CN107477547A - Expanded type lamp cooling structure - Google Patents
Expanded type lamp cooling structure Download PDFInfo
- Publication number
- CN107477547A CN107477547A CN201710871829.2A CN201710871829A CN107477547A CN 107477547 A CN107477547 A CN 107477547A CN 201710871829 A CN201710871829 A CN 201710871829A CN 107477547 A CN107477547 A CN 107477547A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- conducting plate
- cooling structure
- type lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 22
- 239000000463 material Substances 0.000 claims description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052782 aluminium Inorganic materials 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 7
- 229920003023 plastic Polymers 0.000 claims description 4
- 239000004033 plastic Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 description 6
- 239000007788 liquid Substances 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 102100028175 Abasic site processing protein HMCES Human genes 0.000 description 1
- 101001006387 Homo sapiens Abasic site processing protein HMCES Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S45/00—Arrangements within vehicle lighting devices specially adapted for vehicle exteriors, for purposes other than emission or distribution of light
- F21S45/40—Cooling of lighting devices
- F21S45/47—Passive cooling, e.g. using fins, thermal conductive elements or openings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/51—Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention relates to a kind of expanded type lamp cooling structure, including the first radiator, second radiator, heat pipe, heat-conducting plate and support, heat-conducting plate is fixed on support, contact or close thermal source at the lower surface of heat-conducting plate at least one, first radiator is fixed on the upper surface of heat-conducting plate, the bottom plate of first radiator and the upper surface of heat-conducting plate attach, one end of heat pipe is through the first radiator and is attached on the bottom plate of first radiator, another end of heat pipe extends to the second radiator position and is attached on the bottom plate of the second radiator, second radiator opposite brackets are fixedly connected, second radiator is arranged on the other positions beyond the top of thermal source, two ends of heat pipe respectively with the first radiator, second radiator is relatively fixed.The weight of the present invention reduces more than 50% than traditional heat-dissipating structure, and radiating efficiency significantly improves.
Description
Technical field
The present invention relates to a kind of expanded type lamp cooling structure, and being used primarily in dipped beam/distance light/DRL etc. has radiating requirements
At pyrotoxin.
Background technology
Existing automobile lamp typically uses radiator structure made of ADC12 materials to realize radiating.This kind of radiator structure leads to
Often it is molded by mould integral die-cast, including radiating fin and holder part.Due to the relation of pattern draft, typically do
The thickness on the head of the fin of die casting is 1mm, and the thickness of root is 1.5mm.In order to meet cooling requirements, number of fins also compares
It is more, therefore fin account for suitable weight in radiator structure.Correspondingly, it is contemplated that the putting position of radiating fin,
Support will generally also be made bigger, put area needs more greatly with adapt to greater number of radiating fin, therefore tradition dissipates
Weight accounting of the heat structure in light fixture is larger, and structure is also complex.Realize higher heat dissipation capacity, it is necessary to set heavier
Radiator structure, while also improve light fixture cost.
The content of the invention
To solve the above problems, the invention provides a kind of expanded type lamp cooling structure, more excellent radiating can be obtained
Effect, and can make weight reduce more than 50%, dramatically reduce the weight of light fixture.
The main technical schemes of the present invention have：
A kind of expanded type lamp cooling structure, including the first radiator, the second radiator, heat pipe, heat-conducting plate and support, institute
State heat-conducting plate to fix on the bracket, contact or scattered close to thermal source, described first at the lower surface at least one of the heat-conducting plate
Hot device is fixed on the upper surface of the heat-conducting plate, and the bottom plate of first radiator attaches with the upper surface of the heat-conducting plate, institute
An end of heat pipe is stated through first radiator and is attached on the bottom plate of first radiator, the heat pipe it is another
One end extends to the second radiator position, and is attached on the bottom plate of second radiator, described second
The relatively described support of radiator is fixedly connected, and second radiator is arranged on the position beyond the top of the thermal source, described
Two ends of heat pipe are relatively fixed with first radiator and the second radiator respectively.
The heat-conducting plate can include upper heat-conducting plate and lower heat-conducting plate, and the upper heat-conducting plate is fixed on the bracket, institute
The upper surface that the first radiator is fixed on the upper heat-conducting plate is stated, the lower heat-conducting plate fitting is fixed under the upper heat-conducting plate
Surface, the lower surface contact of the lower heat-conducting plate or the close thermal source.
