CN107731661A - A kind of glassivation chip glass cement painting method and device - Google Patents
A kind of glassivation chip glass cement painting method and device Download PDFInfo
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- CN107731661A CN107731661A CN201711122066.8A CN201711122066A CN107731661A CN 107731661 A CN107731661 A CN 107731661A CN 201711122066 A CN201711122066 A CN 201711122066A CN 107731661 A CN107731661 A CN 107731661A
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- glass cement
- chip
- sucker
- silica gel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention discloses a kind of glassivation chip glass cement painting method and device.Glassivation chip glass cement coating unit, including special motor, special sucker, special motor connection have hollow motor rotating shaft, and hollow motor rotating shaft connects special sucker, is fixed with chip on special sucker, the hollow motor rotating shaft is connected with vacuum system.Chip at the uniform velocity rotates on special sucker, glass cement is coated in center wafer position by silica gel spoon, then the silica gel spoon that moves linearly is passed through, by glass cement by center wafer position outwards until edge carries out pushing away painting, glass cement can be uniformly adhered to wafer surface during afer rotates by the pushing of silica gel spoon.
Description
Technical field
The present invention relates to semiconductor electronic component manufacturing technology field, more particularly, to a kind of glassivation chip
Glass cement painting method and device.
Background technology
With the development of semiconductor technology, the requirement more and more higher to semiconductor surface passivation is blunt as diode one kind
Change material, should undoubtedly possess：First, good electric property and reliability.Including resistivity, dielectric strength, ionic mobility
Deng.The introducing of material should not bring side effect to device；Second, good chemical stability.In recent years, used in the market
A kind of cry more and more higher of the higher glassivation of reliability (GPP) silicon diode, and obtain the general of personage in electronics industry
All over accreditation.This GPP chip is that (glass passivation process temperature allow also can after) uses light before the metallization of silicon diffusion sheet
Photoresist mask and etching V-groove or the mechanical table top for drawing V-groove.Then, glass dust is applied on knot surface to carry out table top
Passivation Treatment.The suspension that glass powder is made up of some adhesives and the mixing of the fine glass dust of high-purity.By glass dust
Suspension is by certain process coated in V-groove, adhesive is burned off at high temperature, and glass melting is simultaneously entirely being tied
Seal protection layer is formed on surface.
Coating glass mainly has three kinds of methods：Electrophoresis, photoetching process and knife coating, at present knife coating use polytetrafluoroethylene (PTFE)
Plate makes angle scraper, by least act 5 steps is applied to wafer surface by glass cement by hand, and because of manual operations, each step
Gap and scraper dynamics difference cause wafer surface glass cement thickness to differ, and have a strong impact on that subsequent wafer is processed, and special to chip
Property easily cause it is bad, therefore study it is a kind of glass cement can be coated uniformly on to wafer surface method it is very necessary.
The content of the invention
It is an object of the present invention to overcome the deficiencies in the prior art, there is provided a kind of glassivation chip glass cement coating
Method, while quality problems caused by manual operations are reduced, and improve production efficiency by associated machines.
The present invention adopts the following technical scheme that：
A kind of glassivation chip glass cement painting method, the glass cement that coating glass powder is prepared with adhesive, the painting
Coating method comprises the following steps：
(1) chip is fixed：
The chip of glass cement to be coated is put in special sucker, and is in concentric position, vacuum switch is opened, by crystalline substance
Piece is adsorbed in special chuck surface；
(2) silica gel bale-out glue, rotation is opened：
With a certain amount of glass cement of silica gel bale-out, drip in center wafer position, while press motor rotary switch, chip companion
Rotated with special sucker；
(3) silica gel spoon is at the uniform velocity outer moves：
Silica gel spoon bottom and center wafer glass cement surface gentle touchdown, and by silica gel spoon along straight line to Waffer edge at the uniform velocity
Mobile, traveling time is identical with sucker rotational time；
(4) wafer surface glass cement thickness is controlled by adjusting special sucker rotating speed and rotational time, completes coating：
Glass cement by silica gel spoon bottom pushes away painting, and special sucker centrifugal force is uniformly coated on wafer surface in addition, and passes through
Special sucker rotating speed and rotational time control wafer surface glass cement thickness is adjusted, reaches wafer surface glass cement consistency of thickness.
The amount of glass cement determines that glass cement amount is 2-4g according to the capacity of silica gel spoon in the step (1).
Special 500-800 revs/min of sucker rotating speed in the step (2).
