CN107591420B - Sensor Package Structure - Google Patents

Abstract

A sensor packaging structure includes: a substrate, a sensing chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensing chip, a light-transmitting layer corresponding to the position of the sensing chip, and an adhesive body capable of stably bonding the light-transmitting layer to the sensing chip and the substrate. The top surface of the sensing chip away from the substrate contains a sensing area and a spacing area surrounding the sensing area, and the top surface has at least one first edge and at least one second edge, and the distance between the first edge and the spacing area is greater than the distance between the second edge and the spacing area. The sensing chip has a plurality of connection pads formed between the first edge of the top surface and the spacing area, and no connection pads are formed between the second edge and the spacing area. The adhesive body covers the outer edge of the sensing chip, the top surface portion between the first edge and the spacing area, and the outer edge of the light-transmitting layer, and at least part of each metal wire is buried in the adhesive body. Thereby, the sensor packaging structure can be used to package sensing chips of smaller sizes.

Description

Sensor Package Structure

technical field

The present invention relates to a package structure, and also relates to a sensor package structure.

Background technique

The electronic components in the existing electronic devices need to be developed in the direction of downsizing, so that the electronic devices can install more electronic components in a limited space. However, the development of existing sensor packaging structures (eg, image sensor packaging structures) has faced the problem that it is difficult to continue to reduce the size, and one of the main reasons is that the existing sensor packaging structures are not suitable for Packaging for smaller size sensing chips.

Therefore, the inventors of the present invention believe that the above-mentioned defects can be improved, and have concentrated on research and application of theories, and finally come up with the present invention with a reasonable design and effectively improving the above-mentioned defects.

SUMMARY OF THE INVENTION

The embodiments of the present invention provide a sensor package structure, which can effectively improve the problems that are likely to occur in the existing sensor package structure by being different from the conventional structure.

An embodiment of the present invention discloses a sensor package structure, comprising: a substrate, the substrate includes an upper surface and a lower surface on opposite sides, and a plurality of solder pads are formed on the upper surface of the substrate; a sensing chip, the sensing chip includes a top surface and a bottom surface on opposite sides, the bottom surface of the sensing chip is disposed on the upper surface of the substrate, the top surface includes a A sensing area and a spacer area surrounding the sensing area; wherein the top surface has at least one first edge and at least one second edge, and the sensing chip is at least one of the top surface A plurality of connection pads are formed between the first edge and the spacer, and no connection pad is formed between at least one of the second edges and the spacer; a plurality of metal lines, a plurality of the metal One end of the wire is respectively connected to the plurality of the bonding pads, and the other end of the plurality of the metal wires is respectively connected to the plurality of the connection pads; a first bonding layer, the first bonding layer is arranged on at least one of the bonding pads. On the top surface portion between the first edge and the spacer; a second bonding layer, the second bonding layer is disposed on the upper surface and adjacent to at least one of the sensing chips Next to the second edge, the height of the second bonding layer relative to the upper surface is equal to the height of the first bonding layer relative to the upper surface; a light-transmitting layer, the light-transmitting layer has a first surface and a second surface on opposite sides, the second surface of the light-transmitting layer is bonded to the first bonding layer and the second bonding layer; and an encapsulant, the The encapsulant is disposed on the upper surface of the substrate and covers the outer edge of the sensing chip, the outer edge of the first bonding layer, the outer edge of the second bonding layer, and the outer edge of the light-transmitting layer, At least part of each of the metal lines and each of the solder pads are embedded in the encapsulant.

Preferably, the outer edge of the first bonding layer includes an arc-shaped curved surface, and the arc center of the arc-shaped curved surface is located on the sealing compound.

Preferably, in a section perpendicular to the upper surface, the outer edge of the second bonding layer is an S-shaped curve.

Preferably, the distance between the outer edge of the second bonding layer and the sensing area is equal to the distance between at least one of the first edges and the sensing area.

Preferably, the second bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacer region.

Preferably, the area of the top surface portion between at least one of the second edges and the spacer is smaller than the area of the spacer portion to which it is connected.

Preferably, the distance between at least one of the first edges and the spacer area is greater than the distance between at least one of the second edges and the spacer area.

Preferably, the sensing chip is projected on the second surface to form a projection area, and the projection area is located within the outline of the second surface; the second surface is adhered to the first surface. A fixing area is left on the outer side of the part of the first bonding layer and the second bonding layer, and the sealing compound further covers the fixing area.

Preferably, the encapsulant is further defined as a liquid encapsulant, and the first surface of the light-transmitting layer and the adjacent surface of the encapsulant form an included angle greater than 90 degrees and less than or equal to 180 degrees .

