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CN107681036A - LED encapsulation structure - Google Patents

LED encapsulation structure Download PDF

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Publication number
CN107681036A
CN107681036A CN201710726042.7A CN201710726042A CN107681036A CN 107681036 A CN107681036 A CN 107681036A CN 201710726042 A CN201710726042 A CN 201710726042A CN 107681036 A CN107681036 A CN 107681036A
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China
Prior art keywords
chip
reflector
led
cavity
bracket
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CN201710726042.7A
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Chinese (zh)
Inventor
郑建国
罗小平
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Chonghui Semiconductor Shenzhen Co ltd
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Shenzhen City Core Ltd By Share Ltd
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Priority to CN201710726042.7A priority Critical patent/CN107681036A/en
Publication of CN107681036A publication Critical patent/CN107681036A/en
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10HINORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80Constructional details
    • H10H20/85Packages
    • H10H20/855Optical field-shaping means, e.g. lenses
    • H10H20/856Reflecting means

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  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

本发明提供一种LED封装结构,包括LED支架和芯片,所述LED支架包括支架主体、金属支架和反射件,所述支架主体顶部开设有腔体以容纳所述LED芯片,所述金属支架伸入所述支架主体的所述腔体,且伸出到所述支架主体外部形成管脚,所述反射件设于所述芯片上方对应所述芯片的位置,且与所述芯片之间留有间隔,所述金属支架包括朝向所述反射件凸出的凸起,从而形成斜面。本LED封装结构中,通过在芯片的上方设置反射件,从芯片发出的部分光线射向正上方后被反射件反射到腔体侧壁或底壁后反射出去,可避免光线直射出去,一定程度上解决了灯光刺眼的问题。

The present invention provides an LED packaging structure, which includes an LED bracket and a chip. The LED bracket includes a bracket body, a metal bracket and a reflector. A cavity is opened on the top of the bracket body to accommodate the LED chip. The metal bracket extends into the cavity of the stent main body, and protrude out of the stent main body to form pins, the reflector is arranged above the chip at a position corresponding to the chip, and there is a gap between the chip and the chip At intervals, the metal bracket includes protrusions that protrude toward the reflector, thereby forming a slope. In this LED packaging structure, by setting a reflector above the chip, part of the light emitted from the chip is directed directly above and then reflected by the reflector to the side wall or bottom wall of the cavity, which can prevent the light from going out directly. Solved the glare of the light problem.

Description

LED封装结构LED package structure

技术领域technical field

本发明涉及LED技术领域,特别是涉及一种LED封装结构。The invention relates to the technical field of LEDs, in particular to an LED packaging structure.

背景技术Background technique

目前,LED器件由于其能耗低、寿命长、响应快和发光效率高等优点已得到日益广泛的应用,例如液晶显示装置的背光以及日常的照明等。当LED用于日常照明时,LED灯直接发出的灯光很刺眼。防止LED灯光刺眼的办法一般是:采用磨砂的玻璃罩罩住LED灯;用浅色的布包裹住LED灯;或者用塑料外壳罩住LED灯。但上述方式都会影响LED灯的亮度。At present, LED devices have been increasingly widely used due to their advantages of low energy consumption, long life, fast response and high luminous efficiency, such as backlight of liquid crystal display devices and daily lighting. When LEDs are used for daily lighting, the light directly emitted by LED lamps is very dazzling. The way to prevent the glare of LED lights is generally: cover the LED lights with a frosted glass cover; wrap the LED lights with light-colored cloth; or cover the LED lights with a plastic shell. However, the above methods will affect the brightness of the LED lamp.

发明内容Contents of the invention

本发明的目的是提供一种不刺眼且亮度较高的LED封装结构。The purpose of the present invention is to provide a non-glare and high brightness LED packaging structure.

