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CN107505059A - A kind of welding process detection device and welding parameter acquisition method - Google Patents

A kind of welding process detection device and welding parameter acquisition method Download PDF

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Publication number
CN107505059A
CN107505059A CN201710862038.3A CN201710862038A CN107505059A CN 107505059 A CN107505059 A CN 107505059A CN 201710862038 A CN201710862038 A CN 201710862038A CN 107505059 A CN107505059 A CN 107505059A
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welding
temperature
voltage
arm chip
thermocouple
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汪殿龙
吴朝峰
梁志敏
佘亚东
李海川
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Hebei University of Science and Technology
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Hebei University of Science and Technology
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K7/00Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
    • G01K7/02Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K9/00Arc welding or cutting
    • B23K9/32Accessories
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01KMEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
    • G01K1/00Details of thermometers not specially adapted for particular types of thermometer
    • G01K1/14Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R15/00Details of measuring arrangements of the types provided for in groups G01R17/00 - G01R29/00, G01R33/00 - G01R33/26 or G01R35/00
    • G01R15/14Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks
    • G01R15/20Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices
    • G01R15/202Adaptations providing voltage or current isolation, e.g. for high-voltage or high-current networks using galvano-magnetic devices, e.g. Hall-effect devices, i.e. measuring a magnetic field via the interaction between a current and a magnetic field, e.g. magneto resistive or Hall effect devices using Hall-effect devices
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R19/00Arrangements for measuring currents or voltages or for indicating presence or sign thereof

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Arc Welding In General (AREA)

Abstract

本发明一种焊接过程检测设备及焊接参数采集方法,所述检测设备包括焊机、采集系统和上位机,其中,焊机和采集系统分别与上位机相连接。所述参数采集方法包含5个步骤。采用本发明后,能实时的采集和存储焊接过程中的电信号与温度场信号,并能在‑200℃至1300℃宽范围的采集温度,能承受3000v的TIG高压起弧而不损坏。采用本发明获取的数据可在电脑的上位机软件中分析,焊接电压、电流的分析包括平均电压、平均电流、电压波形图、电流波形图、电压电流波形图,电压密度分布曲线,电流密度分布曲线。温度场的信号分析包括8通道温度场曲线、每通道的最高温度、最低温度、平均温度、温度变化的速度、T85时间、T83时间。

The invention relates to a welding process detection device and a welding parameter collection method. The detection device includes a welding machine, a collection system and a host computer, wherein the welding machine and the collection system are respectively connected to the host computer. The parameter collection method includes 5 steps. After adopting the invention, the electric signal and temperature field signal in the welding process can be collected and stored in real time, and the temperature can be collected in a wide range from -200°C to 1300°C, and can withstand 3000v TIG high-voltage arcing without damage. The data obtained by adopting the present invention can be analyzed in the upper computer software of the computer. The analysis of welding voltage and current includes average voltage, average current, voltage waveform diagram, current waveform diagram, voltage and current waveform diagram, voltage density distribution curve, and current density distribution. curve. Signal analysis of temperature field includes 8-channel temperature field curve, maximum temperature, minimum temperature, average temperature, temperature change speed, T85 time, T83 time of each channel.

Description

一种焊接过程检测设备及焊接参数采集方法A welding process detection device and welding parameter collection method

技术领域technical field

本发明涉及一种焊接技术领域,尤其涉及一种适用于焊接过程中同步采集焊接电压、电流、温度场信号的设备与技术,具体为一种焊接过程检测设备及焊接参数采集方法。The invention relates to the field of welding technology, in particular to a device and technology suitable for synchronously collecting welding voltage, current, and temperature field signals during the welding process, specifically a welding process detection device and a welding parameter collection method.

