CN107452643B - Substrate flattening apparatus and semiconductor manufacturing method using the same - Google Patents

Abstract

The present invention provides a substrate flattening device and a semiconductor manufacturing method using the substrate flattening device. The substrate flattening device comprises: a base; a rotating arm, one end of which is rotatably connected to the base; and a disk-shaped component connected to the other end of the rotating arm, wherein the disk-shaped component moves downward as the rotating arm rotates on a vertical plane, so that a disk surface of the disk-shaped component is superimposed on a substrate carried on a rotating chuck, and a vertical downward pressure is applied to the substrate so as to press the substrate flatly onto the rotating chuck.

Description

Substrate flattening apparatus and semiconductor manufacturing method using the same

technical field

The present invention relates to a substrate flattening device, in particular to a substrate flattening device used in a semiconductor process.

Background technique

With the advancement of science and technology, electronic devices are developing towards miniaturization and precision, which makes the process of semiconductors also tend to be complicated. For example, semiconductor substrates need to undergo multiple processes such as grinding, machining, etching, and high-temperature heating to form integrated circuits in electronic devices. In addition, when the substrate is being cleaned or etched, the substrate is generally fixed on a spin chuck by means of vacuum adsorption or edge clamping, and the substrate is rotated at a high speed and sprayed on the top for cleaning or Etching liquid.

However, after the substrate is subjected to the above-mentioned multi-pass grinding, machining and high-temperature processes, the substrate will be deformed due to the influence of mechanical force or thermal stress. Especially for thin substrates (such as silicon wafers or glass substrates), after various processing and high-temperature processes, it is more likely to cause serious deformation of the substrate, resulting in irregular warpage of the substrate as a whole. Therefore, when the warped substrate is being cleaned or etched, the substrate is not placed flat on the rotary chuck, so that the rotary chuck cannot smoothly pass through the vacuum chuck to vacuum the substrate and then vacuum to fix it on it. . Or, due to the structural interference between the warped edge of the substrate and the jaws of the rotary chuck, the jaws cannot smoothly clamp and fix the substrate on the rotary chuck.

In view of this, it is necessary to propose a device to assist in improving the contact surface between the substrate and the rotary chuck, so that the substrate can be placed on the rotary chuck flatly, so that the rotary chuck can hold the substrate through its fixing mechanism. fixed on it smoothly.

SUMMARY OF THE INVENTION

In order to solve the above-mentioned problems of the prior art, the object of the present invention is to provide a substrate flattening device, which applies an appropriate pressure to the substrate placed on the rotating chuck through a specific mechanism, so as to press the warped and deformed substrate tightly. Attached to the rotating chuck, so that the rotating chuck can smoothly fix the substrate on it through its fixing mechanism (such as vacuum suction cups or clamping jaws, etc.).

In order to achieve the above object, the present invention provides a substrate flattening device, comprising: a base; a rotating arm, one end of which is rotatably connected to the base; one end is connected, wherein the disk-shaped assembly moves downward as the rotating arm rotates toward a first rotation direction, so that a disk surface of the disk-shaped assembly is stacked on a base plate carried on a rotating chuck, and A vertical downward pressure is applied to the substrate, thereby flatly pressing the substrate on the rotating chuck.

In one of the preferred embodiments of the present invention, wherein the disc-shaped assembly comprises: a connecting disc, one side of which is connected with the other end of the rotating arm through a universal joint, and is adjusted through the universal joint an angle of attachment between the connection plate and the rotating arm such that when the plate assembly is stacked on the base plate, the plate assembly remains in a horizontal position relative to the base plate; and a The brush plate is fixed on the other side of the connecting plate through a plurality of fixing bolts.

In one of the preferred embodiments of the present invention, a buffer spring is sleeved on part of the plurality of fixing bolts, for buffering the vertical downward pressure exerted by the disc-shaped component on the substrate.

In one of the preferred embodiments of the present invention, the brush disk includes at least one row of bristles arranged in an annular array, and the disk-shaped component contacts the substrate through the at least one row of bristles to apply the required bristles to the substrate. the vertical downward pressure.

In one of the preferred embodiments of the present invention, the brush disk includes an inner row of bristles and an outer row of bristles arranged in an annular array, and the outer row of bristles is located relative to the outer edge of the substrate.

In one of the preferred embodiments of the present invention, the rotating arm is rotatably connected to the base through a rotating power device, and the rotating power device includes a rotating pneumatic cylinder or a rotating motor.

In one of the preferred embodiments of the present invention, the rotary chuck is a vacuum adsorption type rotary chuck.

In one of the preferred embodiments of the present invention, the rotary chuck is an edge-clamped rotary chuck.

