CN107658275A - Stacked multi-package module and manufacturing method thereof - Google Patents

Abstract

The embodiment of the present invention provides a stacked multi-package module and a manufacturing method thereof, wherein the manufacturing method of the stacked multi-package module comprises installing at least one first electronic component on a substrate, disposing a conductive layer on a first insulating layer, covering the first electronic component and partially covering the surface of the substrate with the first insulating layer, installing at least one other first electronic component on the first insulating layer and electrically connecting with the conductive layer, and covering the first electronic component and the surface of the substrate with a second insulating layer.

Description

Stacked multi-package module and manufacturing method thereof

The present invention is a divisional application, the filing date of the original application is May 31, 2013, the application number is 201310214754.2, and the title of the invention is: stacked multi-encapsulation module and its manufacturing method.

technical field

The present invention relates to a stacked multi-package module, and in particular to a stacked multi-package module with a first insulating layer.

Background technique

The current common electronic packaging modules usually include package stacking structure (Package Stacking), and in order to improve the stacking density of the overall electronic packaging module and reduce the volume of the package, the electronic packaging module usually adopts three-dimensional vertically integrated circuits (VIC) Integrate in combination.

When electronic components of different heights are electrically connected to the substrate, in order to increase the stacking density of the overall electronic packaging module, the existing three-dimensional vertical stacking method usually uses a mold to first form a mold to encapsulate the electronic components, and then lower the height The molding material above the electronic components uses laser to dig out holes as the pre-installation positions of the electronic components, then make conductive columns and circuits in the molding holes, and then place the electronic components in the molding holes And to fill another sealant to fill the mold cavity.

Generally speaking, with the miniaturization of electronic packaging modules, the layout and production process of electronic components become more and more complicated, and the difficulty of production also increases accordingly. In addition, this method is prone to problems such as different appearance colors and poor flatness.

Contents of the invention

The invention provides a stacked multi-encapsulation module, the insulation layer of which is used to simplify the packaging process and increase the utilization rate of the internal stacking space of the stacked multi-encapsulation module.

The stacked multi-package module of the present invention includes a substrate, a stacked structure, and at least one second electronic component; the stacked structure includes a plurality of first electronic components, at least one first insulating layer, and at least one conductive pattern layer, some of which are first The electronic components are installed on the substrate, and the first insulating layer covers some of the first electronic components and partially covers the surface of the substrate, the conductive pattern layer is arranged on the first insulating layer, and some other first electronic components are installed on the first The insulating layer is electrically connected with the conductive pattern layer; the second electronic component is installed on the substrate, and the height of the second electronic component is greater than that of the first electronic component.

The invention provides a method for manufacturing a stacked multi-encapsulation module, which is used to simplify the packaging process and increase the utilization rate of the internal stacking space of the stacked multi-encapsulation module.

The manufacturing method of the stacked multi-package module of the present invention includes installing at least one first electronic component and at least one second electronic component on the substrate, and the first and second electronic components are electrically connected to the substrate, and the second electronic component The height of the element is greater than that of the first electronic element; after disposing the conductive layer on the first insulating layer, the first insulating layer covers the first electronic element and partly covers the surface of the substrate. forming at least one conductive column penetrating the conductive layer and the first insulating layer, and patterning the conductive layer to form a conductive pattern layer; installing another at least one first electronic component on the first insulating layer and It is electrically connected with the conductive pattern layer.

To sum up, in the stacked multi-package module of the present invention, the height of the second electronic component is greater than that of the first electronic component, so that there is a height difference between the first electronic component and the second electronic component. Some of the first electronic components and the second electronic components are installed on the substrate, and the first insulating layer is pasted and covered on a part of the first electronic components and a part of the substrate. The process is relatively simple, thereby simplifying the packaging process. When the first insulating layer covers the first electronic components and part of the substrate, there will be space above the first electronic components to accommodate other first electronic components. Accordingly, not only can the packaging process be simplified and the signal line path shortened, so that line loss and interference are reduced, and the electrical performance of the product is better. In addition, the package of the stacked multi-package module has high flatness and uniform appearance color, and the utilization rate of the internal stacking space of the stacked multi-package module is increased.