背景技术Background technique

在以往的焊接工艺评定过程中,往往只是关注焊后接头的成型、组织、金相、力学性能等数据,焊接过程中的电信号与温度场信号基本不关注。这就导致出现一些工艺性能差的接头无法找出原因。电信号是焊接过程中焊机最直接的能量输出方式,此信号可以反映焊机的工作性能及所采用的焊接方法。在同样的热输入量下,不同的电信号波形会对接头的成形、组织、金相、力学性能产生明显的影响。接头的成型就是在高温下熔化然后冷却成型,温度场信号能最直接的反映工件的受热状态。因此我们发明出能将焊接过程中的电压、电流、温度场信号同步采集的系统。有了这些数据,我们可以找出某个接头的焊接电信号的波形和温度场的热循环曲线,利用这些数据可以从不同的角度分析接头的成型、组织、金相、力学性能,并且不同角度的分析结果应该是相互佐证的。这样的分析方法相比以往的方法会更科学、更全面、更准确、更容易找到问题所在,对现代焊接工艺评定的发展有重大促进作用。In the previous welding procedure qualification process, only attention was paid to the shape, structure, metallographic, mechanical properties and other data of the welded joint, and the electrical signal and temperature field signal during the welding process were basically ignored. This leads to some joints with poor process performance and cannot find out the reason. The electric signal is the most direct energy output mode of the welding machine during the welding process. This signal can reflect the working performance of the welding machine and the welding method adopted. Under the same heat input, different electrical signal waveforms will have a significant impact on the shape, structure, metallographic and mechanical properties of the joint. The forming of the joint is melting at high temperature and then cooling to form. The temperature field signal can most directly reflect the heating state of the workpiece. Therefore, we invented a system that can collect the voltage, current, and temperature field signals in the welding process synchronously. With these data, we can find out the waveform of the welding electrical signal of a certain joint and the thermal cycle curve of the temperature field. Using these data, we can analyze the forming, structure, metallographic and mechanical properties of the joint from different angles, and different angles The analysis results should be mutually corroborated. Such an analysis method will be more scientific, more comprehensive, more accurate and easier to find the problem than the previous method, which will greatly promote the development of modern welding procedure qualification.

发明内容Contents of the invention

本发明所提供的设备,能实时的采集和存储焊接过程中的电信号与温度场信号,并能-200℃至1300℃宽范围的采集温度,能承受3000v的TIG高压起弧而不损坏。采用本发明获取的数据可在电脑的上位机软件中分析,焊接电压、电流的分析包括平均电压、平均电流、电压波形图、电流波形图、电压电流波形图,电压密度分布曲线,电流密度分布曲线。温度场的信号分析包括8通道温度场曲线、每通道的最高温度、最低温度、平均温度、温度变化的速度、T85时间、T83时间。本发明具体如下:The equipment provided by the invention can collect and store electrical signals and temperature field signals in the welding process in real time, and can collect temperature in a wide range from -200°C to 1300°C, and can withstand 3000v TIG high-voltage arcing without damage. The data obtained by adopting the present invention can be analyzed in the upper computer software of the computer. The analysis of welding voltage and current includes average voltage, average current, voltage waveform diagram, current waveform diagram, voltage and current waveform diagram, voltage density distribution curve, and current density distribution. curve. Signal analysis of temperature field includes 8-channel temperature field curve, maximum temperature, minimum temperature, average temperature, temperature change speed, T85 time, T83 time of each channel. The present invention is specifically as follows:

一种焊接设备,包括焊机、采集系统和上位机,其中,焊机和采集系统分别与上位机相连接,同步采集系统包括电压采集单元、电流采集单元、温度场采集单元。其中,A welding device includes a welding machine, an acquisition system and a host computer, wherein the welder and the acquisition system are respectively connected to the host computer, and the synchronous acquisition system includes a voltage acquisition unit, a current acquisition unit, and a temperature field acquisition unit. in,

所述电压采集单元负责采集焊接的电压信号,将±200v的电压信号调理到±10v。并且能承受TIG的3000v高压起弧不被损坏。The voltage acquisition unit is responsible for collecting the welding voltage signal, and conditioning the voltage signal of ±200v to ±10v. And it can withstand TIG's 3000v high voltage arcing without being damaged.

所述电流采集单元负责采集焊接的电流信号,将±1000A的电流信号调理到±10v。The current collection unit is responsible for collecting welding current signals, and conditioning the ±1000A current signals to ±10v.

所述温度场采集单元负责采集工件的温度,测温范围是-200℃至1300℃。The temperature field collection unit is responsible for collecting the temperature of the workpiece, and the temperature measurement range is -200°C to 1300°C.

进一步说,温度场采集单元由热电偶子模块1、第一信号调理子模块2、第一ARM芯片3、第二ARM芯片4、触摸屏5、按键子模块6、第二信号调理子模块7、AD转换模块8和SD卡模块9。其中,Furthermore, the temperature field acquisition unit consists of a thermocouple sub-module 1, a first signal conditioning sub-module 2, a first ARM chip 3, a second ARM chip 4, a touch screen 5, a button sub-module 6, a second signal conditioning sub-module 7, AD conversion module 8 and SD card module 9. in,

热电偶子模块1经过第一信号调理子模块2与第一ARM芯片3相连接。The thermocouple sub-module 1 is connected to the first ARM chip 3 through the first signal conditioning sub-module 2 .

