CN107523019A - A kind of Buddha's warrior attendant wire cutting is with resin material and Buddha's warrior attendant wire cutting resin plate - Google Patents
A kind of Buddha's warrior attendant wire cutting is with resin material and Buddha's warrior attendant wire cutting resin plate Download PDFInfo
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- CN107523019A CN107523019A CN201710882333.5A CN201710882333A CN107523019A CN 107523019 A CN107523019 A CN 107523019A CN 201710882333 A CN201710882333 A CN 201710882333A CN 107523019 A CN107523019 A CN 107523019A
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- Prior art keywords
- buddha
- wire cutting
- warrior attendant
- parts
- attendant wire
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- 238000005520 cutting process Methods 0.000 title abstract description 60
- 229920005989 resin Polymers 0.000 title abstract description 60
- 239000011347 resin Substances 0.000 title abstract description 60
- 239000000463 material Substances 0.000 title abstract description 33
- 239000003063 flame retardant Substances 0.000 abstract description 49
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 44
- 239000003795 chemical substances by application Substances 0.000 abstract description 32
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 25
- 229910052710 silicon Inorganic materials 0.000 abstract description 25
- 239000010703 silicon Substances 0.000 abstract description 25
- 239000000377 silicon dioxide Substances 0.000 abstract description 22
- 235000013312 flour Nutrition 0.000 abstract description 19
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 abstract description 16
- 150000001875 compounds Chemical class 0.000 abstract description 14
- 229920003002 synthetic resin Polymers 0.000 abstract description 11
- 239000000057 synthetic resin Substances 0.000 abstract description 11
- 239000000945 filler Substances 0.000 abstract description 10
- 239000002002 slurry Substances 0.000 abstract description 10
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 abstract description 8
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 abstract description 8
- 238000005452 bending Methods 0.000 abstract description 7
- 230000007613 environmental effect Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 239000007822 coupling agent Substances 0.000 description 15
- 238000007711 solidification Methods 0.000 description 9
- 230000008023 solidification Effects 0.000 description 9
- 229940126062 Compound A Drugs 0.000 description 7
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 7
- 239000003999 initiator Substances 0.000 description 7
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 229910000077 silane Inorganic materials 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- 229910052804 chromium Inorganic materials 0.000 description 4
- 239000011651 chromium Substances 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- GEMHFKXPOCTAIP-UHFFFAOYSA-N n,n-dimethyl-n'-phenylcarbamimidoyl chloride Chemical group CN(C)C(Cl)=NC1=CC=CC=C1 GEMHFKXPOCTAIP-UHFFFAOYSA-N 0.000 description 4
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 3
- 229940125904 compound 1 Drugs 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 241000894007 species Species 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 2
- 229910021502 aluminium hydroxide Inorganic materials 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 150000007524 organic acids Chemical class 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- FDPIMTJIUBPUKL-UHFFFAOYSA-N pentan-3-one Chemical compound CCC(=O)CC FDPIMTJIUBPUKL-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- HBGPNLPABVUVKZ-POTXQNELSA-N (1r,3as,4s,5ar,5br,7r,7ar,11ar,11br,13as,13br)-4,7-dihydroxy-3a,5a,5b,8,8,11a-hexamethyl-1-prop-1-en-2-yl-2,3,4,5,6,7,7a,10,11,11b,12,13,13a,13b-tetradecahydro-1h-cyclopenta[a]chrysen-9-one Chemical compound C([C@@]12C)CC(=O)C(C)(C)[C@@H]1[C@H](O)C[C@]([C@]1(C)C[C@@H]3O)(C)[C@@H]2CC[C@H]1[C@@H]1[C@]3(C)CC[C@H]1C(=C)C HBGPNLPABVUVKZ-POTXQNELSA-N 0.000 description 1
