CN107645827A - A kind of high radiating progressive metal-layer structure of level - Google Patents
A kind of high radiating progressive metal-layer structure of level Download PDFInfo
- Publication number
- CN107645827A CN107645827A CN201710853265.XA CN201710853265A CN107645827A CN 107645827 A CN107645827 A CN 107645827A CN 201710853265 A CN201710853265 A CN 201710853265A CN 107645827 A CN107645827 A CN 107645827A
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- China
- Prior art keywords
- copper
- layer
- aluminum
- copper alloy
- alloy layer
- Prior art date
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- Granted
Links
- 230000000750 progressive effect Effects 0.000 title claims abstract description 15
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 40
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims abstract description 39
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 35
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 31
- 239000004411 aluminium Substances 0.000 claims abstract description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 23
- 229910052802 copper Inorganic materials 0.000 claims abstract description 23
- 239000010949 copper Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 230000004927 fusion Effects 0.000 claims abstract description 11
- 238000003466 welding Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 229910000838 Al alloy Inorganic materials 0.000 claims description 3
- 229910000906 Bronze Inorganic materials 0.000 claims 3
- 239000010974 bronze Substances 0.000 claims 3
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims 3
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 abstract description 6
- 239000012530 fluid Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000005439 thermosphere Substances 0.000 description 3
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 229910000962 AlSiC Inorganic materials 0.000 description 1
- 229910000323 aluminium silicate Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229910052573 porcelain Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a kind of high radiating progressive metal-layer structure of level, include substrate, copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer, cast aluminium layer, heat-dissipating aluminium plate successively from top to bottom, the copper content of first aluminum-copper alloy layer is higher than the copper content of the second aluminum-copper alloy layer, the substrate fuses with copper-clad plate, the copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer, cast aluminium layer two layers of arbitrary neighborhood between connected mode be fusion, the heat-dissipating aluminium plate and cast aluminium layer vertical welding.Copper-clad plate base radiating the present invention is especially suitable for substrate for ceramics, the advantages of copper heat transfer is quick and aluminium radiating is quick is combined, and weaken mutual interface, the upgrading to radiating mode provides new value.
Description
Technical field
The present invention relates to heat abstractor and Material Field, more particularly to a kind of high radiating progressive metal-layer structure of level.
Background technology
Cooling application is in the industrial every profession and trade such as electronics, heat engine, chemical industry.The radiating of early stage is using active radiating, such as
Fan, it is eliminated because volume is larger；Present main method is to conduct heat to outside using heat-conducting glue and thermal grease conduction
Metal on, but because heat-conducting glue thermal conductivity ratio it is relatively low（Less than 5 W/mK）, and metal distance heat generating spot is distant, institute
So that heat sinking function can not be realized well.Electronic applications, semiconductor cover copper mold block heat transfer efficiency height, are to be widely used in electronics neck
The radiating module in domain, its formation base are usually one piece of ceramic substrate.No matter however, contacting between layers again good, always deposit
At interface, and thermosphere fluid layer between interface be present, have thermograde, influence heat transfer efficiency；And heat-conducting silicone grease is that have using the longevity
Life, it is also required to change using long, not so thermal conductivity can significantly reduce.In addition, chip is using heat with covering copper heat-radiating substrate
The different material manufacture of the coefficient of expansion, during being cooled down after high-temperature soldering, because coefficient of thermal expansion is different, covers copper ceramics and dissipate
Hot substrate stress, it may occur that flexural deformation.
Therefore, a kind of radiator structure of resistance putting things right once and for all, solving radiating seems of crucial importance.
The content of the invention
It is an object of the invention to provide a kind of high radiating progressive metal-layer structure of level, high energy persistently radiates, than existing
Heat dissipating layer it is more preferable, faster radiate, overcome problems of the prior art.
In order to realize the above object the technical scheme is that：
A kind of high radiating progressive metal-layer structure of level, include successively from top to bottom substrate, copper-clad plate, the first aluminum-copper alloy layer,
Second aluminum-copper alloy layer, cast aluminium layer, heat-dissipating aluminium plate, the copper content of first aluminum-copper alloy layer is higher than the second aluminum-copper alloy layer
Copper content, the substrate and copper-clad plate fuse, the copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer, cast aluminium layer
Connected mode between two layers of arbitrary neighborhood is fusion, the heat-dissipating aluminium plate and cast aluminium layer vertical welding.
Preferably, the copper-clad plate is red copper, thickness 0.25-0.4mm.It is same that the thickness of copper-clad plate makes it save material
When and can obtain high heat conduction.