第二信号调理子模块7的输出端与AD转换模块8的输入端相连接。The output end of the second signal conditioning sub-module 7 is connected to the input end of the AD conversion module 8 .

第一ARM芯片3、触摸屏5、AD转换模块8和SD卡模块9分别与第二ARM芯片4连接,并双向数据通信。The first ARM chip 3 , the touch screen 5 , the AD conversion module 8 and the SD card module 9 are respectively connected to the second ARM chip 4 for two-way data communication.

按键子模块6与第二ARM芯片4连接,并单向数据通信。The button sub-module 6 is connected with the second ARM chip 4 for unidirectional data communication.

采用本发明所述的一种焊接设备的焊接控制方法,按照如下步骤进行:Adopt the welding control method of a kind of welding equipment of the present invention, carry out according to the following steps:

步骤1:用钻头在待焊接的板材上打孔。随后,将热电偶插入孔中。然后将焊丝塞入插有热电偶的孔中,从而将热电偶固定好。Step 1: Use a drill to punch holes in the plates to be welded. Subsequently, a thermocouple is inserted into the hole. The thermocouple is then secured by inserting welding wire into the hole in which the thermocouple is inserted.

步骤2:将电压采集线的正负极接到待焊接的板材的对应正负极输出上。Step 2: Connect the positive and negative poles of the voltage acquisition line to the corresponding positive and negative pole outputs of the plate to be welded.

步骤3:将地线按电流方向穿过霍尔电流传感器。Step 3: Pass the ground wire through the Hall current sensor according to the current direction.

步骤4:Step 4:

完成以上接线工作后,开机并按如下函数式拟合温度:After completing the above wiring work, turn on the power and fit the temperature according to the following function:

y=ax+b,y=ax+b,

其中,a取值范围在0.010至0.500之间,b的取值范围在0.800至400.1000之间。Wherein, the value range of a is between 0.010 and 0.500, and the value range of b is between 0.800 and 400.1000.

步骤5:将上述拟合温度存储到SD卡并显示到7寸液晶屏上。Step 5: Store the above fitting temperature to the SD card and display it on the 7-inch LCD screen.

步骤6:用上位机软件分析SD卡的电信号与温度场数据,评价焊接工艺。Step 6: Use the host computer software to analyze the electrical signal and temperature field data of the SD card, and evaluate the welding process.

有益的技术效果Beneficial technical effect

传统的热电偶温度采集电路有的使用模拟电路来完成的,也有使用专用的芯片来实现的。前者存在电路复杂,误差大,测温范围窄的不足,后者存在价格贵,测温范围窄的缺陷。而本发明能够克服焊接过程中的电磁的干扰,工作环境恶劣的问题。Some traditional thermocouple temperature acquisition circuits are completed using analog circuits, and some are implemented using dedicated chips. The former has the disadvantages of complex circuit, large error and narrow temperature measurement range, while the latter has the disadvantages of high price and narrow temperature measurement range. However, the present invention can overcome the problems of electromagnetic interference in the welding process and bad working environment.

本发明的测温范围特别宽-200℃-1000℃。当有焊后表面冷却的工艺时会有负温度的情况。本发明克服传统方法(以上两种方案)难以满足使用需求的问题。The temperature measuring range of the present invention is particularly wide -200°C-1000°C. When there is a post-weld surface cooling process, there will be negative temperatures. The invention overcomes the problem that the traditional methods (the above two solutions) are difficult to meet the use requirements.

本发明可以直接采集各种焊机的电信号。电信号的采样可达8通道,每通道采样率可到200KHZ。可以承受TIG的高压高频引弧。温度场可以测-200℃~1300℃的温度。所有数据可以实时保存。所有数据可以在上位机的软件上自动分析。此外,本发明还具有如下特点:The invention can directly collect the electrical signals of various welding machines. The sampling of electrical signals can reach 8 channels, and the sampling rate of each channel can reach 200KHZ. It can withstand the high voltage and high frequency arc ignition of TIG. The temperature field can measure the temperature from -200℃ to 1300℃. All data can be saved in real time. All data can be automatically analyzed on the software of the host computer. In addition, the present invention also has the following characteristics:

1.测温范围宽-200℃-1300℃。1. Wide temperature range -200℃-1300℃.

