CN107584820A - 覆盖带与其制造工艺方法 - Google Patents
覆盖带与其制造工艺方法 Download PDFInfo
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- CN107584820A CN107584820A CN201610594596.1A CN201610594596A CN107584820A CN 107584820 A CN107584820 A CN 107584820A CN 201610594596 A CN201610594596 A CN 201610594596A CN 107584820 A CN107584820 A CN 107584820A
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Abstract
本发明提出一种直接挤压成型的覆盖带与其制造工艺方法。覆盖带包含抗静电层、二中间层、基材层、二连接层及热封层,此七层材料是经直接共挤压成型。本发明具有热封层与抗静电层双面抗静电特性以及各层同步共挤压成型的特性,具有制造工艺步骤简化等优点。
Description
技术领域
本发明是有关一种覆盖带与其制造工艺方法,特别是关于一种多层材料一次挤压成型的覆盖带与其制造工艺方法。
背景技术
电子元件例如积体电路晶片在組裝于印刷电路板上的前一般是收纳于载带(carrier tape)中。载带具有多个可容纳电子元件的收纳袋或收纳槽,并以覆盖带以热封的方式将电子元件包裝在载带之内。当進行組裝时,先将覆盖带剥离,接著沿载带方向由自动化设备例如机械手臂将电子元件逐一取出放置于印刷电路板上。
覆盖带一般须具备足够的透光率以利于观察辨识载带内的电子元件。覆盖带同时必须具备良好的抗静电性质,以保护载带内的电子元件免于受到静电的損害。
传統的覆盖带主要包含基材层、中间层、剥离层以及热封层。基材层與热封层一般均涂布或添加抗静电材料,基材层多為聚對酞酸乙二酯(PET)材质,而热封层多为丙烯酸是树脂。中间层、剥离层以及热封层則必须分別形成,再采用涂布(coating)或积层(lamination)的方式利用黏胶层附著在基材层上。传統的覆盖带使用挤压制造工艺的部分一般仅限于基材或中间层等,后继再将热封层及抗静电层等具特殊功能的材料以积层或涂布等方式附著于基材上。因此传統覆盖带需要多个制造工艺步骤才能完成。
本发明则提出一种覆盖带的制造工艺方法,利用直接挤压的方式将至少包含基材层、中间层、以及热封层的覆盖带一次成型,免除传統覆盖带制造工艺所需的多个制造工艺步骤。
发明内容
鉴于上述,本发明实施的目的之一在于提供一种直接挤压成型的覆盖带及其制造工艺方法。
本发明的目的及解决其技术问题是采用以下技术方案来实现的。
覆盖带包含依序排列的抗静电层、第一中间层、第一连接层、基材层、第二连接层、第二中间层与具抗静电性质的热封层,其中抗静电层、第一中间层、第一连接层、基材层、第二连接层、第二中间层与热封层是经共挤压熔融黏合。
本发明的目的及解决其技术问题还可以采用以下技术措施来进一步实现。
前述的覆盖带,其中该抗静电层的材料包含聚烯烃类与抗静电剂,抗静电剂包含高分子型抗静电剂、离子型抗静电剂或纳米碳管,抗静电剂的添加重量比为约15-30%。
前述的覆盖带,其中该热封层的材料包含抗静电剂、包含氢化石油树脂及热塑性弹性体的增黏剂、丙烯酸是树脂及矿物油,抗静电剂包含高分子型抗静电剂、离子型抗静电剂或纳米碳管,抗静电剂的添加重量比例为约15-30%。
前述的覆盖带,其中该基材层占总厚度的范围为约25-30%,该第一与该第二连接层占总厚度的范围为约8%-10,该第一与该第二中间层占总厚度的范围为约25-30%,该抗静电层占总厚度的范围为约10-12%,该热封层占总厚度的范围为约20-25%。
前述的覆盖带,其中该基材层的材料包含聚酰胺6、聚酰胺66或两者的共聚物及聚对酞酸乙二酯。
前述的覆盖带,其中该中间层13的材料包含聚烯烃类,该连接层的材料包含酸酐改性的聚乙烯、聚丙烯以及聚烯烃类。
