CN107580097B - A kind of ceramic mobile phone rear cover and its moulding process - Google Patents
A kind of ceramic mobile phone rear cover and its moulding process Download PDFInfo
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- CN107580097B CN107580097B CN201710752243.4A CN201710752243A CN107580097B CN 107580097 B CN107580097 B CN 107580097B CN 201710752243 A CN201710752243 A CN 201710752243A CN 107580097 B CN107580097 B CN 107580097B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/12—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by mechanical means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/24—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials for applying particular liquids or other fluent materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/0053—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor combined with a final operation, e.g. shaping
- B29C45/0055—Shaping
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
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- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/4505—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application
- C04B41/4535—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied as a solution, emulsion, dispersion or suspension
- C04B41/4543—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements characterised by the method of application applied as a solution, emulsion, dispersion or suspension by spraying, e.g. by atomising
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/85—Coating or impregnation with inorganic materials
- C04B41/87—Ceramics
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Structural Engineering (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Dispersion Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Telephone Set Structure (AREA)
Abstract
The present invention discloses a kind of ceramic mobile phone rear cover, including rear cover ontology, above-mentioned rear cover ontology is metal back cover ontology, clay filling hole is offered on backboard, the position that the outer surface of rear cover ontology is located at other than clay filling hole is coated with non-conductive ceramic material layer, clay filling is filled with non-conductive ceramic material filler in hole, non-conductive ceramic material layer and non-conductive ceramic material filler are integrally sintered to fix on rear cover ontology, and non-conductive ceramic material layer corresponds to corresponding with the perforation to match with functional hole at each functional hole.Compared with prior art, the ceramic mobile phone rear cover of the present invention, in conjunction with the advantages of metal back cover and the advantage of ceramics, have that light, thin, structural strength is good, case hardness is high, scratch resistance is good, appearance consistency, high-grade beauty, good heat dissipation, without electromagnetic signal interference problem the advantages of.The invention also discloses a kind of moulding process of ceramic mobile phone rear cover.
Description
Technical field
The present invention relates to Cellphone Accessories, more particularly to a kind of cell phone rear cover and its moulding process.
Background technology
The cell phone rear cover that tradition is sold is generally plastics, glass, metal（Based on aluminum）Made of ceramics, they distinguish
There is different types of defect.Such as：1）The rear covers of plastics is at low cost, easy processing, without electromagnetic signal interference problem, but surface intolerant to
It scrapes, the problems such as texture is poor, structural strength is poor, weak heat-dissipating；2）Although the scratch resistance of glass back cover surface, texture is pretty good, believes without electromagnetism
Number interference problem, but glass falls frangible, and and itself can not do structural support, so also to coordinate in one metal of Glass Design
Structural support of the frame as complete machine, it is of high cost in this way, it is complicated；3）Though metal aluminum rear cover have good degree of structuration, good heat dissipation,
The advantages that scratch resistance is good, but because there are electromagnetic signal interference problems for metal, so all metal back covers are required for upper and lower ends each
The antenna strip for inlaying one piece of plastic cement, so that electromagnetic signal can just cannot keep consistency with normal transmission, such appearance.
In view of this, the present inventor furthers investigate the above problem, generated then by this case.
Invention content
In view of this, the purpose of the present invention is to provide it is a kind of it is light, thin, structural strength is good, case hardness is high, scratch resistance
It is good, appearance consistency, high-grade beauty, good heat dissipation, the ceramic mobile phone rear cover without electromagnetic signal interference problem.
It is an object of the invention to also provide one kind to mold that light, thin, structural strength is good, case hardness is high, scratch resistance
It is good, appearance consistency, high-grade beauty, good heat dissipation, the moulding process of ceramic mobile phone rear cover without electromagnetic signal interference problem.
In order to achieve the above objectives, solution of the invention is：A kind of ceramic mobile phone rear cover, including rear cover ontology, after
Lid ontology has backboard and is integrally formed the gusset of connection with backboard, which is surrounded by with backboard is positioned over for circuit board of mobile phone
Interior accommodating cavity offers several functional holes on gusset, and above-mentioned rear cover ontology is metal back cover ontology, is opened up on above-mentioned backboard
There is clay to fill hole, the position that the outer surface of above-mentioned rear cover ontology is located at other than clay filling hole is coated with non-conductive ceramic material
Layer, above-mentioned clay, which fills dispensing or injecting glue in hole, the non-conductive ceramic material filler for being full of clay filling hole, above-mentioned non-
Conducting ceramic material layer and above-mentioned non-conductive ceramic material filler are integrally sintered to fix on above-mentioned rear cover ontology, above-mentioned clay
In filling hole by non-conductive ceramic material filler formed with the non-conductive ceramic block that matches of clay filling hole, it is above-mentioned non-to lead
Electroceramics material layer corresponds to corresponding with the perforation to match with functional hole at each functional hole.
