CN107706299A - A kind of stack PZT (piezoelectric transducer) and preparation method suitable for road piezo-electric generating - Google Patents

Abstract

The invention provides a stacked piezoelectric transducer suitable for road piezoelectric power generation and a manufacturing method. The manufacturing method sequentially manufactures a circular ceramic substrate, a rounded corner ceramic substrate, and a rounded corner piezoelectric ceramic single piece. , making stacked piezoelectric ceramics, making stacked piezoelectric transducers. The present invention optimizes the structure and shape of the piezoelectric ceramic sheet from the manufacturing process to ensure the symmetry and uniformity of the electrode coating on both sides, and the fillet technology can make the electrode layer and the ceramic sheet have a good fit to avoid porcelain leakage phenomenon, to achieve good durability and long service life; at the same time, the setting of metal plates on both sides can increase the structural integrity and strength. The stacked piezoelectric transducer prepared by the invention is suitable for road piezoelectric power generation and has the advantages of high force-to-electricity conversion efficiency, high rigidity, regular structure, and the like.

Description

A stacked piezoelectric transducer suitable for road piezoelectric power generation and its manufacturing method

technical field

The invention belongs to the field of road engineering and relates to road piezoelectric power generation, in particular to a stacked piezoelectric transducer suitable for road piezoelectric power generation and a manufacturing method.

Background technique

my country's road network is becoming more and more developed, and roads bear more and more vehicle loads. The constant impact and vibration of the vehicle load will generate a steady stream of mechanical energy. If this mechanical energy is effectively collected and converted into electrical energy, it will be used as another clean energy besides solar energy, wind energy, and nuclear energy. At this stage, my country is actively developing a clean production capacity model for new intelligent piezoelectric power generation surfaces, which is of great practical significance to the practice of green transportation, the promotion of green road construction, and the completion of the "13th Five-Year Development Plan for Energy Conservation and Environmental Protection in Transportation".

At present, stacked piezoelectric transducers have the characteristics of high force-to-electricity conversion efficiency, good road coupling and durability, and are more suitable for energy harvesting in the road field with large loads, low frequencies, and complex working environments. Commonly used stacked piezoelectric transducer manufacturing processes include monolithic co-firing method and electrode bonding method. According to the existing data, since the sintering temperature of the monolithic co-sintering method is lower than the optimum sintering temperature of the monolithic electrode bonding method, its energy conversion and mechanical properties and other parameters are slightly lower than the optimal parameters, which affects the piezoelectric ceramics. At the same time, although the stacked piezoelectric transducer made by the monolithic co-firing method has good integrity, it is brittle and will be destroyed as a whole once it is damaged, while the stacked piezoelectric transducer made by the electrode bonding method The integrity and anti-destructive performance of the transducer are better, so the electrode bonding method is suitable as the production process of the piezoelectric transducer for road use.

However, when the electrode bonding method is used to manually paint the electrodes, due to the edges and corners on the outer edge of the ceramic sheet, there will be problems such as poor adhesion between the electrode layer and the ceramic sheet, ceramic leakage, etc., and it is difficult to ensure the symmetry of the two sides of the electrode layer. In addition, there will be problems such as lateral slippage of piezoelectric ceramic sheets when stacking. Therefore, there is an urgent need for an optimization scheme so that piezoelectric transducers can be mass-produced and maximize their efficiency to meet the needs of the road energy harvesting field.

Contents of the invention

Aiming at the deficiencies in the prior art, the purpose of the present invention is to provide a stacked piezoelectric transducer suitable for road piezoelectric power generation and a manufacturing method, so as to solve the problems of poor durability and short service life of existing piezoelectric transducers. technical problem.

