CN107664895B - Lens driving device - Google Patents

Abstract

A lens driving device comprises a base, a bearing seat and a first driving mechanism arranged on a first side of the base, a second driving mechanism arranged on a second side of the base relative to the first side, and a conductive component arranged on the base. The bearing seat is used to bear the lens. The first driving mechanism is used to drive the bearing seat to move along the optical axis direction of the lens. The second driving mechanism comprises a circuit board assembly and a memory alloy wire assembly electrically connected to the circuit board assembly, and the memory alloy wire assembly is used to drive the base to move on a plane perpendicular to the optical axis direction. The conductive component is used to electrically connect the first driving mechanism and the second driving mechanism, and the conductive component and the circuit board assembly are connected at an electrical connection point, wherein the memory alloy wire assembly is closer to the light incident end of the lens than the electrical connection point.

Description

lens drive

technical field

The invention relates to a lens driving device; in particular, it relates to a lens driving device which utilizes shape memory alloy (Shape Memory Alloy, SMA) wires to move the lens.

Background technique

With the trend of miniaturization of lens driving devices, many handheld digital products such as mobile phones or tablet computers have built-in camera or video functions. As users' requirements for image quality increase, lens driving devices with optical image stabilization (OIS) functions have become mainstream.

FIG. 1 shows a schematic diagram of an optical anti-shake (OIS) mechanism 1000 of a conventional lens driving device. As shown in the figure, the optical anti-shake mechanism 1000 mainly includes a support member 1001 , a movable member 1002 and a plurality of memory alloy (SMA) wires 1003 , wherein the SMA wires 1003 are arranged between the support member 1001 and the movable member 1002 , the movable member 1002 can be moved on the supporting member 1001 and the position of the movable member 1002 relative to the supporting member 1001 can be controlled by electric driving. In this way, optical shake compensation can be provided for the lens module (not shown) disposed above the optical anti-shake mechanism 1000 .

However, in order to achieve the electrical connection between the aforementioned optical anti-shake mechanism 1000 and the lens module, it is necessary to form a plurality of gooseneck members 1004 (with lines formed thereon) extending toward the lens module above the movable member 1002, and The base of the lens module needs to reserve a space (groove) for accommodating the gooseneck member 1004, so that the size of the lens module will increase and the local strength of the base will be weakened (due to the reduced thickness near the groove). In addition, in order to avoid the possibility of short circuit or jamming caused by the memory alloy wire 1003 coming into contact with the gooseneck member 1004 during the operation of the mechanism, the gooseneck member 1004 also needs to be configured to be spaced from the memory alloy wire 1003 at a certain distance, so as to make the optical anti-hand The size of the vibration mechanism 1000 increases, which is not conducive to miniaturization of the lens driving device.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a lens driving device for further miniaturization.

In view of the aforementioned existing problems, the present invention provides a lens driving device, which includes a base, a bearing seat, a first driving mechanism, a second driving mechanism and a conductive member. The bearing seat is arranged on a first side of the base for bearing a lens. The first driving mechanism is arranged on the first side of the base, and is used for driving the bearing base to move along an optical axis direction of the lens. The second driving mechanism is disposed on a second side of the base relative to the first side, and includes a circuit board assembly and a memory alloy (SMA) wire assembly electrically connected to the circuit board assembly. The memory alloy wire assembly is used to drive the base The mount moves on a plane perpendicular to the direction of the optical axis of the lens. The conductive member is disposed on the base for electrically connecting the first driving mechanism and the second driving mechanism, and the conductive member and the circuit board assembly are connected to an electrical connection point, wherein the memory alloy wire assembly is compared with the electrical connection point Close to the light-incidence end of the lens.

According to some embodiments, the base has a surface facing the second driving mechanism, and the surface is closer to the light incident end of the lens than the aforementioned electrical connection point.

According to some embodiments, the circuit board assembly includes a first circuit board and a second circuit board, and the first circuit board is disposed between the second circuit board and the base and is connected to the base. The memory alloy wire assembly is electrically connected to the first circuit board and the second circuit board, and is used for driving the first circuit board to move relative to the second circuit board on a plane perpendicular to the optical axis direction of the lens. Wherein, the conductive member and the first circuit board form the aforementioned electrical connection point.