本发明提供一种LED封装结构,包括LED支架和芯片,所述LED支架包括支架主体、金属支架和反射件,所述支架主体顶部开设有腔体以容纳所述LED芯片,所述金属支架伸入所述支架主体的所述腔体,且伸出到所述支架主体外部形成管脚,所述反射件设于所述芯片上方对应所述芯片的位置,且与所述芯片之间留有间隔,所述金属支架包括朝向所述反射件凸出的凸起,从而形成斜面。The present invention provides an LED packaging structure, which includes an LED bracket and a chip. The LED bracket includes a bracket body, a metal bracket and a reflector. A cavity is opened on the top of the bracket body to accommodate the LED chip. The metal bracket extends into the cavity of the stent body, and protrude out of the stent body to form pins, the reflector is set above the chip at a position corresponding to the chip, and there is a gap between the chip and the chip At intervals, the metal bracket includes protrusions that protrude toward the reflector, thereby forming a slope.

本LED封装结构中,通过在芯片的上方设置反射件,从芯片发出的部分光线射向正上方后被反射件反射到腔体侧壁或底壁后反射出去,可避免光线直射出去,一定程度上解决了灯光刺眼的问题。In this LED packaging structure, by setting a reflector above the chip, part of the light emitted from the chip is directed directly above and then reflected by the reflector to the side wall or bottom wall of the cavity and then reflected, which can prevent the light from going out directly, to a certain extent Solved the glare of the light problem.

其中一实施例中,所述金属支架包括两个斜面和连接于两个所述斜面之间的平面,所述芯片设于所述平面处。In one embodiment, the metal support includes two slopes and a plane connected between the two slopes, and the chip is disposed on the plane.

其中一实施例中,所述腔体的底部朝所述反射件的一侧凸起,形成凸包,所述斜面设于所述凸包上。In one embodiment, the bottom of the cavity protrudes toward one side of the reflector to form a convex hull, and the slope is provided on the convex hull.

其中一实施例中,所述腔体包括开口,所述反射件设于所述开口处并遮蔽所述开口的一部分。In one embodiment, the cavity includes an opening, and the reflector is disposed at the opening and covers a part of the opening.

其中一实施例中,所述腔体为上大下小的喇叭状,从而形成倾斜的侧壁。In one embodiment, the cavity is in the shape of a trumpet with a large top and a small bottom, thereby forming inclined side walls.

其中一实施例中,所述芯片设于所述腔体的底部,且设于所述金属支架上。In one embodiment, the chip is disposed at the bottom of the cavity and disposed on the metal support.

其中一实施例中,所述LED封装还包括封装层,所述封装层填充于所述支架主体的所述腔体。In one embodiment, the LED package further includes an encapsulation layer, and the encapsulation layer is filled in the cavity of the bracket main body.

其中一实施例中,所述反射件镶嵌于所述封装层内。In one embodiment, the reflector is embedded in the encapsulation layer.

其中一实施例中,所述反射件包括倾斜的反射面。In one embodiment, the reflector includes an inclined reflective surface.

其中一实施例中,所述反射件包括两个相交的所述反射面。In one embodiment, the reflector includes two intersecting reflective surfaces.

附图说明Description of drawings

图1为本发明第一实施例的LED封装结构的结构示意图;1 is a schematic structural view of an LED packaging structure according to a first embodiment of the present invention;

图2为图1所示LED封装结构的反射件的另一实施例结构示意图;FIG. 2 is a structural schematic diagram of another embodiment of the reflector of the LED package structure shown in FIG. 1;

图3为本发明第二实施例的LED封装结构的结构示意图;3 is a schematic structural diagram of an LED packaging structure according to a second embodiment of the present invention;

图4为本发明第三实施例的LED封装结构的结构示意图。FIG. 4 is a schematic structural diagram of an LED packaging structure according to a third embodiment of the present invention.