Above-mentioned clay filling hole is offered at the both ends in above-mentioned carapace length direction, above-mentioned clay filling hole is in along backboard
Width direction extend strip through-hole.
Above-mentioned clay filling hole is in the strip through-hole extended along the length direction of backboard, and above-mentioned clay filling hole is in the back of the body
At the intermediate position of plate.
Integrally be extended on above-mentioned non-conductive ceramic block stretch out clay filling hole outside be in accommodating cavity in, and in backboard
Surface is affixed the extension reinforcement block of cooperation.
Further include having plastic parts, above-mentioned plastic parts is in hollow closed-loop shaped framework, and above-mentioned plastic parts is in above-mentioned accommodating cavity
And with above-mentioned rear cover ontology one nanometer injection molding, above-mentioned plastic parts have the plastic cement gusset that is closely fitted with gusset and with
The inner surface week of backboard is along the plastics sticking part for being affixed cooperation.
Above-mentioned non-conductive ceramic material layer dispatch from foreign news agency is coated with an anti-fingerprint film layer.
Further include having plastic parts, above-mentioned plastic parts is in hollow closed-loop shaped framework, and above-mentioned plastic parts is in above-mentioned accommodating cavity
And with above-mentioned rear cover ontology one nanometer injection molding, above-mentioned plastic parts have the plastic cement gusset that is closely fitted with gusset and with
The inner surface week of backboard is in the hollow range of above-mentioned plastic parts along the plastics sticking part for being affixed cooperation, above-mentioned clay filling hole
It is interior.
A kind of moulding process of ceramic mobile phone rear cover, is achieved by the steps of：
One, metalwork is molded, and prepares the metal back cover to match with cell phone rear cover shape, this metal back cover has gusset
And backboard, and clay filling hole is offered on backboard；
Two, feeding fills non-conductive ceramic material, later to pottery in the clay filling hole of the metal back cover of step 1
Non-conductive ceramic material material in soil filling hole is cured or is sintered into solid-state, then is carried out to the external surface shape of metal back cover
CNC working processes, after working process again to the outer surface of metal back cover spray one layer it is non-lead ceramic coating, obtain ceramic processing
Part；
Three, it is sintered, the ceramic handling member of step 2 is sintered, sintering temperature is 300-1300 DEG C, and sintering time is
It -480 minutes 30 minutes, obtains sintering finished；
Four, CNC is processed, and is processed to the inner surface of the sintering finished metal back cover of step 3 using CNC machining tools
The interior structure of cell phone rear cover, obtains semi-finished product；
Five, it is surface-treated, the outer surface of the semi-finished product of step 4 is processed by shot blasting, plates last layer after polishing treatment again
Anti-fingerprint coating obtains having ceramic appearance, the ceramic mobile phone rear cover of inner metal bezel.
There is injection process, when injection process to be positioned over the sintering finished of step 3 between above-mentioned steps three and step 4
In nanometer injection mold, integrated injection molding goes out hollow injection molding frame on sintering finished inner surface, the clay fill hole and
Metal back cover inner surface is located at the hollow model that the non-conductive ceramic material outside clay filling hole is in above-mentioned hollow injection molding frame
In enclosing, and CNC machining tools also process the inner surface of hollow injection molding frame the interior structure of cell phone rear cover in step 4.
In step 2, when clay fills the non-conductive ceramic material filled in hole, non-conductive ceramic material overflows clay and fills out
Fill the inner surface and the outer surface to metal back cover outside hole.
