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CN107690116A - Mems麦克风组件 - Google Patents

Mems麦克风组件 Download PDF

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Publication number
CN107690116A
CN107690116A CN201710666508.9A CN201710666508A CN107690116A CN 107690116 A CN107690116 A CN 107690116A CN 201710666508 A CN201710666508 A CN 201710666508A CN 107690116 A CN107690116 A CN 107690116A
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acoustic
port
housing
microphone assembly
assembly according
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CN107690116B (zh
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阿拉斯泰尔·锡巴尔德
彼得·约翰·麦卡琴
罗伯特·阿尔科克
大卫·蒙蒂斯
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Samsung Electronics Co Ltd
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Yinkesi Laboratories Ltd
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    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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    • G10K11/16—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
    • G10K11/1787—General system configurations
    • G10K11/17873—General system configurations using a reference signal without an error signal, e.g. pure feedforward
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    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/10—Earpieces; Attachments therefor ; Earphones; Monophonic headphones
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
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    • G10K11/175—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound
    • G10K11/178—Methods or devices for protecting against, or for damping, noise or other acoustic waves in general using interference effects; Masking sound by electro-acoustically regenerating the original acoustic waves in anti-phase
    • G10K11/1785—Methods, e.g. algorithms; Devices
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    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2876—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself by means of damping material, e.g. as cladding
