CN107533202A - Optical bench sub-component with integrated photonic device - Google Patents

Abstract

The invention discloses an optical bench subassembly including an integrated photonic device. Optical alignment of the optoelectronic device to the optical bench can be performed outside of the optoelectronic package assembly prior to attaching the photonic device to the optoelectronic package assembly. The photonic device is attached to the base of the optical bench with its optical input/output in optical alignment with the optical output/input of the optical bench. The optical bench supports the array of optical fibers in precise relationship with respect to the structured reflective surface. Photonic devices are mounted on the submount to be attached to the optical bench. Photonic devices can be actively or passively aligned with the optical bench. After optical alignment is achieved, the submount of the photonic device is fixedly attached to the base of the optical bench. The optical bench subassembly can be structured to be hermetically sealed as a hermetic feedthrough for hermetically attaching to a hermetic optoelectronic package.

Description

Optical bench subassembly with integrated photonics

Background technique

1. Priority claims

This application:

(1) claiming priority to U.S. Provisional Patent Application No. 62/136,601, filed March 22, 2015;

(2) is a continuation-in-part of U.S. Patent Application No. 13/861,273 filed on April 11, 2013, which continuation-in-part:

(a) claiming priority to U.S. Provisional Patent Application No. 61/623,027, filed April 11, 2012,

(b) claiming priority to U.S. Provisional Patent Application No. 61/699,125, filed September 10, 2012, and

(c) is a continuation-in-part of U.S. Patent Application No. 13/786,448, filed March 5, 2013, which requires U.S. Provisional Patent Application No. 61/606,885, filed March 5, 2012 number priority.

(3) It is a continuation-in-part of U.S. Patent Application No. 14/714,211 filed on May 15, 2015, which continuation-in-part:

(a) claiming priority to U.S. Provisional Patent Application No. 61/994,094, filed May 15, 2014,

(b) is a continuation-in-part of U.S. Patent Application No. 14/695,008 filed April 23, 2015.

These applications are fully incorporated by reference as if fully set forth herein. All disclosures set forth below are fully incorporated by reference as if fully set forth herein.

2. Technical fields

The present invention relates to optical bench subassemblies, more particularly to optical bench based optical fiber subassemblies, and more particularly to optical bench based hermetic fiber feedthrough subassemblies.

3. Existing technology

There are many advantages to transmitting optical signals via fiber optic waveguides, and their uses are diverse. Single and multiple fiber optic waveguides can be easily used to transmit visible light to remote locations. Complex telephony and data communication systems can transmit multiple specific optical signals. Data communication systems involve devices joining optical fibers in an end-to-end relationship, including optoelectronic or photonic devices, which include optical and electronic components that provide, detect and/or control light to convert between optical and electrical signals.

For example, a transceiver (Xcvr) is an optoelectronic module comprising a transmitter (Tx) and a receiver (Rx) combined with circuitry within a module housing, known in the prior art as a package. The package can be hermetically sealed to protect its contents from the environment. The transmitter includes a light source (eg, a VCSEL or DFB laser), and the receiver includes a light sensor (eg, a photodiode (PD)). Heretofore, the circuitry of the transceiver (eg, including the laser driver, transimpedance amplifier (TIA), etc.) is soldered to the printed circuit board. Such transceivers generally have a substrate (hermetic or non-hermetic) forming the base or base of the package, and then optoelectronic devices such as lasers and photodiodes are soldered to the substrate. The optical fiber is connected to the outside of the enclosure or uses a gas-tight feedthrough to pass through the wall of the enclosure (see US20130294732A1, which is commonly assigned to the assignee/applicant of the present application, and is fully described as if fully set forth herein incorporated).

The ends of the optical fibers are optically coupled to optoelectronic devices held in the housing. The feedthrough element supports a portion of the optical fiber passing through the wall opening. For many applications, it may be desirable to hermetically seal the optoelectronic device within the housing of the optoelectronic module to protect the components from corrosive media, moisture, and the like. Since the package of the optoelectronic module as a whole must be hermetically sealed, the feedthrough element must be hermetically sealed such that the optoelectronic components within the optoelectronic module housing are reliably and continuously protected from environmental influences.

