CN107645830A - Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof - Google Patents
Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof Download PDFInfo
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- CN107645830A CN107645830A CN201710769977.3A CN201710769977A CN107645830A CN 107645830 A CN107645830 A CN 107645830A CN 201710769977 A CN201710769977 A CN 201710769977A CN 107645830 A CN107645830 A CN 107645830A
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- board substrate
- ultrasonic probe
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Abstract
The invention discloses two-sided FPC of the ultra-thin copper of a kind of ultrasonic probe and preparation method thereof.The two-sided FPC of the ultra-thin copper of the ultrasonic probe includes single sided board region and dual platen region and via；The single sided board region is key area, including flexible board substrate and forms the ultra-thin copper in the flexible board substrate one side, and the ultra-thin copper is thinned via the base material copper microetch on the flexible board substrate surface and formed, and thickness is 6 ± 1 microns；The dual platen region is non-critical areas, including the flexible board substrate and forms the copper wire on the flexible board substrate two sides, and the copper wire forms via the base material copper etching on the flexible board substrate surface；The via is made only in the dual platen region, and the hole copper of the via is formed using selective electroplating.Technical solution of the present invention uses subregion cloth hole, solves the two-sided FPC copper thickness tolerance of the ultra-thin copper of ultrasonic probe+/ 1um control problem, simplifies the difficulty of product processing and the acoustics reliability of lifting product.
Description
Technical field
The present invention relates to FPC technical fields, and in particular to two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof.
Background technology
Flexible PCB（Flexible Printed Circuit, FPC）It is using polyimides or polyester film as base material
Manufactured one kind has height reliability, excellent flexible printed circuit.With Distribution density is high, in light weight, thickness of thin,
The characteristics of bending property is good.
The two-sided FPC of the ultra-thin copper of ultrasonic probe（Abbreviation ultrasonic probe FPC）Have the characteristics that：
（1）FPC points of ultrasonic probe is single sided board key area and dual platen non-critical areas, and single sided board key area is used to realize
The converting transmission function of ultrasonic signal.
（2）Single sided board key area copper is thick to be required to be less than 9um, the +/- 1um of copper thickness allowance control, realize good bending with
Signal transmits.
（3）It is required that the defects of key area surface no wrinkle, dirty, scuffing etc. influence surface texture.
Fig. 1 is refer to, is a kind of ultrasonic probe FPC structure chart in the prior art, as can be seen from the figure：
（a）Ultrasonic probe FPC key areas are designed with via, it is necessary to which hole copper and face copper are electroplated together, to ensure key area
Planarization, high is required to electroplating evenness, conventional plating process is difficult to；
（b）The via of ultrasonic probe FPC key areas design is, it is necessary to which the base material copper for using 2um is thin, using plating processing, realization
Conducting, reaches 6+/- 1um requirement, technique realizes difficulty height.
The content of the invention
The embodiment of the present invention provides two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof, using subregion cloth hole, uses
In solve the +/- 1um of the two-sided FPC copper thickness tolerance of the ultra-thin copper of ultrasonic probe control problem, simplify product processing difficulty and
Lift the acoustics reliability of product.
Used technical scheme is：
First aspect, there is provided a kind of two-sided FPC of ultra-thin copper of ultrasonic probe, including single sided board region and dual platen region and mistake
Hole；The single sided board region is key area, including flexible board substrate and forms the ultra-thin copper in the flexible board substrate one side, described
Ultra-thin copper is thinned via the base material copper microetch on the flexible board substrate surface and formed, and thickness is 6 ± 1 microns；The dual platen region
For non-critical areas, including the flexible board substrate and form the copper wire on the flexible board substrate two sides, the copper wire via
The base material copper etching on the flexible board substrate surface forms；The via is made only in the dual platen region, the hole of the via
Copper is formed using selective electroplating.
Further, the dual platen region is provided with the cover layer for protecting the copper wire.
Further, the two-sided FPC of the ultra-thin copper of the ultrasonic probe is rectangle shape, and both ends are dual platen region, and centre is
Single sided board region.