Preferably, the substrate and the mode of copper-clad plate fusion are after coordinating with glue, repeatedly press, sinter.Coordinate with glue
After liquid, repeatedly pressure, sintering degree of fusion are good, and freezing interface obscures after metal molten, and thermosphere fluid layer effect declines.
Further, sintering temperature is 850-980 DEG C.Sintering temperature ensures that sintering quality eliminates interface.
Preferably, the relative roughness Ra values of the upper surface of base plate are less than 0.025.Base plate surface roughness make its with
Copper-clad plate is tightly combined and conducts heat rapid, fusion well.
Preferably, the thickness of first aluminum-copper alloy layer, the second aluminum-copper alloy layer is 0.2-0.35mm, cast aluminium layer
Thickness is less than the first aluminum-copper alloy layer, the second aluminum-copper alloy layer.The thickness of two aluminum-copper alloy layers ensures the smooth and conduct of transition
Main heat transfer layer.
Preferably, first aluminum-copper alloy layer is aluminium bronze, copper content is more than 90%, the second aluminum-copper alloy layer is aluminium
Alloy, copper content are less than 12%.Aluminium bronze, transition containing albronze are notable, and heat transfer coefficient and interface can be changed stepwise.
The beneficial effects of the present invention are：The high radiating progressive metal-layer structure of level of one kind of the present invention, level is distinct, leads
It is hot efficient.Substrate, copper-clad plate, the first aluminum-copper alloy layer, the second aluminum-copper alloy layer, cast aluminium layer, heat-dissipating aluminium plate coordinate closely, adjacent
Fusion operation between layer makes interface level off to disappearance, so as to weaken the thermograde of the thermosphere fluid layer at interface, makes heat conduction more
It is smooth；And each layer from red copper be transitioned into aluminium linking naturally, fusion reliability of technology it is good, obtain the heat conduction of whole heat conduction system
To be smoothed out.The present invention is especially suitable for the copper-clad plate base that substrate is ceramics radiating, combines copper heat transfer and is quickly radiated with aluminium
The advantages of quick, and weaken mutual interface, the upgrading to radiating mode provides new value.
Brief description of the drawings
Fig. 1 is the hierarchical structure schematic diagram of the embodiment of the present invention.
In figure：1-.
Embodiment
In order to illustrate more clearly of the embodiment of the present application or technical scheme of the prior art, letter will be made to embodiment below
Singly introduce.
Such as Fig. 1, a kind of high radiating progressive metal-layer structure of level, include substrate 1, copper-clad plate 2, first successively from top to bottom
Aluminum-copper alloy layer 3, the second aluminum-copper alloy layer 4, cast aluminium layer 5, heat-dissipating aluminium plate 6, the substrate 1 are ceramic material, and preferably AlSiC makes pottery
One kind in porcelain, alumino-silicate ceramic, zirconia ceramics, the relative roughness Ra values of the upper surface of substrate 1 are described less than 0.025
Copper-clad plate 2 is red copper, and first aluminum-copper alloy layer 3, the thickness of the second aluminum-copper alloy layer 4 are 0.2-0.35mm, cast aluminium layer 5
Thickness is less than the first aluminum-copper alloy layer 3, the second aluminum-copper alloy layer 4, thickness 0.25-0.4mm, first aluminum-copper alloy layer 3
It is more than 90% for aluminium bronze, copper content, the second aluminum-copper alloy layer 4 is aluminium alloy, copper content is less than 12%, and the substrate 1 is with covering copper
Plate 2 fuses, and the mode of fusion is after coordinating with glue, repeatedly presses, sinters, and sintering temperature is 850-980 DEG C；
The copper-clad plate 2, the first aluminum-copper alloy layer 3, the second aluminum-copper alloy layer 4, cast aluminium layer 5 two layers of arbitrary neighborhood between company
Mode is connect as fusion, the heat-dissipating aluminium plate 6 and the vertical welding of cast aluminium layer 5.
Above example is only illustrating the preferred technical solution of the present invention, it is noted that for the general of the art
For logical technical staff, under the premise without departing from the principles of the invention, some improvement made or equivalent substitution, this is accordingly to be regarded as
The protection domain of invention, it should cover in scope of the presently claimed invention.
Claims (7)
1. a kind of high radiating progressive metal-layer structure of level, it is characterised in that include substrate, copper-clad plate, the successively from top to bottom
One aluminum-copper alloy layer, the second aluminum-copper alloy layer, cast aluminium layer, heat-dissipating aluminium plate, the copper content of first aluminum-copper alloy layer is higher than the
The copper content of two aluminum-copper alloy layers, the substrate fuse with copper-clad plate, the copper-clad plate, the first aluminum-copper alloy layer, the second aluminum bronze
Alloy-layer, cast aluminium layer two layers of arbitrary neighborhood between connected mode be fusion, the heat-dissipating aluminium plate and cast aluminium layer vertical welding.