For proper operation, optoelectronic devices supported on printed circuit boards require efficient coupling of light to external optical fibers. Some optoelectronic devices require single-mode optical connections, which require tight alignment tolerances between the fiber and the device, typically less than 1 micron. This is particularly challenging for multi-fiber applications where multiple fibers require the use of active optical alignment methods (where the position and orientation of the fiber(s) is adjusted by mechanical devices down to the fiber and optoelectronic devices. are optically aligned to multiple optoelectronic devices until the amount of light passing between them is maximized.

FIGS. 1A and 1B illustrate a hermetically sealed optoelectronic package 500 having a hermetically sealed multi-fiber feedthrough 502 with a photon submount 506 mounted on a submount 506 supported by the bottom of the package 500. Device 504 is actively aligned. In this example, the feedthrough 502 is similar to the optical coupling device disclosed in US2016/0016218A1, which has been commonly assigned to the assignee/applicant of the present application and is fully incorporated as if fully set forth herein . Photonic device 504 may include a VCSEL array and/or a PD array supported on the package bottom, eg, via submount 506 and printed circuit board 508 . The printed circuit board 508 is provided with other electronic components and circuits, and the package 500 may include several printed circuit boards. After the photonic device 504 /submount 506 and other components are assembled into the package 500 , the feedthrough 504 is inserted through the opening 503 defined by the nozzle 50 on the sidewall of the housing 501 of the package 500 . The array of optical fibers 20 of optical cable 21 is supported by feedthrough 502 and actively aligned with photonic device 504 to achieve a desired optical coupling efficiency between the photonic device and the array of optical fibers 20 . This process requires that the photonic device 504 and associated electronics (not shown) be pre-assembled into the package 500 . The photonic device 504 is activated/stimulated to send/receive optical signals 22 to/from the array of optical fibers 20 . Essentially, the optical signal to/from the optical fiber 20 is optimally coupled to the photonic device 504 when the signal 22 transmitted between the optical fiber 20 and the photonic device 504 is maximized. The feedthrough 502 is then soldered in optical alignment into the nozzle 50 at the package side wall of the housing 501 .

Active optical alignment involves a relatively complex, low-throughput process, since the VCSEL or PD must be activated during the active alignment process. Manufacturers of integrated circuits typically have expensive capital equipment capable of submicron alignment (e.g., wafer probers and handlers for testing integrated circuits), while companies that package chips typically have less capable machinery (several Micron alignment tolerances, generally not applicable to single-mode devices), and manual operations are often used.

The current state of the art, apart from common electronics use and assembly processes, is expensive due to the inclusion of packages, and/or is often unsuitable for single-mode applications. Packages are relatively more expensive assemblies (which include expensive circuit components such as ICs, etc.) than hermetic feedthrough subassemblies. Given the required pre-assembly of components supporting active optical alignment in pre-assembled packages and further assuming that the active alignment and soldering process involves steps with high risk to the end of the overall packaging process, due to defective parts The resulting failure to achieve active alignment will result in the discarding of the entire package, including the photonic device and other components already packaged therein, that defective components may have been introduced during the active alignment process.

Furthermore, while VCSEL and PD components can be tested statically prior to assembly, they cannot be tested in operational conditions until the electronics to drive these components are assembled in the package. Therefore, the burn-in process of VCSEL and PD components (to identify early-life component failures based on simulated loading conditions) can be performed only after these components are assembled into packages. This will lead to further waste of packages (ie low package yield) that are assembled relatively more expensive modules due to defective but relatively inexpensive VCSEL and PD components. VCSEL and PD components are known to contribute to a relatively high number of rejects of assembled packages.

An additional failure mode that results in wasted assembled packages is caused by relatively larger and more compliant structural rings (represented by dashed lines in Figure 1B ) that maintain optical alignment between the photonic device and the feedthrough , as shown in Figure 1B. Long structural loops are more sensitive to thermo-mechanical deformation (which can cause the package to deviate from intended design specifications), thereby leading to failure modes.

There is a need for improved structures for optically aligned coupling of input/output ends of optical fibers to optoelectronic components/photonic devices that improve throughput, tolerances, manufacturability, ease of use, functionality and reliability at reduced cost .

Contents of the invention

The present invention provides an improved structure that facilitates optical alignment of photonic devices to an optical bench, which overcomes the disadvantages of the prior art. The present invention combines the photonic device and the optical bench in a subassembly, so that the optical coupling of the photonic device and the optical bench can be performed outside the optoelectronic packaging assembly.

