CN107635032A - Cases and Electronics - Google Patents
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- CN107635032A CN107635032A CN201710885184.8A CN201710885184A CN107635032A CN 107635032 A CN107635032 A CN 107635032A CN 201710885184 A CN201710885184 A CN 201710885184A CN 107635032 A CN107635032 A CN 107635032A
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Abstract
Description
技术领域technical field
本申请涉及通讯技术领域,具体涉及一种壳体和电子设备。The present application relates to the technical field of communications, in particular to a housing and electronic equipment.
背景技术Background technique
随着终端技术的发展,移动终端已经开始从以前简单地提供通话设备渐渐变成一个通用软件运行的平台。该平台不再以提供通话管理为主要目的,而是提供一个包括通话管理、游戏娱乐、办公记事、移动支付等各类应用软件在内的运行环境,随着大量的普及,已经深入至人们的生活、工作的方方面面。With the development of terminal technology, the mobile terminal has gradually changed from simply providing communication equipment to a platform for general software operation. The platform no longer aims to provide call management, but to provide an operating environment including call management, game entertainment, office notes, mobile payment and other application software. With a large number of popularization, it has penetrated into people's All aspects of life and work.
目前的移动终端,如手机、平板等,其入声口(MIC孔)基本都是专门设置的开设在移动终端的壳体的侧面上的一个单独贯通的小孔,声音自该小孔传递给麦克风,实现接收声音的目的。麦克风的位置一般也都设置在入声口处,这种设置方法限制了麦克风的位置,而由于壳体侧面往往还需设置扬声器、充电接口等等,使得移动终端的机身厚度比较厚,也影响移动终端的整体密封性。In current mobile terminals, such as mobile phones and tablets, the sound inlet (MIC hole) is basically a small through-hole specially set on the side of the housing of the mobile terminal, and the sound is transmitted from the small hole to the Microphone, to achieve the purpose of receiving sound. The position of the microphone is generally also set at the sound inlet, which limits the position of the microphone, and since the side of the housing often needs to be equipped with speakers, charging ports, etc., the thickness of the body of the mobile terminal is relatively thick, and the Affect the overall sealing of the mobile terminal.
发明内容Contents of the invention
本申请实施例提供一种壳体和电子设备,可以将麦克风的位置设置在远离入声口的其他位置,从而减小机身厚度,并且进一步提升电子设备的整体密封性。Embodiments of the present application provide a casing and an electronic device, and the position of the microphone can be set at another position away from the sound inlet, thereby reducing the thickness of the body and further improving the overall sealing performance of the electronic device.
本申请实施例提供一种壳体,包括:本体、与本体连接的侧壁、以及麦克风的声音传播通道;声音传播通道的至少一部分位于本体和侧壁的内部,声音传播通道包括出声口和入声口,出声口设置在本体的内表面,入声口设置在侧壁上。An embodiment of the present application provides a casing, including: a body, a side wall connected to the body, and a sound propagation channel of a microphone; at least a part of the sound propagation channel is located inside the body and the side wall, and the sound propagation channel includes a sound outlet and The sound inlet and the sound outlet are arranged on the inner surface of the body, and the sound inlet is arranged on the side wall.
本申请还提供一种电子设备,包括:壳体、电路板以及麦克风,电路板和麦克风安装在壳体内部,壳体包括上述的壳体,所述麦克风安装在声音传播通道出声口的对应位置。The present application also provides an electronic device, including: a housing, a circuit board, and a microphone, the circuit board and the microphone are installed inside the housing, the housing includes the above housing, and the microphone is installed at the corresponding Location.
本申请提供的壳体和电子设备可以将麦克风的位置设置在远离入声口的其他位置,从而减小机身厚度,并且能够进一步提升电子设备的整体密封性。The casing and the electronic device provided by the present application can set the position of the microphone at another position away from the sound inlet, thereby reducing the thickness of the body and further improving the overall sealing performance of the electronic device.
附图说明Description of drawings
图1为本申请实施例提供的一种电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
图2为本申请实施例提供的第二种电子设备的结构示意图。FIG. 2 is a schematic structural diagram of a second electronic device provided by an embodiment of the present application.
