CN107565922A - The preparation method of SMD ceramic flat surface pedestals - Google Patents
The preparation method of SMD ceramic flat surface pedestals Download PDFInfo
- Publication number
- CN107565922A CN107565922A CN201710820078.1A CN201710820078A CN107565922A CN 107565922 A CN107565922 A CN 107565922A CN 201710820078 A CN201710820078 A CN 201710820078A CN 107565922 A CN107565922 A CN 107565922A
- Authority
- CN
- China
- Prior art keywords
- ceramic
- ceramic substrate
- copper
- base unit
- elargol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 59
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 38
- 229910052802 copper Inorganic materials 0.000 claims abstract description 38
- 239000010949 copper Substances 0.000 claims abstract description 38
- 239000000758 substrate Substances 0.000 claims abstract description 31
- 239000011241 protective layer Substances 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 7
- 238000010586 diagram Methods 0.000 claims abstract description 6
- 238000005520 cutting process Methods 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims abstract description 4
- 238000004080 punching Methods 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000010410 layer Substances 0.000 claims description 13
- 239000002184 metal Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007747 plating Methods 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical group [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 3
- 238000005253 cladding Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001465 metallisation Methods 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 229910052719 titanium Inorganic materials 0.000 claims description 3
- 239000010936 titanium Substances 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 3
- 229910000679 solder Inorganic materials 0.000 abstract 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention provides the preparation method of SMD ceramic flat surface pedestals, and described preparation method includes following steps：Ceramic substrate is made first, and the very empty Splash of use penetrates plated film and metallic film is made, punched after ceramic base plate surface is separated to form several base units；Dried after ceramic substrate after punching is cleaned；Then copper is covered in slot electrode and is formed and covers copper electrode and is carrying out attached copper, protective layer is formed after the ceramic base plate surface marking circuit diagram, gold-plated, pin bores filling perforation after attached copper；Then elargol is printed on ceramic substrate；Place the wafer on corresponding elargol, then chip is fixed by roasting glue；Ceramic substrate will finally be cut after roll welding, form single base unit, the base unit after cutting is tested,.Using the good integrity after this programme, pad solder intensity is high, and oxidation-protective effect is good.
Description
Technical field
Invention is related to electronic component technology field, refers in particular to the preparation method of SMD ceramic flat surface pedestals.
Background technology
Existing tuning fork crystal pedestal is made using glassy metal sintering method, and packing forms use plug-in unit mode
（DIP）, its intensity is relatively low, and sealing is poor, it is impossible to automatic chip mounting（SMT）Operation, it is domestic temporarily to be given birth to without SMD tuning fork crystals pedestal
Production.
The content of the invention
Invention aims to overcome that the deficiencies in the prior art, there is provided a kind of intensive properties is good, good seal, production cost are low,
Energy automatic chip mounting does the preparation method of the SMD ceramic flat surface pedestals of industry.
To achieve the above object, inventing provided technical scheme is：The preparation method of SMD ceramic flat surface pedestals, it is described
Preparation method include following steps：
1）, make thickness be 0.3 ~ 0.8mm ceramic substrate；
2）, using gold-plated method to ceramic substrate carry out ceramic metallization, make ceramic base plate surface formed metallic film；
3）, ceramic base plate surface delineate cut line groove, several base units are separated to form by wire casing；
4）, ceramic substrate is put into puncher, each base unit is punched, enters the linker that metallizes so as to the hole of air exercise
Plate tow sides, form electrode path；
5）, the ceramic substrate after punching be put into plasma cleaning equipment cleaned；
6）, ceramic surface cover copper formed cover copper electrode；
7）, to complete the 6th）The ceramic substrate of step carries out covering copper, makes ceramic base plate surface composite multi-layer metal, institute by covering copper
State that to cover the metallic element of copper be titanium, nickel, one kind in copper or multi-layer metal structure；
8）, after copper is covered ceramic base plate surface marking circuit diagram；
9）, marking circuit after carry out it is gold-plated, institute's metal cladding thickness be 1-10 μm；
10）, will complete the 9th）The ceramic substrate of step carries out pin bores filling perforation, again by plating in ceramic substrate table after filling perforation
Face forms protective layer；
11）, will complete the 10th）Elargol is printed on the ceramic substrate of step, elargol corresponds to the copper electrode that covers on each base unit, institute
State and cover copper electrode and be located at base unit side, elargol is located at base unit opposite side, elargol and covers and passes through pin between copper electrode
Hole connects；
12）, place the wafer on corresponding elargol, then fix chip by roasting glue；
13）, using pulse seam welder by it is upper lid be welded on completion the 12nd）After step on corresponding base unit；The welding is
In high vacuum 8X10-3More than Pa is welded；
14）, ceramic substrate is cut after roll welding, form single base unit, the base unit after cutting tested,
.
