CN107620718B - A special cooling fan structure for microelectronic equipment - Google Patents
A special cooling fan structure for microelectronic equipment Download PDFInfo
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- CN107620718B CN107620718B CN201710726950.6A CN201710726950A CN107620718B CN 107620718 B CN107620718 B CN 107620718B CN 201710726950 A CN201710726950 A CN 201710726950A CN 107620718 B CN107620718 B CN 107620718B
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- heat emission
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- fan
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Abstract
The invention discloses a kind of microelectronic device Special heat dissipating fan structures, including bottom connecting plate, blower, first heat emission fan and the second heat emission fan, bottom connecting plate is mounted on the first heat emission fan bottom, first heat emission fan and the second heat emission fan are fixed together, and first heat emission fan and the second heat emission fan junction be provided with change of current gap, assembling is at the top of the second heat emission fan, conductive loop is provided among first heat emission fan and the second heat emission fan, conductive loop internal sleeve is equipped with interior adapter ring, interior adapter ring surface is evenly arranged with radiation fin, and in the rectangular channel of radiation fin insertion conductive loop, conductive loop bosom is equipped with impeller, impeller is driven by shaft and is rotated, drive motor is connected at the top of shaft, shaft passes through drive motor and is connected with flabellum, and drive motor and flabellum are arranged in blower interior, pass through multi-level fan structure, it realizes in structure Multistage progressive air draft accelerate the efficiency of heat dissipation while by curved fins increasing heat radiation area.
Description
Technical field
The present invention relates to microelectronic device technical field, specially a kind of microelectronic device Special heat dissipating fan structure.
Background technique
Microelectric technique be with integrated circuit, especially Large Scale integrated circuit and grow up one it is new
Technology.Its theoretical basis developed is at the end of the 19th century to the modern physics set up during the 1930s, microelectronics
Technology includes that system circuit design, device physics, technology, material preparation, automatically test and encapsulation, assembling etc. are a series of
Special technology, microelectric technique are the summations of every technology in microelectronics, due to the small size of microelectronic device,
High-power running, so that very high heat is generated, and the excessively high operational efficiency for being easily reduced the microelectronic devices such as chip of heat,
It is easy burning apparatus simultaneously and mostly uses cooling fin to radiate greatly at this stage so that the heat dissipation to microelectronic device is most important, but dissipates
Thermal effect is poor, and the radiator cost of good heat dissipation is excessively high, and volume is larger, and installs complicated.
Summary of the invention
In order to overcome the shortcomings of that prior art, the present invention provide a kind of microelectronic device Special heat dissipating fan structure,
By transmitting heat dissipation at many levels, unique small-scale structure design effectively changes to reach and quickly fans heat, to space requirement
Small, installation is simple.
The technical solution adopted by the present invention to solve the technical problems is: a kind of microelectronic device Special heat dissipating fan knot
Structure, including bottom connecting plate, blower, the first heat emission fan and the second heat emission fan, the bottom connecting plate is mounted on the first heat emission fan bottom, described
First heat emission fan and the second heat emission fan are fixed together, and the first heat emission fan and the second heat emission fan junction are provided with the change of current
Gap, the assembling are provided with conduction among the top of the second heat emission fan, first heat emission fan and the second heat emission fan
Circle, the conductive loop internal sleeve are equipped with interior adapter ring, and the interior adapter ring surface is evenly arranged with radiation fin, and the radiation fin is embedded in
In the rectangular channel of conductive loop, the conductive loop bosom is equipped with impeller, and the impeller is driven by shaft and rotated, and described turn
Drive motor is connected at the top of axis, the shaft passes through drive motor and is connected with flabellum, and the drive motor and flabellum setting
In blower interior；
The conductive loop surface of first heat emission fan is evenly arranged with the fin A of arc, the conduction of second heat emission fan
Circle surface, which is evenly arranged in fin B, the fin A and fin B, is respectively provided with that there are four fixed fin, the fixed fin front ends
Riveting parts are provided with, spiral is connected with fixing screws in the riveting parts, and the bottom of the fixing screws is connected with bottom connecting plate,
Hollow layer cruciferous is arranged in the intermediate of the bottom connecting plate, and is provided with aperture plate, the top of the aperture plate at the top of the hollow layer
Portion and the first heat emission fan bottom link together.