图3为本申请实施例提供的第三种电子设备的结构示意图。FIG. 3 is a schematic structural diagram of a third electronic device provided by an embodiment of the present application.
图4为本申请实施例提供的一种壳体的结构示意图Fig. 4 is a schematic structural diagram of a housing provided in the embodiment of the present application
图5为本申请实施例提供的第四种电子设备的结构示意图。FIG. 5 is a schematic structural diagram of a fourth electronic device provided by an embodiment of the present application.
图6为本申请实施例提供的第五种电子设备的结构示意图。FIG. 6 is a schematic structural diagram of a fifth electronic device provided by an embodiment of the present application.
图7为本申请实施例提供的第六种电子设备的结构示意图。FIG. 7 is a schematic structural diagram of a sixth electronic device provided by an embodiment of the present application.
图8为本申请实施例提供的第七种电子设备的结构示意图。FIG. 8 is a schematic structural diagram of a seventh electronic device provided by an embodiment of the present application.
图9为本申请实施例提供的第八种电子设备的结构示意图。FIG. 9 is a schematic structural diagram of an eighth electronic device provided by an embodiment of the present application.
图10是本申请实施例提供的挡板的一种结构示意图。FIG. 10 is a schematic structural view of a baffle provided in an embodiment of the present application.
图11为本申请实施例提供的第九种电子设备的结构示意图。FIG. 11 is a schematic structural diagram of a ninth electronic device provided by an embodiment of the present application.
具体实施方式Detailed ways
请参照附图中的图式,其中相同的组件符号代表相同的组件,本申请的原理是以实施在一适当的环境中来举例说明。以下的说明是基于所示例的本申请的具体实施例,其不应被视为限制本申请未在此详述的其它具体实施例。Referring to the drawings in the accompanying drawings, where the same reference numerals represent the same components, the principles of the present application are exemplified by implementing them in an appropriate environment. The following description is based on illustrated specific embodiments of the present application, which should not be construed as limiting other specific embodiments of the present application not described in detail herein.
本说明书所使用的词语“实施例”意指用作实例、示例或例证。此外,本说明书和所附权利要求中所使用的冠词“一”一般地可以被解释为意指“一个或多个”,除非另外指定或从上下文清楚导向单数形式。The word "embodiment" as used in this specification means serving as an example, instance or illustration. Furthermore, the article "a" as used in this specification and the appended claims may generally be construed to mean "one or more" unless specified otherwise or clear from context to refer to a singular form.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the application and simplifying the description, and does not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the application.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected, or electrically connected, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediary, and it can be the internal communication of two components or the interaction of two components relation. Those of ordinary skill in the art can understand the specific meanings of the above terms in this application according to specific situations.
此外,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In addition, unless otherwise expressly specified and limited, a first feature being "on" or "under" a second feature may include that the first and second features are in direct contact, and may also include that the first and second features are not in direct contact. Rather, through additional characteristic contacts between them. Moreover, "above", "above" and "above" the first feature on the second feature include that the first feature is directly above and obliquely above the second feature, or simply means that the first feature is horizontally higher than the second feature. "Below", "beneath" and "under" the first feature to the second feature include that the first feature is directly below and obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different implementations or examples for implementing different structures of the present application. To simplify the disclosure of the present application, components and arrangements of specific examples are described below. Of course, they are examples only and are not intended to limit the application. Furthermore, the present application may repeat reference numerals and/or reference letters in various instances, such repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, various specific process and material examples are provided herein, but one of ordinary skill in the art may recognize the use of other processes and/or the use of other materials.
本申请实施例提供一种电子设备。该电子设备可以是智能手机、平板电脑等设备。参考图1,电子设备100包括盖板101、显示屏102、电路板103以及壳体21。An embodiment of the present application provides an electronic device. The electronic device may be a smart phone, a tablet computer or the like. Referring to FIG. 1 , an electronic device 100 includes a cover plate 101 , a display screen 102 , a circuit board 103 and a casing 21 .