Preferably, the sensor packaging structure further includes a molding compound disposed on the top edge of the sealing compound, and the top surface of the molding compound is arranged in parallel with the adjacent first surface, and the The side surface of the molding compound and the adjacent side edges of the encapsulant are arranged coplanarly.

Preferably, the sealing compound is further defined as a molding compound, and the first surface of the light-transmitting layer and the adjacent surface of the sealing compound form an included angle of 180 degrees.

An embodiment of the present invention also discloses a sensor package structure, wherein the sensor package structure includes: a substrate, the substrate includes an upper surface and a lower surface on opposite sides, and the substrate A plurality of bonding pads are formed on the upper surface; a sensing chip includes a top surface and a bottom surface on opposite sides, and the bottom surface of the sensing chip is disposed on the substrate The upper surface of the top surface includes a sensing area and a spacer area surrounding the sensing area; wherein, the top surface has at least one first edge and at least one second edge, and at least one The distance between the first edge and the spacer is greater than the distance between at least one of the second edges and the spacer, and at least one of the first edges and the space of the sensing chip on the top surface A plurality of connection pads are formed between the regions, and no connection pads are formed between at least one of the second edges and the spacer region; a plurality of metal lines, one end of the plurality of metal lines is respectively connected to the plurality of the bonding pads, and the other ends of the plurality of metal lines are respectively connected to the plurality of connection pads; a light-transmitting layer, the light-transmitting layer has a first surface and a second surface on opposite sides , the second surface of the light-transmitting layer faces the top surface of the sensing chip; and an adhesive body, the adhesive body is disposed on the upper surface of the substrate and covers The outer edge of the sensing chip, the top surface portion between at least one of the first edges and the spacer region, the outer edge of the light-transmitting layer and part of the second surface, and each of the At least part of the metal lines and each of the pads are embedded in the adhesive body.

Preferably, the adhesive body includes: a support layer, the support layer is adjacent to at least one of the second edges of the sensing chip, and is far away from the end edge of the support layer and the support layer of the substrate. The top surface of the sensing chip is of the same height; a bonding layer, the bonding layer is disposed on the support layer and the top surface portion between at least one of the first edges and the spacer, so The second surface of the light-transmitting layer is adhered to the bonding layer; an encapsulant body, the encapsulant body is disposed on the upper surface of the substrate and covers the outer edge of the sensing chip, the support The outer edge of the layer, the outer edge of the bonding layer, and the outer edge of the light-transmitting layer, and at least part of each of the metal lines and each of the solder pads are embedded in the encapsulant.

Preferably, the outer edge of the support layer includes an arc-shaped side surface, and the arc center of the arc-shaped side surface is located inside the sealing compound.

Preferably, the outer edge of the bonding layer includes an arc-shaped curved surface, and the arc center of the arc-shaped curved surface is located on the sealing compound.

Preferably, the distance between the outer edge of the bonding layer and the sensing area is equal to the distance between at least one of the first edges and the sensing area.

Preferably, the bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacer region.

Preferably, the area of the top surface portion between at least one of the second edges and the spacer is smaller than the area of the spacer portion to which it is connected.

Preferably, the sensing chip is projected on the second surface to form a projected area, and the projected area is located within the outline of the second surface; the second surface is being bonded to the bonding A fixing area is left outside the part of the layer, and the encapsulant body further covers the fixing area.

To sum up, the sensor package structure disclosed in the present invention can be applied to a sensor chip without connecting pads between the top surface edge (eg, the second edge) and the sensing area, so as to facilitate the reduction of the package size the sensor chip behind.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and accompanying drawings are only used to illustrate the present invention, rather than to the protection scope of the present invention make any restrictions.

Description of drawings

FIG. 1 is a schematic cross-sectional view of a first embodiment of a sensor package structure according to the present invention.

FIG. 2 is a schematic top view of FIG. 1 (the encapsulant, the light-transmitting layer, and the metal wires are omitted).

FIG. 3 is a schematic top view of FIG. 1 (the encapsulant is omitted).

FIG. 4 is another schematic top view of FIG. 1 (the encapsulant is omitted).

FIG. 5A is a partial enlarged schematic diagram of the area A of FIG. 1 .

FIG. 5B is a schematic diagram of a variation of FIG. 5A .

FIG. 6 is a partial enlarged schematic diagram of the B region of FIG. 1 .

FIG. 7 is a schematic cross-sectional view of the variation of FIG. 1 .

FIG. 8 is a schematic cross-sectional view of another variation of FIG. 1 .