In addition, in the manufacturing method of the stacked multi-package module of the present invention, the height of the second electronic component is greater than that of the first electronic component, so that there is a height difference between the first electronic component and the second electronic component. By attaching the first insulating layer to cover a part of the first electronic components and a part of the substrate, and then arranging other first electronic components in the space above the first electronic components. Accordingly, not only can the packaging process be simplified and the signal line path shortened, so that line loss and interference are reduced, and the electrical performance of the product is better. In addition, the package of the stacked multi-package module has high flatness and uniform appearance color, and the utilization rate of the internal stacking space of the stacked multi-package module is increased.

In order to further understand the technology, method and effect adopted by the present invention to achieve the intended purpose, please refer to the following detailed description and drawings of the present invention, and believe that the purpose, characteristics and characteristics of the present invention can be deepened and concretely obtained from this However, the accompanying drawings and appendices are provided for reference and illustration only, and are not intended to limit the present invention.

Description of drawings

FIG. 1 is a schematic structural diagram of a stacked multi-package module according to the first embodiment of the present invention.

FIG. 2 is a schematic structural diagram of a stacked multi-package module according to a second embodiment of the present invention.

FIG. 3 is a schematic flowchart of a method for manufacturing a stacked multi-package module according to an embodiment of the present invention.

4A-4F are schematic diagrams of semi-finished products formed in each step of the manufacturing method of the stacked package module according to the first embodiment of the present invention.

Wherein, the reference signs are explained as follows:

100, 200 stackable multi-package modules

110 Substrate

112 Ground pad

120, 220 stack structure

122, 122', 122a, 122b, 122c, 122a', 122b', 122c' first electronic component

124, 124' first insulation layer

125 conductive layer

126, 126' conductive pattern layer

127, 127' pilot hole

130 Second Electronic Components

140 Second insulating layer

150 electromagnetic shielding layer

D1 tool

S101～S106 Step flow

Detailed ways

FIG. 1 is a schematic structural diagram of a stacked multi-package module according to a first embodiment of the present invention. Please refer to FIG. 1 , the stacked multi-package module 100 includes a substrate 110 , a stack structure 120 and at least one second electronic component 130 . The stack structure 120 is disposed on the substrate 110 , and the second electronic component 130 is mounted on the substrate 110 .

Boding pads, grounding pads 112 and traces (not shown) are generally disposed on the substrate 110 . In practice, the substrate 110 is a carrier on which circuits and various electronic components are arranged, and these pads and lines can be provided according to the electrical connection requirements.

The stack structure 120 includes a plurality of first electronic components 122 , at least a first insulating layer 124 and at least one conductive pattern layer 126 . Some of the first electronic components 122 are installed on the substrate 110, and the first insulating layer 124 covers some of the first electronic components 122 and partially covers the surface of the substrate 110, and the conductive pattern layer 126 is disposed on the first insulating layer 124, and Other first electronic components 122 are disposed on the first insulating layer 124 and electrically connected to the conductive pattern layer 126 .

The first electronic components 122 may include various types, and the types of these first electronic components 122 are not all the same. For example, the first electronic component 122 can be an active component or a passive component, a chip or a discrete component (discretecomponent), etc., as shown in FIG. 122c said. However, the present invention does not limit the type of the first electronic component 122 . In addition, the first electronic components 122a, 122b, and 122c can be electrically connected to the substrate 110 in various ways, such as wire bonding, flip chip or other packaging methods and the pads of the substrate 110 And/or circuit electrical connection.

The first insulating layer 124 covers a part of the first electronic components 122 a , 122 b and 122 c , and extends to cover a part of the surface of the substrate 110 . The first insulating layer 124 is used to avoid unnecessary electrical connection between the first electronic components 122 . In detail, the first insulating layer 124 is a thermosetting sheet-like adhesive material, which has adhesiveness at room temperature, and is used to attach and cover a part of the first electronic components 122a, 122b, and 122c. Since the first insulating layer 124 is a sheet-like adhesive material, the first insulating layer 124 can cover a part of the first electronic components 122a, 122b and 122c without passing through a mold, that is, the first insulating layer 124 Partially formed on the substrate 110 . At an appropriate temperature, the first insulating layer 124 can be more adhered to the first electronic component 122 and the substrate 110 , and will not dissolve with heating. . It is worth noting that the material of the first insulating layer 124 includes epoxy resin (Epoxy resin), inorganic fiber (inorganic filler), etc., for example, the material of the first insulating layer 124 may be a thermosetting hot-melt adhesive material (Thermo-meltingsealant sheet) .