其中,盖板101安装到显示屏102上,以覆盖显示屏102。盖板101可以为透明玻璃盖板。在一些实施例中,盖板101可以是用诸如蓝宝石等材料制成的玻璃盖板。Wherein, the cover plate 101 is installed on the display screen 102 to cover the display screen 102 . The cover plate 101 may be a transparent glass cover plate. In some embodiments, the cover plate 101 may be a glass cover plate made of materials such as sapphire.
显示屏102安装在壳体21上,以形成电子设备100的显示面。显示屏102可以包括显示区域102A、非显示区域102B以及非显示区域102C。显示区域102A用于显示图像、文本等信息。非显示区域102B不显示信息。非显示区域102B的底部可以设置指纹模组、触控电路等功能组件。非显示区域102C的底部可以设置光接近传感器、前置摄像头、受话器等器件。The display screen 102 is mounted on the casing 21 to form a display surface of the electronic device 100 . The display screen 102 may include a display area 102A, a non-display area 102B and a non-display area 102C. The display area 102A is used to display information such as images and texts. The non-display area 102B does not display information. The bottom of the non-display area 102B may be provided with functional components such as a fingerprint module and a touch circuit. The bottom of the non-display area 102C may be provided with optical proximity sensors, front cameras, receivers and other components.
电路板103安装在壳体21内部。电路板103可以为电子设备100的主板。电路板103上可以集成有摄像头、光接近传感器以及处理器等功能组件。同时,显示屏102可以电连接至电路板103。比如,电路板103与非显示区域102C对应的位置集成有摄像头、光接近传感器等。The circuit board 103 is mounted inside the housing 21 . The circuit board 103 may be a main board of the electronic device 100 . Functional components such as a camera, an optical proximity sensor, and a processor may be integrated on the circuit board 103 . Meanwhile, the display screen 102 may be electrically connected to the circuit board 103 . For example, the position of the circuit board 103 corresponding to the non-display area 102C is integrated with a camera, an optical proximity sensor, and the like.
在一些实施例当中,电路板103上设置有射频(RF,Radio Frequency)电路。射频电路可以通过无线网络与网络设备(例如,服务器、基站等)或其他电子设备(例如,智能手机等)通信,以完成与网络设备或其他电子设备之间的信息收发。In some embodiments, a radio frequency (RF, Radio Frequency) circuit is disposed on the circuit board 103 . The radio frequency circuit can communicate with network equipment (eg, server, base station, etc.) or other electronic equipment (eg, smart phone, etc.) through a wireless network, so as to complete information sending and receiving between the network equipment or other electronic equipment.
在一些实施例当中,如图2所示,该电子设备还包含后置摄像头105、闪光灯106以及天线107。其中,该摄像头105可以为单摄像头,比如分别为1600万像素广角摄像头或者2000万像素长焦摄像头。通过该摄像头105电子设备可以拍摄图像。在一些实施例中,该后置摄像头105还可以为双摄像头,比如广角摄像头和长焦摄像头。In some embodiments, as shown in FIG. 2 , the electronic device further includes a rear camera 105 , a flash 106 and an antenna 107 . Wherein, the camera 105 may be a single camera, such as a 16-megapixel wide-angle camera or a 20-megapixel telephoto camera. Through the camera 105, the electronic device can capture images. In some embodiments, the rear camera 105 can also be a dual camera, such as a wide-angle camera and a telephoto camera.
其中,天线107可以与电路板103上的射频电路连接,用于收发射频信号。Wherein, the antenna 107 may be connected with the radio frequency circuit on the circuit board 103 for sending and receiving radio frequency signals.
在一些实施例当中,如图3所示,该电子设备还包括:SIM卡的卡槽108、锁屏按键109等等。卡槽108用于放置SIM卡,并且通过卡槽108内的弹片与电路板103电连接;该卡槽108和锁屏按键109设置在壳体21内。锁屏按键109用于实现显示屏102锁定和解锁,比如,当用户按下锁屏按键109时,显示屏102锁定熄灭。In some embodiments, as shown in FIG. 3 , the electronic device further includes: a SIM card slot 108 , a screen lock button 109 and so on. The card slot 108 is used to place the SIM card, and is electrically connected to the circuit board 103 through the elastic sheet in the card slot 108 ; the card slot 108 and the lock screen button 109 are arranged in the casing 21 . The screen lock button 109 is used to lock and unlock the display screen 102 , for example, when the user presses the screen lock button 109 , the display screen 102 is locked and turned off.