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    • B81B2201/00—Specific applications of microelectromechanical systems
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    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/01—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS
    • B81B2207/012—Microstructural systems or auxiliary parts thereof comprising a micromechanical device connected to control or processing electronics, i.e. Smart-MEMS the micromechanical device and the control or processing electronics being separate parts in the same package
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    • G—PHYSICS
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    • H04M—TELEPHONIC COMMUNICATION
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Abstract

本发明公开了MEMS麦克风组件。MEMS麦克风组件具有包围空气体积的外壳。MEMS麦克风芯片设置在外壳内。第一声端口和第二声端口形成在外壳中，限定在空气体积和外壳外部的空气之间的第一流体路径和第二流体路径。MEMS麦克风根据第一端口和第二端口的声阻抗的电位比响应于经由第一端口和第二端口供应的两个独立压力信号之间的预先确定的线性内插值。

Description

MEMS麦克风组件
发明领域
本发明大体上涉及麦克风组件，并且特别涉及微机电系统(MEMS)麦克风组件。
本申请要求英国专利申请1613508.9的优先权，其全部内容通过引用并入本文。
背景及现有技术
MEMS麦克风组件可用于紧凑型包装，这使它们在诸如头戴式麦克风和降噪头戴式受话器的应用中有用。
MEMS麦克风换能器本身的物理尺寸可能小至1mm x 2mm，并且具有仅为1mm的厚度。为了保护MEMS麦克风换能器并将其以可回流焊的形式供应以用于组装到例如蜂窝电话耳麦中，每个MEMS麦克风换能器通过将其结合到微型PCB型基板来包装。在麦克风周围形成适当的声密封，然后上壳体被密封并结合到PCB基板。上壳体包含一个或更多个微孔，其用作到麦克风的入口端口，将外部环境空气连接到包装内的空气，从而连接到麦克风本身。封装的包装非常小。例如，Knowles Electronics数字MEMS麦克风型号SPK0415HM4H的尺寸为3.00mm x 4.00mm x 1.06mm。
MEMS麦克风的一个构造被称为“顶部端口构造”，其中麦克风隔膜后面的空气的后体积经由具有非常高的声阻抗的非常小的声路径耦合到包装内的空气的前体积。该声路径在硅制造工艺期间被创建，并且由与麦克风隔膜平行的直径通常为20μm的多个微观孔构成。声路径通过提供用于扩张或收缩空气的泄漏路径来防止温度变化期间麦克风隔膜的应力和破裂。麦克风只响应前体积空气压力水平。
一些MEMS麦克风以反向形式安装，称为“底部端口构造”，以节省空间和/或增加灵敏度。在底部端口构造中，麦克风隔膜的后表面暴露于环境空气中。出于与以上描述的用于顶部端口构造的相同安全性原因，麦克风的前体积的空气经由非常高阻抗的声路径连接到后体积的空气。
在“顶部端口”和“底部端口”构造中，MEMS麦克风仅响应于单个环境空气压力信号。在顶部端口构造或底部端口构造中的MEMS麦克风具有单个入口端口并且生成与所述入口端口处的声压级(SPL)成比例的电信号(等式[1])。不存在通过麦克风的空气通道。
V输出∝SPL入口1 [1]
已知另一类型的MEMS麦克风构造为“单向”型，其中在麦克风隔膜前面的前体积的空气经由第一端口耦合到外部环境空气。麦克风隔膜后面的后体积的空气经由第二端口耦合到外部环境空气。因此，麦克风隔膜上的净力取决于每个端口处的压力之间的差，并且因此所得的麦克风信号代表两个端口之间的压力差(它是差分麦克风)。在单向麦克风构造中，没有从麦克风的前体积到后体积的气流路径；气流被麦克风隔膜阻挡。
