CN107651648B - A device and method for self-assembly of micro-device based on micro-vibration excitation - Google Patents

Abstract

The invention discloses a self-assembling device and method of micro-device based on micro-vibration excitation. The device includes a substrate and a spacer, the substrate has an etched pit array, each pit in the pit array matches the shape of the micro-element, the micro-element is carried by the carrier solution, and the spacer and the substrate form an assembly cavity , the substrate is rigidly connected to one end of the piezoelectric stack driver through a connecting plate, the other end of the piezoelectric stack driver is fixedly mounted on a fixed support, and the piezoelectric stack driver is controlled by a computer and a driving power supply. The invention uses piezoelectric vibration to excite the substrate, so that the micro-elements on the substrate that are not fully embedded with the substrate can obtain the energy of jumping from the metastable state to the desired assembly structure, and realize the complete integration with the substrate. After the carrier solution is removed, Under the van der Waals force, the lower surface of the micro-element is connected with the bottom surface of the pit. The excitation can be adjusted in frequency, amplitude, and waveform to meet the requirements of micro-assembly of different scales and shapes and improve the success rate of assembly.

Description

A device and method for self-assembly of micro-device based on micro-vibration excitation

technical field

The invention relates to an assembly device and method for micro components, in particular to an automatic assembly device and method for micro components.

Background technique

Drivers and display units in flat panel display (FPD) devices, high-density alignment assembly of LED chips, micro-control systems, optoelectronic smart array sensors, and electronic labels all require repeated precision assembly of large quantities of micro-components, fluid self-assembly technology The shape-matching alignment in the system has the ability to assemble a large number of micro-components in parallel and accurately in three-dimensional space. When under the action, it will randomly fall into the matching pits on the substrate. The traditional hydraulic pump valve drives the uniform flow of the solution. When the micro-component is close to the assembly point of the substrate, the inertia of its motion will weaken the positioning accuracy of the micro-component and the substrate. There will be some micro-components that are not completely fitted with the substrate, resulting in low assembly efficiency.

Contents of the invention

In view of the above-mentioned problems in the prior art, the present invention provides a device and method for self-assembly of micro-device based on micro-vibration excitation.

Technical scheme of the present invention is as follows:

The invention provides a self-assembly device based on micro-vibration excitation micro-device, including a substrate and a spacer, the substrate has an etched pit array, and each pit in the pit array is connected to the The shape of the manufactured micro-element matches, the micro-element is carried by the carrier solution, the partition plate and the substrate form an assembly cavity, the substrate is rigidly connected to one end of the piezoelectric stack driver through the connecting plate, and the piezoelectric stack The other end of the driver is fixed on the fixed support, and the piezoelectric stack driver is controlled by a computer and a driving power supply.

The present invention also provides a micro-vibration-based self-assembly method for micro-devices. Excessive micro-components are dispersed and suspended in a selected carrier solution, and flow through between the substrate and the separator under pressure, and the computer is programmed to pass through The power supply controls the piezoelectric stack driver to vibrate laterally with the fixed support as the support, and the amplitude, frequency, and acceleration of the piezoelectric stack driver are controlled by the driving power supply after computer programming.

As a further improvement of the present invention, when the carrier solution suspends an excessive amount of micro-elements and flows through the pit array on the substrate, the micro-elements randomly fall into the matching pits under the action of the capillary force and surface tension of the liquid bonding material Middle; the piezoelectric vibration of the piezoelectric stack driver is used to excite the substrate, so that the micro-components on the substrate that are not fully embedded with the substrate can obtain the energy to jump from the metastable state to the desired assembly structure, and the continuous excitation gradually makes the micro-components and the substrate The dimples of the substrate are fully engaged; the components of the dimples that have the opportunity to enter are punched out of the substrate surface.

The beneficial effects of the present invention are as follows:

The present invention is based on the micro-vibration excitation micro-device self-assembly device and method, and uses piezoelectric vibration to excite the substrate, so that the micro-components on the substrate that are not fully embedded with the substrate can obtain energy from a metastable state to a desired assembly structure, To achieve complete embedding with the substrate, when the carrier solution is removed, under the action of van der Waals force, the lower surface of the micro-element is connected with the bottom surface of the pit. The excitation can be adjusted in frequency, amplitude, and waveform to meet the requirements of micro-assembly of different scales and shapes and improve the success rate of assembly. It effectively solves the problem of low assembly efficiency in the prior art due to the fact that the positioning of some micro components cannot be completely embedded with the substrate.

Description of drawings

Fig. 1 is a schematic diagram of the structure of the micro-vibration-excited micro-device self-assembly device of the present invention.

In the figure: 1. substrate; 2. micro-component; 3. solution; 4. partition; 5. connection plate; 6. piezoelectric stack driver; 7. fixed support; 8. drive power supply; 9. computer.