According to some embodiments, the first circuit board includes a first substrate and a first circuit layer, the first circuit layer is disposed on the first substrate and a circuit layer opening is formed. The lens driving device further includes an electrical connection element for electrically connecting the conductive member and the first circuit layer at the opening of the circuit layer.

According to some embodiments, the base has a polygonal shape, and the electrical connection elements are disposed close to corners of the base.

According to some embodiments, when viewed from an outer side of the lens driving device, a substrate opening is formed on the first substrate, exposing the aforementioned circuit layer opening.

According to some embodiments, when viewed along a direction perpendicular to the optical axis direction of the lens, the electrical connection element is partially overlapped with the first substrate.

According to some embodiments, the conductive member is formed with an extension portion passing through the circuit layer opening and the substrate opening.

According to some embodiments, the electrical connection element is disposed on a surface of the first substrate facing the aforementioned outer side of the lens driving device.

According to some embodiments, the second circuit board includes a second substrate and a second circuit layer, the second circuit layer is disposed on the second substrate, is electrically connected to the first circuit layer and extends to the outside of the lens driving device.

According to some embodiments, the first driving mechanism includes a coil and a first magnetic element corresponding in position, and the coil is disposed on the bearing base. The lens driving device further includes an elastic element, which is arranged between the bearing seat and the base. Wherein, the coil is electrically connected to the aforementioned conductive member via an elastic element.

According to some embodiments, the lens driving device further includes a second magnetic element corresponding in position and a magnetic field sensing component, the second magnetic component is disposed on the carrier, and the magnetic field sensing component includes a third circuit board and is disposed on the first A magnetic field sensing chip on three circuit boards. The coil is electrically connected to the third circuit board via the elastic element, and then electrically connected to the conductive member via the third circuit board.

According to some embodiments, the lens driving device further includes a plurality of conductive members, respectively electrically connected to the plurality of conductive terminals of the third circuit board, and configured to surround an opening of the base.

According to some embodiments, the first substrate of the first circuit board has a positioning member extending toward the base, and a positioning groove corresponding to and used for engaging the positioning member is formed on the base.

According to the advantages and beneficial effects of the present invention, a lens driving device using memory alloy wires to move the lens can be provided, and the gooseneck member used to electrically connect the lens module and the optical anti-shake mechanism in the prior art can be omitted. , so as to achieve the purpose of miniaturizing the lens driving device.

In order to make the above-mentioned and other objects, features, and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below, and are described in detail as follows in conjunction with the accompanying drawings.

Description of drawings

FIG. 1 is a schematic diagram of an optical anti-shake (OIS) mechanism of a conventional lens driving device.

FIG. 2 is a partial exploded view of a lens driving device according to some embodiments of the present invention.

FIG. 3 is an exploded view of the optical anti-shake mechanism in FIG. 2 .

FIG. 4 is a bottom view of the optical anti-shake mechanism of FIG. 3 after being assembled.

FIG. 5 is an exploded view of the lens module in FIG. 2 .

FIG. 6 is a cross-sectional view of the lens module of FIG. 5 after being assembled.

FIG. 7 is a top view of the base of the lens module in FIG. 5 .

FIG. 8 is a schematic diagram showing the positional relationship between the conductive member on the base and the optical anti-shake mechanism in FIG. 5 when viewed from the lower side of the lens driving device.

FIG. 9 is a schematic diagram showing the positional relationship between the conductive member on the base and the optical anti-shake mechanism in FIG. 5 when viewed along a direction perpendicular to the optical axis direction of the lens.

10 is a schematic diagram of the positional relationship between the conductive member on the base and the optical anti-shake mechanism when viewed from the lower side of the lens driving device according to other embodiments of the present invention.

FIG. 11 is an exploded view of a lens module according to other embodiments of the present invention.

FIG. 12 is a partial cross-sectional view of the lens module in FIG. 11 after being assembled.

FIG. 13 is a top view of the base of the lens module in FIG. 11 .

14 is a schematic diagram showing the positional relationship between the positioning grooves on the base and the positioning members on the first circuit board of the optical anti-shake mechanism according to some embodiments of the present invention.