After adopting the above technical scheme, a kind of ceramic mobile phone rear cover of the present invention, makes cell phone rear cover by metal back cover
Integral strength is stronger, is unlikely to deform, and service life is long, so that the appearance of cell phone rear cover is had further through non-conductive ceramic material layer true
Real ceramic effect, without simulation process, moulding process is simple, has the resistance to scratch of ceramics, soft handle beautiful and top grade
Advantage, and cell phone rear cover does not have hot phenomenon when use for a long time, further more, using non-conductive ceramic material at clay filling hole
Material filling, in this way, mobile phone signal antenna can be installed here, herein without electromagnetic signal interference problem, then ceramics of the invention
Cell phone rear cover, in conjunction with the advantages of metal back cover and ceramics advantage, have it is light, thin, structural strength is good, case hardness is high, resistance to
Scraping property is good, appearance consistency, high-grade beauty, good heat dissipation, without electromagnetic signal interference problem the advantages of.The invention is to take a variety of materials
With the advantage of technique, integrates the product of aesthetics and the marrow of science, be the breakthrough technological innovation of existing cell phone rear cover, take
The unprecedented improvement of cell phone rear cover must be showed.
Description of the drawings
Fig. 1 is the structural schematic diagram of embodiment one；
Fig. 2 is the diagrammatic cross-section of embodiment one；
Fig. 3 is the stereogram exploded view of embodiment one；
Fig. 4 is the structural schematic diagram of embodiment two；
Fig. 5 is the stereogram exploded view of embodiment two；
Fig. 6 is the diagrammatic cross-section of embodiment two.
Specific implementation mode
A kind of ceramic mobile phone rear cover of the present invention, embodiment one, as shown in Figs. 1-3, including rear cover ontology 1, rear cover ontology 1
The gusset 12 of connection is integrally formed with backboard 11 and with backboard 11, which is surrounded by with backboard 11 puts for circuit board of mobile phone
It is placed in interior accommodating cavity（It is not shown in figure）, several functional holes 121 are offered on the gusset 12, and each functional hole 121 is respectively
Sound regulating key hole, earpiece holes, goes out acoustic aperture etc. at charging hole, the moulding phase of the moulding of the rear cover ontology 1 and existing cell phone rear cover
Together, details are not described herein.
The innovation of the present invention is：The rear cover ontology 1 be metal back cover ontology, this metal back cover ontology by aluminum,
The metal materials such as irony, stainless steel, copper or titanium matter are made, it is preferred to use be aluminium alloy matter, the backboard of the rear cover ontology 1
Clay filling hole 111 is offered on 11, the region that the outer surface of the rear cover ontology 1 is located at other than clay filling hole 111 is coated with
The non-conductive ceramic of non-conductive ceramic material layer 2, this non-conductive ceramic material layer 2 is preferably inorganic ceramic class material, the clay
Filling is filled out using injecting glue or mode for dispensing glue in hole 111 and is filled with non-conductive ceramic material filler, this non-conductive ceramic material
Layer 2 and non-conductive ceramic material filler are sintered to fix by the way of sintering on rear cover ontology 1, can not with rear cover ontology 1
It is separated,（I.e. on non-conductive ceramic material layer 2 integrally formed with fill out riddle clay filling hole 111 in non-conductive ceramic block）
A non-conductive ceramic block 21 to match with clay filling hole, i.e. non-conductive ceramic material are molded in clay filling hole 111
Form non-conductive ceramic block 21 after filler sintering, and non-conductive ceramic material layer 2 correspond at each functional hole it is corresponding have with
The perforation that functional hole matches.
A kind of ceramic mobile phone rear cover of the present invention, keeps the integral strength of cell phone rear cover stronger, no by metal aluminum rear cover
Yielding, service life is long, so that the appearance of cell phone rear cover is had true ceramic effect further through non-conductive ceramic material layer 2,
Without simulation process, moulding process is simple, has the resistance to scratch of ceramics, soft handle, beautiful and high-grade advantage, and long-time
Cell phone rear cover does not have hot phenomenon when use, further more, filled using non-conductive ceramic material at clay filling hole, i.e., it is non-
Conductivity ceramics block 21, herein without electromagnetic signal interference problem, makes the letter of mobile phone in this way, mobile phone signal antenna can be installed here
Number will not be impacted, it is used suitable for 5G signals, then ceramic mobile phone rear cover of the invention, in conjunction with the advantages of metal back cover and ceramics
Advantage, has that light, thin, structural strength is good, case hardness is high, scratch resistance is good, appearance consistency, high-grade beauty, good heat dissipation, nothing
The advantages of electromagnetic signal interference problem.The invention is to take the advantage of a variety of materials and technique, and the marrow of collection aesthetics and science is one
The product of body is the breakthrough technological innovation of existing cell phone rear cover, obtains the unprecedented improvement of existing cell phone rear cover.