The present invention also provides a semiconductor manufacturing method, comprising: placing a substrate on a rotating chuck; providing a substrate flattening device, including a base, a rotating arm and a disk-shaped component, wherein one end of the rotating arm is is rotatably connected with the base, and the disk-shaped assembly is connected with the other end of the rotating arm; the rotating arm of the substrate flattening device is controlled to rotate in a first rotation direction, so that the disk is and control a disk surface of the disk-type assembly to be superimposed on the base plate, and apply a vertical downward pressure to the base plate, thereby pressing the base plate flatly fit on the rotating chuck.

In one of the preferred embodiments of the present invention, the substrate is adsorbed on the rotary chuck by vacuum; After the vertical downward pressure, the method further includes: judging whether the vacuum adsorption value between the substrate and the disk-shaped component reaches a preset value, and if so, controlling the rotating arm of the substrate flattening device Rotate in a second rotational direction, so that the disk-shaped assembly moves up and away from the surface of the substrate, if not, the disk-shaped assembly is controlled to continue to exert the vertical downward pressure on the substrate until The vacuum adsorption value between the substrate and the disk-shaped assembly reaches the preset value.

In one of the preferred embodiments of the present invention, the rotary chuck is an edge-clamped rotary chuck; After applying a vertical downward pressure, the method further includes: judging whether the substrate is flatly pressed on the edge-clamped rotary chuck, and if so, controlling the edge-clamped rotary chuck The clamping jaws of the head clamp and fix the edge of the substrate, and control the rotation arm of the substrate flattening device to rotate in a second rotation direction, so that the disk-shaped assembly is moved up and away from the substrate. If no, control the disc assembly to continue to apply the vertical downward pressure to the substrate until the substrate is flatly pressed against the edge-clamped rotary chuck.

Description of drawings

FIG. 1 shows a schematic perspective view showing a substrate flattening apparatus according to a first preferred embodiment of the present invention;

FIG. 2 shows a schematic diagram of the operation of the substrate flattening device of FIG. 1 being stacked on a substrate;

FIG. 3 shows an exploded view of the parts of the disc assembly of the substrate flattening apparatus of FIG. 1;

FIG. 4 shows a schematic diagram of the substrate flattening apparatus of FIG. 1 for flattening a substrate carried on another carrier; and

FIG. 5 shows a flowchart of a method of using the substrate flattening apparatus of FIG. 1 for manufacturing a semiconductor.

Detailed ways

In order to make the above-mentioned and other objects, features and advantages of the present invention more clearly understood, the preferred embodiments of the present invention will be exemplified below, and the accompanying drawings will be described in detail as follows.

Please refer to FIG. 1 , which shows a schematic perspective view of a substrate flattening apparatus 100 according to a first preferred embodiment of the present invention. The substrate flattening apparatus 100 includes a base 110 , a rotating arm 120 and a disc assembly 130 . One end of the base 110 can be fixed on the ground or erected on a conveying mechanism, and the substrate flattening apparatus 100 is conveyed to a working position through the conveying mechanism. As shown in FIG. 1 , the rotating arm 120 is approximately in an “L” shape, and has a first end 121 and a second end 122 . The first end 121 of the rotating arm 120 is rotatably connected to the base 110 through a rotating power device 150 , and the second end 122 of the rotating arm 120 is connected to the disc assembly 130 , wherein the rotary power device 150 can be a rotary pneumatic cylinder (as shown in FIG. 1 ) or a rotary motor. Moreover, as shown in FIG. 1 , the rotary power device 150 can be covered by a cover body 160 , so as to avoid accidental contact by personnel or prevent dust from contaminating the rotary power device 150 . In order to clearly show the rotating power device 150 , in FIG. 1 , the cover 160 is transparent/translucent, for example, made of a transparent/translucent plastic material. As known to those skilled in the art, the cover 160 can also be opaque, such as made of opaque plastic material or metal.