According to the invention, the photonic device is attached to the base of the optical bench with its optical input/output optically aligned with the optical output/input of the optical bench.

In one embodiment, the optical bench supports optical components in the form of optical waveguides (eg, optical fibers). In a more particular embodiment, the base of the optical bench defines an alignment structure in the form of at least one groove to precisely support the end portion of the optical fiber. Optical elements (eg, lenses, prisms, reflectors, mirrors, etc.) may be provided in precise relationship to the end faces of the optical fibers. In another embodiment, the optical element includes a structured surface, which may be a flat reflective surface or a concave reflective surface (eg, an aspheric mirror surface).

In one embodiment, the photonic device may be mounted on a submount attached to the base of the optical bench in optical alignment with the optical bench. The submount may be provided with circuitry, electrical contact pads, circuit components (eg, drivers for VCSELs, TIAs for PDs), and other components and/or circuits associated with the operation of the photonic device.

Photonic devices can be passively aligned with the optical bench (eg, relying on alignment marks provided on the optical bench). Alternatively, the photonic device and the optical bench can be actively aligned by passing optical signals between the optical waveguides in the optical bench and the photonic device. Photonic devices (eg, VCSELs and/or PDs) can be activated to allow active alignment with optical waveguides (eg, optical fibers) supported in the optical bench without relying on other components within the package. After optical alignment is achieved, the submount of the photonic device is fixedly attached to the base of the optical bench.

The base of the optical bench is preferably formed by stamping a malleable material (eg, metal) to form the precise geometry and features of the optical bench. The optical bench subassembly can be structured to be hermetically sealed.

In another embodiment of the invention, the optical bench is structured to support a plurality of waveguides (e.g., a plurality of optical fibers) and a structured reflective surface (e.g., an array of mirrors) to communicate with the photon optics mounted on the submount. Arrays of devices (VCSELs and/or PDs) work together.

The present invention precisely preassembles optical elements and components and photonic devices into optical bench subassemblies prior to assembly into larger optoelectronic packages. Subassemblies can be functionally tested at the subassembly level, outside of the optoelectronic package, including burn-in testing, thereby reducing waste of more expensive optoelectronic packages due to early failure of photonic devices assembled in the optoelectronic package.

Description of drawings

For a fuller understanding of the nature and advantages of the invention, as well as the preferred mode of use, reference should be made to the following detailed description read in conjunction with the accompanying drawings. In the following figures, the same reference numerals designate the same or similar parts throughout the drawings.

FIG. 1A shows a hermetic optoelectronic package including a hermetic optical fiber feedthrough; FIG. 1B is a cross-sectional view taken along line 1B-1B of FIG. 1A .

2A illustrates an optical bench subassembly in the form of a hermetic feedthrough including integrated optoelectronic devices according to one embodiment of the present invention; FIG. 2B is a cross-sectional view taken along line 2B-2B in FIG. 2A , shown as Mounted in a hermetic optoelectronic package.

3A is an enlarged view of the optical bench of the optical bench subassembly of FIG. 2 according to one embodiment of the present invention; FIG. 3B is an assembled view of the optical bench.

FIG. 4A is an enlarged view of an optical bench in an optical bench subassembly according to another embodiment of the present invention; FIG. 4B is an assembled view of the optical bench.

Figure 5 shows an alternative embodiment of a submount for a photonic device in an optical bench subassembly.

6A to 6C show the assembly sequence of the hermetic optoelectronic package, wherein, FIG. 6A illustrates the assembly of the photonic device assembly; FIG. 6B illustrates the assembly and active alignment of the photonic device assembly and the optical bench; FIG. 6C diagram The assembly of a hermetic optoelectronic package is shown.

Figure 7 shows a hermetic feedthrough installed in a hermetic optoelectronic package.

detailed description

The present invention is described below with reference to various embodiments with reference to the accompanying drawings. While this invention has been described in terms of the best mode for carrying out its objectives, those skilled in the art will appreciate that modifications may be made in light of these teachings without departing from the spirit or scope of the invention.

The present invention provides an improved structure that facilitates optical alignment of photonic devices to an optical bench, which overcomes the disadvantages of the prior art. The present invention combines the photonic device and the optical bench in a subassembly, so that the optical coupling alignment of the photonic device and the optical bench can be performed outside the optoelectronic package assembly.

