CN107517013A - a drive - Google Patents
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- CN107517013A CN107517013A CN201710858406.7A CN201710858406A CN107517013A CN 107517013 A CN107517013 A CN 107517013A CN 201710858406 A CN201710858406 A CN 201710858406A CN 107517013 A CN107517013 A CN 107517013A
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- Prior art keywords
- main power
- driver
- circuit board
- frame housing
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- 238000001816 cooling Methods 0.000 claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 238000006243 chemical reaction Methods 0.000 claims abstract description 12
- 238000009434 installation Methods 0.000 claims description 17
- 239000002184 metal Substances 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 3
- 238000002955 isolation Methods 0.000 claims description 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 230000005855 radiation Effects 0.000 claims 1
- 239000003344 environmental pollutant Substances 0.000 abstract description 3
- 231100000719 pollutant Toxicity 0.000 abstract description 3
- 238000005192 partition Methods 0.000 description 17
- 239000000428 dust Substances 0.000 description 3
- 230000020169 heat generation Effects 0.000 description 3
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明公开了一种驱动器,包括机架壳体,机架壳体内安装有控制电路板、电源系统、散热风道、主功率变换器件及主功率印制电路板,机架壳体一端安装有散热风机,电源系统及控制电路板安装于机架壳体内上部区域,主功率变换器件及主功率印制电路板安装于机架壳体内右下侧区域,散热风道安装于机架壳体内左下侧区域,以上三个区域将驱动器整体分成三个部分,由于位于左下侧区域的散热风道和会产生热量的上部区域和右下侧区域分别相邻,因而只需一个散热风机,即可实现该驱动器整体的有效冷却,同时有效地把风中的污染物和控制回路和相关功率器件实现了隔离。
The invention discloses a driver, which comprises a frame shell, in which a control circuit board, a power supply system, a heat dissipation air duct, a main power conversion device and a main power printed circuit board are installed, and one end of the frame shell is installed with a The heat dissipation fan, power system and control circuit board are installed in the upper area of the rack shell, the main power conversion device and the main power printed circuit board are installed in the lower right area of the rack shell, and the cooling air duct is installed in the lower left of the rack shell Side area, the above three areas divide the driver into three parts as a whole. Since the heat dissipation air duct located in the lower left area is adjacent to the upper area that generates heat and the lower right area, only one heat dissipation fan is needed to realize The overall effective cooling of the drive also effectively isolates the pollutants in the wind from the control circuit and related power devices.
Description
技术领域technical field
本发明涉及一种电能控制装置,具体涉及一种驱动器。The invention relates to an electric energy control device, in particular to a driver.
背景技术Background technique
驱动器,主要包含市面上常规称为变频器、伺服驱动器、逆变器、电机调速器等采用电力电子技术的电气装置,通常此类产品因需要对电能进行交直流变换而损耗发热,约占整机额定功率的2-5%;同时还存在主功率变换器件损耗发热及相关控制回路器件损耗发热,约占整机额定功率的0.5-1%,因此需要有散热应对措施,考虑到成本与可靠性,低压类产品通常采用风冷方式。而风冷方式所带来的灰尘积聚对控制回路PCBA及其上所焊接的功率器件带来的腐蚀、耐压降低、凝露、击穿打火现象时有发生,甚至可能最终致使整机失效。这一问题一直存在,产品的可靠性保证大大降低,尤其在环境相对恶裂的应用中,诸如钢铁、化工、金属加工等。Drivers mainly include electrical devices that are conventionally called frequency converters, servo drives, inverters, motor speed controllers, etc. on the market and use power electronics technology. Usually, such products consume heat due to the need for AC-DC conversion of electric energy, accounting for about 2-5% of the rated power of the whole machine; at the same time, there is also loss and heat generation of the main power conversion device and related control circuit devices, which account for about 0.5-1% of the rated power of the whole machine. Therefore, measures for heat dissipation are required. Considering the cost and For reliability, low-voltage products usually adopt air cooling. The dust accumulation caused by the air-cooling method may cause corrosion, pressure drop, condensation, breakdown and sparking to the control circuit PCBA and the power devices soldered on it, and may even eventually cause the whole machine to fail. . This problem has always existed, and the reliability guarantee of the product is greatly reduced, especially in applications with relatively harsh environments, such as steel, chemical industry, and metal processing.