Among the plurality of first electronic components 122 a , 122 b and 122 c , another part of the first electronic components 122 a ′, 122 b ′ and 122 c ′ are disposed on the first insulating layer 124 and electrically connected to the conductive pattern layer 126 . In short, some of the first electronic components 122 a , 122 b and 122 c are located inside the first insulating layer 124 . Another part of the first electronic components 122 a ′, 122 b ′ and 122 c ′ are located outside the first insulating layer 124 , and the first electronic components 122 ′ can be electrically connected through the circuit design of the conductive pattern layer 126 .

The stack structure 120 further includes at least one conductive pillar 127 , and the conductive pillar 127 penetrates the first insulating layer 124 . Generally speaking, the conductive pillars 127 extend from the conductive pattern layer 126 to the first insulating layer 124 , and are designed to electrically connect different first electronic components 122 or substrate circuits according to different product designs.

The stacked multi-package module 100 includes at least one second electronic component 130 , wherein the second electronic component 130 is mounted on the substrate 110 , and the height of the second electronic component 130 is greater than that of the first electronic component 122 . Likewise, the second electronic component 130 may also include various types, such as active components or passive components, chips or discrete components, and the like. Moreover, the second electronic component 130 can also be electrically connected to the substrate 110 in various ways, such as electrically connecting to the pads and/or lines of the substrate 110 by wire bonding, flip-chip or other packaging methods.

The stacked multi-package module 100 further includes a second insulating layer 140 covering the surface of the second electronic component 130 , the stack structure 120 and the substrate 110 . The second insulating layer 140 is used to reduce the damage caused by moisture intrusion to the second electronic component 130 , the stacked structure 120 or the circuit, and the second insulating layer 140 can also prevent unnecessary electrical connection between the second electronic components 130 . The material of the second insulating layer 140 can be different from that of the first insulating layer 124. For example, the second insulating layer 140 can be a sealant layer, and the main material includes molding compound. process) filled into the cavity (cavity) bake hardening molding. Alternatively, the material of the second insulating layer 140 may be the same as that of the first insulating layer 124 , both of which are thermosetting sheet-like adhesive materials, covering the surfaces of the second electronic component 130 , the stacked structure 120 and the substrate 110 in an attached manner. However, the present invention does not limit the material of the second insulating layer 140 .

In addition, for the electromagnetic shielding design of the product, the stacked multi-package module 100 further includes an electromagnetic shielding layer 150 . The electromagnetic shielding layer 150 is located on the outer surface of the second insulating layer 140 and is electrically connected to the ground pad 112 . The electromagnetic shielding layer 150 is used to reduce the electromagnetic interference effect and the radio frequency interference effect generated by the electronic component 122 and the second electronic component 130 . Generally speaking, the electromagnetic shielding layer 150 is made of conductive materials, such as metal materials, conductive polymer materials or conductive composite materials. The electromagnetic shielding layer 150 can be a conductive film deposited by means of spray coating (Spray Coating), ion plating (Ion Plating), sputtering (Sputter Deposition) or evaporation (Evaporation Deposition), and can also be covered with a metal cover The outer surface of the second insulating layer 140 .

FIG. 2 is a schematic cross-sectional view of a stacked multi-package module according to a second embodiment of the present invention. The stacked multi-package module 200 of the second embodiment is similar in structure to the stacked multi-package module 100 of the first embodiment, and has the same function. For example, the stacked multi-package modules 200 and 100 also include the first electronic component 122 . Only the differences between the stacked multi-package modules 200 and 100 will be introduced below, and the same features will not be repeated here.

Referring to FIG. 2 , the stacked multi-package module 200 of the second embodiment includes a substrate 110 , a stack structure 220 and at least one second electronic component 130 . The stack structure 220 is disposed on the substrate 110 , and the second electronic component 130 is mounted on the substrate 110 .

The stack structure 220 includes a plurality of first electronic components 122 , a plurality of first insulating layers 124 and a plurality of conductive pattern layers 126 . It should be noted that the stack structure 220 is formed by stacking a plurality of first electronic components 122 , a plurality of first insulating layers 124 and a plurality of conductive pattern layers 126 .