This programme uses pedestal made of ceramic material, and it has, and high intensity, good insulating while manufacturing cost are low,
More metal layers are plated again after marking circuit, are easy to protect circuit, circuit and metal layer are prevented using protective layer,
Using the good integrity after this programme, intensity is high, and oxidation-protective effect is good.
Brief description of the drawings
Fig. 1 is the overall structure diagram of invention.
Fig. 2 is the base unit structural representation of invention.
Fig. 3 is the SMD base of ceramic cellular construction schematic diagrams of invention.
Embodiment
Invention is described further with reference to all accompanying drawings, the preferred embodiment of invention is：Referring to accompanying drawing 1 to accompanying drawing
3, the preparation method of the SMD ceramic flat surface pedestals described in the present embodiment, described preparation method includes following steps：
1）, make thickness be 0.3 ~ 0.8mm ceramic substrate；
2）, using gold-plated method to ceramic substrate carry out ceramic metallization, make ceramic base plate surface formed metallic film；
3）, ceramic base plate surface delineate cut line groove, several base units are separated to form by wire casing；
4）, ceramic substrate is put into puncher, each base unit is punched, the hole beaten is pin bores and slot electrode；
5）, the ceramic substrate after punching be put into plasma cleaning equipment cleaned；
6）, cover in slot electrode copper and formed and cover copper electrode；
7）, to complete the 6th）The ceramic substrate of step carries out attached copper, ceramic base plate surface is compounded to form multilayer gold by covering copper
Category, the metallic element of the attached copper are the one or more in titanium, nickel, copper；
8）, after copper is covered ceramic base plate surface marking circuit diagram；
9）, marking circuit after carry out it is gold-plated, institute's metal cladding thickness be 1-10 μm；
10）, will complete the 9th）The ceramic substrate of step carries out pin bores filling perforation, again by plating in ceramic substrate table after filling perforation
Face forms protective layer；
11）, will complete the 10th）Elargol is printed on the ceramic substrate of step, elargol corresponds to the copper electrode that covers on each base unit, institute
State and cover copper electrode and be located at base unit side, elargol is located at base unit opposite side, elargol and covers and passes through pin between copper electrode
Hole connects；
12）, place the wafer on corresponding elargol, then fix chip by roasting glue；
13）, using pulse seam welder by it is upper lid be welded on completion the 12nd）After step on corresponding base unit；The welding is
In 8X10-3More than Pa is welded；
14）, ceramic substrate is cut after roll welding, form single base unit, the base unit after cutting tested,
.
The SMD base of ceramic units made as stated above include rectangular pedestal 1, the length direction both ends of pedestal 1
Bottom be provided with slot electrode, copper is covered in slot electrode and forms electrode 2, pedestal 1 is provided with the pin bores 3 that run through up and down, and pin bores 3 are
Two, in the side wall of slot electrode opposite side, cover the surface of the pedestal after copper 1 and be provided with attached layers of copper 4, attached layers of copper 4 wherein side
Surface be imprinted with circuit figure layer 5, the surface gold-plating of circuit figure layer 5 forms metal level 6, and the surface of metal level 6 is provided with protective layer 7；Seat
The top at the length direction both ends of body 1 is provided with elargol layer 8, and the elargol in elargol layer 8 connects through pin bores 3 with corresponding electrode 2,
Chip 9 is fixed with elargol layer 8, the pedestal 1 in the outside of chip 9 is provided with upper lid 10.
The present embodiment uses pedestal made of ceramic material, and it has, and high intensity, good insulating while manufacturing cost are low,
More metal layers are plated again after circuit is marked, are easy to protect circuit, and circuit and metal level oxygen are prevented using protective layer
Change, using the good integrity after the present embodiment, intensity is high, and oxidation-protective effect is good.
Embodiment described above is only the preferred embodiment of invention, and the practical range of invention is not limited with this, therefore all
The change made according to the shape of invention, principle, it all should cover in the protection domain of invention.