As a kind of technical solution for having choosing of the present invention, the fin B of second heat emission fan is located at the phase of the first heat emission fan
The top center adjacent fin A position, and the fin B is identical with the quantity of fin A.
As a kind of technical solution for having choosing of the present invention, four fixed fins are uniformly mounted on conductive loop table respectively
Face, and the fixation fin of first heat emission fan and the second heat emission fan is located on same vertical line, the riveting of the fixed wings on piece
Fitting is overlapped, and the riveting parts are provided with internal screw thread.
As a kind of technical solution for having choosing of the present invention, the fin A at the change of current gap is provided with inside edge, and adjacent wing
The inside edge of piece A is folded to inside.
As a kind of technical solution for having choosing of the present invention, the rectangle of the conductive loop inner ring setting to match with radiation fin
Slot is twice of radiation fin.
As a kind of technical solution for having choosing of the present invention, the conductive loop, fin A and fin B are all made of aluminum metal material
Material, the interior adapter ring use copper metal material.
Compared with prior art, the beneficial effects of the present invention are: the present invention realizes structure by multi-level fan structure
The progressive air draft of interior multistage, while by curved fins increasing heat radiation area, accelerate the efficiency of heat dissipation, copper interior adapter ring
The heat of bottom connecting plate can faster be transmitted, and effectively and uniformly heat is carried out by radiation fin and is transmitted；Two layers heat emission fan
Connection structure greatly increases the surface velocity of fin so that blower realizes the variation of wind speed when carrying out exhausting, so that heat
Volatilization is faster.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention；
Fig. 2 is cross-sectional structural schematic diagram of the invention；
Fig. 3 is change of current gap structure schematic diagram of the invention；
Fig. 4 is inscribed coil structures schematic diagram of the invention.
In figure: the connecting plate of the bottom 1-；2- blower；The first heat emission fan of 3-；The second heat emission fan of 4-；31- fin A；32- inside edge；41-
Fin B；5- change of current gap；6- fixing screws；7- hollow layer；8- aperture plate；9- riveting parts；10- conductive loop；Adapter ring in 11-；12- leaf
Wheel；13- shaft；The inner cavity 14-；15- drive motor；16- flabellum；17- fixes fin；18- rectangular channel；111- radiation fin.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The explanation of following embodiment be with reference to attached drawing, can be to the specific embodiment implemented to the example present invention.
The direction and position term that the present invention is previously mentioned, for example, "upper", " in ", "lower", "front", "rear", "left", "right", "inner", "
Outside ", " side " etc. is only direction and position with reference to annexed drawings.Therefore, the direction and position term used is to illustrate
And understand the present invention, rather than to limit the present invention.
Embodiment:
As shown in Figure 1, Figure 2, Figure 3 and Figure 4, the present invention provides a kind of microelectronic device Special heat dissipating fan structure, packets
Bottom connecting plate 1, blower 2, the first heat emission fan 3 and the second heat emission fan 4 are included, the bottom connecting plate 1 is mounted on 3 bottom of the first heat emission fan, institute
It states the first heat emission fan 3 and the second heat emission fan 4 is fixed together, and the first heat emission fan 3 and the setting of 4 junction of the second heat emission fan
There is change of current gap 5, the blower 2 is mounted on the top of the second heat emission fan 4, and first heat emission fan 3 and 4 centre of the second heat emission fan are
It is provided with conductive loop 10,10 internal sleeve of conductive loop is equipped with interior adapter ring 11, and interior 11 surface of adapter ring is evenly arranged with radiation
Piece 111, and the radiation fin 111 is embedded in the rectangular channel 18 of conductive loop 10,10 bosom of conductive loop is equipped with impeller
12, the impeller 12 is rotated by the driving of shaft 13, is connected with drive motor 15 at the top of the shaft 13, the shaft 13 passes through
Drive motor 15 is connected with flabellum 16, and the drive motor 15 and flabellum 16 are arranged inside blower 2；
10 surface of conductive loop of first heat emission fan 3 is evenly arranged with the fin A31 of arc, second heat emission fan 4
10 surface of conductive loop be evenly arranged in fin B41, the fin A31 and fin B41 and be respectively provided with there are four fixed fin 17,
17 front end of fixed fin is provided with riveting parts 9, and spiral is connected with fixing screws 6, and the fixed spiral shell in the riveting parts 9
The bottom of nail 6 is connected with bottom connecting plate 1, and hollow layer 7 cruciferous is arranged in the intermediate of the bottom connecting plate 1, and the hollow layer 7 pushes up
Portion is provided with aperture plate 8, and the top and 3 bottom of the first heat emission fan of the aperture plate 8 link together, and hollow layer 7 can speed up bottom company
The air of plate surrounding flows, while accelerating the flow velocity of the wind of bottom connecting plate interior surface.