It can be positioned by alignment pin between the lower heat-conducting plate and upper heat-conducting plate, be attached by screw, and two
Thermal paste should be smeared between person.
The thermal source can be LED module, be positioned between the LED module and lower heat-conducting plate by alignment pin, lead to
Thermal paste is crossed to be fixed.
The area of the lower heat-conducting plate have to be larger than the LED module.
The support can be metallic support or plastic stent, and the upper heat-conducting plate is copper heat-conducting plate or aluminum heat conduction
Plate, the lower heat-conducting plate are copper heat-conducting plate or aluminum heat-conducting plate.
The support can be made of ADC12, PBT or PBT+10%GF-40%GF material.
The cross-sectional profile of the heat pipe can be set with rounded, ellipse, rectangle or oblateness, second radiator
Put at the rear of the thermal source.
The radiator can be finned radiator, and the thickness of its radiating fin is preferably 0.3-0.6mm, and adjacent two dissipate
The spacing of hot fin is preferably not less than 5mm.
The expanded type lamp cooling structure can also include speculum, and the speculum installation on the bracket, makes
The LED module is between the lower heat-conducting plate and the speculum.
The beneficial effects of the invention are as follows：
The present invention is by the way of heat pipe and radiator are combined, whole to dissipate in the case where obtaining equal radiating effect
The weight of heat structure alleviates more than 50% than traditional heat-dissipating structure, therefore can greatly mitigate the weight of light fixture.Equal
In the case of weight, the radiating efficiency apparently higher than traditional heat-dissipating structure can be obtained.And the radiator structure also has knot
The advantages of structure is simple, easy to process.Moreover, can be by heat pipe heat due to also using the flexibility characteristics of heat pipe
Light fixture interiors of products is more transmitted under normal circumstances in other relatively low spaces of temperature, and by another in other spaces
Outer setting radiator radiates to further speed up, and equivalent to the area of dissipation for increasing the radiator structure again, makes the radiating
The radiating efficiency of structure further significantly improves.
Brief description of the drawings
Fig. 1 is the explosive view of one embodiment of the present of invention；
Fig. 2 is the rear view under embodiment illustrated in fig. 1 confined state；
Fig. 3 is a kind of schematic diagram of arrangement of heat pipe opposite heat sink bottom plate.
Embodiment
The invention discloses a kind of expanded type lamp cooling structure, as shown in Figure 1, 2, 3, including the first radiator 1, second
Radiator 7, heat pipe 2, heat-conducting plate and support 5, the support are the installation foundation parts of other each parts, and the heat-conducting plate is fixed on
On the support, contact or the close thermal source, first radiator are fixed at the lower surface at least one of the heat-conducting plate
The upper surface of the heat-conducting plate, the bottom plate of first radiator attach with the upper surface of the heat-conducting plate, and the one of the heat pipe
Individual end is through first radiator and is attached on the bottom plate of first radiator, and another end of the heat pipe is prolonged
The second radiator position is extended, and is attached on the bottom plate of second radiator, second radiator is relative
The support is fixedly connected.Second radiator is arranged on the position beyond the top of the thermal source, two of the heat pipe
End is relatively fixed and is connected with first radiator and the second radiator respectively.
The heat pipe is typically made up of shell, liquid-sucking core and end cap.Inside heat pipe is pumped into negative pressure state, and it is appropriate to be filled with
Liquid, this boiling point of liquid is low, readily volatilized.Tube wall has liquid-sucking core, and it is made up of capillary-porous material.Heat pipe one end is evaporation
End, other end is condensation end, and when heat pipe one end is heated, the liquid rapid vaporization in capillary, steam is in the dynamic of thermal diffusion
Other end is flowed under power, and heat is discharged in cold end condensation, liquid flows back to evaporation ends along porous material by capillarity again,
So circulation is more than, and until heat pipe both ends, temperature is equal (now steam thermal diffusion stopping).This circulation is quickly carried out, heat
Amount, which can be conducted continuously, to be come, therefore heat pipe plays efficient conductive force, and its thermal conductivity factor can reach
100000W/m DEG C, be more than 1000 times of ADC12 materials.