FIG. 9 is a schematic cross-sectional view of another variation of FIG. 1 .

FIG. 10 is a schematic cross-sectional view of Embodiment 2 of the sensor package structure of the present invention.

FIG. 11 is a schematic top view of Embodiment 3 of the sensor package structure of the present invention.

FIG. 12 is a schematic cross-sectional view along the line XII-XII of FIG. 11 .

Detailed ways

[Example 1]

Please refer to FIG. 1 to FIG. 9 , which are the first embodiment of the present invention. It should be noted that the relevant quantity and appearance mentioned in the drawings in this embodiment are only used to specifically describe the embodiments of the present invention. , so as to facilitate understanding of the present invention, but not to limit the protection scope of the present invention.

As shown in FIG. 1 and FIG. 2 , the present embodiment discloses a sensor package structure 100 , especially an image sensor package structure 100 , but the present invention is not limited thereto. The sensor package structure 100 includes: a substrate 1 , a sensing chip 2 disposed on the substrate 1 , a plurality of metal wires 3 for establishing electrical connection between the substrate 1 and the sensing chip 2 , and a position corresponding to the sensing chip 2 . A light-transmitting layer 4 of the sensing chip 2 and a bonding body 5 that can stably adhere the light-transmitting layer 4 to the sensing chip 2 and the substrate 1 . The structure of each component in the sensor package structure 100 will be introduced separately below, and the connection relationship between the components will be described in a timely manner.

As shown in FIG. 1 and FIG. 2 , the substrate 1 may be a plastic substrate, a ceramic substrate, a leadframe, or other plate-like materials, which are not limited in this embodiment. The above-mentioned substrate 1 includes an upper surface 11 and a lower surface 12 located on opposite sides, and the substrate 1 is formed with a plurality of bonding pads 111 arranged at intervals on the upper surface 11 . Furthermore, a plurality of solder pads (not shown) are also formed on the lower surface 12 of the substrate for soldering a plurality of solder balls (not shown) respectively. That is to say, the substrate 1 of this embodiment is described as having a structure of a ball grid array (Ball Grid Array, BGA), but it is not limited thereto.

As shown in FIG. 1 and FIG. 2 , the sensing chip 2 is described as an image sensing chip in this embodiment, but the type of the sensing chip 2 is not limited in this embodiment. The sensing chip 2 includes a top surface 21 and a bottom surface 22 on opposite sides, and an outer edge 23 vertically connected to the top surface 21 and the bottom surface 22 . The top surface 21 includes a sensing area 211 and a spacer area 212 surrounding the sensing area 211 . The sensing area 211 is substantially square (eg, square or rectangle) in this embodiment, and the center of the sensing area 211 may be the center of the top surface 21 (as shown in FIG. distance (see Figures 2 and 3). The spacer 212 is in the shape of a square ring in this embodiment, and the width of each part of the spacer 212 is approximately the same, but the specific shape of the spacer 212 can be adjusted according to the needs of the designer or manufacturer. , is not limited here.

Further, the top surface 21 has at least one first edge 213 and at least one second edge 214 , and the outer edge 23 includes at least one side surface 231 connected to the at least one second edge 214 . The distance D1 between the first edge 213 and the spacer 212 (as shown in FIG. 6 ) is greater than the distance D2 between the second edge 214 and the spacer 212 (as shown in FIG. 5A ). In this embodiment, the distance D2 between the second edge 214 and the sensing area 211 is smaller than 1/3 to 1/4 of the distance D1 between the first edge 213 and the sensing area 211 (D2<1/3˜1 /4D1), but the above-mentioned proportional design of the distance D2 and the distance D1 can be adjusted according to the needs of the designer or manufacturer, which is not limited here. The sensing chip 2 has a plurality of connection pads 215 formed between the first edge 213 of the top surface 21 and the spacer region 212 , and no connection pad 215 is formed between the second edge 214 and the spacer region 212 .

The top surface 21 may include multiple first edges 213 and a single second edge 214 (as shown in FIG. 3 ), multiple first edges 213 and multiple second edges 214 (as shown in FIG. 4 ), or A single first edge 213 and a plurality of second edges 214 (not shown in the figure) are not limited herein. That is, FIG. 1 corresponds to a schematic cross-sectional view along the line IA-IA in FIG. 3 , or a schematic cross-sectional view along the line IB-IB in FIG. 4 .

Furthermore, the sensing chip 2 is disposed on the upper surface 11 of the substrate 1 with the bottom surface 22 , and the part of the upper surface 11 of the substrate 1 on which the sensing chip 2 is disposed is substantially located in the area surrounded by the plurality of bonding pads 111 within. The bottom surface 22 of the sensing chip 2 in this embodiment is fixed to the upper surface 11 of the substrate 1 by die attach adhesive (Die Attach Epoxy, not shown), but the specific arrangement is not limited thereto.