2.抗干扰性能好,可以采集各种焊接设备的温度信号。2. Good anti-interference performance, can collect temperature signals of various welding equipment.

3.电路简单,数字化的温度采集。3. Simple circuit, digital temperature acquisition.

4.温度数据传输便捷,可以是can、无线或其他方式。4. The temperature data transmission is convenient, which can be can, wireless or other methods.

5.本发明的控制芯片采用高性价比ARM芯片-STM32F429VGT6,其内置1MB闪存和256KB SRAM这样的超大存储空间可以满足使用UCOS-III的实时操作系统来完成所有控制与采集任务,同时所有的数据会显示在7寸液晶屏上,液晶屏通过FSMC总线连接到ARM芯片,图形界面显示使用基于STemWin图形界面系统来开发。所有的数据存储到SD卡中,SD卡通过SDIO接口连接到ARM上,对SD卡的操作使用了FatFS文件系统。STM32F429系列采用最新的180MHz的ARM Cortex-M4处理器内核其速度可以满足我们高速数据采集的要求。采集的数据也可以通过无线或者网口向其他设备传送。无线的通信协议采用MODBUS协议,网口的通信协议使用lwip协议栈实现。5. The control chip of the present invention adopts a cost-effective ARM chip-STM32F429VGT6, and its built-in 1MB flash memory and 256KB SRAM such a super large storage space can satisfy the use of the UCOS-III real-time operating system to complete all control and acquisition tasks. Displayed on a 7-inch LCD screen, the LCD screen is connected to the ARM chip through the FSMC bus, and the graphical interface display is developed based on the STemWin graphical interface system. All data is stored in the SD card, and the SD card is connected to the ARM through the SDIO interface, and the operation of the SD card uses the FatFS file system. The STM32F429 series adopts the latest 180MHz ARM Cortex-M4 processor core, and its speed can meet our high-speed data acquisition requirements. The collected data can also be transmitted to other devices through wireless or network ports. The wireless communication protocol adopts the MODBUS protocol, and the communication protocol of the network port uses the lwip protocol stack.

6.焊接的电信号大多数都在±200v/±1000A范围内,为了采集电信号我们将其调理到±10v的范围内,然后接到AD7606模数转换芯片,该芯片通过INTER8086接口连接到ARM芯片上。AD7606的数据采样率可达8通道,每通道200KHZ。6. Most of the welding electrical signals are in the range of ±200v/±1000A. In order to collect the electrical signals, we adjust them to the range of ±10v, and then connect them to the AD7606 analog-to-digital conversion chip, which is connected to the ARM through the INTER8086 interface. on chip. The data sampling rate of AD7606 can reach 8 channels, each channel is 200KHZ.

7.温度是用热电偶来采集的,温差引起的电势经过调理后接到STM32F373的ADC接口上。使用该芯片的16位sigma-delta ADC可以实现高精度温度测量。使用k型热电偶时测温范围能到-200℃--1300℃。STM32F373作为温度场采集模块可以独立使用。该温度数据可以通过无线或CAN通信传送到STM32F429VGT6芯片,然后存储到SD卡中。7. The temperature is collected by a thermocouple, and the potential caused by the temperature difference is conditioned and then connected to the ADC interface of the STM32F373. High-precision temperature measurement can be achieved using the chip's 16-bit sigma-delta ADC. When using a k-type thermocouple, the temperature measurement range can reach -200°C--1300°C. STM32F373 can be used independently as a temperature field acquisition module. The temperature data can be transmitted to the STM32F429VGT6 chip through wireless or CAN communication, and then stored in the SD card.

8.SD卡中的数据可以在电脑的上位机软件进行数据分析,温度场的数据可以看到热循环曲线,每个通道的最高问题,高温持续时间,以及温度变化率等。电信号的可以看到电信号的波形,电信号的平均値、标准差、变异系数,电信号的瞬时功率等。8. The data in the SD card can be analyzed in the upper computer software of the computer. The data of the temperature field can see the thermal cycle curve, the highest problem of each channel, the duration of high temperature, and the temperature change rate. For electrical signals, you can see the waveform of the electrical signal, the average value, standard deviation, coefficient of variation, and instantaneous power of the electrical signal.

