CN107695344A - Composition metal bead preparation method and device - Google Patents
Composition metal bead preparation method and device Download PDFInfo
- Publication number
- CN107695344A CN107695344A CN201710807105.1A CN201710807105A CN107695344A CN 107695344 A CN107695344 A CN 107695344A CN 201710807105 A CN201710807105 A CN 201710807105A CN 107695344 A CN107695344 A CN 107695344A
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- Prior art keywords
- metal
- atomization
- bead
- drop
- rotating disk
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/10—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying using centrifugal force
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
- C23C4/08—Metallic material containing only metal elements
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/12—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the method of spraying
- C23C4/123—Spraying molten metal
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Powder Metallurgy (AREA)
- Manufacture Of Metal Powder And Suspensions Thereof (AREA)
Abstract
The present invention relates to a kind of composition metal bead preparation method and device, mother bulb is passed through into atomized droplet area, drop to the rotating disk of covering metallic solution and thrown away by centrifugal force, surface local melting and spheroidising are carried out subsequently into electromagnetic induction coil, the high composition metal bead of sphericity is obtained, this method is adapted to outer layer metal layer fusing point to be prepared less than the composite pellets of mother bulb melting point metal.
Description
Technical field
The present invention relates to prill preparation method and device, belong to powder metallurgical technology, more particularly to one kind
The preparation method and device of composition metal bead.
Background technology
Surface-mounted integrated circuit is developed rapidly with the fast development of electronics industry.With miniaturization, flexibility and computing
The size and volume of the continuous improvement of speed, surface-mounted integrated circuit and relative electronic components become less and less, more and more thinner.This
Parts and manufacturing process are proposed with more and more harsh requirement.
Prill and important materials and method that soldering tech is connection ic substrate and related component, especially
It is that tin ball of the size between 200-600 microns occupies critical role in circuit board manufacturing process.With circuit design
Diversification, compact in size, this proposes new requirement with the performance of bead to soldering：1) minimize, to adapt to overall structure
The demand of miniaturization；2) high temperature resistant property is improved, although size diminishes, is carried with the capacity and arithmetic speed of electronic component
Height, need to improve heat-sinking capability, ensure that the normal operation of parts；3) sphericity is high.With miniaturization and precise treatment system
Technique is made, it is necessary to improve the sphericity of soldering prill, to improve single quality of welding spot, and prevents the mutual of adjacent welds
Influence.
Copper and tin bead is the very popular material of industry at present, and kernel copper good conductivity, fusing point is high, and high temperature resistant property is good,
The electric conductivity being able to ensure that between connection member；Shell tin fusing point is low, is easy to soldering and shaping, it can be ensured that higher connection matter
Amount.During under arms, overheated even if there is part solder joint, the fusing of outer layer tin ball, but the presence of kernel copper accreditation is true
Protect quality of connection, and can quick conductive, allow tin quickly to cool down, realize solid-state connect.
Industry is generally using atomization method manufacture copper ball at present, then by the method for electroless plating in its Coating one
Layer tin, so as to obtain copper and tin composition metal bead.Chemical plating method has the disadvantage that：1) environment is unfriendly；2) efficiency is low；3)
Coated layer thickness is restricted.
The content of the invention
It is an object of the invention to provide the composition metal bead of a kind of online atomization, rotation coating, online nodularization to prepare
Method, alternative traditional chemical plating method, out of roundness is high, coated layer thickness uniform, controllable.
For achieving the above object, the present invention adopts the following technical scheme that：
Composition metal bead preparation method and device：
Using 4 groups of symmetry arrangements of atomized drop generator 4, form an atomization metal drop and shroud area 6, atomization metal liquid
The concentration and size of drop, and molten drop shroud the size in area and adjusted by the pressure gauge 2 and flowmeter 3 being connected to, and can be by
Data control system 1 is uniformly optimized and revised.Molten drop is composite pellets outer layer coated metal, can be the low melting points such as tin, tin-lead
Class brazing material.
Metal mother bulb is previously positioned in bead adding set 7.Treat temperature sensor 5, vacuumize and pressure controller 14
Real-time testing result meet default after, control system 1 can send instruction, the valve of device for opening 7, and metal mother bulb relies on
Gravity fall, and form a bead and decline boundling 8；And fall into atomization metal and shroud area 6,
Fall into atomization metal molten drop and shroud the mother bulb in area because fusing point is high, will not melt.Because its size is larger, pass
The features such as heat is fast, the atomization metal that can serve as cooling medium to contact its surface solidifies, so as to form outer layer metal.In cage
Accumulation over time in area's crossing process is covered, the outer layer metal formed due to contact solidification can be increasingly thicker.