As shown in FIG. 1 and FIG. 2 , one ends of the plurality of metal wires 3 are respectively connected to the plurality of bonding pads 111 of the substrate 1 , and the other ends of the plurality of metal wires 3 are respectively connected to the plurality of connections of the sensing chip 2 . Pad 215. Wherein, each metal line 3 in this embodiment is formed in a reverse bond manner, so the top surface 21 of the above-mentioned sensing chip 2 is adjacent to each metal line 3 (as shown in FIG. 1 at the top surface 21 ). The metal wire 3 part above the top surface 21) can be formed with an included angle (not marked) less than or equal to 45 degrees, so that the vertex 31 of each metal wire 3 can be located at a lower height position, thereby avoiding touching The light-transmitting layer 4, but the present invention is not limited to this. For example, the above-mentioned included angle may also be less than or equal to 30 degrees.

As shown in FIG. 1 and FIG. 2 , the light-transmitting layer 4 is illustrated as a flat glass in this embodiment, but the type of the light-transmitting layer 4 is not limited in this embodiment. The transparent layer 4 has a first surface 41 and a second surface 42 on opposite sides, and an outer edge 43 vertically connected to the first surface 41 and the second surface 42 . In this embodiment, the first surface 41 and the second surface 42 are squares (eg, square or rectangle) with the same size, and the area of the second surface 42 of the light-transmitting layer 4 is larger than the area of the top surface 21 of the above-mentioned sensing chip 2 , but not limited to this.

Furthermore, the light-transmitting layer 4 is fixed to the substrate 1 and the sensing chip 2 by the adhesive 5 , and the second surface 42 of the light-transmitting layer 4 is substantially parallel and faces the top surface of the sensing chip 2 twenty one. Further, the sensing chip 2 is projected on the second surface 42 to form a projection area (not shown), and the projection area is located within the outline of the second surface 42 . In addition, the second surface 42 of the light-transmitting layer 4 is preferably adjacent but not in contact with each metal line 3 , and the vertex 31 of each metal line 3 is formed by the orthographic projection of the light-transmitting layer 4 toward the substrate 1 . On the outer side of the space, the height H1 of the vertex 31 of each metal line 3 relative to the top surface 21 of the sensing chip 2 (as shown in FIG. 6 ) is preferably smaller than the second surface 42 of the light-transmitting layer 4. The height H2 of the top surface 21 of the chip 2 (as shown in FIG. 6 ) is not limited thereto.

As shown in FIGS. 1 , 5A and 6 , the adhesive body 5 may be a single component of the same material or a composite component composed of multiple materials, and the type of the adhesive body 5 is not limited in this embodiment. The bonding body 5 is disposed on the upper surface of the substrate 1 and covers the outer edge 23 of the sensing chip 2 , the top surface 21 between the first edge 213 and the spacer 212 , and the light transmission The outer edge 43 of the layer 4 and part of the second surface 42 . At least part of each metal line 3 and each pad 111 are embedded in the above-mentioned adhesive body 5 .

More specifically, the adhesive body 5 of this embodiment includes a support layer 51 , a bonding layer 52 , and an encapsulant 53 connected to each other, but the present invention is not limited thereto. The supporting layer 51 and the bonding layer 52 are preferably made of the same material (eg, glass bonding resin, Glass Mount Epoxy), but different from the material of the encapsulant 53 (eg, liquid compound). The connection relationship between the support layer 51 , the bonding layer 52 , and the encapsulant 53 with respect to other components will be described below.

As shown in FIG. 2 and FIG. 5A , the shape and formation position of the support layer 51 in this embodiment are related to the second edge 214 of the top surface 21 of the sensing chip 2 . For example, the support layer 51 shown in FIG. 3 is a single elongated structure substantially parallel to the second edge 214 , and the support layer 51 shown in FIG. 4 is two elongated structures substantially parallel to the second edge 214 structure. The support layer 51 is adjacent to the second edge 214 of the sensing chip 2 (eg, the support layer 51 abuts against the side surface 231 of the sensing chip 2 connected to the second edge 214 ), and is far away from the substrate The end edge of the support layer 51 of 1 (the top edge of the support layer 51 in FIG. 5A ) is approximately the same height as the top surface 21 (or the second edge 214 ) of the sensing chip 2 .