Preferably, four fixed fins 17 are uniformly mounted on 10 surface of conductive loop, and first heat dissipation respectively
Fan 3 and the fixation fin 17 of the second heat emission fan 4 are located on same vertical line, and the riveting parts 9 on the fixed fin 17 are overlapped, institute
It states riveting parts 9 and is provided with internal screw thread, mounted and dismounted by setting riveting parts convenient for the integrated connection of radiator structure；
The fin B41 of second heat emission fan 4 is located at the top center the adjacent fins A31 position of the first heat emission fan 3, and institute
State that fin B41 is identical with the quantity of fin A31, the fin A31 at the change of current gap 5 is provided with inside edge 32, and adjacent fins
The inside edge 32 of A31 is folded to inside；The rectangular channel 18 of 10 inner ring of the conductive loop setting to match with radiation fin 111 is radiation
Twice of piece 111；The conductive loop 10, fin A31 and fin B41 are all made of aluminum metal material, and the interior adapter ring 11 uses
Copper metal material can quickly be received the heat of bottom connecting plate by copper interior adapter ring, and pass through the poor heat conductivity of copper and aluminium
Away from forming that force is poor in the heat transmitting of interior adapter ring and conductive loop, thus the transmitting of accelerated heat, the inside edge of change of current gap makes wing
Gap between piece becomes smaller, and in blower work, the flow velocity that wind flows through change of current gap becomes faster, and increases the heat dissipation of fin surface.
The working principle of the invention by withstanding in microelectronic chip equipment bottom connecting plate admittedly by screw, and is connecting
Place is coated with heat conduction silicon layer, and drive motor drives the impeller in flabellum and interior adapter ring by shaft simultaneously, and realization is rotated coaxially, will be set
Air in standby sucks in interior adapter ring from hollow layer, and is blowed out by flabellum, while passing through the first heat emission fan and the second heat dissipation
The radiating surface of the fin A and fin B of fan, to realize the heat dissipation of microelectronic device.
In conclusion the main characteristic of the invention lies in that: the present invention is realized in structure by multi-level fan structure
Multistage progressive air draft, while by curved fins increasing heat radiation area, the efficiency of heat dissipation is accelerated, copper interior adapter ring can
The heat of bottom connecting plate is faster transmitted, and effectively and uniformly heat is carried out by radiation fin and is transmitted；The connection of two layers of heat emission fan
Structure greatly increases the surface velocity of fin so that blower realizes the variation of wind speed when carrying out exhausting, so that heat volatilizees
Faster.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
Claims (6)
1. a kind of microelectronic device Special heat dissipating fan structure, it is characterised in that: dissipated including bottom connecting plate (1), blower (2), first
Heat fan (3) and the second heat emission fan (4), the bottom connecting plate (1) are mounted on the first heat emission fan (3) bottom, first heat emission fan (3)
It is fixed together with the second heat emission fan (4), and the first heat emission fan (3) and the second heat emission fan (4) junction are provided with the change of current
Gap (5), the blower (2) are mounted on the top of the second heat emission fan (4), in first heat emission fan (3) and the second heat emission fan (4)
Between be provided with conductive loop (10), conductive loop (10) internal sleeve is equipped with interior adapter ring (11), and interior adapter ring (11) surface is equal
It is even to be provided with radiation fin (111), and in the rectangular channel (18) of the radiation fin (111) insertion conductive loop (10), the conductive loop
(10) bosom is equipped with impeller (12), and the impeller (12) passes through shaft (13) driving rotation, shaft (13) top
It is connected with drive motor (15), the shaft (13) passes through drive motor (15) and is connected with flabellum (16), and the drive motor
(15) and flabellum (16) setting is internal in blower (2)；
Conductive loop (10) surface of first heat emission fan (3) is evenly arranged with the fin A(31 of arc), second heat emission fan
(4) conductive loop (10) surface is evenly arranged with fin B(41), the fin A(31) and fin B(41) in be respectively provided with there are four
Fixed fin (17), fixed fin (17) front end are provided with riveting parts (9), and spiral is connected with solid in the riveting parts (9)
Determine screw (6), and the bottom of the fixing screws (6) is connected with bottom connecting plate (1), the centre of the bottom connecting plate (1) is provided with ten
The hollow layer (7) of font, and be provided with aperture plate (8) at the top of the hollow layer (7), the top of the aperture plate (8) and the first heat dissipation
Fan (3) bottom links together.