在一些实施例当中,该电子设备还可以包括:还设置在壳体内的USB接口、音频接口、第一音量调节键和第二音量调节键。In some embodiments, the electronic device may further include: a USB interface, an audio interface, a first volume adjustment key, and a second volume adjustment key that are also disposed in the casing.
如图4所示,图4为本申请实施例提供的一种壳体21的结构示意图,包括:本体212、与本体连接的侧壁211、以及麦克风的声音传播通道23。其中,声音传播通道23的至少一部分位于本体212和侧壁211的内部;As shown in FIG. 4 , FIG. 4 is a schematic structural diagram of a casing 21 provided by an embodiment of the present application, including: a body 212 , a side wall 211 connected to the body, and a sound propagation channel 23 of a microphone. Wherein, at least a part of the sound propagation channel 23 is located inside the body 212 and the side wall 211;
声音传播通道23包括出声口27和入声口24,出声口27设置在本体212的内表面,入声口24设置在侧壁211上。The sound propagation channel 23 includes a sound outlet 27 and a sound inlet 24 , the sound outlet 27 is disposed on the inner surface of the body 212 , and the sound inlet 24 is disposed on the side wall 211 .
在一实施例当中,参考图5至图9,图5为本申请实施例提供的第四种电子设备的结构示意图。该电子设备包括壳体21和麦克风22,其中壳体21包括本体212和侧壁211,壳体的侧壁211上设置有入声口24,沿入声口向壳体的本体212内测延伸以形成声音传播通道23,该声音传播通道23的另一端延伸至壳体的本体212的内表面上。In an embodiment, referring to FIG. 5 to FIG. 9 , FIG. 5 is a schematic structural diagram of a fourth electronic device provided in an embodiment of the present application. The electronic device includes a housing 21 and a microphone 22, wherein the housing 21 includes a body 212 and a side wall 211, and the side wall 211 of the housing is provided with a sound inlet 24, which extends along the sound inlet to the body 212 of the housing. To form a sound transmission channel 23 , the other end of the sound transmission channel 23 extends to the inner surface of the body 212 of the casing.
麦克风22设置于声音传播通道23在壳体的本体212内表面上的一端,麦克风22用于接收通过入声口23进入声音传播通道23的声音。The microphone 22 is disposed at one end of the sound propagation channel 23 on the inner surface of the body 212 of the casing, and the microphone 22 is used for receiving sound entering the sound propagation channel 23 through the sound inlet 23 .
在一实施例当中,声音传播通道23包括从入声口24向壳体的本体212内测延伸的延伸通道231和连接该延伸通道231端部的连接部232,麦克风22设置于该连接部22。麦克风22可以通过粘胶的方式固定在壳体的本体212内测。In one embodiment, the sound propagation channel 23 includes an extension channel 231 extending from the sound inlet 24 to the inner side of the body 212 of the housing and a connecting portion 232 connecting the end of the extending channel 231, and the microphone 22 is disposed on the connecting portion 22 . The microphone 22 can be fixed inside the body 212 of the casing by means of glue.
在一实施例当中,声音传播通道23的横截面积不小于0.5mm2,保证声音通过入声口24进入声音传播通道23内、并在声音传播通道23内很好的传播。入声口24的横截面可以为圆形、椭圆或者方形等等,在此不做进一步限定,入声口的横截面积可以大于或者等于声音传播通道23的横截面积,以保证接收到的声音全部进入声音传播通道23内。同时也可以使外壳的侧壁211的厚度较薄,这样制成的壳体21的外观也更美观。In one embodiment, the cross-sectional area of the sound propagation channel 23 is not less than 0.5 mm 2 , so as to ensure that the sound enters the sound propagation channel 23 through the sound inlet 24 and propagates well in the sound propagation channel 23 . The cross-section of the sound inlet 24 can be circular, oval or square, etc., without further limitation here, the cross-sectional area of the sound inlet can be greater than or equal to the cross-sectional area of the sound propagation channel 23, to ensure the received All sound enters the sound propagation channel 23 . At the same time, the thickness of the side wall 211 of the casing can also be made thinner, so that the appearance of the casing 21 made in this way is also more beautiful.