综上所述,本发明为焊接领域专门研发,可以承受焊接时的高压高频引弧干扰。当焊接速度确定时,该系统还可以测量焊接时的线能量。电信号的通道可达8路,可以测量各种复合焊的电源。温度可以测量到-200℃。焊接的电信号、温度场与焊后接头的工艺性能有密切关系,可以从多个角度分析问题。该系统已在多个场合使用,体积小巧,使用便捷,系统稳定性。To sum up, the present invention is specially developed for the field of welding, and can withstand the interference of high-voltage and high-frequency arc ignition during welding. When the welding speed is determined, the system can also measure the heat input during welding. The electrical signal channel can reach 8 channels, which can measure the power source of various hybrid welding. The temperature can be measured to -200°C. The electrical signal and temperature field of welding are closely related to the process performance of the welded joint, and the problem can be analyzed from multiple angles. The system has been used in many occasions, small size, easy to use, stable system.

附图说明Description of drawings

图1是本发明的结构框图。Fig. 1 is a structural block diagram of the present invention.

具体实施方式detailed description

下面将结合附图和实施例对本发明作进一步的详细说明。The present invention will be further described in detail with reference to the accompanying drawings and embodiments.

一种焊接过程检测设备,包括焊机、采集系统和上位机,其中,焊机和采集系统分别与上位机相连接,其特征在于:同步采集系统包括电压采集单元、电流采集单元、温度场采集单元。其中,A welding process detection device, including a welding machine, an acquisition system, and a host computer, wherein the welding machine and the acquisition system are respectively connected to the host computer, and is characterized in that the synchronous acquisition system includes a voltage acquisition unit, a current acquisition unit, and a temperature field acquisition unit. unit. in,

所述电压采集单元负责采集焊接的电压信号,将±200v的电压信号调理到±10v。并且能承受TIG的3000v高压起弧不被损坏。The voltage acquisition unit is responsible for collecting the welding voltage signal, and conditioning the voltage signal of ±200v to ±10v. And it can withstand TIG's 3000v high voltage arcing without being damaged.

所述电流采集单元负责采集焊接的电流信号,将±1000A的电流信号调理到+10v。The current collection unit is responsible for collecting welding current signals, and conditioning the ±1000A current signals to +10v.

所述温度场采集单元负责采集工件的温度,测温范围是-200℃至1300℃。The temperature field collection unit is responsible for collecting the temperature of the workpiece, and the temperature measurement range is -200°C to 1300°C.

进一步说,温度场采集单元含有8通道热电偶,检测-200℃至1300℃环境温度。电压采集单元的采样电压范围在-200V至200V之间。电流采集单元的采样电流范围在-1000A至1000A之间。Furthermore, the temperature field acquisition unit contains 8-channel thermocouples to detect the ambient temperature from -200°C to 1300°C. The sampling voltage range of the voltage acquisition unit is between -200V and 200V. The sampling current range of the current acquisition unit is between -1000A and 1000A.

参见图1,进一步说,温度场采集单元由热电偶子模块1、第一信号调理子模块2、第一ARM芯片3、第二ARM芯片4、触摸屏5、按键子模块6、第二信号调理子模块7、AD转换模块8和SD卡模块9。其中,热电偶子模块1经过第一信号调理子模块2与第一ARM芯片3相连接。第二信号调理子模块7的输出端与AD转换模块8的输入端相连接。第一ARM芯片3、触摸屏5、AD转换模块8和SD卡模块9分别与第二ARM芯片4连接,并双向数据通信。按键子模块6与第二ARM芯片4连接,并单向数据通信。Referring to Fig. 1, further, the temperature field acquisition unit is composed of a thermocouple sub-module 1, a first signal conditioning sub-module 2, a first ARM chip 3, a second ARM chip 4, a touch screen 5, a button sub-module 6, a second signal conditioning Submodule 7, AD conversion module 8 and SD card module 9. Wherein, the thermocouple sub-module 1 is connected to the first ARM chip 3 through the first signal conditioning sub-module 2 . The output end of the second signal conditioning sub-module 7 is connected to the input end of the AD conversion module 8 . The first ARM chip 3 , the touch screen 5 , the AD conversion module 8 and the SD card module 9 are respectively connected to the second ARM chip 4 for two-way data communication. The button sub-module 6 is connected with the second ARM chip 4 for unidirectional data communication.