现有技术中,在驱动器中通常设计散热风道对上述散热器进行冷却,而主功率变换器件损耗发热及相关控制回路器件损耗发热通常采用自然冷却或者强制风冷,采用自然冷却时控制回路温度相对较高,严重影响电子元器件的可靠性与寿命,采用强制风冷时,又难以应对灰尘杂物被风带入后对影响及凝露积水加重的负面次生影响,因此需要提供一种具有良好可靠性保证和优秀散热效果的驱动器。In the prior art, a heat dissipation air duct is usually designed in the driver to cool the above-mentioned radiator, while the loss and heat generation of the main power conversion device and the loss and heat generation of related control circuit devices usually adopt natural cooling or forced air cooling, and the temperature of the control circuit when natural cooling is adopted Relatively high, which seriously affects the reliability and life of electronic components. When forced air cooling is used, it is difficult to deal with the negative secondary effects of dust and sundries being brought in by the wind on the impact and the aggravation of condensation water. Therefore, it is necessary to provide a A driver with good reliability guarantee and excellent heat dissipation effect.
发明内容Contents of the invention
本发明所要解决的主要目的是解决现有驱动器中散热可靠性差以及被冷却风带入的灰尘杂物会对控制回路PCBA及其上所焊接的功率器件产生负面影响的技术问题。The main purpose of the present invention is to solve the technical problems of poor heat dissipation reliability in the existing driver and the dust and debris brought in by the cooling wind will have a negative impact on the control circuit PCBA and the power devices welded thereon.
为了解决以上技术问题,本发明提供了一种驱动器,包括机架壳体,所述机架壳体内安装有控制电路板、电源系统、散热风道、主功率变换器件及主功率印制电路板,所述机架壳体一端安装有散热风机,所述电源系统及所述控制电路板安装于所述机架壳体内上部区域,所述主功率变换器件及所述主功率印制电路板安装于所述机架壳体内右下侧区域,所述散热风道安装于所述机架壳体内左下侧区域。In order to solve the above technical problems, the present invention provides a driver, including a frame housing, in which a control circuit board, a power supply system, a cooling air duct, a main power conversion device and a main power printed circuit board are installed. A cooling fan is installed at one end of the rack housing, the power supply system and the control circuit board are installed in the upper area of the rack housing, and the main power conversion device and the main power printed circuit board are installed In the lower right area of the frame housing, the cooling air duct is installed in the lower left area of the rack housing.
可选的,所述机架壳体内设置有倒L型隔离壁,以用于将所述上部区域、右下侧区域与左下侧区域隔离开,形成上安装室、右下安装室及左下安装室。Optionally, an inverted L-shaped partition wall is provided inside the rack housing to isolate the upper area, the lower right area, and the lower left area to form an upper installation room, a lower right installation room, and a lower left installation room. room.
可选的,所述隔离壁由塑料壳体或者金属壳体。Optionally, the partition wall is made of a plastic shell or a metal shell.
可选的,所述隔离壁为实心板。Optionally, the partition wall is a solid plate.
可选的,所述隔离壁设置有若干散热孔,所述散热孔总面积小于所述隔离壁总面积的50%。Optionally, the partition wall is provided with several cooling holes, and the total area of the cooling holes is less than 50% of the total area of the partition wall.
可选的,所述散热风道为重复排列堆叠的L型结构。Optionally, the heat dissipation air duct is an L-shaped structure that is repeatedly arranged and stacked.
采用了本发明提供的驱动器后,由于电源系统及控制电路板安装于机架壳体内上部区域,主功率变换器件及主功率印制电路板安装于机架壳体内右下侧区域,散热风道安装于机架壳体内左下侧区域,在结构上将驱动器整体分成三个部分,即上部区域、右下侧区域和左下侧区域,由于位于左下侧区域的散热风道和会产生热量的上部区域和右下侧区域分别相邻,因而只需一个散热风机,即可实现该驱动器整体的有效冷却,同时有效地把风中的污染物和控制回路和相关功率器件实现了隔离;进一步的,在机架壳体内设置有倒L型隔离壁以用于将上部区域、右下侧区域与左下侧区域隔离开,形成上安装室、右下安装室及左下安装室,该倒L型隔离壁可以作为驱动器主骨架用于支撑和装配各组成部件,同时可用于隔离散热风道中的冷却风与控制电路板及主功率印制电路板直接接触,此L隔离壁还能起到传热的作用。After adopting the driver provided by the present invention, since the power supply system and the control circuit board are installed in the upper area of the frame shell, the main power conversion device and the main power printed circuit board are installed in the lower right area of the frame shell, the heat dissipation air duct Installed in the lower left area of the rack housing, the driver is structurally divided into three parts, namely the upper area, the lower right area and the lower left area. Due to the cooling air duct located in the lower left area and the upper area that generates heat It is adjacent to the lower right area respectively, so only one heat dissipation fan is needed to realize the effective cooling of the driver as a whole, and at the same time effectively isolate the pollutants in the wind from the control circuit and related power devices; further, in The frame housing is provided with an inverted L-shaped partition wall for isolating the upper area, the lower right area, and the lower left area to form an upper installation room, a lower right installation room, and a lower left installation room. The inverted L-shaped partition wall can As the main frame of the driver, it is used to support and assemble the various components. At the same time, it can be used to isolate the cooling air in the cooling air duct from direct contact with the control circuit board and the main power printed circuit board. The L partition wall can also play the role of heat transfer.