Specifically, some of the first electronic components 122a, 122b, and 122c are mounted on the substrate 110, and one of the first insulating layers 124 covers these first electronic components 122a, 122b, and 122c and partially covers the surface of the substrate 110. , and one of the conductive pattern layers 126 is disposed on the first insulating layer 124, and the other part of the first electronic components 122a, 122b, and 122c are mounted on the first insulating layer 124 and electrically connected to the conductive pattern layer 126. connect. Another first insulating layer 124' covers the first electronic component 122 and the conductive pattern layer 126, while another conductive pattern layer 126' covers the first insulating layer 124', and another part of the first electronic component 122a', 122b' and 122c' are disposed on the first insulating layer 124' and electrically connected to the conductive pattern layer 126'.

In short, the stack structure 220 may be a multi-layer structure, in which some first electronic components 122 are mounted on the substrate 110 and located within the first insulating layer 124 , and some other first electronic components 122 are located between the first insulating layer 124 on, and the first electronic component 122' is located outside the first insulating layer 124'. The conductive pattern layer 126, 126' is located on the first insulating layer 124, 124'.

It should be noted that, in this embodiment, the stack structure 220 is a two-layer structure. However, in other embodiments, the stacked structure 220 may be a structure of more than two layers according to considerations of different electrical connection designs. However, the present invention is not limited thereto.

FIG. 3 is a schematic flowchart of a method for manufacturing a stacked multi-package module according to an embodiment of the present invention. 4A-4F are schematic diagrams of semi-finished products formed in each step of the manufacturing method of the stacked multi-package module according to the first embodiment of the present invention. Please refer to FIG. 3 and refer to FIGS. 4A-4F sequentially.

In step 101, referring to FIG. 4A, at least one first electronic component 122 and at least one second electronic component 130 are installed on the substrate 110, and both the first electronic component 122 and the second electronic component 130 are electrically connected to the substrate 110. connection, and the height of the second electronic component 130 is greater than that of the first electronic component 122 . It should be noted that, here, the height is defined as the vertical extension distance from the bottom surface to the top surface of the mounted first electronic component 122 and the second electronic component 130 . Since the height of the second electronic component 130 is greater than that of the first electronic component 122 , there is a height difference between the first electronic component 122 and the second electronic component 130 .

In detail, a substrate 110 is provided, and the substrate 110 may be a circuit substrate panel or a circuit substrate strip (only a part of the substrate 110 is shown in FIG. 4A ). Install at least one first electronic component 122 and at least one second electronic component 130 on the substrate 110. In this embodiment, a plurality of first electronic components 122a, 122b and 122c and a plurality of second electronic components 130 are provided, wherein the first An electronic component 122 and a second electronic component 130 may be active components or passive components, chips or discrete components, etc., and may be electrically connected to the substrate 110 in various ways, such as wire bonding, flip-chip ( flip chip) or other packaging methods are electrically connected to the pads and/or lines of the substrate.

In step 102 , referring to FIG. 4B , a conductive layer 125 is disposed on the first insulating layer 124 . The conductive layer 125 can be formed on the upper surface of the first insulating layer 124 by means of spray coating (Spray Coating), ion plating (Ion Plating), sputtering (Sputter Deposition) or evaporation (Evaporation Deposition) .

In step 103 , please refer to FIG. 4C , after the conductive layer 125 is disposed on the first insulating layer 124 , the first insulating layer 124 covers the first electronic component 122 and partially covers the surface of the substrate 110 . It is worth noting that the first insulating layer 124 is a thermosetting sheet adhesive material. In this embodiment, the material of the first insulating layer 124 can be a thermosetting hot-melt adhesive material. On the first electronic component 122 and part of the substrate 110 , that is to say, the first insulating layer 124 is partially formed on the substrate 110 .