本发明的目的及解决其技术问题还可采用以下技术方案来实现。
在一个实施例中,本发明提出一种覆盖带的制造工艺方法,包含以下步骤。首先提供抗静电层材料、第一中间层材料、第一连接层材料、基材层材料、第二连接层材料、第二中间层材料与热封层材料。接着将抗静电层材料、第一中间层材料、第一连接层材料、基材层材料、第二连接层材料、第二中间层材料与热封层材料分别加入各自对应的七个挤压设备内,并设定各个挤压设备对应抗静电层材料、第一中间层材料、第一连接层材料、基材层材料、第二连接层材料、第二中间层材料与热封层材料的塑化温度。最后将抗静电层材料、第一中间层材料、第一连接层材料、基材层材料、第二连接层材料、第二中间层材料与热封层材料加热成熔融状,并黏合成单一薄膜。
在另一实施例中,本发明提出的覆盖带的制造工艺方法包含将具有抗静电层、中间层、基材层、连接层及热封层的覆盖带的七层材料备料后分别加入各自对应的七个挤压设备内,以各自对应的塑化温度一并进行共挤压黏合,以形成覆盖带。其中覆盖带各层的排列顺序为抗静电层、中间层、连接层、基材层、连接层、中间层及热封层。
本发明的目的及解决其技术问题还可采用以下技术措施来进一步实现。
前述的方法,其中该抗静电层材料包含聚烯烃类与抗静电剂。
前述的方法,其中该第一与该第二中间层材料包含聚烯烃类。
前的方法,其中该第一与该第二连接层材料包含酸酐改性的聚乙烯、聚丙烯与聚烯烃类。
前述的方法,其中该基材层材料包含聚酰胺6、聚酰胺66、聚酰胺6/66共聚合物。
前述的方法,其中该热封层材料包含抗静电剂、氢化石油树脂、热塑性弹性体、丙烯酸是树脂及矿物油。
前述的方法,其中该挤压设备包含单螺杆压出机。
前述的方法,包含:
将具有抗静电层、二个中间层、基材层、二个连接层及热封层的覆盖带的七层材料备料后分别加入各自对应的七个挤压设备内,以各自对应的塑化温度一并进行共挤压黏合,以形成该覆盖带,其中该覆盖带各层的排列顺序为该抗静电层、该中间层、该连接层、该基材层、该连接层、该中间层及该热封层。
前述的方法,其中该抗静电层的材料包含高分子型抗静电剂与线性低密度聚乙烯,该高分子型抗静电剂与该线性低密度聚乙烯混合,高分子型抗静电剂占重量百分比15-30%,并加入抗氧化助剂、开口剂及内滑剂,以一双螺杆压出机混合造粒,粒子于摄氏90℃进行干燥。
前述的方法,其中该中间层的材料包含线性低密度聚乙烯、高密度聚乙烯及低密度聚乙烯、聚丙烯或聚丙烯共聚物。
前述的方法,其中该基材层的材料包含聚酰胺6、聚酰胺6/66共聚合物干拌混合,聚酰胺6占重量百分比20-80%。
前述的方法,其中该连接层的材料包含酸酐改性的聚乙烯与线性低密度聚乙烯,以比例范围为20-40%的酸酐改性的聚乙烯以及比例范围为80-60%的线性低密度聚乙烯干拌混合。
前述的方法,其中该热封层的材料包含高分子型抗静电剂、增黏剂、丙烯酸是树脂、热塑性弹性体、矿物油,以比例(10-20):(10-20):(20-30):(35-45):(5-10)混合,加入抗氧化助剂、开口剂及内滑剂,以双螺杆压出机混合造粒,粒子于摄氏90℃进行干燥。
前述的方法,其中该抗静电层、该二个中间层、该基材层、该二个连接层及该热封层的七层材料以七层共挤吹膜机吹膜,依照该抗静电层、该中间层、该连接层、该基材层、该连接层、该中间层与该热封层的顺序加入各层所属的单螺杆压出机,设定各单螺杆压出机的塑化温度。各层材料经过单螺杆加热塑化成熔融状,经过七层圆形螺旋模头内流道后形成七层圆柱状熔融薄膜,在出模头处各层在高温下黏合成单一圆柱薄膜。
与传统覆盖带制造工艺技术相比,本发明的覆盖带与其制造工艺方法具有热封层与抗静电层双面抗静电特性以及各层同步共挤压成型的特性。不同于传统覆盖带制造工艺需要多个制造工艺步骤才能完成的缺点,本发明利用各层材料同步共挤压成型,具有制造工艺步骤简化等优点。传统覆盖带制造工艺技术一般需将热封层及抗静电层等具特殊功能的材料以积层或涂布等方式附着于基材上。而本发明的覆盖带与其制造工艺方法使用共挤压的方式则是将具有特殊功能的原料与基材一同挤压成型,无须再另作表面处理。