Description of reference numbers:

1～Lens drive device;

10, 10'～Lens module;

11 ~ frame;

11A ~ frame opening;

12 ~ base;

12A~ base opening;

12B ~ bottom surface;

12C～Locating slot;

13～bearing seat;

13A~through hole;

14. Electromagnetic drive mechanism (first drive mechanism);

15~ elastic element;

16 ~ elastic element;

17~ Magnetic field sensing components;

17A ~ circuit board (third circuit board);

17B ~ Magnetic Field Sensing Chip;

17C～Conductive terminal;

18 ~ cover plate;

20～Optical anti-shake mechanism;

21 to the first circuit board (movable component);

22 to the second circuit board (supporting member);

23～Memory alloy wire;

30 to shell;

210 to the first substrate;

210A ~ body part;

210B～chord arm;

210C ~ opening;

210D～substrate opening;

210E～Locating parts;

211 ~ the first circuit layer;

211A ~ circuit layer opening;

212～protruding part;

212A ~ line connection structure;

220 to the second substrate;

221 to the second circuit layer;

222～protruding part;

222A~line fixing structure;

1000～Optical anti-shake mechanism;

1001 ~ support components;

1002 ~ movable components;

1003～memory alloy wire;

1004 ~ gooseneck components;

A1 ~ circuit board components;

A2~memory alloy wire assembly;

C ~ coil;

E ~ end;

M1～the first magnetic element;

M2～the second magnetic element;

O ~ optical axis, optical axis direction;

P, P1, P2 ~ conductive components;

T ~ extension;

W - electrical connection element.

Detailed ways

The lens driving device according to the embodiment of the present invention will be described below. It can be readily appreciated, however, that embodiments of the invention provide many suitable inventive concepts that can be embodied in a wide variety of specific contexts. The specific embodiments disclosed are merely illustrative of particular ways to use the invention, and are not intended to limit the scope of the invention. The protection scope of the present invention shall be determined by the scope defined by the appended claims.

Unless otherwise defined, all terms (including technical and scientific terms) used hereinafter have the same meaning as commonly understood by one of ordinary skill in the art. It is to be understood that these terms, such as those defined in commonly used dictionaries, should be interpreted to have a meaning consistent with the relevant art and the context or context of this disclosure and not in an idealized or overly formal manner Interpretation, unless specifically defined herein.

In the following description, the orientations referred to as "up" and "down" are only used to represent relative positional relationships, and are not used to limit the present invention. When referring to a first element on a second element, it may include the case where the first element and the second element are in direct contact with or spaced apart by one or more other elements.

In addition, in the drawings or the description of the specification, the same symbols are used for similar or identical parts. In the drawings, the shape or thickness of the embodiments may be exaggerated for simplification or convenience of indication.

Referring to FIG. 2 first, a lens driving device 1 according to some embodiments of the present invention may be disposed inside an electronic device such as a camera, a mobile phone or a tablet computer, and includes a lens module 10 and an optical anti-shake (OIS) mechanism. 20 and a casing 30 for accommodating the lens module 10 and the optical anti-shake mechanism 20 . The lens module 10 is used to carry a lens (not shown in the figure), and can drive the lens along its optical axis direction O (that is, the Z-axis direction in the figure) relative to a photosensitive element (not shown in the figure) outside the lens driving device 1 . ) to move to achieve the purpose of Auto-Focus (AF). The lens module 10 can also be fixed on the optical anti-shake mechanism 20 by, for example, bonding. The optical anti-shake mechanism 20 is used to drive the lens module 10 to move on a plane perpendicular to the optical axis direction O (ie, the XY plane in the figure) to provide optical shake compensation, thereby improving image quality.

It should be understood that a main purpose of the present invention is to provide a lens driving device, which can omit the gooseneck member used to electrically connect the lens module 10 and the optical anti-shake mechanism 20 in the prior art, so as to achieve the The effect of miniaturization of the drive unit. The following first describes the basic structure and driving principle of the optical anti-shake mechanism 20 according to some embodiments of the present invention.

As shown in FIGS. 3 and 4 , the optical anti-shake mechanism 20 mainly includes a circuit board assembly A1 and a memory alloy (SMA) wire assembly A2. The circuit board assembly A1 includes a first circuit board 21 and a second circuit board 22 that are stacked on top of each other. The memory alloy wire assembly A2 includes a plurality of (for example, 4) memory alloy wires 23, and the material may include titanium-nickel (Ti-Ni) alloy, titanium-palladium (Ti-Pd) alloy, titanium-nickel-copper (Ti-Ni-Cu) Alloys, titanium-nickel-palladium (Ti-Ni-Pd) alloys, or a combination of the above. The memory alloy wire 23 is electrically connected to the first circuit board 21 and the second circuit board 22 , and can be changed in length by applying a driving signal (eg, current) to it through an external power source (not shown). For example, when a driving signal is applied to increase the temperature of the memory alloy wire 23, the memory alloy wire 23 can be deformed and elongated or shortened; when the driving signal is stopped, the memory alloy wire 23 can return to its original length.