According to the invention, the photonic device is attached to the base of the optical bench with its optical input/output optically aligned with the optical output/input of the optical bench. Various embodiments of the present invention incorporate certain inventive concepts developed by the assignee of the present invention (nanoPrecision Products, Inc.), including various patented products including optical bench subassemblies for use in connection with optical data transmission, including The concepts disclosed in the patent publications discussed below, which have been commonly assigned to the assignee. Priority to the pending application has been claimed here.

For example, US Patent Application Publication No. US2013/0322818A1 discloses an optical coupling device for routing optical signals in the form of an optical bench having a stamped structured surface for routing optical data signals. The optical bench includes a metal base having a structured surface defined therein, wherein the structured surface has surface contours that bend, reflect, and/or reshape incident light. The base also defines an alignment structure configured with surface features to facilitate precise positioning of an optical component (eg, an optical fiber) on the base in precise optical alignment with the structured surface, thereby allowing light to travel along the structured surface. A defined path transport between the surface and the optical component, wherein the structured surface and alignment structures are integrally defined on the base by stamping a malleable metallic material to form the optical bench.

U.S. Patent Application Publication No. US2015/0355420A1 also discloses an optical coupling device for routing optical signals used in an optical communication module, in particular an optical coupling device in the form of an optical bench, wherein there are functions to bend, reflect and/or Or a structured surface of reshaped surface profile is defined on the metal base. An alignment structure is defined on the submount configured with surface features to facilitate positioning an optical component (eg, an optical fiber) on the submount in light alignment with the structured surface, thereby allowing the light to travel along the path between the structured surface and the optical component. Restricted route transmission. The structured surface and alignment structures are integrally defined on the base by stamping the ductile metallic material of the base. The alignment structure facilitates passive alignment of the optical component on the submount in optical alignment with the structured surface to allow light to travel along a defined path between the structured surface and the optical component.

U.S. Patent Application Publication No. US2013/0294732A1 also discloses a hermetic fiber optic alignment assembly with an integral optical element, in particular a hermetic fiber optic alignment assembly including an optical bench comprising a metal sleeve with a plurality of grooves A collar portion, the plurality of grooves for receiving an end portion of an optical fiber, wherein the grooves define a location and orientation of the end portion with respect to the ferrule portion. The assembly includes an integral optical element for coupling the input/output ends of the optical fiber to the optoelectronic device in the optoelectronic module. The light elements may be in the form of structured reflective surfaces. The end of the optical fiber is at a defined distance from and aligned with the structured reflective surface. The structured reflective surfaces and fiber alignment grooves can be formed by stamping the ductile metal to define these features on the metal base.

US Patent No. 9,213,148 also discloses a similar hermetic fiber alignment assembly, but without the need for an integral structured reflective surface.

US Patent No. 7,343,770 discloses a novel precision stamping system for manufacturing close tolerance parts. Such an inventive stamping system can be implemented in various stamping processes to produce the devices disclosed in the patent publications noted above. These stamping processes involve stamping large volumes of material (e.g., metal blanks) to form final overall geometries and surface feature geometries with tight (i.e., small) tolerances, including the desire to have precise alignment with other defined surface features Reflective surfaces of geometric shapes.

US Patent Application Publication No. US2016/0016218A1 also discloses a composite structure comprising a base having a main part and an auxiliary part of a dissimilar metallic material. The base and auxiliary parts are formed by stamping. As the auxiliary part is stamped, it interlocks with the base, and at the same time, desired structured features, such as structured reflective surfaces, fiber alignment features, etc., are formed on the auxiliary part. Using this method, relatively less critical structural features on the volume of the base can be formed with less effort to maintain relatively larger tolerances, while relatively more critical structural features on the auxiliary part are more precisely formed. Precisely shaped to further consider defining size, geometry and/or finish within relatively tight tolerances. The auxiliary part may comprise an additional composite structure having two dissimilar metallic materials associated with different properties for stamping different structural features. This method of stamping improves on the earlier stamping process in US Patent No. 7,343,770, in which the bulk material subjected to stamping is a homogeneous material (e.g., metal strips such as Kovar, aluminum, etc.) . The stamping process produces structural features from a single homogeneous material. Thus, the different features will share properties of the material that cannot be optimized for one or more features. For example, features that are suitable for stamping alignment features may not possess properties suitable for stamping reflective surface features with optimal light reflection efficiency to reduce optical signal loss.

