light beam LBa projected on the mirror M1 and the light beam LBa ( M8 ) in the inside is separated in a direction parallel to the Yt axis. When the entire drawing unit U2 is rotated (inclined) by the angle Δθz from the initial position, when viewed from the mirror M1, the position of the light beam LBa (M8) on the mirror M8 corresponds to the angle Δθz and is relatively in the Xt direction. Offset (actually rotate around the rotation center axis AXr).

Thereby, the optical path (center line) of the light beam LBa-1 reflected by the mirror M1 in the initial position state becomes the light beam LBa-2 after the overall rotation angle Δθz of the unit U2 is drawn, and is inclined in the XtYt plane. In addition, in FIG. 10 , the intersection angle between the center line of the light beam LBa-1 in the initial position state in the XtYt plane and the optical axis AXc of the condenser lens CD, and the center of the light beam LBa in the YtZt plane shown in FIG. 8 The line coincides with the intersection angle of the rotation center axis AXr. Therefore, the convergence position BW1 of the light beam LBa-1 in the initial position state in the rear focal plane Pcd is the convergence position BW2 of the light beam LBa-2 in the rear focal plane Pcd after the entire drawing unit U2 is rotated by the angle Δθz, The position is shifted (parallel offset) by ΔYh in the Yt direction. This positional shift amount ΔYh is uniquely obtained from the geometric relational expression of ΔYh=fy(Δθz) with respect to the angle Δθz. In addition, each center line of the light beam LBa- 1 and the light beam LBa- 2 from the condenser lens CD toward the rear focal plane Pcd is parallel to the optical axis AXc.

On the other hand, as exaggeratedly shown in FIG. 9 , if the alignment state of the light beam LBa-2 after the entire drawing unit U2 is rotated by the angle Δθz from the initial position state is observed in the XtZt plane, the light beam LBa incident on the mirror M1 is The center line is inclined in the Yt direction with respect to the rotation center axis AXr, so that the light beam LBa-2 goes from the mirror M1 after the rotation angle Δθz to the light beam LBa-1 (parallel to the optical axis AXc) in the initial position state. It advances obliquely in the Zt-axis direction and is incident on the condenser lens CD. Therefore, the convergence position BW1 of the light beam LBa-1 in the initial position state in the rear focal plane Pcd is the convergence position BW2 of the light beam LBa-2 in the rear focal plane Pcd after the entire drawing unit U2 is rotated by the angle Δθz, The position is shifted (parallel shift) ΔZh in the Zt direction. This positional shift amount ΔZh is uniquely obtained from the geometric relational expression of ΔZh=fz(Δθz) with respect to the angle Δθz. In addition, in the configuration of the first embodiment, the positional shift amount ΔZh in the Zt axis direction is larger than the positional shift amount ΔYh in the Yt axis direction. The above action is also the same for the light beam LBb. After the entire drawing unit U2 is rotated by the angle Δθz, the position of the light beam LBb-2 in the rear focal plane Pcd is converged by the condenser lens CD with respect to the rear focal plane Pcd. The position of the light beam LBb-1 in the initial position state of the inside is shifted in the Yt direction and the Zt direction.

As described above, in the first embodiment, since the condenser lens CD is provided such that the reflection surface of the mirror M1 is located at the position of the front focal distance fa, the light beam LBa-2 emitted from the condenser lens CD can always be The centerline of (LBb-2) is parallel to the centerline of light beam LBa-1 (LBb-1). Therefore, the inclination of the offset optical members SRa and SRb arranged after the condenser lens CD is adjusted so that the positional shift amounts ΔYh and ΔZh of the light beams LBa and LBb generated after the entire drawing unit U2 is rotated by the angle Δθz are zero. way to correct. Thereby, the two light beams LBa and LBb can be correctly passed through the subsequent optical system along the optical path in the initial position state. By using the relationship table of the angle Δθz and the inclination adjustment amount prepared in advance based on the geometrical expressions ΔYh=fy(Δθz), ΔZh=fz(Δθz), etc., the inclination of the offset optical members SRa and SRb can be performed at high speed. degree adjustment. Thereby, even when the whole drawing unit U2 is rotated, the light beams LBa and LBb can be made incident on the appropriate position of the reflection surface RP of the polygon mirror PM.

In addition, as long as the light beams LBa and LBb from the mirror M8 can be made incident on the mirror M1 on the same axis as the rotation center axis AXr, the incident angle of the light beams LBa and LBb with respect to the mirror M1 does not depend on the drawing unit. U rotates around the rotation center axis AXr and changes. Therefore, in the drawing unit U, the reflection directions of the light beams LBa and LBb reflected by the mirror M1 do not change due to the rotation of the drawing unit U. One method of spatially separating the two light beams LBa and LBb in the drawing unit U2 after the mirror M1 so that the two light beams LBa and LBb incident on the mirror M1 are on the same axis is to form the following system, After arranging a polarizing beam-splitter or the like on the mirror M1, the beams LBa and LBb whose polarization states are orthogonal to each other are coaxially combined and incident on the mirror M1, and the polarizing beam splitter is used. and so on for polarization separation.

In FIGS. 9 and 10 , a case where the beams LBa and LBb (parallel beams) having a fixed inclination with respect to the rotation center axis AXr and symmetrical with respect to the rotation center axis AXr are incident on the At the same position of the mirror M1, two beams LBa and LBb (parallel beams) that are symmetrical in the Yt direction with respect to the rotation center axis AXr and aligned parallel to each other with the rotation center axis AXr are incident on the reflection mirror M1 situation is explained. 11A is an exaggerated view showing reflections of light beams LBa and LBb incident on the mirror (reflection member) M1 when the entire drawing unit U2 is rotated by an angle (predetermined angle) Δθz around the rotation center axis AXr from the +Zt direction side Fig. 11B shows changes in the positions of the light beams LBa and LBb in the mirror M1 when the entire drawing unit U2 is rotated by an angle Δθz when viewed from the advancing direction side (the +Xt direction side) of the light beams LBa and LBb. 's diagram.

In addition, in FIG. 11A, since the orthogonal coordinate system XtYtZt is the orthogonal coordinate system set for the drawing unit U2, the orthogonal coordinate system XtYtZt after the entire rotation angle Δθz of the drawing unit U2 becomes as indicated by the dotted line. An orthogonal coordinate system tilted by an angle Δθz around the Zt axis. Therefore, in the initial position state in which the drawing unit U2 is not rotated, the main scanning direction (Yt direction) of the light spot SP along the drawing line SL2 is parallel to the Y direction, but when the entire drawing unit U2 is rotated by the angle Δθz , the main scanning direction (Yt direction) of the light spot SP along the drawing line SL2 of the rotated drawing unit U2 is inclined with respect to the Y direction. Also, as shown in FIGS. 11A and 11B , a line that is set so as to extend in the Xt direction at an intermediate position in the Yt direction of the two light beams LBa and LBb and is orthogonal to the rotation center axis AXr is set as the center axis AXt. The central axis AXt corresponds to the optical axis AXc of the condenser lens CD in the aforementioned FIGS. 9 and 10 . Further, as shown in FIGS. 11A and 11B , when the two light beams LBa and LBb reflected by the mirror M1 travel in parallel with the central axis AXt, the light beams described in the previous FIGS. 9 and 10 are condensed. The lens CD is changed to a condenser lens with a smaller diameter, and is individually arranged in the respective optical paths of the two light beams LBa, LBb.

In FIG. 11A , the mirror M1 indicated by the solid line represents the mirror M1 when the drawing unit U2 is not rotated at the initial position, that is, when the drawing lines SL2a and SL2b are parallel to the Y direction. In addition, the light beams LBa-1 and LBb-1 shown by solid lines indicate the incident position of the mirror M1 in the initial position state, and the light beams LBa and LBb reflected by the mirror M1 in the Xt-axis direction. In addition, the mirror M1' shown by the two-dot chain line is an exaggerated representation of the arrangement of the mirror M1 in the state in which the unit U2 is rotated by the angle Δθz. Furthermore, the light beams LBa-2 and LBb-2 indicated by the two-dotted chain line represent the light beams LBa-2 and LBb reflected by the mirror M1' when the drawing unit U2 is rotated by the angle Δθz.

When the drawing unit U2 rotates, in the XtYt plane, the reflection directions of the light beams LBa-2 and LBb-2 reflected by the mirror M1' also rotate according to the rotation of the drawing unit U2. Further, the relative positions (especially the positions in the Zt direction) of the light beams LBa and LBb incident on the mirror M1 are changed due to the rotation of the drawing unit U2. In parallel), the respective center lines of the light beams LBa-2 and LBb-2 reflected by the mirror M1' are parallel to the center axis AXt as shown in FIG. 11B, but their positions vary around the center axis AXt.

As shown in FIG. 11B , when the drawing unit U2 is in the initial position state, the light beams LBa- 1 and LBb- 1 reflected by the mirror M1 are conventionally arranged in parallel with the center axis AXt in the ±Yt (Y) direction at a constant distance from the center axis AXt . However, when the drawing unit U2 is rotated by the angle Δθz, the light beam LBa-2 reflected by the mirror M1 moves in the −Zt direction and the +Yt direction so as to draw an arc with the central axis AXt as the center. , the light beam LBb-2 reflected by the mirror M1 moves to the +Zt direction and the -Yt direction. Therefore, the optical paths of the two light beams LBa and LBb of the optical members after passing through the reflecting mirror M1 are different from those in the initial position state, so that the light beams LBa and LBb cannot be incident on the reflecting surface RP of the polygon mirror PM. appropriate location.

However, in the first embodiment, since the offset optical members SRa and SRb are provided after the mirror M1, it is possible to two-dimensionally reflect the respective light beams LBa and LBb in the Yt direction and the Zt direction within the plane Pv. Adjust the center line. Therefore, even when the entire drawing unit U2 is rotated, the optical paths of the light beams LBa and LBb can be corrected (adjusted) after the offset optical members SRa and SRb in the drawing unit U2 so that the drawing unit U does not rotate. Correct optical path in the initial position state. Thereby, the light beams LBa and LBb can be made incident on an appropriate position of the reflection surface RP of the polygon mirror PM.

In addition, by the triangular mirror M2 and the mirrors M3a and M3b, the distance between the center lines of the light beams LBa and LBb reflected by the mirror M1 in the Yt direction in the XtYt plane is widened, so that the incident to the drawing unit U2 can be shortened. The distance between the respective center lines of the two light beams LBa and LBb of the reflecting mirror M1 can make the light beams LBa and LBb incident on the drawing unit U2 (mirror M1 ) close to the rotation center axis AXr. As a result, even when the drawing unit Ub is rotated, the amount of positional change of the respective center lines of the light beams LBa and LBb in the plane Pv accompanying the rotation can be suppressed to be small.

Furthermore, the control device 18 can detect the inclination (inclination) of the exposure area W based on the positions of the alignment marks MK ( MK1 to MK4 ) detected using the alignment microscopes AMa ( AMa1 to AMa4 ) and AMb ( AMb1 to AMb4 ) or skewed (deformed). As for the inclination (inclination) or skew of the exposure region W, for example, the longitudinal direction of the substrate P conveyed around the rotary drums DR1 and DR2 is inclined or skewed with respect to the central axes AXo1 and AXo2 , which causes exposure to exposure. The case where the area W is inclined or skewed. In addition, even if the substrates P wound around the rotary drums DR1 and DR2 and conveyed are not inclined or skewed, when the lower pattern layer is formed, the substrate P may be inclined (toppled) or conveyed in a skewed manner. The exposure area W itself is skewed. In addition, the substrate P itself may be deformed linearly or non-linearly due to the thermal influence applied to the substrate P in the previous step.