In order to solve the above technical problems, the present invention adopts the following technical solutions to achieve:

A method for manufacturing a stacked piezoelectric transducer suitable for road piezoelectric power generation, the method includes the following steps:

Step 1. Making a circular ceramic substrate:

Making a circular ceramic substrate by a conventional method;

Step 2. Making a rounded corner ceramic substrate:

Fix the circular ceramic substrate obtained in step 1 with a fixture, and grind from the symmetrical two ends of the circular ceramic substrate to the center of the circle to form a pair of symmetrical electrode bonding end faces; use a chamfering tool to bond one electrode end face One edge of the electrode is rounded, and the other edge of the bonded end face of the other electrode is rounded with a chamfering tool to form a round chamfer. The two round chamfers are respectively connected with the circular ceramic substrate. The two different surfaces of the chip are connected to make a rounded ceramic substrate;

Step 3, making a piezoceramic monolithic piece with rounded corners:

Each of the two surfaces of the rounded ceramic substrate prepared in step 2 is also provided with a partition area respectively, and the partition area and the circular chamfer are oppositely arranged on the two surfaces of the rounded ceramic substrate, and the end of the partition area Through the electrode bonding end face; the positions on the two surfaces of each rounded ceramic substrate except the isolation area are conductive areas;

Use a screen printing machine to print insulating epoxy resin glue in the partition area, use a screen printing machine to print conductive silver glue in the conductive area, and use a manual pen to brush conductive silver glue on the bonding end of the electrode;

Dry at 150°C for 15 minutes, then polarize the rounded ceramic substrates, so that the conductive region on one surface of each rounded ceramic substrate forms a positive electrode surface, and the conductive region on the other surface forms a negative electrode surface. Obtain a piezoceramic monolithic piece with rounded corners;

Step 4, making stacked piezoelectric ceramics:

Stack multiple rounded piezoelectric ceramic monoliths prepared in step 3 in a physical series and electrical parallel manner, and fix and clamp them with a clamping device. After vertical static pressure, the temperature is raised to 120°C and cured for 4 to 5 hours. Prepare stacked piezoelectric ceramics;

The physical series connection and the electrical parallel connection method are as follows:

Stack multiple piezoceramics with rounded corners to achieve physical series connection;

The positive surfaces of adjacent rounded piezoelectric ceramic monoliths are in contact with each other through conductive silver glue, so that the positive surfaces of multiple rounded piezoelectric ceramic monoliths are connected in parallel; the adjacent rounded piezoelectric ceramic monoliths The negative electrode surfaces are in contact with each other through conductive silver glue, so that the negative electrode surfaces of multiple rounded piezoelectric ceramic monoliths are also connected in parallel; a pair of circular chamfers of adjacent rounded piezoelectric ceramic monoliths are adjacently arranged , a pair of isolation areas of adjacent rounded piezoelectric ceramic monoliths are in contact with each other through insulating epoxy resin glue, so that the positive and negative surfaces of multiple rounded piezoelectric ceramic monoliths connected in parallel are isolated from each other, realizing electrical parallel connection ;

Step five, making the stacked piezoelectric transducer:

The two ends of the stacked piezoelectric ceramics prepared in step 4 are respectively formed by a plurality of electrode bonding end faces to form an electrode bonding surface, that is, a positive electrode bonding surface and a negative electrode bonding surface, and a positive electrode is bonded to the positive electrode bonding surface. A metal sheet, the negative electrode metal sheet is bonded to the negative electrode bonding surface, and the positive electrode metal sheet and the negative electrode metal sheet are respectively connected to the wire through solder joints;

The top surface insulating tiles are bonded to the top surface of the stacked piezoelectric ceramics, and the bottom insulating tiles are bonded to the bottom surface of the stacked piezoelectric ceramics to obtain a stacked piezoelectric transducer.

The present invention also has the following distinguishing technical features:

In step 1, as a preference, the conventional method for making a circular ceramic substrate is: calcining and ball milling the ceramic powder, mixing it with a solvent, a dispersant and a defoamer, and then adding a bonding agent after wet ball milling. agent, plasticizer and lubricant, and then mixed and milled for 12 hours for the second time to form a slurry, which was formed and cut by a tape casting machine, and a circular ceramic substrate was obtained after debinding and sintering.

In step 2, the distance from the electrode bonding end surface to the center of the circular ceramic substrate is 0.3 mm smaller than the radius of the circular ceramic substrate; the diameter of the circular ceramic substrate is 30 mm;

In step 2, the chamfering radius during the rounding treatment is 0.3-0.6 times, preferably 0.5 times, the thickness of the circular ceramic substrate.