The falling speed of mother bulb is being shrouded area's residence time, and the size and concentration of the molten drop in metal atomization area
The thickness of the outer layer metal formed etc. parameter to solidification has an impact.Storage has tens of kinds of databases in control system, wherein wrapping
The preparation technology of variety classes composition metal tin ball is included, including variety classes inner layer metal bead and variety classes outer layer gold
Belong to the combination of bead.It before preparation starts, can be inquired about according to the internal data of control system, and carry out related setting, from
And select optimal preparation technology and parameter.
By the bead in atomization metal molten drop area, its outer layer has had coated metal layer.Fallen into by one-level collector 9
To above rotating disk 11.There is sheet metal solution above rotating disk, its solution is still outer layer metal solution, and sample path length is no more than metal
10 times of bead.The prill being sent into by one-level collector is transported to the center of rotating disk, small due to the effect of centrifugal force
Club gradually moves to disk edge.It is small with metal because prill itself serves as cooling medium effect in moving process
Solidification can occur for the solution thin layer that ball directly contacts so as to be changed into the outer layer of prill, so that prill size becomes
Greatly.
Rotating disk is driven by electrode 10.Rotary speed also has an impact to coated layer metal thickness.When size constantly becomes big gold
Belong to bead and reach disk edge, because centrifugal action will be thrown out of.When being thrown out of, prill surface might have part
Not solidified drop or the drop not solidified completely.During throwing away, due to cooling, it may occur that solidify so as to be formed
Prill outer layer metal.
The prill outer layer that turntable rotation is formed during flying out, due to the particularity of force-bearing situation, its sphericity without
Method ensures, therefore the bead thrown away passes through two level collector 12, forms coated metal bead boundling 13, then enters by gravity
17 solenoid controlled devices 15, carry out surface local melting and spheroidising, coil heats temperature and the rate of heat addition and filled by control
17 controls are put, then form coated metal bead 16；
5) prill after coating is by sorting inspection system 18, be judged to it is unqualified after, be through over pressurizeed and control
System 19 reenters adding set 7, carries out coating again；
Composition metal bead preparation method and device, the fusing point of atomization metal are less than the fusing point of mother bulb metal, and range of atomization melts
Temperature is dripped within fusing point ± 20 DEG C；
Composition metal bead preparation method and device, the thickness of metallic solution is less than the 10 of mother bulb average diameter in rotating disk
Times, and temperature is within ± 10 DEG C of fusing point；
Composition metal bead preparation method and device, coated layer metal thickness≤100 micron；
Technology is described as follows：
Composition metal bead preparation method and device, data control system 1 connect pressure gauge 2, flowmeter 3, and atomization
Droplet generator 4, and produce metal atomization drop beam according to the instruction sent.Atomized drop generator is key equipment, is determined
The size of the pressure of drop, size and drop beam.
4 groups of atomized drop generators and associated component symmetry arrangement, form an atomization metal drop and shroud area 6, the gold
It is prill outer layer metal to belong to drop.The length of range of atomization has an impact to the thickness of coating metal.The liquid in atomization metal area
Drop size and temperature can also have an impact to the thickness of metal coating.
Temperature sensor 5, vacuumize implementation monitoring is carried out to vacuum chamber with pressure controller 14, when index meets to instruct
It is required that the primitive globules for being previously positioned at prill adding set 7, which fall into atomization metal, shrouds area 6, and form a bead
Decline boundling 8.
The size and species for the bead being pre-placed have an impact to coating metal thickness.When the size of primitive globules is larger
When, under equal conditions, due to larger cooling velocity, coating layer thickness can be increased；Otherwise, coating layer thickness can be reduced.
Primitive globules pass through atomization metal molten drop area, can be formed on surface and adhere to numerous metal drop, under subsequent
Fall in cooling procedure, because solidification is so as to be that bead surface forms molten drop layer in original, its thickness and temperature, original are bead sizes etc.
Factor is relevant.The metal drop layer that the process is formed is referred to as a molten drop layer.
