CN107635356A - Circuit board side wall gold filled nickel-gold electroplating process - Google Patents
Circuit board side wall gold filled nickel-gold electroplating process Download PDFInfo
- Publication number
- CN107635356A CN107635356A CN201710883692.2A CN201710883692A CN107635356A CN 107635356 A CN107635356 A CN 107635356A CN 201710883692 A CN201710883692 A CN 201710883692A CN 107635356 A CN107635356 A CN 107635356A
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- China
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- gold
- side wall
- circuit board
- copper
- nickel
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Abstract
The invention provides a kind of circuit board side wall gold filled nickel-gold electroplating process, including：Lead to overetched mode and etching groove is formed on the copper face of circuit board, the etching groove is along the figure extension for treating side wall gold filled so that layers of copper needs side wall covered with gold leaf to be exposed；Dry film is pasted in the layers of copper, and windowing is formed on the dry film, the windowing sets corresponding to the etching groove and its needs surrounded copper coin region covered with gold leaf and exposes the side wall；Electronickelling gold is carried out to the circuit board, so that plating last layer nickel gold in the copper coin region and the side wall.Method in the present invention can form nickel gold on the upper surface in copper coin region and side wall simultaneously in plating, so as to realize that top layer is gold-plated and side wall is covered with gold leaf simultaneously.
Description
Technical field
The present invention relates to circuit board manufacturing area, more particularly to a kind of circuit board side wall gold filled nickel-gold electroplating process.
Background technology
With the development of industry, more and more electronic products begin to use bonding process, to reduce product body to greatest extent
Product, therefore increasing PCB uses electronickelling gold surface technique.
In the manufacture craft of main flow, plating golden finger technique can realize solder joint side wall gold filled, but need to be fabricated separately to draw
Line turns on solder joint and edges of boards, is removed after gold-plated, is only applicable to side wall covered with gold leaf making of the solder joint in edges of boards；Nickel-gold electroplating process makes
Flow is simple, is not required to that lead is fabricated separately, but can only be gold-plated in solder joint top layer, can not carry out side wall making covered with gold leaf.
The content of the invention
The invention provides a kind of circuit board side wall gold filled nickel-gold electroplating process, it can realize that top layer is gold-plated and side simultaneously
Wall is covered with gold leaf.
To solve the above problems, as one aspect of the present invention, there is provided a kind of circuit board side wall gold filled electronickelling gold
Technique, including：Lead to overetched mode and etching groove is formed on the copper face of circuit board, side wall figure covered with gold leaf is treated on the etching groove edge
Shape extends so that the side wall of the needs gold filled of layers of copper is exposed；Dry film, and the shape on the dry film are pasted in the layers of copper
Into windowing, the windowing sets and exposed described corresponding to the etching groove and its needs surrounded copper coin region covered with gold leaf
Side wall；Electronickelling gold is carried out to the circuit board, so that plating last layer nickel gold in the copper coin region and the side wall.
Preferably, if the copper coin region is independent pad, lead is individually added for it.
Preferably, the distance between the circumferential edge of the windowing and the circumferential edge in the copper coin region are 4mil.
Method in the present invention can form nickel gold on the upper surface in copper coin region and side wall simultaneously in plating, so as to same
Shi Shixian top layers are gold-plated and side wall is covered with gold leaf.
Brief description of the drawings
Fig. 1 schematically shows dry film windowing schematic diagram when etching forms etching groove；
Fig. 2 schematically shows the board structure of circuit schematic diagram after foring etching groove；
Dry film when Fig. 3 schematically shows to form side wall gold filled opens schematic diagram.
Reference in figure：1st, etching groove；2nd, layers of copper；3rd, side wall；4th, dry film；5th, copper coin region；6th, open a window；7th, base material；
8th, open a window；9th, dry film.
Embodiment
Embodiments of the invention are described in detail below in conjunction with accompanying drawing, but the present invention can be defined by the claims
Implement with the multitude of different ways of covering.
One aspect of the present invention, there is provided a kind of circuit board side wall gold filled nickel-gold electroplating process, including：It is logical overetched
Mode forms etching groove 1 on the copper face of circuit board, and the etching groove 1 extends so that layers of copper 2 along the figure for treating side wall gold filled
The covered with gold leaf side wall 3 of needs be exposed；Dry film 4 is pasted in the layers of copper 2, and windowing 6 is formed on the dry film 4, it is described
Windowing sets corresponding to the etching groove 1 and its needs surrounded copper coin region 5 covered with gold leaf and exposes the side wall；To institute
State circuit board and carry out electronickelling gold, so that plating last layer nickel gold in the copper coin region 5 and the side wall 3.
When making circuit board, first as shown in Figure 1, the patch last layer dry film 9 on the lateral wall of layers of copper 2, and
Windowing 8 is formed on dry film 9, the windowing 8 corresponds to etching groove 1 to be formed, and corresponding with its shape.Then, it is etched, from
And form etching groove 1 as shown in Figure 2.Wherein, a side wall 3 of etching groove 1 is to need to carry out side gold filled in subsequent handling
Side wall.