Therefore, the control device 18 rotates the drawing units U1 , U2 , U5 , and U6 according to the inclination (inclination) or skew of the whole or part of the exposure area W detected using the alignment microscopes AMa ( AMa1 to AMb4 ) The central axis AXr rotates. In addition, the control device 18 rotates the drawing units U3 and U4 around the rotation center axis AXr in accordance with the inclination (slope) or skew of the whole or part of the exposure area W detected using the alignment microscope AMb ( AMb1 to AMb4 ). verb: move. At this time, the control device 18 also drives the offset optical members SRa and SRb according to the rotation angles of the drawing units U ( U1 to U6 ).

Specifically, for example, the substrate P conveyed by being wound around the rotary drums DR1 and DR2 inclines (falls) or slants, so the predetermined pattern to be drawn needs to be slanted or slanted in accordance with the inclination (fall) and the slant. As another example, when the predetermined pattern is re-overlaid on the lower layer pattern and drawn, the drawn predetermined pattern needs to be inclined or skewed according to the inclination or skew of the whole or part of the lower layer pattern. Therefore, in order to incline or skew the predetermined pattern to be drawn, the control device 18 individually rotates the drawing units U ( U1 to U6 ) to incline the drawing lines SLa and SLb with respect to the Y direction.

As described above, in the first embodiment, the drawing unit U uses one polygon mirror PM to scan the spots SPa and SPb of the light beams LBa and LBb along the drawing lines SLa and SLb so that the drawing lines SLa and SLb are located on the substrate P. The first projection optical system 24 and the second projection optical system 26 are arranged at the same position in the sub-scanning direction and spaced apart in the main-scanning direction. Further, the central axis of rotation of the drawing unit U is set at a position between the two drawing lines SLa and SLb in the main scanning direction, and preferably set at a position between the two drawing lines SLa and SLb in the main scanning direction. The position of the midpoint of the bisector.

Thereby, even if the drawing unit U rotates, it is possible to suppress an increase in the positional deviation of the drawing lines SLa and SLb of the light spots SPa and SPb of the light beams LBa and LBb scanned by the drawing unit U on the substrate P, and it is possible to easily The inclinations of the drawing lines SLa and SLb are adjusted. On the contrary, in Japanese Patent Laid-Open No. 2004-117865 A, in which a plurality of scanning lines are provided at the same position in the main scanning direction and spaced apart from each other in the sub-scanning direction, the laser scanning device is rotated to When adjusting the inclination of a plurality of scan lines, the scan lines move so as to draw an arc around the rotational center position of the laser scanning device. Therefore, the farther the scanning line is from the rotation center position, the greater the positional shift of the scanning line on the irradiated object caused by the rotation of the laser scanning device. That is, in the first embodiment, since the drawing lines SLa and SLb are set at the same position in the sub-scanning direction and spaced apart in the main-scanning direction, the rotation of the drawing unit U can be avoided. The positional displacement of the drawing lines SLa and SLb on the substrate P due to the movement increases excessively. In addition, since the scan length of the drawing line SL can be shortened, it is possible to stably maintain the arrangement accuracy and optical performance of the scan line required for drawing an ultra-detailed pattern.

The first projection optical system 24 and the second projection optical system 24 are arranged such that the respective scan lengths of the drawing lines SLa and SLb are set to be the same, and the drawing lines SLa and SLb are set to be separated from each other at intervals equal to or less than the scan length in the main scanning direction. Optical system 26 . Thereby, the drawing lines SLa and SLb of the drawing units U can be brought into contact with each other in the main scanning direction by the plurality of drawing units U, and the positional deviation of the drawing lines SLa and SLb of the drawing units U on the substrate P can be suppressed. As the displacement increases, the inclination of the drawing lines SLa and SLb can be easily adjusted.

The rotation center axis AXr of the drawing unit U is the center point of a line segment passing through the respective midpoints of the drawing lines SLa and SLb of the drawing unit U perpendicularly with respect to the substrate P. As shown in FIG. Thereby, the positional deviation of the drawing lines SLa and SLb accompanying the rotation of the drawing unit U can be minimized, and the inclinations of the drawing lines SLa and SLb can be easily adjusted.

The light beams LBa and LBb from the light source device 14 are incident on the drawing unit U in a symmetrical manner with respect to the rotation center axis AXr, so even if the drawing unit U rotates around the rotation center axis AXr, it is possible to suppress the The positional shift of each center line passing through the light beams LBa and LBb in the drawing unit U increases.

The drawing unit U includes a mirror M1 at a position where the rotation center axis AXr passes, and the mirror M1 reflects the incident light beams LBa and LBb and guides them to the first light guide optical system 20 and the second light guide optical system 22 . In this way, even when the drawing unit U is rotated, the light beams LBa and LBb from the light source device 14 are first incident on the mirror M1 in the drawing unit U, so that the light beams LBa and LBb can be projected on the spots SPa and SPb of the light beams LBa and LBb. to the drawing lines SLa and SLb.

The first light guide optical system 20 includes a shift optical member SRa that shifts the position of the light beam LBa reflected by the mirror M1 on a plane intersecting the advancing direction of the light beam LBa, and the second light guide optics The system 22 includes a shift optical member SRb that shifts the position of the light beam LBb reflected by the mirror M1 on a plane intersecting the advancing direction of the light beam LBb. Thereby, even when the drawing unit U is rotated, the light beams LBa and LBb can be made incident on the polygon mirror PM through an appropriate optical path in the drawing unit U. Therefore, it is possible to suppress that the light spots SPa and SPb are not irradiated on the irradiated surface of the substrate P due to the rotation of the drawing unit U, or that the light spots SPa and SPb are projected to positions deviating from the drawing lines SLa and SLb after the inclination adjustment, etc. Problem arises.

The plurality of drawing units U are arranged such that the respective drawing lines SLa and SLb are in contact (joined) along the main scanning direction (the width direction of the substrate P). Thereby, the drawable range in the width direction of the board|substrate P can be enlarged.

The drawing lines SLa and SLb of a predetermined number of drawing units U among the plurality of drawing units U are positioned on the substrate P supported by the outer peripheral surface of the rotating drum DR1, and the drawing lines SLa and SLb of the remaining drawing units are positioned on the rotating drum. In the form of the board|substrate P supported by the outer peripheral surface of DR2, several drawing units U are arrange|positioned. Thereby, it becomes unnecessary to arrange|position all the drawing units U in one rotary drum DR, and the freedom degree of arrangement|positioning of drawing units U improves. In addition, three or more rotating drums DR may be provided, and one or more drawing units U may be arranged for each of the three or more rotating drums DR.

The drawing lines SLa and SLb (drawing means) are rotated (inclined) so that the predetermined pattern to be drawn on the irradiated surface of the substrate P is inclined. Thereby, the shape of the predetermined pattern drawn according to the conveyance state of the board|substrate P or the shape of the exposure area W of the board|substrate P can be changed. In addition, when a predetermined pattern is again superimposed on the lower layer pattern formed in advance on the irradiated surface of the substrate P for drawing, the drawing can be made based on the measurement result of the inclination of the whole or part of the lower layer pattern, or the nonlinear deformation. Lines SLa, SLb swirl (tilt). Thereby, the superimposition accuracy with respect to the pattern formed in the lower layer improves.

In addition, although the drawing lines SLa and SLb of each drawing unit U ( U1 - U6 ) are arranged at the same position in the sub-scanning direction, they may be arranged at different positions in the sub-scanning direction. In short, the drawing lines SLa and SLb only need to be spaced apart from each other in the main scanning direction. Even in this case, the rotation center axis AXr passes through a point set between the midpoint of the drawing line SLa and the midpoint of the drawing line SLb perpendicular to the irradiated surface of the substrate P, or connects the drawing line SLa and the drawing line Since the center point is set on the line segment of each midpoint of the line SLb, the positional deviation of the drawing lines SLa and SLb accompanying the rotation of the drawing unit U can be reduced.

Furthermore, in the first embodiment of the present invention, the main scanning of the light spots SPa and SPb along the two drawing lines SLa and SLb is performed by one polygon mirror PM. Therefore, as shown in FIG. In the case where 12 drawing lines SL1a to SL6a and SL1b to SL6b are set to correspond to the exposure region W on the substrate P having a large width, the number of polygon mirrors PM may be only half, that is, six. Therefore, the vibration and noise (wind noise) which generate|occur|produce accompanying the high-speed rotation (for example, 20,000 rpm or more) of the polygon mirror PM are suppressed.

[Variation of the first embodiment]

The above-mentioned first embodiment may have the following modifications.

(Modification 1) FIG. 12 is a view of the beam scanning system using the polygon mirror PM in Modification 1 of the first embodiment when viewed from the +Zt direction side, and FIG. 13 is a view of the beam of FIG. 12 viewed from the +Xt direction side Image while scanning the system. In addition, the same code|symbol is attached|subjected to the same structure as the said 1st Embodiment, the description is abbreviate|omitted, and only the part different from the said 1st Embodiment is demonstrated. The polygon mirror PM of the present modification 1 also has a regular octagon having eight reflecting surfaces RPa to RPh as shown in FIG. 12 , and two reflecting surfaces (for example, reflecting surfaces) located at symmetrical positions with respect to the rotation axis AXp RPa and reflecting surface RPe, reflecting surface RPc and reflecting surface RPg, etc.) are parallel to each other.

As shown in FIG. 13 , the mirror M4a reflects the light beam LBa traveling in the +Xt direction through the beam shaping optical system BFa in the −Zt direction. The light beam LBa reflected in the -Zt direction by the mirror M4a passes through the first cylindrical lens CY1a whose generatrix is set to be parallel to the Xt axis, and then enters the mirror M5a. The reflection mirror M5a reflects the incident light beam LBa in the +Yt direction and guides it to the first reflection surface RPc of the polygon mirror PM. As shown in FIG. 12 , the polygon mirror PM reflects the incident light beam LBa toward the reflection mirror M5a (the −Yt direction side), and guides it to the reflection mirror M6a. As described in the above-described first embodiment, the mirror M6a reflects the incident light beam Lba in the −Xt direction and guides it to the fθ lens FTa. Similarly, the mirror M4b reflects the light beam LBb traveling in the +X direction through the beam shaping optical system BFb in the −Zt direction. The light beam LBb reflected in the -Zt direction by the mirror M4b passes through the first cylindrical lens CY1b whose generatrix is set to be parallel to the Xt axis, and then enters the mirror M5b. The reflection mirror M5b reflects the incident light beam LBb in the −Yt direction, and guides it to the second reflection surface RPg of the polygon mirror PM. The polygon mirror PM reflects the incident light beam LBb toward the reflection mirror M5b side (+Yt direction side), and guides it to the reflection mirror M6b. As described in the first embodiment, the mirror M6b reflects the incident light beam LBb in the −Xt direction and guides it to the fθ lens FTb. The mirrors M6a and M6b are arranged at the same position in the Zt direction. Furthermore, the mirror M5a is arranged on the -Zt direction side rather than the mirror M6a, and the mirror M5b is arranged on the +Zt direction side rather than the mirror M6b. In addition, the mirrors M5a and M5b and the mirrors M6a and M6b are provided at substantially the same position in the Xt direction. That is, the mirrors M5a, M5b, and the mirrors M6a, M6b are arranged along the Yt direction.