- PFRGGOIBYLYVKM-UHFFFAOYSA-N 15alpha-hydroxylup-20(29)-en-3-one Natural products CC(=C)C1CCC2(C)CC(O)C3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 PFRGGOIBYLYVKM-UHFFFAOYSA-N 0.000 description 1
- WFUGQJXVXHBTEM-UHFFFAOYSA-N 2-hydroperoxy-2-(2-hydroperoxybutan-2-ylperoxy)butane Chemical compound CCC(C)(OO)OOC(C)(CC)OO WFUGQJXVXHBTEM-UHFFFAOYSA-N 0.000 description 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- GLBHAWAMATUOBB-UHFFFAOYSA-N 6,6-dimethylheptane-1,1-diamine Chemical compound CC(C)(C)CCCCC(N)N GLBHAWAMATUOBB-UHFFFAOYSA-N 0.000 description 1
- 241000233855 Orchidaceae Species 0.000 description 1
- SOKRNBGSNZXYIO-UHFFFAOYSA-N Resinone Natural products CC(=C)C1CCC2(C)C(O)CC3(C)C(CCC4C5(C)CCC(=O)C(C)(C)C5CCC34C)C12 SOKRNBGSNZXYIO-UHFFFAOYSA-N 0.000 description 1
- PEQYWQJRQVAUAZ-UHFFFAOYSA-L [Cr](=O)(=O)(Cl)Cl.C(C(=C)C)(=O)O Chemical compound [Cr](=O)(=O)(Cl)Cl.C(C(=C)C)(=O)O PEQYWQJRQVAUAZ-UHFFFAOYSA-L 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 description 1
- 229910052794 bromium Inorganic materials 0.000 description 1
- 150000001649 bromium compounds Chemical group 0.000 description 1
- 125000001246 bromo group Chemical group Br* 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/136—Phenols containing halogens
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34922—Melamine; Derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention provides a kind of Buddha's warrior attendant wire cutting resin material and Buddha's warrior attendant wire cutting resin plate, Buddha's warrior attendant wire cutting with resin material in terms of parts by weight, including following components：1~20 part of 20~70 parts of synthetic resin, 5~50 parts of fire retardant, 10~70 parts of silica flour and curing agent；One or more of the fire retardant in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant.Compared with prior art, the Buddha's warrior attendant wire cutting uses silica flour not use the compound containing metal as filler and make filler by the use of resin material so that cutting slurries mitigate environmental protection pressure, and cut slurries and be beneficial to recycle without subsequent treatment；The resin material is close with the silicon rod property cut to be beneficial to cutting so that silicon chip yield is higher.The shore hardness of resin plate prepared by resin material is 80~96, no bending, no deformation；The chipping rate of silicon rod slicing is 1% or so.
Description
Technical field
The present invention relates to Buddha's warrior attendant wire cutting technology field, more particularly to a kind of Buddha's warrior attendant wire cutting resin material and diamond wire
Cutting resin plate.
Background technology
Silicon chip cutting is the important step in photovoltaic solar cell manufacture, most of at present to use diamond wire saw skill
Silicon single crystal rod multi-wire saw is monocrystalline silicon piece by art., it is necessary to which silicon rod is pasted by glue before being cut using the technology
Onto resin plate, so that the position of silicon rod is fixed, it is easy to cut.
The filler such as addition aluminium hydroxide, magnesium hydroxide in the resin plate used at present in industry, although its intensity, hardness
The indexs such as modulus of elasticity can meet cut needs, but cut after the completion of, cut slurries after extended meeting enter Environmental protection type water pool progress
Processing recycles, due to the presence of metal therein so that subsequent treatment or the wherein solid waste recovery for cutting slurries are sharp
Using can be more complicated, causes larger pressure to environmental protection, and cost also can be higher；In addition, aluminium hydroxide, magnesium hydroxide etc.
Filler hardness is low, is easily wrapped in cutting process on gauze, influences to cut, and the chipping rate of silicon chip is 3% or so.