Thereby, by applying an appropriate driving signal, the length of the memory alloy wires 23 of the memory alloy wire assembly A2 can be controlled to drive the first circuit board 21 (moving member) to move relative to the second circuit board 22 (supporting member). Further, with the movement of the first circuit board 21 , the lens module 10 ( FIG. 2 ) connected to the first circuit board 21 can also move relative to the second circuit board 22 , so that the lens driving device 1 has an optical anti-shake and optical shake compensation.

Please continue to refer to FIG. 3 and FIG. 4 , the first circuit board 21 includes a first substrate 210 and a first circuit layer 211 . The first substrate 210 can be made of a metal material (eg, stainless steel), and includes a substantially rectangular body portion 210A and a plurality of (eg, two) L-shaped string arm portions 210B extending from the body portion 210A, and the string arm portions 210B It is configured to correspond to the four sides of the main body portion 210A. The first circuit layer 211 is formed on the chord portion 210B of the first substrate 210 and partially extends to the body portion 210A. For the purpose of electrical isolation, the outer layer of the first circuit layer 211 is covered with an insulating layer. According to some embodiments, the first circuit layer 211 may be formed on the first substrate 210 by means of Insert Molding or 3D Molded Interconnect Device technology.

In addition, a plurality of (eg, two) stepped protrusions 212 are formed on an oblique diagonal line of the first substrate 210 , and each protrusion 212 has a plurality of (eg, two) wire connection structures 212A. The first circuit layer 211 may extend to the protruding portion 212 to electrically connect the wire connection structure 212A.

Similarly, the second circuit board 22 includes a second substrate 220 and a second circuit layer 221 . The second substrate 220 can be made of a metal material (eg, stainless steel) and has a substantially rectangular shape. The second circuit layer 221 substantially covers the upper surface of the second substrate 220 . For the purpose of electrical isolation, the second circuit layer 221 may be coated with an insulating layer (not shown). The second circuit layer 221 can also be formed on the second substrate 220 by means of insert molding or three-dimensional molding interconnection object technology.

In addition, a plurality of (eg, two) stepped protrusions 222 are formed on a diagonal line of the second substrate 220 , and each protrusion 222 has a plurality of (eg, two) wire fixing structures 222A. The second circuit layer 221 may extend to the protruding portion 222 of the second substrate 220 to electrically connect the wire fixing structure 222A.

As shown in FIG. 4 , after the optical anti-shake mechanism 20 is assembled, the wire connecting structures 212A of the first circuit board 21 and the wire fixing structures 222A of the second circuit board 22 are located at four corners of the optical anti-shake mechanism 20, respectively. In addition, a line connecting structure 212A and a line fixing structure 222A can be seen on each side of the optical anti-shake mechanism 20 , and each memory alloy wire 23 is electrically connected to the line connecting structure 212A and the line fixing structure 222A. In addition, the first circuit layer 211 of the first circuit board 21 can be electrically connected to the second circuit layer 221 of the second circuit board 22 by, for example, soldering. Although not shown, the second circuit layer 221 can extend to the outside of the optical anti-shake mechanism 20 to be electrically connected to an external power source (not shown).

Through the configuration of the optical anti-shake mechanism 20 (second driving mechanism) described above, when an appropriate driving signal is applied to each memory alloy wire 23 of the memory alloy wire assembly A2, the memory alloy wire 23 will change its shape (eg, elongate or shortening), so that the first circuit board 21 and the lens module 10 ( FIG. 2 ) connected thereto can move relative to the second circuit board 22 on a plane (XY plane) perpendicular to the optical axis direction O (including along a plane perpendicular to the optical axis direction O). The axis direction O is translated relative to the second circuit board 22, or rotated relative to the second circuit board 22 around the optical axis direction O) to provide optical shake compensation.

Next, the structure of the lens module 10 and the electrical connection relationship between the lens module 10 and the optical anti-shake mechanism 20 will be described.

