CN107475671A - Metal film electrode preparation method based on MPTMS modification ITO heating plates - Google Patents
Metal film electrode preparation method based on MPTMS modification ITO heating plates Download PDFInfo
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Abstract
本发明公开了一种基于MPTMS修饰ITO加热片的金属膜电极制作方法,首先将ITO基板超声清洗干净并吹干;然后对ITO基板进行紫外光处理;再将ITO基板浸泡在MPTMS与甲苯的混合溶液中,利用MPTMS自组装修饰ITO基板表面,使ITO基板表面形成一层自组装薄膜;最后在经过MPTMS修饰后的ITO基板上制作金属膜电极。本发明中ITO基板与金属膜电极之间形成了一层自组装薄膜,该自组装薄膜的分子链两端通过键合作用连接ITO基板和金属膜电极,使得所制备的金属膜电极更加均匀致密、粘附力更强且阻抗更低。因此,本发明有效地改善了使用传统技术制备ITO加热片电极存在的阻抗分布不均匀以及电极粘附力差的问题。
The invention discloses a metal film electrode manufacturing method based on MPTMS modified ITO heating sheet. First, the ITO substrate is ultrasonically cleaned and dried; then the ITO substrate is treated with ultraviolet light; In the solution, the surface of the ITO substrate is modified by MPTMS self-assembly, so that a layer of self-assembled film is formed on the surface of the ITO substrate; finally, a metal film electrode is fabricated on the ITO substrate modified by MPTMS. In the present invention, a layer of self-assembled film is formed between the ITO substrate and the metal film electrode, and the two ends of the molecular chain of the self-assembled film are connected to the ITO substrate and the metal film electrode through bonding, so that the prepared metal film electrode is more uniform and compact , stronger adhesion and lower impedance. Therefore, the present invention effectively solves the problems of non-uniform impedance distribution and poor electrode adhesion existing in the preparation of ITO heater sheet electrodes using traditional techniques.
Description
技术领域technical field
本发明涉及ITO基板电极制备方法领域,具体是一种基于MPTMS修饰ITO加热片的金属膜电极制作方法。The invention relates to the field of preparation methods of ITO substrate electrodes, in particular to a method for manufacturing metal film electrodes based on MPTMS modified ITO heating sheets.
背景技术Background technique
目前,显示领域中多以ITO基板作为加热器件,其电极主要通过涂覆导电银浆和真空蒸镀的方式制作,但通过这些方式制作的电极主要存在两个问题。一是电极内部阻抗不一致,使得ITO加热片中电流分布不均匀,导致局部生热现象严重。二是电极的附着力过低,若ITO加热片长时间工作,会导致电极老化、脱落,影响器件的可靠性。因此需要对电极的制备工艺加以优化,提升电极的阻抗均匀性和与ITO表面的粘附性能。At present, in the display field, ITO substrates are mostly used as heating devices, and the electrodes are mainly produced by coating conductive silver paste and vacuum evaporation, but there are two main problems in the electrodes produced by these methods. One is that the internal impedance of the electrodes is inconsistent, which makes the current distribution in the ITO heating sheet uneven, resulting in serious local heating. The second is that the adhesion of the electrode is too low. If the ITO heater works for a long time, it will cause the electrode to age and fall off, which will affect the reliability of the device. Therefore, it is necessary to optimize the preparation process of the electrode to improve the impedance uniformity of the electrode and the adhesion performance with the ITO surface.
发明内容 针对上述背景技术中存在的问题,本发明提供了一种基于MPTMS修饰ITO加热片的金属膜电极制作方法,以解决现有技术在ITO基板上制备的电极存在的电极阻抗分布不均匀和附着力较低的问题。SUMMARY OF THE INVENTION Aiming at the problems existing in the above-mentioned background technology, the present invention provides a metal film electrode manufacturing method based on MPTMS modified ITO heating plate, in order to solve the problem of uneven electrode impedance distribution and Problems with low adhesion.