在一实施例当中,如图6所示,声音传播通道23的形状也可以为直线型。需要说明的是,上述声音传播通道23还可以为或曲线形通道(如弧形通道、S形通道)等。上述声音传播通道23和入声口24为一个,麦克风22也为一个,在其他实施例当中,还可以设置多个声音传播通道23和入声口24,以提升收集到的声音音量,而上述多个声音传播通道23和入声口24则可以对应一个或多个麦克风22。In an embodiment, as shown in FIG. 6 , the shape of the sound propagation channel 23 may also be linear. It should be noted that the above-mentioned sound propagation channel 23 may also be a curved channel (such as an arc channel, an S-shaped channel) and the like. The above-mentioned sound propagation channel 23 and the sound inlet 24 are one, and the microphone 22 is also one. In other embodiments, a plurality of sound propagation channels 23 and the sound inlet 24 can also be set to improve the collected sound volume, and the above-mentioned Multiple sound propagation channels 23 and sound inlets 24 may correspond to one or more microphones 22 .
在一实施例当中,如图7所示,电子设备包括壳体21、麦克风22以及麦克风支架25,其中壳体21包括本体212和侧壁211,壳体的侧壁211上设置有入声口24,沿入声口向壳体的本体212内测延伸以形成声音传播通道23,该声音传播通道23的另一端延伸至壳体的本体212的内表面上。In one embodiment, as shown in FIG. 7, the electronic device includes a housing 21, a microphone 22, and a microphone holder 25, wherein the housing 21 includes a body 212 and a side wall 211, and the side wall 211 of the housing is provided with a sound inlet. 24 , extending inwardly toward the body 212 of the housing along the sound inlet to form a sound propagation channel 23 , and the other end of the sound propagation channel 23 extends to the inner surface of the body 212 of the housing.
麦克风22设置于声音传播通道23在壳体的本体212内表面上的一端,麦克风22用于接收通过入声口23进入声音传播通道23的声音。The microphone 22 is disposed at one end of the sound propagation channel 23 on the inner surface of the body 212 of the casing, and the microphone 22 is used for receiving sound entering the sound propagation channel 23 through the sound inlet 23 .
麦克风支架25设置于声音传播通道23在壳体的本体212内表面上的一端,麦克风22设置于麦克风支架25内。该麦克风支架25可以为弹性材料,用于保护麦克风22不受损害,麦克风支架25可以通过粘胶或螺丝固定在壳体的本体212内表面。The microphone holder 25 is disposed at one end of the sound propagation channel 23 on the inner surface of the body 212 of the casing, and the microphone 22 is disposed inside the microphone holder 25 . The microphone holder 25 can be made of elastic material to protect the microphone 22 from damage, and the microphone holder 25 can be fixed on the inner surface of the body 212 of the housing by glue or screws.
在一实施例当中,如图8所示,麦克风支架25可以包括本体251和固定件252,壳体的本体212内表面设置有固定槽,固定件252和固定槽相吻合,以使麦克风支架25固定在壳体的本体212内表面。而由于麦克风支架25为弹性材料,麦克风支架25可以被更加牢固地固定到壳体的本体212内表面。固定件252的数量可以为两个,分别设置在麦克风22的两端。当然,上述固定件252的数量也可以为多个,分别壳体的本体212内设置与之数量对应的固定槽,以使麦克风22固定的更为牢固。In one embodiment, as shown in FIG. 8 , the microphone holder 25 may include a body 251 and a fixing member 252, the inner surface of the body 212 of the housing is provided with a fixing groove, and the fixing member 252 matches the fixing groove so that the microphone holder 25 It is fixed on the inner surface of the body 212 of the housing. And because the microphone holder 25 is made of elastic material, the microphone holder 25 can be more firmly fixed to the inner surface of the body 212 of the housing. The number of fixing parts 252 can be two, which are respectively arranged at two ends of the microphone 22 . Certainly, the number of the above-mentioned fixing parts 252 may also be multiple, and the corresponding number of fixing slots are respectively provided in the body 212 of the housing, so that the microphone 22 is fixed more firmly.