As shown in FIG. 5 and FIG. 6 , the lens module 10 includes a frame 11 , a base 12 , a bearing base 13 , an electromagnetic driving mechanism 14 and a plurality of elastic elements 15 and 16 .

The frame 11 and the base 12 can be combined with each other to accommodate the aforementioned other components/elements. A lens (not shown) in the lens module 10 can pass through a frame opening 11A formed on the frame 11 to capture light and shadow from the outside world. The base 12 is formed with a base opening 12A, wherein the base opening 12A and the frame opening 11A are located on the optical axis O of the lens. Thereby, the lens in the lens module 10 can focus on the optical axis O with a photosensitive element (not shown) disposed outside the lens driving device 1 (eg, the lower side thereof), thereby achieving the camera function.

The bearing seat 13 is disposed on the upper side (first side) of the base 12, and has a through hole 13A for accommodating the lens, wherein the through hole 13A and the lens can be respectively provided with corresponding screw structures (not shown in the figure), The lens can be locked in the through hole 13A.

The electromagnetic drive mechanism 14 (first drive mechanism) includes a coil C and a plurality (for example, four) of first magnetic elements M1 (for example, magnets). The coil C is wound around the outer peripheral surface of the carrier 13 . According to some embodiments, the coil C may be in the shape of a quadrangle, a hexagon, an octagon or other optional shapes according to the shape of the carrier 13 . A plurality of elongated first magnetic elements M1 are respectively disposed on different inner side walls of the frame 11 and correspond to the coils C. As shown in FIG. According to some embodiments, the first magnetic elements M1 can also be triangular, and are respectively disposed at the corners between the inner side walls of the frame 11 .

In addition, the aforementioned carrier 13 and the lens therein are disposed between elastic elements 15 and 16 (eg, metal reeds) made of elastic materials, and can be elastically suspended from the center of the frame 11 by the elastic elements 15 and 16 . More specifically, the top of the bearing seat 13 can be connected with the elastic element 15, and the elastic element 15 can be connected with the inner wall of the frame 11, and the bottom of the bearing seat 13 can be connected with the elastic element 16, and the elastic element 16 and the base 12 Inner wall connection.

Through the above design, when an external power source (not shown) applies a driving signal (such as current) to the coil C, an electromagnetic driving force can be generated by the magnetic field of the coil C and the first magnetic element M1. , so as to drive the bearing seat 13 and the lens therein to move relative to the frame 11 along the optical axis direction O (Z axis direction) of the lens, thereby achieving the automatic focusing function. The elastic elements 15 and 16 can produce a buffering effect in the direction O of the optical axis, so as to avoid damage to the bearing base 13 and the lens therein.

When the lens module 10 is assembled and connected to the optical anti-shake mechanism 20 (please refer to FIG. 2 to FIG. 6 and FIG. 9 together), the optical anti-shake mechanism 20 is located on the lower side of the base 12 of the lens module 10 (No. two sides), and the first circuit board 21 of the optical anti-shake mechanism 20 is located between the base 12 and the second circuit board 22 and connected to the base 12 .

Further, the coil C of the electromagnetic driving mechanism 14 of the aforementioned lens module 10 can be electrically connected to an external power source (not shown) via the elastic element 16 and a plurality of conductive members P disposed on the base 12 . More specifically, the two ends of the coil C can be electrically connected to the plurality of conductive members P on the base 12 through a plurality of (eg, two) independent portions of the elastic element 16 , respectively. According to some embodiments (for example, referring to FIG. 7 ), the base 12 may have a plurality of (for example, four) conductive members P, and two of the conductive members P1 are electrically connected to a plurality of independent parts of the elastic element 16 , and the other is The two conductive members P2 are not electrically connected to the elastic element 16 . The aforementioned conductive member P may be made of a metal material (eg, copper), and embedded in the base 12 by means of insert molding or three-dimensional molding interconnected object technology.

According to some embodiments, the conductive member P may have an elongated plate structure (but not limited thereto), and is configured to surround the base opening 12A of the base 12 . In addition, the surface of the conductive member P is adjacent to the bottom surface 12B of the base 12, and the conductive member P has only the end E extending toward the base opening 12A (along its radial direction) exposed to the outside of the base 12 for connecting the aforementioned The first circuit board 21 of the optical anti-shake mechanism 20 .