Then dropped into by one-level collector 9 above rotating disk 11, there is sheet metal solution above rotating disk, then rely on from
Mental and physical efforts are thrown out of, and rotating disk is driven by electrode 10.Rotating disk size and rotating speed determine centrifugal force, therefore have an impact to throwing away process.
The bead for being attached to droplet metal is fallen on the rotating disk with thin layer of solution, then during rolling and flying out, same meeting
Metal drop is accompanied with, these molten drops can be set in bead surface in subsequent cooling procedure, so as to form metal drop layer.
The metal drop layer that the process is formed is referred to as secondary molten drop layer.
Bead with two layers of metal drop layer passes through two level collector 12, forms coated metal bead boundling 13, then
Enter 17 solenoid controlled devices 15 by gravity, carry out surface local melting and spheroidising, coil heats temperature and heating
Speed is controlled by control device 17, then forms coated metal bead 16.
The main purpose of the process be allow bead secondary metals molten drop layer occur local melting, eliminate turning, increase it is small
The sphericity of ball.
Prill after spheroidising enters sorting inspection system 18, and sphericity is bad, the defective meeting in surface
It is judged to unqualified, then reenters adding set 7 through over pressurizeed and control system 19, carry out atomization again and prepare molten drop
Layer；Up-to-standard small club enters collection device, and is packed.
The fusing point of atomization metal is less than the fusing point of mother bulb metal, and range of atomization droplet temperature is within fusing point ± 20 DEG C.Mother bulb
The fusing point of metal is higher than atomization metal fusing point, and otherwise primitive globules can melt when atomization metal molten drop area is entered
Change, so as to destroy mother bulb, do not become composite pellets.
Meanwhile range of atomization droplet temperature needs to control within ± 20 DEG C, when temperature is too high, is unfavorable for metal drop
Atomization, and subsequent cooling and metal drop layer are formed；When temperature is too low, residence time mistake of the metal drop in liquid
It is short, it is unfavorable for being formed uniformly for metal drop layer.
The thickness of metallic solution is less than 10 times of mother bulb average diameter in rotating disk, and temperature is within ± 10 DEG C of fusing point.
When metallic solution thickness exceedes 10 times of mother bulb diameter in rotating disk, due to Action of Gravity Field, these beads flowing velocity in the solution
It is relatively slow, and be not easy to be thrown out of when moving to disk edge, it is unfavorable for secondary metals molten drop layer and is formed.When solution temperature is beyond molten
± 10 DEG C of scopes of point, when too high or too low, the metal drop layer that is unfavorable in the cooling procedure after throwing away is formed uniformly.
Using the program, metal drop thickness degree is within 100 microns.
Advantages of the present invention and beneficial effect：
The inventive method using atomization metal drop beam and be covered with liquid film rotating disk carry out respectively primary and secondary coating preparation,
Then online spheroidising is carried out using electromagnetic induction coil, realizes online outer layer metal preparation and spheroidising, obtain
Prepared by the high composition metal bead of sphericity, solve prior art by the low problem of the efficiency of offline electrochemistry coating.
Accompanying drawing 1：Schematic device
1 data control system；2 pressure gauges；3 flowmeters；4 atomized drop generators；5 temperature sensors；6 atomizationization liquid
Drop；7 original metal bead adding sets；8 original metal beads；9 one-level collectors；10 motors；11 rotating disks；12 two levels are collected
Device；Prill after 13 coatings；14 vacuumize and Stress control control；15 electromagnetic induction heating coils；16 terminal collectors；
17 solenoid controlled devices；18 beads sort inspection system；19 pressurizations and control system.
Embodiment
Technical scheme is further described below in conjunction with preferred embodiment.
Embodiment 1：
Prepare copper and tin composition metal bead.
Primitive globules are copper balls, and size is in 200-300 microns；
Preparation facilities is as shown in Figure 1.Atomization metal is tin.Using original material of the solder as atomization metal generator
Material.Temperature control in vacuum chamber is at 220-240 DEG C, and vacuum degree control is 10-2Below.Filling argon gas is protected in vacuum chamber
Shield.
Rotating disk velocity of rotation in 50-500r/s, disk diameter in 20-800mm, metallic tin solution temperature at 225-235 DEG C,
Solution deep is 500-1500mm, the prill fallen into by top take the lead in rosette center, then by rotate gradually to
Boundary slip, with continuing to increase for centrifugal force, rolling speed continues to increase, and when leaving rotating disk, speed is in 100-600m/s.
Electromagnetic induction heating speed is in 200-800 DEG C/s.