The content of the invention
In view of this, it is an object of the invention to provide a kind of Buddha's warrior attendant wire cutting resin material and Buddha's warrior attendant wire cutting tree
Fat plate, the Buddha's warrior attendant wire cutting with Buddha's warrior attendant wire cutting prepared by resin material resin plate mitigate environmental protection pressure, and silicon chip yield compared with
It is high.
The invention provides a kind of Buddha's warrior attendant wire cutting resin material, in terms of parts by weight, including following components：
1~20 part of 20~70 parts of synthetic resin, 5~50 parts of fire retardant, 10~70 parts of silica flour and curing agent；
The one kind of the fire retardant in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant
It is or a variety of.
Preferably, the fire retardant is selected from bromide fire retardant and/or silicon-series five-retardant.
Preferably, the fire retardant is selected from silica and/or tetrabromobisphenol A.
Preferably, 10~20 parts of fire retardant.
Preferably, the curing agent is selected from organic amine curing agent, organic acid anhydride curing agent, imidazole curing agent, height
One or more in polymers class curing agent and organic peroxide class curing agent.
Preferably, silane coupler, titanate coupling agent and chromium also are selected from comprising 0.1-10 part coupling agents, the coupling agent
The one or more being complexed in compound coupling agent.
Preferably, in addition to 0.1~1 part of initiator；The initiator is selected from cobalt naphthenate.
The invention provides a kind of Buddha's warrior attendant wire cutting resin plate, it is made by following methods：
10~70 parts and 20~70 parts 5~50 parts of fire retardant, silica flour synthetic resin are mixed, obtain compound A, the resistance
Fire one or more of the agent in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant；
The compound A and 1~20 part of curing agent are mixed, obtain compound B；
Compound B is tiled into mould, solidifies, obtains Buddha's warrior attendant wire cutting resin plate.
Preferably, the temperature of the solidification is 50~150 DEG C；The time of the solidification is 15~90min.
The invention provides a kind of Buddha's warrior attendant wire cutting resin material, in terms of parts by weight, including following components：Synthesis tree
1~20 part of 20~70 parts of fat, 5~50 parts of fire retardant, 10~70 parts of silica flour and curing agent；It is fire-retardant that the fire retardant is selected from bromine system
One or more in agent, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant.Compared with prior art, the diamond wire
Cutting uses silica flour not use the compound for containing metal as filler as filler by the use of resin material so that cutting
Slurries mitigate environmental protection pressure, and cut slurries and be beneficial to recycle without subsequent treatment；The resin material and the silicon rod of cutting
Matter is close to be beneficial to cutting so that silicon chip yield is higher.Test result indicates that：The shore hardness of resin plate prepared by resin material is
80~96, no bending, no deformation；The chipping rate of silicon rod slicing is 1% or so.
Brief description of the drawings
Fig. 1 is the process chart provided by the invention for preparing Buddha's warrior attendant wire cutting resin plate.
Embodiment
The invention provides a kind of Buddha's warrior attendant wire cutting resin material, in terms of parts by weight, including following components：
1~20 part of 20~70 parts of synthetic resin, 5~50 parts of fire retardant, 10~70 parts of silica flour and curing agent；
The one kind of the fire retardant in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant
It is or a variety of.
Compared with prior art, the Buddha's warrior attendant wire cutting uses silica flour as filler by the use of resin material, do not use containing
The compound of metal is as filler so that cutting slurries mitigate environmental protection pressure, and cut slurries to follow without subsequent treatment
Ring utilizes；The resin material is close with the silicon rod property cut to be beneficial to cutting so that silicon chip yield is higher.Test result indicates that：
The shore hardness of resin plate prepared by resin material is 80~96, no bending, no deformation；The chipping rate of silicon rod slicing is 1% left
It is right.
In terms of parts by weight, Buddha's warrior attendant wire cutting provided by the invention resin material includes 20~70 parts of synthetic resin, excellent
Elect 40~60 parts as.In the present invention, the synthetic resin is preferably selected from phenolic resin, unsaturated-resin and epoxy resin
One or more, it is more preferably selected from unsaturated-resin and/or epoxy resin.