Further, the outer edge 511 of the support layer 51 includes an arc-shaped side surface 511 , and the arc center (not marked) of the arc-shaped side surface 511 is located inside the sealing compound 53 (eg, the arc center is located in the support layer 51 ) , but not limited to this. For example, as shown in FIG. 5B , the arc center (not shown) of the arc-shaped side surface 511 may also be located at the sealing compound 53 .

As shown in FIG. 2 , FIG. 5A , and FIG. 6 , the bonding layer 52 is substantially in the shape of a square ring, and the ring inner edge of the bonding layer 52 is preferably connected to the outer edge of the spacer 212 of the sensing chip 2 . That is, the spacer area 212 is a predetermined reserved area for separating the bonding layer 52 and the sensing area 211 . The bonding layer 52 is disposed on the support layer 51 and the top surface 21 between the first edge 213 and the spacer 212, and is disposed on the bonding layer 52 on the support layer 51 (as shown in FIG. 5A ). ) may be further disposed on the top surface 21 portion between the second edge 214 and the spacer 212 . The area of the top surface 21 between the second edge 214 and the spacer 212 is preferably smaller than the area of the spacer 212 to which the second edge 214 is connected. To put it another way, in a not-shown embodiment, when the portion of the bonding layer 52 disposed on the support layer 51 is not disposed on the top surface 21 of the sensing chip 2, the first The two edges 214 correspond to the outer edges of the spacer 212 .

Further, the width and height of the bonding layer 52 portion (as shown in FIG. 5A ) provided on the support layer 51 are approximately equal to the bonding portion provided on the top surface 21 between the first edge 213 and the spacer 212 . The width and height of the layer 52 portion (FIG. 6). The outer edge 521 of the bonding layer 52 includes an arc-shaped curved surface 521 , and the arc center of the arc-shaped curved surface 521 is located at the sealing compound 53 . The maximum distance D3 between the curved surface 521 of the bonding layer 52 and the sensing area 211 (as shown in FIG. 5A ) is preferably approximately equal to the distance D4 between the first edge 213 and the sensing area 211 (as shown in FIG. 6 ). Wherein, on the cross section of the sensor package structure 100 perpendicular to the upper surface 11 of the substrate 1 (as shown in FIG. 5A ), the arc-shaped side surface 511 of the support layer 51 is connected to the arc-shaped surface 521 of the bonding layer 52 to form S-shaped curve, but the present invention is not limited to this (as shown in FIG. 5B ).

Furthermore, a portion of each metal wire 3 is embedded in the bonding layer 52 , that is, each connection pad 215 and the local metal wire 3 connected thereto are embedded in the bonding layer in this embodiment. within 52. However, in a not-shown embodiment, the connection pads 215 and the local metal lines 3 connected thereto may not need to be embedded in the bonding layer 52 .

In addition, as shown in FIG. 1 , the second surface 42 of the light-transmitting layer 4 is bonded to the bonding layer 52 , so that the second surface 42 of the light-transmitting layer 4 , the bonding layer 52 , and the top surface 21 of the sensing chip 2 share the same A closed space 6 is formed around it, and the sensing area 211 of the sensing chip 2 is located in the closed space 6 . Wherein, the second surface 42 has a square ring-shaped fixing area 421 at the outer side of the part that is adhered to the bonding layer 52 .

As shown in FIG. 1 , FIG. 5A , and FIG. 6 , the encapsulant 53 is disposed on the upper surface 11 of the substrate 1 and covers the outer edge 23 of the sensing chip 2 , the outer edge 511 of the support layer 51 , and the outer edge 521 of the bonding layer 52 , and the outer edge 43 and the fixed area 421 of the light-transmitting layer 4 . At least part of each metal line 3 and each pad 111 are embedded in the encapsulant 53 . In this embodiment, each metal line 3 is embedded in the encapsulant 53 and the bonding layer 52 respectively, and the vertex 31 of each metal line 3 is embedded in the encapsulant 53 . However, in a non-illustrated embodiment, each metal line 3 can also be completely embedded in the encapsulant 53 .

较佳是介于115度至150度。而所述封胶体53侧缘则大致切齐于基板1的侧缘。其中，本实施例中的封胶体53虽是以未附着在透光层4的第一表面41作说明，但本发明不排除封胶体53附着在上述透光层4的局部第一表面41(如：第一表面41的外缘部位)。In more detail, the first surface 41 of the light-transmitting layer 4 and the surface of the adjacent sealing compound 53 (such as the top edge of the sealing compound 53 in FIG. 1 ) form an included angle greater than 90 degrees and less than or equal to 180 degrees the included angle

Preferably, it is between 115 degrees and 150 degrees. The side edges of the encapsulant body 53 are substantially aligned with the side edges of the substrate 1 . Wherein, although the encapsulant 53 in this embodiment is described as being not attached to the first surface 41 of the light-transmitting layer 4, the present invention does not exclude that the encapsulant 53 is attached to the partial first surface 41 ( For example: the outer edge of the first surface 41).

