CN107517541A - The preparation method of circuit board and circuit board - Google Patents
The preparation method of circuit board and circuit board Download PDFInfo
- Publication number
- CN107517541A CN107517541A CN201710645519.9A CN201710645519A CN107517541A CN 107517541 A CN107517541 A CN 107517541A CN 201710645519 A CN201710645519 A CN 201710645519A CN 107517541 A CN107517541 A CN 107517541A
- Authority
- CN
- China
- Prior art keywords
- layers
- circuit board
- layer
- copper
- basalis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 86
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims abstract description 49
- 229910052737 gold Inorganic materials 0.000 claims abstract description 49
- 239000010931 gold Substances 0.000 claims abstract description 49
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- 229910052802 copper Inorganic materials 0.000 claims abstract description 47
- 239000010949 copper Substances 0.000 claims abstract description 47
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims abstract description 44
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 43
- 229910052763 palladium Inorganic materials 0.000 claims abstract description 22
- 238000009713 electroplating Methods 0.000 claims description 17
- 240000007594 Oryza sativa Species 0.000 claims 1
- 235000007164 Oryza sativa Nutrition 0.000 claims 1
- 235000009566 rice Nutrition 0.000 claims 1
- 241000218202 Coptis Species 0.000 abstract description 8
- 235000002991 Coptis groenlandica Nutrition 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 8
- 238000012545 processing Methods 0.000 abstract description 6
- 238000005260 corrosion Methods 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 110
- 238000007747 plating Methods 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 230000002787 reinforcement Effects 0.000 description 2
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005238 degreasing Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- LGQLOGILCSXPEA-UHFFFAOYSA-L nickel sulfate Chemical compound [Ni+2].[O-]S([O-])(=O)=O LGQLOGILCSXPEA-UHFFFAOYSA-L 0.000 description 1
- 229910000363 nickel(II) sulfate Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000005488 sandblasting Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present embodiments relate to art of printed circuit boards, discloses a kind of circuit board.Circuit board provided by the present invention is mainly used in and wire terminal pad, it includes basalis, the layers of copper being arranged on the basalis and is laid in the layers of copper to form the metal level of several pads, the metal level includes the nickel dam being arranged in the layers of copper, the palladium layers being arranged on the nickel dam and the soft gold layer being arranged in the palladium layers, and golden content is at least 99.9% in the soft gold layer.The present invention also provides a kind of preparation method of circuit board.The cost of the preparation method of circuit board and circuit board provided by the present invention is relatively low, plays gold thread stable performance, black pad phenomenon caused by no nickel corrosion, the easy management and control of processing procedure.
Description
Technical field
The present embodiments relate to art of printed circuit boards, the preparation method of more particularly to a kind of circuit board and circuit board.
Background technology
In recent years, printed circuit board industry develops rapidly, is applicable electronic product to high density, miniaturization, highly reliable direction
The needs of development, on the fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, digital camera or product
To being widely applied, the surface treatment method that contemporary printed board needs to beat the pad of gold thread has electroplating mild alloy, chemical plating
Nickel gold etc..
It was found by the inventors of the present invention that at least there are the following problems in the prior art：Good gold thread is beaten in order to obtain
Can, electroplating mild alloy needs to plate more than 0.5um layer gold on pad, therefore manufacturing cost is expensive；Manufacturing cost is relatively low
Although chemical nickel plating gold can obtain the beat golden performance suitable with electroplating mild alloy, after the method processing of this kind of chemical nickel plating gold
Pad nickel corrosion phenomenon be present and easily black, simultaneously because chemical nickel plating is golden, nickel cylinder needs periodically more groove and causes system
Journey management and control requires higher.
The content of the invention
The purpose of embodiment of the present invention is to provide a kind of circuit board and preparation method thereof, and its cost is relatively low, can have
Have it is good beat gold thread performance, not perishable nigrescence, and processing procedure management and control requires low.
In order to solve the above technical problems, embodiments of the present invention provide a kind of circuit board, and for being connected with wire, institute
Stating circuit board includes：Basalis, the layers of copper being arranged on the basalis and it is laid in the layers of copper to form several welderings
The gold of disk bends layer, and the gold layer in the wrong includes the nickel dam being arranged in the layers of copper, the palladium layers being arranged on the nickel dam and setting
Soft gold layer in the palladium layers, golden content is at least 99.9% in the soft gold layer.
Embodiments of the present invention additionally provide a kind of preparation method of circuit board, comprise the following steps：Basalis is provided,
Layers of copper is laid on the basalis；In described one layer of nickel dam of layers of copper electroplating surface；In described one layer of palladium layers of nickel dam electroplating surface；
In described one layer of soft gold layer of palladium layers electroplating surface；Wherein, content golden in the soft gold layer is at least 99.9%.