Detailed ways

The present invention will be described in further detail below in conjunction with the accompanying drawings.

Embodiment one

This embodiment provides a self-assembly device based on micro-vibration excitation of micro-devices, the structure of which is shown in Figure 1:

On the substrate 1 such as silicon or glass, there is an array of pits of corresponding shapes etched out, each pit is matched with a micro-element 2 of a specific shape manufactured from a silicon wafer, and the micro-element 2 is carried by a carrier solution 3, The partition plate 4 and the substrate 1 form an assembly cavity, and the substrate 1 such as silicon or glass is rigidly connected to one end of the piezoelectric stack driver 6 through a rigid connecting plate 5, and the other end of the piezoelectric stack driver 6 is fixed on the fixed support 7 , the piezoelectric stack driver is controlled by a computer 9 and a driving power supply 8 .

Embodiment two

This embodiment provides a self-assembly method based on the self-assembly device described in Embodiment 1.

The excess microelements 2 are dispersed and suspended in the selected carrier solution 3, and can flow through the substrate 1 and the separator 4 under pressure, and the computer 9 is programmed to control the piezoelectric stack driver 6 through the driving power supply 8 to fix the The support 7 supports lateral vibration, and the computer 9 is programmed to control the amplitude, frequency and acceleration of the piezoelectric stack driver 6 through the drive power supply 8 .

When the carrier solution 3 suspends an excessive amount of micro-elements 2 and flows through the array of pits on the substrate 1, the micro-elements, the capillary force and surface tension of the liquid bonding material will randomly fall into the matching pits on the substrate , some of the micro components 2 are completely fitted into the pits of the substrate, and most of the micro components 2 are completely fitted into the pits of the substrate 1. The piezoelectric vibration of the piezoelectric stack driver 6 is used to excite the substrate 1, so that the substrate 1 The micro-components that are not fully embedded with the substrate obtain the energy to jump from the metastable state to the desired assembly structure, and the continuous excitation will gradually make the micro-components 2 fully embedded with the pits of the substrate 1 one after another, just like assembling building blocks. After a period of vibration excitation, it is ensured that most of the micro components 2 are completely fitted into the pits of the substrate 1, and the components in the pits that have no chance to enter will be rushed out of the substrate surface. After cleaning, enter the next assembly. After the micro-components are aligned on the assembly point of the substrate, the solution is cleaned up, and the assembly of the product is completed through lead interconnection.

The computer changes the driving power supply 8 to apply a driving signal to the piezoelectric stack driver 6 through program parameterization, controls the amplitude, frequency and acceleration of the piezoelectric stack driver 6, and can adjust the excitation energy for the substrate 1 to adapt to microstructures of different shapes and scales. Assembly requirements.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (3)

1. A self-assembly device based on micro-vibration excitation micro-device, characterized in that: comprise a substrate (1) and a partition (4), the substrate (1) has an etched pit array, the pit Each pit in the array matches the shape of a micro-element (2) manufactured from a silicon wafer, the micro-element (2) is carried by a carrier solution (3), and the spacer (4) and the substrate (1) An assembly cavity is formed, the base plate (1) is rigidly connected to one end of the piezoelectric stack driver (6) through the connecting plate (5), and the other end of the piezoelectric stack driver (6) is fixedly mounted on the fixed support ( 7), the piezoelectric stack driver (6) is controlled by the computer (9) and the driving power supply (8), and the computer (9) controls the piezoelectric stack driver (6) through the driving power supply (8) to fix the support (7 ) to support the lateral vibration. 2. The self-assembly method of the described device of claim 1, is characterized in that: excessive microelement (2) is dispersed and suspended in the selected carrier solution (3), under the drive of pressure from substrate (1) and dividing plate (4), the computer (9) controls the piezoelectric stack driver (6) to vibrate laterally with the fixed support (7) as the support through the drive power supply (8) by programming, and the computer (9) passes the drive power supply after programming (8) Control the amplitude, frequency and acceleration of the piezoelectric stack driver (6). 3. The method according to claim 2, characterized in that: when the carrier solution (3) suspended excessive microelements (2) and flowed through the pit array on the substrate (1), the microelements (2) were in the liquid state Under the action of the capillary force and surface tension of the bonding material, it randomly falls into the matching pits; the piezoelectric vibration of the piezoelectric stack driver (6) is used to excite the substrate (1), so that no holes on the substrate (1) The microcomponent (2) fully embedded with the substrate (1) obtains the energy to jump from the metastable state to the desired assembly structure, and the continuous excitation gradually makes the microcomponent (2) fully embedded with the pit of the substrate (1); there is no Components that have access to the recesses are punched out of the surface of the substrate (1).