具体实施方式detailed description

为更进一步阐述本发明为达成预定发明目的所采取的技术方式及功效,以下结合附图及实施例,对本发明的具体实施方式、结构、特征及其功效,详细说明如后。In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the specific implementation, structure, features and effects of the present invention will be described in detail below in conjunction with the accompanying drawings and examples.

如图1所示,第一实施例提供的LED封装结构包括LED支架和芯片80,LED支架包括支架主体10、金属支架30和反射件50。支架主体10顶部开设有腔体102以容纳LED芯片80。金属支架30伸入支架主体10的腔体102,且伸出到支架主体10外部形成管脚301。反射件50设于芯片80上方对应芯片80的位置,且与芯片80之间留有间隔。As shown in FIG. 1 , the LED package structure provided by the first embodiment includes an LED bracket and a chip 80 , and the LED bracket includes a bracket body 10 , a metal bracket 30 and a reflector 50 . A cavity 102 is opened on the top of the bracket main body 10 for accommodating the LED chip 80 . The metal bracket 30 extends into the cavity 102 of the bracket body 10 , and protrudes out of the bracket body 10 to form pins 301 . The reflector 50 is disposed above the chip 80 at a position corresponding to the chip 80 , and there is a space between the chip 80 and the chip 80 .

通过在芯片80的上方设置反射件50,从芯片80发出的部分光线射向正上方后被反射件50反射到腔体102侧壁或底壁后反射出去,可避免光线直射出去,一定程度上解决了灯光刺眼的问题。By setting the reflector 50 above the chip 80, part of the light emitted from the chip 80 is directed directly above and then reflected by the reflector 50 to the side wall or bottom wall of the cavity 102 and then reflected, which can prevent the light from going out directly. Solved the problem of glare of light.

腔体102包括开口104,反射件50设于开口104处并遮蔽开口104的一部分。这样,光线从开口104未被反射件59遮蔽的位置射出。The cavity 102 includes an opening 104 , and the reflector 50 is disposed at the opening 104 and covers a part of the opening 104 . In this way, the light is emitted from the position where the opening 104 is not shielded by the reflector 59 .

腔体102为上大下小的喇叭状,从而形成倾斜的侧壁。具体地,腔体102的侧壁上可涂覆反射层。倾斜的侧壁便于将光线反射后从开口104射出。The cavity 102 is in the shape of a trumpet with a large top and a small bottom, thereby forming inclined side walls. Specifically, a reflective layer may be coated on the sidewall of the cavity 102 . The inclined sidewall is convenient for reflecting the light and emitting it from the opening 104 .

本实施例中,金属支架30为平板状,其设于腔体102的底部。In this embodiment, the metal bracket 30 is flat and disposed at the bottom of the cavity 102 .

本实施例中,反射件50为平板状。请参照图2,反射件50也可包括倾斜的反射面502。这样,反射件50可改变光线的出射角度,便于光线反射到腔体102的侧壁和底壁再反射出。具体地,反射件50包括两个相交的反射面502。更具体地,两个反射面502之间的夹角为钝角。反射件50朝向芯片80的一侧设有反射层。In this embodiment, the reflector 50 is flat. Please refer to FIG. 2 , the reflector 50 may also include an inclined reflective surface 502 . In this way, the reflector 50 can change the outgoing angle of the light, so that the light is reflected to the side wall and the bottom wall of the cavity 102 and then reflected. Specifically, the reflector 50 includes two intersecting reflective surfaces 502 . More specifically, the included angle between the two reflective surfaces 502 is an obtuse angle. A reflective layer is provided on a side of the reflective member 50 facing the chip 80 .

芯片80设于腔体102的底部,且设于金属支架30上。The chip 80 is disposed at the bottom of the cavity 102 and disposed on the metal support 30 .

LED封装还包括封装层90,封装层90填充于支架主体10的腔体102,将芯片80封装起来,实现密封。具体地,反射件50可镶嵌于封装层90内,当然,反射件50也可以其他方式固定于封装层90上方。The LED package also includes an encapsulation layer 90, which fills the cavity 102 of the bracket body 10, and encapsulates the chip 80 to achieve sealing. Specifically, the reflector 50 can be embedded in the encapsulation layer 90 , of course, the reflector 50 can also be fixed on the encapsulation layer 90 in other ways.