The above-mentioned mirrors M4a and M4b are provided in place of the mirror M4 of the above-described first embodiment, and these mirrors M4a and M4b have the same function as the mirror M4. Furthermore, the first cylindrical lenses CY1a and CY1b are provided in place of the first cylindrical lens CY1 of the first embodiment, and these first cylindrical lenses CY1a and CY1b have the same functions as the first cylindrical lens CY1. That is, the cylindrical lenses CY1a and CY1b converge the incident light beams LBa and LBb on the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) by the polygon mirror PM. on the reflective surface RP. Similarly, mirrors M5a and M5b are provided in place of the mirror M5 in the above-described first embodiment, and these mirrors M5a and M5b have functions equivalent to those of the mirror M5. In this way, the reflection mirror M4, the first cylindrical lens CY1, and the reflection mirror M5 of the first embodiment described above are individually provided in each of the first light guide optical system 20 and the second light guide optical system 22, which is a reflection Mirrors M4a, M4b, first cylindrical lenses CY1a, CY1b, and mirrors M5a, M5b.

In addition, the distance in the Yt direction of the light beams LBa and LBb incident on the mirrors M4a and M4b in the XtYt plane is greater than the Yt of the polygon mirror PM through the triangular mirror M2 and the mirrors M3a and M3b shown in FIG. 6 . The direction of the size (diameter) way to expand.

In this modification 1, as shown in FIG. 13 , the polygon mirror PM is inclined and arranged so that the rotation axis AXp of the polygon mirror PM is inclined by a fixed angle θy (less than 45°) in the Yt direction from a state parallel to the Zt axis. overall. Therefore, among the reflecting surfaces RP of the polygon mirror PM, the reflecting surfaces RPc and RPg located at positions facing the reflecting mirrors M6a and M6b respectively during the rotation are inclined by a fixed angle θy in the Yt direction with respect to the Zt axis. FIGS. 12 and 13 show a state at an instant when both the reflection surface RPc of the polygon mirror PM and the reflection surface RPg facing the reflection surface RPc with the rotation axis AXp in between are parallel to the Xt axis. At this time, when viewed from the Xt direction orthogonal to the rotation axis AXp, the light beams LBa and LBb incident on the reflecting surfaces RPc and RPg of the polygon mirror PM are incident at an angle of incidence θy obliquely with respect to the reflecting surfaces RPc and RPg, Therefore, the reflection positions of the light beams LBa and LBb generated by the polygon mirror PM can be made to be the same height positions in the Zt direction. That is, the respective Zt direction positions of the mirrors M6a and M6b can be made the same. Furthermore, each center line (advance direction) of the light beams LBa and LBb reflected by the polygon mirror PM and directed to the mirrors M6a and M6b can be set to be parallel to the XtYt plane. Thereby, the position of the Zt direction of the 1st projection optical system 24 and the 2nd projection optical system 26 can be made the same position, and it becomes easy to arrange|position the drawing lines SLa and SLb on the irradiated surface of the board|substrate P on a straight line.

In addition, as shown in FIG. 13 , when the polygon mirror PM is inclined by the angle θy, the light beams LBa and LBb are projected from the Yt direction to each of the two parallel reflection surfaces RPc and RPg of the polygon mirror PM, and When the projection position of the light beam LBa on the reflection surface RPc and the projection position of the light beam LBb on the reflection surface RPg are highly aligned in the Zt direction, if the inclination angle θy is increased, the reflection surface RPa in the direction of the rotation axis AXp must also be increased. Height dimension of reflecting surface RPh. In the case of this modification 1, if the inclination angle θy of the polygon mirror PM is increased, the mirrors M5a, M5b, M6a, M6b, etc. can be easily arranged, but the reflection surfaces RPa of the polygon mirror PM in the direction of the rotation axis AXp~ The size of the reflection surface RPh is increased, and the mass of the polygon mirror PM is increased. Therefore, when priority is given to reducing the mass of the polygon mirror PM to achieve high rotation speed, the projection position of the light beam LBa on the reflection surface RPc and the projection position of the light beam LBb on the reflection surface RPg may be set in the Zt direction. different.

Also, as shown in FIG. 13 , when viewed from the Xt direction orthogonal to the rotation axis AXp, the light beams LBa and LBb incident on the reflection surfaces RPc and RPg of the polygon mirror PM which contribute to the drawing are made relative to the YtZt plane in the YtZt plane. The reflection surfaces RPc and RPg are incident obliquely, whereby the incident direction and the reflection direction of the light beams LBa and LBb can be made different in the rotation axis AXp direction or the Zt direction. Thereby, when the polygon mirror PM is viewed from the rotation axis AXp direction or the Zt direction (the state of FIG. 12 ), the respective light beams LBa and LBb can be incident on the reflection surface RPc that contributes to the drawing in a substantially orthogonal manner. , RPg. That is, when observing in the XtYt plane, the extension line of each center line AXs of the light beams LBa and LBb reflected by the mirrors M5a and M5b and directed to the reflection surfaces RPc and RPg of the polygon mirror PM can be set as: Both pass through the rotation axis AXp of the polygon mirror PM.

With the above configuration, when viewing in the XtYt plane, the light beams LBa and LBb reflected by the reflecting surfaces RPc and RPg of the polygon mirror PM which contribute to the drawing are fixed at the center line AXs. It is guided to the 1st projection optical system 24 (specifically, fθ lens FTa) and the 2nd projection optical system 26 (specifically, fθ lens FTb) in the state of deflecting scanning within the angular range θs. Therefore, when viewed from the rotation axis AXp direction or the Zt direction, the effective reflection angle range (θs) of the pulsed light beams LBa and LBb continuously incident on one reflection surface RP (RPc, RPg) can be divided into The light spots SPa and SPb along the drawing lines SLa and SLb are scanned once in an equal angular range (±θs/2) centered on the center line AXs. Thereby, the optical performance (aberration characteristics, focusing characteristics, spot quality, etc.) or isokinetic properties of the light beams LBa, LBb or the light spots SPa, SPb scanned by the polygon mirror PM are improved, and the scanning accuracy is improved.

(Modification 2) FIG. 14 is a view of the beam scanning system using the polygon mirror PMa in Modification 2 of the first embodiment when viewed from the +Zt direction side, and FIG. 15 is a view of the beam of FIG. 14 viewed from the +Xt direction side Image while scanning the system. In addition, the same code|symbol is attached|subjected to the same structure as the modification 1 of the said 1st Embodiment, and only a different part is demonstrated. In addition, the mirrors M5a and M5b are located at the same position in the Zt direction, and are arranged on the +Zt direction side rather than the mirrors M6a and M6b. In addition, the mirrors M5a, M5b and the mirrors M6a, M6b are provided at substantially the same position in the Xt direction.

In this modification 2, the rotation axis AXp of the polygon mirror PMa having the eight reflection surfaces RPa to RPh is made parallel to the Zt axis, and each reflection of the polygon mirror PMa is formed so as to be inclined by the angle θy with respect to the rotation axis AXp. Surface RPa to reflective surface RPh. FIGS. 14 and 15 show a state at an instant when both the first reflecting surface RPc of the polygon mirror PMa and the second reflecting surface RPg facing the reflecting surface RPc with the rotation axis AXp in between are parallel to the Xt axis. Then, as shown in FIG. 15 , when viewed from the Xt direction orthogonal to the rotation axis AXp, when the light beam LBa projected toward the reflection surface RPc of the polygon mirror PMa from the obliquely upward direction (+Zt direction) with respect to the reflection surfaces RPc and RPg, For each of the light beams LBb on the reflection surface RPg, the reflection positions of the light beams LBa and LBb on the reflection surfaces RPc and RPg can be set to the same height position in the plane parallel to the XtYt plane, that is, in the Zt direction. That is, the positions of the center lines of the light beams LBa and LBb reflected by the polygon mirror PMa in the Zt direction can be made the same. This makes it possible to make the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction the same position as in the modification example 1 of the above-described first embodiment, so that the irradiated surface of the substrate P can be easily irradiated. The drawing lines SLa and SLb are arranged on a straight line.

In addition, when viewed from the Xt direction, the light beam LBa is made incident on each of the two reflecting surfaces RP (for example, RPc and RPg) facing each other with the rotation axis AXp between the reflecting surfaces RPa to RPh of the polygon mirror PMa. , LBb are incident obliquely in the Z direction with respect to the reflection surface RP. Therefore, if observed in the YtZt plane, as shown in FIG. 15 , the incident angle direction and the reflection angle direction of the light beams LBa and LBb can be rotated The axis AXp direction (Zt direction) is separated by an angle 2θy. Thereby, when the polygon mirror PMa is observed from the rotation axis AXp direction (Zt direction), as shown in FIG. As a result, the light beams LBa and LBb from the mirrors M5a and M5b reflected by the polygon mirror PMa are incident on the mirrors M6a and M6b and do not return to the mirrors M5a and M5b.

In the present modification 2, the light beams LBa and LBb reflected by the reflection surfaces RPc and RPg of the polygon mirror PMa, which contribute to the drawing, are also centered on the center line AXs, as in the modification 1 of FIG. 12 described above. It guides to the 1st projection optical system 24 (specifically, f[theta] lens FTa) and the 2nd projection optical system 26 (specifically, f[theta] lens FTb) in the state of deflected scanning within the fixed angular range [theta]s. Therefore, the effective reflection angle range (θs) of the pulsed light beams LBa and LBb continuously incident on one reflecting surface RP (RPc, RPg) can be divided into equal angular ranges (±θs/ 2), the light spots along the drawing lines SLa and SLb are scanned by one scan. Thereby, the optical performance (aberration characteristics, focusing characteristics, spot quality, etc.) or isokinetic properties of the light beams LBa, LBb or the light spots SPa, SPb scanned by the polygon mirror PMa are improved, and the scanning accuracy is improved.

(Modification 3) In the modification 1 of the first embodiment, the rotation axis AXp of the polygon mirror PM is inclined by an angle θy in the Yz direction with respect to the Zt axis, and in the modification 2, the rotation of the polygon mirror PMa is made The axis AXp is parallel to the Zt axis, and each of the reflection surfaces RPa to RPh of the polygon mirror PMa is formed so as to be inclined by an angle θy with respect to the Zt axis. However, the arrangement of the polygon mirror PM and the configuration of each reflection surface RP (RPa to RPh) are not limited to the above-mentioned Modification 1 and Modification 2. For example, the polygon mirror PM configured as in the above-described first embodiment may be used to obliquely the light beam LB with respect to a plane (parallel to the XtYt plane) perpendicular to each reflection surface RP (parallel to the Zt axis and the rotation axis AXp). Inject from above (or below). Thereby, when the polygon mirror PM is viewed from the direction of the rotation axis AXp of the polygon mirror PM, in a state where the respective reflecting surfaces RP are arranged so that the light beams LBa and LBb are perpendicularly incident, the incident directions of the light beams LBa and LBb can be adjusted. It is the same as the reflection direction, and the incident direction and the reflection direction of the light beams LBa and LBb can be shifted in the direction of the rotation axis AXp (Zt axis). Therefore, the polygon mirror PM can cause the light beams LBa and LBb reflected by each of the two reflecting surfaces RP to fall within a fixed angular range θs (angle ±θs/2 of the center line AXs centered on the center line AXs) distribution) and guide it to the first projection optical system 24 (specifically, fθ lens FTa) and the second projection optical system 26 (specifically, fθ lens FTb). In this way, even in the case of Modification 3, the optical properties (aberrations) of the light beams LBa and LBb or the light spots SPa and SPb scanned by the polygon mirror PM are similar to the Modifications 1 and 2 of the first embodiment described above. characteristics, focusing characteristics, spot quality, etc.) or isokinetic improvement, so that the scanning accuracy is improved.