Second aspect, there is provided a kind of two-sided FPC of ultra-thin copper of ultrasonic probe preparation method, including：
Soft core plate is provided, the soft core plate includes flexible board substrate and is fitted in the base material copper on the flexible board substrate two sides, the base
The thickness of material copper is more than 6 microns；
The holes drilled through on the soft core plate, the through hole are located at designed non-critical areas, then set on the soft core plate
Plating resist film, exposed development are put, windowing manifests the through hole, carries out selective electroplating, by the via metal, forms institute
The via needed, then remove the plating resist film；
First etchant resist, exposed development and etching step are set on the soft core plate, in designed non-critical areas shape
Etched away into the copper wire for being distributed in the flexible board substrate two sides, and by the base material copper at the back side of designed key area, so
After remove first etchant resist；
Second etchant resist, exposed development are set on the soft core plate, windowing manifests the front of designed key area,
The base material copper etching of appeared part is thinned to 6 ± 1 microns, then removes second etchant resist.
Further, method also includes：In the non-critical areas, it is provided for protecting the cover layer of the copper wire
Layer.
Further, the thickness of the base material copper is 12 microns.
As can be seen from the above technical solutions, the embodiment of the present invention has advantages below：
1st, Via Design is controlled into difficulty in non-critical areas, the copper thickness for reducing key area.
2nd, via uses selective electroplating structure, an electroplating hole, not electroplating surface copper so that conventional plating process equipment can
To meet plating demand.
3rd, single sided board key area ultra-thin copper control, can by the high 12um base materials copper of uniformity by microetch be thinned come
Formed, can reach 6+/- 1um precision controlling.
It can be seen that present invention reduces the difficulty of processing of the two-sided FPC products of the ultra-thin copper of ultrasonic probe, can be added with traditional handicraft
Work goes out the ultra-thin copper FPC products of function admirable.Moreover, the two-sided FPC of the ultra-thin copper of ultrasonic probe of the present invention product structure obtain it is excellent
Change, technique becomes simple, and product signal converting transmission and bending reliability improve.
Brief description of the drawings
Technical scheme in order to illustrate the embodiments of the present invention more clearly, below will be to institute in embodiment and description of the prior art
The accompanying drawing needed to use is briefly described, it should be apparent that, drawings in the following description are only some implementations of the present invention
Example, for those of ordinary skill in the art, on the premise of not paying creative work, can also be obtained according to these accompanying drawings
Obtain other accompanying drawings.
Fig. 1 is a kind of two-sided FPC of the ultra-thin copper of ultrasonic probe of prior art structure chart；
Fig. 2 is a kind of two-sided FPC of the ultra-thin copper of ultrasonic probe provided in an embodiment of the present invention sectional view；
Fig. 3 is a kind of two-sided FPC of the ultra-thin copper of ultrasonic probe provided in an embodiment of the present invention plan；
Fig. 4 is a kind of schematic flow sheet of the two-sided FPC of the ultra-thin copper of ultrasonic probe provided in an embodiment of the present invention preparation method.
Embodiment
In order that those skilled in the art more fully understand the present invention program, below in conjunction with the embodiment of the present invention
Accompanying drawing, the technical scheme in the embodiment of the present invention is clearly and completely described, it is clear that described embodiment is only
The embodiment of a part of the invention, rather than whole embodiments.Based on the embodiment in the present invention, ordinary skill people
The every other embodiment that member is obtained under the premise of creative work is not made, it should all belong to the model that the present invention protects
Enclose.
Term " first ", " second ", " the 3rd " in description and claims of this specification and above-mentioned accompanying drawing etc. are
For distinguishing different objects, rather than for describing particular order.In addition, term " comprising " and " having " and they are any
Deformation, it is intended that cover non-exclusive include.Such as contain the process of series of steps or unit, method, system, product
Or equipment the step of being not limited to list or unit, but the step of alternatively also include not listing or unit, or can
Selection of land is also included for the intrinsic other steps of these processes, method, product or equipment or unit.
Below by specific embodiment, it is described in detail respectively.
Fig. 2 and Fig. 3 are refer to, one embodiment of the invention provides a kind of two-sided FPC of ultra-thin copper of ultrasonic probe, including one side
Plate region 11 and dual platen region 12 and via 13；The FPC is process based on soft core plate, and soft core plate includes middle soft board
Base material and the base material copper of flexible board substrate two sides attachment, the thickness requirement of base material copper are more than 6 microns, herein using base material copper thickness as
Exemplified by 12 microns.
The single sided board region 11 is key area, can be described as single sided board key area, including flexible board substrate 20 and formation
In the ultra-thin copper 21 of the one side of flexible board substrate 20, the ultra-thin copper 21 subtracts via the base material copper microetch on the flexible board substrate surface
Thin to form, thickness is 6 ± 1 microns；
The dual platen region 12 is non-critical areas, can be described as dual platen key area, including the flexible board substrate 20 and shape
Into the copper wire 22 on the two sides of flexible board substrate 20, the copper wire 22 etches via the base material copper on the flexible board substrate surface
Form；
The via 13 is made only in the dual platen region 12, and the hole copper of the via 13 is formed using selective electroplating.