The radiator is a kind of device to the radiating of easy heat-generating electronic elements, can make tabular, sheet, splintery,
Play a part of radiating.Traditional radiator is made frequently with ADC12 materials.
The heat that the heat pipe can distribute thermal source is quickly and efficiently transmitted to radiator, and radiator is then rapidly carried out
Radiating.The present invention can be quickly and efficiently led except heat, therefore using the combination of heat pipe and first, second independent radiator
In the case of equal cooling requirements, the radiator, which can be made, is significantly less than traditional radiating fin part, therefore mitigates
The weight of a part of radiator structure.Simultaneously as the installation without traditional radiating fin needs, holder part weight
It is obviously reduced so that the weight of whole radiator structure is decreased obviously.
The expanded type lamp cooling structure also has the advantages of simple in construction, easy to process, good manufacturability.Not only such as
This, is more transmitted to by heat pipe due to heat on the radiator in light fixture interiors of products its complementary space, equivalent to increasing
The area of dissipation of the radiator structure, the radiating efficiency of the radiator structure is set further to significantly improve.
The heat-conducting plate can include upper heat-conducting plate 3 and lower heat-conducting plate 4, and the upper heat-conducting plate is fixed on the bracket,
First radiator is fixed on the upper surface of the upper heat-conducting plate, and the lower heat-conducting plate fitting is fixed on the upper heat-conducting plate
Lower surface, the lower surface contact of the lower heat-conducting plate or the close thermal source.Thermal source first transfers heat to lower heat-conducting plate, under lead
Hot plate transfers heat to heat-conducting plate again.Generally, the area of upper heat-conducting plate will be significantly greater than lower heat-conducting plate, on the one hand be easy to the
The installation of one radiator and heat pipe, be on the other hand advantageous to improve radiating efficiency.
It can be positioned by alignment pin between the lower heat-conducting plate and upper heat-conducting plate, be attached by screw, and two
Thermal paste should be smeared between person, is advantageous to from the upward heat-conducting plate heat conduction of lower heat-conducting plate.
The thermal source can be LED module, be positioned between the LED module and lower heat-conducting plate by alignment pin, lead to
Thermal paste is crossed to be fixed.
The area of the lower heat-conducting plate have to be larger than the LED module.The lower heat-conducting plate can be square or rectangular
Shape.
The support can be metallic support or plastic stent.When for metallic support when, it is preferred to use ADC12 material systems
Into, when for plastic stent when, can use PBT or PBT+10%GF-40%GF (such as PBT+10%GF, PBT+20%GF,
PBT+30%GF or PBT+40%GF) material is made.
The upper heat-conducting plate can be copper heat-conducting plate or aluminum heat-conducting plate, and the lower heat-conducting plate can also be copper heat conduction
Plate or aluminum heat-conducting plate.Heretofore described upper heat-conducting plate is preferably aluminum heat-conducting plate, and the lower heat-conducting plate is preferably that copper is led
Hot plate.
The cross-sectional profile of the heat pipe is unlimited, can with rounded, ellipse, rectangle or oblateness, or it is existing its
He is variously-shaped.Further, the cross-sectional profile for the part that the heat pipe is attached on the bottom plate of the radiator is preferably
Rectangle or square, make that heat pipe and radiator contact area are bigger, and the cross-sectional profile of remainder heat pipe is preferably circular
Or ellipse, make heat pipe for thermal conductivity performance more preferable.This setup can make heat conduction and the aspect of radiating two while reach preferable
Level, therefore being obviously improved for radiating efficiency can be obtained.
In addition, the part that heat pipe fits with base plate of radiator can be extended on bottom plate with straight line or dog-leg path,
It can be extended with curvilinear path.In the case that fund condition allows, the part heat pipe is preferably prolonged on bottom plate 1-1 with serpentine path
Stretch, as shown in figure 3, so that heat pipe and contacts baseplate more fully, uniformly, enable each portion of bottom plate evenly to conduct heat.
Second radiator is preferably provided at the rear of the thermal source.Heat pipe can run through the second radiator, with radiating
The upper surface of device bottom plate is in contact, back face that can also be not through the second radiator and only with the bottom plate of the second radiator
Touch.