(Modification 4) As shown in FIGS. 16A and 16B , polarizing beam splitters PBS (PBSa, PBSb) may also be used as another configuration using a regular octagonal polygon mirror PM, as in the previous modification 1 In each of the modification 3, the incident direction and the reflection direction of the light beams LBa and LBb incident on the reflection surface RP of the polygon mirror PM contributing to the drawing are the same directions when observed in the XtYt plane, and the above In the regular octagonal polygon mirror PM, the rotation axis AXp and the Zt axis are parallel to each other, and the respective reflection surfaces RPa to RPh are also parallel to the rotation axis AXp, as in the third modification. 16A is a view of the beam scanning system using the polygon mirror PM in Modification 4 of the first embodiment when viewed from the +Zt direction side, and FIG. 16B is a view of the beam scanning system of FIG. 16A viewed from the −Xt direction side . In addition, the same reference numerals are given to the same members as the members described in each of the first embodiment and Modification 1 to Modification 3 above, and only different parts will be described.

As shown in FIGS. 16A and 16B , in this modification 4, between the polygon mirror PM and the reflecting mirror M6a, a rectangular parallelepiped-shaped polarized beam splitting with the incident and exit plane of the light beam parallel to each of the XtYt plane and the XtZt plane is arranged. In the device PBSa, between the polygon mirror PM and the reflecting mirror M6b, a rectangular parallelepiped-shaped polarizing beam splitter PBSb in which the incident and exit surfaces of the light beams are parallel to the XtYt plane and the XtZt plane is arranged. The polarization splitting surfaces of the polarization beam splitters PBSa and PBSb are set to be inclined by 45° with respect to both the XtYt plane and the XtZt plane. Further, a quarter wavelength plate QPa is arranged between the polarization beam splitter PBSa and the polygon mirror PM, and a quarter wavelength plate QPb is arranged between the polarization beam beam splitter PBSb and the polygon mirror PM.

In the above configuration, the light beam LBa modulated by the optical element (acousto-optic modulation element) AOMa (see FIGS. 5 and 7 ) passes through the first column parallel to the Xt axis as shown in FIG. 16B . The surface lens CY1a is incident on the polarization beam splitter PBSa from the +Zt direction side parallel to the Zt axis in a state where the surface lens CY1a converges in the Yt direction. After the light beam LBa is linearly S-polarized, most of the light beam LBa is reflected by the polarization splitting surface of the polarizing beam splitter PBSa, passes through the quarter-wave plate QPa, becomes circularly polarized, and goes toward the polygon mirror PM. When the rotational angle position of the polygon mirror PM is within the range of the angle ±θs/2 from the state where the one reflecting surface PRc that contributes to the drawing of the light beam LBa is parallel to the XtZt plane, as shown in FIG. 16A , passing 1 The light beam LBa of the /4-wavelength plate QPa is reflected by the reflection surface PRc, passes through the quarter-wavelength plate QPa again, becomes linear P-polarized light, and returns to the polarization beam splitter PBSa. Therefore, most of the light beam LBa reflected by the reflection surface PRc goes toward the reflection mirror M6a through the polarization separation surface of the polarization beam splitter PBSa.

Similarly, the light beam LBb modulated by the optical element (acousto-optic modulation element) AOMb (see FIGS. 5 and 7 ) passes through the first cylindrical lens parallel to the Xt axis as shown in FIG. 16B . In a state where CY1b converges in the Yt direction, it is incident on the polarization beam splitter PBSb from the +Zt direction side in parallel with the Zt axis. After the light beam LBb is linearly S-polarized, most of the light beam LBb is reflected by the polarization splitting surface of the polarization beam splitter PBSb, passes through the quarter-wave plate QPb, becomes circularly polarized, and goes toward the polygon mirror PM. As shown in FIG. 16A , when the rotational angle position of the polygon mirror PM is within the range of the angle ±θs/2 from the state in which one reflecting surface PRg contributing to the drawing of the light beam LBb is parallel to the XtZt plane, 1/4 The light beam LBb of the wavelength plate QPb is reflected by the reflection surface PRg, passes through the quarter wavelength plate QPb again, becomes linear P-polarized light, and returns to the polarization beam splitter PBSb. Therefore, most of the light beam LBb reflected by the reflection surface PRg goes toward the reflection mirror M6b through the polarization separation surface of the polarization beam splitter PBSb.

With the above-described configuration, the light beam LBa reflected by the mirror M6a and the light beam LBb reflected by the mirror M6b are each scanned within the angle range θs in a plane parallel to the XtYt plane. Moreover, it is arranged so that the extension line of the optical axis AXfa of the first projection optical system 24 (specifically, the fθ lens FTa) arranged after the mirror M6a is bent by 90° by the mirror M6a to be connected with the polygon mirror PM. The rotation axis AXp of the 2nd projection optical system 26 (specifically, the fθ lens FTb) arranged after the reflection mirror M6b intersects with the optical axis AXfb of the extension line, which is bent by 90° by the reflection mirror M6b and is connected with the polygon mirror PM. The axis of rotation AXp crosses. Therefore, in this modification 4, the polygon mirror PM can make the light beams LBa and LBb reflected by each of the two reflecting surfaces (for example, RPc and RPg) fall within a fixed angular range θs centered on the optical axes AXfa and AXfb (distribution of angles ±θs/2 centered on the optical axes AXfa, AXfb) is deflected inward, and is guided to the first projection optical system 24 (fθ lens FTa) and the second projection optical system 26 (fθ lens FTb) . In this way, even in the case of Modification 4, the optical performance (aberration characteristics, focusing characteristics, spot quality, etc.) or isokinetic properties of the light beams LBa, LBb or the light spots SPa, SPb scanned by the polygon mirror PM are improved, and the scanning is improved. Accuracy improved. Also, in the present modification 4, the drawing line SLa generated by the deflection scanning of the two light beams LBa and LBb of the one polygon mirror PM is similar to the above-mentioned first embodiment and its modification examples 1 to 3. , SLb can also be set to a length of, for example, about 30 mm to 80 mm, and the length can be set to a precision corresponding to the fineness (minimum line width) of the pattern to be drawn or the effective size (diameter) of the light spots SPa and SPb while maintaining a linear length.

In addition, in the above modification 4, the light beams LBa and LBb deflectedly scanned by the polygon mirror PM, as shown in FIG. 16A , are incident on the polarization within the effective angle range θs corresponding to the lengths of the drawing lines SLa and SLb. Beam splitters PBSa, PBSb. Therefore, the degree of separation of the P-polarized light and the S-polarized light of the polarization beam splitters PBSa and PBSb, that is, the extinction ratio is set to be the maximum angle range θs or more. As an example of the above-described polarizing beam splitters PBSa and PBSb, a polarizing beam splitter in which a hafnium oxide (HfO2) film and a silicon dioxide (SiO2) film are laminated on a polarized light separation surface has been disclosed in International Publication Gazette No. 2014/073535.

[Second Embodiment]

FIG. 17 is a diagram showing the configuration of a part of the drawing unit Ua in the second embodiment. Since each drawing unit Ua has the same configuration, in the second embodiment, the drawing unit Ua2 that scans the light spots SPa and SPb along the drawing lines SL2a and SL2b is also described as an example. In addition, the same code|symbol is attached|subjected to the same structure as the said 1st Embodiment. In addition, only the part different from the said 1st Embodiment is demonstrated.

In the second embodiment, the polygon mirror PM is provided so that the rotation axis AXp extends in the Xt axis direction, and the fθ lenses FTa and FTb are provided so that the optical axes AXfa and AXfb extend in the Zt axis direction. The light beams LBa and LBb advancing in the -Zt axis direction are incident on two reflecting surfaces RP (reflection surfaces RPb in FIG. 17 , which form an angle of 90° with each other in the YtZt plane among the eight reflecting surfaces RP of the polygon mirror PM). , RPh). The first reflection surface RP (here, RPh) of the polygon mirror PM reflects the light beam LBa incident from the first direction toward the −Yt direction side, and guides it to the reflection mirror M6a. The light beam Lba reflected by the mirror M6a advances in the −Zt direction, passes through the fθ lens FTa and the cylindrical lens CY2a, and then enters the substrate P. Through the fθ lens FTa and the cylindrical lens CY2a, the light beam LBa incident on the substrate P becomes a light spot SPa on the irradiated surface of the substrate P. As shown in FIG. In addition, the second reflecting surface RP (here, RPb) of the polygon mirror PM reflects the light beam LBb incident from the second direction different from the first direction toward the +Yt direction side, and guides it to the reflecting mirror M6b. The light beam LBb reflected by the mirror M6b advances in the −Zt direction, passes through the fθ lens FTb and the cylindrical lens CY2b, and then enters the substrate P. Through the fθ lens FTb and the cylindrical lens CY2b, the light beam LBb incident on the substrate P becomes a light spot SPb on the irradiated surface of the substrate P. As shown in FIG. The light spots SPa and SPb projected on the irradiated surface of the substrate P are scanned at the same speed on the drawing lines SL2a and SL2b by the rotation of the polygon mirror PM.

In this way, since the polygon mirror PM is provided so that the rotation axis AXp extends in the Xt axis direction, and the fθ lenses FTa and FTb are provided so that the optical axes AXfa and AXfb thereof extend in the Zt axis direction, there is no need for the above-described first embodiment. Reflecting mirrors M7a and M7b are provided in the same form, and the mirrors M7a and M7b reflect the light beams LBa and LBb traveling in the -Xt direction through the fθ lenses FTa and FTb in the -Z direction. Even in this configuration, the same effects as those of the first embodiment described above can be obtained.

In addition, in the second embodiment, the reflecting mirror M6a, the fθ lens FTa and the cylindrical lens CY2a function as the first projection optical system 24a, and the reflecting mirror M6b, the fθ lens FTb and the cylindrical lens CY2b function as the second projection optical system The system 26a functions. The drawing unit Ua according to the second embodiment can also be rotated around the rotation center axis AXr, which passes through the center point of the line segment connecting the midpoint of the drawing line SL2a and the midpoint of the drawing line SL2b, and is relative to the substrate. The irradiated surface of P passes vertically.

In addition, in the second embodiment, although not shown in the drawings, the first light guide optical system 20 and the second light guide optical system 22 of the above-mentioned first embodiment are replaced so that the light beams LBa from the light source device 14, The first light guide optical system and the second light guide optical system for guiding the light beams LBa and LBb to the polygon mirror PM are arranged so that the LBb advances in the -Z direction and is incident on the polygon mirror PM.

As described in Modification 3 of the first embodiment, the light beam LB is incident on the reflection surface RP obliquely with respect to the direction intersecting the rotation direction of the reflection surface RP (the direction in which the rotation axis AXp of the polygon mirror PM extends), Thereby, the incident direction and the reflection direction of the light beams LBa and LBb can also be shifted in the direction of the rotation axis AXp. Therefore, the same effects as those of Modification 3 of the first embodiment described above can be obtained.

Also, as described in Modification 1 of the first embodiment, when the polygon mirror PM is viewed from a direction orthogonal to the rotation axis AXp, the rotation axis AXp of the polygon mirror PM may be inclined with respect to the Xt direction. Moreover, the polygon mirror PMa demonstrated in the modification 2 of the said 1st Embodiment can also be used. That is, the rotation axis AXp of the polygon mirror PM in FIG. 17 is parallel to the Xt axis, and each of the polygon mirror PM may be formed so as to be inclined by the angle θy as shown in FIG. 15 from the state parallel to the rotation axis AXp. Reflecting surfaces RP (RPa to RPh). Thereby, by making the light beams LBa and LBb incident on the respective reflecting surfaces RP (RPa to RPh) of the polygon mirror PM obliquely incident with respect to the respective reflecting surfaces RP, as viewed from the direction orthogonal to the rotation axis AXp, it is possible to The same effects as those of Modification 1 and Modification 2 of the first embodiment described above are obtained.