为了达到上述目的,本发明所采用的技术方案为:In order to achieve the above object, the technical scheme adopted in the present invention is:
基于MPTMS修饰ITO加热片的金属膜电极制作方法,其特征在于:先使用有机硅烷材料自组装修饰ITO基板,然后在其上制作金属膜电极,具体包括以下步骤:The method for manufacturing a metal film electrode based on MPTMS modified ITO heating sheet is characterized in that: firstly use organic silane material to self-assemble and modify the ITO substrate, and then make a metal film electrode on it, which specifically includes the following steps:
(1)、ITO基板的清洗:(1) Cleaning of ITO substrate:
采用超声清洗方式清洗ITO基板,清洗结束后将ITO基板吹干;Use ultrasonic cleaning to clean the ITO substrate, and dry the ITO substrate after cleaning;
(2)、紫外光处理:(2), UV treatment:
使用紫外光清洗机处理经步骤(1)处理后的ITO基板,以去除ITO基板表面的有机物残留并增加ITO基板表面的羟基数量;Use an ultraviolet cleaning machine to treat the ITO substrate after step (1) to remove organic residues on the surface of the ITO substrate and increase the number of hydroxyl groups on the surface of the ITO substrate;
(3)、ITO基板的MPTMS 3-巯丙基三甲氧基硅烷修饰:(3), MPTMS 3-mercaptopropyltrimethoxysilane modification of ITO substrate:
将经步骤(2)处理后的ITO基板置于MPTMS 3-巯丙基三甲氧基硅烷与甲苯的混合溶液中进行自组装修饰,混合溶液中甲苯为溶剂,修饰结束后再用甲苯冲洗ITO基板以去除多余的MPTMS 3-巯丙基三甲氧基硅烷,最后将ITO基板吹干;Place the ITO substrate treated in step (2) in a mixed solution of MPTMS 3-mercaptopropyltrimethoxysilane and toluene for self-assembly modification. Toluene is used as the solvent in the mixed solution, and the ITO substrate is rinsed with toluene after modification To remove excess MPTMS 3-mercaptopropyltrimethoxysilane, and finally dry the ITO substrate;
(4)、在经步骤(3)修饰后的ITO基板上制备金属膜电极。(4) Prepare a metal film electrode on the ITO substrate modified in step (3).
所述的基于MPTMS修饰ITO加热片的金属膜电极制作方法,其特征在于:所述步骤(2)中,采用紫外光清洗机处理ITO基板的时长为25-35min。The method for manufacturing a metal film electrode based on MPTMS modified ITO heating sheet is characterized in that: in the step (2), the time length for processing the ITO substrate with an ultraviolet cleaning machine is 25-35 minutes.
所述的基于MPTMS修饰ITO加热片的金属膜电极制作方法,其特征在于:所述的步骤(3)的混合溶液中,MPTMS与甲苯的体积比为0.5-1.5:40;在室温环境下,将ITO基板置于混合溶液中进行自组装修饰,修饰的时长为3-8h。The method for manufacturing a metal film electrode based on MPTMS modified ITO heating sheet is characterized in that: in the mixed solution of step (3), the volume ratio of MPTMS to toluene is 0.5-1.5:40; at room temperature, The ITO substrate is placed in the mixed solution for self-assembly modification, and the modification time is 3-8h.
所述的基于MPTMS修饰ITO加热片的金属膜电极制作方法,其特征在于:所述的步骤(3)中,除了MPTMS外还可以使用其他有机硅烷材料修饰ITO基板。The method for manufacturing a metal film electrode based on MPTMS-modified ITO heating sheet is characterized in that in the step (3), in addition to MPTMS, other organosilane materials can be used to modify the ITO substrate.