Embodiment of the present invention will include nickel dam, palladium layers and soft gold layer in terms of existing technologies, by plating mode
Gold bend layer be deposited on routing class pad, without preventing nickel from corroding by increasing soft gold layer thickness, cost is relatively low, soft gold layer
In golden content it is high, quality is soft, therefore beats that gold thread performance is more stable, and the structure of NiPdAu reduce nickel dam and soft gold layer it
Between potential difference, in the absence of corroding because of nickel caused by black pad phenomenon, in addition, tank liquor is not required to regularly replace in electroplating technology,
Processing procedure management and control requires low.
In addition, the thickness range of the nickel dam is 2 to 8 microns.
In addition, the thickness range of the palladium layers is 0.03 to 0.3 micron.
In addition, the thickness range of the soft gold layer is 0.03 to 0.3 micron.
In addition, the circuit board also includes the enhancement layer being arranged on surface of the basalis away from layers of copper, it is described to add
It is fixedly connected by glue-line between layer and the basalis by force, for the reinforcement in load-carrying unit region, is easily installed.
In addition, the layers of copper is not set matcoveredn on the surface of gold layer covering in the wrong, protect the layers of copper not sudden and violent
Dew in atmosphere, avoids the oxidation of the layers of copper and the generation of electrostatic.
In addition, the preparation method is before the step of one layer of nickel dam of layers of copper electroplating surface, it is further comprising the steps of：
Remove the oxide layer on the layers of copper surface and to going to the layers of copper surface after removing oxide layer to be roughened, be so designed that
Peel strength can be strengthened, make the nickel dam plating more firm, and then improve and beat gold thread reliability.
Brief description of the drawings
Fig. 1 is the part sectioned view of the circuit board provided according to first embodiment of the invention；
Fig. 2 is the overall structure diagram of the circuit board provided according to first embodiment of the invention；
Fig. 3 is that the gold for the circuit board that first embodiment of the invention provides bends layer cross-sectional view；
Fig. 4 is the part sectioned view of the circuit board provided according to second embodiment of the invention；
Fig. 5 is the flow chart of the preparation method of the circuit board provided according to third embodiment of the invention；
Fig. 6 is the flow chart of the preparation method of the circuit board provided according to four embodiment of the invention.
Embodiment
To make the purpose, technical scheme and advantage of the embodiment of the present invention clearer, below in conjunction with accompanying drawing to the present invention
Each embodiment be explained in detail.However, it will be understood by those skilled in the art that in each embodiment party of the present invention
In formula, in order that reader more fully understands the present invention and proposes many ins and outs.But even if without these ins and outs
With many variations based on following embodiment and modification, claimed technical solution of the invention can also be realized.
The first embodiment of the present invention is related to a kind of circuit board 100.As depicted in figs. 1 and 2.The circuit board 100 wraps
Include：Basalis 3, the layers of copper 2 being arranged on the basalis 3 and it is laid in the layers of copper 2 to form several routing pads
Gold bend layer 1, the gold layer 1 in the wrong includes the nickel dam 13 being arranged in the layers of copper 2, the palladium layers 12 being arranged on the nickel dam 13
With the soft gold layer 11 being arranged in the palladium layers 12, golden content is at least 99.9% in the soft gold layer 11.
In present embodiment, the palladium layers 12 are added between nickel dam 13 and soft gold layer 11, without by increasing soft gold layer
11 thickness prevents nickel from corroding, and reduces cost, and golden content is at least 99.9% in soft gold layer 11, and purity is higher, quality
Softer, so routing performance is more preferable, and the structure of NiPdAu reduces the potential difference between nickel dam 13 and soft gold layer 11, makes described
The corrosion resistance on the gold surface of layer 1 in the wrong improves, and the black pad phenomenon caused by nickel corrodes is avoided, in addition, electroplating technology bracket groove
Liquid is not required to regularly replace, so the more preferable management and control of processing procedure.It is additionally provided with the surface that the layers of copper 2 is not covered by gold layer 3 in the wrong
Protective layer 6 so that mutually isolated between adjacent conducting strip.
Specifically, the thickness range of the nickel dam 13 could be arranged to 2 to 8 microns, the thickness range of the palladium layers 102 can
To be arranged to 0.03 to 0.3 micron, the thickness range of the soft gold layer 101 could be arranged to 0.03 to 0.3 micron.
Second embodiment of the present invention is related to a kind of circuit board 200.Second embodiment is on first embodiment basis
On done further improvement, mainly the improvement is that：In second embodiment of the invention, the circuit board 200 also includes
The enhancement layer being arranged on the basalis, it is fixedly connected between the enhancement layer and the basalis by glue-line.