附图说明
图1是根据本发明实施例的覆盖带的截面图。
图2是根据本发明实施例的覆盖带制造工艺方法步骤。
[符号的说明]
10:基材层
12:连接层
13:中间层
14:抗静电层
15:热封层
20:提供至少包含基材层、抗静电层、热封层的材料
22:依照各层排列的顺序将各层材料加入所属的挤压设备内,并设定各挤压设备对应材料适合的塑化温度
24:将各层材料经过加热成熔融状,经过各层材料各自挤压设备形成熔融薄膜,各层并在出模处于高温下黏合成单一薄膜
具体实施方式
本发明的一些实施例将详细描述如下。然而,除了如下描述外,本发明还可以广泛地在其他的实施例施行,且本发明的范围并不受实施例的限定,其以的后的专利范围为准。再者,为提供更清楚的描述及更易理解本发明,图式内各部分并没有依照其相对尺寸绘图,某些尺寸与其他相关尺度相比已经被变更;不相关的细节部分也未完全绘出,以求图式的简洁。
图1为根据本发明实施例的覆盖带的截面图。于此实施例中,覆盖带至少包含基材层10、二个连接层12、二个中间层13、抗静电层14及一热封层15。连接层12主要是连结基材层10与中间层13。抗静电层14具有抗静电功能,热封层15用于将覆盖带热封于载带同时亦具有抗静电功能。于此实施例中,覆盖带的各层排列方式为抗静电层14/中间层13/连接层12/基材层10/连接层12/中间层13/热封层15,如图1所示。图1所示的覆盖带仅为本发明较佳实施例,并非限制。本发明的覆盖带可具有其他排列结构,但本发明的覆盖带必须具有热封层与抗静电层双面抗静电特性以及各层同步共挤压成型。相较于传统利用涂布或积层的方式制作的覆盖带,本发明的覆盖带是利用共挤压的方式,使各层在熔融状态下互相黏着,冷却后形成厚度范围为约40至70μm的薄膜。
在本发明的实施例中,基材层10的材料包含聚酰胺6(Polyamide 6)或聚酰胺66(polyamide 66)或聚酰胺6/66共聚合物(polyamide 6/66co-polymer)或聚对酞酸乙二酯(PET),但不限于此。中间层13的材料包含聚烯烃类(polyolefin),例如线性低密度聚乙烯(Polyethylene)、高密度聚乙烯及低密度聚乙烯、聚丙烯(Polypropylene)或聚丙烯共聚物(Copolymer)等,但不限于此。
连接基材层10与中间层13的连接层12的材料包含酸酐改性的聚乙烯或聚丙烯以及聚烯烃类,例如线性低密度聚乙烯、高密度聚乙烯及低密度聚乙烯、聚丙烯或聚丙烯共聚物等,但不限于此。
抗静电层14的材料包含聚烯烃类与抗静电剂,但不限于此;抗静电剂包含高分子型抗静电剂、离子型抗静电剂或纳米碳管,抗静电剂的添加重量比为约15-30%,使本发明的覆盖带二个面的表面电阻值介于1.0E+9至9.0E+11奥姆(Ω),测定方法使用绝缘材料的直流电阻或电导的标准测试方法ASTM D257,测定条件为相对湿度(RH)为50%,温度为摄氏23℃。
热封层15的材料包含抗静电剂、增黏剂(氢化石油树脂)及热塑性弹性体、丙烯酸是树脂及矿物油等,但不限于此;抗静电剂包含高分子型抗静电剂,抗静电剂的添加重量比例为约15-30%,使本发明的覆盖带二面的表面电阻值介于1.0E+9至9.0E+11奥姆(Ω)。测定方法同样为绝缘材料的直流电阻或电导的标准测试方法ASTM D257,测定条件为相对湿度为50%,温度为摄氏23℃。
本发明的覆盖带可具有各种排列结构,但必须具有热封层与抗静电层双面抗静电特性,以及必须各层同步共挤压成型。在本发明的实施例中,覆盖带的制造工艺方法是将基材层、连接层、中间层、抗静电层及热封层的各层材料备料后一并进行共挤压,即特殊功能的原料与基材一同挤压成型以形成覆盖带。与传统的覆盖带不同,本发明的覆盖带并无任何一层是使用涂布或积层的方式制作。
在本发明的实施例中,基材层的材料包含聚酰胺6及聚酰胺6/66共聚合物干拌混合,聚酰胺6占重量百分比20-80%。
中间层的材料包含线性低密度聚乙烯(LLDPE)。