所述的基于MPTMS修饰ITO加热片的金属膜电极制作方法,其特征在于:所述的步骤(4)中,优选采用真空蒸镀方式在经过步骤(3)修饰后的ITO基板上制备金属膜电极。The method for manufacturing a metal film electrode based on MPTMS modified ITO heating sheet is characterized in that in the step (4), the metal film is preferably prepared on the ITO substrate modified in step (3) by vacuum evaporation electrode.
本发明的原理是:Principle of the present invention is:
本发明在步骤(2)中,采用紫外光清洗机处理ITO基板。紫外光可分解ITO基板表面的有机物残留;同时,空气中的氧气在紫外光催化下生成臭氧,臭氧可以进一步分解ITO表面的有机物残留,且臭氧与ITO表面残留的水分子反生氧化还原反应生成羟基(-OH)。紫外光处理使ITO基板表面变得更加清洁,同时增加了ITO基板表面的羟基数量,有利于后续处理。In the step (2) of the present invention, an ultraviolet cleaning machine is used to process the ITO substrate. Ultraviolet light can decompose the organic residues on the surface of the ITO substrate; at the same time, the oxygen in the air generates ozone under the catalysis of ultraviolet light, and the ozone can further decompose the organic residues on the ITO surface, and the ozone reacts with the water molecules remaining on the ITO surface to generate redox reactions. Hydroxyl (-OH). The ultraviolet light treatment makes the surface of the ITO substrate cleaner, and at the same time increases the number of hydroxyl groups on the surface of the ITO substrate, which is beneficial to subsequent processing.
本发明在步骤(3)中,基于分子自组装原理,在室温环境下,将经步骤(2)处理后的ITO基板浸泡于MPTMS与甲苯的混合溶液中,MPTMS分子的头基(-Si-OCH3)发生水解反应,生成-Si-OH,然后-Si-OH又与ITO表面的-OH发生聚合反应,生成-Si-O-,从而将MPTMS分子固定在ITO基板表面,最终在ITO基板表面形成一层自组装薄膜。自组装薄膜中MPTMS分子链上的巯基(-SH)暴露在外侧,其极易与金属形成稳固的共价键,从而能够将金属固定在ITO基板表面,使得所制备的电极更均匀、致密、附着力更强。在本发明中首先使用MPTMS自组装修饰ITO基板,然后在修饰后的ITO基板上蒸镀金属膜电极作为加热片电极。由于MPTMS修饰后形成的自组装薄膜的作用,使得金属膜电极更均匀、致密且牢固地粘接在ITO基板上。In the step (3), based on the principle of molecular self-assembly, the ITO substrate treated in the step (2) is soaked in the mixed solution of MPTMS and toluene at room temperature, and the head group (-Si- OCH3) undergoes a hydrolysis reaction to generate -Si-OH, and then -Si-OH polymerizes with the -OH on the ITO surface to generate -Si-O-, thereby immobilizing MPTMS molecules on the surface of the ITO substrate, and finally on the surface of the ITO substrate A self-assembled film is formed. The sulfhydryl group (-SH) on the MPTMS molecular chain in the self-assembled film is exposed to the outside, and it is very easy to form a strong covalent bond with the metal, so that the metal can be fixed on the surface of the ITO substrate, making the prepared electrode more uniform, dense, and stable. Stronger adhesion. In the present invention, MPTMS self-assembly is used to modify the ITO substrate firstly, and then metal film electrodes are evaporated on the modified ITO substrate as heating plate electrodes. Due to the effect of the self-assembled thin film formed after MPTMS modification, the metal film electrode is more uniformly, densely and firmly bonded on the ITO substrate.