The traveling time about 5-8 seconds identical with sucker rotational time in the step (3).
The wafer surface glass cement thickness is about 50-70um.
The silica gel spoon is polytetrafluoroethylene (PTFE) material, has acid-alkali-corrosive-resisting high-temperature stability, and pollution-free to glass cement.
A kind of glassivation chip glass cement coating unit, including special motor, special sucker, during special motor connection has
Empty machine shaft, hollow motor rotating shaft connect special sucker, and chip, the hollow motor rotating shaft connection are fixed with special sucker
There is vacuum system；Special suction cup interior has vacuum groove, and center drilling is vacuum hole, communicates to form vacuum tube with machine shaft
Road；Chip is put into special chuck surface, connects vacuum system, and chip is adsorbed in special chuck surface, opens special motor, chip
Rotated with special sucker with hollow motor rotating shaft, vacuum system is discharged after end of run, removes chip.
The special motor connection has motor speed control box, and motor speed control box is provided with motor rotary switch；Electricity
Machine rotating speed control box sets multistage rotating speed, realizes that the slow-speed of revolution is changed to high rotating speed, and can set rotational time.
The vacuum system is connected with magnetic valve, and magnetic valve is connected with vacuum switch.
The special sucker is Teflon material, and Surface Machining is fluted, and is communicated to the true of special sucker center
At emptying aperture, i.e., chip is positioned over special chuck surface, is opened by vacuum switch, and chip is firmly adsorbed in special sucker
Surface, and as special sucker is rotated.
Use the advantageous effects that as above scheme obtains for：
Chip is at the uniform velocity rotated on special sucker, and glass cement is coated in center wafer position by silica gel spoon, is then passed through
Move linearly silica gel spoon, and by glass cement by center wafer position outwards until edge carries out pushing away painting, glass cement is in afer rotates mistake
Wafer surface can be uniformly adhered to by the pushing of silica gel spoon in journey.
Brief description of the drawings
Fig. 1 is glassivation chip glass cement coating unit structural representation of the present invention.
Fig. 2 illustrates for glassivation chip glass cement painting method process of the present invention.
In figure, 1, motor speed control box, 2, motor rotary switch, 3, special motor, 4, special sucker, 5, chip, 6,
Hollow motor rotating shaft, 7, magnetic valve, 8, vacuum switch.
Embodiment
It is described further with reference to 1 to 2 pair of specific embodiment of the invention of accompanying drawing：
A kind of glassivation chip glass cement painting method, the painting method comprise the following steps：
(1) chip of glass cement to be coated is put in special sucker, and is in concentric position, open vacuum switch,
Chip is adsorbed in special chuck surface；
(2) a certain amount of glass cement of silica gel bale-out is used, is dripped in center wafer position, while presses motor rotary switch, it is brilliant
Piece is rotated with special sucker；
(3) silica gel spoon bottom and center wafer glass cement surface gentle touchdown, and by silica gel spoon along straight line to Waffer edge
At the uniform velocity move, traveling time is identical with sucker rotational time；
(4) glass cement by silica gel spoon bottom push away painting in addition special sucker centrifugal force be uniformly coated on wafer surface, and
Wafer surface glass cement thickness is controlled by adjusting special sucker rotating speed and rotational time, reaches wafer surface glass cement thickness one
Cause.
The amount of glass cement determines that glass cement amount is 2-4g according to the capacity of silica gel spoon in the step (1).
Special 500-800 revs/min of sucker rotating speed in the step (2).
The traveling time about 5-8 seconds identical with sucker rotational time in the step (3).
The wafer surface glass cement thickness is about 50-70um.
The silica gel spoon is polytetrafluoroethylene (PTFE) material, has acid-alkali-corrosive-resisting high-temperature stability, and pollution-free to glass cement.
A kind of glassivation chip glass cement coating unit, for realizing above-mentioned glassivation chip glass cement coating side
Method.It includes special motor 3, special sucker, and special motor 3 is connected with hollow motor rotating shaft 6, and hollow motor rotating shaft 6 connects spy
Sucker processed, chip 5 is fixed with special sucker, the hollow motor rotating shaft is connected with vacuum system；Special suction cup interior has very
Empty groove, center drilling are vacuum hole, communicate to form vacuum line with machine shaft；Chip is put into special chuck surface, connects
Vacuum system, chip are adsorbed in special chuck surface, open special motor, chip enters with special sucker and hollow motor rotating shaft
Row rotates, and discharges vacuum system after end of run, removes chip.