In step 2, the clamp fixes the circular ceramic substrate in a manner of clamping up and down.

In step 4, the clamping device includes a pair of clamping half-shells matching the stacked piezoelectric ceramics, the two side edges of the pair of fastening half-shells are connected by hinges, and the pair of fastening half-shells The other two side edges are provided with a pair of fastening buckles; the bottom of the pair of fastening half-shells is matched with a base.

In Step 4, the vertical static pressure is 20kPa, and the heating rate is 3°C/min.

In step five, the solder joints are sealed with epoxy resin.

A stacked piezoelectric transducer suitable for road piezoelectric power generation, the stacked piezoelectric transducer is manufactured by the above-mentioned manufacturing method.

Compared with the prior art, the present invention has the following technical effects:

(I) The present invention optimizes the structure and shape of the piezoelectric ceramic sheet from the manufacturing process to ensure the symmetry and uniformity of the electrode coating on both sides, and the fillet process can make the electrode layer and the ceramic sheet have good adhesion Avoid porcelain leakage, achieve good durability and long service life; at the same time, the setting of metal plates on both sides can increase the structural integrity and strength.

(II) The manufacturing process of the piezoelectric transducer of the present invention is simple, the cost is low, the cost performance is high, and it can be used in different road conditions.

(Ⅲ) The stacked piezoelectric transducer prepared by the present invention has simple structure, convenient manufacturing process, good durability, long service life, strong practicability, can collect more electric energy, and can be widely used in highways and urban roads And roads in special areas and reconstruction of old roads. Stacked piezoelectric transducers suitable for road piezoelectric power generation have the advantages of high force-to-electricity conversion efficiency, high rigidity, and regular structure.

Description of drawings

Fig. 1 is a schematic diagram of the overall structure of a stacked piezoelectric transducer.

Fig. 2 is a schematic diagram of an exploded structure of a stacked piezoelectric transducer.

Fig. 3 is a schematic diagram of the structure of stacked piezoelectric ceramics.

Fig. 4 is a schematic structural view of the positive electrode surface of the rounded corner piezoelectric ceramic monolith.

Fig. 5 is a structural schematic diagram of the negative electrode surface of the rounded corner piezoelectric ceramic monolith.

Fig. 6 is a schematic diagram of the state of rounding the circular ceramic substrate.

FIG. 7 is a schematic structural view of a rounded corner ceramic substrate obtained after corner rounding treatment.

Fig. 8 is a structural schematic diagram of the tightening device.

The meaning of each label in the figure is: 1-circular ceramic substrate, 2-fixture, 3-electrode bonding end surface, 4-electrode bonding end surface, 5-round chamfer, 6-rounded ceramic substrate, 7 -Separation area, 8-conductive area, 9-insulating epoxy resin glue, 10-conductive silver glue, 11-positive electrode surface, 12-negative electrode surface, 13-rounded piezoelectric ceramic monolithic, 14-stacked piezoelectric ceramic , 15-Positive electrode bonding surface, 16-Negative electrode bonding surface, 17-Positive electrode metal sheet, 18-Negative electrode metal sheet, 19-Solder point, 20-Tightening device, 21-Chamfering tool, 22-Wire, 23- Top insulating tiles, 24-bottom insulating tiles;

(20-1) - hoop half shell, (20-2) - hoop half shell, (20-3) - hinge, (20-4) - buckle, (20-5) - base;

A and B represent an electrode bonding end face, respectively.

The specific content of the present invention will be further explained in detail below in conjunction with the examples.

detailed description

Specific embodiments of the present invention are provided below, and it should be noted that the present invention is not limited to the following specific embodiments, and all equivalent transformations done on the basis of the technical solutions of the present application all fall within the scope of protection of the present invention.

Example:

According to the above technical solution, as shown in Figures 1 to 8, this embodiment provides a method for manufacturing a stacked piezoelectric transducer suitable for road piezoelectric power generation. The method includes the following steps:

Step 1. Making a circular ceramic substrate:

A circular ceramic substrate 1 is fabricated by a conventional method.