Buddha's warrior attendant wire cutting provided by the invention resin material includes 5~50 parts of fire retardant, preferably 10~20 parts.At this
In invention, one kind in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant of the fire retardant or
It is a variety of, it is preferably selected from bromide fire retardant and/or silicon-series five-retardant；It is more preferably selected from silica, melamine and tetrabromobisphenol A
In one or more.
Buddha's warrior attendant wire cutting provided by the invention resin material includes 10~70 parts of silica flour, preferably 20~60 parts.At this
In invention, the granularity of the silica flour is preferably 0.5~100 μm.
Buddha's warrior attendant wire cutting provided by the invention resin material includes 1~20 part of curing agent, preferably 2~10 parts.At this
In invention, the curing agent is selected from organic amine curing agent, organic acid anhydride curing agent, imidazole curing agent, high polymer class and consolidated
One or more in agent and organic peroxide class curing agent；It is more preferably selected from trimethylhexane diamine and/or peroxidating first
Ethyl ketone.
Buddha's warrior attendant wire cutting provided by the invention resin material preferably also includes 0.1~10 part of coupling agent, and preferably 2~3
Part.In the present invention, the coupling agent is preferably selected from one in silane coupler, titanate coupling agent and chromium complex coupling agent
Kind is a variety of, more preferably silane coupler and/or chromium complex coupling agent；It is most preferably selected from (the 'beta '-methoxy second of vinyl three
Epoxide) silane and/or methacrylate-chromic chloride salt；In embodiments of the present invention, it is even to be selected from model silane for the coupling agent
Connection agent A-172 or model irrigate blue chromium complex coupling agent.
Buddha's warrior attendant wire cutting provided by the invention preferably also includes 0.1~1 part of initiator with resin material；The initiator choosing
From cobalt naphthenate.
The invention provides a kind of Buddha's warrior attendant wire cutting resin plate, it is made by following methods：
10~70 parts and 20~70 parts 5~50 parts of fire retardant, silica flour synthetic resin are mixed, obtain compound A, the resistance
Fire one or more of the agent in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant；
The compound A and 1~20 part of curing agent are mixed, obtain compound B；
The compound B is tiled into mould, solidifies, obtains Buddha's warrior attendant wire cutting resin plate.
Referring to Fig. 1, Fig. 1 is the process chart provided by the invention for preparing Buddha's warrior attendant wire cutting resin plate.
The present invention mixes 10~70 parts and 20~70 parts 5~50 parts of fire retardant, silica flour synthetic resin, obtains compound A.
It is the fire retardant, the species of silica flour and synthetic resin, consistent described in source and dosage and above-mentioned technical proposal, it is no longer superfluous herein
State.The present invention preferably mixes initiator, coupling agent with fire retardant, silica flour and synthetic resin jointly, obtains compound.It is described to draw
It is consistent with above-mentioned technical proposal to send out the dosage, species and source of agent and coupling agent, will not be repeated here.
After obtaining compound A, the present invention mixes the compound A and 1~20 part of curing agent, obtains compound B.It is described
It is consistent described in source, species and the dosage and above-mentioned technical proposal of curing agent, it will not be repeated here.
After obtaining compound B, the present invention tiles the compound B into mould, solidifies, obtains Buddha's warrior attendant wire cutting tree
Fat plate.It is 5~30mm that the compound B, which tiles to thickness,.The present invention is preferably in insulating box well known to those skilled in the art
Solidification.In the present invention, the temperature of the solidification is preferably 50~150 DEG C, more preferably 80~100 DEG C；The solidification when
Between be preferably 15~90min, more preferably 30~60min.
In order to further illustrate the present invention, with reference to embodiment to a kind of Buddha's warrior attendant wire cutting resin provided by the invention
Material and Buddha's warrior attendant wire cutting are described in detail with resin plate, but they can not be interpreted as to the limit to the scope of the present invention
It is fixed.