The size of obtained bead is between 250-350 microns；External skin size is between 50-80 microns.
Embodiment 2：
Prepare copper and tin composition metal bead.
Primitive globules are copper balls, and size is in 100-150 microns；
Preparation facilities is as shown in Figure 1.Atomization metal is tin.Using original material of the solder as atomization metal generator
Material.Temperature control in vacuum chamber is at 225-235 DEG C, and vacuum degree control is 10-3Below.Filling argon gas is protected in vacuum chamber
Shield.
Rotating disk velocity of rotation is in 100-400r/s, and disk diameter is in 50-600mm, and metallic tin solution temperature is in 225-235
DEG C, solution deep 300-500mm, the prill fallen into by top takes the lead in rosette center, then relying on and rotating gradually
To boundary slip, with continuing to increase for centrifugal force, rolling speed continues to increase, and when leaving rotating disk, speed is in 180-450m/
s。
Electromagnetic induction heating speed is in 160-400 DEG C/s.
The size of obtained bead is between 150-200 microns；External skin size is between 40-70 microns.
By above-described embodiment, prepared by atomization metal drop beam provided by the invention, the coating for being covered with liquid film rotating disk,
Then online spheroidising is carried out using electromagnetic induction coil, realizes online outer layer metal preparation and spheroidising, obtain
Prepared by the high composition metal bead of sphericity, compound gold can only be prepared by offline electrochemistry coating method by solving prior art
Belong to the technical barrier of bead.
Embodiment described above only expresses the embodiment of the present invention, but can not be therefore understands that for the present invention
The limitation of the scope of the claims.Any variation that those skilled in the art is done under the enlightenment of present inventive concept to the present invention falls
Within the scope of the present invention.
Claims (4)
1. composition metal bead preparation method and device, it is characterised in that：1）Pass through data control system 1, pressure gauge 2, flow
Meter 3, and atomized drop generator 4 produce metal atomization drop beam, 4 groups of equipment symmetry arrangements, form an atomization metal liquid
Drop shrouds area 6, and the molten drop is prill outer layer；2）Temperature sensor 5 and vacuumize the survey with pressure controller 14
Test result meets after requiring that the primitive globules for being previously positioned at prill adding set 7 fall into atomization metal and shroud area 6, and
Form a bead and decline boundling 8；3）By the bead in atomization metal molten drop area, rotating disk 11 is dropped into by one-level collector 9
Above, there is sheet metal solution above rotating disk, be then thrown out of by centrifugal force, rotating disk is driven by electrode 10；4）What is thrown away is small
Ball warp crosses two level collector 12, forms coated metal bead boundling 13, then enters 17 solenoid controlled devices 15 by gravity,
Carry out surface local melting and spheroidising, coil heats temperature and the rate of heat addition are controlled by control device 17, then formed and applied
Plate prill 16；5）Prill after coating by sorting inspection system 18, be judged to it is unqualified after, through over pressurizeed and control
System 19 processed reenters adding set 7, carries out coating again.
2. composition metal bead preparation method according to claim 1 and device, it is characterised in that：The fusing point of atomization metal
Less than the fusing point of mother bulb metal, range of atomization droplet temperature is within fusing point ± 20 DEG C.
3. composition metal bead preparation method according to claim 1 and device, it is characterised in that：Metallic solution in rotating disk
Thickness be less than 10 times of mother bulb average diameter, and temperature is within ± 10 DEG C of fusing point.