In this embodiment, as a preferred method, the conventional method for making a circular ceramic substrate is: calcining and ball-milling the ceramic powder, mixing it with a solvent, a dispersant, and a defoamer, and then adding a binder, The plasticizer and the lubricant are mixed and milled for a second time for 12 hours to form a slurry, which is molded and cut by a tape casting machine, and a circular ceramic substrate is obtained after debinding and sintering.

Step 2. Making a rounded corner ceramic substrate:

Fix the circular ceramic substrate 1 obtained in step 1 with a fixture 2, and grind from the symmetrical two ends of the circular ceramic substrate 1 to the center of the circle to form a pair of symmetrical electrode bonding end faces 3 and 4; use a chamfering tool 21. Carry out rounding processing on one edge of one electrode bonding end face 3, and perform rounding processing on the other edge of the other electrode bonding end face 4 with a chamfering tool 21 to form a circular chamfering 5. Two circular chamfers 5 are respectively connected to two different surfaces of the circular ceramic substrate 1 to obtain a rounded ceramic substrate 6;

In this embodiment, the distance from the electrode bonding end faces 3 and 4 to the center of the circular ceramic substrate 1 is 0.3 mm smaller than the radius of the circular ceramic substrate 1 . The diameter of the circular ceramic substrate 1 is 30mm;

In this embodiment, the chamfering radius during the rounding process is 0.3-0.6 times the thickness of the circular ceramic substrate 1, and a preferred result in this embodiment is 0.5 times.

In this embodiment, the clamp 2 clamps and fixes the circular ceramic substrate 1 in a manner of clamping up and down.

Step 3, making a piezoceramic monolithic piece with rounded corners:

The two surfaces of the rounded ceramic substrate 6 prepared in each step 2 are also respectively provided with an isolation zone 7, and the isolation zone 7 and the circular chamfer 5 are oppositely arranged on the two surfaces of the rounded ceramic substrate 6, The end of the isolation area 7 penetrates the electrode bonding end faces 3, 4; the positions on the two surfaces of each rounded ceramic substrate 6 except the isolation area 7 are conductive areas 8;

Use a screen printing machine to print insulating epoxy resin glue 9 in the partition area 7, use a screen printing machine to print conductive silver glue 10 in the conductive area 8, and use a manual pen to brush the conductive silver glue 10 on the electrode bonding end faces 3 and 4;

Dry at 150°C for 15 minutes, then polarize the rounded ceramic substrate 6, so that the conductive region 8 on one surface of each rounded ceramic substrate 6 forms a positive electrode surface 11, and the conductive region 8 on the other surface Forming the negative electrode surface 12 to produce a rounded piezoelectric ceramic monolith 13;

Step 4, making stacked piezoelectric ceramics:

Stack the multiple rounded piezoelectric ceramic monoliths 13 prepared in step 3 in a physical series and electrical parallel manner, and fix and clamp them with a clamping device 20, heat up to 120°C after vertical static pressure, and cure for 4 to 5 hours, a stacked piezoelectric ceramic 14 was prepared;

The pressure of vertical static pressure is 20kPa, and the rate of temperature increase is 3°C/min.

The physical series connection and the electrical parallel connection method are as follows:

A plurality of rounded piezoelectric ceramic monoliths 13 are stacked to realize physical series connection.

The positive surfaces 11 of adjacent rounded piezoelectric ceramic monoliths 13 are in contact with each other through conductive silver glue 10, so that the positive surfaces of multiple rounded piezoelectric ceramic monoliths 13 are connected in parallel; adjacent rounded piezoelectric ceramics The negative electrode surfaces 12 of the ceramic monoliths 13 are in contact with each other through the conductive silver glue 10, so that the negative electrode surfaces 12 of multiple rounded piezoelectric ceramic monoliths 13 are also connected in parallel; adjacent rounded piezoelectric ceramic monoliths 13 A pair of circular chamfers 5 are arranged adjacently, and a pair of isolation regions 7 of adjacent rounded piezoelectric ceramic monoliths 13 are in contact with and insulated by insulating epoxy resin glue, so that a plurality of rounded corner piezoelectric ceramic monoliths 13 are connected in parallel The conductive positive electrode surface 11 and the negative electrode surface 12 are isolated from each other to realize electrical parallel connection.