与已有技术相比,本发明的有益效果体现在:Compared with the prior art, the beneficial effects of the present invention are reflected in:
本发明采用MPTMS修饰ITO基板,并在其上真空蒸镀制备了金属膜电极。相比于传统工艺,本发明制作的电极更为均匀致密,附着力较强且阻抗更低。在一定程度上可以改善加热片电极的电势分布,提升ITO加热片的加热均匀性,并缓解电极的老化脱落,使得器件的可靠性更高。The invention adopts MPTMS to modify the ITO substrate, and prepares the metal film electrode by vacuum evaporation on the ITO substrate. Compared with the traditional process, the electrode produced by the invention is more uniform and compact, has stronger adhesion and lower impedance. To a certain extent, it can improve the potential distribution of the heating plate electrode, improve the heating uniformity of the ITO heating plate, and alleviate the aging and falling off of the electrode, so that the reliability of the device is higher.
附图说明Description of drawings
图1为MPTMS自组装修饰ITO基板的原理图。Figure 1 is a schematic diagram of MPTMS self-assembly modified ITO substrate.
图2为本发明具体实施例中ITO加热片的结构示意图。Fig. 2 is a schematic structural diagram of an ITO heating chip in a specific embodiment of the present invention.
图3为本发明具体实施例中MPTMS修饰后的ITO薄膜和在其上所制作Ag电极的原子力图像。Fig. 3 is the atomic force image of the ITO thin film modified by MPTMS and the Ag electrode made thereon in the specific embodiment of the present invention.
图4 为本发明中在经MPTMS修饰后的ITO薄膜上所制作Ag电极的横截面结构示意图。Fig. 4 is a schematic diagram of the cross-sectional structure of an Ag electrode fabricated on an ITO film modified by MPTMS in the present invention.
具体实施方式detailed description
下面对本发明的实施例作详细说明。本实施例基于本发明技术方案,给出了详细实施方式和具体操作过程。本发明的保护范围包括但不限于下述的实施例。The embodiments of the present invention will be described in detail below. Based on the technical solution of the present invention, this embodiment provides detailed implementation and specific operation process. The protection scope of the present invention includes but not limited to the following examples.
如图1、图2所示,基于MPTMS修饰ITO加热片的金属膜电极制作方法,包括以下步骤:As shown in Figure 1 and Figure 2, the metal film electrode manufacturing method based on MPTMS modified ITO heating sheet includes the following steps:
(1)ITO基板的清洗:(1) Cleaning of ITO substrate:
首先将ITO基板依次置于丙酮、无水乙醇和去离子水中分别超声处理20min,以实现对ITO基板的超声清洗,其中丙酮、乙醇的浓度为99.5%。超声清洗结束后用氮气吹干ITO基板。First, the ITO substrate was placed in acetone, absolute ethanol, and deionized water for 20 min, respectively, to ultrasonically clean the ITO substrate. The concentrations of acetone and ethanol were 99.5%. After ultrasonic cleaning, blow dry the ITO substrate with nitrogen.
(2)紫外光处理:(2) Ultraviolet light treatment:
将经过步骤(1)处理后的ITO基板置于紫外光清洗机中处理30min,其中紫外光清洗机的工作波长为185nm和254nm。Place the ITO substrate treated in step (1) in an ultraviolet cleaning machine for 30 minutes, wherein the working wavelength of the ultraviolet cleaning machine is 185nm and 254nm.
紫外光处理能够有效分解ITO表面的有机物残留,使得ITO基板表面更加清洁,并增加了羟基数量,以便后续的MPTMS修饰。Ultraviolet light treatment can effectively decompose the organic residues on the ITO surface, make the ITO substrate surface cleaner, and increase the number of hydroxyl groups for subsequent MPTMS modification.
(3)ITO基板的3-巯丙基三甲氧基硅烷(简称MPTMS)修饰:(3) 3-Mercaptopropyltrimethoxysilane (MPTMS for short) modification of ITO substrate:
基于分子自组装原理,将步骤(2)处理后的ITO基板置于MPTMS与甲苯的混合溶液中进行自组装修饰,混合溶液中甲苯作为溶剂。修饰结束后用甲苯冲洗ITO基板,以除去多余的MPTMS,然后用氮气吹干ITO基板。Based on the principle of molecular self-assembly, the ITO substrate treated in step (2) was placed in a mixed solution of MPTMS and toluene for self-assembly modification, and toluene in the mixed solution was used as a solvent. After modification, rinse the ITO substrate with toluene to remove excess MPTMS, and then dry the ITO substrate with nitrogen.