[third embodiment]

18 is a configuration diagram of the drawing unit Ub according to the third embodiment viewed from the -Yt (-Y) direction side, and FIG. 19 is a configuration diagram of the drawing unit Ub from the polygon mirror PMb to the +Zt side viewed from the +Xt direction side FIG. 20 is a diagram showing the configuration of the drawing unit Ub from the polygon mirror PMb toward the −Zt direction side as viewed from the +Zt direction side. In addition, the same code|symbol is attached|subjected to the same structure as the said 1st Embodiment. In addition, only the part different from the said 1st Embodiment is demonstrated.

As shown in FIG. 19 , the drawing unit Ub includes a triangular mirror (right-angle mirror) M10 whose ridge line is parallel to the Xt axis, mirrors M11a, M11b, offset optical members SRa, SRb, and a cylindrical lens CY1a whose generatrix is parallel to the Xt axis , CY1b, polygon mirror PMb with 8 reflecting surfaces RP, mirrors M12a, M12b, mirrors M13a, M13b, mirrors M14a, M14b, fθ lenses FTa, FTb, mirrors M15a, M15b, and the busbar parallel to the Yt axis Optical system of cylindrical lenses CY2a, CY2b. For an optical system in which the two light beams LBa, LBb are arranged in pairs, a, b are added after the reference symbols.

As shown in FIG. 19 , the two light beams LBa and LBb (both are parallel light beams) from the light source device 14 are arranged in parallel with the central axis of rotation AXr in between, travel in the −Zt direction, and are incident on the drawing unit Ub across the The different reflection surfaces M10a and M10b of the ridgeline of the triangular mirror M10. The light beams LBa and LBb are incident on the respective reflection surfaces M10a and M10b of the triangular mirror M10 of the drawing unit Ub so as to be symmetrical in the Yt direction with respect to the rotation center axis AXr parallel to the Zt axis. The reflection surface M10a of the triangular mirror M10 reflects the light beam LBa in the -Yt direction and guides it to the mirror M11a, and the reflection surface M10b of the triangular mirror M10 reflects the light beam LBb in the +Yt direction and guides it to the mirror M11b. The light beam Lba reflected by the mirror M11a travels in the −Zt direction, passes through the shift optical member SRa and the cylindrical lens CY1a, and then enters the reflection surface RP (eg, reflection surface RPa) of the polygon mirror PMb. The light beam LBb reflected by the mirror M11b travels in the −Zt direction, passes through the shift optical member SRb and the cylindrical lens CY1b, and then enters the reflection surface RP (eg, reflection surface RPe) of the polygon mirror PMb. The reflection surface RPa and the reflection surface RPe of the polygon mirror PMb are located at symmetrical positions with respect to the rotation axis AXp of the polygon mirror PMb.

In the third embodiment, as shown in FIG. 20 , the rotation axis AXp of the polygon mirror PMb is set to be coaxial with the rotation center axis AXr. The triangular mirror M10 and the mirrors M11a and M11b (see FIG. 19 ) widen the distance in the Yt direction between the respective center lines of the light beams LBa and LBb incident on the polygon mirror PMb. Thereby, the distance between the optical axes of the light beams LBa and LBb incident on the drawing unit Ub can be shortened, and the light beams LBa and LBb incident on the drawing unit Ub (triangular mirror M10 ) can be brought closer to the rotation center axis AXr. As a result, even when the entire drawing unit Ub rotates, the position of the respective center lines of the light beams LBa and LBb accompanying the rotation can be suppressed from greatly changing within the drawing unit Ub. The positional change of the respective center lines of the light beams LBa and LBb accompanying the rotation of the drawing unit Ub is corrected by the offset optical members SRa and SRb which function similarly to the first embodiment.

In addition, the reflection surface M10a of the triangular mirror M10, the reflection mirror M11a, the shift optical member SRa, and the cylindrical lens CY1a serve as the first light guide optics for guiding the light beam LBa toward the first reflection surface RP (RPa) of the polygon mirror PMb The system 20b functions. In addition, the reflection surface M10b of the triangular mirror M10, the reflection mirror M11b, the shift optical member SRb, and the cylindrical lens CY1b serve as a second reflection surface RP (RPe) different from the first reflection surface for directing the light beam LBb toward the polygon mirror PMb. The introduced second light guide optical system 22b functions. In addition, each reflection surface M10a, M10b of the triangular mirror M10 may be a plane mirror provided individually in the 1st light guide optical system 20b and the 2nd light guide optical system 22b. In addition, the cylindrical lens CY1a (the same is true for CY1b) has a refractive power to converge the light beam LBa (LBb) incident as a parallel light beam only in the Yt direction, so that the light spot extending in a slit shape along the Xt direction is projected to On the reflection surface RPa (reflection surface RPe) of the polygon mirror PMb.

When observed in the XtYt plane, as shown in FIG. 20 , the polygon mirror PMb of the third embodiment has a regular octagon shape, and eight reflective surfaces RPa to RPh are formed around it (in FIG. 19 , RPa is shown in the figure). -RPe) are each formed so as to be inclined by 45 degrees with respect to the rotation axis AXp (rotation center axis AXr). That is, the polygon mirror PMb has a shape obtained by cutting a regular octagonal pyramid with an appropriate thickness along the direction of the center line, the bottom surface of which is a regular octagon, and each of the eight side surfaces is inclined by 45° with respect to the center line. Spend. Therefore, the respective reflecting surfaces (RPa to RPh) of the polygon mirror PMb reflect the light beam Lba traveling in the -Zt direction at right angles to the -Yt direction side, guide it to the reflecting mirror M12a, and reflect the light beam Lba traveling in the -Zt direction at a right angle. The light beam LBb is reflected at right angles to the +Yt direction side and guided to the mirror M12b. Therefore, as in Modification 2 of the first embodiment described above, the polygon mirror PMb can be centered on each center line AXs (coaxial with each of the optical axes AXfa and AXfb of the two fθ lenses FTa and FTb) within a fixed angular range. Within θs, the light beams LBa and LBb reflected by, for example, the reflecting surfaces RPa and RPe among the eight reflecting surfaces RPa to RPh are reflected. Thereby, the optical performance, scanning linearity, and isokinetic properties of the light beams LBa and the light spots SPa and SPb of the polygon mirror PMb are improved, and the scanning accuracy (drawing accuracy) is improved.

As shown in FIGS. 18 and 20 , the light beam LBa from the polygon mirror PMb (eg, reflecting surface RPa) reflected in the −Xt direction by the mirror M12a is guided to the fθ lens FTa via the mirrors M13a and M14a. Similarly, the light beam LBb from the polygon mirror PMb (for example, the reflection surface RPe) reflected in the +Xt direction by the mirror M12b is guided to the fθ lens FTb via the mirrors M13b and M14b. The reflection mirror M13a reflects the light beam LBa from the reflection mirror M12a in the -Xt direction at the bending position p13a in the -Zt direction, and the reflection mirror M14a reflects the light beam LBa from the reflection mirror M13a in the +Xt direction at the bending position p14a. Lead to the fθ lens FTa. The reflection mirror M13b reflects the light beam LBb from the reflection mirror M12b in the +Xt direction at the bending position p13b in the -Zt direction, and the reflection mirror M14b reflects the light beam LBb from the reflection mirror M13a in the -Xt direction at the bending position p14b. Lead to fθ lens FTb. 20, the light beam Lba incident on the fθ lens FTa through the mirrors M12a, M13a, and M14a becomes substantially parallel when viewed in the XtYt plane by the action of the cylindrical lens CY1a. When the light beam is observed in the XtZt plane, it becomes a diverging light beam as shown in FIG. 18 .

The light beam LBa traveling in the +Xt direction through the fθ lens FTa (the optical axis AXfa is parallel to the Xt axis) is reflected in the -Zt direction by the mirror M15a in the telecentric state, and becomes a circular shape after passing through the cylindrical lens CY2a The light spot SPa is projected on the irradiated surface of the substrate P. As shown in FIG. Similarly, the light beam LBb traveling in the -Xt direction through the fθ lens FTb (the optical axis AXfb is parallel to the Xt axis) is reflected in the -Zt direction by the mirror M15b in the telecentric state, and after passing through the cylindrical lens CY2b, it becomes The circular light spot SPb is projected on the irradiated surface of the substrate P. As shown in FIG. By the fθ lens FTa and the cylindrical lens CY2a, the light beam LBa projected on the substrate P converges on the irradiated surface of the substrate P into a minute light spot SPa. Similarly, through the fθ lens FTb and the cylindrical lens CY2b, the light beam LBb projected on the substrate P converges on the irradiated surface of the substrate P into a minute light spot SPb. The two light spots SPa and SPb projected on the irradiated surface of the substrate P simultaneously perform one-dimensional scanning on the drawing lines SLa and SLb by the rotation of one polygon mirror PMb. In the case of the configuration of the third embodiment, the two light spots SPa and SPb scan and move in opposite directions to each other along the drawing lines SLa and SLb. Next, as shown in FIG. 20 , when the polygon mirror PMb is rotated clockwise in the XtYt plane, the +Yt direction end of the drawing line SLa that becomes the Yt direction connecting portion of the drawing pattern and the drawing The ends in the −Yt direction of the line SLb are the scanning end positions of the light spots SPa and SPb, respectively. Conversely, when the polygon mirror PMb is rotated counterclockwise in the XtYt plane, the +Yt direction end of the drawing line SLa and the −Yt direction end of the drawing line SLb that become the Yt direction connecting portion of the drawing pattern become the light spots SPa, respectively. , the scan start position of SPb.

In the above configuration, the mirrors M12a, M13a, M14a, M15a, the fθ lens FTa, and the cylindrical lens CY2a function as the first projection optical system 24b that deflects the reflection by the polygon mirror PMb. The scanned light beam LBa is condensed and projected on the drawing line SLa as a light spot SPa. In addition, the mirrors M12b, M13b, M14b, M15b, the fθ lens FTb, and the cylindrical lens CY2b function as a second projection optical system 26b that deflects the scanned light beam reflected by the polygon mirror PMb The LBb is condensed and projected onto the drawing line SLb as a light spot SPb.

Furthermore, as shown in FIGS. 18 and 20 , in the third embodiment, the optical path length from the reflection surface RP of the polygon mirror PMb to the fθ lenses FTa and FTb is extended by the reflection mirrors M12a to M14a and M12b to M14b therebetween. , therefore, as the fθ lenses FTa and FTb, the longer focal distance on the light beam incident side can be used. In general, the reflection surface of the polygon mirror PM (the same applies to PMa and PMb) is arranged at or near the focal distance fs (pupil position) on the beam incident side of the telecentric fθ lens FTa (FTb). Therefore, if the length of the drawing line SLa (SLb) on the irradiated surface is Lss, and the deflection angle range of the light beam entering the fθ lens at this time is θs, it can be approximated that Lss≒fs·sin( θs) relationship. Therefore, when the length Lss of the drawing line SLa (SLb) is set to a fixed value, the deflection angle range θs can be reduced correspondingly by using an fθ lens with a long focal length fs. This means that the rotation angle range θs/2 of the polygon mirror PM (PMa, PMb) that contributes to one scan of the light spot SPa (SPb) along the drawing line SLa (SLb) is reduced, which is advantageous for speeding up .

In the drawing unit Ub according to the third embodiment, as shown in FIG. 20, the drawing line SLa and the drawing line SLb are set to be shifted in the Yt direction so that the drawing line SLa of each of the scanning light spot SPa and the light spot SPb is different from the drawing line SLa. The drawing lines SLb are spaced apart from each other in the sub-scanning direction, and in the main-scanning direction, the ends adjoin or partially overlap. That is, the drawing lines SLa and SLb are spaced apart in the sub-scanning direction (the conveyance direction of the substrate P) in a parallel state, and are arranged so as to be continuous without a gap in the main-scanning direction. Therefore, in the case of arranging a plurality of such drawing units Ub, for example, it is arranged as shown in FIG. 21 .