Please refer to FIG. 1 and FIG. 2 , wherein FIG. 2 shows a schematic diagram of the operation of the substrate flattening apparatus 100 of FIG. 1 being laminated on a substrate 300 . The substrate 300 is preferably a thin substrate used in a semiconductor process, such as a silicon wafer, a glass substrate, and the like. Generally speaking, after the substrate 300 is subjected to multiple processes such as grinding, machining, and high-temperature heating, the substrate 300 is prone to warp deformation. Therefore, when the substrate 300 is placed on the spin chuck 200 by a robot arm, the substrate 300 is not flatly attached to the spin chuck 200 . In view of this, in the present invention, after the substrate 300 is placed on the rotating chuck 200, the substrate flattening apparatus 100 will be activated accordingly. In addition, the rotating arm 120 is controlled to rotate in a first rotation direction R1 on a vertical plane by the rotating power device 150 , and the disk-shaped assembly 130 is moved downward, and a part of the disk-shaped assembly 130 is moved downward. The disk surface is stacked on the substrate 300 , and a vertical downward pressure F is applied to the substrate 300 . Through the above operations, the warped and deformed portion of the substrate 300 can be effectively flattened to achieve the effect of flatly attaching the substrate 300 to the rotary chuck 200 . Next, the rotary chuck 200 can vacuum suction the substrate 300 through a plurality of vacuum suction cups (not shown in the figure) communicating with the vacuum suction line 210 , so as to effectively fix the substrate 300 on the substrate 300 . on the rotating chuck 200.

Please refer to FIG. 3 , which shows an exploded view of the parts of the disc-shaped assembly 130 of the substrate flattening apparatus 100 of FIG. 1 . The disk-shaped assembly 130 includes a connecting disk 131 , a brush disk 132 and an intermediate disk 133 . The connecting plate 131 is connected to the second end 122 of the rotating arm 120 . More specifically, one side of the connecting plate 131 is connected with the second end 122 of the rotating arm 120 through a universal joint 140 . It can be understood that, the setting of the universal joint 140 can effectively adjust the connection angle between the connecting plate 131 and the rotating arm 120, so that when the plate assembly 130 is stacked on the base plate 300 (as shown in FIG. 2 ), the disc-shaped assembly 130 is kept in a horizontal position relative to the base plate 300 as a whole, so that the disc-shaped assembly 130 can face the brush disc 132 The vertical downward pressure F is evenly applied to the whole of the substrate 300 to prevent the substrate 300 from being damaged by uneven stress on one side.

As shown in FIGS. 1 and 3 , the brush disc 132 of the disc assembly 130 includes an inner row of bristles 1324 and an outer row of bristles 1322 arranged in an annular array. The disk-shaped assembly 130 is in contact with the substrate 300 through the inner row of bristles 1324 and the outer row of bristles 1322 to apply the vertical downward pressure F to the substrate 300 . In a preferred embodiment of the present invention, by selecting elastic bristles to contact the substrate 300, the warpage deformation of the substrate 300 can be effectively absorbed. That is, when the bristles of the inner row of bristles 1324 and the bristles of the outer row of bristles 1322 are in contact with the substrate 300, they will be elastically deformed according to the warpage deformation amount of the corresponding position of the substrate 300, thereby effectively buffering the The vertical downward pressure F exerted by the disc-shaped assembly 130 on the substrate 300 further prevents the substrate 300 from being broken due to excessive stress at a single point. It can be understood that the number of bristles shown in FIG. 1 is only for illustration, and in different embodiments, the number of bristles can be changed according to the size of the corresponding substrate, for example, only a single row of bristles arranged in an annular array is provided, or The bristles are arranged in an annular array of more than three rows. Preferably, the bristles disposed at the outermost periphery (eg, the outer row of bristles 1322 ) are positioned relative to the outer edge of the substrate 300 .

As shown in FIG. 3 , the disc assembly 130 assembles and fixes the connecting disc 131 , the brush disc 132 and the intermediate disc 133 through a plurality of first fixing bolts 171 and a plurality of second fixing bolts 172 . Specifically, the connecting plate 131 is fixed on one side of the intermediate plate 133 through the plurality of first fixing bolts 171 , and a buffer spring 173 is sleeved on each of the first fixing bolts 171 for buffering The vertical downward pressure F exerted by the disk-shaped assembly 130 on the substrate 300 . Next, the brush plate 132 is fixed on the other side of the intermediate plate 133 by the plurality of second fixing bolts 172 .

Please refer to FIG. 4 , which shows a schematic diagram of the substrate flattening apparatus 100 of FIG. 1 used for flattening the substrate 300 carried on another carrying mechanism. In this embodiment, the carrying mechanism is an edge-clamped rotary chuck 400 , which includes a plurality of clamping jaws 410 . When the substrate 300 is placed on the edge-clamped rotary chuck 400 by a robotic arm, the plurality of jaws 410 are located away from the substrate 300 . Next, when the substrate 300 is flattened by the substrate flattening apparatus 100 , the plurality of clamping jaws 410 will rotate toward the direction of the substrate 300 , thereby clamping and fixing the substrate 300 on the edge On the clamp-type rotary chuck 400.