Embodiment 1
By 50 parts of fire retardant silica, 20 parts of the silica flour that the fertile blue 3 parts, granularity of coupling agent is 0.5~100 μm, it is added to
In 40 parts of epoxy resin, stir, then add curing agent trimethyl 10 parts of diamines thereto again, stir
Afterwards, it is evenly laid out in a mold by material distributing machine, into insulating box after 100 DEG C of solidification 30min, Temperature fall, obtain Buddha's warrior attendant
Wire cutting resin plate.
The resin plate shore hardness is 88, no bending, no deformation, suitable for the Buddha's warrior attendant wire cutting of silicon rod；Embodiment 1 is made
Standby Buddha's warrior attendant wire cutting resin plate is used for silicon rod slicing, and the chipping rate of section is 1.3%.
Embodiment 2
By 10 parts of fire retardant tetrabromobisphenol A, two parts of silane coupling A -172,60 parts of the silica flour that granularity is 0.5~100 μm,
0.1 part of initiator cobalt naphthenate, is added in 40 parts of unsaturated-resin, then adds curing agent peroxidating first and second thereto again
2 parts of ketone, it is evenly laid out in a mold by material distributing machine after stirring, into insulating box after 80 DEG C of solidification 60min,
Temperature fall, obtain Buddha's warrior attendant wire cutting resin plate.
The resin plate shore hardness is 90, no bending, no deformation, suitable for the Buddha's warrior attendant wire cutting of silicon rod；Embodiment 2 is made
Standby Buddha's warrior attendant wire cutting resin plate is used for silicon rod slicing, and the chipping rate of section is 0.93%.
Embodiment 3
By 25 parts of flame-retardants melamine, granularity is 0.5~100 μm of 40 parts of silica flour, 0.1 part of initiator cobalt naphthenate,
It is added in 40 parts of epoxy resin, then adds 2 parts of curing agent methyl ethyl ketone peroxide thereto again, after stirring,
It is evenly laid out in a mold by material distributing machine, into insulating box after 80 DEG C of solidification 60min, Temperature fall, obtain diamond wire and cut
Cut and use resin plate.
The resin plate shore hardness is 90, no bending, no deformation, suitable for the Buddha's warrior attendant wire cutting of silicon rod；Embodiment 3 is made
Standby Buddha's warrior attendant wire cutting resin plate is used for silicon rod slicing, and the chipping rate of section is 1.2%.
Comparative example
By 60 parts of fire retardant calcium carbonate, fertile 3 parts of the orchid of coupling agent, it is added in 40 parts of epoxy resin, stirs, then
Add curing agent trimethyl 10 parts of diamines thereto again, it is evenly laid out in a mold by material distributing machine after stirring,
Into in insulating box after 80 DEG C of solidification 30min, Temperature fall, Buddha's warrior attendant wire cutting resin plate is obtained.
The resin plate shore hardness is 85, but chipping rate of cutting into slices is up to 5%, and easily falls piece, is not suitable for silicon rod
Buddha's warrior attendant wire cutting.
As seen from the above embodiment, the invention provides a kind of Buddha's warrior attendant wire cutting resin material, in terms of parts by weight, bag
Include following components：1~20 part of 20~70 parts of synthetic resin, 5~50 parts of fire retardant, 10~70 parts of silica flour and curing agent；The resistance
Fire one or more of the agent in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant.With existing skill
Art is compared, and the Buddha's warrior attendant wire cutting uses silica flour not use the compound conduct for containing metal as filler by the use of resin material
Filler so that cutting slurries mitigate environmental protection pressure, and cut slurries to recycle without subsequent treatment；The resinous wood
Expect close with the silicon rod property cut beneficial to cutting so that silicon chip yield is higher.Test result indicates that：Tree prepared by resin material
The shore hardness of fat plate is 80~96, no bending, no deformation；The chipping rate of silicon rod slicing is 1% or so.
Described above is only the preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, under the premise without departing from the principles of the invention, some improvements and modifications can also be made, these improvements and modifications also should
It is considered as protection scope of the present invention.