Silica gel spoon is suspended in above chip, can be operated by the spoon of holding of operating personnel, can also be set special silica gel spoon and fix
And mobile device, drive silica gel spoon contact chip and at the uniform velocity move.
The special motor connection has motor speed control box 1, and motor speed control box 1 is provided with motor rotary switch 2；
Motor speed control box 1 sets multistage rotating speed, realizes that the slow-speed of revolution is changed to high rotating speed, and can set rotational time.
The vacuum system is connected with magnetic valve 7, and magnetic valve 7 is connected with vacuum switch 8.
The special sucker is Teflon material, and Surface Machining is fluted, and is communicated to the true of special sucker center
At emptying aperture, i.e., chip is positioned over special chuck surface, is opened by vacuum switch 8, and chip is firmly adsorbed in special suction
Panel surface, and as special sucker is rotated.
Glassivation chip glass cement coating unit reduces quality problems caused by manual operations, and is set by associated mechanical
It is standby to improve production efficiency.
Chip is at the uniform velocity rotated on special sucker, and glass cement is coated in center wafer position by silica gel spoon, is then passed through
Move linearly silica gel spoon, and by glass cement by center wafer position outwards until edge carries out pushing away painting, glass cement is in afer rotates mistake
Wafer surface can be uniformly adhered to by the pushing of silica gel spoon in journey.
Certainly, described above is only presently preferred embodiments of the present invention, and the present invention is not limited to enumerate above-described embodiment, should
When explanation, any those skilled in the art are all equivalent substitutes for being made, bright under the guidance of this specification
Aobvious variant, all falls within the essential scope of this specification, ought to be protected by the present invention.
Claims (10)
1. a kind of glassivation chip glass cement painting method, it is characterised in that the painting method comprises the following steps：
(1) chip of glass cement to be coated is put in special sucker, and is in concentric position, vacuum switch is opened, by crystalline substance
Piece is adsorbed in special chuck surface；
(2) a certain amount of glass cement of silica gel bale-out is used, is dripped in center wafer position, while presses motor rotary switch, chip companion
Rotated with special sucker；
(3) silica gel spoon bottom and center wafer glass cement surface gentle touchdown, and by silica gel spoon along straight line to Waffer edge at the uniform velocity
Mobile, traveling time is identical with sucker rotational time；
(4) glass cement by silica gel spoon bottom pushes away painting special sucker centrifugal force is uniformly coated on wafer surface in addition, and passes through
Special sucker rotating speed and rotational time control wafer surface glass cement thickness is adjusted, reaches wafer surface glass cement consistency of thickness.
A kind of 2. glassivation chip glass cement painting method according to claim 1, it is characterised in that the step
(1) amount of glass cement determines that glass cement amount is 2-4g according to the capacity of silica gel spoon in.
A kind of 3. glassivation chip glass cement painting method according to claim 1, it is characterised in that the step
(2) special 500-800 revs/min of sucker rotating speed in.
A kind of 4. glassivation chip glass cement painting method according to claim 1, it is characterised in that the step
(3) the traveling time about 5-8 seconds identical with sucker rotational time in.
A kind of 5. glassivation chip glass cement painting method according to claim 1, it is characterised in that the chip table
Surface glass glue thickness is about 50-70um.
A kind of 6. glassivation chip glass cement painting method according to claim 1, it is characterised in that the silica gel spoon
For polytetrafluoroethylene (PTFE) material, there is acid-alkali-corrosive-resisting high-temperature stability, and it is pollution-free to glass cement.
A kind of 7. glassivation chip glass cement coating unit, it is characterised in that including special motor (3), special sucker (4),
Special motor (3) is connected with hollow motor rotating shaft (6), and hollow motor rotating shaft (6) connects special sucker (4), on special sucker (4)
Chip (5) is fixed with, the hollow motor rotating shaft (6) is connected with vacuum system；
There is vacuum groove inside special sucker (4), center drilling is vacuum hole, communicates to form vacuum with hollow motor rotating shaft (6)
Pipeline；
Chip (5) is put into special sucker (4) surface, connects vacuum system, chip (5) absorption is in special sucker (4) surface, opening
Special motor (3), chip (5) are rotated with special sucker (4) with hollow motor rotating shaft (6), are discharged after end of run true
Empty set is united, and removes chip (5).