如图3所示,本发明第二实施例的LED封装结构的结构与第一实施例的LED封装结构相似,不同点仅在于,金属支架30不为平板状,金属支架30包括朝向反射件50凸出的凸起302,从而形成斜面304。这样,便于将反射件50反射回来的光线经反射后改变其出射角度从开口104射出。具体地,金属支架30包括两个斜面304和连接于两个斜面304之间的平面306,芯片80设于平面306处。具体地,斜面304上可涂覆反射膜,以增强反射效果。As shown in FIG. 3 , the structure of the LED packaging structure of the second embodiment of the present invention is similar to that of the first embodiment, the only difference is that the metal bracket 30 is not flat, and the metal bracket 30 includes a reflector 50 Convex protrusions 302 , forming ramps 304 . In this way, it is convenient for the light reflected by the reflector 50 to change its exit angle and exit from the opening 104 after being reflected. Specifically, the metal support 30 includes two slopes 304 and a plane 306 connected between the two slopes 304 , and the chip 80 is disposed on the plane 306 . Specifically, a reflective film may be coated on the slope 304 to enhance the reflective effect.

第二实施例中,腔体102的底部朝反射件50的一侧凸起,形成凸包108,斜面304和平面306设于凸包108上,以使支架主体10更好地支撑金属支架30。In the second embodiment, the bottom of the cavity 102 protrudes toward one side of the reflector 50 to form a convex hull 108, and the slope 304 and the flat surface 306 are arranged on the convex hull 108, so that the bracket body 10 can better support the metal bracket 30 .

可以理解,第二实施例的LED封装结构也可采用图2所示的反射板50。It can be understood that the LED package structure of the second embodiment can also use the reflective plate 50 shown in FIG. 2 .

如图4所示,本发明第三实施例的LED封装结构的结构与第二实施例的LED封装结构相似,不同点仅在于,第三实施例的LED封装结构的支架主体10的腔体102的底部为平面,未设置凸包。可以理解,第三实施例的LED封装结构也可采用图2所示的反射板50。As shown in Fig. 4, the structure of the LED packaging structure of the third embodiment of the present invention is similar to that of the LED packaging structure of the second embodiment, the only difference is that the cavity 102 of the bracket body 10 of the LED packaging structure of the third embodiment The bottom of is flat and has no convex hull. It can be understood that the LED packaging structure of the third embodiment can also use the reflective plate 50 shown in FIG. 2 .

以上仅是本发明的较佳实施例而已,并非对本发明作任何形式上的限制,虽然本发明已以较佳实施例揭露如上,然而并非用以限定本发明,任何熟悉本专业的技术人员,在不脱离本发明技术方案范围内,当可利用上述揭示的技术内容作出些许更动或修饰为等同变化的等效实施例,但凡是未脱离本发明技术方案内容,依据本发明的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本发明技术方案的范围内。The above are only preferred embodiments of the present invention, and do not limit the present invention in any form. Although the present invention has been disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any skilled person familiar with the profession, Without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make some changes or be modified into equivalent embodiments with equivalent changes, but as long as it does not depart from the content of the technical solution of the present invention, the technical essence of the present invention is Any simple modifications, equivalent changes and modifications made in the above embodiments still fall within the scope of the technical solution of the present invention.