附图说明Description of drawings
附图是用来提供对本发明的进一步理解,并且构成说明书的一部分,与下面的具体实施方式一起用于解释本发明,但并不应构成本发明的限制,在附图中:The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the description, and are used to explain the present invention together with the following specific embodiments, but should not constitute a limitation of the present invention. In the accompanying drawings:
图1为本发明实施例驱动器的外部结构示意图;FIG. 1 is a schematic diagram of the external structure of a driver according to an embodiment of the present invention;
图2为本发明实施例驱动器的结构剖面图;Fig. 2 is a structural sectional view of the driver of the embodiment of the present invention;
图3为本发明实施例驱动器的整体结构爆炸示意图;3 is an exploded schematic diagram of the overall structure of the driver according to the embodiment of the present invention;
具体实施方式detailed description
以下结合附图对本发明的具体实施方式进行详细说明。应当理解的是,此处所描述的具体实施方式仅用于说明和解释本发明,并不是用于限制本发明。Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described here are only used to illustrate and explain the present invention, not to limit the present invention.
如图1、图2及图3所示,为本发明提供的一种驱动器100,包括机架壳体110,机架壳体内安装有控制电路板120、电源系统130、散热风道140、主功率变换器件150及主功率印制电路板160,机架壳体110一端安装有散热风机170,其中该散热风道140为重复排列堆叠的L型结构,电源系统130及控制电路板120安装于机架壳体110内上部区域,主功率变换器件150及主功率印制电路板160安装于机架壳体110内右下侧区域,散热风道140安装于机架壳体110内左下侧区域,机架壳体110内设置有倒L型隔离壁111,将上部区域、右下侧区域与左下侧区域隔离开,形成上安装室112、右下安装室113及左下安装室114。As shown in Fig. 1, Fig. 2 and Fig. 3, a driver 100 provided by the present invention includes a frame housing 110 in which a control circuit board 120, a power supply system 130, a heat dissipation air duct 140, a main The power conversion device 150 and the main power printed circuit board 160, a heat dissipation fan 170 is installed at one end of the frame housing 110, wherein the heat dissipation air duct 140 is an L-shaped structure that is repeatedly arranged and stacked, and the power supply system 130 and the control circuit board 120 are installed on the In the upper area of the rack housing 110, the main power conversion device 150 and the main power printed circuit board 160 are installed in the lower right area of the rack housing 110, and the cooling air duct 140 is installed in the lower left area of the rack housing 110 , the frame shell 110 is provided with an inverted L-shaped partition wall 111, which isolates the upper area, the lower right area, and the lower left area to form an upper installation chamber 112, a lower right installation chamber 113, and a lower left installation chamber 114.
另外,对于本领域技术人员而言,本实施例中的该倒L型隔离壁111为塑料壳体或者金属壳体,同样的,该倒L型隔离壁111可采用实心板结构,亦可采用带有若干散热孔的板状结构,为保证隔离效果,散热孔总面积小于该倒L型隔离壁总面积的50%。In addition, for those skilled in the art, the inverted L-shaped partition wall 111 in this embodiment is a plastic shell or a metal shell. Similarly, the inverted L-shaped partition wall 111 can adopt a solid plate structure, or can In order to ensure the isolation effect of the plate-shaped structure with several cooling holes, the total area of the cooling holes is less than 50% of the total area of the inverted L-shaped partition wall.