在一实施例当中,如图9所示,电子设备包括壳体21、麦克风22以及挡板26,壳体21包括本体212和侧壁211,壳体的侧壁211上设置有入声口24,沿入声口向壳体的本体212内测延伸以形成声音传播通道23,该声音传播通道23的另一端延伸至壳体的本体212的内表面上。In one embodiment, as shown in FIG. 9 , the electronic device includes a housing 21 , a microphone 22 and a baffle 26 , the housing 21 includes a body 212 and a side wall 211 , and the side wall 211 of the housing is provided with a sound inlet 24 , extend along the sound inlet to the body 212 of the housing to form a sound propagation channel 23 , and the other end of the sound propagation channel 23 extends to the inner surface of the body 212 of the housing.
麦克风22设置于声音传播通道23在壳体的本体212内表面上的一端,麦克风22用于接收通过入声口23进入声音传播通道23的声音。The microphone 22 is disposed at one end of the sound propagation channel 23 on the inner surface of the body 212 of the casing, and the microphone 22 is used for receiving sound entering the sound propagation channel 23 through the sound inlet 23 .
其中,声音传播通道23为开设在壳体的本体212内测上面的安装槽,挡板26覆盖在安装槽的槽口处,以围成周向上闭环的声音传播通道23。挡板26如图10所示,在挡板对应于声音传播通道的另一端处设置有通孔261,麦克风22设置在通孔261处,麦克风22接收自通孔261传播出的声音。挡板26可以是以粘胶的方式安装在安装槽的槽口处。Wherein, the sound propagation channel 23 is an installation groove opened on the inner side of the body 212 of the housing, and the baffle plate 26 covers the notch of the installation groove to form a circumferential closed-loop sound propagation channel 23 . As shown in FIG. 10 , the baffle 26 is provided with a through hole 261 at the other end of the baffle corresponding to the sound propagation channel. The microphone 22 is disposed at the through hole 261 , and the microphone 22 receives the sound transmitted from the through hole 261 . The baffle plate 26 can be installed at the notch of the installation groove in the manner of viscose.
在一实施例当中,安装槽的侧壁上设置有安装台阶(此方案图中未示出),挡板26安装在该安装台阶处,挡板26的外板面与安装槽的外端面平齐,以方便于壳体的本体212内测的其他部件安装,防止因挡板26凸出而产生干涉。In one embodiment, an installation step (not shown in this scheme figure) is provided on the side wall of the installation groove, and the baffle plate 26 is installed at the installation step, and the outer surface of the baffle plate 26 is flush with the outer end surface of the installation groove. In order to facilitate the installation of other components inside the body 212 of the housing, and prevent interference due to the protrusion of the baffle 26.
其中,挡板26与安装台阶之间可以采用胶粘的方式密封连接,也可以通过螺钉锁紧的方式固定连接,均可实现本申请的目的,其宗旨未脱离本发明的设计思想,在此不再赘述,均应属于本申请的保护范围内。Wherein, the baffle plate 26 and the installation step can be sealed and connected by glue, or can be fixedly connected by screw locking, both of which can achieve the purpose of this application, and its purpose does not deviate from the design idea of the present invention. No more details are given, and all should belong to the protection scope of the present application.
在一实施例当中,当挡板26和壳体的本体212均为金属材质时,挡板26和壳体的本体212可采用焊接的方式密封连接,密封性更好,能减少声音的泄露,进而提升麦克风22接收声音的效率。In one embodiment, when the baffle 26 and the body 212 of the housing are made of metal, the baffle 26 and the body 212 of the housing can be sealed and connected by welding, which has better sealing performance and can reduce sound leakage. Further, the efficiency of receiving sound by the microphone 22 is improved.