U.S. Patent No. 8,961,034 discloses a method of producing a ferrule for supporting an optical fiber in a fiber optic connector, comprising stamping a metal blank to form a body having a plurality of generally U-shaped longitudinally open grooves, each groove having a a longitudinal opening in the surface of the body, wherein each groove is sized to securely hold the optical fiber in the groove by gripping the optical fiber. The optical fibers are held securely in the body of the ferrule without the need for additional fiber retaining members.

PCT Patent Application Publication No. WO2014/011283A2 discloses a ferrule for an optical fiber connector, which overcomes many shortcomings of prior art ferrules and connectors, and further improves the pinless alignment ferrule described above. The fiber optic connector includes a fiber optic ferrule having a generally elliptical cross-section for aligning an array of multiple optical fibers with fibers held in another ferrule using a ferrule.

The above inventive concept is incorporated herein by reference, and will be cited below for the convenience of disclosing the present invention. Exemplary embodiments of the present invention are disclosed with respect to a hermetic fiber optic feedthrough for a hermetic optoelectronic package that includes an optical bench subassembly with integrated photonic devices.

2A and 2B illustrate one embodiment of a sealed fiber feedthrough in the form of an optical bench subassembly 10 comprising an optical bench 11 with integrated photonic devices 12 according to one embodiment of the present invention. In the illustrated embodiment, photonic device 12 is mounted on submount 14 at a position aligned with the optical input/output of optical bench 11 (see optical signal 22 in FIG. 2B ), attached to submount 14. Connect to optical bench 11.

3A and 3B illustrate the structure of the optical bench 11 in the optical bench subassembly 10 more clearly. In this embodiment, the optical bench 11 is similar to the hermetic multi-fiber alignment subassembly disclosed in assignee's US2016/0016218A1 cited above. The optical bench supports one or more optical waveguides of a plurality of optical fibers 20 which in the illustrated embodiment are optical cables 21 . In the case of multiple optical fibers, the base 13 of the optical bench 11 defines a plurality of open grooves 16 that support the optical fibers 20 and define or support optical elements (eg, lenses, prisms, reflectors, mirrors, etc.). In the illustrated embodiment, the optical element includes an array of structured reflective surfaces 17 , one for each optical fiber 20 . The reflective surface may be a flat reflective surface or contoured as a concave reflective surface (eg, an aspheric mirror surface) or a convex reflective surface. In the illustrated embodiment, the base 13 comprises a composite structure comprising an auxiliary portion 30 of material dissimilar to that of the remainder of the base 13, i.e. the main portion 13'. The base 13 including the auxiliary portion 30 is stamped from a malleable material to form the body geometry and desired surface features. In this case, the auxiliary part is formed by stamping a malleable metal material to form the array of structured reflective surfaces 17 and grooves 18, while the base 13 is stamped from a different malleable metal material to form the recesses. Slot 16 and other structures shown. As disclosed in US2016/0016218A1, when the auxiliary part 17 is stamped, it interlocks with the base 13, like a rivet, and at the same time forms the desired structured features on the auxiliary part 30, including the array of structured reflective surfaces 17 and Fiber alignment grooves 18 for supporting end portions of optical fibers 20 such that each reflective surface 17 maintains a precise relationship with the end face (ie, input end/output end) of the corresponding optical fiber 20 . In this embodiment, the auxiliary part 17 and the main part 13' are stamped from dissimilar metal materials.

The open grooves 16 and 18 can be punched open grooves according to the disclosed in U.S. Patent No. 8,961,034 (which firmly clamps the optical fiber in the groove without the need for additional fastening members (for example, without epoxy Resins, etc.)) are configured and formed. In the illustrated embodiment, cover 15 is provided to cover base 13 without covering structured reflective surface 17 . A hermetic sealing epoxy (e.g., glass epoxy) is applied to fill the space around the portion of the optical fiber 20 in the cavity 19 between the cover 15 and the base 13 to form a hermetic seal such that the optic Socket 11 is a feedthrough that can be used with an optoelectronic package in a similar function to the hermetic feedthrough 502 of FIG. 1 , except that optical bench 11 has integrated thereon to form an optical bench assembly 10 optoelectronic devices. A further elaboration of a similar hermetic feedthrough structure can be found in US2013/0294732A.