4. composition metal bead preparation method according to claim 1 and device, it is characterised in that：Coated layer metal thickness
≤ 100 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710807105.1A CN107695344A (en) | 2017-09-08 | 2017-09-08 | Composition metal bead preparation method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710807105.1A CN107695344A (en) | 2017-09-08 | 2017-09-08 | Composition metal bead preparation method and device |
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| Publication Number | Publication Date |
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| CN107695344A true CN107695344A (en) | 2018-02-16 |
Family
ID=61172243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710807105.1A Pending CN107695344A (en) | 2017-09-08 | 2017-09-08 | Composition metal bead preparation method and device |
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| CN (1) | CN107695344A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109530713A (en) * | 2018-12-30 | 2019-03-29 | 北京康普锡威科技有限公司 | A kind of device preparing composite metal powder, method and composite metal powder |
| CN112024903A (en) * | 2020-11-09 | 2020-12-04 | 西安赛隆金属材料有限责任公司 | Metal powder manufacturing equipment and method |
| CN115846649A (en) * | 2022-12-20 | 2023-03-28 | 江苏宇钛新材料有限公司 | Preparation method of low-melting-point spherical metal powder |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59170208A (en) * | 1983-03-14 | 1984-09-26 | ダウ・コ−ニング・コ−ポレ−シヨン | Quick solidification device for molten metal or like to particles |
| CN1071614A (en) * | 1992-10-07 | 1993-05-05 | 中南工业大学 | Secondary atomizer for double electrode arc melting |
| JP3743980B2 (en) * | 2002-03-28 | 2006-02-08 | 同和鉱業株式会社 | Low melting point metal powder and method for producing the same |
| CN102873324A (en) * | 2012-10-17 | 2013-01-16 | 厦门大学 | Covering-type copper-nickel-silver composite powder and preparation method thereof |
| CN104493186A (en) * | 2014-11-26 | 2015-04-08 | 大连理工大学 | A kind of preparation device and preparation method of uniform spherical microparticles |
| CN104588673A (en) * | 2015-01-28 | 2015-05-06 | 大连理工大学 | A device and method for efficiently preparing metal spherical ultrafine powder |
| CN104625046A (en) * | 2015-02-06 | 2015-05-20 | 南京大学 | Manufacturing method of micrometer and nanometer composite spherical metal powder of core-shell structure |
| CN105268980A (en) * | 2014-07-15 | 2016-01-27 | 昆山玛冀电子有限公司 | Extruding granulation method for soft-magnetism powder |
| CN105568024A (en) * | 2016-01-26 | 2016-05-11 | 广东工业大学 | Preparation method for nano ceramic reinforced metal-matrix composite |
| CN106862578A (en) * | 2017-02-13 | 2017-06-20 | 连云港倍特超微粉有限公司 | It is a kind of to combine the apparatus and method that atomization type prepares spherical metal alloy powder |
-
2017
- 2017-09-08 CN CN201710807105.1A patent/CN107695344A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59170208A (en) * | 1983-03-14 | 1984-09-26 | ダウ・コ−ニング・コ−ポレ−シヨン | Quick solidification device for molten metal or like to particles |
| CN1071614A (en) * | 1992-10-07 | 1993-05-05 | 中南工业大学 | Secondary atomizer for double electrode arc melting |
| JP3743980B2 (en) * | 2002-03-28 | 2006-02-08 | 同和鉱業株式会社 | Low melting point metal powder and method for producing the same |
| CN102873324A (en) * | 2012-10-17 | 2013-01-16 | 厦门大学 | Covering-type copper-nickel-silver composite powder and preparation method thereof |
| CN105268980A (en) * | 2014-07-15 | 2016-01-27 | 昆山玛冀电子有限公司 | Extruding granulation method for soft-magnetism powder |
| CN104493186A (en) * | 2014-11-26 | 2015-04-08 | 大连理工大学 | A kind of preparation device and preparation method of uniform spherical microparticles |
| CN104588673A (en) * | 2015-01-28 | 2015-05-06 | 大连理工大学 | A device and method for efficiently preparing metal spherical ultrafine powder |
| CN104625046A (en) * | 2015-02-06 | 2015-05-20 | 南京大学 | Manufacturing method of micrometer and nanometer composite spherical metal powder of core-shell structure |
| CN105568024A (en) * | 2016-01-26 | 2016-05-11 | 广东工业大学 | Preparation method for nano ceramic reinforced metal-matrix composite |
| CN106862578A (en) * | 2017-02-13 | 2017-06-20 | 连云港倍特超微粉有限公司 | It is a kind of to combine the apparatus and method that atomization type prepares spherical metal alloy powder |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109530713A (en) * | 2018-12-30 | 2019-03-29 | 北京康普锡威科技有限公司 | A kind of device preparing composite metal powder, method and composite metal powder |
| CN112024903A (en) * | 2020-11-09 | 2020-12-04 | 西安赛隆金属材料有限责任公司 | Metal powder manufacturing equipment and method |
| CN115846649A (en) * | 2022-12-20 | 2023-03-28 | 江苏宇钛新材料有限公司 | Preparation method of low-melting-point spherical metal powder |
| CN115846649B (en) * | 2022-12-20 | 2024-08-16 | 江苏宇钛新材料有限公司 | Preparation method of low-melting-point spherical metal powder |
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