As shown in figure 3, circuit board 200 described in the present embodiment includes：Basalis 3, the copper being arranged on the basalis 3
Layer 2 and it is laid in the layers of copper 2 and bends layer 1 to form the gold of several routing pads, is arranged on the basalis 3 away from institute
The enhancement layer 5 of the side of layers of copper 2 is stated, is laid on the enhancement layer 5 and is used to be fixedly connected with the enhancement layer 5 and the basalis
3 glue-line 4.The enhancement layer 5 can be used for the reinforcement in load-carrying unit region, using the secure bond of glue-line 4, be easy to pacify
Dress.
Preferably, protective layer 10 is additionally provided with the surface that the layers of copper 2 is not covered by gold layer 1 in the wrong, is arranged such
So that it is mutually isolated between adjacent conducting strip, the layers of copper 2 can also be protected to be not exposed in air, avoid the layers of copper 2
Oxidation and electrostatic generation.
More excellent, the material of the enhancement layer 5 is PI (Polyimide, polyimides), and its flame resistance is good, can protect institute
State circuit board inner member；The glue-line 4 using bonding agent (Adhesvie), increase the enhancement layer 5 and the basalis 3 it
Between stripping difficulty, influence the flex stiffiness energy of circuit board；The material of the basalis 3 is PI or epoxy resin FR-4 (FR-4
For the code name of flame resistant material grade), there is resistant to elevated temperatures characteristic, ensure that the reliability of the circuit board.
Third embodiment of the invention is related to a kind of preparation method of circuit board, and idiographic flow is as shown in Figure 4.
Step S11, there is provided basalis 3, layers of copper 2 is laid on the basalis 3.
In step s 11, the comparatively robust of basalis 3, can play a supporting role to layers of copper 2.
Step S12, in 2 electroplating surface of layers of copper, one layer of nickel dam 13.
In step s 12, specifically, it can select but be not limited to nickel sulfate, nickel chloride and nickel aminosulfonic bath
The surface of layers of copper 2 is electroplated, to plate nickel dam 13 on the surface of layers of copper 2.
Step S13, in 13 electroplating surface of nickel dam, one layer of palladium layers 12.
In step s 13, the contact resistance of palladium layers 12 is very low, and solderability and wearability are good.
Step S14, in 12 electroplating surface of palladium layers, one layer of soft gold layer 11.
In step S14, golden content is at least 99.9% in the soft gold layer 11, and golden purity is high, and quality is soft, so
Routing performance is more preferable.
In present embodiment, before step S12, in addition to step S20：Remove the oxide layer on the surface of layers of copper 2 and to going
The surface of layers of copper 2 after removing oxide layer is roughened.
In step S20, specifically, electrochemical deoiling, electrolytic degreasing, ultrasonic wave cleaning, sandblasting, microetch, acid may be selected
Wash, the one or more in the mode such as brushing are handled the surface of layers of copper 2, can strengthen peel strength, make the electricity of nickel dam 13
Plating is more firm, and then improves and beat gold thread reliability.
In the present embodiment, the nickel dam 13, palladium layers 12 and soft gold layer 11 are deposited on by circuit board by plating mode
On pad, due to adding the palladium layers 12 between nickel dam 13 and soft gold layer 11, without preventing nickel by increasing layer gold thickness
Corrosion, reduces cost, and golden purity is high in soft gold layer 11, and quality is soft, plays gold thread stable performance, and the structure reduction of NiPdAu
Potential difference between nickel dam 13 and soft gold layer 11, the corrosion resistance on gold layer 1 surface in the wrong is improved, is avoided because nickel corrodes
Caused by black pad phenomenon, meanwhile, tank liquor need not regularly replace in electroplating technology, so the more preferable management and control of processing procedure.
It is seen that present embodiment is the system embodiment corresponding with first embodiment, present embodiment can be with
First embodiment is worked in coordination implementation.The relevant technical details mentioned in first embodiment still have in the present embodiment
Effect, in order to reduce repetition, is repeated no more here.Correspondingly, the relevant technical details mentioned in present embodiment are also applicable in
In first embodiment.
Four embodiment of the invention is related to a kind of preparation method of circuit board, and idiographic flow is as shown in figure 5, the 4th implements
Mode is substantially the same with the 3rd embodiment, and difference is, in the 4th embodiment, after step s 11, in step
Before S20, in addition to step S30：Enhancement layer 5 is laid in the opposite side of basalis 3, enhancement layer 5 is passed through glue-line 4 and basalis
3 are fixedly connected.
In step s 30, due to the presence of enhancement layer 5 so that the more firm and durable of basalis 1, add circuit board
Durability.
In addition, after step s 14, step S40 can also be included, do not covered in the layers of copper 2 by gold layer 1 in the wrong
Protective layer 10 is laid on surface.