在一实施例当中,该电子设备还可以包括:密封件(此方案图中未示出),安装于挡板26与安装槽的槽壁之间,用于封堵挡板26与安装槽的槽壁之间的缝隙,防止音波在该缝隙处向外扩散而影响音波传递质量,尽量减小音波传递过程中的能量损失。In one embodiment, the electronic device may also include: a seal (not shown in this scheme), installed between the baffle plate 26 and the groove wall of the installation groove, for blocking the gap between the baffle plate 26 and the installation groove The gap between the groove walls prevents the sound wave from spreading outward in the gap and affects the quality of the sound wave transmission, and minimizes the energy loss during the sound wave transmission process.
在一实施例当中,上述密封件可以为密封条,材质可以为弹性材质,且密封条包括有两个,安装台阶位于安装槽的两个长边的内侧壁面上,挡板26的端部抵压在安装槽另一端的内端面上,两个密封条分别安装在挡板26与两个安装台阶的缝隙之间。In one embodiment, the above-mentioned sealing element can be a sealing strip, and the material can be an elastic material, and there are two sealing strips, the installation steps are located on the inner wall surfaces of the two long sides of the installation groove, and the ends of the baffle plate 26 abut against Pressed on the inner end surface of the other end of the installation groove, the two sealing strips are respectively installed between the baffle plate 26 and the gap between the two installation steps.
参考图11,图11本申请实施例提供的电子设备100的又一结构示意图。电子设备100包括天线装置10、存储器20、显示单元30、电源40、处理器50以及传感器模块60。本领域技术人员可以理解,图11中示出的电子设备100的结构并不构成对电子设备100的限定。电子设备100可以包括比图示更多或更少的部件,或者组合某些部件,或者不同的部件布置。Referring to FIG. 11 , FIG. 11 is another schematic structural diagram of the electronic device 100 provided by the embodiment of the present application. The electronic device 100 includes an antenna device 10 , a memory 20 , a display unit 30 , a power supply 40 , a processor 50 and a sensor module 60 . Those skilled in the art can understand that the structure of the electronic device 100 shown in FIG. 11 does not limit the electronic device 100 . Electronic device 100 may include more or fewer components than shown, or combine certain components, or have a different arrangement of components.
其中,天线装置10可以通过无线网络与网络设备(例如,服务器)或其他电子设备(例如,智能手机)通信,完成与网络设备或其他电子设备之间的信息收发。其中,天线装置10可以包括本申请实施例任一提供的保护电路200。Wherein, the antenna device 10 can communicate with a network device (for example, a server) or other electronic devices (for example, a smart phone) through a wireless network to complete information sending and receiving between the network device or other electronic devices. Wherein, the antenna device 10 may include the protection circuit 200 provided in any one of the embodiments of the present application.
存储器20可用于存储应用程序和数据。存储器20存储的应用程序中包含有可执行程序代码。应用程序可以组成各种功能模块。处理器50通过运行存储在存储器20的应用程序,从而执行各种功能应用以及数据处理。Memory 20 may be used to store applications and data. The application programs stored in the memory 20 include executable program codes. Applications can be composed of various functional modules. The processor 50 executes various functional applications and data processing by executing the application programs stored in the memory 20 .
显示单元30可用于显示由用户输入到电子设备100的信息或提供给用户的信息以及电子设备100的各种图形用户接口。这些图形用户接口可以由图形、文本、图标、视频和其任意组合来构成。显示单元30可包括显示面板。The display unit 30 may be used to display information input to the electronic device 100 by a user or information provided to the user and various graphical user interfaces of the electronic device 100 . These graphical user interfaces can be composed of graphics, text, icons, videos and any combination thereof. The display unit 30 may include a display panel.
电源40用于给电子设备100的各个部件供电。在一些实施例中,电源40可以通过电源管理系统与处理器50逻辑相连,从而通过电源管理系统实现管理充电、放电、以及功耗管理等功能。The power supply 40 is used to supply power to various components of the electronic device 100 . In some embodiments, the power supply 40 may be logically connected to the processor 50 through a power management system, so as to implement functions such as managing charging, discharging, and power consumption through the power management system.