4A and 4B illustrate another embodiment of an optical bench 11' that is similar to the optical bench 11 of FIGS. In this embodiment, the optical bench 11' is provided with a detachable connection in the form of a ferrule 30. Instead of the fiber 21 extending away from the optical bench 11', the ferrule 30 supports the proximal section of the short portion of the fiber 20, while the distal portion of the fiber is supported by the grooves 16 and 18 in the optical bench 11'. The ferrule 30 may be structured to have a generally elliptical cross-section, as disclosed in WO2014/011283A2. A sleeve (not shown) may be used to couple to, for example, a fiber optic cable terminated with a similar ferrule (eg, a patch cable). In this embodiment, if the connecting cable becomes defective, it can be disconnected and replaced without needing to replace the entire optoelectronic package to which the optical bench 11' is permanently or fixedly attached. pieces.

Turning now to photonic devices, in the illustrated embodiment of FIGS. 2A and 2B , photonic device 12 is mounted to submount 14 to form photonic device assembly 23 . Submount 14 may be provided with circuitry, electrical contact pads, circuit components (eg, drivers for VCSELs, TIAs for PDs), and other components and/or circuits associated with the operation of photonic device 12 .

6A to 6C illustrate the assembly sequence of the hermetic optoelectronic package. Figure 6A illustrates the assembly of the photonic device (transmitter or receiver or transceiver) assembly; Figure 6B illustrates the assembly and active alignment of the photonic device assembly with the optical bench; Figure 6C illustrates the hermetic optoelectronic package assembly of parts.

Referring to FIG. 6A , where the photonic device 12 is a transmitter such as a VCSEL, it is mounted on a submount 14 together with a driver chip. The VCSELs may be wire bonded to circuitry on submount 14 . Testing may be performed after assembly to confirm that the VCSEL is operable to transmit light signals. In case the photonic device 12 is a receiver, such as a PD, it is mounted on a submount 14 together with a TIA chip. The PD may be wire bonded to circuitry on the submount 14 . Testing may be performed after assembly to confirm that the PD is operable to receive an optical device and output an electrical signal. In the case of a transceiver, the above procedures are combined to test separate receive and transmit functions. Photonic device 12 may include multiple receivers, transmitters and/or transceivers mounted on submount 14 .

Referring to FIG. 6B, the submount 14 of the photonic device assembly is in a position where the photonic device 12 is optically aligned with the optical bench 11 (in this position, the input/output of the photonic device 12 is connected to the output and input of the optical bench 11). End optical alignment) is attached to the opposite surface of the base 13 of the optical bench 11 so that the optical pathway 12 achieves the desired optical coupling efficiency between the photonic device and the optical fiber 20. 2B, the optical path 22 is between the end face of the input/output end of the optical fiber 20 and the output/input end of the corresponding optical device 12. surface) to bend and reshape. More specifically, in the illustrated embodiment, the optical path is in a direction out of the plane of the base 13 which is generally perpendicular to the plane of the base 13 . As shown in FIG. 2B , the plane of the sub-base 24 is parallel to the plane of the base 13 . The frame 32 is provided as a spacer between opposite surfaces of the sub-mount 14 and the base 13 to provide a space between the sub-mount 14 and the base 13 to accommodate the photonic device 13 . In the illustrated embodiment, there are four arrays of reflective surfaces 17 corresponding to four arrays of optical fibers 20 .

Photonic device 12 may be passively aligned with optical bench 11 (eg, by relying on alignment marks (not shown) provided on the base of optical bench 11 ). Alternatively, the photonic device 12 and the optical bench 11 can transmit an optical signal between the optical waveguide in the optical bench 11 (i.e., the optical fiber 20) and the photonic device 12 and measure the intensity of the optical signal in the optical path to determine the indicating optical signal. The aligned state of the optical link is actively aligned. Photonic devices 12 (e.g., VCSELs and/or PDs) can be activated to allow active alignment with optical fibers supported in the optical bench 11 without relying on other components within the optoelectronic package, the optical bench Component 10 is mounted to the optoelectronic package. For example, where the optoelectronic device 12 is a transmitter (eg, a VCSEL), it is energized to emit light toward the reflective surface 17 to be directed to the end face of the corresponding optical fiber 20 . The intensity of the optical signal transmitted via the reflective surface 17 and through the corresponding optical fiber is measured to determine the optical coupling between the transmitter and the optical bench 11 . In case the optoelectronic device is a receiver (eg PD), the optical signal reflected by the reflective surface to the corresponding receiver is supplied through the optical fiber. The degree of optical coupling between the optical fiber and the receiver can be determined from the electrical output of the receiver, which corresponds to the strength of the received optical signal, to identify the alignment state. The active alignment process involves moving the photonic device 12 in the plane of the submount 14 about the reflective surface 17 while determining the optical coupling efficiency for the alignment point. In order to facilitate the electrical connection to perform active alignment, conductive pads are provided on the surface of the submount remote from the base 13 .