连接层的材料包含酸酐改性的聚乙烯与线性低密度聚乙烯,酸酐改性的聚乙烯的比例范围为20-40%、线性低密度聚乙烯的比例范围为80-60%,二者干拌后备用。
抗静电层的材料包含高分子型抗静电剂与线性低密度聚乙烯,高分子型抗静电剂与线性低密度聚乙烯以1:5比例,加入抗氧化助剂、开口剂(避免制造工艺中与热封层黏死)及内滑剂,以双螺杆压出机混合造粒,粒子于摄氏90℃干燥后备用。
热封层的材料包含高分子型抗静电剂、增黏剂、丙烯酸是树脂、热塑性弹性体、矿物油,四种主要原料照以比例(10-20):(10-20):(20-30):(35-45):(5-10)混合,加入抗氧化助剂、开口剂(避免制造工艺中与抗静电层黏死)及内滑剂,以双螺杆压出机混合造粒,粒子于摄氏90℃干燥后备用。
最后将基材层、二个中间层、二个连接层、抗静电层、热封层共七层材料共挤吹膜机吹膜,由内而外依照抗静电层/中间层/连接层/基材层/连接层/中间层/热封层的顺序于各层所属的挤压设备内加入对应原料,各挤压设备设定对应材料适合的塑化温度。挤压设备包含单螺杆压出机,但不限于此。各层塑料经过加热塑化成熔融状,经过七层圆形螺旋模头内流道后形成七层圆柱状熔融薄膜,在出模头处各层在高温下黏合成单一圆柱薄膜。此柱状薄膜(筒膜)因上方牵引及膜泡内吹入冷空气,使直径胀大,经过牵引装置上的夹辊压平成一片膜(两层),经过冷却后分切为两片膜(单层)并收卷。分条成所需宽度以及长度。
膜厚由空气冷却效果控制在60±5μm(单层)。最后收卷的平膜宽度为约1200mm,长度3200m(单一卷,共两卷)。总膜厚范围为约40-70μm。其中基材层占膜厚度的范围为约25-30%,二个连接层占膜厚度的范围为约8%-10,二个中间层占膜厚度的范围为约25-30%,抗静电层占膜厚度的范围为约10-12%,热封层占膜厚度的范围为约20-25%。
本发明的覆盖带制造工艺方法并不受限于上述实施例中所述的各层排列方式,但必须具有热封层与抗静电层双面抗静电特性以及各层同步共挤压成型的特性。在一个实施例中,如图2所示,本发明的覆盖带制造工艺方法包含以下步骤。首先,在步骤20中,提供至少包含基材层、抗静电层、热封层的材料。接着于步骤22中,依照各层排列的顺序将各层材料加入所属的挤压设备内,并设定各挤压设备对应材料适合的塑化温度。然后在步骤24中,将各层材料经过加热塑化成熔融状,经过各层材料各自挤压设备形成熔融薄膜,各层在出模处于高温下黏合成单一薄膜。于较佳实施例中,覆盖带制造工艺方法使用的材料包含基材层、二个中间层、二个连接层、抗静电层、热封层的材料。
上述的实施例仅是为说明本发明的技术思想及特点,其目的在使熟悉此技艺的人士能了解本发明的内容并据以实施,当不能据以限定本发明的专利范围,即凡其他未脱离本发明所揭示精神所完成的各种等效改变或修饰都涵盖在本发明所揭露的范围内,均应包含在以下的申请专利范围内。
Claims (20)
1.一种覆盖带的制造工艺方法,其特征在于:包含:
提供抗静电层材料、第一中间层材料、第一连接层材料、基材层材料、第二连接层材料、第二中间层材料与热封层材料;
将该抗静电层材料、该第一中间层材料、该第一连接层材料、该基材层材料、该第二连接层材料、该第二中间层材料与该热封层材料分别加入各自对应的七个挤压设备内,并设定各个该挤压设备对应该抗静电层材料、该第一中间层材料、该第一连接层材料、该基材层材料、该第二连接层材料、该第二中间层材料与该热封层材料的塑化温度;及
将该抗静电层材料、该第一中间层材料、该第一连接层材料、该基材层材料、该第二连接层材料、该第二中间层材料与该热封层材料加热成熔融状,并黏合成单一薄膜,其中该薄膜包含抗静电层、第一中间层、第一连接层、基材层、第二连接层、第二中间层与热封层。
2.根据权利要求1所述的方法,其特征在于:其中该抗静电层材料包含聚烯烃类与抗静电剂。
3.根据权利要求1所述的方法,其特征在于:其中该第一与该第二中间层材料包含聚烯烃类。
4.申请专利范围第1所述的方法,其特征在于:其中该第一与该第二连接层材料包含酸酐改性的聚乙烯、聚丙烯与聚烯烃类。