进一步说,热电偶子模块1含有不少于8个的通道。热电偶子模块1为K型热电偶。热电偶子模块1的测温范围在-200℃至1300℃之间。第一ARM芯片3的型号为STM32F373。第二ARM芯片4的型号为STM32F429。第一信号调理子模块2负责将热电偶上的干扰、噪声信号虑除并把热电势信号隔离输出到ARM芯片,热电势的输入输出范围为±1v。第二信号调理子模块7负责虑除焊接过程中的干扰、噪声信号将接收到的焊接电压、电流信号调理到-10V至+10V的范围内。AD转换模块8的型号为AD7606模数转换芯片。AD转换模块8的数据采样率不少于8通道,每通道200KHZ。Furthermore, the thermocouple sub-module 1 contains no less than 8 channels. The thermocouple sub-module 1 is a K-type thermocouple. The temperature measuring range of the thermocouple module 1 is between -200°C and 1300°C. The model of the first ARM chip 3 is STM32F373. The model of the second ARM chip 4 is STM32F429. The first signal conditioning sub-module 2 is responsible for eliminating the interference and noise signals on the thermocouple and isolating and outputting the thermoelectric potential signal to the ARM chip. The input and output range of the thermoelectric potential is ±1v. The second signal conditioning sub-module 7 is responsible for considering the interference and noise signals during the welding process and conditioning the received welding voltage and current signals to the range of -10V to +10V. The model of AD conversion module 8 is AD7606 analog-to-digital conversion chip. The data sampling rate of the AD conversion module 8 is not less than 8 channels, and each channel is 200KHZ.

参见图1,进一步说,第一ARM芯片3与第二ARM芯片4采用无线连接方式或CAN有线方式连接。触摸屏5与第二ARM芯片4之间通过FSMC连接。按键子模块6与第二ARM芯片4之间通过I/O连接。AD转换模块8与第二ARM芯片4之间通过INTER8086连接。Referring to FIG. 1 , further speaking, the first ARM chip 3 and the second ARM chip 4 are connected by wireless connection or CAN cable. The touch screen 5 is connected with the second ARM chip 4 through FSMC. The button sub-module 6 is connected to the second ARM chip 4 through I/O. The AD conversion module 8 is connected with the second ARM chip 4 through INTER8086.

参见图1,进一步说,第二信号调理子模块7的接收端与焊接电信号接口10相连接。Referring to FIG. 1 , further speaking, the receiving end of the second signal conditioning sub-module 7 is connected to the welding electrical signal interface 10 .

参见图1,进一步说,电压采集单元的输出端、电流采集单元的输出端分别与焊接电信号接口10相连接。Referring to FIG. 1 , further speaking, the output terminals of the voltage acquisition unit and the output terminal of the current acquisition unit are respectively connected to the welding electrical signal interface 10 .

采用本发明所述的一种焊接过程检测设备的焊接参数采集方法,按照如下步骤进行:Adopt the welding parameter collection method of a kind of welding process detection equipment of the present invention, carry out according to the following steps:

步骤1:用钻头在待焊接的板材上打孔。随后,将热电偶插入孔中。然后将焊丝塞入插有热电偶的孔中,从而将热电偶固定好。步骤2:将电压采集线的正负极接到待焊接的板材的对应正负极输出上。步骤3:将地线按电流方向穿过霍尔电流传感器。步骤4:完成以上接线工作后,开机并按如下函数式拟合温度:Step 1: Use a drill to punch holes in the plates to be welded. Subsequently, a thermocouple is inserted into the hole. The thermocouple is then secured by inserting welding wire into the hole in which the thermocouple is inserted. Step 2: Connect the positive and negative poles of the voltage acquisition line to the corresponding positive and negative pole outputs of the plate to be welded. Step 3: Pass the ground wire through the Hall current sensor according to the current direction. Step 4: After completing the above wiring work, turn on the power and fit the temperature according to the following function:

y=ax+b,y=ax+b,

其中,a取值范围在0.010至0.500之间,b的取值范围在0.800至400.1000之间。Wherein, the value range of a is between 0.010 and 0.500, and the value range of b is between 0.800 and 400.1000.

步骤5:将上述拟合温度存储到SD卡并显示到7寸液晶屏上。Step 5: Store the above fitting temperature to the SD card and display it on the 7-inch LCD screen.

步骤6:用上位机软件分析SD卡的电信号与温度场数据,评价焊接工艺。Step 6: Use the host computer software to analyze the electrical signal and temperature field data of the SD card, and evaluate the welding process.