FIG. 21 shows an example of a situation in which, corresponding to the previous FIG. 2 , the exposure area W formed on the substrate P as the electronic component forming area is divided into six along the Y (Yt) direction, and the six drawing lines SL1a, SL1a, SL1b, SL2a, SL2b, SL3a, and SLb draw patterns in each of the plurality of band-shaped divided regions WS1 to WS6. Here, the two drawing lines SL1a and SL1b of the first drawing unit Ub1 having the same configuration as the drawing unit Ub described above in FIGS. 18 to 20 are set to the divided regions adjacent to each other along the Y direction. WS1, WS2 draw patterns. Similarly, the two drawing lines SL2a, SL2b of the second drawing unit Ub2 having the same configuration as the drawing unit Ub are set to draw patterns on the divided areas WS3, WS4 adjacent to the Y direction, respectively, and the drawing unit Ub The two drawing lines SL3a and SL3b of the third drawing unit Ub3 having the same configuration are set to draw patterns on the divided regions WS5 and WS6 adjacent to each other along the Y direction, respectively. At the connection part STa of the divided area WS1 and the divided area WS2, the connection part STb of the divided area WS2 and the divided area WS3, the connection part STc of the divided area WS3 and the divided area WS4, the connection part STd of the divided area WS4 and the divided area WS5, and At the connection portion STe of the divided area WS5 and the divided area WS6, the Y-direction position of each of the drawing lines is precisely adjusted so that the ends of the six drawing lines SL1a, . Or the drawing magnification of each drawing line.

In this way, in the third embodiment, the two drawing lines SLa and SLb for scanning the light spots SPa and SPb by the drawing units Ub ( Ub1 to Ub3 ) are set so as to be separated from each other in the sub-scanning direction and to be separated from each other in the main scanning direction. In the direction, the ends abut or partially overlap. Even in this case, the rotation center axis AXr when the entire drawing unit Ub is slightly rotated can be set to pass through the center point of a line segment connecting the midpoints of the two drawing lines SLa and SLb perpendicular to the substrate P. Therefore, even in the case where the entire drawing unit Ub is rotated about the rotational center axis AXr in order to obtain high superposition accuracy, the two drawing lines SLa and SLb that scan the light spots SPa and SPb by the drawing unit Ub can be suppressed from being swept on the substrate. Since the positional displacement on P becomes large, it is possible to easily adjust the inclination of the drawing lines SLa and SLb (inclination with respect to the Y axis in the irradiated surface) while performing high-precision pattern drawing.

In addition, in each of the above-described embodiments (including modifications), the drawing lines SL of the plurality of drawing units U, Ua, and Ub are all set to the same scan length, but the scan lengths may be different. In this case, the scan lengths of the drawing lines SL may be different between the drawing units U, Ua, Ub, or the scan lengths of the drawing lines SLa, SLb may be different in the same drawing units U, Ua, Ub. Further, the rotation center axis AXr may pass through the center point of a line segment connecting the respective midpoints of the drawing lines SLa and SLb of the drawing units U, Ua, Ub perpendicular to the substrate P, but the rotation center axis AXr may be It is a direction perpendicular|vertical with respect to the board|substrate P, and is set on the line segment which connects each midpoint of the drawing lines SLa and SLb.

In the case of the above third embodiment, in order to perform pattern drawing on the irradiated surface of the substrate P supported by the rotating drums DR1 and DR2 in a cylindrical shape along the longitudinal direction as in the first embodiment, as follows: As shown in FIG. 22, as long as the extension line of the optical axis AXfa (AXfb) bent by the mirror M15a (M15b) after the fθ lens FTa (FTb) of the drawing unit Ub is directed toward the central axis ( Rotate the central axis) AXo1 or AXo2, set the inclination of the mirror M15a (M15b) in the XZ plane to an angle other than 45 degrees, and also focus on the inclined optical axis AXfa (AXfb), The cylindrical lens CY2a (CY2b) may be arranged obliquely with respect to the XY plane. Moreover, when supporting the board|substrate P flatly parallel to the XY plane, for example, the conveyance apparatus disclosed in International Publication No. WO 2013/150677 can be used. Moreover, instead of the rotating drums DR1 and DR2, a pad member (substrate support and holder) having a plurality of fine gas ejection holes formed on the surface curved in a cylindrical shape may be used. (and a plurality of fine suction holes), and the back side of the substrate P is supported by a gas bearing in a non-contact or low friction state so that the substrate P is bent cylindrically in the longitudinal direction and supports the substrate P. Moreover, in the above-described first to second embodiments and their modifications, the rotating drums DR1 and DR2 may be replaced with the flat support substrate parallel to the XY plane disclosed in International Publication No. WO 2013/150677. As the conveying device of P, the above-mentioned pad member (substrate support holder) that supports the back side of the substrate P in a non-contact or low friction state by a gas bearing may be used.

[Modifications of the first to third embodiments]

The first embodiment to the third embodiment may have the following modified examples.

(Modification 1) FIG. 23 is a diagram showing a configuration of an example of a beam distribution system for distributing, for example, the light beam LB (two light beams LBa, LBb) supplied from the light source device 14 shown in FIG. 1 . to each of the 4 drawing units U1 , U2 , U5 , U6 in FIG. 2 . In addition, this light beam distribution system can be applied not only to the drawing apparatus of the first embodiment, but also to the drawing apparatuses of the second embodiment, the third embodiment, and their modifications.

The light source device 14 is provided with a laser light source LS that outputs a high-intensity laser beam (continuous light or pulsed light) in the ultraviolet region, and a beam that converts the light beam from the laser light source LS into a parallel beam of a predetermined diameter (for example, a diameter of several mm) The expander BX, the 1st beam splitter (half mirror) BS1 and the surface mirror MR1 which divide the light beam which becomes a parallel light beam into two. The light beam reflected by the beam splitter BS1 enters the second beam splitter BS2a as the light beam LBa, and the light beam passing through the beam splitter BS1 is reflected by the mirror MR1 and enters the second beam splitter BS2b as the light beam LBb. The division ratio of the beam splitter BS1 is 1:1, and the respective light intensities (illuminance) of the light beams LBa and LBb are substantially equal. The light beam LBa incident on the beam splitter BS2a and the light beam LBb incident on the beam splitter BS2b are further divided into two at the same intensity ratio.

Among the light beams LBa incident on the beam splitter BS2a, the light beam LBa passing through the beam splitter BS2a is incident on the third beam splitter BS3a (the division ratio is 1:1). Of the light beams LBb incident on the beam splitter BS2b, the light beam LBb passing through the beam splitter BS2b is incident on the third beam splitter BS3b (the division ratio is 1:1). The two light beams LBa, LBb reflected by each of the beam splitters BS3a, BS3b are parallel to each other with the rotation center axis AXr of the drawing unit U1 interposed therebetween, and are directed toward the corresponding optical elements AOMa, AOMb (see FIG. 5, etc.). Draw unit U1. Then, after the two light beams LBa, LBb passing through each of the beam splitters BS3a, BS3b are reflected by the mirrors MR2a, MR2b, respectively, they are parallel to each other with the rotation center axis AXr of the drawing unit U2 sandwiched therebetween, and pass through the corresponding optical element AOMa. , AOMb toward the rendering unit U2.

Further, the previous light beam LBa reflected by the beam splitter BS2a is incident on the fourth beam splitter BS4a (the division ratio is 1:1), and the previous light beam LBb reflected by the beam splitter BS2b is incident on the fourth beam splitter. BS4b (split ratio is 1:1). The two light beams LBa, LBb reflected by each of the beam splitters BS4a, BS4b are parallel to each other across the rotation center axis AXr of the drawing unit U5, and head toward the drawing unit U5 through the corresponding optical elements AOMa, AOMb. Then, after the two light beams LBa, LBb passing through each of the beam splitters BS4a, BS4b are reflected by the mirrors MR3a, MR3b, respectively, they are parallel to each other with the rotation center axis AXr of the drawing unit U6 sandwiched therebetween, and pass through the corresponding optical element AOMa. , AOMb toward the rendering unit U6. With the above configuration, the light beams LBa and LBb distributed to each of the four drawing units U1 , U2 , and U5 are all set to substantially equal light intensities.

Further, the laser light source in the light source device 14 may be any of a solid-state laser and a gas laser as long as it emits a high-intensity light beam having a wavelength in the ultraviolet region. If a fiber laser light source is used as the solid-state laser, a high-output ultraviolet beam can be obtained despite a relatively small housing, and it can be easily incorporated into the main body of the exposure apparatus (drawing apparatus) EX. The above-mentioned fiber laser light source uses The fiber amplifier amplifies a beam of infrared wavelength (pulse light of several hundreds of MHz) from a semiconductor laser diode, and emits a beam of ultraviolet wavelength (pulsed light) through a wavelength conversion element. Furthermore, in the above-mentioned first to third embodiments and each modification example, the drawing unit U (Ua, Ub) that can be rotated around the rotation center axis AXr is in the main body of the exposure apparatus EX. The structure without a light source for drawing may be sufficient to draw (expose) a pattern by utilizing the intensity of a light beam from a semiconductor laser diode (LD), a light emitting diode (LED), or the like. An LD or LED for supplying the light beams LBa and LBb is provided in each of the drawing units U (Ua, Ub). However, the temperature of the light source unit formed of the above-mentioned LD or LED increases considerably during the pattern drawing operation, so it is necessary to provide a temperature adjustment mechanism for heat insulation, cooling, etc. of the light source unit in the drawing unit U (Ua, Ub). , in order to suppress the temperature change of the whole drawing unit U (Ua, Ub) small. In this case, the optical elements AOMa and AOMb shown in FIG. 5 are also arranged in each drawing unit U (Ua, Ub).

(Modification 2) In each of the above-described first to third embodiments and their modifications, the polygon mirrors PM (PMa, PMb) have eight reflections arranged at intervals of 45 degrees around the rotation axis AXp Although the number of reflecting surfaces may be any number, 3 to 6 surfaces, 9 surfaces, 10 surfaces, 12 surfaces, 15 surfaces, 16 surfaces, 18-sided, 20-sided, etc. polygon mirrors. In general, even if the diameter of the polygon mirror is the same, the larger the number of reflecting surfaces, the smaller the wind loss, so that it can be rotated at a higher speed. In addition, in each of the first to third embodiments and their modifications, although illustration and description are omitted, origin sensors are provided at two places around the polygon mirror PM (PMa, PMb). Scanning of the two light beams LBa, LBb reflected by the origin sensor on each of the different reflecting surfaces of the polygon mirror PM (PMa, PMb) and the light spots SPa, SPb on the drawing lines (scanning lines) SLa, SLb When the starting point corresponds to the corresponding reflection direction, the origin signal is output. Management of scanning positions of light spots SPa and SPb along drawing lines SLa and SLb (offset setting, etc.) or intensity modulation of light spots SPa and SPb based on pattern data (on/off of optical elements AOMa and AOMb) The timing and the like of ON) are controlled based on the origin signal and the clock signal corresponding to the scanning speed of the light spots SPa and SPb.