Please refer to FIG. 5 , which shows a flowchart of a method of using the substrate flattening apparatus 100 of FIG. 1 for manufacturing a semiconductor. First, in step S11, the substrate 300 is placed on the rotary chuck 200 by a robot arm, and the substrate 300 is preferably a thin substrate for semiconductor process, such as a silicon wafer, a glass substrate, and the like. Next, in step S12 , the substrate flattening apparatus 100 is provided, and the substrate flattening apparatus 100 is set at a working position corresponding to the rotary chuck 200 . And, as described above, the substrate flattening apparatus 100 includes a base 110, a rotating arm 120, and a disc-shaped assembly 130, and one end of the rotating arm 120 is rotatably connected to the base 110, and the disc The mold assembly 130 is connected with the other end of the rotating arm 120 . Next, step S13 is performed to control the rotation arm 120 of the substrate flattening apparatus 100 to rotate in a first rotation direction R1 (as shown in FIG. 2 ) on a vertical plane, so that the disk-shaped assembly 130 is connected together Move Downward. Next, step S14 is performed, and the disk surface of the brush disk 132 of the disk-shaped assembly 130 is controlled to be stacked on the base plate 300, and a vertical downward pressure F is applied to the base plate 300, thereby effectively removing the The warped portion of the substrate 300 is flattened.

Furthermore, in this embodiment, the rotary chuck 200 is a vacuum adsorption type rotary chuck 200 . It can be understood that, generally speaking, a vacuum suction cup, a vacuum suction pipeline 210 (as shown in FIG. 2 ) and a vacuum value sensor for detecting a vacuum value are usually arranged on the vacuum suction type rotating chuck 200 . . Therefore, after controlling the disc-shaped assembly 130 to apply the vertical downward pressure F to the substrate 300 , step S15 may also be included, in which a plurality of vacuum suction cups communicated with the vacuum suction line 210 are used to apply the vertical downward pressure to the substrate 300 . The substrate 300 is vacuum-adsorbed to effectively fix the substrate 300 on the rotary chuck 200 . And determine whether the vacuum adsorption value between the substrate 300 and the disk-shaped assembly 130 reaches a preset value through the value measured by the vacuum value sensor, and if so, control the substrate flattening device 100 . The rotating arm 120 is rotated toward a second rotating direction (ie, a direction opposite to the first rotating direction R1 ), so that the disk-shaped assembly 130 is moved upwardly and away from the surface of the substrate 300 . If no, control the disk assembly 130 to continue to apply the vertical downward pressure F on the substrate 300 until the vacuum suction value between the substrate 300 and the disk assembly 130 reaches the preset value . In addition, when the substrate flattening apparatus 100 of the present invention is applied to flatten the substrate 300 carried on the edge-clamped rotary chuck 400 (as shown in FIG. 4 ), the edge-clamped rotation can An appropriate sensor is provided on the chuck 400 for judging whether the substrate 300 has been flatly pressed onto the edge-clamped rotary chuck 400 by the substrate flattening device 100, and if so, then The clamping jaws 410 are controlled to rotate toward the direction of the substrate 300 , thereby clamping and fixing the edge of the substrate 300 on the edge-clamping rotary chuck 400 , and controlling the The rotating arm 120 is rotated in a second rotating direction, so that the disk-shaped assembly 130 is moved upward and away from the surface of the substrate 300 . If not, control the disk assembly 130 to continue to apply the vertical downward pressure F to the substrate 300 until the substrate 300 is flatly pressed on the edge-clamped rotary chuck 400 .

The above are only the preferred embodiments of the present invention. It should be pointed out that for those skilled in the art, without departing from the principles of the present invention, several improvements and modifications can also be made, and these improvements and modifications should also be regarded as the protection of the present invention. scope.

Claims (14)