进一步说,采用一种焊接过程检测设备的焊接参数采集方法,在不同的温度范围内,a和b的取值具体如下:Furthermore, using a welding parameter acquisition method of welding process detection equipment, in different temperature ranges, the values of a and b are specifically as follows:

热电偶子模块1探测到的温度Temperature detected by thermocouple sub-module 1 aa bb 线性度Linearity -250℃~-200℃-250℃~-200℃ 0.09560.0956 367.24367.24 0.98380.9838 -199℃~100℃-199℃~100℃ 0.04240.0424 55.76855.768 0.99300.9930 -99℃~-50℃-99℃~-50℃ 0.03010.0301 7.46157.4615 0.99960.9996 -49℃~0℃-49℃~0℃ 0.02650.0265 0.40840.4084 0.99980.9998 1℃-100℃1°C-100°C 0.02430.0243 0.53170.5317 1.00001.0000 101℃-200℃101°C-200°C 0.02480.0248 -1.8988-1.8988 1.00001.0000 201℃-400℃201℃-400℃ 0.02420.0242 4.26844.2684 0.99900.9990 401℃-600℃401℃-600℃ 0.02350.0235 15.05715.057 1.00001.0000 601℃-800℃601℃-800℃ 0.02390.0239 4.53974.5397 1.00001.0000 801℃-1000℃801°C-1000°C 0.02500.0250 -32.73-32.73 1.00001.0000 1001℃-1300℃1001°C-1300°C 0.02500.0250 -32.73-32.73 0.99980.9998

在上述拟合函数中,y是温度单位是℃,x是热电势单位是uV。分段拟合后的函数与分度表对比只有最大±3℃的误差。In the above fitting function, y is temperature in °C, and x is thermoelectric potential in uV. Compared with the graduated table, the function after segment fitting has only a maximum error of ±3°C.

通过差分的ADC采集到热电势,然后通过拟合函数算出对应的温度,完成温度的采集。The thermoelectric potential is collected through the differential ADC, and then the corresponding temperature is calculated through the fitting function to complete the temperature collection.

线性度是拟合后的函数和实际的分度表的偏差程度。用连续函数表达出离散的点。线性度越高拟合的函数与离散点的误差越小。有上表可以看出,采用本发明设备及方法后获得的温度与实际温度之间的温度误差小。Linearity is the degree of deviation between the fitted function and the actual graduated table. Use continuous functions to represent discrete points. The higher the linearity, the smaller the error between the fitted function and the discrete point. It can be seen from the above table that the temperature error between the temperature obtained after adopting the equipment and method of the present invention and the actual temperature is small.

Claims (9)