Recognized by temperature simulation, above thermal source be the relatively high position of heat in general light fixture, and after thermal source
The temperature of side is then than relatively low.Conduct heat in the relatively low space of temperature and be clearly advantageous to radiate, but due to bulb be from
Load below, and LED is disposed vertically, heat can not transmit from the rear of the direct heat source of thermal source, therefore the biography of heat
Guide passage path length, and thermal resistance is big, also therefore the temperature at the rear of thermal source is often relatively low.The present invention utilizes the flexibility characteristics of heat pipe, will
Heat is efficiently transmitted in the rear space of thermal source, and the heat-transfer effect of heat pipe is good to the rear that can ignore from thermal source to thermal source
The thermal resistance in space.The second radiator is set up in the rear space of thermal source, the area of dissipation equivalent to this radiator structure dramatically increases,
Therefore in the case where other conditions are constant, radiating effect can be significantly improved.
The radiator is preferably finned radiator made of sheet material welding, and the thickness of its radiating fin can be very thin,
Preferably 0.3-0.6mm, such as 0.5mm.The spacing of adjacent two radiating fin is preferably not less than 5mm, is advantageous to air circulation, from
And be advantageous to radiate.The radiator is preferably using fin type made of other aluminum alloy materials of heat-conducting system higher than ADC12
Radiator, such as the thermal conductivity factor accordingly used are about 226W/m DEG C, are that traditional heat-dissipating structure uses the 2 of materials A DC12
More than times, therefore heat can conduct more quickly, and radiating efficiency is higher.Due to density of material and the heat radiating fin of traditional heat-dissipating structure
The density of material of piece is essentially identical, in the case of identical area of dissipation, uses the radiating fin of other aluminum alloy materials, radiating
The pts wt of device part is lighter, therefore the weight of heat sink part can mitigate more than 50% compared to traditional in the present invention,
Therefore the weight of light fixture can greatly be mitigated.In the case of equivalent weight, it can obtain apparently higher than traditional heat-dissipating structure
Radiating efficiency.
The heat pipe preferably along through the most direction of radiating fin lay, to obtain highest heat transfer efficiency.
Because the radiating of part mainly wants radiating fin and air contact, distribute heat among air.With air
The area of contact is bigger, and radiating effect is better.Within equal spatial dimension, using the aluminum alloy materials in addition to ADC12
Finned radiator, because fin thickness is thinner, it is possible to more radiating fins are arranged during than using ADC12 materials, because
First radiator of this present invention has more area of dissipations than the radiating fin of traditional ADC12 materials, and radiating effect is notable
Improve.
The expanded type lamp cooling structure can also include speculum 6, and the speculum installation on the bracket, makes
The LED module is between the lower heat-conducting plate and the speculum.The support also forms the installation base of the speculum
Plinth part.
Claims (10)
- A kind of 1. expanded type lamp cooling structure, it is characterised in that：Including the first radiator, the second radiator, heat pipe, heat-conducting plate And support, the heat-conducting plate are fixed on the bracket, contact or close thermal source, institute at the lower surface at least one of the heat-conducting plate State the upper surface that the first radiator is fixed on the heat-conducting plate, the bottom plate of first radiator and the upper surface of the heat-conducting plate Attach, an end of the heat pipe through first radiator and is attached on the bottom plate of first radiator, described Another end of heat pipe extends to the second radiator position, and is attached on the bottom plate of second radiator, The relatively described support of second radiator is fixedly connected, and second radiator is arranged on the position beyond the top of the thermal source Put, two ends of the heat pipe are relatively fixed with first radiator and the second radiator respectively.
- 2. expanded type lamp cooling structure as claimed in claim 1, it is characterised in that：The heat-conducting plate include upper heat-conducting plate and Lower heat-conducting plate, the upper heat-conducting plate are fixed on the bracket, and first radiator is fixed on the upper table of the upper heat-conducting plate Face, the lower heat-conducting plate fitting are fixed on the lower surface of the upper heat-conducting plate, the lower surface contact or close of the lower heat-conducting plate The thermal source.
- 3. expanded type lamp cooling structure as claimed in claim 2, it is characterised in that：Between the lower heat-conducting plate and upper heat-conducting plate Positioned by alignment pin, be attached by screw, and thermal paste is smeared between the two.