To sum up, the sensor package structure 100 disclosed in this embodiment can be applied to a sensing chip without connecting pads 215 between the edge of the top surface 21 (eg, the second edge 214 ) and the sensing region 211 . 2, in order to facilitate the sensing chip 2 after the package size is reduced. In addition, the sensor package structure 100 can also be beneficial to the sensor chip 2 with a reduced package size by partially burying the metal wire 3 in the bonding layer 52 .

Furthermore, the encapsulant body 53 is adhered to the curved side surface 511 of the support layer 51 and the curved surface 521 of the bonding layer 52 , and the outer edge 43 and the fixing region 421 of the light-transmitting layer 4 , so that the light-transmitting layer 4 It is more stably arranged at a predetermined position, so that the light-transmitting layer 4 does not contact the metal wire 3, so that the light-transmitting layer 4 is approximately parallel to the top surface 21 of the sensor chip 2, so that the sensor package structure is 100 has better reliability.

In addition, the supporting layer 51 is first fabricated in one process, and then the bonding layer 52 is fabricated in another process, so the reduced portion of the sensing chip 2 (eg, the sensing area 211 and the first part) can be filled by the supporting layer 51 . The portion between the two edges 214 ), so as to provide enough space for the bonding layer 52 to prevent the bonding layer 52 from crossing the spacer region 212 and contacting the sensing region 211 .

In addition, the sensor package structure 100 disclosed in FIG. 1 to FIG. 6 in this embodiment can also be adjusted according to the needs of the designer, but because the sensor package structure 100 of this embodiment has too many changes, it cannot be passed through one by one. The drawings are disclosed, so the following only lists some variations of the sensor package structure 100 .

As shown in FIG. 7 , the outer edge 43 of the transparent layer 4 is stepped and embedded in the sealing compound 53 , and the area of the first surface 41 of the transparent layer 4 is smaller than that of the second surface 42 . area. However, in an embodiment not shown, it is not excluded that the area of the first surface 41 is larger than that of the second surface 42 .

As shown in FIG. 8 , the bonding body 5 of the sensor package structure 100 may further include a molding compound 54 . The molding compound 54 is disposed on the top edge of the sealing compound 53 , and the top surface of the molding compound 54 is substantially parallel to the first surface 41 of the adjacent light-transmitting layer 4 , and the molding compound 54 The side surfaces of the s and the adjacent side edges of the sealing compound 53 are coplanar, but not limited thereto. Furthermore, the top surface of the molding colloid 54 and the adjacent first surface 41 of the light-transmitting layer 4 may be substantially coplanar, but the invention is not limited thereto.

As shown in FIG. 9 , the sealing compound 53 may be a molding compound 54 , and the first surface 41 of the light-transmitting layer 4 and the surface of the adjacent sealing compound 53 are arranged approximately parallel to each other, preferably formed approximately 180 mm angle

[Example 2]

Please refer to FIG. 10 , which is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the same parts will not be repeated. The layer 51 can be replaced by the first bonding layer 55 and the second bonding layer 56 of this embodiment, that is, the supporting layer 51 of the first embodiment and the bonding layer 52 disposed thereon (as shown in FIG. 5A ) are in this embodiment. In the example, one process is used and is defined as the second bonding layer 56 , while the rest of the bonding layer 52 in the first embodiment (as shown in FIG. 6 ) is manufactured by another process and is defined as the first in this embodiment. The bonding layer 55, but the present invention is not limited to this. The specific structural differences between this embodiment and the first embodiment are roughly described as follows.

The first bonding layer 55 is disposed on the top surface 21 between the first edge 213 and the spacer 212, and the second bonding layer 56 is disposed on the upper surface 11 of the substrate 1 and adjacent to the sensor. Next to the second edge 214 of the sensor chip 2 (eg, the second bonding layer 56 is in contact with the side surface 231 of the sensor chip 2 ). The second bonding layer 56 may be further disposed on the top surface 21 portion between the second edge 214 and the spacer 212 , and the top surface 21 portion between the second edge 214 and the spacer 212 The area is smaller than the area of the spacer 212 to which it is connected. The height of the top edge of the second bonding layer 56 relative to the upper surface 11 of the substrate 1 is approximately equal to the height of the top edge of the first bonding layer 55 relative to the upper surface 11 of the substrate 1 .