Once the desired optical alignment is achieved, the submount 14 of the photonic device 12 is fixedly attached to the base of the optical bench, eg, by laser welding, soldering, or epoxy.

After the optical bench subassembly 10 is assembled, it may be aged to eliminate early life failures and further functionally tested.

The preceding embodiments of the optical bench subassembly 10 including the integrated photonic device 12 are hermetic feedthroughs with the integrated photonic device 12 .

6C, and as shown in FIG. 2B, once the assembly of the optical bench subassembly 10 is complete, the optical bench subassembly 10 is hermetically (eg, by soldering) attached to the optoelectronic package 500', the optoelectronic package 500 ′ may be similar to package 500 of FIG. 1A except that photonic device 12 is integrated into optical bench subassembly 10 in optical alignment with optical bench 11 . The optoelectronic package 500' is provided with various components (eg, ICs, chips, submounts, circuit boards, etc.). The optical bench subassembly 10, which is a hermetic feedthrough, is inserted through the opening of the nozzle 50 in the sidewall of the housing 501' of the seal 500' and hermetically sealed (eg, by brazing). In contrast to the situation of FIG. 1B , the position of the feedthrough with respect to the encapsulation 500' is not critical because there is no required optical alignment between the feedthrough and the external photonic device within the package 500'. As shown in FIG. 2B , submount 14 may be solder bonded to a printed circuit board 39 (which may be a flexible printed circuit board) within package 500 ′ using through holes 36 provided through the base of submount 14 for connection to The photonic device 12 on the other side of the submount 14 . A ball grid array (BGA) with micro-soldered ball joints may be disposed on the submount 14 . Other electrical connections may include the optical bench subassembly 10' in the embodiment of FIG. A circuit board (not shown) in part 500'. Alternatively, spring pins (not shown) may be configured to form an electrical connection between the submount and a printed circuit board in package 500'. These electrical connections absorb error motion and stress due to thermal expansion/contraction, which will not affect the optical alignment between the photonic devices integrated on the board and the optical bench in the optical bench subassembly.

Figure 7 illustrates the hermetic feedthrough/optical bench subassembly 10 installed in a hermetic optoelectronic package 500'. Other electronics and circuit components are omitted from the view of FIG. 7 . The hermetic cover of the hermetic optoelectronic package 500' is also omitted from view.

After the optical bench subassembly 10 is assembled into the hermetic optoelectronic package 500', the package 500' can be aged to eliminate early life failures and further functionally tested.

Given that the present invention precisely pre-assembles optics and components and photonics into an optical bench subassembly prior to assembly into a larger optoelectronic package, the optical bench subassembly can be outside of the optoelectronic package, within the subassembly The stages are functionally tested, including burn-in testing, thereby reducing waste of more expensive optoelectronic packages (including expensive circuit components such as ICs, etc.) due to early failure of photonic devices mounted in the optoelectronic package. The active alignment process of the optical bench subassembly is much easier. Additionally, a much smaller and more robust structural ring is provided between the optical bench and the photonic device. Thereby, an overall higher yield, higher reliability and lower manufacturing costs can be achieved for optoelectronic packages comprising a hermetic feedthrough according to the invention.

Although the present invention has been particularly shown and described with reference to preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made without departing from the spirit, scope and teaching of the invention. Accordingly, the disclosed invention is to be considered as illustrative only and limited only as specified in the appended claims.