处理器50是电子设备100的控制中心。处理器50利用各种接口和线路连接整个电子设备100的各个部分,通过运行或执行存储在存储器20内的应用程序,以及调用存储在存储器20内的数据,执行电子设备100的各种功能和处理数据,从而对电子设备100进行整体监控。The processor 50 is the control center of the electronic device 100 . The processor 50 uses various interfaces and lines to connect various parts of the entire electronic device 100, and executes various functions and The data is processed so as to monitor the electronic device 100 as a whole.
传感器模块60用于感应外界信号,如光信号等,传感器60可以包括光接近传感器、环境光传感器等。The sensor module 60 is used to sense external signals, such as light signals, and the sensor 60 may include a light proximity sensor, an ambient light sensor, and the like.
此外,电子设备100还可以包括摄像头模块、蓝牙模块等,在此不再赘述。In addition, the electronic device 100 may further include a camera module, a bluetooth module, etc., which will not be repeated here.
综上所述,本申请提供一种壳体和电子设备,壳体包括:本体、与本体连接的侧壁、以及麦克风的声音传播通道;声音传播通道的至少一部分位于本体和侧壁的内部,声音传播通道包括出声口和入声口,出声口设置在本体的内表面,入声口设置在侧壁上。本申请可以将麦克风的位置设置在远离入声口的其他位置,从而减小机身厚度,并且能够进一步提升电子设备的整体密封性。In summary, the present application provides a casing and an electronic device, the casing includes: a body, a side wall connected to the body, and a sound propagation channel of a microphone; at least a part of the sound propagation channel is located inside the body and the side wall, The sound propagation channel includes a sound outlet and a sound inlet, the sound outlet is arranged on the inner surface of the body, and the sound inlet is arranged on the side wall. In the present application, the position of the microphone can be set at another position away from the sound inlet, thereby reducing the thickness of the body and further improving the overall sealing performance of the electronic device.
尽管已经相对于一个或多个实现方式示出并描述了本申请,但是本领域技术人员基于对本说明书和附图的阅读和理解将会想到等价变型和修改。本申请包括所有这样的修改和变型,并且仅由所附权利要求的范围限制。特别地关于由上述组件执行的各种功能,用于描述这样的组件的术语旨在对应于执行所述组件的指定功能(例如其在功能上是等价的)的任意组件(除非另外指示),即使在结构上与执行本文所示的本说明书的示范性实现方式中的功能的公开结构不等同。此外,尽管本说明书的特定特征已经相对于若干实现方式中的仅一个被公开,但是这种特征可以与如可以对给定或特定应用而言是期望和有利的其他实现方式的一个或多个其他特征组合。而且,就术语“包括”、“具有”、“含有”或其变形被用在具体实施方式或权利要求中而言,这样的术语旨在以与术语“包含”相似的方式包括。Although the application has been shown and described with respect to one or more implementations, equivalent alterations and modifications will occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings. This application includes all such modifications and variations and is limited only by the scope of the appended claims. With particular reference to the various functions performed by the components described above, terminology used to describe such components is intended to correspond to any component that performs the specified function (eg, which is functionally equivalent) of the described component (unless otherwise indicated). , even if not structurally equivalent to the disclosed structures that perform the functions shown herein in the exemplary implementations of the specification. Furthermore, although a particular feature of this specification has been disclosed with respect to only one of several implementations, such feature may be combined with one or more other implementations as may be desirable and advantageous for a given or particular application. other feature combinations. Moreover, to the extent the terms "comprises", "has", "comprising" or variations thereof are used in the detailed description or the claims, such terms are intended to be encompassed in a manner similar to the term "comprising".
综上所述,虽然本申请已以优选实施例揭露如上,但上述优选实施例并非用以限制本申请,本领域的普通技术人员,在不脱离本申请的精神和范围内,均可作各种更动与润饰,因此本申请的保护范围以权利要求界定的范围为准。In summary, although the present application has disclosed the above with preferred embodiments, the above preferred embodiments are not intended to limit the present application, and those of ordinary skill in the art can make various modifications without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application is subject to the scope defined in the claims.
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