Furthermore, the maximum distance between the outer edge 561 of the upper half block of the second bonding layer 56 and the sensing area 211 is approximately equal to the distance between the first edge 213 and the sensing area 211 . The outer edge 551 of the first bonding layer 55 includes an arc-shaped side surface 551 , and the arc center of the arc-shaped side surface 551 is located at the sealing compound 53 . On the cross section of the sensor package structure 100 perpendicular to the upper surface 11 of the substrate 1 , the outer edge of the second bonding layer 56 is an S-shaped curve, but not limited thereto (as shown in FIG. 5B ).

The second surface 42 of the transparent layer 4 is bonded to the first bonding layer 55 and the second bonding layer 56 ; and the second surface 42 is bonded to the first bonding layer 55 and the second bonding layer 56 A fixing area 421 is left on the outside of the site.

The encapsulant 53 is disposed on the upper surface 11 of the substrate 1 and covers the outer edge 23 of the sensing chip 2 , the outer edge 551 of the first bonding layer 55 , the outer edge 561 of the second bonding layer 56 , and the transparent The outer edge 43 of the optical layer 4 and the fixing region 421 , and a portion of each metal line 3 and each bonding pad 111 are embedded in the encapsulant 53 .

[Example 3]

Please refer to FIG. 11 and FIG. 12 , which are Embodiment 3 of the present invention. This embodiment is similar to Embodiment 1 above, and the same parts will not be repeated, and the main difference between the two is: the sensor of this embodiment The package structure 100 does not need to be provided with any supporting layer 51 , that is, the edges of the top surface 21 of the sensing chip 2 in this embodiment are all the first edges 213 .

It should be noted that the dimensions of the sensor package structure 100 of the above three embodiments can be reduced in many parts. For example, as shown in FIG. 12 , the outer edge 43 of the transparent layer 4 and the phase The distance D5 between the side edges of the adjacent encapsulation bodies 53 is approximately 300 μm˜500 μm, and the maximum distance D6 between the outer edge of any pad 111 of the substrate 1 and the outer edge 23 of the adjacent sensing chip 2 is approximately 200 μm ˜350 μm, the distance D7 between the outer edge 23 of the sensing chip 2 adjacent to any one of the bonding pads 111 and the adjacent side edge of the encapsulant body 53 is approximately 225 μm˜425 μm. Therefore, the size of the sensor package structure 100 is smaller than that of the prior art, and a smaller amount of the encapsulant 53 can be used. The thermal expansion and contraction stress are reduced, and the reliability is improved.

The above descriptions are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the present invention. All equivalent changes and modifications made according to the claims of the present invention shall belong to the protection scope of the present invention.

Claims (16)

1. A sensor package, comprising:

the substrate comprises an upper surface and a lower surface which are positioned on two opposite sides, and a plurality of welding pads are formed on the upper surface of the substrate;

a sensing chip, wherein the sensing chip comprises a top surface and a bottom surface which are positioned at two opposite sides, the bottom surface of the sensing chip is arranged on the upper surface of the substrate, and the top surface comprises a sensing region and a spacing region which surrounds the sensing region; the top surface is provided with at least one first edge and at least one second edge, a plurality of connecting pads are formed between the at least one first edge of the top surface and the spacing area of the sensing chip, and no connecting pad is formed between the at least one second edge and the spacing area;

one end of each metal wire is connected to the corresponding welding pad, and the other end of each metal wire is connected to the corresponding connecting pad;

a first bonding layer disposed on the top surface portion between at least one of the first edges and the spacer region;

a second bonding layer disposed on the upper surface and adjacent to at least one of the second edges of the sensing chip, wherein a height of the second bonding layer relative to the upper surface is equal to a height of the first bonding layer relative to the upper surface;

the light-transmitting layer is provided with a first surface and a second surface which are positioned at two opposite sides, and the second surface of the light-transmitting layer is adhered to the first bonding layer and the second bonding layer; and

the sealing colloid is arranged on the upper surface of the substrate and covers the outer edge of the sensing chip, the outer edge of the first bonding layer, the outer edge of the second bonding layer and the outer edge of the light-transmitting layer, and at least part of each metal wire and each welding pad are embedded in the sealing colloid;

the outer edge of the first bonding layer comprises an arc-shaped curved surface, and the arc center of the arc-shaped curved surface is positioned on the sealing colloid.

2. The sensor package structure of claim 1, wherein the outer edge of the second bonding layer is S-shaped in a cross-section perpendicular to the upper surface.