In step 104 , referring to FIG. 4D , at least one conductive column 127 penetrating through the conductive layer 125 and the first insulating layer 124 is formed, and the conductive layer 125 is patterned to form a conductive pattern layer 126 . In detail, laser is used to drill the conductive layer 125 and the first insulating layer 124, so that the first insulating layer 124 forms at least one hollow via hole, and then, a conductive material is formed in the hollow via hole to form a conductive column 127 , the conductive column 127 penetrates and extends from the conductive layer 125 into the first insulating layer 124 . It is worth noting that the shape, quantity and distribution position of each conductive column 127 can be designed according to different electrical connection requirements. Next, patterning is performed on the conductive layer 125 to form a conductive pattern layer 126 . In detail, a laser may be used to ablate the conductive layer so that the conductive layer 125 forms a conductive pattern.

In addition, it should be noted that, for technological considerations, the order of the steps of forming the conductive pillars 127 and patterning the conductive layer 125 may be reversed simultaneously or in sequence. The present invention is not limited thereto.

In step 105 , referring to FIG. 4E , another at least one first electronic component 122 ′ is mounted on the first insulating layer 124 and electrically connected to the conductive pattern layer 126 . In this embodiment, a plurality of first electronic components 122a', 122b' and 122c' are provided, and these first electronic components 122a', 122b' and 122c' mounted on the first insulating layer 124 can pass through the conductive pattern The layer 126 and the conductive pillar 127 are electrically connected to the first electronic component 122 or the second electronic component 130 mounted on the substrate 110 .

It is worth noting that, due to the height difference between the first electronic components 122 and the second electronic components 130, when some of the first electronic components 122 and the second electronic components 130 are mounted on the substrate 110, these first electronic components There will be a space above the electronic component 122 to accommodate other first electronic components 122 .

In order to reduce the damage of the second electronic component 130, the stacked structure 120 or the wiring caused by moisture intrusion and protect unnecessary electrical connections between the second electronic component 130, the manufacturing method of the stacked multi-package module 100 further includes The second insulating layer 140 covers the stacked structure 120 , the second electronic component 130 and the surface of the substrate 110 .

In step 106 , referring to FIG. 4F , the second insulating layer 140 is covered on the stacked structure 120 and the surface of the substrate 110 . Generally speaking, the second insulating layer 140 may be an adhesive layer, and its main material includes molding adhesive. Through the glue sealing process, the material of the second insulating layer 140 is filled into the mold cavity, and then baked and hardened to form after extrusion and injection of glue. In addition, in other embodiments, the material of the second insulating layer 140 can also be the same as the material of the first insulating layer 124, that is, the material of the second insulating layer 140 is a thermosetting sheet adhesive, and the covering the surface of the second electronic component 130 , the stack structure 120 and the substrate 110 . In the practical application of the present invention, the second insulating layer 140 may not be required.

Subsequently, the substrate 110 is cut into a plurality of units by a cutter D1 or using a laser. The cutting can be a half cut, that is, the molding unit 130 and the substrate 110 are not completely cut off, and the half-cut substrate 110 is completely cut off in the last step. Alternatively, the cutting can be a full cut, that is, the entire substrate 110 is cut off at one time.

Please refer to FIG. 1 again. For the electromagnetic shielding design of the product, the manufacturing method of the stacked multi-package module 100 further includes forming an electromagnetic shielding layer 150 on the outer surface of the second insulating layer 140 and electrically connecting to the ground pad 112 . The electromagnetic shielding layer 150 may be a conductive film made by depositing conductive materials by means of spraying, ion plating, sputtering or evaporation. Alternatively, the electromagnetic shielding layer 150 may also be covered on the outer surface of the second insulating layer 140 with a metal cover. Through the above steps, the stacked package module 100 has basically been formed

To sum up, the embodiment of the present invention provides a stacked multi-package module, in which the height of the second electronic component is greater than that of the first electronic component, so that there is a height difference between the first electronic component and the second electronic component. Some of the first electronic components and the second electronic components are installed on the substrate, and the first insulating layer is a thermosetting sheet adhesive material, which is attached and covered on a part of the first electronic components and a part of the substrate without a mold . Therefore, the process is relatively simple, thereby simplifying the packaging process. When the first insulating layer covers the first electronic components and part of the substrate, there will be space above the first electronic components to accommodate other first electronic components. Accordingly, not only can the packaging process be simplified and the signal line path shortened, so that line loss and interference are reduced, and the electrical performance of the product is better. In addition, the package of the stacked multi-package module has high flatness and uniform appearance color, and the utilization rate of the internal stacking space of the stacked multi-package module is increased.