Wherein, the back side of single sided board key area, Copper base material are all etched away, the front of single sided board key area, copper
Base material is etched thinned, and it is 6 ± 1 microns of ultra-thin copper 21 to form thickness.
Further, the dual platen region 12 may be provided with the cover layer 23 for protecting the copper wire 22, example
Such as welding resistance green oil.
As shown in figure 3, the two-sided FPC of the ultra-thin copper of ultrasonic probe can be rectangle shape, both ends are dual platen region 12,
Centre is single sided board region 11.
The two-sided FPC of the ultra-thin copper of ultrasonic probe of the present invention design feature is as follows：
（1）Single sided board key area, realize the converting transmission function of ultrasonic signal.
（2）Single sided board key area copper is thick to be required to be less than 9um, the +/- 1um of copper thickness allowance control, realize good bending with
Signal transmits, it is preferred that control is at 6 ± 1 microns.
（3）The defects of key area surface no wrinkle, dirty, scuffing etc. influence surface texture.
The advantages of ultra-thin copper of ultrasonic probe of the present invention two-sided FPC, includes：
（1）Via Design controls difficulty in non-critical areas, the copper thickness for reducing key area.
（2）Via uses selective electroplating structure, an electroplating hole, not electroplating surface copper so that conventional plating process equipment is just
Plating demand can be met.
（3）The ultra-thin copper control of single sided board key area, can be crossed the high 12um base materials copper of uniformity by microetch with copper, reached
6+/- 1um control.
In order to preferably implement technical solution of the present invention, corresponding preparation method is also provided below.
Fig. 4 is refer to, one embodiment of the invention provides a kind of ultra-thin two-sided FPC's of copper of ultrasonic probe as described above
Preparation method, it may include：
41st, soft core plate is provided, the soft core plate includes flexible board substrate and is fitted in the base material copper on the flexible board substrate two sides, described
The thickness of base material copper is more than 6 microns；
42nd, the holes drilled through on the soft core plate, the through hole is located at designed non-critical areas, then on the soft core plate
Plating resist film, exposed development are set, and windowing manifests the through hole, carries out selective electroplating, and the via metal is formed
Required via, then remove the plating resist film；
The 43rd, first etchant resist, exposed development and etching step are set on the soft core plate, in designed non-critical areas
The copper wire for being distributed in the flexible board substrate two sides is formed, and the base material copper at the back side of designed key area is etched away,
Then first etchant resist is removed；
The 44th, second etchant resist, exposed development are set on the soft core plate, windowing is manifesting designed key area just
Face, the base material copper etching of appeared part is thinned to 6 ± 1 microns, then removes second etchant resist.
Further, this method may also include：In the non-critical areas, it is provided for protecting the covering of the copper wire
Film layer.
Optionally, the thickness of the base material copper is 12 microns.
It should be noted that for above-mentioned embodiment of the method, those skilled in the art should know, the present invention not by
The limitation of described sequence of movement, because according to the present invention, some steps can use other orders to carry out.
To sum up, the embodiment of the invention discloses two-sided FPC of the ultra-thin copper of a kind of ultrasonic probe and preparation method thereof, from above skill
Art scheme, which can be seen that, achieves following technique effect：
1st, Via Design is controlled into difficulty in non-critical areas, the copper thickness for reducing key area.
2nd, via uses selective electroplating structure, an electroplating hole, not electroplating surface copper so that conventional plating process equipment can
To meet plating demand.
3rd, single sided board key area ultra-thin copper control, can by the high 12um base materials copper of uniformity by microetch be thinned come
Formed, can reach 6+/- 1um precision controlling.
It can be seen that present invention reduces the difficulty of processing of the two-sided FPC products of the ultra-thin copper of ultrasonic probe, can be added with traditional handicraft
Work goes out the ultra-thin copper FPC products of function admirable.Moreover, the two-sided FPC of the ultra-thin copper of ultrasonic probe of the present invention product structure obtain it is excellent
Change, technique becomes simple, and product signal converting transmission and bending reliability improve.
In the above-described embodiments, the description to each embodiment all emphasizes particularly on different fields, and is not described in some embodiment
Part, may refer to the associated description of other embodiments.