Referring to FIGS. 4 , 7 , 8 and 9 , the first circuit layer 211 on the first circuit board 21 of the optical anti-shake mechanism 20 can be located adjacent to an opening 210C in the center of the first substrate 210 . A plurality of (eg, two) wiring layer openings 211A are formed to expose wirings therein, and the positions of the wiring layer openings 211A correspond to the positions of the ends E of the conductive members P1 on the base 12 of the lens module 10 ( FIG. 8 and Figure 9). The end E of the conductive member P1 and the circuit exposed in the circuit layer opening 211A of the first circuit layer 211 can be connected to an electrical connection point.

In addition, when viewed from an outer side of the lens driving device 1 (eg, the lower side of the optical anti-shake mechanism 20 ), the first substrate 210 is formed with a plurality of (eg, two) substrate openings 210D ( FIG. 8 ), corresponding to The wiring layer opening 211A of the first wiring layer 211 is exposed. The substrate opening 210D allows an electrical connection element W (such as solder) to be applied to the position of the circuit layer opening 211A from the lower side of the optical anti-shock mechanism 20 to electrically connect the end E of the conductive member P1 and the first circuit Layer 211. Furthermore, the circuit layer opening 211A may facilitate the combination of the electrical connection element W and the first circuit layer 211 . It should be noted that, when viewed along a direction perpendicular to the optical axis direction O of the lens (as shown in FIG. 9 ), the electrical connection element W partially overlaps the first substrate 210 .

It is worth mentioning that the conductive member P2 on the base 12 that is not electrically connected to the elastic element 16 can also be soldered to the first substrate 210 of the first circuit board 21 through an electrical connection element W (eg, solder). In this way, the joint strength between the lens module 10 and the optical anti-shake mechanism 20 can be improved.

Through the above design, the electrical connection between the electromagnetic driving mechanism 14 (first driving mechanism) of the lens module 10 and the optical anti-shake mechanism 20 (second driving mechanism) can be achieved, and the lens driving device 1 can be equipped with autofocus ( AF) and Optical Image Stabilization (OIS).

It should be understood that the lens driving device 1 of the above-mentioned embodiment omits the gooseneck member used to electrically connect the lens module 10 and the optical anti-shake mechanism 20 in the prior art, so that the effect of miniaturizing the lens driving device can be achieved. . More specifically, since it is not necessary to provide a gooseneck member extending toward the base 12 of the lens module 10 on the optical anti-shake mechanism 20, it is also unnecessary to reserve a space (groove) for accommodating the gooseneck member on the base 12, Therefore, the size of the lens module 10 can be reduced. At the same time, since the structural integrity of the base 12 can be maintained, the structural strength thereof can also be improved.

It should be noted that, when viewed along a direction perpendicular to the optical axis direction O of the lens (as shown in FIG. 9 ), the conductive member P1 and the first circuit board 21 of the circuit board assembly A1 are connected to an electrical connection point (corresponding to the position of the junction between the end E of the conductive member P1 and the electrical connection element W in the figure), wherein the memory alloy wire component A2 is closer to the light incident end of the lens than the electrical connection point (that is, The upper side of the lens driving device 1 ), and a surface of the base 12 facing the optical anti-shake mechanism 20 is also closer to the light incident end of the lens than the electrical connection point. In addition, the electrical connection point is located close to the central opening 210C of the first circuit board 21 (or the base opening 12A of the base 12 ) and away from the memory alloy wire assembly A2 (located on the first circuit board 21 and the base The outer side of the seat 12), so as to avoid the risk of short circuit caused by the electrical connection point contacting the memory alloy wire assembly A2.

According to other embodiments (please refer to FIG. 10 ), the conductive member P1 on the base 12 may be formed with an extension portion T extending toward the first circuit board 21 of the circuit board assembly A1 and passing through the first circuit board 21 The circuit layer opening 211A of the first circuit layer 211 (due to the angle relationship, the first circuit layer 211 and the circuit layer opening 211A are not seen in FIG. 10 ) and the substrate opening 210D. The substrate opening 210D allows an electrical connection element W (such as solder) to be applied to the position of the circuit layer opening 211A from the underside of the optical anti-shake mechanism 20 (at this time, the electrical connection element W is disposed on the surface of the first circuit board 21 ). On the lower surface of the lens driving device 1 ), the conductive member P1 and the first circuit layer 211 are electrically connected. In an ideal situation, the electrical connection element W can be covered with the extension portion T passing through the first substrate 21 to prevent it from being exposed to the outside world. With this design, the bonding area between the electrical connection element W and the conductive member P1 can be increased, and the reliability of the assembly operation can be improved.