The clamping device 20 in this embodiment includes a pair of clamping half-shells 20-1, 20-2 matched with the stacked piezoelectric ceramics 14, and a pair of clamping half-shells 20-1, 20-2. The side edges are connected by hinges 20-3, and the other two side edges of a pair of fastening half shells 20-1, 20-2 are provided with a pair of fastening buckles 20-4; The bottom of the half shells 20-1, 20-2 is equipped with a base 20-5.

Step five, making the stacked piezoelectric transducer:

The two ends of the stacked piezoelectric ceramic 14 prepared in step 4 are respectively formed by a plurality of electrode bonding end faces 3 to form an electrode bonding surface, that is, the positive electrode bonding surface 15 and the negative electrode bonding surface 16, and the positive electrode bonding surface 15 A positive electrode metal sheet 17 is bonded to the top, and a negative electrode metal sheet 18 is bonded to the negative electrode bonding surface 16. The positive electrode metal sheet 17 and the negative electrode metal sheet 18 are respectively connected to the wire 22 through solder joints 19;

A top insulating ceramic sheet 23 is bonded to the top surface of the stacked piezoelectric ceramic 14, and a bottom insulating ceramic sheet 24 is bonded to the bottom surface of the stacked piezoelectric ceramic 14 to obtain a stacked piezoelectric transducer.

The solder joints 19 in this embodiment are sealed by insulating epoxy glue 9 .

Example 2:

This embodiment provides a stacked piezoelectric transducer suitable for road piezoelectric power generation. As shown in FIGS.

Claims (9)

1. A kind of 1. preparation method of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, it is characterised in that the making side Method comprises the following steps：

   Step 1: make round ceramic substrate：

   Round ceramic substrate (1) is made using conventional method；

   Step 2: make fillet ceramic substrate：

   Round ceramic substrate (1) made from step 1 is fixed with fixture (2), from the symmetrical both ends of round ceramic substrate (1) to Circle centre position is polished, and forms a pair of symmetrical electrode adhesion end faces (3,4)；With chamfer tool (21) to an electrode adhesion end face (3) a arris carries out rounding processing, another arris with chamfer tool (21) to another electrode adhesion end face (4) Rounding processing is carried out, forms rounded corners (5), two rounded corners (5), two differences with round ceramic substrate (1) respectively Surface is connected, and fillet ceramic substrate (6) is made；

   Step 3, make fillet piezoelectric ceramics monolithic：

   Made from each step 2 exclusion region (7), exclusion region are also respectively provided with two surfaces of fillet ceramic substrate (6) (7) it is oppositely arranged with rounded corners (5) on two surfaces of fillet ceramic substrate (6), the end through electrode of exclusion region (7) Bond end face (3,4)；Position on two surfaces of each fillet ceramic substrate (6) in addition to exclusion region (7) is conduction region (8)；

   Insulating epoxy glue (9) is printed in exclusion region (7) using screen process press, using screen process press in conduction region (8) Conductive silver glue (10) is printed, using manual pen in electrode adhesion end face (3,4) brushing conductive silver glue (10)；

   Dry 15 minutes under the conditions of 150 DEG C, then fillet ceramic substrate (6) is polarized so that each fillet ceramic base The conduction region (8) on one surface of piece (6) forms positive pole-face (11), and the conduction region (8) on another surface forms negative pole face (12), Fillet piezoelectric ceramics monolithic (13) is made；

   Step 4, make stack piezoelectric ceramics：

   Multiple fillet piezoelectric ceramics monolithics (13) made from step 3 are stacked in a manner of physics series connection and electrical parallel, are used in combination Tightening device (20) fixed clamp, 120 DEG C are warming up to after vertical static pressure and is solidified 4~5 hours, stack piezoelectric ceramics is made (14)；