Preferably, clay filling hole 111 is provided with two, and two clay filling hole is arranged the two of 11 length direction of backboard
At end, and clay filling hole 111 is in the strip through-hole extended along the width direction of backboard 12；The position in two clay filling holes 111
It sets corresponding with the installation site of the antenna for mobile phone of existing mobile phone, keeps the installation site of each component in mobile phone unaffected, to
Metallic mobile phone rear cover is set to correspond to antenna installation place it is not necessary that plastic part is arranged, it is in integral type appearance to make the rear cover back side, avoids tradition
Metallic mobile phone rear cover causes shape to influence beautiful problem in splicing structure corresponding to that need to install plastic part at antenna.
Preferably, clay filling hole 111 also can be in the strip through-hole extended along the length direction of backboard, and clay is filled
Hole is at the intermediate position of backboard, and such non-conductive ceramic block is in the inner surface center of cell phone rear cover, then circuit board can
On the non-conductive ceramic block, the signal of mobile phone is further made not influenced by metal material, to make the signal of mobile phone
It is very strong, meet the requirement of existing 5G signals.
Preferably, it is integrally extended with and is stretched out outside clay filling hole 21 in accommodating cavity on non-conductive ceramic block 21, and with
The inner surface of backboard 11 is affixed the extension reinforcement block 211 of cooperation, i.e., this extends reinforcement block 211 and extends outside clay filling hole 21,
And it is affixed cooperation with backboard, it is compressed in this way, backboard 12 is extended reinforcement block 211, makes non-conductive ceramic material layer 2 and rear cover sheet
The binding force of body 1 is stronger, is further ensured that non-conductive ceramic material layer 2 will not be detached from rear cover ontology 1.
Preferably, which is coated with an anti-fingerprint film layer（It is not drawn into figure）, utilize this anti-finger
Line film layer makes the outer surface of cell phone rear cover keep brightness effect.
A kind of ceramic mobile phone rear cover of the present invention, embodiment two, as Figure 4-Figure 6, difference from the first embodiment is that
The ceramic mobile phone rear cover further includes having plastic parts 3, and plastic parts 3 is in hollow closed-loop shaped framework, plastic parts 3 be in accommodating cavity it is interior and with
The 1 integrated nanometer of injection molding of rear cover ontology, plastic parts 3 have the plastic cement gusset 31 that is closely fitted with gusset 12 and with backboard 11
Inner surface week along the plastics sticking part 32 of cooperation is affixed, i.e. the rear cover ontology with non-conductive ceramic material layer 2 passes through nanometer
Shooting Technique is integrally formed out plastic parts 3 in the accommodating cavity of rear cover；In this way, can be on plastic parts 3 integrally by this plastic parts 3
The mounting structure installed for mobile phone component is molded, the mounting structure for being used in mobile phone component installation is not necessarily on rear cover ontology
Molding, further facilitates the molding of cell phone rear cover, and moulding process is simple, and mounting structure can make hand with plastic parts integrated molding
The installation of each component of machine is more secured.
Preferably, clay filling hole be in the hollow range of plastic parts 3, and plastics sticking part 32 side edge with it is non-conductive
21 phase of ceramic block leans on tight fit.
A kind of moulding process of ceramic mobile phone rear cover, is achieved by the steps of：
One, metalwork is molded, and prepares the metal back cover to match with cell phone rear cover shape, this metal back cover has gusset
And backboard, and clay filling hole is offered on backboard, which is preferably aluminium alloy rear cover；
Two, feeding fills non-conductive ceramic material, later to clay in the clay filling hole of the metal back cover of step 1
Non-conductive ceramic material material in filling hole is cured or is sintered into solid-state, then is carried out to the external surface shape of metal back cover
CNC working processes, after working process again to the outer surface of metal back cover spray one layer it is non-lead ceramic coating, obtain ceramic processing
Part；
Three, it is sintered, the ceramic handling member of step 2 is sintered, sintering temperature is 300-1300 DEG C, and sintering time is
- 480 minutes 30 minutes, obtain sintering finished, which determines depending on different metal material；
Four, CNC is processed, and is processed to the inner surface of the sintering finished metal back cover of step 3 using CNC machining tools
The interior structure of cell phone rear cover, obtains semi-finished product；
Five, it is surface-treated, the outer surface of the semi-finished product of step 4 is processed by shot blasting, plates last layer after polishing treatment again
Anti-fingerprint coating obtains having ceramic appearance, the ceramic mobile phone rear cover of inner metal bezel.