In some embodiments, the electrical connection element W can also be disposed close to the corner of the base 12 (having a polygonal shape) and separated from the opening 210C of the first substrate 210 by a certain distance (in this way, the conductive member P1 and the circuit The electrical connection points formed by the first circuit board 21 of the board assembly A1 also need to be moved accordingly). This configuration prevents the lens from being disturbed.

Fig. 11 shows an exploded view of a lens module 10' according to other embodiments of the present invention, and Fig. 12 shows a partial cross-sectional view of the lens module 10' in Fig. 11 after being assembled. As shown in FIG. 11 and FIG. 12 , the main difference between the lens module 10 ′ and the lens module 10 in the aforementioned embodiments in FIGS. 5 to 7 is that the lens module 10 ′ further includes a plurality of (eg, two) second magnetic elements M2 (eg a magnet) and a magnetic field sensing element 17 . The second magnetic element M2 is disposed on the outer peripheral surface of the bearing base 13 . It should be understood that the sensing accuracy can be improved by using a plurality of second magnetic elements M2, and a similar effect can also be achieved by using a magnetic element with a plurality of magnetic poles (for example, four magnetic poles) to replace the plurality of second magnetic elements M . A cover plate 18 can also be disposed on the frame 11 to locate the first magnetic element M1, which can improve the positioning accuracy. The magnetic field sensing element 17 is disposed on an inner sidewall of the frame 11 and corresponds to the second magnetic element M2, wherein the magnetic field sensing element 17 includes a circuit board 17A (eg, a flexible circuit board) and is disposed on the circuit board 17A (No. A magnetic field sensing chip 17B on three circuit boards).

By sensing the change of the magnetic field generated by the movement of the second magnetic element M2 , the magnetic field sensing chip 17B can know the position of the carrier 13 and the lens in the optical axis direction O. Further, the magnetic field sensing element 17 can be electrically connected to an external power source (not shown), and the external power source can further transmit a driving signal (eg, current) according to the position of the carrier 13 measured by the magnetic field sensing chip 17B The coil C applied to the carrier 13 (according to some embodiments, the magnetic field sensing chip 17B may also have the function of controlling the magnitude of the driving signal provided to the coil C), and then driven by the electromagnetic driving force generated by the magnetic field driving mechanism 14 The carrier 13 and the lens therein are moved to a desired position along the optical axis direction O (Z axis direction) of the lens. Thereby, a closed-loop auto focus (AF) control can be realized.

According to some embodiments, the coil C can be electrically connected to the circuit board 17A of the magnetic field sensing component 17 via the elastic element 16 , and then electrically connected to a plurality of conductive terminals 17C ( FIG. 11 ) on the base 12 via the plurality of conductive terminals 17C of the circuit board 17A ( FIG. 11 ). (For example, four) conductive members P. As shown in FIG. 13 , the conductive member P may have an elongated plate structure (but not limited thereto), and be arranged in a manner to surround the base opening 12A of the base 12 . More specifically, one end of each conductive member P is disposed on the side of the base 12 connected to the conductive terminal 17C of the circuit board 17A, and the other end is disposed around the base opening 12A of the base 12 . In addition, the surface of the conductive member P is adjacent to the bottom surface 12B of the base 12, and the conductive member P has only the end E extending toward the base opening 12A (along its radial direction) exposed to the outside of the base 12 for connecting the aforementioned The first circuit board 21 of the optical anti-shake mechanism 20 .

The electrical connection method and advantages of the conductive member P and the first circuit board 21 of the optical anti-shock mechanism 20 are the same as those in the foregoing embodiments, and repeated descriptions are only omitted here.

In addition, according to some embodiments (please refer to FIG. 3 , FIG. 4 , and FIG. 14 ), the first substrate 210 of the first circuit board 21 of the optical anti-shake mechanism 20 may also extend toward the base 12 of the lens module 10 . At least one positioning member 210E is formed on the base 12 , and at least one positioning groove 12C corresponding to and used for engaging the positioning member 210E is formed on the base 12 (eg, formed on the bottom side of the outer side wall of the base 12 ). In this way, the positioning between the lens module 10 and the optical anti-shake mechanism 20 can be facilitated, and at the same time, an adhesive can be applied between the positioning member 210E and the positioning groove 12C to assist the assembly operation.