单向型的麦克风通常安装在壳体或挡板中，以用于在用户的嘴唇附近使用，使得与另一个麦克风端口相比接近声音信号更接近一个麦克风端口(并且因此该信号在该端口处比在该另一个端口处更大)，而背景噪声在两个端口处等同地存在。因此，由于背景噪声信号在麦克风隔膜的两侧以相等水平存在，因此来自麦克风的所得到的差分信号主要包含声音信号，使得不存在净压差，并且从而背景噪声信号极少或不存在。
在“单向”构造中，麦克风通常在其外壳或包装的最上面和最下面具有两个入口端口，并生成与两个入口端口之间的SPL的差成比例的电信号(等式[2])。不存在端口之间通过麦克风的空气通道。
V输出∝SPL入口1-SPL入口2 [2]
为了清楚起见，目前的MEMS术语如下。制造商将将供应MEMS麦克风作为“组件”，适用于制造中的处理和使用。MEMS“部件”包括硅MEMS芯片，其是实际换能器本身，其安装在用于电互连和附加组件的适合的基板上，然后形成在适合于测试、分配和处理的封闭“包装”中。
在本公开中，术语MEMS“组件”将指的是MEMS部件(即，芯片，包装和全部)，并且术语“MEMS”芯片将指的是换能器本身。
公开概述
根据本公开的一个方面，提供了一种微机电(MEMS)麦克风组件，其包括：
封闭第一空气体积的外壳；
设置在所述外壳内的MEMS麦克风芯片；
形成在所述外壳中的第一声端口，该第一声端口限定在所述第一空气体积和邻近所述第一声端口的所述外壳外部的环境空气之间的第一流体路径，所述第一端口具有第一声阻抗；以及
形成在所述外壳中的、与该第一声端口间隔开的第二声端口，该第二声端口限定在第一空气体积和邻近该第二声端口的所述外壳外部的环境空气之间的第二流体路径，所述第二端口具有第二声阻抗。
在一种布置中，第一声端口包括形成在所述外壳中的单个孔。在可选布置中，第一声端口包括形成在所述外壳中的多个孔。
在一种布置中，第二声端口包括形成在所述外壳中的单个孔。在可选布置中，第二声端口包括形成在所述外壳中的多个孔。
在一种布置中，第一声端口和第二声端口都形成在外壳的相同表面中。在可选布置中，第一声端口和第二声端口形成在外壳的相对表面中。
在一种布置中，第一声端口和第二声端口中的至少一个还包括声阻材料。
优选地，第一声阻抗和第二声阻抗的比率至少为5:1。更优选地，第一声阻抗和第二声阻抗的比率至少为10:1。
优选地，麦克风组件还包括设置在外壳内的信号处理电路。
麦克风组件可以结合在环境降噪系统、耳机、头戴式受话器或蜂窝网络电话耳麦中。
附图简述
现在将参照附图描述本公开的实施例，在附图中：
图1A显示了根据本公开的第一实施例的第一MEMS麦克风组件的等距分解图；
图1B显示了通过图1A的麦克风组件的正视截面图；
图2A显示了根据本公开的第二实施例的第二MEMS麦克风组件的等距分解图；
图2B显示了通过图2A的模块的正视截面图；
图3显示了根据本公开的实施例的示例性装置中的图1A和图1B的麦克风组件的图示；
图4A显示了根据本公开的实施例的MEMS麦克风组件的外壳的顶视图；以及
图4B显示了根据本公开的实施例的MEMS麦克风组件的另一个外壳的顶视图。
优选实施例的描述
本公开的实施例提供了响应于经由不同端口供应的两个独立压力信号之间的预先确定的线性内插值的MEMS麦克风组件。MEMS麦克风组件具有如将在下文描述的两个端口，其根据等式[3]生成与在两个端口中的每一个处的声压级(SPL)之间的预先确定的线性内插值成比例的信号。在两个端口之间也存在通过设备的空气通道。
图1A和图1B显示了MEMS麦克风组件1000，其包括封闭第一空气体积1003的外壳1002。外壳1002可以由基板1007和上壳体1009形成。
MEMS麦克风芯片1006设置在外壳1002内并安装在基板1007上。基板1007可以是微型印刷线路板(PWB)。MEMS麦克风芯片1006根据其规格通常伴随着用于执行一些初始信号处理(诸如AD转换、前置放大、多路复用或其它信号处理)的辅助集成电路1011。
上壳体1009可以由金属形成以提供电气屏蔽。上壳体1009被结合到基板1007并围绕其边缘密封，以便将第一空气体积1003封闭在其间。MEMS麦克风芯片1006和相关联的电路被第一空气体积1003包围。
第一声端口1004形成在外壳1002中。在图1A所示的实施例中，第一声端口1004包括衬底1007中的一个或更多个孔1024。孔1024可以是小直径孔的小阵列。第一声端口具有由孔1024的数量和尺寸以及通过其形成孔1024的基板1007的厚度限定的第一声阻抗。
第一声端口1004限定第一空气体积1003和邻近第一声端口1004的外壳1002外部的环境空气(即，基板1007下面的空气)之间的第一流体路径。