2. a kind of microelectronic device Special heat dissipating fan structure according to claim 1, it is characterised in that: described second dissipates
The fin B(41 of heat fan (4)) it is located at the adjacent fins A(31 of the first heat emission fan (3)) top center position, and the fin B
(41) identical with the quantity of fin A(31).
3. a kind of microelectronic device Special heat dissipating fan structure according to claim 1, it is characterised in that: four described solid
Determine fin (17) and be uniformly mounted on conductive loop (10) surface respectively, and first heat emission fan (3) and the second heat emission fan (4) are consolidated
Determine fin (17) to be located on same vertical line, the riveting parts (9) on the fixed fin (17) are overlapped, and the riveting parts (9) set
It is equipped with internal screw thread.
4. a kind of microelectronic device Special heat dissipating fan structure according to claim 1, it is characterised in that: the change of current gap
(5) the fin A(31 at) be provided with inside edge (32), and adjacent fins A(31) inside edge (32) be folded to inside.
5. a kind of microelectronic device Special heat dissipating fan structure according to claim 4, it is characterised in that: the conductive loop
(10) rectangular channel (18) of inner ring setting to match with radiation fin (111) is twice of radiation fin (111).
6. a kind of microelectronic device Special heat dissipating fan structure according to claim 1, it is characterised in that: the conductive loop
(10), fin A(31) and fin B(41) it is all made of aluminum metal material, the interior adapter ring (11) uses copper metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710726950.6A CN107620718B (en) | 2017-08-23 | 2017-08-23 | A special cooling fan structure for microelectronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710726950.6A CN107620718B (en) | 2017-08-23 | 2017-08-23 | A special cooling fan structure for microelectronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107620718A CN107620718A (en) | 2018-01-23 |
| CN107620718B true CN107620718B (en) | 2019-04-09 |
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ID=61088842
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710726950.6A Active CN107620718B (en) | 2017-08-23 | 2017-08-23 | A special cooling fan structure for microelectronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107620718B (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5785116A (en) * | 1996-02-01 | 1998-07-28 | Hewlett-Packard Company | Fan assisted heat sink device |
| US20020090308A1 (en) * | 2001-01-10 | 2002-07-11 | Jui-Hung Cheng | Heat dissipation device having passive fan |
| TW200928113A (en) * | 2007-12-26 | 2009-07-01 | Delta Electronics Inc | Heat dissipation module and fan thereof |
| CN102022362B (en) * | 2009-09-18 | 2014-01-22 | 鸿富锦精密工业（深圳）有限公司 | Radiating fan module |
| DE102010060261B3 (en) * | 2010-10-29 | 2011-11-10 | Institut für Luft- und Kältetechnik gemeinnützige Gesellschaft mbH | CPU cooler |
| CN205297965U (en) * | 2015-12-16 | 2016-06-08 | 东莞市同裕电子有限公司 | Heat dissipation device |
-
2017
- 2017-08-23 CN CN201710726950.6A patent/CN107620718B/en active Active
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| Publication number | Publication date |
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| CN107620718A (en) | 2018-01-23 |
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