To sum up, in the lens driving device of the embodiment of the present invention, the gooseneck member used to electrically connect the lens module and the optical anti-shake mechanism in the prior art can be omitted, and the base embedded in the lens module can be The conductive member is directly electrically connected to the optical anti-shake mechanism, so as to achieve the effect of miniaturizing the lens driving device and simplifying the structure. In addition, since the conductive members of the base are not exposed to the outside world, the chance of short-circuiting caused by the influence of other components (eg, memory alloy wires) can also be reduced.

Although the present invention is disclosed in the foregoing embodiments, it is not intended to limit the present invention. Those skilled in the art can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be regarded as the scope defined by the appended claims.

Claims (13)

1. A lens driving apparatus, comprising:

a base;

a bearing seat arranged on a first side of the base and used for bearing a lens;

the first driving mechanism is arranged on the first side of the base and used for driving the bearing seat to move along the optical axis direction of the lens;

a second driving mechanism disposed on a second side of the base opposite to the first side, comprising:

a circuit board assembly;

a memory alloy wire component electrically connected with the circuit board component and used for driving the base to move on a plane vertical to the optical axis direction; and

a conductive member disposed on the base for electrically connecting the first driving mechanism and the second driving mechanism, wherein the conductive member and the circuit board assembly are connected to an electrical connection point, and the memory alloy wire assembly is closer to a light incident end of the lens than the electrical connection point;

the memory alloy wire assembly is electrically connected with the first circuit board and the second circuit board and used for driving the first circuit board to move relative to the second circuit board on the plane perpendicular to the optical axis direction, wherein the conductive member and the first circuit board form the electrical connection point.

2. The lens driving device as claimed in claim 1, wherein the base has a surface facing the second driving mechanism and closer to the light incident end of the lens than the electrical connection point.

3. The lens driving device as claimed in claim 1, wherein the first circuit board includes a first substrate and a first circuit layer disposed on the first substrate and having a circuit layer opening formed thereon, the lens driving device further including an electrical connection element for electrically connecting the conductive member and the first circuit layer at the position of the circuit layer opening.

4. The lens driving device as claimed in claim 3, wherein the base has a polygonal shape and the electrical connection element is disposed close to a corner of the base.

5. The lens driving device as claimed in claim 3, wherein the first substrate has a substrate opening formed thereon exposing the wiring layer opening when viewed from an outer side of the lens driving device.

6. The lens driving device as claimed in claim 5, wherein the electrically connecting element partially overlaps the first substrate when viewed along a direction perpendicular to the optical axis direction of the lens.

7. The lens driving device as claimed in claim 5, wherein the conductive member is formed with an extension portion passing through the circuit layer opening and the substrate opening.

8. The lens driving device according to claim 7, wherein the electrical connection element is disposed on a surface of the first substrate facing the outer side of the lens driving device.

9. The lens driving device as claimed in claim 3, wherein the second circuit board includes a second substrate and a second circuit layer disposed on the second substrate, electrically connected to the first circuit layer and extending to an outside of the lens driving device.

10. A lens driving device as claimed in any one of claims 1 to 9, wherein the first driving mechanism comprises a coil and a first magnetic element corresponding to each other, the coil is disposed on the carrying seat, the lens driving device further comprises an elastic element disposed between the carrying seat and the base, wherein the coil is electrically connected to the conductive member through the elastic element.

11. The lens driving device as claimed in claim 10, further comprising a second magnetic element and a magnetic field sensing assembly disposed on the carrier, the magnetic field sensing assembly comprising a third circuit board and a magnetic field sensing chip disposed on the third circuit board, wherein the coil is electrically connected to the third circuit board via the elastic element and the conductive member via the third circuit board.

12. The lens driving device as claimed in claim 11, further comprising a plurality of conductive members electrically connected to the plurality of conductive terminals of the third circuit board, respectively, and configured to surround an opening of the base.

13. The lens driving device as claimed in claim 3, wherein the first substrate of the first circuit board has a positioning element extending toward the base, and the base has a positioning slot corresponding to and for engaging with the positioning element.

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