2. a kind of high radiating progressive metal-layer structure of level according to claim 1, it is characterised in that the copper-clad plate is
Red copper, thickness 0.25-0.4mm.
3. a kind of high radiating progressive metal-layer structure of level according to claim 1, it is characterised in that the substrate is with covering
After the mode of copper coin fusion is coordinates with glue, repeatedly press, sinter.
4. a kind of high radiating progressive metal-layer structure of level according to claim 3, it is characterised in that sintering temperature is
850-980℃。
A kind of 5. high radiating progressive metal-layer structure of level according to claim 1, it is characterised in that the substrate upper table
The relative roughness Ra values in face are less than 0.025.
A kind of 6. high radiating progressive metal-layer structure of level according to claim 1, it is characterised in that first aluminum bronze
Alloy-layer, the thickness of the second aluminum-copper alloy layer are 0.2-0.35mm, and the thickness of cast aluminium layer is less than the first aluminum-copper alloy layer, the second aluminium
Copper alloy layer.
A kind of 7. high radiating progressive metal-layer structure of level according to claim 1, it is characterised in that first aluminum bronze
Alloy-layer is aluminium bronze, copper content is more than 90%, and the second aluminum-copper alloy layer is aluminium alloy, copper content less than 12%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710853265.XA CN107645827B (en) | 2017-09-20 | 2017-09-20 | High heat dissipation level progressive metal layer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710853265.XA CN107645827B (en) | 2017-09-20 | 2017-09-20 | High heat dissipation level progressive metal layer structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107645827A true CN107645827A (en) | 2018-01-30 |
| CN107645827B CN107645827B (en) | 2019-12-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710853265.XA Active CN107645827B (en) | 2017-09-20 | 2017-09-20 | High heat dissipation level progressive metal layer structure |
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| Country | Link |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141711A (en) * | 2021-03-15 | 2021-07-20 | 华宇华源电子科技（深圳）有限公司 | Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6173883B1 (en) * | 1998-11-17 | 2001-01-16 | Motorola, Inc. | Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium |
| CN101483217A (en) * | 2009-02-04 | 2009-07-15 | 宋立峰 | LED high heat conduction ceramic copper coating heat radiation circuit board |
| CN201803246U (en) * | 2010-10-11 | 2011-04-20 | 孟强 | High-efficiency radiating light-emitting diode (LED) street lamp |
| CN104384676A (en) * | 2014-08-15 | 2015-03-04 | 招商局重工（江苏）有限公司 | Welding process of aluminum bronze and low-alloy steel |
| TW201644017A (en) * | 2015-03-30 | 2016-12-16 | 三菱綜合材料股份有限公司 | Method of producing power module substrate with heat sink |
-
2017
- 2017-09-20 CN CN201710853265.XA patent/CN107645827B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6173883B1 (en) * | 1998-11-17 | 2001-01-16 | Motorola, Inc. | Method and apparatus for increasing heat transfer that is restricted in thermally isolated pockets of a medium |
| CN101483217A (en) * | 2009-02-04 | 2009-07-15 | 宋立峰 | LED high heat conduction ceramic copper coating heat radiation circuit board |
| CN201803246U (en) * | 2010-10-11 | 2011-04-20 | 孟强 | High-efficiency radiating light-emitting diode (LED) street lamp |
| CN104384676A (en) * | 2014-08-15 | 2015-03-04 | 招商局重工（江苏）有限公司 | Welding process of aluminum bronze and low-alloy steel |
| TW201644017A (en) * | 2015-03-30 | 2016-12-16 | 三菱綜合材料股份有限公司 | Method of producing power module substrate with heat sink |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113141711A (en) * | 2021-03-15 | 2021-07-20 | 华宇华源电子科技（深圳）有限公司 | Manufacturing method of local high-heat-dissipation circuit board and high-heat-dissipation circuit board |
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| Publication number | Publication date |
|---|---|
| CN107645827B (en) | 2019-12-10 |
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Effective date of registration: 20211207 Address after: 215400 No.6, Fenggang Road, Shuangfeng town, Taicang City, Suzhou City, Jiangsu Province Patentee after: TAICANG ZHONGXIANG PRECISION HARDWARE Co.,Ltd. Address before: No.37, Taiping South Road, Chengxiang Town, Taicang City, Suzhou City, Jiangsu Province Patentee before: TAICANG SANYI HEATING AND CHILLING PROJECT Co.,Ltd. |