Then, last layer dry film 4 as shown in Figure 3, then on the outer wall of the layers of copper 2 shown in Fig. 2 is pasted, meanwhile, shape on dry film 4
Into the windowing 6 for having the etching groove 1 corresponding to pending top layer is gold-plated and side wall is covered with gold leaf copper coin region 5 and its surrounding.
Finally, circuit board is electroplated.Because now the upper surface in copper coin region 5 and side surface are not covered with dry film
4, therefore nickel gold can be formed during plating on the upper surface in copper coin region 5 and side wall simultaneously, so as to while realize that top layer is gold-plated
It is covered with gold leaf with side wall.
Preferably, if the copper coin region 5 is independent pad, lead is individually added for it.
Preferably, the distance between the circumferential edge of the windowing 6 and the circumferential edge in the copper coin region 5 are 4mil.
So, liquid medicine can be facilitated to enter pad sidewall locations, in electronickelling gold, realize side wall gold filled.
The preferred embodiments of the present invention are the foregoing is only, are not intended to limit the invention, for the skill of this area
For art personnel, the present invention can have various modifications and variations.Within the spirit and principles of the invention, that is made any repaiies
Change, equivalent substitution, improvement etc., should be included in the scope of the protection.
Claims (3)
- A kind of 1. circuit board side wall gold filled nickel-gold electroplating process, it is characterised in that including：Lead to overetched mode and etching groove (1) is formed on the copper face of circuit board, side wall figure covered with gold leaf is treated on etching groove (1) edge Shape extends so that the side wall (3) of the needs gold filled of layers of copper (2) is exposed；Dry film (4) is pasted in the layers of copper (2), and windowing (6) is formed on the dry film (4), the windowing corresponds to described The copper coin region (5) of etching groove (1) and its needs gold filled surrounded sets and exposes the side wall；Electronickelling gold is carried out to the circuit board, so that plating last layer nickel in the copper coin region (5) and the side wall (3) Gold.
- 2. circuit board side wall gold filled nickel-gold electroplating process according to claim 1, it is characterised in that if the copper coin area Domain (5) is independent pad, then individually adds lead for it.
- 3. the circuit board side wall gold filled nickel-gold electroplating process according to claim 1 and 2, it is characterised in that the windowing (6) The distance between the circumferential edge of circumferential edge and the copper coin region (5) be 4mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710883692.2A CN107635356A (en) | 2017-09-26 | 2017-09-26 | Circuit board side wall gold filled nickel-gold electroplating process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710883692.2A CN107635356A (en) | 2017-09-26 | 2017-09-26 | Circuit board side wall gold filled nickel-gold electroplating process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107635356A true CN107635356A (en) | 2018-01-26 |
Family
ID=61103478
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710883692.2A Pending CN107635356A (en) | 2017-09-26 | 2017-09-26 | Circuit board side wall gold filled nickel-gold electroplating process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107635356A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994660A (en) * | 2019-03-15 | 2019-07-09 | 福建南平南孚电池有限公司 | A kind of rechargeable battery with improved circuit unit |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05121862A (en) * | 1991-10-30 | 1993-05-18 | Fujitsu Ltd | Indium resistant solder pattern |
| JPH10298771A (en) * | 1997-04-22 | 1998-11-10 | Matsushita Electric Works Ltd | Electroless nickel plating method |
| CN1427469A (en) * | 2001-12-20 | 2003-07-02 | 全懋精密科技股份有限公司 | Manufacturing method and structure of electroplating nickel/gold on electrical contact pad of chip packaging substrate |
| CN104105350A (en) * | 2013-04-02 | 2014-10-15 | 深南电路有限公司 | Selective nickel and gold plating method, PCB and device |
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN106211633A (en) * | 2016-06-29 | 2016-12-07 | 深圳崇达多层线路板有限公司 | The manufacture method of the four sides gold filled golden finger of printed substrate |
-
2017
- 2017-09-26 CN CN201710883692.2A patent/CN107635356A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05121862A (en) * | 1991-10-30 | 1993-05-18 | Fujitsu Ltd | Indium resistant solder pattern |
| JPH10298771A (en) * | 1997-04-22 | 1998-11-10 | Matsushita Electric Works Ltd | Electroless nickel plating method |
| CN1427469A (en) * | 2001-12-20 | 2003-07-02 | 全懋精密科技股份有限公司 | Manufacturing method and structure of electroplating nickel/gold on electrical contact pad of chip packaging substrate |
| CN104105350A (en) * | 2013-04-02 | 2014-10-15 | 深南电路有限公司 | Selective nickel and gold plating method, PCB and device |
| CN105682348A (en) * | 2016-03-08 | 2016-06-15 | 深圳崇达多层线路板有限公司 | Fabrication method for printed circuit board (PCB) with gold finger of which three surfaces coated with gold |
| CN106211633A (en) * | 2016-06-29 | 2016-12-07 | 深圳崇达多层线路板有限公司 | The manufacture method of the four sides gold filled golden finger of printed substrate |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109994660A (en) * | 2019-03-15 | 2019-07-09 | 福建南平南孚电池有限公司 | A kind of rechargeable battery with improved circuit unit |
| CN109994660B (en) * | 2019-03-15 | 2023-12-05 | 福建南平南孚电池有限公司 | Rechargeable battery with improved circuit unit |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180126 |
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| RJ01 | Rejection of invention patent application after publication |