1. a substrate flattening equipment, is characterized in that, comprises: a base; a rotating arm, one end of which is rotatably connected to the base; and A disk-shaped assembly is connected with the other end of the rotating arm, wherein the disk-shaped assembly moves downward as the rotating arm rotates toward a first rotation direction, so that a disk surface of the disk-shaped assembly is superimposed on the rotating arm. A substrate is carried on a rotary chuck, and a vertical downward pressure is applied to the substrate, thereby flatly pressing the substrate on the rotary chuck; and Wherein the disc-shaped assembly includes a brush plate, the brush disc includes at least one row of bristles arranged in an annular array, and the disc-shaped assembly contacts the substrate through the at least one row of bristles to apply the application to the substrate The vertical downward pressure. 2. The substrate flattening apparatus of claim 1, wherein the disc-shaped assembly comprises: A connecting plate, one side of which is connected with the other end of the rotating arm through a universal joint, and the connection angle between the connecting plate and the rotating arm is adjusted through the universal joint, so that when all the when the disc-shaped assembly is stacked on the base plate, the disc-shaped assembly is maintained in a horizontal position relative to the base plate; and The brush plate is fixed on the other side of the connecting plate through a plurality of fixing bolts. 3 . The substrate flattening apparatus according to claim 2 , wherein a buffer spring is sleeved on part of the plurality of fixing bolts, which is used for buffering the plate-shaped component applied on the substrate. 4 . vertical downward pressure. 4 . The substrate flattening apparatus according to claim 1 , wherein the brush plate comprises an inner row of bristles and an outer row of bristles arranged in an annular array, and the outer row of bristles is located relative to the substrate. 5 . The position of the outer edge. 5 . The substrate flattening apparatus according to claim 1 , wherein the rotating arm is rotatably connected to the base through a rotating power device, and the rotating power device comprises a rotating pneumatic cylinder or a rotating motor. 6 . 6 . The substrate flattening apparatus according to claim 1 , wherein the rotary chuck is a vacuum adsorption type rotary chuck. 7 . 7 . The substrate flattening apparatus of claim 1 , wherein the rotary chuck is an edge-clamped rotary chuck. 8 . 8. A method of manufacturing a semiconductor, comprising: placing a substrate on a rotating chuck; Provide a substrate flattening equipment, including a base, a rotating arm and a disc-shaped assembly, wherein one end of the rotating arm is rotatably connected to the base, and the disc-shaped assembly and the rotating arm are connected. connection at the other end; controlling the rotation arm of the substrate flattening apparatus to rotate in a first rotational direction, so that the disk-shaped assembly is moved downward in a concomitant manner; and Controlling a disk surface of the disk assembly to be stacked on the base plate, and applying a vertical downward pressure to the base plate, so as to press the base plate flatly on the rotary chuck, Wherein the disc-shaped assembly includes a brush plate, the brush disc includes at least one row of bristles arranged in an annular array, and the disc-shaped assembly contacts the substrate through the at least one row of bristles to apply the application to the substrate The vertical downward pressure. 9. The semiconductor manufacturing method of claim 8, wherein the disk-shaped component comprises: A connecting plate, one side of which is connected with the other end of the rotating arm through a universal joint, and the connection angle between the connecting plate and the rotating arm is adjusted through the universal joint, so that when all the when the disc-shaped assembly is stacked on the base plate, the disc-shaped assembly is maintained in a horizontal position relative to the base plate; and The brush plate is fixed on the other side of the connecting plate through a plurality of fixing bolts. 10 . The semiconductor manufacturing method of claim 9 , wherein a buffer spring is sleeved on part of the plurality of fixing pins for buffering the vertical force applied by the disk-shaped component on the substrate. 11 . downward pressure. 11 . The semiconductor manufacturing method of claim 8 , wherein the brush plate comprises an inner row of bristles and an outer row of bristles arranged in an annular array, and the outer row of bristles is located outside the substrate relative to the substrate. 12 . edge location. 12 . The semiconductor manufacturing method of claim 8 , wherein the rotating arm is rotatably connected to the base via a rotating power device, and the rotating power device includes a rotating pneumatic cylinder or a rotating motor. 13 . 13. The semiconductor manufacturing method according to claim 8, wherein the substrate is vacuum-sucked on the rotary chuck; and wherein the disk-shaped component is controlled to be stacked on the substrate, and the After the substrate is subjected to a vertical downward pressure, the method further includes: Determine whether the vacuum adsorption value between the substrate and the disc assembly reaches a preset value, if so, control the rotating arm of the substrate flattening device to rotate in a second rotation direction, so that the disc The assembly moves up and away from the surface of the substrate, if not, the disk assembly is controlled to continue to apply the vertical downward pressure to the substrate until the vacuum between the substrate and the disk assembly The adsorption value reaches the preset value. 14. The semiconductor manufacturing method of claim 8, wherein the rotary chuck is an edge-clamped rotary chuck; and wherein the disk-shaped component is controlled to be stacked on the substrate, And after applying a vertical downward pressure to the substrate, the method further includes: Determine whether the substrate is flatly pressed on the edge-clamping rotary chuck, if so, control the jaws of the edge-clamping rotary chuck to clamp and fix the edge of the substrate, and Controlling the rotating arm of the substrate flattening device to rotate in a second rotation direction, so that the disk-shaped assembly moves upwards and leaves the surface of the substrate, if not, the disk-shaped assembly is controlled to continue to rotate The substrate is subjected to the vertical downward pressure until the substrate is flatly pressed against the edge-clamped rotary chuck.

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