Claims (10)

1.一种LED封装结构,其特征在于,包括LED支架和芯片(80),所述LED支架包括支架主体(10)、金属支架(30)和反射件(50),所述支架主体(10)顶部开设有腔体(102)以容纳所述LED芯片(80),所述金属支架(30)伸入所述支架主体(10)的所述腔体(102),且伸出到所述支架主体(10)外部形成管脚(301),所述反射件(50)设于所述芯片(80)上方对应所述芯片(80)的位置,且与所述芯片(80)之间留有间隔,所述金属支架(30)包括朝向所述反射件(50)凸出的凸起(302),从而形成斜面(304)。1. A kind of LED encapsulation structure, it is characterized in that, comprises LED support and chip (80), and described LED support comprises support main body (10), metal support (30) and reflector (50), and described support main body (10 ) is provided with a cavity (102) on the top to accommodate the LED chip (80), the metal bracket (30) extends into the cavity (102) of the bracket body (10), and extends to the Pins (301) are formed on the outside of the bracket main body (10), and the reflector (50) is arranged above the chip (80) at a position corresponding to the chip (80), and leaves a gap between the chip (80) and the chip (80). With intervals, the metal bracket (30) includes a protrusion (302) protruding toward the reflector (50), thereby forming a slope (304). 2.如权利要求1所述的LED封装结构,其特征在于,所述金属支架(30)包括两个斜面(304)和连接于两个所述斜面(304)之间的平面(306),所述芯片(80)设于所述平面(306)处。2. The LED packaging structure according to claim 1, wherein the metal bracket (30) comprises two slopes (304) and a plane (306) connected between the two slopes (304), The chip (80) is disposed at the plane (306). 3.如权利要求1或2所述的LED封装结构,其特征在于,所述腔体(102)的底部朝所述反射件(50)的一侧凸起,形成凸包(108),所述斜面(304)设于所述凸包(108)上。3. The LED packaging structure according to claim 1 or 2, characterized in that, the bottom of the cavity (102) protrudes toward one side of the reflector (50) to form a convex hull (108), the The slope (304) is arranged on the convex hull (108). 4.如权利要求1所述的LED封装结构,其特征在于,所述腔体(102)包括开口(104),所述反射件(50)设于所述开口(104)处并遮蔽所述开口(104)的一部分。4. The LED packaging structure according to claim 1, characterized in that, the cavity (102) comprises an opening (104), and the reflector (50) is arranged at the opening (104) and shields the A portion of the opening (104). 5.如权利要求1所述的LED封装结构,其特征在于,所述腔体(102)为上大下小的喇叭状,从而形成倾斜的侧壁。5. The LED packaging structure according to claim 1, characterized in that, the cavity (102) is in the shape of a trumpet with a large top and a small bottom, so as to form inclined side walls. 6.如权利要求1所述的LED封装结构,其特征在于,所述芯片(80)设于所述腔体(102)的底部,且设于所述金属支架(30)上。6. The LED packaging structure according to claim 1, characterized in that, the chip (80) is disposed at the bottom of the cavity (102) and disposed on the metal support (30). 7.如权利要求1所述的LED封装结构,其特征在于,所述LED封装还包括封装层(90),所述封装层(90)填充于所述支架主体(10)的所述腔体(102)。7. The LED package structure according to claim 1, characterized in that, the LED package further comprises an encapsulation layer (90), and the encapsulation layer (90) is filled in the cavity of the bracket body (10) (102). 8.如权利要求7所述的LED封装结构,其特征在于,所述反射件(50)镶嵌于所述封装层(90)内。8. The LED package structure according to claim 7, characterized in that, the reflector (50) is embedded in the package layer (90). 9.如权利要求1所述的LED封装结构,其特征在于,所述反射件(50)包括倾斜的反射面(502)。9. The LED package structure according to claim 1, characterized in that, the reflector (50) comprises an inclined reflective surface (502). 10.如权利要求9所述的LED封装结构,其特征在于,所述反射件(50)包括两个相交的所述反射面(502)。10. The LED packaging structure according to Claim 9, characterized in that, the reflector (50) comprises two intersecting reflective surfaces (502).
CN201710726042.7A 2017-08-22 2017-08-22 LED encapsulation structure Withdrawn CN107681036A (en)

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