第二声端口1005形成在外壳1002中。在图1A所示的实施例中，第二声端口1005包括形成在上壳体1009中的一个或更多个孔1022。孔1022可以是小直径孔的小阵列。第二声端口1005具有由孔1022的数量和尺寸以及通过其形成孔1022的上壳体1009的厚度限定的第二声阻抗。
第二声端口1005限定第一空气体积1003和邻近第二声端口1005的外壳1002外部的环境空气(即，在上壳体1009上方的空气)之间的第二流体路径。
图1A和图1B的实施例提供了MEMS麦克风组件1000，其包含基于MEMS的声学分压器，其中电位分数由第一声端口1004和第二声端口1005的声阻抗的比率限定。在图1A和图1B的实施例中，第一声端口1004和第二声端口1005设置在外壳1002的相对侧上。
通常，优选在第一声端口1004和第二声端口1005中引入一定程度的声阻，以减少亥姆霍兹共振效应。在声阻抗方面，小孔和短长度孔主要表现为声惯量。随着孔或管的直径减小，空气与管的侧壁之间的摩擦相互作用开始变得显著，并且这增加了其复阻抗的声阻分量。对于通过侧壁或外壳(例如，小于2mm)的短路径长度，则当直径小于0.2mm或在其附近时声阻值变得显著。例如，在1kHz处，在0.2mm厚的基板中的0.2mm孔具有665.2声欧姆(CGS单位)的阻性分量(a resistive component)和873.2声欧姆(CGS)的抗性分量(a reactivecomponent)。因此，通过单独使用小直径孔，可以制造稳定且精确的设备，而不需要声阻网覆盖。
上述实施例的电位比通过两个声端口1004、1005的阻抗来限定，这又由形成每个端口的孔1024、1022的数量和尺寸确定。例如，如果孔全部为例如直径为0.2mm、长度为0.2mm，则基板1007种的5个孔和上壳体1009中的45个孔的阵列将提供45/(45+5)＝0.9的电位分数。换句话说，在该示例中，第一声阻抗和第二声阻抗的比率为9:1。
现在参考图2A和图2B，示出了本公开的另一实施例。该另一实施例具有与图1A和图1B的实施例大体相同的形式，其中相似的参考数字表示相似的部件。此外，在壳体1009上设置最上面的声阻网层1102，以及在基板1007上设置最下面的声阻网层1104。声阻网层1102、1104分别有助于声端口1005、1004的阻抗。对于阻尼或其他原因，一些制造商可能优选使用声阻网层。
在图1A、图1B、图2A和图2B中，为了清楚起见，省略了组件的一些细节。例如，焊接凸点和互连件未示出。
现在参考图3，显示了MEMS麦克风组件1000的示例性安装。MEMS麦克风组件1000设置在主体1204中，其在示例性安装中可以是头戴式受话器的主体。通过第一声端口1004和第二声端口1005经由第一空气体积1003提供通过MEMS麦克风组件1000的空气通路。空气通路具有作为第一声端口1004和第二声端口1005的第一阻抗和第二阻抗的串行相加的阻抗。在某些应用中，空气通道可能直接替换头戴式受话器的后排气孔。
然而，如果空气通路的“通过”阻抗大于头戴式受话器中的扬声器的期望的后体积顺应性所需的“通过”阻抗，则MEMS麦克风组件1000可以与传统的声阻端口并行操作，如在图3中所示，以便提供适合的组合的后排气孔阻抗。如果耳机或头戴式受话器需要50声欧姆的后排气孔声阻，并且本发明的MEMS麦克风组件1000具有500声欧姆的声阻，则如图3所示，它可以与具有55.5声欧姆的声阻的后排气孔1200并行使用，使得两者的并行组合将有效地提供50欧姆的必需的后排气孔声阻抗。然而，实际上，对于这种类型的应用的阻抗通常不是关键的，并且模块结合现有的头戴式受话器的后排气孔端口来使用而无需改变可能被证明是可以接受的。
在图3所示的实施方案中与MEMS麦克风组件1000并行布置的声排气孔1200被示出为声阻耦合，特征为声阻覆盖层1202的端口。也可以使用本领域技术人员已知的其它类型的声排气孔，包括在行为中主要是惯量的那些，以及还包括特征为惯量耦合(诸如，短管)和声阻耦合的并行组合的那些。
现在参考图4A，在本公开的可选实施例中，第一端口1004和第二端口1005都可以形成在外壳1002的相同表面中。图4A显示了其中形成第一端口1004和第二端口1005的上壳体1009的顶视图。第一端口1004由形成在阵列中的25个孔1024形成，而第二端口1005由形成在阵列中的3个孔1022形成。所有的孔1022、1024具有相同的直径，例如直径为0.2mm，但可以使用其它直径。第一端口1004和第二端口1005的声阻抗提供{3/(3+25)}＝0.107或8.3:1的电位比。
孔1022和1024可以通过光刻蚀刻技术、激光加工、添加制造方法或本领域技术人员已知的其它合适的方法形成。用于成本制造的另一种方法是机械地冲孔。这适合于单个孔和少量的孔，但是它不适合于紧密间隔的孔的大阵列。