[4th Embodiment]

In the above-described first to third embodiments and their modifications, the optical paths from the polygon mirror PM (PMa, PMb) to the fθ lenses FTa and FTb are provided with mirrors M6a, M6b or M12a, M12b, the reflecting mirrors M6a, M6b or M12a, M12b are on the surface that deflects the light beams LBa, LBb reflected by the polygon mirror PM (PMa, PMb) (in the embodiment of FIG. 5, FIG. 6, FIGS. 12 to 16 18 to 20, the plane parallel to the XtYt plane, and in the embodiment of FIG. 17, the plane parallel to the YtZt plane), the light beams LBa and LBb are bent. When the light beams LB (LBa, LBb) from the light source device 14 are in the ultraviolet wavelength band longer than the wavelength of about 240 nm, the polygon mirror PM (PMa, PMb) or the reflecting surface of each reflecting mirror is on the glass or ceramic mother. An aluminum layer with high reflectivity is vapor-deposited on the surface of the material, and a dielectric thin film (single-layer or multi-layer) for preventing oxidation and the like is vapor-deposited on the aluminum layer. In the case of the polygon mirror PM, aluminum is used to form the main body of the base material, and after optical polishing is performed on the portion to be the reflection surface, a dielectric thin film (single-layer or multi-layer) is vapor-deposited on the surface. In the polygon mirror PM (PMa, PMb) or the mirrors M6a, M6b, M12a, M12b having such a structure of reflecting surfaces, the incident angles of the light beams LBa, LBb incident on the reflecting surface are deflected according to the beam direction for main scanning The angle greatly changes, and when the light beams LBa and LBb have polarization characteristics, it is sometimes impossible to ignore the tendency of the intensity of the reflected light beam to change according to the change of the incident angle, that is, the incident angle dependence of the reflectance of the reflecting surface. sexual influence.

FIG. 24 is a diagram illustrating the state of the incident angle or reflection angle of the light beam LBa projected on each of the polygon mirror PM and the mirror M6a described in FIG. 17 in the YtZt plane. The situation described in FIG. 24 can be similarly generated in other embodiments ( FIGS. 5 , 6 , 12 to 16 , and 18 to 20 ). In FIG. 24, when the angle θo of one reflecting surface RPh of the polygon mirror PM in the YtZt plane is 45°, the light beam LBa incident parallel to the Zt axis is reflected by the reflecting surface RPh so as to be parallel to the Yt axis, It bends by 90° by the mirror M6a, and advances coaxially with the optical axis AXfa of the subsequent fθ lens FTa. If the polygon mirror PM is a polygon mirror rotated clockwise in FIG. 24 , the starting point of effective scanning of the light spot SPa along the drawing line SL2a (SLa) is the point where the reflection surface RPh reaches the angle θo−Δθa in the YtZt plane. The time point, the end point of the effective scanning of the light spot SPa, is the time point when the reflection surface RPh reaches the angle θo+Δθa in the YtZt plane. Therefore, the deflection angle range of the light beam LBa reflected by the reflection surface RPh of the polygon mirror PM and directed toward the reflection mirror M6a with respect to the optical axis AXfa is ±2Δθa. When the deflection angle of the light beam LBa with respect to the optical axis AXfa is +2Δθa, the incident angle θm1 of the light beam LBa projected on the reflection surface of the mirror M6a is θm1=45°−2Δθa, when the deflection angle of the light beam LBa with respect to the optical axis AXfa When it is -2Δθa, the incident angle θm2 of the light beam LBa projected on the reflection surface of the mirror M6a is θm2=45°+2Δθa.

Here, the influence of the change in the incident angle of the light beam LBa incident on the mirror M6a will be described with reference to FIG. 25 . 25 is a graph illustrating the incident angle-dependent characteristic CV1 of the reflectance observed when a light beam having a polarization characteristic in the ultraviolet wavelength band is incident on a reflective surface composed of an aluminum layer and a dielectric thin film, with the vertical axis The reflectance (%) of the reflective surface is shown, and the horizontal axis represents the incident angle (degree) of the light beam incident on the reflective surface. In general, the reflectivity is maximized when a light beam is projected onto a reflective surface at an angle of incidence of 0° (ie, normal incidence). For the characteristic CV1 of FIG. 25 , the maximum reflectance is about 90%. When the incident angle is about 45°, the reflectivity is about 87%, but as the incident angle further increases, the reflectivity decreases greatly. When the reflectance of each reflecting surface (RPh) of the polygon mirror PM is the same as the characteristic CV1, as shown in FIG. 24, the incident angle of the light beam LBa incident on the reflecting surface RPh of the polygon mirror PM is centered at 45° Instead, changes occur within the range of ±Δθa. Here, if the maximum deflection angle range ±2Δθa of the light beam LBa incident on the fθ lens system FTa for scanning the drawing line SLa is ±15° with the optical axis AXfa as the center, since Δθa is 7.5°, the polygon mirror The incident angle of the light beam LBa incident on the reflection surface RPh of the PM varies within a range of 37.5° to 52.5° with a center of 45°. Regarding the characteristic CV1, the reflectance at an incident angle of 37.5° was about 88%, and the reflectance at an incident angle of 52.5° was about 85.5%.

From the above, when the light beam LBa reflected by the polygon mirror PM is incident on the fθ lens system FTa in its original state, the intensity of the light spot SPa at the scanning start point on the drawing line SLa and the The intensity of the light spot SPa at the scanning end point produces a difference of 88%−85.5%=2.5%. This means that the intensity error is ±1.25% at both ends of the drawing line SLa based on the intensity of the light spot SPa in the vicinity of the center of the drawing line SLa. When the photosensitive functional layer formed on the substrate P is a photoresist or a dry film, the allowable range of the intensity deviation of the light spot SP during the main scanning process can be said to be about ±2%. If the intensity error (deviation) is ± 1.25% may be allowed.

However, as shown in FIG. 24 , after the polygon mirror PM, there is also a mirror M6a whose incident angle is greatly changed due to the deflection of the light beam LBa for main scanning, so that the light spot projected on the substrate P is The intensity of the SPa produces a larger intensity error in the main scan direction. As described above, the incident angle of the light beam LBa incident on the mirror M6a varies between θm1 and θm2. When Δθa is set to 7.5°, θm1=45°−15°=30°, and θm2=45°+15°=60°. If the incident angle dependence of the reflectance of the mirror M6a is also the same as the characteristic CV1 of FIG. 25 , the incident angle of the light beam LBa incident on the mirror M6a at the scanning start point of the light spot SPa on the drawing line SLa is θm1 =30°, therefore, the reflectivity of the mirror M6a at this incident angle is about 88.5%. Therefore, the total reflectance at the scanning start point of the light spot SPa is 77.9% (88%×88.5%) based on the product of 88% of the reflectance of the reflection surface RPh of the polygon mirror PM. In addition, at the scanning end point of the light spot SPa on the drawing line SLa, the incident angle of the light beam LBa incident on the mirror M6a is θm2=60°, so the reflectance of the mirror M6a at this incident angle is about 81 %. Therefore, the total reflectance at the scanning end point of the light spot SPa is 69.3% (85.5%×81%) based on the product of 85.5% of the reflectance of the reflection surface RPh of the polygon mirror PM. From the above, the incident angle dependence of the total reflectance of the reflection surface of the polygon mirror PM and the reflection surface of the reflection mirror M6a becomes like the characteristic CV2 in FIG. 25 . In addition, when the incident angle of the light beam LBa with respect to both the reflection surface of the polygon mirror PM and the reflection surface of the reflection mirror M6a is 45°, the total reflectance is about 75.7% (87%×87%).

As described above, the mirror M6a (the same is true for M6b, M12a, and M12b) has a surface that deflects the light beam LBa (LBb) reflected by the polygon mirror PM (parallel to the YtZt surface in the embodiment of FIG. 17 , and in other embodiments Since the reflective surface is perpendicular to the XtYt plane, the change in the incident angle of the light beam LBa (LBb) is large, and for the characteristic CV2 of FIG. 25, the light spot SPa (SPb) The intensities will yield an error of about 8.6%. This value is not necessarily within the allowable range, and if necessary, it is desirable to provide some correction (adjustment) mechanism. The characteristic CV1 shown in FIG. 25 is an example, and when the reflecting surface of the mirror is formed of a multilayer film of a dielectric, the change rate (slope) of the reflectance with respect to the incident angle may further increase. Therefore, the characteristic CV1 of the reflectance of each of the polygon mirror PM and the mirror M6a (M6b) actually used is obtained in advance through experiments, simulations, etc., and is obtained in advance with respect to the light spot SPa on the drawing line SLa (SLb). The change tendency (intensity deviation, gradient, etc.) of the beam intensity at the scanning position of (SPb).

When the change tendency of the above-mentioned beam intensity is above the allowable range, in the beam path after the mirrors M6a, M6b, M12a, and M12b, set the neutral density in which the transmittance in the main scanning direction changes continuously or in stages. The filter (ND filter) can optically suppress or correct the tendency (intensity deviation, gradient, etc.) of the intensity change with respect to the scanning position of the light spot SPa (SPb) on the substrate P. The neutral density filter can be arranged in the optical path between the mirrors M6a, M6b (M12a, M12b) and the fθ lens systems FTa, FTb, or in the optical path between the fθ lens systems FTa, FTb and the substrate P. Plano-convex second cylindrical lenses CY2a and CY2b are provided in the optical paths after the fθ lens systems FTa and FTb so as to cover the drawing lines SLa and SLb. Therefore, the second cylindrical lenses CY2a and CY2b may also be located in the vicinity of the cylindrical lenses CY2a and CY2b. Set up a neutral density filter. Further, as shown in FIGS. 5 , 18 , and 22 , mirrors M7a, M7b, M7b, M7b, M7b, M7b, LBb, LBb, and LBb emitted from the fθ lens systems FTa, FTb are provided so as to be perpendicular to the substrate P. In the case of M15a and M15b, a thin film that continuously or stepwise changes the reflectance of the mirrors M7a, M7b, M15a, and M15b in the main scanning direction may be deposited on the reflective surface, or the reflective area layer may have a thickness of The neutral density filter plate formed of thin glass of 0.1 mm or less optically adjusts (corrects) the intensity deviation with respect to the main scanning position of the light spot SPa (SPb).

The tendency (intensity deviation, gradient, etc.) of the intensity change with respect to the scanning position of the light spot SPa (SPb) may be corrected by an electrical correction mechanism. 26 is a diagram showing optical elements ( A block diagram of an example of a control system of acousto-optic modulation element, intensity modulation means) AOMa, AOMb. In FIG. 26, the drive circuit 100 outputs the high-frequency drive signal Sdv for on/off to the optical element AOMa (AOMb). Here, the so-called off state of the optical element AOMa (AOMb) means that the high-frequency drive signal Sdv is not applied to the optical element AOMa (AOMb), and the light beam LB from the light source device 14 is maintained in the original state as 0 times The state in which the light beam LBu passes through; the so-called conduction state refers to applying the high-frequency drive signal Sdv to the optical element AOMa (AOMb), and the first-order diffracted light of the light beam LB from the light source device 14 is used as the light beam LBa (LBb), A state in which it is deflected at a predetermined diffraction angle and output. The diffraction angle is determined by the frequency (eg, 80 MHz) of the drive signal Sdv (high frequency signal). Furthermore, when the amplitude of the drive signal Sdv is changed, the diffraction efficiency is changed, and the intensity of the light beam LBa (LBb), which is the first-order diffracted light, can be adjusted.

The drive circuit 100 inputs a high-frequency signal from a high-frequency oscillator SF with a fixed frequency and a stable amplitude, a drawing bit signal CLT read out from a memory in a pixel-by-bit sequence, and a control signal DE, and the memory Drawing data (pattern data) in a bitmap format in which one pixel is associated with one bit is stored. The drive circuit 100 outputs a high-frequency signal from the high-frequency oscillator SF as the drive signal Sdv during the period when the drawing bit signal CLT is at the logic value "1", and disables it during the period when the drawing bit signal CLT is at the logic value "0" The drive signal Sdv is sent out. Further, a power amplifier is provided in the drive circuit 100, and the power amplifier can change the amplitude of the high-frequency signal from the high-frequency oscillator SF according to the control signal DE. The control signal DE is an analog signal or a digital signal, for example, a value indicating the amplification ratio (gain) of the power amplifier. Here, the control signal DE is assumed to be an analog signal.