1. The utility model provides a welding process check out test set, includes welding machine, collection system and host computer, wherein, welding machine and collection system are connected with the host computer respectively, its characterized in that: the synchronous acquisition system comprises a voltage acquisition unit, a current acquisition unit and a temperature field acquisition unit; the voltage acquisition unit is responsible for acquiring a welding voltage signal, conditioning a voltage signal of +/-200 v to +/-10 v, and bearing 3000v high-voltage arcing of TIG without being damaged; the current acquisition unit is responsible for acquiring welding current signals, and conditioning the current signals of +/-1000A to +/-10 v; the temperature field acquisition unit is responsible for acquiring the temperature of the workpiece, and the temperature measurement range is-200 ℃ to 1300 ℃.
2. The welding process detection device of claim 1, wherein: the temperature field acquisition unit comprises an 8-channel thermocouple and is used for detecting the ambient temperature of-200 ℃ to 1300 ℃; the sampling voltage range of the voltage acquisition unit is between-200V and 200V; the sampling current range of the current acquisition unit is between-1000A and 1000A.
3. The welding process detection device of claim 1, wherein: the temperature field acquisition unit consists of a thermocouple sub-module (1), a first signal conditioning sub-module (2), a first ARM chip (3), a second ARM chip (4), a touch screen (5), a key sub-module (6), a second signal conditioning sub-module (7), an AD conversion module (8) and an SD card module (9); the thermocouple submodule (1) is connected with the first ARM chip (3) through the first signal conditioning submodule (2); the output end of the second signal conditioning submodule (7) is connected with the input end of the AD conversion module (8); the first ARM chip (3), the touch screen (5), the AD conversion module (8) and the SD card module (9) are respectively connected with the second ARM chip (4) and are in bidirectional data communication; the key submodule (6) is connected with the second ARM chip (4) and is in one-way data communication.
4. A welding process detection apparatus according to claim 3, wherein: the thermocouple submodule (1) comprises not less than 8 channels; the thermocouple sub-module (1) is a K-type thermocouple; the temperature measuring range of the thermocouple sub-module (1) is between-200 ℃ and 1300 ℃; the model of the first ARM chip (3) is STM32F 373; the model of the second ARM chip (4) is STM32F 429; the first signal conditioning submodule (2) is responsible for filtering interference and noise signals on the thermocouple and isolating and outputting thermoelectric potential signals to the ARM chip, and the input and output range of thermoelectric potential is +/-1 v; the second signal conditioning submodule (7) is responsible for filtering interference and noise signals in the welding process and conditioning received welding voltage and current signals to a range from-10V to + 10V; the model of the AD conversion module (8) is an AD7606 analog-to-digital conversion chip; the data sampling rate of the AD conversion module (8) is not less than 8 channels, and each channel has 200 KHZ.
5. A welding process detection apparatus according to claim 3, wherein: the first ARM chip (3) is connected with the second ARM chip (4) in a wireless connection mode or a CAN wired mode; the touch screen (5) is connected with the second ARM chip (4) through the FSMC; the key submodule (6) is connected with the second ARM chip (4) through I/O; the AD conversion module (8) is connected with the second ARM chip (4) through an INTER 8086.
6. A welding process detection apparatus according to claim 3, wherein: the receiving end of the second signal conditioning submodule (7) is connected with the welding electric signal interface (10).
7. The welding process detection device of claim 6, wherein: the output end of the voltage acquisition unit and the output end of the current acquisition unit are respectively connected with the welding electric signal interface (10).
8. A welding parameter acquisition method using a welding process detection apparatus according to claims 1 to 7, characterized in that: the method comprises the following steps:
step 1: punching a hole on a plate to be welded by using a drill bit; subsequently, a thermocouple was inserted into the hole; then, a welding wire is plugged into the hole in which the thermocouple is inserted, so that the thermocouple is fixed;
step 2: welding the positive and negative electrodes of the voltage acquisition line to the corresponding positive and negative electrode outputs of the plate to be welded;
and step 3: the ground wire penetrates through the Hall current sensor according to the current direction;
and 4, step 4: after the wiring work is finished, starting the machine and fitting the temperature according to the following functional formula:
y=ax+b,
wherein, the value range of a is between 0.010 and 0.500, and the value range of b is between 0.800 and 400.1000.
And 5: and outputting the fitting temperature.
9. The method of claim 8 for collecting welding parameters using a welding process sensing device, wherein the method comprises the steps of: in different temperature ranges, the values of a and b are specifically as follows:
CN201710862038.3A 2017-09-21 2017-09-21 A kind of welding process detection device and welding parameter acquisition method Pending CN107505059A (en)

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Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109357363A (en) * 2018-09-07 2019-02-19 华南理工大学广州学院 A kind of indoor environmental condition control system based on zigbee
CN109623224A (en) * 2019-02-26 2019-04-16 南京工程学院 A kind of production Thermal Cycle and sweating heat specification monitoring system and application method
CN110243486A (en) * 2019-07-04 2019-09-17 上海申矽凌微电子科技有限公司 Full temperature high-precision temperature sensor-based system, method and medium
CN110658403A (en) * 2019-09-30 2020-01-07 无锡市同芯恒通科技有限公司 Solder joint reliability test system and method
CN110899933A (en) * 2019-12-19 2020-03-24 沈阳大学 Device and method for wirelessly detecting welding parameters
CN115464288A (en) * 2022-10-13 2022-12-13 长沙学院 Resistance heat-assisted hybrid welding system based on heterogeneous metal

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109357363A (en) * 2018-09-07 2019-02-19 华南理工大学广州学院 A kind of indoor environmental condition control system based on zigbee
CN109623224A (en) * 2019-02-26 2019-04-16 南京工程学院 A kind of production Thermal Cycle and sweating heat specification monitoring system and application method
CN110243486A (en) * 2019-07-04 2019-09-17 上海申矽凌微电子科技有限公司 Full temperature high-precision temperature sensor-based system, method and medium
CN110243486B (en) * 2019-07-04 2021-01-08 上海申矽凌微电子科技有限公司 Full-temperature high-precision temperature sensing system, method and medium
CN110658403A (en) * 2019-09-30 2020-01-07 无锡市同芯恒通科技有限公司 Solder joint reliability test system and method
CN110899933A (en) * 2019-12-19 2020-03-24 沈阳大学 Device and method for wirelessly detecting welding parameters
CN115464288A (en) * 2022-10-13 2022-12-13 长沙学院 Resistance heat-assisted hybrid welding system based on heterogeneous metal

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