现在参考图4B，在本公开的可选实施例中，第一端口1004和第二端口1005都形成在外壳1002的相同表面中。图4B中所示的第一端口1004和第二端口1005中的每一个分别由单个孔1024、1022形成。图4B显示了其中形成第一端口1004和第二端口1005的上壳体1009的顶视图。
孔1024、1002具有不同的直径，以便提供所需的声分压器比。在图4B的示例中，第一孔和第二孔的直径分别为0.15mm和0.60mm。如果上壳体1009具有0.1mm的厚度，则孔1024、1002在频率为1kHz处的声阻抗将分别为约1372声欧姆和166声欧姆(以CGS为单位)，提供电位比为0.108或8.26：1。
如本领域技术人员将认识到的，在使用中，可以安装形成在相同表面上的具有第一端口1004和第二端口1005的MEMS麦克风组件1000，使得第一端口和第二端口诸如通过在第一端口1004和第二端口1005之间的上壳体1009上提供衬垫来与单独的空气体积连通。第一端口1004和第二端口1005间隔开以帮助这种安装。
MEMS技术和包装布置对于实现本发明的模块型实施例是理想的，其中麦克风及其伴随的声耦合作为单个包装被提供给耳机和头戴式受话器制造商，使得不需要为它们设计并且建造本发明本身的声耦合，本发明作为单一的、明确定义的、自校准的ANC麦克风包装被供应。
特别地，本发明涉及微型麦克风组件或“包装”，其特别适用于环境降噪(ANC)耳机和头戴式受话器中的应用。本公开的MEMS麦克风组件可以适用于头戴式受话器、耳机和主动降噪(ANC)系统，诸如蜂窝电话耳麦的听筒ANC系统。
在需要MEMS麦克风组件1000的校准的情况下，英国专利公布GB2,538,432A描述了一种快速校准方法，其可适用于MEMS麦克风组件1000以加速生产并使ANC系统能够以低成本高容量进行制造。然而，可以采用本领域技术人员已知的任何合适的校准程序。

Claims (14)

1.一种微机电(MEMS)麦克风组件，包括：
外壳，所述外壳包围第一空气体积；
MEMS麦克风芯片，所述MEMS麦克风芯片设置在所述外壳内；
第一声端口，所述第一声端口形成在所述外壳中，所述第一声端口限定在所述第一空气体积和所述外壳外部的邻近所述第一声端口的环境空气之间的第一流体路径，所述第一端口具有第一声阻抗；以及
第二声端口，所述第二声端口形成在所述外壳中、与所述第一声端口间隔开，所述第二声端口限定在所述第一空气体积和所述外壳外部的邻近所述第二声端口的环境空气之间的第二流体路径，所述第二端口具有第二声阻抗。
2.根据权利要求1所述的麦克风组件，其中，所述第一声端口包括形成在所述外壳中的单个孔。
3.根据权利要求1所述的麦克风组件，其中，所述第一声端口和第二声端口各自包括形成在所述外壳中的单个孔。
4.根据权利要求1或2所述的麦克风组件，其中，所述第二声端口包括形成在所述外壳中的多个孔。
5.根据任一前述权利要求所述的麦克风组件，其中，所述第一声端口和第二声端口都形成在所述外壳的相同表面中。
6.根据权利要求1至4所述的麦克风组件，其中，所述第一声端口和第二声端口形成在所述外壳的相对表面中。
7.根据任一前述权利要求所述的麦克风组件，其中，所述第一声端口和第二声端口中的至少一个还包括声阻材料。
8.根据任一前述权利要求所述的麦克风组件，其中，所述第一声阻抗和第二声阻抗的比率至少为5:1。
9.根据任一前述权利要求所述的麦克风组件，其中，所述第一声阻抗和第二声阻抗的比率至少为10:1。
10.根据任一前述权利要求所述的麦克风组件，还包括设置在所述外壳内的信号处理电路。
11.一种包括根据权利要求1-10中任一项所述的麦克风组件的环境降噪系统。
12.一种包括根据权利要求1-10中任一项所述的麦克风组件的耳机。
13.一种包括根据权利要求1-10中任一项所述的麦克风组件的头戴式受话器。
14.一种包括根据权利要求1-10中任一项所述的麦克风组件的蜂窝网络电话耳麦。
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EP3279892A1 (en) 2018-02-07
CN107690116B (zh) 2021-07-27
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US10009694B2 (en) 2018-06-26
US20180041843A1 (en) 2018-02-08
US10419841B2 (en) 2019-09-17
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US20180041828A1 (en) 2018-02-08
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