Claims (20)

1. a kind of optical bench sub-component for being used to route optical signal, including：

Optical bench, including：

Pedestal；

Patterned surface, it is limited on pedestal, wherein, patterned surface has so that incident light reshapes and curved surface Profile；

Optical component；And

Align structures, it is limited on pedestal, is configured with surface characteristics, it is fixed by optical component and patterned surface optical alignment Position is on pedestal, so as to allow optical path transmission of the optical signal along the restriction between patterned surface and optical component, its In, optical path is extended to outside pedestal from patterned surface；And

Photonic device component, including photonic device, wherein, photonic device component is attached to pedestal, and wherein photonic device is along light Ways for education footpath optical alignment is to patterned surface.

2. optical bench sub-component as claimed in claim 1, wherein, optical component includes fiber waveguide.

3. optical bench sub-component as claimed in claim 2, wherein, fiber waveguide includes the array of optical fiber, and patterned surface Array including structured reflecting surface.

4. optical bench sub-component as claimed in claim 3, in addition to lid, the lid is airtightly attached to pedestal, with airtightly close The space sealed around the section of the array of optical fiber, wherein, lid does not extend with covered structure surface, is consequently formed airtight feedthrough Part.

5. optical bench sub-component as claimed in claim 4, wherein, it is mounted thereto that photonic device component includes photonic device Sub- base, and wherein, sub- base is attached to the pedestal of optical bench, wherein photonic device and patterned surface optical alignment.

6. optical bench sub-component as claimed in claim 5, wherein, photonic device includes transmitter, receiver or transceiver.

7. optical bench sub-component as claimed in claim 6, wherein, photonic device is passively aligned to patterned surface.

8. optical bench sub-component as claimed in claim 6, wherein, photonic device is actively aligned to patterned surface.

9. optical bench sub-component as claimed in claim 1, wherein, patterned surface and align structures by punch pad can The material of extension and be integrally defined on pedestal.

10. optical bench sub-component as claimed in claim 9, wherein, pedestal includes：

The major part of first material, for limiting first structure feature；And

The slave part of second material, for limiting the second structured features on the second material, wherein, the second material and first Material is dissimilar,

Wherein, pedestal is attached in slave part structure, to be consequently formed including special with the first structureization being limited to thereon The major part of first material of sign and slave part with the second material for being limited to the second structured features thereon Composite construction, and wherein, the first and second structured features limit optical path to route optical signal.

11. a kind of airtight photoelectric packaging part, including：

Shell；

Electronic unit, it is arranged in shell；And

Optical bench sub-component as shown in claim 4, is attached to shell.

12. airtight photoelectric packaging part as claimed in claim 11, wherein, optical bench sub-component airtightly seal to shell it It is preceding functionally to be tested.

13. a kind of method for assembling the optical bench sub-component for routeing optical signal, including：

Optical bench is provided, optical bench includes：

Pedestal；

Patterned surface, it is limited on pedestal, wherein, patterned surface has so that incident light reshapes and curved surface Profile；

Optical component；And

Align structures, it is limited on pedestal, is configured with surface characteristics, it is fixed by optical component and patterned surface optical alignment Position is on pedestal, so as to allow optical path transmission of the optical signal along the restriction between patterned surface and optical component, its In, optical path is extended to outside pedestal from body structure surface；

There is provided includes the photonic device component of photonic device；

Along optical path by photonic device optical alignment to patterned surface；And

Once optical alignment, photonic device component is attached to pedestal.

14. method as claimed in claim 13, wherein, optical component includes the array of optical fiber, and patterned surface includes The array of structured reflecting surface, and wherein, methods described also includes providing lid, and the lid is airtightly attached to pedestal, with Space around the section of the array of gas-tight seal optical fiber, wherein, lid does not extend with covered structure surface, is consequently formed airtight Feedthrough component.

15. method as claimed in claim 14, wherein, photonic device component includes photonic device bottom mounted thereto Seat, and wherein, sub- base is attached to the pedestal of optical bench, wherein photonic device and patterned surface optical alignment.

16. method as claimed in claim 15, wherein, photonic device includes transmitter, receiver or transceiver.

17. method as claimed in claim 16, wherein, photonic device is actively aligned to patterned surface.

18. method as claimed in claim 17, wherein, optical bench component is functionally tested in sub-component level, including aging Test.

19. a kind of method for forming airtight photoelectric packaging part, including：

Shell is provided；

Electronic building brick is set in shell；And

The optical bench sub-component assembled according to claim 14 is airtightly attached to shell.

20. method as claimed in claim 19, wherein, optical bench sub-component is before airtightly sealing to shell by functionally Test, including burn-in test.