混合溶液中,MPTMS与甲苯的体积比为0.5-1.5:40;修饰时长为3-8h。经过实验得知,MPTMS与甲苯的体积比、自组装修饰时长都会影响到自组装的效果。当MPTMS与甲苯的体积比为1:40、修饰时长为6h时,自组装修饰的效果最为理想。In the mixed solution, the volume ratio of MPTMS to toluene is 0.5-1.5:40; the modification time is 3-8h. It is known from experiments that the volume ratio of MPTMS to toluene and the length of self-assembly modification will affect the effect of self-assembly. When the volume ratio of MPTMS to toluene is 1:40 and the modification time is 6h, the effect of self-assembly modification is the most ideal.
本发明中,除了采用MPTMS对ITO基板进行自组装修饰外,还可采用其他有机硅烷材料修饰ITO基板。In the present invention, in addition to using MPTMS to self-assemble and modify the ITO substrate, other organosilane materials can also be used to modify the ITO substrate.
(4)使用真空蒸镀的方法在经步骤(3)修饰后的ITO基板上制备金属膜电极。(4) Prepare a metal film electrode on the ITO substrate modified in step (3) by vacuum evaporation.
本发明中,除了采用真空蒸镀的方式外,还可以使用其他的方法制备金属膜电极,例如磁控溅射法、静电喷涂法和电化学沉积法等。但相比于其他方法,真空蒸镀法更容易操作、重复性更好且制作的金属薄膜更加均匀平整。因此,在本实施例中优选真空蒸镀法制作金属膜电极。In the present invention, in addition to vacuum evaporation, other methods can also be used to prepare metal film electrodes, such as magnetron sputtering, electrostatic spraying and electrochemical deposition. However, compared with other methods, the vacuum evaporation method is easier to operate, has better repeatability and produces a more uniform and smooth metal film. Therefore, in this embodiment, the vacuum evaporation method is preferred to fabricate the metal film electrode.
真空蒸镀方式在步骤(3)修饰后的ITO基板上制备金属膜电极过程如下:The process of preparing metal film electrodes on the modified ITO substrate in step (3) by vacuum evaporation is as follows:
(a)、贴合掩膜板:(a) Attaching the mask plate:
将MPTMS修饰后的ITO基板与掩膜板进行贴合,掩膜板遮挡住ITO基板上不需要制备金属膜电极的部分,只露出需要制作电极的部分,即图2的阴影部分。The ITO substrate modified by MPTMS is bonded to the mask plate. The mask plate covers the part of the ITO substrate that does not need to prepare metal film electrodes, and only exposes the part that needs to make electrodes, that is, the shaded part in Figure 2.
(b)、转移掩膜板:(b), transfer mask:
将ITO基板连同贴合的掩膜板整体移至真空镀膜机腔室内的基片架上,ITO基板、掩膜板以及基片架固定作为一个整体,基片架转动时带动ITO基板转动。Move the ITO substrate together with the attached mask plate to the substrate frame in the chamber of the vacuum coating machine. The ITO substrate, mask plate and substrate frame are fixed as a whole. When the substrate frame rotates, the ITO substrate is driven to rotate.
(c)、蒸镀金属膜电极:(c), Evaporated metal film electrode:
抽真空直至真空度低于2x10-7Torr时开始蒸镀,当蒸镀速率稳定在20Å/s时,打开挡板令金属分子蒸镀到ITO基板上。为了保证金属膜的均匀性,基片架匀速旋转,转速为20r/min。Vacuum until the vacuum degree is lower than 2x10 -7 Torr and start evaporation. When the evaporation rate is stable at 20Å/s, open the baffle to allow metal molecules to evaporate onto the ITO substrate. In order to ensure the uniformity of the metal film, the substrate holder rotates at a constant speed at 20 r/min.