- 4. expanded type lamp cooling structure as claimed in claim 3, it is characterised in that：The thermal source is LED module, described Positioned by alignment pin between LED module and lower heat-conducting plate, be fixed by thermal paste.
- 5. expanded type lamp cooling structure as claimed in claim 4, it is characterised in that：The area of the lower heat-conducting plate is more than institute State LED module.
- 6. expanded type lamp cooling structure as claimed in claim 5, it is characterised in that：The support is metallic support or plastics Support, the upper heat-conducting plate are copper heat-conducting plate or aluminum heat-conducting plate, and the lower heat-conducting plate is copper heat-conducting plate or aluminum heat conduction Plate.
- 7. expanded type lamp cooling structure as claimed in claim 6, it is characterised in that：The support using ADC12, PBT or PBT+10%GF-40%GF materials are made.
- 8. the expanded type lamp cooling structure as described in claim 1,2,3,4,5,6 or 7, it is characterised in that：The heat pipe Cross-sectional profile is rounded, ellipse, rectangle or oblateness, second radiator are arranged on the rear of the thermal source.
- 9. expanded type lamp cooling structure as claimed in claim 8, it is characterised in that：The radiator radiates for fin type Device, the thickness of its radiating fin is 0.3-0.6mm, and the spacing of adjacent two radiating fin is not less than 5mm.
- 10. expanded type lamp cooling structure as claimed in claim 8, it is characterised in that：Also include speculum, the speculum Installation on the bracket, makes the LED module between the lower heat-conducting plate and the speculum.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710871829.2A CN107477547B (en) | 2017-09-25 | 2017-09-25 | Expansion type lamp heat dissipation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710871829.2A CN107477547B (en) | 2017-09-25 | 2017-09-25 | Expansion type lamp heat dissipation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107477547A true CN107477547A (en) | 2017-12-15 |
| CN107477547B CN107477547B (en) | 2023-07-14 |
Family
ID=60586807
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710871829.2A Active CN107477547B (en) | 2017-09-25 | 2017-09-25 | Expansion type lamp heat dissipation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107477547B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107747718A (en) * | 2017-09-25 | 2018-03-02 | 上海小糸车灯有限公司 | Automobile lamp radiator structure |
| CN108591964A (en) * | 2018-02-06 | 2018-09-28 | 太仓市华盈电子材料有限公司 | LED car lamp high efficiency and heat radiation module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101408301A (en) * | 2007-10-10 | 2009-04-15 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
| WO2013016998A1 (en) * | 2011-08-01 | 2013-02-07 | 深圳亚锐光电科技有限公司 | Fin-type heat dissipation device |
| CN203823502U (en) * | 2014-04-04 | 2014-09-10 | 深圳亚锐光电科技有限公司 | Led lamp |
| CN203823634U (en) * | 2014-04-10 | 2014-09-10 | 深圳亚锐光电科技有限公司 | LED searchlight |
| CN207279580U (en) * | 2017-09-25 | 2018-04-27 | 上海小糸车灯有限公司 | Expanded type lamp cooling structure |
-
2017
- 2017-09-25 CN CN201710871829.2A patent/CN107477547B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101408301A (en) * | 2007-10-10 | 2009-04-15 | 富准精密工业(深圳)有限公司 | LED light fitting with heat radiating device |
| WO2013016998A1 (en) * | 2011-08-01 | 2013-02-07 | 深圳亚锐光电科技有限公司 | Fin-type heat dissipation device |
| CN203823502U (en) * | 2014-04-04 | 2014-09-10 | 深圳亚锐光电科技有限公司 | Led lamp |
| CN203823634U (en) * | 2014-04-10 | 2014-09-10 | 深圳亚锐光电科技有限公司 | LED searchlight |
| CN207279580U (en) * | 2017-09-25 | 2018-04-27 | 上海小糸车灯有限公司 | Expanded type lamp cooling structure |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107747718A (en) * | 2017-09-25 | 2018-03-02 | 上海小糸车灯有限公司 | Automobile lamp radiator structure |
| CN108591964A (en) * | 2018-02-06 | 2018-09-28 | 太仓市华盈电子材料有限公司 | LED car lamp high efficiency and heat radiation module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107477547B (en) | 2023-07-14 |
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