In addition, an embodiment of the present invention provides a method for manufacturing a stacked multi-package module, the height of the second electronic component is greater than the height of the first electronic component, so that there is a height difference between the first electronic component and the second electronic component . By attaching the first insulating layer to cover a part of the first electronic components and a part of the substrate, and then arranging other first electronic components in the space above the first electronic components. Accordingly, not only can the packaging process be simplified and the signal line path shortened, so that line loss and interference are reduced, and the electrical performance of the product is better. In addition, the package of the stacked multi-package module has high flatness and uniform appearance color, and the utilization rate of the internal stacking space of the stacked multi-package module is increased.

The above descriptions are only examples of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Any modifications and equivalent replacements made by those skilled in the art without departing from the spirit and scope of the present invention are still within the protection scope of the claims of the present invention.

Claims (13)

1. a kind of more package modules of stack, it is characterised in that the more package modules of the stack include：

One substrate；

At least one first insulating barrier, the local complexity substrate surface；

An at least conductive pattern layer, it is configured on first insulating barrier；

Multiple first electronic components, the plurality of first electronic component in part are covered by least one first insulating barrier, and in addition should Multiple first electronic components are installed on first insulating barrier and are electrically connected with the conductive pattern layer；And

One second insulating barrier, cover the plurality of first electronic component in the part and at least one first insulating barrier, be exposed to The substrate surface of at least one first insulating barrier.

It is exhausted that 2. the more package modules of stack as claimed in claim 1, the wherein more package modules of the stack include multiple first Edge layer and multiple conductive pattern layers, wherein the conductive pattern layer is located therein between 2 first insulating barriers, and this is more in addition Individual first electronic component is located therein on first insulating barrier and is electrically connected with the conductive pattern layer.

3. the more package modules of stack as claimed in claim 1, in addition at least one second electronic component, second electronics member Part is installed on the substrate.

4. the more package modules of stack as claimed in claim 3, the wherein height of second electronic component are more than first electricity The height of subcomponent.

5. the more package modules of stack as claimed in claim 1, in addition to an at least conductive pole, the conductive pole penetrate this first Insulating barrier.

6. a kind of more package modules of stack, it is characterised in that the more package modules of the stack include：

One substrate；

Stacked arrangement, including multiple first electronic components and at least one first insulating barrier, the plurality of first electronics of which part Element is installed on the substrate, and first insulating barrier is covered in the plurality of first electronic component in part, and in addition the plurality of first Electronic component is installed on first insulating barrier；

One second insulating barrier, cover the plurality of first electronic component in the part and at least one first insulating barrier；And

One ELECTROMAGNETIC OBSCURANT layer, positioned at an outer surface of second insulating barrier, and first insulating barrier is not contacted.

7. the more package modules of stack as claimed in claim 6, in addition at least one second electronic component, second electronics member Part is installed on the substrate, and the height of second electronic component is more than the height of first electronic component.

8. the more package modules of stack as claimed in claim 7, the wherein height of second electronic component are more than first electricity The height of subcomponent.

9. the more package modules of stack as claimed in claim 7, wherein second electronic component separate the ELECTROMAGNETIC OBSCURANT layer and First insulating barrier.

A kind of 10. manufacture method of the more package modules of stack, it is characterised in that the manufacture method of the more package modules of the stack Including：

At least one first electronic component is installed on a substrate；

One conductive layer is configured on one first insulating barrier；

First insulating barrier is covered in first electronic component and local complexity on the substrate surface；

Separately at least one first electronic component is installed on first insulating barrier and is electrically connected with the conductive layer；And

One second insulating barrier is covered on first electronic component and the substrate surface.

11. the manufacture method of the more package modules of stack as claimed in claim 10, in addition to：

Form at least one conductive pole for penetrating the conductive layer and first insulating barrier；And

The conductive layer is subjected to patterned process, forms a conductive pattern layer according to this.

12. the manufacture method of the more package modules of stack as claimed in claim 10, in addition to：

At least one second electronic component is installed on the substrate, second insulating barrier is covered second electronic component.

13. the manufacture method of the more package modules of stack as claimed in claim 10, the wherein more package modules of the stack Manufacture method also includes being formed an ELECTROMAGNETIC OBSCURANT layer in the outer surface of second insulating barrier.