5.根据权利要求1所述的方法,其特征在于:其中该基材层材料包含聚酰胺6、聚酰胺66、聚酰胺6/66共聚合物。
6.根据权利要求1所述的方法,其特征在于:其中该热封层材料包含抗静电剂、氢化石油树脂、热塑性弹性体、丙烯酸是树脂及矿物油。
7.根据权利要求1所述的方法,其特征在于:其中该挤压设备包含单螺杆压出机。
8.一种覆盖带的制造工艺方法,其特征在于:包含:
将具有抗静电层、二个中间层、基材层、二个连接层及热封层的覆盖带的七层材料备料后分别加入各自对应的七个挤压设备内,以各自对应的塑化温度一并进行共挤压黏合,以形成该覆盖带,其中该覆盖带各层的排列顺序为该抗静电层、该中间层、该连接层、该基材层、该连接层、该中间层及该热封层。
9.根据权利要求8所述的方法,其特征在于:其中该抗静电层的材料包含高分子型抗静电剂与线性低密度聚乙烯,该高分子型抗静电剂与该线性低密度聚乙烯混合,高分子型抗静电剂占重量百分比15-30%,并加入抗氧化助剂、开口剂及内滑剂,以一双螺杆压出机混合造粒,粒子于摄氏90℃进行干燥。
10.根据权利要求8所述的方法,其特征在于:其中该中间层的材料包含线性低密度聚乙烯、高密度聚乙烯及低密度聚乙烯、聚丙烯或聚丙烯共聚物。
11.根据权利要求8所述的方法,其特征在于:其中该基材层的材料包含聚酰胺6、聚酰胺6/66共聚合物干拌混合,聚酰胺6占重量百分比20-80%。
12.根据权利要求8所述的方法,其特征在于:其中该连接层的材料包含酸酐改性的聚乙烯与线性低密度聚乙烯,以比例范围为20-40%的酸酐改性的聚乙烯以及比例范围为80-60%的线性低密度聚乙烯干拌混合。
13.根据权利要求8所述的方法,其特征在于:其中该热封层的材料包含高分子型抗静电剂、增黏剂、丙烯酸是树脂、热塑性弹性体、矿物油,以比例(10-20):(10-20):(20-30):(35-45):(5-10)混合,加入抗氧化助剂、开口剂及内滑剂,以双螺杆压出机混合造粒,粒子于摄氏90℃进行干燥。
14.根据权利要求8所述的方法,其特征在于:其中该抗静电层、该二个中间层、该基材层、该二个连接层及该热封层的七层材料以七层共挤吹膜机吹膜,依照该抗静电层、该中间层、该连接层、该基材层、该连接层、该中间层与该热封层的顺序加入各层所属的单螺杆压出机,设定各单螺杆压出机的塑化温度。各层材料经过单螺杆加热塑化成熔融状,经过七层圆形螺旋模头内流道后形成七层圆柱状熔融薄膜,在出模头处各层在高温下黏合成单一圆柱薄膜。
15.一种覆盖带,其特征在于:包含:
依序排列的抗静电层、第一中间层、第一连接层、基材层、第二连接层、第二中间层与具抗静电性质的热封层,其中该抗静电层、该第一中间层、该第一连接层、该基材层、该第二连接层、该第二中间层与该热封层是经共挤压熔融黏合。
16.根据权利要求15所述的覆盖带,其特征在于:其中该抗静电层的材料包含聚烯烃类与抗静电剂,抗静电剂包含高分子型抗静电剂、离子型抗静电剂或纳米碳管,抗静电剂的添加重量比为约15-30%。
17.根据权利要求15所述的覆盖带,其特征在于:其中该热封层的材料包含抗静电剂、包含氢化石油树脂及热塑性弹性体的增黏剂、丙烯酸是树脂及矿物油,抗静电剂包含高分子型抗静电剂、离子型抗静电剂或纳米碳管,抗静电剂的添加重量比例为约15-30%。
18.根据权利要求15所述的覆盖带,其特征在于:其中该基材层占总厚度的范围为约25-30%,该第一与该第二连接层占总厚度的范围为约8%-10,该第一与该第二中间层占总厚度的范围为约25-30%,该抗静电层占总厚度的范围为约10-12%,该热封层占总厚度的范围为约20-25%。
19.根据权利要求15所述的覆盖带,其特征在于:其中该基材层的材料包含聚酰胺6、聚酰胺66或两者的共聚物及聚对酞酸乙二酯。
20.根据权利要求15所述的覆盖带,其特征在于:其中该中间层的材料包含聚烯烃类,该连接层的材料包含酸酐改性的聚乙烯、聚丙烯以及聚烯烃类。
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