表1膜厚和面电阻值表Table 1 Table of film thickness and surface resistance value
对上述方法所制备的金属膜电极进行测试,将电极膜分成相同的四段,用台阶仪和面电阻仪分别测量每段的膜厚和面电阻值,数据如表1所示,金属膜电极的厚度均匀,且阻值也较为稳定。The metal film electrode prepared by the above method was tested, the electrode film was divided into the same four sections, and the film thickness and surface resistance value of each section were measured with a step meter and a surface resistance meter respectively. The data are shown in Table 1. The metal film electrode The thickness is uniform, and the resistance value is relatively stable.
如图3所示,采用本发明方法得到的经MPTMS修饰后的ITO薄膜(左图)和在其上制作Ag电极(右图)的原子力图像,扫描范围为5μm * 5μm。其表面粗糙度只有1 nm,表明在经MPTMS修饰后的ITO上所制备的Ag电极较为平滑。As shown in Figure 3, the atomic force image of the MPTMS-modified ITO thin film (left picture) obtained by the method of the present invention and the Ag electrode (right picture) fabricated on it, the scanning range is 5 μm * 5 μm. Its surface roughness is only 1 nm, indicating that the Ag electrode prepared on MPTMS-modified ITO is relatively smooth.
如图4所示为本发明所制作的加热片电极的横截面结构示意图。MPTMS分子通过键合作用,分子两端分别与ITO和Ag相结合,从而将Ag固定在ITO表面。通过MPTMS自组装处理所形成薄膜层,将Ag和ITO紧密连接,从而增强了Ag附着力,使得形成的Ag电极膜更加均匀、致密,减小了电极的膜厚差异,提升了电极的均匀性。FIG. 4 is a schematic diagram of the cross-sectional structure of the heating chip electrode produced by the present invention. The MPTMS molecule is bonded, and the two ends of the molecule are respectively combined with ITO and Ag, thereby immobilizing Ag on the surface of ITO. The film layer formed by MPTMS self-assembly process tightly connects Ag and ITO, thereby enhancing the adhesion of Ag, making the formed Ag electrode film more uniform and dense, reducing the film thickness difference of the electrode, and improving the uniformity of the electrode. .
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CN110133934A (en) * | 2019-05-31 | 2019-08-16 | 电子科技大学 | A bistable electrochromic device and its preparation method |
CN113097361A (en) * | 2021-03-31 | 2021-07-09 | 厦门乾照光电股份有限公司 | Method for improving structural stability of LED |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102636474A (en) * | 2012-03-19 | 2012-08-15 | 上海师范大学 | Working electrode for electrochemical onsite surface enhanced Raman scattering (SERS) spectrum in-situ cell as well as preparation method and application thereof |
-
2017
- 2017-07-26 CN CN201710615423.8A patent/CN107475671A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102636474A (en) * | 2012-03-19 | 2012-08-15 | 上海师范大学 | Working electrode for electrochemical onsite surface enhanced Raman scattering (SERS) spectrum in-situ cell as well as preparation method and application thereof |
Non-Patent Citations (1)
Title |
---|
《中国优秀硕士学位论文全文数据库》: "基于纳米材料的透明柔性电极在OLED器件中的应用研究", 《中国优秀硕士学位论文全文数据库》 * |
Cited By (3)
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---|---|---|---|---|
CN110133934A (en) * | 2019-05-31 | 2019-08-16 | 电子科技大学 | A bistable electrochromic device and its preparation method |
CN110133934B (en) * | 2019-05-31 | 2021-06-08 | 电子科技大学 | Bistable electrochromic device and preparation method thereof |
CN113097361A (en) * | 2021-03-31 | 2021-07-09 | 厦门乾照光电股份有限公司 | Method for improving structural stability of LED |
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