The present invention a kind of ceramic mobile phone rear cover moulding process, it is plastic go out by metal aluminum framework and ceramic surface
The ceramic mobile phone rear cover of composition keeps the integral strength of cell phone rear cover stronger, is unlikely to deform by metal aluminum rear cover in this way, uses
Long lifespan makes the appearance of cell phone rear cover have true ceramic effect, without emulation further through non-conductive ceramic material layer
Technique, moulding process is simple, when having the resistance to scratch of ceramics, soft handle, beautiful and high-grade advantage, and using for a long time after mobile phone
Lid does not have hot phenomenon, further more, filled using non-conductive ceramic material at clay filling hole, in this way, mobile phone signal day
Line can be installed here, herein without electromagnetic signal interference problem, make the signal of mobile phone will not be impacted, be used suitable for 5G signals,
And the outer surface for coordinating anti-fingerprint coating to enable ceramic mobile phone rear cover is always maintained at light, totally, is not easy dirty effect.Then adopt
The advantage of the advantages of ceramic mobile phone rear cover combination metal back cover to be formed out with this skill and ceramics have light, thin, structure
Intensity is good, case hardness is high, scratch resistance is good, and appearance consistency light, bears dirty, high-grade beauty, good heat dissipation, does without electromagnetic signal
The advantages of disturbing problem.The invention is to take the advantage of a variety of materials and technique, integrates the product of aesthetics and the marrow of science, is
The breakthrough technological innovation of existing cell phone rear cover obtains the unprecedented improvement of existing cell phone rear cover.
The moulding process of the ceramic mobile phone rear cover of the present invention, it is preferred that in step 2, non-leading in clay filling hole
Electroceramics material filler is spilled over on the backboard inner surface of metal back cover, in this way, making the ceramic mobile phone rear cover to form out
Also there is non-conductive ceramic material, the connection of the metal back cover and non-conductive ceramic material that make ceramic mobile phone rear cover is more on inner surface
It is secured, is not susceptible to be detached from.
Preferably, there is injection process between step 3 and step 4, by the sintering finished of step 3 when injection process
It is positioned in nanometer injection mold, integrated injection molding goes out hollow injection molding frame on sintering finished inner surface, and clay is filled out
It fills hole and overflows and be in hollow injection molding frame to the non-conductive ceramic material region at metal back cover inner surface outside clay filling hole
In the hollow range of frame, the ceramic mobile phone rear cover item for disposal being made of moulding, metalwork and ceramic member is obtained, and in step 4
Middle CNC machining tools also process the interior structure of cell phone rear cover to the inner surface of hollow injection molding frame, in this way, make to form out
Ceramic mobile phone rear cover is by the surface of ceramics, framework and plastics the internal frame body composition of metal, to which ceramic mobile phone rear cover has ceramics
Appearance, it appears it is high-grade, it is beautiful, the characteristics of the intensity of metal frame, intensity height and plastic parts, that is, be easy to mobile phone mounting structure at
The advantages that type.
The product form and style of above-described embodiment and attached drawing and the non-limiting present invention, any technical field it is common
The appropriate changes or modifications that technical staff does it all should be regarded as the patent category for not departing from the present invention.
Claims (3)
1. a kind of moulding process of ceramic mobile phone rear cover, it is characterised in that：It is achieved by the steps of：
One, metalwork is molded, and prepares the metal back cover to match with cell phone rear cover shape, this metal back cover has gusset and the back of the body
Plate, and clay filling hole is offered on backboard；
Two, feeding is filled non-conductive ceramic material in the clay filling hole of the metal back cover of step 1, is filled later to clay
Non-conductive ceramic material material in hole is cured or is sintered into solid-state, then is carried out CNC to the external surface shape of metal back cover and added
Work processing, after working process again to the outer surface of metal back cover spray one layer it is non-lead ceramic coating, obtain ceramic handling member；
Three, it is sintered, the ceramic handling member of step 2 is sintered, sintering temperature is 300-1300 DEG C, and sintering time is 30 points
Clock -480 minutes obtains sintering finished；
Four, CNC is processed, and mobile phone is processed to the inner surface of the sintering finished metal back cover of step 3 using CNC machining tools
The interior structure of rear cover, obtains semi-finished product；
Five, it is surface-treated, the outer surface of the semi-finished product of step 4 is processed by shot blasting, plates the anti-finger of last layer after polishing treatment again
Line coating obtains having ceramic appearance, the ceramic mobile phone rear cover of inner metal bezel.