3. The sensor package structure of claim 1, wherein the outer edge of the second bonding layer is a distance from the sensing region equal to a distance of at least one of the first edges from the sensing region.

4. The sensor package structure of claim 1, wherein the second bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacers.

5. The sensor package structure of claim 4, wherein an area of the top surface portion between at least one of the second edges and the spacers is smaller than an area of the spacer portion to which it is connected.

6. The sensor package structure of any one of claims 1-5, wherein at least one of the first edges is farther from the spacers than at least one of the second edges.

7. The sensor package structure of any one of claims 1 to 5, wherein the sensing chip is orthographically projected onto the second surface to form a projected area, and the projected area is located within a contour of the second surface; and a fixing area is reserved on the outer side of the part of the second surface, which is adhered to the first bonding layer and the second bonding layer, and the fixing area is further coated by the sealing colloid.

8. The sensor package structure of any one of claims 1 to 5, wherein the encapsulant is further defined as a liquid encapsulant, and an included angle between the first surface of the transparent layer and the adjacent surface of the encapsulant is greater than 90 degrees and less than or equal to 180 degrees.

9. The sensor package of claim 8, further comprising a molding compound disposed at a top edge of the molding compound, wherein a top surface of the molding compound is parallel to the adjacent first surface, and a side surface of the molding compound is coplanar with an adjacent side edge of the molding compound.

10. The sensor package structure as recited in any one of claims 1 to 5, wherein the encapsulant is further defined as a molding encapsulant, and the first surface of the transparent layer forms an angle of 180 degrees with an adjacent surface of the encapsulant.

11. A sensor package, comprising:

the substrate comprises an upper surface and a lower surface which are positioned on two opposite sides, and a plurality of welding pads are formed on the upper surface of the substrate;

a sensing chip, wherein the sensing chip comprises a top surface and a bottom surface which are positioned at two opposite sides, the bottom surface of the sensing chip is arranged on the upper surface of the substrate, and the top surface comprises a sensing region and a spacing region which surrounds the sensing region; the top surface is provided with at least one first edge and at least one second edge, the distance between the at least one first edge and the spacing area is larger than the distance between the at least one second edge and the spacing area, a plurality of connecting pads are formed between the at least one first edge of the top surface and the spacing area of the sensing chip, and no connecting pad is formed between the at least one second edge and the spacing area of the top surface;

one end of each metal wire is connected to the corresponding welding pad, and the other end of each metal wire is connected to the corresponding connecting pad;

the light-transmitting layer is provided with a first surface and a second surface which are positioned at two opposite sides, and the second surface of the light-transmitting layer faces the top surface of the sensing chip; and

an adhesive disposed on the upper surface of the substrate and covering the outer edge of the sensing chip, the top portion between at least one of the first edge and the spacer, and the outer edge of the light transmissive layer and a portion of the second surface, wherein at least a portion of each of the metal lines and each of the pads are embedded in the adhesive, the adhesive comprising:

the supporting layer is arranged beside at least one second edge of the sensing chip in an adjacent mode, and the end edge of the supporting layer far away from the substrate is as high as the top surface of the sensing chip;

the bonding layer is arranged on the supporting layer and the top surface part between at least one first edge and the spacing area, and the second surface of the light-transmitting layer is adhered to the bonding layer;

the sealing colloid is arranged on the upper surface of the substrate and covers the outer edge of the sensing chip, the outer edge of the supporting layer, the outer edge of the bonding layer and the outer edge of the light-transmitting layer, and at least part of each metal wire and each welding pad are embedded in the sealing colloid; the outer edge of the supporting layer comprises an arc-shaped side surface, and the arc center of the arc-shaped side surface is positioned on the inner side of the sealing colloid.

12. The sensor package structure of claim 11, wherein the outer edge of the bonding layer comprises an arc-shaped curved surface, and an arc center of the arc-shaped curved surface of the bonding layer is located on the encapsulant.

13. The sensor package structure of claim 11, wherein a maximum distance between the outer edge of the bonding layer and the sensing region is equal to a distance between at least one of the first edges and the sensing region.

14. The sensor package structure of claim 11, wherein the bonding layer is further disposed on the top surface portion between at least one of the second edges and the spacers.

15. The sensor package structure of claim 14, wherein an area of the top surface portion between at least one of the second edges and the spacers is less than an area of the spacer portion to which it is connected.

16. The sensor package structure of any one of claims 11 to 15, wherein the sensing chip is orthographically projected onto the second surface to form a projected area, and the projected area is located within a contour of the second surface; the second surface is provided with a fixed area outside the part adhered to the jointing layer, and the sealing colloid further coats the fixed area.

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