Here, a case in which the intensity of the light beam LBa (LBb) is adjusted in the pattern drawing operation of scanning the light spot SPa (SPb) along the drawing line SLa (SLb) will be described using the timing chart of FIG. 27 . Adjustment. In FIG. 27 , the origin signal generates a pulse waveform before the reflection surface of the polygon mirror PM rotates to a predetermined angular position and starts to scan the light spot SPa (SPb) on the substrate P. Therefore, when the reflective surfaces of the polygon mirror PM are eight, the pulse waveform of the origin signal is generated eight times during one rotation of the polygon mirror PM. After a fixed delay time Tsq elapses from the generation of the pulse waveform of the origin signal, a drawing ON signal (logical value "1") is generated, the drawing bit signal CLT is applied to the driving circuit 100, and the pattern drawing by the light beam LBa (LBb) starts. . At this time, the value (analog voltage) of the control signal DE changes with the characteristic CCv, that is, it increases from the value Ra when the drawing-on signal becomes the logical value "1", and when the drawing-on signal changes from the logical value The value Rb is reached when "1" becomes "0". In FIG. 27 , when the value of the control signal DE is Ro, the gain of the power amplifier in the drive circuit 100 is set to an initial value (for example, 10 times). In the case of FIG. 27 , since Ra<Ro<Rb is set, the gain of the power amplifier is set to be lower than the initial value in the vicinity of the scanning start point on the drawing line SLa where the drawing ON signal rises to “1” value, so the intensity of the light spot SPa (SPb) projected to the substrate P is smaller than the initial value. In addition, the gain of the power amplifier is set to be higher than the initial value in the vicinity of the scanning end point on the drawing line SLa where the drawing ON signal falls to “0”, so that the light spot SPa (SPb) projected on the substrate P has a higher gain than the initial value. The intensity is greater than the initial value. In this way, it is possible to electrically adjust (correct) the intensity variation depending on the position of the light spot SPa (SPb) in the main scanning direction.

The waveform of the control signal DE as described above can be generated by a simple time constant circuit (integration circuit or the like) to which the drawing ON signal or the origin signal is input. In addition, although the characteristic CCv of the control signal DE changes linearly in FIG. 27, it may change non-linearly by an appropriate filter circuit. In the case where the control signal DE is given as digital information instead of an analog waveform, it is only necessary to deform it so that the gain of the power amplifier can be changed by the digital value of the control signal DE.

As described above in FIGS. 26 and 27 , an electrical adjustment mechanism for adjusting the intensity of the light beam LBa (LBb) projected on the substrate P by changing the amplitude of the high-frequency drive signal Sdv applied to the optical element AOMa (AOMb) , is also effective when adjusting the relative intensity difference between the light beams projected onto the substrate P from each of the plurality of drawing units. In addition, the mechanism for electrically adjusting the intensity of the light beam LBa (LBb) can be realized, for example, when the light source device 14 is a semiconductor laser light source or a high-intensity LED light source that generates a laser beam in the ultraviolet wavelength band, the light source The luminous intensity can be adjusted by itself.

Furthermore, as shown in FIGS. 5 , 6 , and 17 above, in a state where the two light beams LBa and LBb directed toward the polygon mirror PM having eight reflective surfaces are parallel to each other, using the reflective surface of the polygon mirror PM When the light beam LBa and the light beam LBb are reflected by each of the reflecting surfaces having a 90° relationship, the light beam LBa and the light beam LBb spot SPa scan on the substrate P at the same timing. However, as disclosed in International Publication No. WO 2015/166910, in the case of dividing the light beam LB from one light source device 14 into the light beam LBa and the light beam LBb in a time-sharing manner, it is necessary to set so that the light beam LB The main scanning of the spot SPa and the main scanning of the light spot SPb are not performed at the same timing. In this simple embodiment, in the configuration shown in FIGS. 5 , 6 , and 17 , a polygon mirror having nine reflecting surfaces is used as the polygon mirror PM. In the case where the polygon mirror has 9 faces, for example, the sequence in which the light beam LBa is incident on the center of the rotation direction of one reflecting surface is when the other light beam LBb is incident on the 9-faceted polygon mirror between the reflecting surface and the reflecting surface (edges). line) timing. That is, by changing the number of reflecting surfaces, the timing of the main scanning of the light spot SPa and the main scanning of the light spot SPb can be shifted. 5 , 6 , and 17 , when the polygon mirror PM has 8 faces and the timings of the main scanning of the light spot SPa and the main scanning of the light spot SPb are shifted, the direction of the The light beam LBa and the light beam LBb of the polygon mirror PM may be changed from a state of being parallel to each other to a state of being non-parallel.

Claims (12)

1. A pattern drawing device for drawing a pattern corresponding to drawing data on an irradiation object by performing sub-scanning of the irradiation object, which is a flexible long sheet substrate, in a longitudinal direction and performing main scanning of a light spot intensity-modulated based on the drawing data along a scanning line extending in a width direction orthogonal to the longitudinal direction of the irradiation object, the pattern drawing device comprising:

a rotary polygon mirror that rotates around a rotation axis for the main scanning;

a1 st light guiding optical system that projects a1 st light beam from a1 st direction toward the rotary polygonal mirror;

a2 nd light guiding optical system that projects a2 nd light beam toward the rotary polygon mirror from a2 nd direction different from the 1 st direction;

a1 st projection optical system for converging the 1 st light beam reflected by the rotary polygon mirror and projecting the converged light beam as a1 st light spot onto a1 st scanning line; and

a2 nd projection optical system for condensing the 2 nd light beam reflected by the rotary polygon mirror and projecting the condensed light beam as a2 nd light spot onto a2 nd scanning line;

the 1 st projection optical system and the 2 nd projection optical system are arranged such that the 1 st scanning line and the 2 nd scanning line have the same scanning length and are separated from each other in the main scanning direction by an interval equal to or less than the scanning length.

2. The pattern drawing device according to claim 1,

the 1 st projection optical system and the 2 nd projection optical system are arranged so that the 1 st scanning line and the 2 nd scanning line are located at the same position in the sub-scanning direction on the irradiation target.

3. The pattern drawing device according to claim 1 or 2,

a rotary polygonal mirror having a plurality of reflecting surfaces arranged so as to surround the rotation axis;

a1 st light guiding optical system provided such that an incident direction of the 1 st light flux incident on a1 st reflecting surface among the plurality of reflecting surfaces of the rotary polygonal mirror is different from a reflecting direction of the 1 st light flux reflected by the 1 st reflecting surface in a direction in which the rotation axis extends;

the 2 nd light guiding optical system is provided such that an incident direction of the 2 nd light flux incident on a2 nd reflecting surface different from the 1 st reflecting surface among the plurality of reflecting surfaces of the rotary polygonal mirror is different from a reflecting direction of the 2 nd light flux reflected by the 2 nd reflecting surface in a direction in which the rotation axis extends.

4. The pattern drawing device according to claim 1 or 2,

the rotary polygonal mirror, the 1 st light guide optical system, the 2 nd light guide optical system, the 1 st projection optical system, and the 2 nd projection optical system are integrally formed as one drawing unit that is rotatable;

the rotation central axis of the drawing unit is set so as to pass through a point on a line segment perpendicular to the irradiation target, and the line segment connects the midpoint of the 1 st scanning line and the midpoint of the 2 nd scanning line.

5. The pattern drawing device according to claim 4,

the 1 st light flux and the 2 nd light flux are incident on the drawing unit so as to be symmetrical with respect to the rotation center axis.

6. The pattern drawing device according to claim 5,

the drawing unit includes a reflecting member that reflects the incident 1 st light flux and 2 nd light flux and guides the reflected light fluxes to the 1 st light guiding optical system and the 2 nd light guiding optical system.

7. The pattern drawing device according to claim 5,

the 1 st light guiding optical system includes a1 st shift optical member that shifts a position of the 1 st light beam reflected by the reflecting member within a plane intersecting a traveling direction of the 1 st light beam;

the 2 nd light guiding optical system includes a2 nd shifting optical member that shifts a position of the 2 nd light beam reflected by the reflecting member in a plane intersecting a traveling direction of the 2 nd light beam.

8. The pattern drawing device according to claim 4,

a plurality of the drawing units are provided;

each of the plurality of drawing units is disposed such that the 1 st scanning line and the 2 nd scanning line are in contact with each other along the width direction of the irradiation object.

9. The pattern drawing device according to claim 8, comprising:

a1 st rotating cylinder having a1 st central axis extending in a width direction orthogonal to a longitudinal direction of the irradiation target and a cylindrical outer peripheral surface having a fixed radius from the 1 st central axis, and configured to rotate around the 1 st central axis as a center to convey the irradiation target while bending and supporting a part of the irradiation target in a longitudinal direction in conformity with the outer peripheral surface, thereby sub-scanning the irradiation target; and

a2 nd rotating cylinder which is provided on a downstream side in a transport direction of the 1 st rotating cylinder, has a2 nd central axis extending in a width direction orthogonal to a longitudinal direction of the irradiated object, and a cylindrical outer peripheral surface having a constant radius from the 2 nd central axis, and transports the irradiated object by rotating around the 2 nd central axis while bending and supporting a part of the irradiated object in the longitudinal direction in conformity with the outer peripheral surface, thereby sub-scanning the irradiated object;

the plurality of drawing units are arranged such that the 1 st scan line and the 2 nd scan line of a predetermined number of the drawing units are positioned on the irradiation object supported on the outer peripheral surface of the 1 st rotating cylinder, and the 1 st scan line and the 2 nd scan line of the remaining drawing units are positioned on the irradiation object supported on the outer peripheral surface of the 2 nd rotating cylinder.

10. A pattern drawing method for drawing a pattern corresponding to drawing data on an irradiation object by performing main scanning of a light spot intensity-modulated based on the drawing data along a scanning line extending in a width direction orthogonal to a longitudinal direction of the irradiation object while performing sub-scanning of the irradiation object, which is a flexible long sheet substrate, in the longitudinal direction, includes the steps of:

projecting a1 st light beam from a1 st direction toward the rotating polygon mirror;

projecting a2 nd light beam toward the rotary polygon mirror from a2 nd direction different from the 1 st direction;

deflecting the 1 st light beam and the 2 nd light beam incident on different reflection surfaces of the rotary polygon mirror and reflected by the rotation of the rotary polygon mirror;

converging the 1 st light beam reflected by the rotary polygon mirror and projecting the converged light beam as a1 st light spot onto a1 st scan line; and

condensing the 2 nd light beam reflected by the rotating polygon mirror and projecting the condensed light beam as a2 nd light spot onto a2 nd scan line;

the 1 st scanning line and the 2 nd scanning line are set to have the same scanning length, and the 1 st scanning line and the 2 nd scanning line are set apart in the main scanning direction at an interval equal to or less than the scanning length.

11. The pattern drawing method according to claim 10, comprising the steps of:

the 1 st scanning line and the 2 nd scanning line are rotated around a rotation central axis as a center, and the rotation central axis passes through a point on a line segment connecting a midpoint of the 1 st scanning line and a midpoint of the 2 nd scanning line perpendicularly to the irradiated object.

12. The pattern drawing method according to claim 10,

the 1 st light flux and the 2 nd light flux are incident on the rotary polygon mirror from directions symmetrical with respect to a rotation center axis.

Images