2. a kind of moulding process of ceramic mobile phone rear cover according to claim 1, it is characterised in that：Above-mentioned steps three and step
There is injection process, when injection process the sintering finished of step 3 to be positioned in nanometer injection mold between rapid four, be sintered
Integrated injection molding goes out hollow injection molding frame on the inner surface of finished product, and clay filling hole is in above-mentioned hollow injection molding frame
In empty range, and CNC machining tools also process the inner surface of hollow injection molding frame the interior knot of cell phone rear cover in step 4
Structure.
3. a kind of moulding process of ceramic mobile phone rear cover according to claim 1, it is characterised in that：In step 2, making pottery
Non-conductive ceramic material overflows clay and fills outside hole in metal back cover when the non-conductive ceramic material filled in soil filling hole
Surface and outer surface.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710752243.4A CN107580097B (en) | 2017-08-28 | 2017-08-28 | A kind of ceramic mobile phone rear cover and its moulding process |
| PCT/CN2018/077764 WO2019041775A1 (en) | 2017-08-28 | 2018-03-01 | Ceramic mobile phone back cover and forming process therefor |
| KR1020207000819A KR102168872B1 (en) | 2017-08-28 | 2018-03-01 | Ceramic mobile phone back cover and its molding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710752243.4A CN107580097B (en) | 2017-08-28 | 2017-08-28 | A kind of ceramic mobile phone rear cover and its moulding process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107580097A CN107580097A (en) | 2018-01-12 |
| CN107580097B true CN107580097B (en) | 2018-10-16 |
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| CN201710752243.4A Active CN107580097B (en) | 2017-08-28 | 2017-08-28 | A kind of ceramic mobile phone rear cover and its moulding process |
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| Country | Link |
|---|---|
| KR (1) | KR102168872B1 (en) |
| CN (1) | CN107580097B (en) |
| WO (1) | WO2019041775A1 (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107580097B (en) * | 2017-08-28 | 2018-10-16 | 福建省石狮市通达电器有限公司 | A kind of ceramic mobile phone rear cover and its moulding process |
| CN108322585A (en) * | 2018-03-15 | 2018-07-24 | 浙江宏泰锆业科技有限公司 | A kind of zirconia ceramics mobile phone backboard |
| CN108570646A (en) * | 2018-03-29 | 2018-09-25 | 瑞宏精密电子（太仓）有限公司 | A kind of surface anti-fingerprint treatment process of notebook computer casing |
| CN109808128B (en) * | 2019-04-10 | 2024-01-02 | 福建省石狮市通达电器有限公司 | IBF product manufacturing process |
| CN112468636B (en) * | 2019-09-06 | 2022-09-02 | 北京小米移动软件有限公司 | Housing and processing method thereof |
| CN110785035A (en) * | 2019-10-21 | 2020-02-11 | 华为技术有限公司 | A casing of an electronic device and a method for making the casing |
| CN113542458B (en) * | 2020-04-16 | 2025-04-04 | 华为机器有限公司 | Middle frame and manufacturing method thereof and electronic device |
| CN112462561B (en) * | 2020-12-22 | 2024-04-26 | 北京小米移动软件有限公司 | Electrochromic module, preparation method thereof and electronic equipment |
| CN114760376A (en) * | 2022-03-21 | 2022-07-15 | 合肥金龙浩科技有限公司 | Lid, be used for its hole inkjet hole patching device of making a video recording and tool behind cell-phone |
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- 2017-08-28 CN CN201710752243.4A patent/CN107580097B/en active Active
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2018
- 2018-03-01 KR KR1020207000819A patent/KR102168872B1/en not_active Expired - Fee Related
- 2018-03-01 WO PCT/CN2018/077764 patent/WO2019041775A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| CN107580097A (en) | 2018-01-12 |
| KR102168872B1 (en) | 2020-10-22 |
| KR20200017470A (en) | 2020-02-18 |
| WO2019041775A1 (en) | 2019-03-07 |
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