   Described physics series connection and the mode of electrical parallel are specially：

   Multiple fillet piezoelectric ceramics monolithics (13) are stacked and realize that physics is connected；

   It is in contact conducting by conductive silver glue (10) between the positive pole-face (11) of adjacent fillet piezoelectric ceramics monolithic (13) so that more The positive pole-face turned in parallel of individual fillet piezoelectric ceramics monolithic (13)；The negative pole face (12) of adjacent fillet piezoelectric ceramics monolithic (13) it Between be in contact conducting by conductive silver glue (10) so that also parallel connection is led in the negative pole face (12) of multiple fillet piezoelectric ceramics monolithics (13) It is logical；A pair of rounded corners (5) of adjacent fillet piezoelectric ceramics monolithic (13) are disposed adjacent, adjacent fillet piezoelectric ceramics monolithic (13) A pair of exclusion regions (7) be in contact insulation by insulating epoxy glue so that multiple fillet piezoelectric ceramics monolithics (13) are in parallel The positive pole-face (11) of conducting and negative pole face (12) mutually completely cut off, and realize electrical parallel；

   Step 5, make stack PZT (piezoelectric transducer)：

   The both ends of stack piezoelectric ceramics (14) made from step 4 are bonded into end face (3) each self-forming one by multiple electrodes respectively Individual electrode adhesion face, i.e. positive pole adhesive surface (15) and negative pole adhesive surface (16), positive pole adhesive surface are bonded with cathode metal on (15) Piece (17), negative metal piece (18), cathode metal piece (17) and negative metal piece (18) point are bonded with negative pole adhesive surface (16) It is not connected by solder joint (19) with wire (22)；

   Top surface insulation ceramics (23) is bonded in the top surface of stack piezoelectric ceramics (14), in the bottom surface of stack piezoelectric ceramics (14) Bottom surface insulation ceramics (24) is bonded, stack PZT (piezoelectric transducer) is made.
2. 2. preparation method as claimed in claim 1, it is characterised in that in step 1, as a preferred embodiment, described making circle The conventional method of shape ceramic substrate is：It will be mixed after ceramic powder calcining and ball milling with solvent, dispersant and defrother, wet method ball Binding agent, plasticizer and lubricant are added after mill, then secondary mix grinding 12h forms slurry, is molded and cuts using casting machine, row Round ceramic substrate is made after glue sintering.
3. 3. preparation method as claimed in claim 1, it is characterised in that in step 2, described electrode adhesion end face (3,4) are arrived The distance in the center of circle of round ceramic substrate (1) is smaller 0.3mm than the radius of round ceramic substrate (1)；Described round ceramic substrate (1) a diameter of 30mm.
4. 4. preparation method as claimed in claim 2, it is characterised in that in step 2, chamfering when described rounding is handled Radius is 0.3~0.6 times of round ceramic substrate (1) thickness.
5. 5. preparation method as claimed in claim 1, it is characterised in that in step 2, described fixture (2) uses to be clamped up and down Mode round ceramic substrate (1) is gripped.
6. 6. preparation method as claimed in claim 1, it is characterised in that in step 4, described tightening device (20) includes one Pair lock ring half-shell (20-1,20-2) to match with stack piezoelectric ceramics (14), the two of a pair of fastening half-shells (20-1,20-2) Bar incline is connected by hinge (20-3), and being provided with a pair on another two inclines of a pair of fastening half-shells (20-1,20-2) can The buckle (20-4) of fastening；The bottom of a pair of described fastening half-shells (20-1,20-2) is configured with base (20-5).
7. 7. preparation method as claimed in claim 1, it is characterised in that in step 4, the pressure of described vertical static pressure is 20kPa, the speed of described heating is 3 DEG C/min.
8. 8. preparation method as claimed in claim 1, it is characterised in that in step 5, described solder joint (19) passes through dead ring Oxygen resin glue (9) seals.
9. 9. a kind of stack PZT (piezoelectric transducer) suitable for road piezo-electric generating, it is characterised in that described stack piezoelectricity changes Energy device is made using the preparation method as described in claim 1 to 8 any claim.