Claims (1)
- The preparation method of 1.SMD ceramic flat surface pedestals, it is characterised in that：Described preparation method includes following steps：1）, make thickness be 0.3 ~ 0.8mm ceramic substrate；2）, penetrate using Zhen Kong Splash plated film ceramic metallization carried out to ceramic substrate, ceramic base plate surface is formed metallic film；3）, ceramic base plate surface delineate cut line groove, several base units are separated to form by wire casing；4）, ceramic substrate is put into puncher, each base unit is punched, the hole beaten is pin bores and slot electrode；5）, the ceramic substrate after punching be put into plasma cleaning equipment cleaned, dry；6）, cover in slot electrode copper and formed and cover copper electrode；7）, to complete the 6th）The ceramic substrate of step carries out attached copper, makes ceramic base plate surface composite multi-layer metal, institute by attached copper The metallic element for stating attached copper is titanium, the one or more in nickel, copper；8）, after attached copper ceramic base plate surface marking circuit diagram；9）, marking circuit after carry out it is gold-plated, institute's metal cladding thickness be 1-10 μm；10）, will complete the 9th）The ceramic substrate of step carries out pin bores filling perforation, again by plating in ceramic substrate table after filling perforation Face forms protective layer；11）, will complete the 10th）Elargol is printed on the ceramic substrate of step, elargol corresponds to the copper electrode that covers on each base unit, institute State and cover copper electrode and be located at base unit side, elargol is located at base unit opposite side, elargol and covers and passes through pin between copper electrode Hole connects；12）, place the wafer on corresponding elargol, then fix chip by roasting glue；13）, using pulse seam welder by it is upper lid be welded on completion the 12nd）After step on corresponding base unit；The welding is In high vacuum 8X10-3More than Pa is welded；14）, ceramic substrate is cut after roll welding, form single base unit, the base unit after cutting tested, .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710820078.1A CN107565922B (en) | 2017-09-13 | 2017-09-13 | Preparation method of SMD ceramic planar base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710820078.1A CN107565922B (en) | 2017-09-13 | 2017-09-13 | Preparation method of SMD ceramic planar base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107565922A true CN107565922A (en) | 2018-01-09 |
| CN107565922B CN107565922B (en) | 2020-07-03 |
Family
ID=60979774
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710820078.1A Active CN107565922B (en) | 2017-09-13 | 2017-09-13 | Preparation method of SMD ceramic planar base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107565922B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899154A (en) * | 2022-06-02 | 2022-08-12 | 江苏富乐华功率半导体研究院有限公司 | High-efficiency double-side heat dissipation power module packaging method |
| CN116477963A (en) * | 2023-04-18 | 2023-07-25 | 福建华清电子材料科技有限公司 | Method for producing ceramic copper-clad substrate with pins by using porous ceramic |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1342035A (en) * | 2000-09-04 | 2002-03-27 | 三洋电机株式会社 | Circuit device and its manufacturing method |
| CN102044535A (en) * | 2009-10-26 | 2011-05-04 | 佛山市国星光电股份有限公司 | Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen |
| CN102185580A (en) * | 2010-01-18 | 2011-09-14 | 精工爱普生株式会社 | Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus |
| US20150130326A1 (en) * | 2013-11-12 | 2015-05-14 | Seiko Epson Corporation | Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object |
| CN106486490A (en) * | 2015-08-31 | 2017-03-08 | 广州万维立视数码科技有限公司 | New LED panel assembly, 3D panel assembly and 3D display screen |
-
2017
- 2017-09-13 CN CN201710820078.1A patent/CN107565922B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1342035A (en) * | 2000-09-04 | 2002-03-27 | 三洋电机株式会社 | Circuit device and its manufacturing method |
| CN102044535A (en) * | 2009-10-26 | 2011-05-04 | 佛山市国星光电股份有限公司 | Surface mounted device (SMD) light emitting diode (LED) device and display module thereof for outdoor display screen |
| CN102185580A (en) * | 2010-01-18 | 2011-09-14 | 精工爱普生株式会社 | Electronic apparatus, method of manufacturing substrate, and method of manufacturing electronic apparatus |
| US20150130326A1 (en) * | 2013-11-12 | 2015-05-14 | Seiko Epson Corporation | Wiring board, method of manufacturing the same, element housing package, electronic device, electronic apparatus, and moving object |
| CN106486490A (en) * | 2015-08-31 | 2017-03-08 | 广州万维立视数码科技有限公司 | New LED panel assembly, 3D panel assembly and 3D display screen |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114899154A (en) * | 2022-06-02 | 2022-08-12 | 江苏富乐华功率半导体研究院有限公司 | High-efficiency double-side heat dissipation power module packaging method |
| CN116477963A (en) * | 2023-04-18 | 2023-07-25 | 福建华清电子材料科技有限公司 | Method for producing ceramic copper-clad substrate with pins by using porous ceramic |
| CN116477963B (en) * | 2023-04-18 | 2023-12-26 | 福建华清电子材料科技有限公司 | Method for producing ceramic copper-clad substrate with pins by using porous ceramic |
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| Publication number | Publication date |
|---|---|
| CN107565922B (en) | 2020-07-03 |
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