Above-described embodiment is merely illustrative of the technical solution of the present invention, rather than its limitations；The ordinary skill people of this area
Member should be understood：It can still modify to the technical scheme described in the various embodiments described above, or to which part skill
Art feature carries out equivalent substitution；And these modifications or replacement, the essence of appropriate technical solution is departed from each reality of the present invention
Apply the spirit and scope of a technical scheme.
Claims (6)
- A kind of 1. two-sided FPC of ultra-thin copper of ultrasonic probe, it is characterised in thatIncluding single sided board region and dual platen region and via；The single sided board region is key area, including flexible board substrate and formation are in the ultra-thin copper of the flexible board substrate one side, institute State ultra-thin copper via the flexible board substrate surface base material copper microetch be thinned form, thickness be 6 ± 1 microns；The dual platen region is non-critical areas, including the flexible board substrate and forms the copper cash on the flexible board substrate two sides Road, the copper wire form via the base material copper etching on the flexible board substrate surface；The via is made only in the dual platen region, and the hole copper of the via is formed using selective electroplating.
- 2. the two-sided FPC of the ultra-thin copper of ultrasonic probe according to claim 1, it is characterised in thatThe dual platen region is provided with the cover layer for protecting the copper wire.
- 3. the two-sided FPC of the ultra-thin copper of ultrasonic probe according to claim 1, it is characterised in thatThe two-sided FPC of the ultra-thin copper of ultrasonic probe is rectangle shape, and both ends are dual platen region, and centre is single sided board region.
- A kind of 4. two-sided FPC of ultra-thin copper of ultrasonic probe preparation method, it is characterised in that including：Soft core plate is provided, the soft core plate includes flexible board substrate and is fitted in the base material copper on the flexible board substrate two sides, the base The thickness of material copper is more than 6 microns；The holes drilled through on the soft core plate, the through hole are located at designed non-critical areas, then set on the soft core plate Plating resist film, exposed development are put, windowing manifests the through hole, carries out selective electroplating, by the via metal, forms institute The via needed, then remove the plating resist film；First etchant resist, exposed development and etching step are set on the soft core plate, in designed non-critical areas shape Etched away into the copper wire for being distributed in the flexible board substrate two sides, and by the base material copper at the back side of designed key area, so After remove first etchant resist；Second etchant resist, exposed development are set on the soft core plate, windowing manifests the front of designed key area, The base material copper etching of appeared part is thinned to 6 ± 1 microns, then removes second etchant resist.
- 5. according to the method for claim 4, it is characterised in that also include：In the non-critical areas, it is provided for protecting the cover layer of the copper wire.
- 6. according to the method for claim 4, it is characterised in that also include：The thickness of the base material copper is 12 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201710769977.3A CN107645830A (en) | 2017-08-29 | 2017-08-29 | Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710769977.3A CN107645830A (en) | 2017-08-29 | 2017-08-29 | Two-sided FPC of a kind of ultra-thin copper of ultrasonic probe and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496058A (en) * | 2018-11-12 | 2019-03-19 | Oppo广东移动通信有限公司 | Flexible circuit board and preparation method thereof, and electronic equipment |
| CN111225497A (en) * | 2020-03-03 | 2020-06-02 | 瑞华高科技电子工业园(厦门)有限公司 | Local ultrathin hollowed double-layer FPC product and manufacturing method thereof |
| CN111263525A (en) * | 2020-03-23 | 2020-06-09 | 瑞华高科技电子工业园(厦门)有限公司 | Manufacturing method of ultrathin false hollow double-layer FPC product |
| CN114286507A (en) * | 2022-01-19 | 2022-04-05 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109496058A (en) * | 2018-11-12 | 2019-03-19 | Oppo广东移动通信有限公司 | Flexible circuit board and preparation method thereof, and electronic equipment |
| CN111225497A (en) * | 2020-03-03 | 2020-06-02 | 瑞华高科技电子工业园(厦门)有限公司 | Local ultrathin hollowed double-layer FPC product and manufacturing method thereof |
| CN111225497B (en) * | 2020-03-03 | 2021-03-02 | 瑞华高科技电子工业园(厦门)有限公司 | Local ultrathin hollowed double-layer FPC product and manufacturing method thereof |
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| CN114286507A (en) * | 2022-01-19 | 2022-04-05 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
| CN114286507B (en) * | 2022-01-19 | 2024-03-29 | 瑞华高科技电子工业园(厦门)有限公司 | Double-sided FPC and manufacturing method thereof |
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