A kind of 8. glassivation chip glass cement coating unit according to claim 7, it is characterised in that the special electricity
Machine (3) is connected with motor speed control box (1), and motor speed control box (1) is provided with motor rotary switch (2)；
Motor speed control box (1) sets multistage rotating speed, when realizing that the slow-speed of revolution is changed to high rotating speed, and can set rotation
Between.
A kind of 9. glassivation chip glass cement coating unit according to claim 7, it is characterised in that the vacuum system
System is connected with magnetic valve (7), and magnetic valve (7) is connected with vacuum switch (8).
10. a kind of glassivation chip glass cement coating unit according to claim 7, it is characterised in that described special
Sucker (4) is Teflon material, and Surface Machining is fluted, and is communicated at the vacuum hole of special sucker (4) center, i.e., brilliant
Piece (5) is positioned over special sucker (4) surface, is opened by vacuum switch (8), and chip (5) is firmly adsorbed in special suction
Disk (4) surface, and as special sucker (4) is rotated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711122066.8A CN107731661A (en) | 2017-11-14 | 2017-11-14 | A kind of glassivation chip glass cement painting method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711122066.8A CN107731661A (en) | 2017-11-14 | 2017-11-14 | A kind of glassivation chip glass cement painting method and device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107731661A true CN107731661A (en) | 2018-02-23 |
Family
ID=61215896
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711122066.8A Pending CN107731661A (en) | 2017-11-14 | 2017-11-14 | A kind of glassivation chip glass cement painting method and device |
Country Status (1)
| Country | Link |
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Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241945A (en) * | 1987-03-28 | 1988-10-07 | Mitsubishi Metal Corp | Wafer arrangement device |
| CN1104372A (en) * | 1993-08-26 | 1995-06-28 | 施蒂格微技术施特伦费尔斯有限公司 | Apparatus for coating base sheet of semiconductor products with film |
| CN101038892A (en) * | 2007-04-25 | 2007-09-19 | 天津中环半导体股份有限公司 | Knife scraping method glass passivation process for silicon current rectifier |
| CN101905205A (en) * | 2009-06-08 | 2010-12-08 | 株式会社东芝 | Film formation device and film build method |
| WO2011102201A1 (en) * | 2010-02-17 | 2011-08-25 | 東京エレクトロン株式会社 | Application method and application device |
| US20140000517A1 (en) * | 2012-06-27 | 2014-01-02 | Tokyo Electron Limited | Coating apparatus and nozzle |
| US20150336114A1 (en) * | 2014-05-22 | 2015-11-26 | Tokyo Electron Limited | Coating processing apparatus |
| US20160038965A1 (en) * | 2014-08-11 | 2016-02-11 | Tokyo Electron Limited | Substrate processing apparatus |
| CN106024865A (en) * | 2016-07-19 | 2016-10-12 | 如皋市大昌电子有限公司 | Mesa diode processing technology |
-
2017
- 2017-11-14 CN CN201711122066.8A patent/CN107731661A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63241945A (en) * | 1987-03-28 | 1988-10-07 | Mitsubishi Metal Corp | Wafer arrangement device |
| CN1104372A (en) * | 1993-08-26 | 1995-06-28 | 施蒂格微技术施特伦费尔斯有限公司 | Apparatus for coating base sheet of semiconductor products with film |
| CN101038892A (en) * | 2007-04-25 | 2007-09-19 | 天津中环半导体股份有限公司 | Knife scraping method glass passivation process for silicon current rectifier |
| CN101905205A (en) * | 2009-06-08 | 2010-12-08 | 株式会社东芝 | Film formation device and film build method |
| WO2011102201A1 (en) * | 2010-02-17 | 2011-08-25 | 東京エレクトロン株式会社 | Application method and application device |
| KR20120101180A (en) * | 2010-02-17 | 2012-09-12 | 도쿄엘렉트론가부시키가이샤 | Application method and application device |
| US20140000517A1 (en) * | 2012-06-27 | 2014-01-02 | Tokyo Electron Limited | Coating apparatus and nozzle |
| US20150336114A1 (en) * | 2014-05-22 | 2015-11-26 | Tokyo Electron Limited | Coating processing apparatus |
| US20160038965A1 (en) * | 2014-08-11 | 2016-02-11 | Tokyo Electron Limited | Substrate processing apparatus |
| CN106024865A (en) * | 2016-07-19 | 2016-10-12 | 如皋市大昌电子有限公司 | Mesa diode processing technology |
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