采用了本发明提供的驱动器100后,由于电源系统130及控制电路板120安装于机架壳体110内上部区域,主主功率变换器件150及主功率印制电路板160安装于机架壳体110内右下侧区域,散热风道140安装于机架壳体110内左下侧区域,在结构上将驱动器100整体分成三个部分,即上部区域、右下侧区域和左下侧区域,由于位于左下侧区域的散热风道140和会产生热量的上部区域和右下侧区域分别相邻,因而只需一个散热风机170,即可实现该驱动器100整体的有效冷却,同时有效地把风中的污染物和控制回路和相关功率器件实现了隔离;进一步的,在机架壳体110内设置有倒L型隔离壁111以用于将上部区域、右下侧区域与左下侧区域隔离开,形成上安装室112、右下安装室113及左下安装室114,该倒L型隔离壁111可以作为驱动器主骨架用于支撑和装配各组成部件,同时可用于隔离散热风道140中的冷却风与控制电路板120及主功率印制电路板160直接接触,此倒L隔离壁111还能起到传热的作用,具体地,上安装室112、右下安装室113中的电路板及其上所焊电子器件工作时所产生的较大的持续的热量会烤热上、右室中的空气,此部分空气烤热倒L形隔离壁111,此倒L形隔离壁111另一侧为散热风道140的侧壁,冷却风会持续的吹经此散热风道140侧壁从而带走热量,继而起冷却上安装室112、右安装室113的作用。After the driver 100 provided by the present invention is adopted, since the power supply system 130 and the control circuit board 120 are installed in the upper area of the frame housing 110, the main main power conversion device 150 and the main power printed circuit board 160 are installed in the frame housing. 110, the cooling air duct 140 is installed in the lower left area of the rack housing 110, and structurally divides the driver 100 into three parts, namely, the upper area, the lower right area, and the lower left area. The heat dissipation air channel 140 in the lower left area is adjacent to the upper area and the lower right area that generate heat, respectively, so only one heat dissipation fan 170 is needed to achieve effective cooling of the driver 100 as a whole, and at the same time effectively dissipate the heat in the wind. Pollutants and control circuits and related power devices are isolated; further, an inverted L-shaped partition wall 111 is provided in the frame housing 110 to isolate the upper area, the lower right area and the lower left area, forming The upper installation chamber 112, the lower right installation chamber 113, and the lower left installation chamber 114. The inverted L-shaped partition wall 111 can be used as the main frame of the driver to support and assemble the various components, and can be used to isolate the cooling air in the cooling air duct 140 from the The control circuit board 120 and the main power printed circuit board 160 are in direct contact, and the inverted L partition wall 111 can also play the role of heat transfer. Specifically, the circuit boards in the upper installation chamber 112 and the lower right installation chamber 113 and their The larger continuous heat produced by the soldered electronic device will heat the air in the upper and right chambers, and this part of the air will heat the inverted L-shaped partition wall 111. The other side of the inverted L-shaped partition wall 111 is for heat dissipation. On the side wall of the air duct 140 , the cooling air will continuously blow through the side wall of the heat dissipation air duct 140 to take away heat, and then play a role in cooling the upper installation chamber 112 and the right installation chamber 113 .
以上结合附图对本发明的实施方式作了详细说明,但本发明不限于所描述的实施方式。对于本领域的技术人员而言,在不脱离本发明原理和精神的情况下,对这些实施方式进行多种修改、替换和变型,仍落入本发明的保护范围内。The embodiments of the present invention have been described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. For those skilled in the art, without departing from the principle and spirit of the present invention, various modifications, substitutions and variations can be made to these embodiments, which still fall within the protection scope of the present invention.
Claims (6)
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CN201710858406.7A CN107517013A (en) | 2017-09-21 | 2017-09-21 | a drive |
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CN201710858406.7A CN107517013A (en) | 2017-09-21 | 2017-09-21 | a drive |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5831240A (en) * | 1994-11-08 | 1998-11-03 | Sansha Electric Manufacturing Company, Limited | Power supply apparatus |
DE202008000736U1 (en) * | 2007-01-19 | 2008-03-20 | Abb Oy | frequency converter |
CN102189311A (en) * | 2010-03-10 | 2011-09-21 | 株式会社大亨 | Power supply apparatus |
CN204498013U (en) * | 2015-04-01 | 2015-07-22 | 常熟开关制造有限公司(原常熟开关厂) | A kind of photovoltaic network inverter |
CN204913102U (en) * | 2015-08-13 | 2015-12-30 | 上海通用重工集团有限公司 | Novel wind channel |
CN207339666U (en) * | 2017-09-21 | 2018-05-08 | 深圳弘远电气有限公司 | A kind of driver |
-
2017
- 2017-09-21 CN CN201710858406.7A patent/CN107517013A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5831240A (en) * | 1994-11-08 | 1998-11-03 | Sansha Electric Manufacturing Company, Limited | Power supply apparatus |
DE202008000736U1 (en) * | 2007-01-19 | 2008-03-20 | Abb Oy | frequency converter |
CN102189311A (en) * | 2010-03-10 | 2011-09-21 | 株式会社大亨 | Power supply apparatus |
CN204498013U (en) * | 2015-04-01 | 2015-07-22 | 常熟开关制造有限公司(原常熟开关厂) | A kind of photovoltaic network inverter |
CN204913102U (en) * | 2015-08-13 | 2015-12-30 | 上海通用重工集团有限公司 | Novel wind channel |
CN207339666U (en) * | 2017-09-21 | 2018-05-08 | 深圳弘远电气有限公司 | A kind of driver |
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