In step s 40, specifically, protective layer 10 is set on the surface that the layers of copper 2 is not covered by the nickel dam 13,
Protect the layers of copper 2 to be not exposed in air, the oxidation of the layers of copper 2 and the generation of electrostatic can be avoided.
The step of various methods divide above, be intended merely to describe it is clear, can be merged into when realizing a step or
Some steps are split, are decomposed into multiple steps, as long as including identical logical relation, all protection domain in this patent
It is interior；To either adding inessential modification in algorithm in flow or introducing inessential design, but its algorithm is not changed
Core design with flow is all in the protection domain of the patent.
It will be understood by those skilled in the art that the respective embodiments described above are to realize the specific embodiment of the present invention,
And in actual applications, can to it, various changes can be made in the form and details, without departing from the spirit and scope of the present invention.
Claims (8)
1. a kind of circuit board, for being connected with wire, the circuit board includes：Basalis, the copper being arranged on the basalis
Layer and it is laid in the layers of copper and bends layer to form the gold of several pads, it is characterised in that the gold layer in the wrong includes being arranged on
Nickel dam, the palladium layers being arranged on the nickel dam and the soft gold layer being arranged in the palladium layers in the layers of copper, the soft gold layer
Middle golden content is at least 99.9%.
2. circuit board according to claim 1, it is characterised in that the thickness range of the nickel dam is 2 to 8 microns.
3. circuit board according to claim 1, it is characterised in that the thickness range of the palladium layers is 0.03 to 0.3 micron.
4. circuit board according to claim 1, it is characterised in that the thickness range of the soft gold layer is 0.03 to 0.3 micro-
Rice.
5. circuit board according to claim 1, it is characterised in that the circuit board is also remote including being arranged on the basalis
From the enhancement layer on the surface of layers of copper, it is fixedly connected between the enhancement layer and the basalis by glue-line.
6. circuit board according to claim 5, it is characterised in that the layers of copper is not by the surface of gold layer covering in the wrong
Matcoveredn is set.
7. a kind of preparation method of circuit board, it is characterised in that comprise the following steps：
Basalis is provided, layers of copper is laid on the basalis；
In described one layer of nickel dam of layers of copper electroplating surface；
In described one layer of palladium layers of nickel dam electroplating surface；
In described one layer of soft gold layer of palladium layers electroplating surface；
Wherein, content golden in the soft gold layer is at least 99.9%.
8. the preparation method of circuit board according to claim 7, it is characterised in that in described one layer of nickel of layers of copper electroplating surface
It is further comprising the steps of before the step of layer：Remove the oxide layer on the layers of copper surface and to removing the copper after removing oxide layer
Layer surface is roughened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710645519.9A CN107517541A (en) | 2017-07-31 | 2017-07-31 | The preparation method of circuit board and circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710645519.9A CN107517541A (en) | 2017-07-31 | 2017-07-31 | The preparation method of circuit board and circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107517541A true CN107517541A (en) | 2017-12-26 |
Family
ID=60722853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710645519.9A Withdrawn CN107517541A (en) | 2017-07-31 | 2017-07-31 | The preparation method of circuit board and circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107517541A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136327A1 (en) * | 2007-04-27 | 2008-11-13 | Hitachi Chemical Company, Ltd. | Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package |
| US20160157340A1 (en) * | 2013-05-30 | 2016-06-02 | Dyi-chung Hu | Circuit board structure with embedded fine-pitch wires and fabrication method thereof |
| CN206164982U (en) * | 2016-09-30 | 2017-05-10 | 武汉光谷创元电子有限公司 | Golden finger, printed circuit board and be used for making printed circuit board's base plate |
| CN106793538A (en) * | 2016-11-25 | 2017-05-31 | 上海美维电子有限公司 | The method for making selective nickel porpezite with dry film legal system on a printed-wiring board |
-
2017
- 2017-07-31 CN CN201710645519.9A patent/CN107517541A/en not_active Withdrawn
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008136327A1 (en) * | 2007-04-27 | 2008-11-13 | Hitachi Chemical Company, Ltd. | Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package |
| US20160157340A1 (en) * | 2013-05-30 | 2016-06-02 | Dyi-chung Hu | Circuit board structure with embedded fine-pitch wires and fabrication method thereof |
| CN206164982U (en) * | 2016-09-30 | 2017-05-10 | 武汉光谷创元电子有限公司 | Golden finger, printed circuit board and be used for making printed circuit board's base plate |
| CN106793538A (en) * | 2016-11-25 | 2017-05-31 | 上海美维电子有限公司 | The method for making selective nickel porpezite with dry film legal system on a printed-wiring board |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171226 |