Claims (9)
1. a kind of Buddha's warrior attendant wire cutting resin material, in terms of parts by weight, including following components：
1~20 part of 20~70 parts of synthetic resin, 5~50 parts of fire retardant, 10~70 parts of silica flour and curing agent；
The one kind or more of the fire retardant in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant
Kind.
2. Buddha's warrior attendant wire cutting resin material according to claim 1, it is characterised in that the fire retardant hinders selected from bromine system
Fire agent and/or silicon-series five-retardant.
3. Buddha's warrior attendant wire cutting resin material according to claim 2, it is characterised in that the fire retardant is selected from titanium dioxide
Silicon and/or tetrabromobisphenol A.
4. Buddha's warrior attendant wire cutting resin material according to claim 1, it is characterised in that 10~20 parts of fire retardant.
5. Buddha's warrior attendant wire cutting resin material according to claim 1, it is characterised in that the curing agent is selected from organic amine
In class curing agent, organic acid anhydride curing agent, imidazole curing agent, high polymer class curing agent and organic peroxide class curing agent
One or more.
6. Buddha's warrior attendant wire cutting resin material according to claim 1, it is characterised in that be also coupled including 0.1-10 parts
Agent, one or more of the coupling agent in silane coupler, titanate coupling agent and chromium complex coupling agent.
7. Buddha's warrior attendant wire cutting resin material according to claim 1, it is characterised in that also including 0.1~1 part of initiation
Agent；The initiator is selected from cobalt naphthenate.
8. a kind of Buddha's warrior attendant wire cutting resin plate, is made by following methods：
10~70 parts, 20~70 parts 5~50 parts of fire retardant, silica flour synthetic resin are mixed, obtain compound A, the fire retardant
One or more in bromide fire retardant, nitrogenated flame retardant, phosphorus-nitrogen containing flame retardant and silicon-series five-retardant；
The compound A and 1~20 part of curing agent are mixed, obtain compound B；
Compound B is tiled into mould, solidifies, obtains Buddha's warrior attendant wire cutting resin plate.
9. Buddha's warrior attendant wire cutting resin plate according to claim 8, it is characterised in that the temperature of the solidification be 50~
150℃；The time of the solidification is 15~90min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710882333.5A CN107523019A (en) | 2017-09-26 | 2017-09-26 | A kind of Buddha's warrior attendant wire cutting is with resin material and Buddha's warrior attendant wire cutting resin plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710882333.5A CN107523019A (en) | 2017-09-26 | 2017-09-26 | A kind of Buddha's warrior attendant wire cutting is with resin material and Buddha's warrior attendant wire cutting resin plate |
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| CN107523019A true CN107523019A (en) | 2017-12-29 |
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|---|---|---|---|
| CN201710882333.5A Pending CN107523019A (en) | 2017-09-26 | 2017-09-26 | A kind of Buddha's warrior attendant wire cutting is with resin material and Buddha's warrior attendant wire cutting resin plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113527562A (en) * | 2020-04-14 | 2021-10-22 | 西安昊锐电子科技有限公司 | Backing plate for diamond wire cutting material and manufacturing method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101173159A (en) * | 2006-11-02 | 2008-05-07 | 比亚迪股份有限公司 | A kind of epoxy resin packaging material composition |
| CN103467967A (en) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | A kind of thermosetting resin composition and its application |
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2017
- 2017-09-26 CN CN201710882333.5A patent/CN107523019A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101173159A (en) * | 2006-11-02 | 2008-05-07 | 比亚迪股份有限公司 | A kind of epoxy resin packaging material composition |
| CN103467967A (en) * | 2013-09-16 | 2013-12-25 | 广东生益科技股份有限公司 | A kind of thermosetting resin composition and its application |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113527562A (en) * | 2020-04-14 | 2021-10-22 | 西安昊锐电子科技有限公司 | Backing plate for diamond wire cutting material and manufacturing method thereof |
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